BGM260PB22VNA2

Bluetooth Module, BLE 5.4, 2 Mbps, -95.5 dBm, 1.8 to 3.8 V, -40 °C to 125 °C

⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
Manufacturer: SILICON LABS
Product type: Bluetooth Modules & Adaptors
SVHC: No SVHC (21-Jan-2025)
Interfaces: I2C, SPI, UART, USART
Product Range: Wireless Gecko BGM240P Series
Certifications: CE, FCC, ISED, KC, MIC, NCC, UKCA
Bluetooth Class: -
Bluetooth Version: Bluetooth LE 5.4
Supply Voltage Range: 1.8 V to 3.8 V
Receiver Sensitivity Rx: -95.5 dBm
Operating Temperature Range: -40 °C to 125 °C
Delivery and price
Units per pack	250
Price	6.2 €
Current stock	10+
Lead time	30 days
Datasheet
## **BGM260P Wireless Gecko Bluetooth Module Data Sheet** 

The BGM260P is a secure, high-performance wireless module optimized for the requirements of battery and line-powered IoT devices running on Bluetooth networks. 

Built on the powerful Series 2 EFR32BG26 SoC, the module enables Bluetooth[®] Low Energy connectivity, delivering exceptional RF performance and energy efficiency, industry-leading Secure Vault[®] technology, and a comprehensive range of features that address the evolving needs of IoT applications. 

The BGM260P is a complete solution offered with robust and fully-upgradeable software stacks, global regulatory certifications, advanced development and debugging tools, and documentation that simplifies and minimizes the development cycle of your end-product, helping to accelerate its time-to-market. 

The BGM260P is targeted for a broad range of applications, including: 

- Smart Home Devices 

## **KEY FEATURES** 

   - Bluetooth Low Energy 5.4 

   - Built-in antenna 

   - +10 or +19.5 dBm TX output power 

   - -98.2 dBm Bluetooth Low Energy 1 Mbps RX sensitivity 

   - 32-bit ARM® Cortex®-M33 core at 80 MHz 

   - 3200/512 kB of Flash/RAM memory 

   - Secure Vault[®] 

   - Rich set of analog and digital peripherals 

   - 32 GPIO pins 

   - -40 °C to 125 °C 

   - 12.9 mm x 15.0 mm 

- Lighting 

- Gateways and Digital Assistants 

- Building Automation and Security 

**==> picture [526 x 176] intentionally omitted <==**

**----- Start of picture text -----**<br>
Core / Memory Crystal Clock Management Supply Energy Management Security<br>Features<br>ARM CortexDSP extensions, FPU, TrustZone [TM]  M33 Flash MemoryUp to 3200 kB 40 MHz HF Crystal OscillatorFast Startup HFRC OscillatorLF RC  DC-DC LCDecoupling DC-DC RegulatorBuck  Voltage Regulators Crypto Acceleration,  TRNG, PUF Key Secure Boot RTSLSecure Debug available down to Energy Mode:<br>RC Oscillator Oscillator<br>Debug InterfaceSWD, ETM, JTAG RAM MemoryUp to 512 kB 8-Channel Linked DMA Controller LF Crystal Oscillator Ultra LF RC Oscillator Brown-Out Detectors Power-On Reset DPA Countermeasures Tamper Detect EM0Run<br>EM1<br>32-bit bus Sleep<br>Peripheral Reflex System<br>EM2<br>Antenna Radio Serial Interfaces Timers and Triggers I/O Ports Analog I/F Deep Sleep<br>Antenna 2.4 GHz BLE (1M, 2M, LR) 3x EUSARTUART, SPI 1x EUSARTUART, SPI 4x 32-bit, 3-ch Timers 6x 16-bit, 3-ch Timers Keypad Scanner LCD Controller 12-16 bit ADC EM3Stop<br>Protocol Timer 12-bit VDAC<br>RX/TX Front-End with  External  General  EM4<br>Matching Integrated PA 3x I2C 1x I2C 2-ch Low  System Real  Interrupts Purpose I/O Analog  Shutoff<br>Energy Timer Time Counter Comparator<br>M0+ Radio Controller 3x USARTUART, SPI, I2S 2x Watchdog Timer Back-Up Real Time Counter Pin Reset Pin Wakeup Temperature Sensor<br>**----- End of picture text -----**<br>


**Copyright © 2025 by Silicon Laboratories** 

**silabs.com** | Building a more connected world. 

Rev. 1.1 

BGM260P Wireless Gecko Bluetooth Module Data Sheet Features 

## **1.  Features** 

## • **Supported Protocols** 

   - Bluetooth Low Energy (BLE) 5.4 

- **Wireless System-on-Chip** 

   - 2.4 GHz radio 

   - TX power up to +19.5 dBm 

   - High-performance 32-bit 80 MHz ARM Cortex[®] -M33 with DSP instruction and floating-point unit for efficient signal processing 

   - 3200 kB flash program memory 

   - 512 kB RAM data memory 

- **Receiver Sensitivity[1]** 

   - -106.2 dBm (0.1% BER) @ 125 kbps GFSK 

   - -101.9 dBm (0.1% BER) @ 500 kbps GFSK 

   - -98.2 dBm (0.1% BER) @ 1 Mbps GFSK 

   - -95.5 dBm (0.1% BER) @ 2 Mbps GFSK 

- **Current Consumption** 

   - 5.7 mA RX current @ 1 Mbps GFSK 

   - 6.8 mA TX current @ 0 dBm 

   - 19.4 mA TX current @ 10 dBm 

   - 153 mA TX current @ 19.5 dBm 

   - 59.3 μA/MHz in Active Mode (EM0) @ 40 MHz 

   - 1.4 μA EM2 DeepSleep current (16 kB RAM retention and RTC running from LFRCO) 

- **Regulatory Certifications** 

   - CE (EU) and UKCA (UK) 

   - FCC (USA) and ISED (Canada) 

   - MIC (Japan) 

   - KC (South Korea) 

   - NCC (Taiwan) 

- **Operating Range** 

   - 1.8 V to 3.8 V single power supply 

   - -40 °C to +125 °C 

- **Dimensions** 

   - 12.9 mm x 15.0 mm 

- **Security** 

   - Secure Boot with Root of Trust and Secure Loader (RTSL) 

   - Hardware Cryptographic Acceleration for AES128/192/256, ChaCha20-Poly1305, SHA-1, SHA-2/256/384/512, ECDSA +ECDH(P-192, P-256, P-384, P-521), Ed25519 and Curve25519, J-PAKE, PBKDF2 

   - True Random Number Generator (TRNG) 

   - ARM[®] TrustZone[®] 

   - Secure Debug Unlock 

   - Secure Key Management with PUF 

   - Anti-Tamper 

   - Secure Attestation 

   - PSA L3 certified 

- **MCU Peripherals** 

   - Analog to Digital Converter (ADC) 

      - 12-bit @ 1 Msps 

      - 16-bit @ 76.9 ksps 

   - 2 × Analog Comparator (ACMP) 

   - 2 × Digital to Analog Converter (VDAC) 

   - Up to 32 General Purpose I/O pins with output state retention and asynchronous interrupts 

   - 8 Channel DMA Controller 

   - 20 Channel Peripheral Reflex System (PRS) 

   - 6 × 16-bit Timer/Counter with 3 Compare/Capture/PWM channels 

   - 4× 32-bit Timer/Counter with 3 Compare/Capture/PWM channels 

   - 2 x 32-bit Real Time Counter (SYSRTC/BURTC) 

   - 24-bit Low Energy Timer for waveform generation (LETIMER) 

   - 16-bit Pulse Counter with asynchronous operation (PCNT) 

   - 2 × Watchdog Timer (WDOG) 

   - 3× Universal Synchronous/Asynchronous Receiver/Transmitter (USART), supporting UART/SPI/SmartCard (ISO 7816)/IrDA/I[2] S 

   - 4 × Enhanced Universal Synchronous/Asynchronous Receiver/Transmitter (EUSART) supporting UART/SPI/DALI/ IrDA 

   - 4× I[2] C interface with SMBus support 

   - Low-Frequency RC Oscillator with precision mode to replace 32 kHz sleep crystal (LFRCO) 

   - Die temperature sensor with +/- 1.5 °C accuracy after single-point calibration 

## **Note:** 

1. Sensitivity values above are for +10 dBm parts (BGM260P22A). 

**silabs.com** | Building a more connected world. 

Rev. 1.1  |  2 

BGM260P Wireless Gecko Bluetooth Module Data Sheet Ordering Information 

## **2.  Ordering Information** 

## **Table 2.1.  Ordering Information** 

|**Ordering Code**|**Protocol Stack**|**Max TX**<br>**Power**|**Security**|**Antenna**|**Flash**<br>**(kB)**|**RAM**<br>**(kB)**|**GPIO**|**Carrier**|
|---|---|---|---|---|---|---|---|---|
|BGM260PB22VNA2|• Bluetooth Low Energy<br>5.4|+10 dBm|Vault High|Built-in|3200|512|32|Cut<br>Tape|
|BGM260PB22VNA2R|• Bluetooth Low Energy<br>5.4|+10 dBm|Vault High|Built-in|3200|512|32|Reel|
|BGM260PB32VNA2|• Bluetooth Low Energy<br>5.4|+19.5 dBm|Vault High|Built-in|3200|512|32|Cut<br>Tape|
|BGM260PB32VNA2R|• Bluetooth Low Energy<br>5.4|+19.5 dBm|Vault High|Built-in|3200|512|32|Reel|



## **Note:** 

1. BGM260P modules operate in the 2.4 GHz ISM frequency band. 

2. The maximum RF TX power allowed by different regional regulatory authorities may differ from the maximum output power a module can produce. End-product manufacturers must then verify that the module is configured to meet the regulatory limits for each region in accordance with the local rules and the formal certification test reports. 

3. Throughout this document, the modules may be referred to by their product family/marketing name (e.g. BGM260P), by their model names (BGM260P32A, BGM260P22A or by their full ordering codes as seen in the table above. 

4. Radio boards **xGM260P-RB4350** (+10 dBm) and **xGM260P-RB4351** (+19.5 dBm) are available for BGM260P evaluation and development. 

5. Devices are pre-programmed with BGAPI UART DFU bootloader version 3.0.0, which uses the pin configuration in Section 5. Reference Diagrams. 

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Rev. 1.1  |  3 

## **Table of Contents** 

|**1.**|**Features .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 2**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**2.**|**Ordering Information**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 3**|
|**3.**|**System Overview .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 7**|
||3.1  Block Diagram .<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 7|
||3.2  EFR32BG26 SoC .<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 9|
||3.3  Antenna .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 9|
||3.4  Power Supply<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.10|
||3.4.1  Energy Management Unit (EMU)|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.10|
||3.4.2  Voltage Scaling<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.10|
||3.4.3  Power Domains .<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.11|
||3.5  Clocking .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.12|
||3.6  General Purpose Input/Output (GPIO)|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.12|
||3.7  Keypad Scanner (KEYSCAN) .<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.12|
||3.8  Counters/Timers and PWM .<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.12|
||3.8.1  Timer/Counter (TIMER)<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.12|
||3.8.2  Low Energy Timer (LETIMER)<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.13|
||3.8.3  System Real Time Clock with Capture|||(SYSRTC).||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.13|
||3.8.4  Back-Up Real Time Counter (BURTC)|||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.13|
||3.8.5  Watchdog Timer (WDOG) .<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.13|
||3.9  Communications and Other Digital Peripherals||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.13|
||3.9.1  Universal Synchronous/Asynchronous|||Receiver/Transmitter|||||||(USART)|||.|.|.|.|.|.|.|.|.|.13|
||3.9.2  Enhanced Universal Synchronous/Asynchronous||||||Receiver/Transmitter||||||||(EUSART)||||.|.|.|.|.13|
||3.9.3  Inter-Integrated Circuit Interface (I2C)||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.13|
||3.9.4  Peripheral Reflex System (PRS)|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.13|
||3.10  Security .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.14|
||3.10.1  Secure Boot with Root of Trust and Secure|||||Loader||(RTSL)|||.|.|.|.|.|.|.|.|.|.|.|.|.14|
||3.10.2  Cryptographic Accelerator<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.15|
||3.10.3  True Random Number Generator|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.15|
||3.10.4  Secure Debug with Lock/Unlock|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.15|
||3.10.5  DPA Countermeasures<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.15|
||3.10.6  Secure Key Management with PUF||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.15|
||3.10.7  Anti-Tamper .<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.16|
||3.10.8  Secure Attestation .<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.16|
||3.11  Analog<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.16|
||3.11.1  Analog to Digital Converter (IADC)||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.16|
||3.11.2  Analog Comparator (ACMP)<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.16|
||3.11.3  Digital to Analog Converter (VDAC)||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.16|
||3.11.4  Liquid Crystal Display Driver (LCD)||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.17|
||3.12  Core, Memory, and Accelerators<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.17|
||3.12.1  Processor Core .<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.17|
||3.12.2  Memory System Controller (MSC)||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.17|



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Rev. 1.1 |  4 

||3.12.3  Linked Direct Memory Access|3.12.3  Linked Direct Memory Access|3.12.3  Linked Direct Memory Access|Controller|Controller|Controller|Controller|(LDMA)|(LDMA)|(LDMA)|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.17|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||3.13  Memory Map .<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.18|
||3.14  Configuration Summary<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.19|
|**4.**|**Electrical Specifications**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**||**.**<br>**.**|**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 20**|
||4.1  Absolute Maximum Ratings.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.20|
||4.2  General Operating Conditions|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.21|
||4.3  Thermal Characteristics .<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.22|
||4.4  MCU Current Consumption at|3.0 V||.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.23|
||4.5  Radio Current Consumption with||3.0 V||Supply|||.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.25|
||4.6  RF Transmitter General Characteristics for the|||||||2.4|GHz Band||||.|.|.|.|.||.|.|.|.|.|.|.|.|.26|
||4.7  RF Receiver General Characteristics for the||||||2.4 GHz|||Band||.|.|.|.|.|.||.|.|.|.|.|.|.|.|.27|
||4.8  RF Receiver Characteristics for Bluetooth|||||Low||Energy in the 2.4||||||GHz||Band||1 Mbps Data Rate .||||||||.|.28|
||4.9  RF Receiver Characteristics for Bluetooth|||||Low||Energy in the 2.4||||||GHz||Band||2 Mbps Data Rate .||||||||.|.30|
||4.10  RF Receiver Characteristics|for|Bluetooth Low Energy in the||||||||||2.4 GHz Band||||||500||kbps Data Rate .||||||.32|
||4.11  RF Receiver Characteristics|for|Bluetooth Low Energy in the||||||||||2.4 GHz Band||||||125||kbps Data Rate .||||||.34|
||4.12  High-Frequency Crystal (HFXO).|||.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.35|
||4.13  Low Frequency Crystal Oscillator (LFXO)||||||.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.36|
||4.14  Precision Low Frequency RC Oscillator (LFRCO) .|||||||||.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.37|
||4.15  GPIO Pins .<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.38|
||4.16  LCD .<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.39|
||4.17  Microcontroller Peripherals|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.40|
||4.18  Antenna Radiation and Efficiency|||.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.41|
|**5.**|**Reference Diagrams.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**44**|
||5.1  Network Co-Processor (NCP)|Application||||with||UART||Host||.|.|.|.|.|.||.|.|.|.|.|.|.|.|.44|
||5.2  SoC Application<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.45|
|**6.**|**Pin Definitions .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**46**|
||6.1  Module Pinout .<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.46|
||6.2  Alternate Pin Functions .<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.48|
||6.3  Analog Peripheral Connectivity||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.49|
||6.4  Digital Peripheral Connectivity .||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.50|
|**7.**|**Design Guidelines**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 56**|
||7.1  Layout and Placement<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.56|
||7.2  Proximity to Other Materials|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.57|
||7.3  Proximity to Human Body<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.57|
||7.4  Reset .<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.57|
||7.5  Debug .<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.57|
||7.6  Packet Trace Interface (PTI)|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.||.|.|.|.|.|.|.|.|.57|



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Rev. 1.1 |  5 

|**8.  Package Specifications**|**8.  Package Specifications**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.58**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|8.1  Package Outline<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.58|
|8.2  PCB Land Pattern .|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.59|
|8.3  Package Marking .|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.60|
|**9.  Soldering Recommendations**|||||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 61**|
|**10.  Tape and Reel**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.62**|
|**11.  Certifications .**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**63**|
|11.1  CE and UKCA - EU|and UK|||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.63|
|11.2  FCC - USA .<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.63|
|11.3  ISED - Canada<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.66|
|11.4  MIC - Japan<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.68|
|11.5  KC - South Korea|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.69|
|11.6  NCC - Taiwan .<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.70|
|11.7  RF Exposure and Proximity||||to|Human Body|||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.72|
|11.8  Bluetooth Qualification||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.72|
|**12.  Revision History.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**73**|



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Rev. 1.1 |  6 

BGM260P Wireless Gecko Bluetooth Module Data Sheet System Overview 

## **3.  System Overview** 

## **3.1  Block Diagram** 

The BGM260P module is a highly integrated, high-performance system with all the essential hardware components needed to enable 2.4 GHz wireless connectivity and support robust networking capabilities via multiple wireless protocols. 

Built around the EFR32BG26 Wireless SoC, the BGM260P includes a built-in antenna, an RF matching network (optimized for transmit power efficiency), supply decoupling and filtering components, an LC tank for DC-DC conversion, a 40 MHz reference crystal, and an RF shield. An integrated 32.768 kHz RC oscillator (LFRCO) for low power operation without an external crystal. Precision mode enables periodic recalibration against the HFXO crystal to improve accuracy to +/- 500 ppm, making it suitable for BLE sleep interval timing. External 32 kHz crystal (LFXO) is supported via GPIO pins for scenarios demanding maximum energy efficiency and accuracy. 

The RF matching network is optimized for transmit power efficiency, therefore modules rated for +19.5 dBm will show non-optimal current consumption and performance when operated at a lower output power (e.g. +10 or 0 dBm). 

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Integrated<br>Antenna<br>Supply Decoupling VDD<br>ane DCDC LC 1.8V – 3.8V<br>RF Shield<br>RF Match SILICON LABS GPIO<br>BG26 Up to 32<br>|<br>40 MHz RESET<br>RF Shield<br>**----- End of picture text -----**<br>


**Figure 3.1.  BGM260P Block Diagram** 

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A simplified internal schematic for the BGM260P module is shown in Figure 3.2 BGM260P Module Schematic on page 8. On +19.5 dBm devices PAVDD is directly connected to VDD. 

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EFR32BG26<br>VDD VREGIN RF2G4_IO Matching<br>IOVDD Network<br>10µF<br>AVDD<br>PA0x PA0x (x:0-9)<br>VREGSW PB0x PB0x (x:0-5)<br>PC0x PC0x (x:0-9)<br>PD0x PD0x (x:0-5)<br>2.2µH<br>RESET RESET<br>DVDD 0.1µF<br>RFVDD<br>PAVDD HFXTAL_I<br>4.7µF 40 MHz<br>HFXTAL_O<br>DECOUPLE<br>2.2µF<br>**----- End of picture text -----**<br>


**Figure 3.2.  BGM260P Module Schematic** 

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BGM260P Wireless Gecko Bluetooth Module Data Sheet System Overview 

## **3.2  EFR32BG26 SoC** 

The EFR32BG26 SoC features a 32-bit ARM Cortex M33 core, a 2.4 GHz high-performance radio, 3200 kB of Flash memory, 512 kB of RAM, a dedicated core for security, a rich set of MCU peripherals, and various clock management and serial interfacing options. See the EFR32xG26 Reference Manual and EFR32BG26 Data Sheet for details. 

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Radio Subsystem Port I/O Configuration IOVDD<br>DEMOD ARM Cortex [TM]  M0+<br>Radio Controller Digital Peripherals<br>RX/TX Frontend  IFADC USART<br>RF2G4_IO with Integrated PA AGC BUFC RAM EUSART DriversPort A PAn<br>FRC<br>Frequency  I2C<br>Synthesizer MOD CRC Port B  PBn<br>LETIMER Drivers<br>TIMER DBUS<br>RESETn Reset Management Unit, Brown Out and POR Core and Memory SYSRTC MappersPort  DriversPort C  PCn<br>ARM Cortex-M33 Core<br>with Floating Point Unit KEYSCAN<br>(shared w/GPIO)Debug Signals Debug / Programming Serial Wire and ETM  Up to 3200 KB ISP Flash PCNT DriversPort D  PDn<br>with Debug Challenge I/F Program Memory A A<br>LCD<br>H P<br>Up to 512 KB RAM B B CRC<br>PAVDD Energy Management Trust Zone<br>RFVDD LDMA Controller<br>IOVDD Analog Peripherals<br>AVDD Voltage<br>Monitor<br>DVDD Watchdog  Internal  Temperature<br>Timer Reference Sensor<br>bypass<br>VREGVDD DC-DC  Voltage  Clock Management VDD<br>VREGSW Converter Regulator ULFRCO 12-16 bit ADC<br>DECOUPLE FSRCO<br>LFRCO<br>LFXTAL_I<br>LFXTAL_O HFRCOLFXO VDAC ACMP<br>HFXTAL_I<br>HFXO<br>HFXTAL_O<br>Security<br>Crypto  Secure Debug  True Random   DPA<br>Secure Engine Acceleration Authentication Number Generator Countermeasures<br>Input Mux<br>ABUS Multiplexers<br>**----- End of picture text -----**<br>


**Figure 3.3.  Detailed EFR32BG26 Block Diagram** 

## **3.3  Antenna** 

BGM260P modules include a build-in antenna. Typical performance characteristics for the built-in antenna are detailed in the table below. See 4.18 Antenna Radiation and Efficiency for more details. 

**Table 3.1.  Integral Antenna Efficiency and Peak Gain** 

|**Parameter**|**With optimal layout **|**Note**|
|---|---|---|
|Efficiency|-1 dB|Antenna efficiency, gain and radiation pattern are highly depend-<br>ent on the application PCB layout and mechanical design. Refer<br>to for recommendations to achieve optimal antenna performance.|
|Peak gain|2.87 dBi||



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## **3.4  Power Supply** 

The BGM260P requires a single nominal supply level (VDD) to operate and supports an operating range of 1.8 to 3.8 V. The nominal level needed for +10 dBm devices (Model: BGM260P22A) is 3.0 V whereas +19.5 dBm devices (Model: BGM260P32A) require 3.3 V in order to achieve higher TX output power. All necessary decoupling, filtering and DC-DC related components are included in the module. 

**Note:** The power amplifier for +10 dBm modules is supplied through an internal LDO, and thus is independent of the VDD supply. Respectively, the power amplifier for +19.5 dBm modules is supplied through the VDD pin with a target level of 3.3 V. 

## **3.4.1  Energy Management Unit (EMU)** 

The EMU manages transitions of energy modes in the device. Each energy mode defines which peripherals and features are available and the amount of current the device consumes. The EMU can also be used to implement system-wide voltage scaling and turn off the power to unused RAM blocks to optimize the energy consumption in the target application. The DC-DC regulator operation is tightly integrated with the EMU. 

## **3.4.2  Voltage Scaling** 

The BGM260P supports supply voltage scaling for the LDO powering DECOUPLE, with independent selections for EM0 / EM1 and EM2 / EM3. Voltage scaling helps to optimize the energy efficiency of the system by operating at lower voltages when possible. The EM0 / EM1 voltage scaling level defaults to VSCALE2, which allows the core to operate in active mode at full speed. The intermediate level, VSCALE1, allows operation in EM0 and EM1 at up to 40 MHz. The lowest level, VSCALE0, can be used to conserve power further in EM2 and EM3. The EMU will automatically switch the target voltage scaling level when transitioning between energy modes. 

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## **3.4.3  Power Domains** 

Peripherals may exist on one of several independent power domains which are powered down to minimize supply current when not in use. Power domains are managed automatically by the EMU. 

The lowest-energy power domain is the "high-voltage" power domain (PDHV), which supports extremely low-energy infrastructure and peripherals. Circuits powered from PDHV are always on and available in all energy modes down to EM4. 

The next power domain is the low power domain (PD0), which is further divided to power subsets of peripherals. All PD0 power domains are shut down in EM4. Circuits powered from PD0 power domains may be available in EM0, EM1, EM2, and EM3. 

Low power domain A (PD0A) is the base power domain for EM2 and EM3 and will always remain on in EM0-EM3. It powers the most commonly-used EM2 and EM3-capable peripherals and infrastructure required to operate in EM2 and EM3. Auxiliary PD0 power domains (PD0B, PD0C, PD0D, PD0E) power additional EM2 and EM3-capable peripherals on demand. If any peripherals on one of the auxiliary power domains is enabled, that power domain will be active in EM2 and EM3. Otherwise, the auxiliary PD0 power domains will be shut down to reduce current. 

**Note:** Power domain PD0E is also turned on when peripherals on PD0B, PD0C, or PD0D are used. 

The active power domain (PD1) powers the rest of the device circuitry, including the CPU core and EM0 / EM1 peripherals. PD1 is always powered on in EM0 and EM1. PD1 is always shut down in EM2, EM3, and EM4. 

Table 3.2 Peripheral Power Subdomains on page 11 shows the peripherals on the PDHV and PD0x domains. Any peripheral not listed is on PD1. 

**Table 3.2.  Peripheral Power Subdomains** 

|**Always On in EM2/EM3**|**Always On in EM2/EM3**|**Selectively On in EM2/3**|**Selectively On in EM2/3**|**Selectively On in EM2/3**|**Selectively On in EM2/3**|
|---|---|---|---|---|---|
|**PDHV1**|**PD0A**|**PD0B2**|**PD0C2**|**PD0D2**|**PD0E**|
|LFRCO (Non-preci-<br>sion Mode)|SYSRTC|LETIMER0|LFRCO (Precision<br>Calibration Mode)|DEBUG|GPIO|
|LFXO|FSRCO|IADC0|HFRCOEM23|WDOG0/1|KEYSCAN|
|BURTC||PCNT0|HFXO|EUSART0|PRS|
|BURAM||ACMP0/1||I2C0||
|ULFRCO||VDAC0/1||||
|**Note:**<br>1. Peripherals on PDHV are also available in EM4.<br>2. If any of PD0B, PD0C, or PD0D are enabled, PD0E will also be automatically enabled.||||||



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## **3.5  Clocking** 

The Clock Management Unit (CMU) controls oscillators and clocks in the BGM260P. Individual enabling and disabling of clocks to all peripheral modules is performed by the CMU. The CMU also controls enabling and configuration of the oscillators. A high degree of flexibility allows software to optimize energy consumption in any specific application by minimizing power dissipation in unused peripherals and oscillators. 

The BGM260P integrates one crystal oscillator, supports two crystal oscillators (one internal, one external) and fully integrates four RC oscillators, listed below. 

- Integrated high frequency crystal oscillator (HFXO) running at 40.0 MHz provides a precise timing reference for the MCU and the radio. 

- Optional external 32.768 kHz crystal oscillator (LFXO) provides an accurate timing reference for low energy modes. An external LFXO enhances energy efficiency during BLE sleep intervals by reducing the listening window and eliminating the need for periodic recalibration against the HFXO in EM2. 

- An integrated high frequency RC oscillator (HFRCO) is available for the MCU system, when crystal accuracy is not required. The HFRCO employs fast start-up at minimal energy consumption combined with a wide frequency range, from 1 MHz to 80 MHz. 

- An integrated fast start-up RC oscillator (FSRCO) that runs at a fixed 20 MHz. 

- An integrated low frequency 32.768 kHz RC oscillator (LFRCO). Precision mode enables periodic recalibration against the 40.0 MHz HFXO crystal to improve accuracy to +/- 500 ppm, suitable for BLE sleep interval timing. 

- An integrated ultra-low frequency 1 kHz RC oscillator (ULFRCO) is available to provide a timing reference at the lowest energy consumption in low energy modes. 

## **3.6  General Purpose Input/Output (GPIO)** 

The BGM260P has up to 32 General Purpose Input/Output pins. Each GPIO pin can be individually configured as either an output or input. More advanced configurations including open-drain, open-source, and glitch-filtering can be configured for each individual GPIO pin. The GPIO pins can be overridden by peripheral connections, like SPI communication. Each peripheral connection can be routed to several GPIO pins on the device. The input value of a GPIO pin can be routed through the Peripheral Reflex System to other peripherals. The GPIO subsystem supports asynchronous external pin interrupts. 

All of the pins on ports A and port B are EM2 capable. These pins may be used by Low-Energy peripherals in EM2/3 and may also be used as EM2/3 pin wake-ups. Pins on ports C and D are latched/retained in their current state when entering EM2 until EM2 exit upon which internal peripherals could once again drive those pads. 

A few GPIOs also have wake functionality down to EM4. These pins are listed in the Table 6.2 GPIO Alternate Functions Table on page 48 with the function GPIO.EM4WU. 

## **3.7  Keypad Scanner (KEYSCAN)** 

A low-energy keypad scanner (KEYSCAN) is included, which can scan up to a 6 x 8 matrix of keyboard switches. The KEYSCAN peripheral contains logic for debounce and settling time, allowing it to scan through the switch matrix autonomously in EM0 and EM1, and interrupt the processor when a key press is detected. A wake-on-keypress feature is also supported, allowing for the detection of any key press down to EM3. 

## **3.8  Counters/Timers and PWM** 

## **3.8.1  Timer/Counter (TIMER)** 

TIMER peripherals keep track of timing, count events, generate PWM outputs, and trigger timed actions in other peripherals through the Peripheral Reflex System (PRS). The core of each TIMER is a 16-bit or 32-bit counter with up to 3 compare/capture channels. Each channel is configurable in one of three modes. In capture mode, the counter state is stored in a buffer at a selected input event. In compare mode, the channel output reflects the comparison of the counter to a programmed threshold value. In PWM mode, the TIMER supports generation of pulse-width modulation (PWM) outputs of arbitrary waveforms defined by the sequence of values written to the compare registers. In addition, some timers offer dead-time insertion. 

See 3.14 Configuration Summary for information on the feature set of each timer. 

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## **3.8.2  Low Energy Timer (LETIMER)** 

The unique LETIMER is a 24-bit timer that is available in energy mode EM0 Active, EM1 Sleep, EM2 Deep Sleep, and EM3 Stop. This allows it to be used for timing and output generation when most of the device is powered down, allowing simple tasks to be performed while the power consumption of the system is kept at an absolute minimum. The LETIMER can be used to output a variety of waveforms with minimal software intervention. The LETIMER is connected to the Peripheral Reflex System (PRS), and can be configured to start counting on compare matches from other peripherals such as the Real Time Clock. 

## **3.8.3  System Real Time Clock with Capture (SYSRTC)** 

The System Real Time Clock (SYSRTC) is a 32-bit counter providing timekeeping down to EM3. The SYSRTC can be clocked by any of the on-board low-frequency oscillators, and it is capable of providing system wake-up at user defined intervals. 

## **3.8.4  Back-Up Real Time Counter (BURTC)** 

The Back-Up Real Time Counter (BURTC) is a 32-bit counter providing timekeeping in all energy modes, including EM4. The BURTC can be clocked by any of the on-board low-frequency oscillators, and it is capable of providing system wake-up at user-defined intervals. 

## **3.8.5  Watchdog Timer (WDOG)** 

The watchdog timer can act both as an independent watchdog or as a watchdog synchronous with the CPU clock. It has windowed monitoring capabilities, and can generate a reset or different interrupts depending on the failure mode of the system. The watchdog can also monitor autonomous systems driven by the Peripheral Reflex System (PRS). 

## **3.9  Communications and Other Digital Peripherals** 

## **3.9.1  Universal Synchronous/Asynchronous Receiver/Transmitter (USART)** 

The Universal Synchronous/Asynchronous Receiver/Transmitter is a flexible serial I/O module. It supports full duplex asynchronous UART communication with hardware flow control as well as RS-485, SPI, MicroWire, and 3-wire. It can also interface with devices supporting: 

- ISO7816 SmartCards 

- IrDA 

- I[2] S 

## **3.9.2  Enhanced Universal Synchronous/Asynchronous Receiver/Transmitter (EUSART)** 

The Enhanced Universal Synchronous/Asynchronous Receiver/Transmitter supports full duplex asynchronous UART communication with hardware flow control, RS-485, and IrDA support. The EUSART also supports high-speed SPI. In EM0 and EM1, the EUSART provides a high-speed, buffered communication interface. 

When routed to GPIO ports A or B, the EUSART0 may also be used in a low-energy mode and operate in EM2. A 32.768 kHz clock source allows full duplex UART communication up to 9600 baud. EUSART0 can also act as a SPI secondary device in EM2 and EM3, and wake the system when data is received from an external bus controller. 

## **3.9.3  Inter-Integrated Circuit Interface (I[2] C)** 

The I[2] C module provides an interface between the MCU and a serial I[2] C bus. It is capable of acting as a main or secondary interface and supports multi-drop buses. Standard-mode, fast-mode, and fast-mode plus speeds are supported, allowing transmission rates from 10 kbit/s up to 1 Mbit/s. Bus arbitration and timeouts are also available, allowing implementation of an SMBus-compliant system. The interface provided to software by the I[2] C module allows precise timing control of the transmission process and highly automated transfers. Automatic recognition of addresses is provided in active and low energy modes. Not all instances of I[2] C are available in all energy modes. 

## **3.9.4  Peripheral Reflex System (PRS)** 

The Peripheral Reflex System provides a communication network between different peripheral modules without software involvement. Peripheral modules producing Reflex signals are called producers. The PRS routes Reflex signals from producers to consumer peripherals which in turn perform actions in response. Edge triggers and other functionality, such as simple logic operations (AND, OR, NOT), can be applied by the PRS to the signals. The PRS allows peripherals to act autonomously without waking the MCU core, saving power. 

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## **3.10  Security** 

BGM260P modules support Secure Vault High. 

Secure Vault is a PSA Level 3 certified collection of technologies that deliver state-of-the-art security and upgradability features to protect and future-proof IoT devices against costly threats, attacks, and tampering. A dedicated security CPU enables the Secure Vault functions and isolates cryptographic functions and data from the Cortex-M33 core. 

## **Table 3.3.  Secure Vault Features** 

|**Feature**|**Secure Vault High**|
|---|---|
|True Random Number Generator (TRNG)|Yes|
|Secure Boot with Root of Trust and Secure Loader (RTSL)|Yes|
|Secure Debug with Lock/Unlock|Yes|
|DPA Countermeasures|Yes|
|Anti-Tamper|Yes|
|Secure Attestation|Yes|
|Secure Key Management|Yes|
|Symmetric Encryption|• AES 128 / 192 / 256 bit<br>• ECB, CTR, CBC, CFB, CCM, GCM, CBC-MAC, and GMAC<br>• ChaCha20|
|Public Key Encryption - ECDSA / ECDH / EdDSA|• p192, p256, p384 and p521<br>• Curve25519 (ECDH)<br>• Ed25519 (EdDSA)|
|Key Derivation|• ECJ-PAKE p192, p256, p384, and p521<br>• PBKDF2<br>• HKDF|
|Hashes|• SHA-1<br>• SHA-2 256, 384, and 512<br>• Poly1305|



## **3.10.1  Secure Boot with Root of Trust and Secure Loader (RTSL)** 

The Secure Boot with RTSL authenticates a chain of trusted firmware that begins from an immutable memory (ROM). 

It prevents malware injection, prevents rollback, ensures that only authentic firmware is executed, and protects Over The Air updates. For more information about this feature, see AN1218: Series 2 Secure Boot with RTSL. 

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## **3.10.2  Cryptographic Accelerator** 

The Cryptographic Accelerator is an autonomous hardware accelerator with Differential Power Analysis (DPA) countermeasures to protect keys. 

It supports AES encryption and decryption with 128/192/256-bit keys, ChaCha20 encryption, and Elliptic Curve Cryptography (ECC) to support public key operations and hashes. 

Supported block cipher modes of operation for AES include: 

- Electronic Code Book (ECB) 

- Counter Mode (CTR) 

- Cipher Block Chaining (CBC) 

- Cipher Feedback (CFB) 

- Galois Counter Mode (GCM) 

- Counter with CBC-MAC (CCM) 

- Cipher Block Chaining Message Authentication Code (CBC-MAC) 

- Galois Message Authentication Code (GMAC) 

The Cryptographic Accelerator accelerates Elliptical Curve Cryptography and supports the National Institute of Standards and Technology (NIST) recommended curves including P-192, P-256, P-384, and P-521 for Elliptic Curve Diffie-Hellman (ECDH) key derivation, and Elliptic Curve Digital Signature Algorithm (ECDSA) sign and verify operations. Also supported is the non-NIST Curve25519 for ECDH and Ed25519 for Edwards-curve Digital Signature Algorithm (EdDSA) sign and verify operations. 

Secure Vault also supports Elliptic Curve variant of Password Authenticated Key Exchange by Juggling (ECJ-PAKE) and PasswordBased Key Derivation Function 2 (PBKDF2). 

Supported hashes include SHA-1, SHA-2/256/384/512 and Poly1305. 

This implementation provides a fast and energy efficient solution to state of the art cryptographic needs. 

## **3.10.3  True Random Number Generator** 

The TRNG module is a non-deterministic random number generator that harvests entropy from a thermal energy source. It includes start-up health tests for the entropy source as required by NIST SP800-90B and AIS-31, as well as online health tests required for NIST SP800-90C. 

The TRNG is suitable for periodically generating entropy to seed an approved pseudo random number generator. 

## **3.10.4  Secure Debug with Lock/Unlock** 

For obvious security reasons, it is critical for a product to have its debug interface locked before being released in the field. 

Secure Vault also provides a secure debug unlock function that allows authenticated access based on public key cryptography. This functionality is particularly useful for supporting failure analysis while maintaining confidentiality of IP and sensitive end-user data. 

For more information about this feature, see AN1190: Series 2 Secure Debug. 

## **3.10.5  DPA Countermeasures** 

The AES and ECC accelerators have Differential Power Analysis (DPA) countermeasures support. This makes it very expensive from a time and effort standpoint to use DPA to recover secret keys. 

## **3.10.6  Secure Key Management with PUF** 

Key material in Secure Vault High products is protected by "key wrapping" with a standardized symmetric encryption mechanism. This method has the advantage of protecting a virtually unlimited number of keys, limited only by the storage that is accessible by the Cortex-M33, which includes off-chip storage as well. The symmetric key used for this wrapping and unwrapping must be highly secure because it can expose all other key materials in the system. The Secure Vault Key Management system uses a Physically Unclonable Function (PUF) to generate a persistent device-unique seed key on power up to dynamically generate this critical wrapping/unwrapping key which is only visible to the AES encryption engine and is not retained when the device loses power. 

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## **3.10.7  Anti-Tamper** 

Secure Vault High devices provide internal tamper protection which monitors parameters such as voltage, temperature, and electromagnetic pulses as well as detecting tamper of the security sub-system itself. Additionally, 8 external configurable tamper pins support external tamper sources, such as enclosure tamper switches. 

For each tamper event, the user is able to select the severity of the tamper response ranging from an interrupt, to a reset, to destroying the PUF reconstruction data which will make all protected key materials un-recoverable and effectively render the device inoperable. The tamper system also has an internal resettable event counter with programmable trigger threshold and refresh periods to mitigate false positive tamper events. 

For more information about this feature, see AN1247: Anti-Tamper Protection Configuration and Use. 

## **3.10.8  Secure Attestation** 

Secure Vault High products support Secure Attestation, which begins with a secure identity that is created during the Silicon Labs manufacturing process. During device production, each device generates its own public/private keypair and securely stores the wrapped private key into immutable OTP memory and this key never leaves the device. The corresponding public key is extracted from the device and inserted into a binary DER-encoded X.509 device certificate, which is signed into a Silicon Labs CA chain and then programmed back into the chip into an immutable OTP memory. 

The secure identity can be used to authenticate the chip at any time in the life of the product. The production certification chain can be requested remotely from the product. This certification chain can be used to verify that the device was authentically produced by Silicon Labs. The device unique public key is also bound to the device certificate in the certification chain. A challenge can be sent to the chip at any point in time to be signed by the device private key. The public key in the device certificate can then be used to verify the challenge response, proving that the device has access to the securely-stored private key, which prevents counterfeit products or impersonation attacks. 

For more information about this feature, see AN1268: Authenticating Silicon Labs Devices Using Device Certificates. 

## **3.11  Analog** 

## **3.11.1  Analog to Digital Converter (IADC)** 

The IADC is a hybrid architecture combining techniques from both SAR and Delta-Sigma style converters. Flexible controls allow finetuned performance and speed to meet the needs of a wide variety of applications. Hardware oversampling reduces system-level noise over multiple front-end samples. The IADC includes integrated voltage reference options. Inputs are selectable from a wide range of sources, including pins configurable as either single-ended or differential. 

The IADC supports one operational mode: 

- Normal Mode: Flexible speed and performance, 12-16 bits output resolution 

   - 11.7 bits ENOB performance at 1 Msps (OSR = 2) 

   - 14.3 bits ENOB performance at 76.9 ksps (OSR = 32) 

## **3.11.2  Analog Comparator (ACMP)** 

The ACMP is used to compare the voltage of two analog inputs, with a digital output indicating which input voltage is higher. Inputs are selected from among internal references and external pins. The tradeoff between response time and current consumption is configurable by software. Two 6-bit reference dividers allow for a wide range of internally-programmable reference sources. The ACMP can also be used to monitor the supply voltage. An interrupt can be generated when the supply falls below or rises above the programmable threshold. 

## **3.11.3  Digital to Analog Converter (VDAC)** 

The VDAC can convert a digital value to an analog output voltage. The VDAC is a fully differential, 500 ksps, 12-bit converter. The VDAC may be used for a number of different applications such as sensor interfaces or sound output. The VDAC can generate highresolution analog signals while the MCU is operating at low frequencies and with low total power consumption. Using DMA and a timer, the VDAC can be used to generate waveforms without any CPU intervention. The VDAC is available in all energy modes down to and including EM3. 

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## **3.11.4  Liquid Crystal Display Driver (LCD)** 

The LCD driver is capable of driving a segmented LCD with up to 4x23 segments. A voltage boost function enables it to provide the LCD with higher voltage than the supply voltage for the device. A patented charge redistribution driver can reduce the LCD peripheral supply current by up to 40%. In addition, an animation feature can run custom animations on the LCD without any CPU intervention. The LCD driver can also remain active even in Energy Mode 2 and provides a Frame Counter interrupt that can wake-up the device on a regular basis for updating data. 

## **3.12  Core, Memory, and Accelerators** 

## **3.12.1  Processor Core** 

The ARM Cortex-M processor includes a 32-bit RISC processor integrating the following features and tasks in the system: 

- ARM Cortex-M33 RISC processor achieving 1.50 Dhrystone MIPS/MHz 

- ARM TrustZone security technology 

- Embedded Trace Macrocell (ETM) for real-time trace and debug 

- Up to 3200 kB flash program memory 

- Up to 512 kB RAM data memory 

- Configuration and event handling of all modules 

- 2-pin Serial-Wire debug interface 

## **3.12.2  Memory System Controller (MSC)** 

The MSC is the program memory unit of the microcontroller. The flash memory is readable and writable from both the Cortex-M33 and LDMA. In addition to the main flash array where program code is normally written, the MSC also provides an information block where additional information, such as special user information or flash-lock bits, is stored. There is also a read-only page in the information block containing system and device calibration data. Read and write operations are supported in energy modes EM0 Active and EM1 Sleep. 

## **3.12.3  Linked Direct Memory Access Controller (LDMA)** 

The LDMA controller allows the system to perform memory operations independently of software. This reduces both energy consumption and software workload. The LDMA allows operations to be linked together and staged, enabling sophisticated operations to be implemented. 

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## **3.13  Memory Map** 

The BGM260P memory map is shown in the figures below. RAM and flash sizes are for the largest memory configuration. 

**==> picture [457 x 309] intentionally omitted <==**

**----- Start of picture text -----**<br>
0xfffffffe<br>0xe0100000<br>0xe00fffff<br>M33 Peripherals<br>0xe0000000<br>0xe0100000<br>0xdfffffff M33 ROM Table<br>0xe00ff000<br>0xb0005000<br>0xe0042000<br>0xb0004fff Embedded Trace Macrocell (ETM)<br>FRCRAM (non-secure) 0xe0041000<br>0xb0004000 Trace Port Interface Unit (TPIU)<br>0xe0040000<br>0xb0003fff<br>SEQRAM (non-secure) 0xe000f000<br>0xb0000000 System Control Space<br>0xe000e000<br>0xafffffff<br>0xe0003000<br>0xa0005000 Flash Patch and Breakpoint (FPB)<br>0xe0002000<br>0xa0004fff Data Watchpoint and Trace (DWT)<br>FRCRAM (secure) 0xe0001000<br>0xa0004000 Instrumentation Trace Macrocell (ITM)<br>0xe0000000<br>0xa0003fff<br>SEQRAM (secure)<br>0xa0000000<br>0x9fffffff<br>0x60000000<br>0x5fffffff<br>Peripherals (non-secure)<br>0x50000000<br>0x4fffffff<br>Peripherals (secure)<br>0x40000000<br>0x3fffffff 0x0fe08a00<br>FLASH_CHIPCONFIG<br>0x20080000<br>0x0fe08400<br>0x2007ffff<br>RAM (DMEM) FLASH_DEVINFO<br>0x20000000<br>0x0fe08000<br>0x1fffffff<br>0x0fe00400<br>Flash FLASH_USERDATA<br>0x0fe00000<br>0x08000000<br>0x08320000<br>0x07FFFFFF<br>FLASH<br>0x00000000<br>0x08000000<br>**----- End of picture text -----**<br>


**Figure 3.4.  BGM260P Memory Map — Core Peripherals and Code Space** 

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Rev. 1.1  |  18 

BGM260P Wireless Gecko Bluetooth Module Data Sheet System Overview 

## **3.14  Configuration Summary** 

The features of the BGM260P are a subset of the feature set described in the device reference manual. The table below describes device specific implementation of the features. Remaining modules support full configuration. Refer to the Energy Modes table in the BGM260P Reference Manual EMU Chapter for a more comprehensive list of energy mode support for all device peripherals. 

**Table 3.4.  Configuration Summary** 

|**Module**|**Lowest Energy Mode**|**Configuration**|
|---|---|---|
|I2C0|EM1 - Full functionality<br>EM2/31- Functionality limited to receive address recog-<br>nition||
|I2C1|EM1 - Full functionality||
|I2C2|EM1 - Full functionality||
|I2C3|EM1 - Full functionality||
|LETIMER0|EM2/31|24-bit, 2-channels|
|TIMER0|EM1|32-bit, 3-channels, +DTI|
|TIMER1|EM1|32-bit, 3-channels, +DTI|
|TIMER2|EM1|16-bit, 3-channels, +DTI|
|TIMER3|EM1|16-bit, 3-channels, +DTI|
|TIMER4|EM1|16-bit, 3-channels, +DTI|
|TIMER5|EM1|16-bit, 3-channels, +DTI|
|TIMER6|EM1|16-bit, 3-channels, +DTI|
|TIMER7|EM1|16-bit, 3-channels, +DTI|
|TIMER8|EM1|32-bit, 3-channels, +DTI|
|TIMER9|EM1|32-bit, 3-channels, +DTI|
|EUSART0|EM1 - Full high-speed operation, all modes<br>EM21- Low-energy UART operation, 9600 Baud<br>EM2/31- Low-energy SPI secondary receiver|UART, SPI, IrDA, DALI|
|EUSART1|EM1|UART, SPI, IrDA, DALI|
|EUSART2|EM1|UART, SPI, IrDA, DALI|
|EUSART3|EM1|UART, SPI, IrDA, DALI|
|USART0|EM1|UART, SPI, IrDA, I2S, SmartCard|
|USART1|EM1|UART, SPI, IrDA, I2S, SmartCard|
|USART2|EM1|UART, SPI, IrDA, I2S, SmartCard|
|**Note:**<br>1. EM2 and EM3 operation is only supported for digital peripheral I/O on Port A and Port B. All GPIO ports support digital peripheral<br>operation in EM0 and EM1.|||



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Rev. 1.1  |  19 

BGM260P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 

## **4.  Electrical Specifications** 

All electrical parameters in all tables are specified under the following conditions, unless stated otherwise: 

- Typical values are based on TA=25 °C and VDD supply at 3.0 V, by production test and/or technology characterization. 

- Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output power-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna. 

- Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise. 

## **4.1  Absolute Maximum Ratings** 

**Table 4.1.  Absolute Maximum Ratings** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Storage temperature range|TSTG||-40|—|+125|°C|
|Voltage on any supply pin|VDDMAX||-0.3|—|3.8|V|
|Junction temperature|TJMAX||—|—|+125|°C|
|Voltage ramp rate on any<br>supply pin|VDDRAMPMAX||—|—|1.0|V / µs|
|DC voltage on any GPIO<br>pin1|VDIGPIN||-0.3|—|VVDD+ 0.3|V|
|DC voltage on RESETn pin2|VRESETn||-0.3|—|3.8|V|
|Total current into VDD pin|IVDDMAX|Source|—|—|200|mA|
|Total current into GND pin|IVSSMAX|Sink|—|—|200|mA|
|Current per I/O pin|IIOMAX|Sink|—|—|50|mA|
|||Source|—|—|50|mA|
|Current for all I/O pins|IIOALLMAX|Sink|—|—|200|mA|
|||Source|—|—|200|mA|
|**Note:**<br>1. When operating as an LCD driver, the output voltage on a GPIO may safely exceed this specification except on PA00, where the<br>the maximum voltage is VDD. The pin output voltage may be up to 3.8 V in this case.<br>2. The RESETn pin has a pull-up device to the internal DVDD supply. For minimum leakage, RESETn should not exceed the volt-<br>age at DVDD, which is generated by the DC-DC converter. DVDD is equal to 1.8 V when DC-DC is active and bypassed to VDD<br>when DC-DC is inactive.|||||||



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BGM260P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 

## **4.2  General Operating Conditions** 

**Table 4.2.  General Operating Conditions** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Operating ambient tempera-<br>ture range1|TA||-40|—|+125|°C|
|VDD operating supply volt-<br>age|VVDD|10 dBm Module, DC-DC in regula-<br>tion|2.2|3.0|3.8|V|
|||19.5 dBm Module, DC-DC in reg-<br>ulation|2.2|3.3|3.8|V|
|||10 dBm Module, DC-DC in by-<br>pass|1.8|3.0|3.8|V|
|||19.5 dBm Module, DC-DC in by-<br>pass|1.8|3.3|3.8|V|
|HCLK and SYSCLK frequen-<br>cy|fHCLK|VSCALE2, MODE = WS1|—|—|80|MHz|
|||VSCALE2, MODE = WS0|—|—|40|MHz|
|||VSCALE1, MODE = WS1|—|—|40|MHz|
|||VSCALE1, MODE = WS0|—|—|20|MHz|
|PCLK frequency|fPCLK|VSCALE2 or VSCALE1|—|—|40|MHz|
|EM01 Group A clock fre-<br>quency|fEM01GRPACLK|VSCALE2|—|—|80|MHz|
|||VSCALE1|—|—|40|MHz|
|EM01 Group C clock fre-<br>quency|fEM01GRPCCLK|VSCALE2|—|—|80|MHz|
|||VSCALE1|—|—|40|MHz|
|Radio HCLK frequency|fRHCLK|VSCALE2 or VSCALE1|—|40|—|MHz|
|DPLL Reference Clock|fDPLLREFCLK|VSCALE2 or VSCALE1|—|—|40|MHz|
|**Note:**<br>1. The device may operate continuously at the maximum allowable ambient TArating as long as the absolute maximum TJMAXis not<br>exceeded. For an application with significant power dissipation, the allowable TAmay be lower than the maximum TArating. TA=<br>TJMAX- (THETAJAx PowerDissipation). Refer to the4.1 Absolute Maximum Ratingstable and the4.3 Thermal Characteristics<br>table for TJMAXand THETAJA.|||||||



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BGM260P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 

## **4.3  Thermal Characteristics** 

**Table 4.3.  Thermal Characteristics** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Thermal Resistance, Junc-<br>tion to Ambient|THETAJA|2-Layer PCB, under Natural Con-<br>vection1|—|48.5|—|°C/W|
|||4-Layer PCB, under Natural Con-<br>vection1|—|24.5|—|°C/W|
|Thermal Resistance, Junc-<br>tion to Board|PSIJT|2-Layer PCB, under Natural Con-<br>vection1|—|8.6|—|°C/W|
|||4-Layer PCB, under Natural Con-<br>vection1|—|8.3|—|°C/W|
|**Note:**<br>1. Measured according to JEDEC standard JESD51-2A. Integrated Circuit Thermal Test Method Environmental Conditions - Natural<br>Convection (Still Air).|||||||



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Rev. 1.1  |  22 

BGM260P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 

## **4.4  MCU Current Consumption at 3.0 V** 

Unless otherwise indicated, typical conditions are: VDD = 3.0 V, DC-DC in regulation. Voltage scaling level = VSCALE1. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 °C. 

**Table 4.4.  MCU Current Consumption at 3.0 V** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Current consumption in EM0<br>mode with all peripherals dis-<br>abled|IACTIVE|80 MHz HFRCO w/ DPLL refer-<br>enced to 40 MHz crystal, CPU<br>running Prime from flash,<br>VSCALE2|—|53.5|—|µA/MHz|
|||80 MHz HFRCO w/ DPLL refer-<br>enced to 40 MHz crystal, CPU<br>running while loop from flash,<br>VSCALE2|—|53.8|—|µA/MHz|
|||80 MHz HFRCO w/ DPLL refer-<br>enced to 40 MHz crystal, CPU<br>running CoreMark loop from flash,<br>VSCALE2|—|72.4|—|µA/MHz|
|||40 MHz crystal, CPU running<br>Prime from flash|—|59.4|—|µA/MHz|
|||40 MHz crystal, CPU running<br>while loop from flash|—|59.3|—|µA/MHz|
|||40 MHz crystal, CPU running<br>CoreMark loop from flash|—|76.9|—|µA/MHz|
|||38 MHz HFRCO, CPU running<br>while loop from flash|—|55|—|µA/MHz|
|Current consumption in EM1<br>mode with all peripherals dis-<br>abled|IEM1|80 MHz HFRCO w/ DPLL refer-<br>enced to 40 MHz crystal,<br>VSCALE2|—|39.9|—|µA/MHz|
|||40 MHz crystal|—|45.7|—|µA/MHz|
|||38 MHz HFRCO|—|41.5|—|µA/MHz|
|Current Consumption in EM2<br>mode, VSCALE0|IEM2_VS|512 kB RAM and full Radio RAM<br>retention, RTC running from<br>LFXO1|—|5|—|µA|
|||512 kB RAM and full Radio RAM<br>retention, RTC running from<br>LFRCO1|—|5|—|µA|
|||512 kB RAM and full Radio RAM<br>retention, RTC running from<br>LFRCO in precision mode1|—|5.75|—|µA|
|||16 kB RAM and full Radio RAM<br>retention, RTC running from<br>LFXO1|—|1.4|—|µA|
|||16 kB RAM and full Radio RAM<br>retention, RTC running from<br>LFRCO1|—|1.4|—|µA|
|||16 kB RAM and full Radio RAM<br>retention, RTC running from<br>LFRCO in precision mode1|—|2.15|—|µA|



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BGM260P Wireless Gecko Bluetooth Module Data Sheet 

Electrical Specifications 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Current consumption in EM3<br>mode, VSCALE0|IEM3_VS|512 kB RAM and full Radio RAM<br>retention, RTC running from<br>ULFRCO1|—|4.7|—|µA|
|||16 kB RAM and full Radio RAM<br>retention, RTC running from<br>ULFRCO1|—|1.2|—|µA|
|Change in current consump-<br>tion for retained RAM bank in<br>EM2 or EM3|IEM3_RAM|Per 16 kB RAM bank|—|0.12|—|µA|
|Current consumption in EM4<br>mode2|IEM4|No BURTC, no LF oscillator|—|0.23|—|µA|
|||BURTC with LFRCO|—|0.66|—|µA|
|Current consumption during<br>reset|IRST|Hard pin reset held|—|480|—|µA|
|**Note:**<br>1. CPU cache retained, EM0/1 peripheral states retained<br>2. Note that the DCDC will be disabled in EM4.|||||||



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Rev. 1.1  |  24 

BGM260P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 

## **4.5  Radio Current Consumption with 3.0 V Supply** 

RF current consumption measured with MCU in EM1 and all MCU peripherals disabled. Unless otherwise indicated, typical conditions are: VDD = 3.0 V, DC-DC in regulation. TA = 25 °C. 

**Table 4.5.  Radio Current Consumption with 3.0 V Supply** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Current consumption in re-<br>ceive mode, active packet<br>reception|IRX_ACTIVE|125 kbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE1, EM1P|—|6|—|mA|
|||125 kbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE2|—|7.2|—|mA|
|||500 kbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE1, EM1P|—|6.1|—|mA|
|||500 kbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE2|—|7.2|—|mA|
|||1 Mbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE1, EM1P|—|5.7|—|mA|
|||1 Mbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE2|—|6.8|—|mA|
|||2 Mbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE1, EM1P|—|6.5|—|mA|
|||2 Mbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE2|—|7.6|—|mA|
|Current consumption in re-<br>ceive mode, listening for<br>packet|IRX_LISTEN|125 kbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE1, EM1P|—|6|—|mA|
|||125 kbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE2|—|7.2|—|mA|
|||500 kbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE1, EM1P|—|6.1|—|mA|
|||500 kbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE2|—|7.2|—|mA|
|||1 Mbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE1, EM1P|—|5.7|—|mA|
|||1 Mbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE2|—|6.8|—|mA|
|||2 Mbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE1, EM1P|—|6.5|—|mA|
|||2 Mbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE2|—|7.7|—|mA|
|Current consumption in<br>transmit mode, VSCALE2|ITX|f = 2.442 GHz, CW, 19.5 dBm<br>output power, VDD = 3.3 V|—|154.8|—|mA|
|||f = 2.442 GHz, CW, 10 dBm out-<br>put power|—|19.4|—|mA|
|||f = 2.442 GHz, CW, 0 dBm output<br>power|—|6.8|—|mA|



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Rev. 1.1  |  25 

BGM260P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 

## **4.6  RF Transmitter General Characteristics for the 2.4 GHz Band** 

Unless otherwise indicated, typical conditions are: VDD = 3.0 V, DC-DC in regulation. RF center frequency 2.45 GHz. TA = 25 °C. 

**Table 4.6.  RF Transmitter General Characteristics for the 2.4 GHz Band** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|RF tuning frequency range|FRANGE||2402|—|2480|MHz|
|Maximum TX power1|POUTMAX|19.5 dBm, VDD = 3.3 V|—|19.5|—|dBm|
|||10 dBm|—|10|—|dBm|
|||0 dBm|—|-0.1|—|dBm|
|Minimum active TX power|POUTMIN|19.5 dBm, VDD = 3.3 V|—|-33|—|dBm|
|||10 dBm|—|-30|—|dBm|
|||0 dBm|—|-24|—|dBm|
|Output power step size|POUTSTEP|0 dBm, Output Power < -5 dBm|2.7|6|10.2|dB|
|||0 dBm, Output Power > -5 dBm|0.1|0.4|1.6|dB|
|||10 dBm, Output Power < -5 dBm|2.2|6|12.7|dB|
|||10 dBm, -5 dBm < Output power <<br>0 dBm|0.9|1.4|2.1|dB|
|||10 dBm, Output power > 0 dBm|0.1|0.3|1.1|dB|
|||19.5 dBm, VDD = 3.3 V, Output<br>power < -5 dBm|14.3|6.5|2.5|dB|
|||19.5 dBm, VDD = 3.3 V, -5 dBm <<br>Output power < 0 dBm|1.1|1.4|1.8|dB|
|||19.5 dBm, VDD = 3.3 V, 0 dBm <<br>Output power < 10 dBm|0.1|0.4|1|dB|
|||19.5 dBm, VDD = 3.3 V, Output<br>power > 10 dBm|0.1|0.1|0.4|dB|
|Output power variation vs<br>supply voltage variation|POUTVAR_V|19.5 dBm output power with VDD<br>voltage swept from 1.8 V to 3.8 V|—|5|—|dB|
|||10 dBm output power with VDD<br>voltage swept from 1.8 V to 3.8 V|—|0.02|—|dB|
|||0 dBm output power with VDD<br>voltage swept from 1.8 V to 3.8 V|—|0.02|—|dB|
|Output power variation vs<br>temperature|POUTVAR_T|19.5 dBm, VDD = 3.3 V, (-40 to<br>+125 °C)|—|0.9|—|dB|
|||10 dBm, (-40 to +125 °C)|—|0.8|—|dB|
|||0 dBm, (-40 to +125 °C)|—|1.2|—|dB|
|Output power variation over<br>the RF tuning frequency<br>range|POUTVAR_F|19.5 dBm, VDD = 3.3 V|—|0.2|—|dB|
|||10 dBm|—|0.2|—|dB|
|||0 dBm|—|0.2|—|dB|
|**Note:**<br>1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-<br>ered in this data sheet can be found in the TX Power column of the Ordering Information Table.|||||||



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BGM260P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 

## **4.7  RF Receiver General Characteristics for the 2.4 GHz Band** 

Unless otherwise indicated, typical conditions are: VDD = 3.0 V, DC-DC in regulation. RF center frequency 2.442 GHz. TA = 25 °C. 

**Table 4.7.  RF Receiver General Characteristics for the 2.4 GHz Band** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|RF tuning frequency range|FRANGE||2402|—|2480|MHz|



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BGM260P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 

## **4.8  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate** 

Unless otherwise indicated, typical conditions are: VDD = 3.0 V, DC-DC in regulation. RF center frequency 2.442 GHz. TA = 25 °C. 

**Table 4.8.  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Rx Max Strong Signal Input<br>Level for 0.1% BER|RXSAT|Signal is reference signal, packet<br>length is 37 bytes1|—|10|—|dBm|
|Sensitivity|SENS|10 dBm Module, Signal is refer-<br>ence signal, 37 byte payload1|—|-98.2|—|dBm|
|||10 dBm Module, Signal is refer-<br>ence signal, 255 byte payload2|—|-96.7|—|dBm|
|||10 dBm Module, With non-ideal<br>signals, 37 byte payload3 1|—|-97.9|—|dBm|
|||19.5 dBm Module, Signal is refer-<br>ence signal, 37 byte payload1|—|-97.7|—|dBm|
|||19.5 dBm Module, Signal is refer-<br>ence signal, 255 byte payload2|—|-96.1|—|dBm|
|||19.5 dBm Module, With non-ideal<br>signals, 37 byte payload3 1|—|-97.3|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes), 37 byte payload1 4|—|6.4|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +1<br>MHz offset, 37 byte payload1 5 4 6|—|-7.2|—|dB|
|||Interferer is reference signal at -1<br>MHz offset, 37 byte payload1 5 4 6|—|-7.4|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +2<br>MHz offset, 37 byte payload1 5 4 6|—|-44.7|—|dB|
|||Interferer is reference signal at -2<br>MHz offset, 37 byte payload1 5 4 6|—|-46.7|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +3<br>MHz offset, 37 byte payload1 5 4 6|—|-49.9|—|dB|
|||Interferer is reference signal at -3<br>MHz offset, 37 byte payload1 5 4 6|—|-49.6|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion, 37 byte payload1 6|—|-25.2|—|dB|
|Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision, 37 byte payload1 6|—|-44.7|—|dB|
|||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision, 37 byte payload1 6|—|-7.2|—|dB|



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BGM260P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|**Note:**<br>1. 0.1% Bit Error Rate.<br>2. 0.017% Bit Error Rate.<br>3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>4. Desired signal -67 dBm.<br>5. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>6. With allowed exceptions.|||||||



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BGM260P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 

## **4.9  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate** 

Unless otherwise indicated, typical conditions are: VDD = 3.0 V, DC-DC in regulation. RF center frequency 2.442 GHz. TA = 25 °C. 

**Table 4.9.  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Rx Max Strong Signal Input<br>Level for 0.1% BER|RXSAT|Signal is reference signal, packet<br>length is 37 bytes1|—|10|—|dBm|
|Sensitivity|SENS|10 dBm Module, Signal is refer-<br>ence signal, 37 byte payload1|—|-95.5|—|dBm|
|||10 dBm Module, Signal is refer-<br>ence signal, 255 byte payload2|—|-93.9|—|dBm|
|||10 dBm Module, With non-ideal<br>signals, 37 byte payload3 1|—|-95.3|—|dBm|
|||19.5 dBm Module, Signal is refer-<br>ence signal, 37 byte payload1|—|-94.8|—|dBm|
|||19.5 dBm Module, Signal is refer-<br>ence signal, 255 byte payload2|—|-93.3|—|dBm|
|||19.5 dBm Module, With non-ideal<br>signals, 37 byte payload3 1|—|-94.6|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes), 37 byte payload1 4|—|6.6|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +2<br>MHz offset, 37 byte payload1 5 4 6|—|-7.1|—|dB|
|||Interferer is reference signal at -2<br>MHz offset, 37 byte payload1 5 4 6|—|-7.5|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +4<br>MHz offset, 37 byte payload1 5 4 6|—|-43.8|—|dB|
|||Interferer is reference signal at -4<br>MHz offset, 37 byte payload1 5 4 6|—|-45.8|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +6<br>MHz offset, 37 byte payload1 5 4 6|—|-49.8|—|dB|
|||Interferer is reference signal at -6<br>MHz offset, 37 byte payload1 5 4 6|—|-50.8|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion, 37 byte payload1 6|—|-24.6|—|dB|
|Selectivity to image frequen-<br>cy ± 2 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +2 MHz with 1<br>MHz precision, 37 byte payload1 6|—|-43.8|—|dB|
|||Interferer is reference signal at im-<br>age frequency -2 MHz with 1 MHz<br>precision, 37 byte payload1 6|—|-7.1|—|dB|



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|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|**Note:**<br>1. 0.1% Bit Error Rate.<br>2. 0.017% Bit Error Rate.<br>3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>4. Desired signal -64 dBm.<br>5. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>6. With allowed exceptions.|||||||



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## **4.10  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate** 

Unless otherwise indicated, typical conditions are: VDD = 3.0 V, DC-DC in regulation. RF center frequency 2.442 GHz. TA = 25 °C. 

**Table 4.10.  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Rx Max Strong Signal Input<br>Level for 0.1% BER|RXSAT|Signal is reference signal, packet<br>length is 37 bytes1|—|10|—|dBm|
|Sensitivity|SENS|10 dBm Module, Signal is refer-<br>ence signal, 37 byte payload1|—|-101.9|—|dBm|
|||10 dBm Module, Signal is refer-<br>ence signal, 255 byte payload2|—|-100.6|—|dBm|
|||10 dBm Module, With non-ideal<br>signals, 37 byte payload3 1|—|-101.2|—|dBm|
|||19.5 dBm Module, Signal is refer-<br>ence signal, 37 byte payload1|—|-101.2|—|dBm|
|||19.5 dBm Module, Signal is refer-<br>ence signal, 255 byte payload2|—|-99.9|—|dBm|
|||19.5 dBm Module, With non-ideal<br>signals, 37 byte payload3 1|—|-100.6|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes), 37 byte payload1 4|—|2.0|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +1<br>MHz offset, 37 byte payload1 5 4 6|—|-8.8|—|dB|
|||Interferer is reference signal at -1<br>MHz offset, 37 byte payload1 5 4 6|—|-8.9|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +2<br>MHz offset, 37 byte payload1 5 4 6|—|-49.4|—|dB|
|||Interferer is reference signal at -2<br>MHz offset, 37 byte payload1 5 4 6|—|-51.4|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +3<br>MHz offset, 37 byte payload1 5 4 6|—|-52.0|—|dB|
|||Interferer is reference signal at -3<br>MHz offset, 37 byte payload1 5 4 6|—|-55.5|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion, 37 byte payload1 6|—|-52.4|—|dB|
|Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision, 37 byte payload1 6|—|-52.4|—|dB|
|||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision, 37 byte payload1 6|—|-49.8|—|dB|



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|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|**Note:**<br>1. 0.1% Bit Error Rate.<br>2. 0.017% Bit Error Rate.<br>3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>4. Desired signal -72 dBm.<br>5. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>6. With allowed exceptions.|||||||



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## **4.11  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate** 

Unless otherwise indicated, typical conditions are: VDD = 3.0 V, DC-DC in regulation. RF center frequency 2.442 GHz. TA = 25 °C. 

**Table 4.11.  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Rx Max Strong Signal Input<br>Level for 0.1% BER|RXSAT|Signal is reference signal, packet<br>length is 37 bytes1|—|10|—|dBm|
|Sensitivity|SENS|10 dBm Module, Signal is refer-<br>ence signal, 37 byte payload1|—|-106.2|—|dBm|
|||10 dBm Module, Signal is refer-<br>ence signal, 255 byte payload2|—|-105.8|—|dBm|
|||10 dBm Module, With non-ideal<br>signals, 37 byte payload3 1|—|-105.8|—|dBm|
|||19.5 dBm Module, Signal is refer-<br>ence signal, 37 byte payload1|—|-105.6|—|dBm|
|||19.5 dBm Module, Signal is refer-<br>ence signal, 255 byte payload2|—|-105.2|—|dBm|
|||19.5 dBm Module, With non-ideal<br>signals, 37 byte payload3 1|—|-105.2|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes), 37 byte payload1 4|—|0.8|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +1<br>MHz offset, 37 byte payload1 5 4 6|—|-13|—|dB|
|||Interferer is reference signal at -1<br>MHz offset, 37 byte payload1 5 4 6|—|-13.1|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +2<br>MHz offset, 37 byte payload1 5 4 6|—|-54.2|—|dB|
|||Interferer is reference signal at -2<br>MHz offset, 37 byte payload1 5 4 6|—|-55.9|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +3<br>MHz offset, 37 byte payload1 5 4 6|—|-55.9|—|dB|
|||Interferer is reference signal at -3<br>MHz offset, 37 byte payload1 5 4 6|—|-59.6|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion, 37 byte payload1 6|—|-55.2|—|dB|
|Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision, 37 byte payload1 6|—|-55.9|—|dB|
|||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision, 37 byte payload1 6|—|-54.2|—|dB|



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|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|**Note:**<br>1. 0.1% Bit Error Rate.<br>2. 0.017% Bit Error Rate.<br>3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>4. Desired signal -79 dBm.<br>5. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>6. With allowed exceptions.|||||||



## **4.12  High-Frequency Crystal (HFXO)** 

**Table 4.12.  High-Frequency Crystal (HFXO)** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Crystal frequency|fHFXTAL||—|40|—|MHz|
|Initial calibrated accuracy|ACCHFXTAL||-5|+/-3|5|ppm|
|Temperature drift|DRIFTHFXTAL|Across specified temperature<br>range|-32|—|32|ppm|



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## **4.13  Low Frequency Crystal Oscillator (LFXO)** 

**Table 4.13.  Low Frequency Crystal Oscillator (LFXO)** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Crystal Frequency|FLFXO||—|32.768|—|kHz|
|Supported Crystal equivalent<br>series resistance (ESR)|ESRLFXO|GAIN = 0|—|—|80|kΩ|
|||GAIN = 1 to 3|—|—|100|kΩ|
|Supported range of crystal<br>load capacitance1|CL_LFXO|GAIN = 0|4|—|6|pF|
|||GAIN = 1|6|—|10|pF|
|||GAIN = 2 (see note2)|10|—|12.5|pF|
|||GAIN = 3 (see note2)|12.5|—|18|pF|
|Current consumption|ICL12p5|ESR = 70 kΩ, CL= 12.5 pF,<br>GAIN3= 2, AGC4= 1|—|294|—|nA|
|Startup Time|TSTARTUP|ESR = 70 kΩ, CL= 7 pF, GAIN3=<br>1, AGC4= 1|—|52|—|ms|
|On-chip tuning cap step size|SSLFXO||—|0.26|—|pF|
|On-chip tuning capacitor val-<br>ue at minimum setting5|CLFXO_MIN|CAPTUNE = 0|—|5.2|—|pF|
|On-chip tuning capacitor val-<br>ue at maximum setting5|CLFXO_MAX|CAPTUNE = 0x4F|—|26.2|—|pF|
|**Note:**<br>1. Total load capacitance seen by the crystal<br>2. Crystals with a load capacitance of greater than 12 pF require external load capacitors.<br>3. In LFXO_CAL Register<br>4. In LFXO_CFG Register<br>5. The effective load capacitance seen by the crystal will be CLFXO/2. This is because each XTAL pin has a tuning cap and the two<br>caps will be seen in series by the crystal|||||||



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## **4.14  Precision Low Frequency RC Oscillator (LFRCO)** 

**Table 4.14.  Precision Low Frequency RC Oscillator (LFRCO)** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Nominal oscillation frequen-<br>cy|FLFRCO||—|32.768|—|kHz|
|Frequency accuracy|FLFRCO_ACC|Normal mode|-3|—|3|%|
|||Precision mode1, across operat-<br>ing temperature range2|-500|—|500|ppm|
|Startup time|tSTARTUP|Normal mode|—|204|—|µs|
|||Precision mode1|—|11.7|—|ms|
|Current consumption|ILFRCO|Normal mode|—|189.9|—|nA|
|||Precision mode1, T = stable at 25<br>°C3|—|649.8|—|nA|
|**Note:**<br>1. The LFRCO operates in high-precision mode when CFG_HIGHPRECEN is set to 1. High-precision mode is not available in EM4.<br>2. Includes ± 40 ppm frequency tolerance of the HFXO crystal.<br>3. Includes periodic re-calibration against HFXO crystal oscillator.|||||||



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## **4.15  GPIO Pins** 

**Table 4.15.  GPIO Pins** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Leakage current|ILEAK_IO|MODEx = DISABLED, VDD = 3.0<br>V|—|2.5|—|nA|
|Input low voltage1|VIL|Any GPIO pin|—|—|0.3 * VVDD|V|
|||RESETn|—|—|0.3 *<br>VDVDD|V|
|Input high voltage1|VIH|Any GPIO pin|0.7 * VVDD|—|—|V|
|||RESETn|0.7 *<br>VDVDD|—|—|V|
|Hysteresis of input voltage|VHYS|Any GPIO pin|0.05 * VVDD|—|—|V|
|||RESETn|0.05 *<br>VDVDD|—|—|V|
|Output high voltage|VOH|Sourcing 20 mA, VDD = 3.0 V|0.8 * VVDD|—|—|V|
|Output low voltage|VOL|Sinking 20 mA, VDD = 3.0 V|—|—|0.2 * VVDD|V|
|GPIO rise time|TGPIO_RISE|VDD = 3.0 V, Cload= 50pF,<br>SLEWRATE = 4, 10% to 90%|—|8.4|—|ns|
|GPIO fall time|TGPIO_FALL|VDD = 3.0 V, Cload= 50pF,<br>SLEWRATE = 4, 90% to 10%|—|7.1|—|ns|
|Pull up/down resistance2|RPULL|Any GPIO pin. Pull-up to VDD:<br>MODEn = DISABLE DOUT=1.<br>Pull-down to GND: MODEn =<br>WIREDORPULLDOWN DOUT =<br>0.|33|44|55|kΩ|
|||RESETn pin. Pull-up to DVDD|33|44|55|kΩ|
|Maximum filtered glitch width|TGF|MODE = INPUT, DOUT = 1|—|27|—|ns|
|RESETn low time to ensure<br>pin reset|TRESET||100|—|—|ns|
|**Note:**<br>1. GPIO input thresholds are proportional to the VDD pin. RESETn input thresholds are proportional to the internal DVDD supply,<br>which is generated by the DC-DC converter. DVDD is equal to 1.8 V when DC-DC is active and bypassed to VDD when DC-DC<br>is inactive.<br>2. GPIO pull-ups connect to VDD supply, pull-downs connect to GND. RESETn pull-up connects to internal DVDD supply, which is<br>generated by the DC-DC converter. DVDD is equal to 1.8 V when DC-DC is active and bypassed to VDD when DC-DC is inac-<br>tive.|||||||



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## **4.16  LCD** 

## **Table 4.16.  LCD** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|LCD Temperature Range|TRANGE||-40|—|105|°C|
|Frame rate|fLCDFR||30|—|100|Hz|
|LCD supply range1|VLCDIN||1.8|—|3.8|V|
|LCD output voltage range2 3|VLCD|Step-down mode with external<br>LCD capacitor|2.4|—|MIN(3.6,<br>VLCDIN-<br>0.1)|V|
|||Charge pump mode with external<br>LCD capacitor|2.4|—|MIN(3.6,<br>1.9 *<br>VLCDIN)|V|
|Contrast control step size|STEPCONTRAST|Charge pump or Step-down mode|—|50|—|mV|
|Contrast control step accura-<br>cy4|ACCCONTRAST||—|+/- 1.5|—|%|
|**Note:**<br>1. VLCDINis selectable between the VDD or DVDD supply pins, depending on EMU_PWRCTRL_ANASW.<br>2. VLCDshould be a maximum of 2 V above VVDDto avoid additional leakage through the GPIO pins used for LCD functions.<br>3. Maximum voltage for PA00 is V_LCDIN.<br>4. Step size accuracy is measured relative to the typical step size, and typ value represents one standard deviation.|||||||



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BGM260P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 

## **4.17  Microcontroller Peripherals** 

The MCU peripherals set available in BGM260P modules includes: 

- Analog to Digital Converter (IADC) 

- Analog Comparator (ACMP) 

- Digital to Analog Converter (VDAC) 

- Brown Out Detectors (BOD) 

- Oscillators 

   - High Frequency RC Oscillator (HFRCO) 

   - Fast Start-Up RC Oscillator (FSRCO) 

   - Ultra Low Frequency RC Oscillator (ULFRCO) 

- Counters/Timers and PWM 

   - Timer/Counter (TIMER) 

   - Low Energy Timer (LETIMER) 

   - System Real Time Clock with Capture (SYSRTC) 

   - Back-Up Real Time Counter (BURTC) 

   - Watchdog Timer (WDOG) 

   - Pulse Counter (PCNT) 

- USART (UART/SPI/SmartCards/IrDA/I2S) 

- EUSART (UART/IrDA) 

- I[2] C peripheral interfaces 

- Peripheral Reflex System (PRS) 

- Flash Characteristics 

- Temperature Sensor 

- Crypto Operation Timing for SE Manager API 

- Crypto Operation Average Current for SE Manager API 

For details on their electrical performance, consult the relevant portions of Section 4 in the EFR32BG26 Data Sheet. 

To learn which GPIO ports provide access to every peripheral, consult 6.3 Analog Peripheral Connectivity and 6.4 Digital Peripheral Connectivity. 

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BGM260P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 

## **4.18  Antenna Radiation and Efficiency** 

Typical BGM260P radiation patterns for the built-in antenna under optimal operating conditions are plotted in the figures that follow. Antenna gain and radiation patterns have a strong dependence on the size and shape of the application PCB the module is mounted on, as well as on the proximity of any mechanical design to the antenna. 

**Figure 4.1.  Typical 2D Antenna Radiation Patterns - Phi 0[o] (Side View) Gain (dBi)** 

**Figure 4.2.  Typical 2D Antenna Radiation Patterns - Phi 90[o] (Top View) Gain (dBi)** 

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BGM260P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 

**Figure 4.3.  Typical 2D Antenna Radiation Patterns - Theta 90[o] (Front View) Gain (dBi)** 

**Figure 4.4.  3D Radiation Pattern at 2440MHz View 1** 

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**Figure 4.5.  3D Radiation Pattern at 2440MHz View 2** 

**Figure 4.6.   Efficiency of the Built-in Antenna as Function of the Carrier Board Width (mm)** 

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BGM260P Wireless Gecko Bluetooth Module Data Sheet Reference Diagrams 

## **5.  Reference Diagrams** 

## **5.1  Network Co-Processor (NCP) Application with UART Host** 

The BGM260P can be controlled over the UART interface as a peripheral to an external host processor. Typical power supply, programming/debug interface, and host interface connections are shown in the figure below. For more details, refer to AN958: Debugging and Programming Interfaces for Custom Designs. 

**==> picture [504 x 299] intentionally omitted <==**

**----- Start of picture text -----**<br>
Mini Simplicity<br>VDD Connector<br>1 VDD GND 2<br>RESET 35 RESET VCOM_RX 46 0R PA06_RX<br>PA02_DBG_SWDIOPA05_TX 0R 7 VCOM_TXSWDIO SWCLKSWO 8 PA03_DBG_SWOPA01_DBG_SWCLK 44 43 42 41 40 39 38 37<br>PC05_PTI_SYNC 9 PTI_SYNC PTI_DATA 10 PC04_PTI_DATA<br>Header 10-PIN 1.27mm SMD DUAL 1 GND GND 36<br>2 PB04 GND 35<br>3 PB03 GND 34<br>4 PB02 RFOUT 33<br>5 PB01 GND 32<br>6 PB00 RESET 31 RESET<br>87 PA00 BGM260P PC07 2930<br>PA01_DBG_SWCLK PA01 PC06<br>9 28<br>PA02_DBG_SWDIO PA02 PC05 PC05_PTI_SYNC<br>10 27<br>PA03_DBG_SWO PA03 PC04 PC04_PTI_DATA<br>11 26<br>12 PA04 PC03 25 Optional<br>PA05_TX PA05 PC02<br>13 24<br>PA06_RX PA06 PC01<br>VDD 14 GND GND 23<br>HOST CPU<br>1 VDD RX 2 PA05_TX<br>3 0R<br>RTSTX 4 0R PA06_RXPA08_CTS 15 16 17 18 19 20 21 22<br>CTS 5 PA07_RTS VDD<br>7 GND RESET 6 RESET<br>PA07_RTS 32.768 kHz<br>PA08_CTS<br>Optional<br>PC09 PC08 PD05 PD04 PA09 GND GND PB04<br>VDD PA07 PA08 PD03 PD02 PD01 PD00 PC00<br>**----- End of picture text -----**<br>


**Figure 5.1.  UART NCP Configuration** 

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BGM260P Wireless Gecko Bluetooth Module Data Sheet Reference Diagrams 

## **5.2  SoC Application** 

The BGM260P can be used in a stand-alone SoC configuration without an external host processor. Typical power supply and programming/debug interface connections are shown in the figure below. For more details, refer to AN958: Debugging and Programming Interfaces for Custom Designs. 

**==> picture [470 x 279] intentionally omitted <==**

**----- Start of picture text -----**<br>
Mini Simplicity<br>VDD Connector<br>1 VDD GND 2<br>PA02_DBG_SWDIOPA05_TXRESET 0R 357 VCOM_TXRESETSWDIO VCOM_RXSWCLKSWO 468 0R PA06_RXPA03_DBG_SWOPA01_DBG_SWCLK 44 43 42 41 40 39 38 37<br>PC05_PTI_SYNC 9 PTI_SYNC PTI_DATA 10 PC04_PTI_DATA<br>Header 10-PIN 1.27mm SMD DUAL 1 GND GND 36<br>2 PB04 GND 35<br>3 PB03 GND 34<br>4 PB02 RFOUT 33<br>5 PB01 GND 32<br>6 PB00 RESET 31 RESET<br>PA01_DBG_SWCLK 87 PA00PA01 BGM260P PC06PC07 2930<br>PA02_DBG_SWDIO 9 PA02 PC05 28 PC05_PTI_SYNC<br>PA03_DBG_SWO 10 PA03 PC04 27 PC04_PTI_DATA<br>PA05_TX 1112 PA04PA05 PC03PC02 2625 Optional<br>PA06_RX 13 PA06 PC01 24<br>14 GND GND 23<br>15 16 17 18 19 20 21 22<br>VDD<br>PA07_RTS 32.768 kHz<br>Optional<br>PC09 PC08 PD05 PD04 PA09 GND GND PB04<br>VDD PA07 PA08 PD03 PD02 PD01 PD00 PC00<br>**----- End of picture text -----**<br>


**Figure 5.2.  Stand-Alone SoC Configuration** 

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BGM260P Wireless Gecko Bluetooth Module Data Sheet Pin Definitions 

## **6.  Pin Definitions** 

## **6.1  Module Pinout** 

**==> picture [187 x 201] intentionally omitted <==**

**----- Start of picture text -----**<br>
Pin 1<br>Index<br>GND 1 36 GND<br>PB04 2 35 GND<br>PB03 3 34 GND<br>PB02 4 33 RFOUT<br>PB01 5 32 GND<br>PB00 6 31 RESET<br>PA00 7 30 PC07<br>PA01 8 PB05 37 44 PC09 29 PC06<br>PA02 9 GND 38 43 PC08 28 PC05<br>PA03 10 GND 39 42 PD05 27 PC04<br>PA04 11 PA09 40 41 PD04 26 PC03<br>PA05 12 25 PC02<br>PA06 13 24 PC01<br>GND 14 15 16 17 18 19 20 21 22 23 GND<br>VDD PA07 PA08 PD03 PD02 PD01 PD00 PC00<br>**----- End of picture text -----**<br>


**Figure 6.1.  BGM260P Module Pinout** 

The next table shows the BGM260P pinout and general descriptions for each pin. Refer to 6.2 Alternate Pin Functions, 6.3 Analog Peripheral Connectivity, and 6.4 Digital Peripheral Connectivity for details on functions and peripherals supported by each GPIO pin. 

**Table 6.1.  BGM260P Module Pin Definitions** 

|**Pin Name**|**No.**|**Description**||**Pin Name**|**No.**|**Description**|
|---|---|---|---|---|---|---|
|GND|1|Ground||PB04|2|GPIO|
|PB03|3|GPIO||PB02|4|GPIO|
|PB01|5|GPIO||PB00|6|GPIO|
|PA00|7|GPIO||PA01|8|GPIO|
|PA02|9|GPIO||PA03|10|GPIO|
|PA04|11|GPIO||PA05|12|GPIO|
|PA06|13|GPIO||GND|14|Ground|
|VDD|15|Power supply||PA07|16|GPIO|
|PA08|17|GPIO||PD03|18|GPIO|
|PD02|19|GPIO||PD01|20|GPIO|
|PD00|21|GPIO||PC00|22|GPIO|
|GND|23|Ground||PC01|24|GPIO|
|PC02|25|GPIO||PC03|26|GPIO|
|PC04|27|GPIO||PC05|28|GPIO|
|PC06|29|GPIO||PC07|30|GPIO|



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BGM260P Wireless Gecko Bluetooth Module Data Sheet Pin Definitions 

|**Pin Name**|**No.**|**Description**||**Pin Name**|**No.**|**Description**|
|---|---|---|---|---|---|---|
|RESETn|31|Reset Pin. The RESETn pin is pulled up<br>to an internal DVDD supply. An external<br>pull-up is not recommended. To apply<br>an external reset source to this pin, it is<br>required to only drive this pin low during<br>reset, and let the internal pull-up ensure<br>that reset is released. The RESETn pin<br>can be left unconnected if no external<br>reset switch or source is used.||GND|32|Ground|
|RFOUT|33|No Connect||GND|34|Ground|
|GND|35|Ground||GND|36|Ground|
|PB05|37|GPIO||GND|38|Ground|
|GND|39|Ground||PA09|40|GPIO|
|PD04|41|GPIO||PD05|42|GPIO|
|PC08|43|GPIO||PC09|44|GPIO|



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BGM260P Wireless Gecko Bluetooth Module Data Sheet Pin Definitions 

## **6.2  Alternate Pin Functions** 

Some GPIOs support alternate functions like debugging, wake-up from EM4, external low frequency crystal access, etc.. The following table shows which module pins have alternate capabilities and the functions they support. Refer to the EFR32xG26 Reference Manual for more details. 

**Table 6.2.  GPIO Alternate Functions Table** 

|**GPIO**|**Alternate Functions**|**Alternate Functions**|**Alternate Functions**|
|---|---|---|---|
|PA00|IADC0.VREFP|LCD.SEG8||
|PA01|GPIO.SWCLK|LCD.SEG9||
|PA02|GPIO.SWDIO|||
|PA03|GPIO.SWV|GPIO.TDO|GPIO.TRACEDATA0|
|PA04|GPIO.TDI|GPIO.TRACECLK|LCD.SEG10|
|PA05|GPIO.TRACEDATA1|GPIO.EM4WU0|LCD.SEG11|
|PA06|GPIO.TRACEDATA2|LCD.LCD_CP||
|PA07|GPIO.TRACEDATA3|LCD.SEG12||
|PA08|LCD.SEG13|||
|PA09|LCD.SEG20|||
|PB00|VDAC0.VDAC_CH0_MAIN_OU<br>TPUT|LCD.SEG14||
|PB01|GPIO.EM4WU3|VDAC0.VDAC_CH1_MAIN_OU<br>TPUT|LCD.SEG15|
|PB02|VDAC1.VDAC_CH0_MAIN_OU<br>TPUT|LCD.SEG16||
|PB03|GPIO.EM4WU4|VDAC1.VDAC_CH1_MAIN_OU<br>TPUT|LCD.SEG17|
|PB04|LCD.SEG26|||
|PB05|LCD.SEG27|||
|PC00|GPIO.EM4WU6|LCD.SEG0||
|PC01|GPIO.EFP_TX_SDA|LCD.SEG1||
|PC02|GPIO.EFP_TX_SCL|LCD.SEG2||
|PC03|LCD.SEG3|||
|PC04|LCD.SEG4|||
|PC05|GPIO.EFP_INT|GPIO.EM4WU7|LCD.SEG5|
|PC06|LCD.SEG6|||
|PC07|GPIO.EM4WU8|LCD.SEG7||
|PC08|LCD.SEG18|||
|PC09|GPIO.THMSW_EN|GPIO.THMSW_HALFSWITCH|LCD.SEG19|
|PD00|LFXO.LFXTAL_O|||
|PD01|LFXO.LFXTAL_I|LFXO.LF_EXTCLK||
|PD02|GPIO.EM4WU9|LCD.COM0||



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BGM260P Wireless Gecko Bluetooth Module Data Sheet Pin Definitions 

|**GPIO**|**Alternate Functions**|**Alternate Functions**|**Alternate Functions**|
|---|---|---|---|
|PD03|LCD.COM1|||
|PD04|LCD.COM2|||
|PD05|GPIO.EM4WU10|LCD.COM3||



## **6.3  Analog Peripheral Connectivity** 

Many analog resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port. When a differential connection is being used positive inputs are restricted to the EVEN pins and negative inputs are restricted to the ODD pins. When a single ended connection is being used positive input is avaliable on all pins. See the EFR32xG26 Reference Manual for more details on the ABUS and analog peripherals. 

## **Table 6.3.  ABUS Routing Table** 

|**Peripheral**|**Signal**|**PA**|**PA**|**PB**|**PB**|**PC**|**PC**|**PD**|**PD**|
|---|---|---|---|---|---|---|---|---|---|
|||**EVEN**|**ODD**|**EVEN**|**ODD**|**EVEN**|**ODD**|**EVEN**|**ODD**|
|ACMP0|ANA_NEG|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
||ANA_POS|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
|ACMP1|ANA_NEG|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
||ANA_POS|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
|IADC0|ANA_NEG|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
||ANA_POS|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
|VDAC0|VDAC_CH0_ABUS_OUT-<br>PUT|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
||VDAC_CH1_ABUS_OUT|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
|VDAC1|VDAC_CH0_ABUS_OUT-<br>PUT|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
||VDAC_CH1_ABUS_OUT|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|



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BGM260P Wireless Gecko Bluetooth Module Data Sheet Pin Definitions 

## **6.4  Digital Peripheral Connectivity** 

Many digital resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port. 

**Table 6.4.  DBUS Routing Table** 

|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|---|
||**PA**|**PB**|**PC**|**PD**|
|ACMP0.DIGOUT|Available|Available|Available|Available|
|ACMP1.DIGOUT|Available|Available|Available|Available|
|CMU.CLKIN0|||Available|Available|
|CMU.CLKOUT0|||Available|Available|
|CMU.CLKOUT1|||Available|Available|
|CMU.CLKOUT2|Available|Available|||
|CMU.CLKOUTHIDDEN|Available|Available|||
|EUSART0.CS|Available|Available|||
|EUSART0.CTS|Available|Available|||
|EUSART0.RTS|Available|Available|||
|EUSART0.RX|Available|Available|||
|EUSART0.SCLK|Available|Available|||
|EUSART0.TX|Available|Available|||
|EUSART1.CS|Available|Available|Available|Available|
|EUSART1.CTS|Available|Available|Available|Available|
|EUSART1.RTS|Available|Available|Available|Available|
|EUSART1.RX|Available|Available|Available|Available|
|EUSART1.SCLK|Available|Available|Available|Available|
|EUSART1.TX|Available|Available|Available|Available|
|EUSART2.CS|Available|Available|Available|Available|
|EUSART2.CTS|Available|Available|Available|Available|
|EUSART2.RTS|Available|Available|Available|Available|
|EUSART2.RX|Available|Available|Available|Available|
|EUSART2.SCLK|Available|Available|Available|Available|
|EUSART2.TX|Available|Available|Available|Available|
|EUSART3.CS|Available|Available|Available|Available|
|EUSART3.CTS|Available|Available|Available|Available|
|EUSART3.RTS|Available|Available|Available|Available|
|EUSART3.RX|Available|Available|Available|Available|
|EUSART3.SCLK|Available|Available|Available|Available|
|EUSART3.TX|Available|Available|Available|Available|



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BGM260P Wireless Gecko Bluetooth Module Data Sheet 

Pin Definitions 

|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|---|
||**PA**|**PB**|**PC**|**PD**|
|FRC.DCLK|||Available|Available|
|FRC.DFRAME|||Available|Available|
|FRC.DOUT|||Available|Available|
|HFXO0.BUFOUT_REQ_IN_ASYNC|Available|Available|||
|I2C0.SCL|Available|Available|Available|Available|
|I2C0.SDA|Available|Available|Available|Available|
|I2C1.SCL|||Available|Available|
|I2C1.SDA|||Available|Available|
|I2C2.SCL|Available|Available|||
|I2C2.SDA|Available|Available|||
|I2C3.SCL|||Available|Available|
|I2C3.SDA|||Available|Available|
|KEYSCAN.COL_OUT_0|Available|Available|Available|Available|
|KEYSCAN.COL_OUT_1|Available|Available|Available|Available|
|KEYSCAN.COL_OUT_2|Available|Available|Available|Available|
|KEYSCAN.COL_OUT_3|Available|Available|Available|Available|
|KEYSCAN.COL_OUT_4|Available|Available|Available|Available|
|KEYSCAN.COL_OUT_5|Available|Available|Available|Available|
|KEYSCAN.COL_OUT_6|Available|Available|Available|Available|
|KEYSCAN.COL_OUT_7|Available|Available|Available|Available|
|KEYSCAN.ROW_SENSE_0|Available|Available|||
|KEYSCAN.ROW_SENSE_1|Available|Available|||
|KEYSCAN.ROW_SENSE_2|Available|Available|||
|KEYSCAN.ROW_SENSE_3|Available|Available|||
|KEYSCAN.ROW_SENSE_4|Available|Available|||
|KEYSCAN.ROW_SENSE_5|Available|Available|||
|LETIMER0.OUT0|Available|Available|||
|LETIMER0.OUT1|Available|Available|||
|MODEM.ANT0|Available|Available|Available|Available|
|MODEM.ANT1|Available|Available|Available|Available|
|MODEM.ANT_ROLL_OVER|||Available|Available|
|MODEM.ANT_RR0|||Available|Available|
|MODEM.ANT_RR1|||Available|Available|
|MODEM.ANT_RR2|||Available|Available|
|MODEM.ANT_RR3|||Available|Available|
|MODEM.ANT_RR4|||Available|Available|



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BGM260P Wireless Gecko Bluetooth Module Data Sheet Pin Definitions 

|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|---|
||**PA**|**PB**|**PC**|**PD**|
|MODEM.ANT_RR5|||Available|Available|
|MODEM.ANT_SW_EN|||Available|Available|
|MODEM.ANT_SW_US|||Available|Available|
|MODEM.ANT_TRIG|||Available|Available|
|MODEM.ANT_TRIG_STOP|||Available|Available|
|MODEM.DCLK|Available|Available|||
|MODEM.DIN|Available|Available|||
|MODEM.DOUT|Available|Available|||
|PCNT0.S0IN|Available|Available|||
|PCNT0.S1IN|Available|Available|||
|PRS.ASYNCH0|Available|Available|||
|PRS.ASYNCH1|Available|Available|||
|PRS.ASYNCH2|Available|Available|||
|PRS.ASYNCH3|Available|Available|||
|PRS.ASYNCH4|Available|Available|||
|PRS.ASYNCH5|Available|Available|||
|PRS.ASYNCH6|||Available|Available|
|PRS.ASYNCH7|||Available|Available|
|PRS.ASYNCH8|||Available|Available|
|PRS.ASYNCH9|||Available|Available|
|PRS.ASYNCH10|||Available|Available|
|PRS.ASYNCH11|||Available|Available|
|PRS.ASYNCH12|Available|Available|||
|PRS.ASYNCH13|Available|Available|||
|PRS.ASYNCH14|Available|Available|||
|PRS.ASYNCH15|Available|Available|||
|PRS.SYNCH0|Available|Available|Available|Available|
|PRS.SYNCH1|Available|Available|Available|Available|
|PRS.SYNCH2|Available|Available|Available|Available|
|PRS.SYNCH3|Available|Available|Available|Available|
|RAC.LNAEN|Available|Available|Available|Available|
|RAC.PAEN|Available|Available|Available|Available|
|TIMER0.CC0|Available|Available|Available|Available|
|TIMER0.CC1|Available|Available|Available|Available|
|TIMER0.CC2|Available|Available|Available|Available|
|TIMER0.CDTI0|Available|Available|Available|Available|



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BGM260P Wireless Gecko Bluetooth Module Data Sheet 

Pin Definitions 

|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|---|
||**PA**|**PB**|**PC**|**PD**|
|TIMER0.CDTI1|Available|Available|Available|Available|
|TIMER0.CDTI2|Available|Available|Available|Available|
|TIMER1.CC0|Available|Available|Available|Available|
|TIMER1.CC1|Available|Available|Available|Available|
|TIMER1.CC2|Available|Available|Available|Available|
|TIMER1.CDTI0|Available|Available|Available|Available|
|TIMER1.CDTI1|Available|Available|Available|Available|
|TIMER1.CDTI2|Available|Available|Available|Available|
|TIMER2.CC0|Available|Available|||
|TIMER2.CC1|Available|Available|||
|TIMER2.CC2|Available|Available|||
|TIMER2.CDTI0|Available|Available|||
|TIMER2.CDTI1|Available|Available|||
|TIMER2.CDTI2|Available|Available|||
|TIMER3.CC0|||Available|Available|
|TIMER3.CC1|||Available|Available|
|TIMER3.CC2|||Available|Available|
|TIMER3.CDTI0|||Available|Available|
|TIMER3.CDTI1|||Available|Available|
|TIMER3.CDTI2|||Available|Available|
|TIMER4.CC0|Available|Available|||
|TIMER4.CC1|Available|Available|||
|TIMER4.CC2|Available|Available|||
|TIMER4.CDTI0|Available|Available|||
|TIMER4.CDTI1|Available|Available|||
|TIMER4.CDTI2|Available|Available|||
|TIMER5.CC0|Available|Available|Available|Available|
|TIMER5.CC1|Available|Available|Available|Available|
|TIMER5.CC2|Available|Available|Available|Available|
|TIMER5.CDTI0|Available|Available|Available|Available|
|TIMER5.CDTI1|Available|Available|Available|Available|
|TIMER5.CDTI2|Available|Available|Available|Available|
|TIMER6.CC0|Available|Available|Available|Available|
|TIMER6.CC1|Available|Available|Available|Available|
|TIMER6.CC2|Available|Available|Available|Available|
|TIMER6.CDTI0|Available|Available|Available|Available|



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BGM260P Wireless Gecko Bluetooth Module Data Sheet 

Pin Definitions 

|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|---|
||**PA**|**PB**|**PC**|**PD**|
|TIMER6.CDTI1|Available|Available|Available|Available|
|TIMER6.CDTI2|Available|Available|Available|Available|
|TIMER7.CC0|Available|Available|Available|Available|
|TIMER7.CC1|Available|Available|Available|Available|
|TIMER7.CC2|Available|Available|Available|Available|
|TIMER7.CDTI0|Available|Available|Available|Available|
|TIMER7.CDTI1|Available|Available|Available|Available|
|TIMER7.CDTI2|Available|Available|Available|Available|
|TIMER8.CC0|Available|Available|Available|Available|
|TIMER8.CC1|Available|Available|Available|Available|
|TIMER8.CC2|Available|Available|Available|Available|
|TIMER8.CDTI0|Available|Available|Available|Available|
|TIMER8.CDTI1|Available|Available|Available|Available|
|TIMER8.CDTI2|Available|Available|Available|Available|
|TIMER9.CC0|Available|Available|Available|Available|
|TIMER9.CC1|Available|Available|Available|Available|
|TIMER9.CC2|Available|Available|Available|Available|
|TIMER9.CDTI0|Available|Available|Available|Available|
|TIMER9.CDTI1|Available|Available|Available|Available|
|TIMER9.CDTI2|Available|Available|Available|Available|
|USART0.CLK|Available|Available|Available|Available|
|USART0.CS|Available|Available|Available|Available|
|USART0.CTS|Available|Available|Available|Available|
|USART0.RTS|Available|Available|Available|Available|
|USART0.RX|Available|Available|Available|Available|
|USART0.TX|Available|Available|Available|Available|
|USART1.CLK|Available|Available|Available|Available|
|USART1.CS|Available|Available|Available|Available|
|USART1.CTS|Available|Available|Available|Available|
|USART1.RTS|Available|Available|Available|Available|
|USART1.RX|Available|Available|Available|Available|
|USART1.TX|Available|Available|Available|Available|
|USART2.CLK|Available|Available|Available|Available|
|USART2.CS|Available|Available|Available|Available|
|USART2.CTS|Available|Available|Available|Available|
|USART2.RTS|Available|Available|Available|Available|



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BGM260P Wireless Gecko Bluetooth Module Data Sheet Pin Definitions 

|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|---|
||**PA**|**PB**|**PC**|**PD**|
|USART2.RX|Available|Available|Available|Available|
|USART2.TX|Available|Available|Available|Available|



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BGM260P Wireless Gecko Bluetooth Module Data Sheet 

Design Guidelines 

## **7.  Design Guidelines** 

## **7.1  Layout and Placement** 

For optimal performance of the BGM260P, 

- Place the module aligned with the center of an edge of the application PCB, as illustrated in the figures below. 

- Leave the antenna clearance area void of any traces, components, or copper on all layers of the application PCB. 

- Connect all ground pads directly to a solid ground plane. 

- Place the ground vias as close to the ground pads as possible. 

- Avoid plastic or any other dielectric material in contact with the antenna. 

- The outer row footprint is backward compatible with BGM240P module footprint, and the inner row pins are optional. 

**==> picture [178 x 206] intentionally omitted <==**

**----- Start of picture text -----**<br>
Align module edge with PCB edge<br>{ {| | | |<br>GND GND<br>Antenna clearance GND<br>No metal in this area GND<br>Place vias close to<br>each of the module’s<br>GND<br>GND pads<br>Wireless module<br>—_ (Top View)<br>GND<br>GND<br>B2is<br>= =<br>GND GND<br>==<br>NS<br>Place vias along all PCB edges<br>**----- End of picture text -----**<br>


**Figure 7.1.  Recommended Layout for BGM260P Using Built-in Antenna** 

The figure below illustrates layout scenarios that will lead to severely degraded RF performance for the module with integrated antenna. 

**==> picture [203 x 151] intentionally omitted <==**

**----- Start of picture text -----**<br>
Copper<br>Clearance<br>Area<br>Host PCB GND plane width X<br>**----- End of picture text -----**<br>


**Figure 7.2.  Non-Optimal Layout Examples** 

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BGM260P Wireless Gecko Bluetooth Module Data Sheet Design Guidelines 

The width of the GND plane to the sides of the module will impact the efficiency of the built-in antenna. To achieve optimal performance, a total GND plane width of 50 - 60 mm is recommended. Narrower or wider ground planes can be used but will result in compromised RF performance. See 4.18 Antenna Radiation and Efficiency for reference. 

## **7.2  Proximity to Other Materials** 

Avoid placing plastic or any other dielectric material in close proximity to the antenna, as this is likely to cause RF performance degradation. Solder mask, conformal coating, and/or other thin dielectric layers are acceptable directly on top of the antenna region, however these might also negatively impact antenna efficiency and reduce range. 

Any metallic object in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended distance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCB ground planes. 

## **7.3  Proximity to Human Body** 

Placing the module in contact with, or very close to the human body will negatively impact antenna efficiency and reduce range. Furthermore, additional certification work may be required if the module is integrated in a wearable device: please refer to chapter 11.7 RF Exposure and Proximity to Human Body. 

## **7.4  Reset** 

The Reset Management Unit (RMU) is responsible for handling reset of the BGM260P. A wide range of reset sources are available, including several power supply monitors, pin reset, software controlled reset, core lockup reset, and watchdog reset. 

The reset state does not provide power saving functionality and it is not recommended as a means to conserve power. 

## **7.5  Debug** 

See AN958: Debugging and Programming Interfaces for Custom Designs. 

The BGM260P supports hardware debugging via 4-pin JTAG or 2-pin serial-wire debug (SWD) interfaces. It is recommended to expose the debug pins in your own hardware design for firmware update and debug purposes. The table below lists the required pins for JTAG and SWD debug interfacing, which are also presented in Section 6.2 Alternate Pin Functions. 

If JTAG interfacing is enabled, the module must be power cycled to return to a SWD debug configuration if necessary. 

**Table 7.1.  Debug Pins** 

|**Pin Name**|**JTAG Signal**|**SWD Signal**|**Comments**|
|---|---|---|---|
|PA04|TDI|N/A|This pin is disabled after reset. Once enabled the pin has a built-in<br>pull-up.|
|PA03|TDO|N/A|This pin is disabled after reset.|
|PA02|TMS|SWDIO|Pin is enabled after reset and has a built-in pull-up.|
|PA01|TCK|SWCLK|Pin is enabled after reset and has a built-in pull-down.|



## **7.6  Packet Trace Interface (PTI)** 

The BGM260P integrates a true PHY-level packet trace interface (PTI) peripheral that can capture packets non-intrusively to monitor and log device and network traffic without burdening processing resources in the module's SoC. The PTI generates two output signals that can serve as a powerful debugging tool, especially in conjunction with other hardware and software development tools available from Silicon Labs. The PTI_DATA and PTI_FRAME signals can be accessed through any GPIO on ports C and D (see FRC.DOUT and FRC.DFRAME peripheral resources in 6. Pin Definitions). 

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BGM260P Wireless Gecko Bluetooth Module Data Sheet Package Specifications 

## **8.  Package Specifications** 

## **8.1  Package Outline** 

**==> picture [73 x 40] intentionally omitted <==**

**Figure 8.1.  Package Outline** 

## **Note:** 

1. All dimensions are in mm. 

2. All dimensions are measured after singulation. 

3. Solder paste thickness is expected to contribute to the overall package height but must be within the specified tolerance. 

4. No burrs or sharp edges are allowed. 

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BGM260P Wireless Gecko Bluetooth Module Data Sheet Package Specifications 

## **8.2  PCB Land Pattern** 

**==> picture [155 x 181] intentionally omitted <==**

**Figure 8.2.  Recommended Land Pattern for Modules with a Built-in Antenna** 

## **Note:** 

1. All dimensions are in mm. 

2. Refer to the technical documentation of the specific solder paste for profile configuration. 

3. Avoid using more than two reflow cycles. 

4. A no-clean, type-3 solder paste is recommended. 

5. A stainless steel, laser-cut, and electro-polished stencil with trapezoidal walls should be used to ensure good solder paste release. 

6. The recommended stencil thickness is 0.100 mm (4 mils). 

7. For further recommendations, refer to the JEDEC J-STD-020, IPC-SM-782, and IPC-7351 guidelines. 

8. The outer row footprint is backward compatible with BGM240P module footprint, and the inner row pins are optional. 

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BGM260P Wireless Gecko Bluetooth Module Data Sheet Package Specifications 

## **8.3  Package Marking** 

The figure below shows the module markings engraved on the RF shield. 

**Figure 8.3.  BGM260P Top Marking** 

## **Mark Description** 

The package marking consists of: 

- BGM260Pxxxxxxx - Orderable Part Number designation 

- Model: BGM260Pxxx - Model Number designation 

- QR Code: YYWWMMABCDE 

   - YY – Last two digits of the assembly year 

   - WW – Two-digit workweek when the device was assembled 

   - MMABCDE – Silicon Labs unit code 

- YYWWTTTTTT 

   - YY – Last two digits of the assembly year 

   - WW – Two-digit workweek when the device was assembled 

   - TTTTTT – Manufacturing trace code. The first letter is the device revision 

- All certification-related information (such as the CE compliance mark, or the FCC and IC IDs, etc.) is being engraved on the hatched-out area, in accordance with the requirements by regional regulatory bodies. 

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BGM260P Wireless Gecko Bluetooth Module Data Sheet Soldering Recommendations 

## **9.  Soldering Recommendations** 

It is recommended that final PCB assembly of the BGM260P follows the industry standard as identified by the Institute for Printed Circuits (IPC). This product is assembled in compliance with the J-STD-001 requirements and the guidelines of IPC-AJ-820. Surface mounting of this product by the end user is recommended to follow IPC-A-610 to meet or exceed class 2 requirements. 

## **CLASS 1 General Electronic Products** 

Includes products suitable for applications where the major requirement is function of the completed assembly. 

## **CLASS 2 Dedicated Service Electronic Products** 

Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically the end-use environment would not cause failures. 

## **CLASS 3 High Performance/Harsh Environment Electronic Products** 

Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems. 

**Note:** General SMT application notes are provided in the AN1223: LGA Manufacturing Guidance. 

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BGM260P Wireless Gecko Bluetooth Module Data Sheet Tape and Reel 

## **10.  Tape and Reel** 

BGM260P modules are delivered to the customer in cut tape (100 pcs) or reel (1000 pcs) packaging having the dimensions below. All dimensions are given in mm unless otherwise indicated. 

**Figure 10.1.  Carrier Tape Dimensions** 

**Figure 10.2.  Reel Dimensions** 

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BGM260P Wireless Gecko Bluetooth Module Data Sheet Certifications 

## **11.  Certifications** 

This section details the certification status of the modules with regards to regional regulatory radio approvals. Where applicable, the status with the qualifications against the specifications of the supported global industrial wireless standards is given too. 

The address of the module manufacturer (technology owner) and certification applicant/holder is: 

SILICON LABS / SILICON LABORATORIES FINLAND OY Alberga Business Park, Bertel Jungin aukio 3, 02600 Espoo, Finland 

The BGM260P modules have brand name of "SILICON LABS". For certifications and qualifications purposes, the modules are referred to by their formal Model Name(s) of BGM260P22A and BGM260P32A. 

"SILICON LABS" (and "Silicon Labs") is a trademark globally owned by the Silicon Laboratories Inc. corporation, and all branches and subsidiaries, including the above applicant, holds the right to use it. 

For any clarification on regulatory certifications, or if you need to discuss topics such as Permissive Changes or Change in ID requests, please contact your Sales Representative or our Technical Support. You can get started by visiting Contact Us. 

## **11.1  CE and UKCA - EU and UK** 

The BGM260P modules have been tested against the relevant harmonized/designated standards and are in conformity with the essential requirements and other relevant requirements of the EU's Radio Equipment Directive (RED) (2014/53/EU) and of the UK's Radio Equipment Regulations (RER) (S.I. 2017/1206). 

## **Table 11.1.  Operating Frequencies and Maximum Transmitted Power per the EN 300 328 RF test report** 

|**Model name**|**Operating Frequencies**|**Maximum EIRP BLE**|
|---|---|---|
|BGM260P22A|2402 - 2480 MHz (BLE)<br>2405 - 2480 MHz (15.4)|12.94 dBm|
|BGM260P32A||19.75 dBm|



Please notice that every end-product integrating a BGM260P module will need to perform the radio EMC tests on the whole assembly, according to the ETSI 301 489-x relevant standards. 

Furthermore, it is ultimately the responsibility of the manufacturers to ensure the compliance of their end-products as a whole. The specific product assembly is likely to have an impact to RF radiated characteristics, when compared to the bare module. Hence, manufacturers should carefully consider RF radiated testing with the final product assembly, and the possible deviations in the PSD, EIRP and spurious emissions measurements, as defined in the ETSI EN 300 328 standard. 

The modules are entitled to carry the CE and UKCA compliance marks, and the respective formal Declarations of Conformity (DoC) are available at the product web page which is reachable starting from https://www.silabs.com/. 

Each OEM must also consider applying the compliance marks to a visible location on their end-products. In general, module customers assume full responsibility with regards to learning the guidelines and meeting the requirements for the compliance in each member country where their end-products are marketed. 

## **11.2  FCC - USA** 

This device complies with FCC's e-CFR Title 47, Part 15, Subpart C, Section 15.247 (and related relevant parts of the ANSI C63.10 standard) when operating with the built-in integral antenna. 

Operation is subject to the following two conditions: 

1. This device may not cause harmful interference, and 

2. This device must accept any interference received, including interference that may cause undesirable operation. 

Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment. 

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## **FCC RF Radiation Exposure Statement** 

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. 

This transmitter meets the Mobile requirements at a distance of 20 cm and above from the human body, in accordance with the evaluation exposed in the RF Exposure test report(s). This transmitter also meets the Portable requirements at distances equal or above 11.6 mm for the BGM260P22A and 35.1 mm for the BGM260P32A in the case of Bluetooth Low Energy. These distances are reported for convenience also in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 72. 

This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. 

## **OEM Responsibilities to comply with FCC Regulations** 

This module has been tested for compliance to FCC Part 15. 

OEM integrators are responsible for testing their end-product for any additional compliance requirements needed with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). 

Additionally, investigative measurements and spot-check testing (with all transmitters active, if other co-located radios than the module itself exist on the host), are strongly recommended in order to verify that the full system's compliance is maintained when the module is integrated, even with the module having a full modular approval, in accordance with the "Host Product Testing Guidance" in FCC's KDB 996369 D04 Module Integration Guide. 

## • **General Considerations** 

This transmitter module is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B (unintentional radiator) rule requirement, which is typically applicable to the final host. The final host will still need to be assessed for compliance to this portion of the rule requirements, if applicable. 

- **Manual Information to the End User** 

The OEM integrator has to be aware not to provide information to the end-user regarding how to install or remove this RF module, or how to change RF related parameters, in the user’s manual of the final product which integrates this module. 

The end-user manual shall include all required regulatory information/warnings as shown in this manual. 

## • **Host Manufacturer Responsibilities** 

A host manufacturer is ultimately responsible for the full compliance of their host system. The final product is supposed to be assessed against all the essential requirements of the FCC rules, such as FCC Part 15 Subpart B, before it can be placed on the US market. This includes re-assuring the compliance of the radio transmitter with the RF and EMF essential requirements of the FCC rules. The modular radio transmitter must not be incorporated into any other radio-equipped device or system without retesting for compliance as multi-radio and combined equipment. 

For more details about integrating the Single Modular Transmitter, refer to the following FCC document: 

- KDB 996369 D04 Module Integration Guide 

For understanding better the process leading to obtaining a Full Modular Approval, see the following documents instead: 

- KDB 996369 D01 Transmitter Module Equipment Authorization Guide 

- KDB 996369 D02 Frequently Asked Questions and Answers about Modules 

The two documents above give an insight of the FCC requirements from the module manufacturer’s perspective, and will help to realize the need by the integrators to follow the integration instructions and design guidance, and to take into account for example the RF Exposure limitations, if any. Should a deviation occur, keep in mind the possible need to work with the manufacturer in order to proceed with a permissive change (following a _Change in ID_ ), in accordance with the FCC guidelines found in the following documents: 

- KDB 178919 D01 Permissive Change Policy 

- KDB 178919 D02 Permissive Change Frequently-Asked Questions 

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## **Separation** 

- To meet the SAR exemption for portable conditions, the minimum separation distance indicated in must be maintained between the human body and the radiator (antenna) at all times. In particular, in the use case of Bluetooth Low Energy the minimum distance must be 11.6 mm for the BGM260P22A and 35.1 mm for the BGM260P32A. 

- This transmitter module is tested in a standalone RF Exposure condition, and in case of any co-located radio transmitter being allowed to transmit simultaneously, or in case of portable use at closer distances from the human body than those allowing the exceptions rules to be applied, a separate additional SAR evaluation, or a reduction in the max output power or in the duty-cycle, might be required for the host, ultimately leading to a Class II Permissive Change, or more rarely to a new grant. 

- **Important Note:** In the event that the conditions for the exemption cannot be met, the final product will likely have to undergo additional testing to evaluate the RF Exposure, or go through some re-configuration of the max output power and/or duty-cycle in order for the FCC authorization to remain valid, and a permissive change will have to be applied. The SAR evaluation (and/or reconfiguration) is in the responsibility of the end-product’s manufacturer, as well as the permissive change that can be carried out with the help of the customer's own Telecommunication Certification Body, following a Change in ID authorization by the module's original grant holder. 

## **End Product Labeling** 

BGM260P modules are labeled with their own FCC ID. In all those cases when the FCC ID is not visible after the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final product must be labeled in a visible area with the following: 

## **"Contains Transmitter Module FCC ID: QOQ-GM260P"** 

or 

## **"Contains FCC ID: QOQ-GM260P"** 

**Final note** : As long as all the conditions in this and all the above chapters are met, further RF testing of the transmitter will not be strictly required. However, still consider the good practice and the FCC strong recommendation to ensure the compliance of the host by spot-checking. Nevertheless, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements which might be mandatory with this module installed. 

## **Class B Device Notice** 

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: 

- Reorient or relocate the receiving antenna 

- Increase the separation between the equipment and receiver 

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected 

- Consult the dealer or an experienced radio/TV technician for help 

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## **11.3  ISED - Canada** 

This radio transmitter (with IC: 5123A-GM260P) has been approved by _Innovation, Science and Economic Development Canada (ISED Canada, formerly Industry Canada_ ) to operate with the built-in integral antenna. 

- This radio-equipped device complies with ISED's license-exempt RSS standards. Operation is subject to the following two conditions: 1. This device may not cause interference; and 

2. This device must accept any interference, including interference that may cause undesired operation of the device 

## **RF Exposure Statement** 

Exception from routine SAR evaluation limits are given in RSS-102 Issue 6. 

The module meets the requirements for Mobile use cases when the minimum separation distance from the human body is 20 cm or greater, in accordance with the evaluation exposed in the RF Exposure test report(s). 

For Portable use cases, RF exposure or SAR evaluation is not required when the separation distances from the human body are equal or above 16.9 mm for the BGM260P22A and 41.9 mm for the BGM260P32A in the case of Bluetooth Low Energy. 

If the separation distance from the human body is less than the values stated above, which are also reported in for convenience, then the OEM integrator is responsible for evaluating the SAR with the end-product, or for the re-configuration of the radio module in the host in terms of lowering the max RF TX power and/or the duty-cycle. A permissive change would be required too, under the responsibility of the host manufacturer, following a Multiple Listing authorization by the original module's certificate holder. 

## **OEM Responsibilities to comply with IC Regulations** 

The BGM260P modules have been certified for integration into products only by OEM integrators, under the following conditions: 

- The module must be installed in such a way that the intended minimum separation distances are maintained between the radiator (antenna) and all persons at all times. Table 11.2 indicates these distances in accordance to the use cases. 

- The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. 

**Important Note:** In the event that the above conditions cannot be met, the final product will have to undergo additional testing to evaluate the RF Exposure, or go through some re-configuration of the max output power and/or duty-cycle in order for the ISED authorization to remain valid - a permissive change will have to be applied too **.** The RF Exposure evaluation (SAR, or possibly a re-configuration) is in the responsibility of the end-product's manufacturer, as well as the permissive change that can be carried out with the help of the customer's own Certification Body, following a Multiple Listing authorization by the module's original grant holder. 

## **End Product Labeling** 

The BGM260P modules are labeled with their own IC ID. In all those cases when the module's own label is not visible after a module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final product must be labeled in a visible area with the following: 

## “ **Contains Transmitter Module IC: 5123A-GM260P** ” 

## or 

## “ **Contains IC: 5123A-GM260P”** 

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end-product. 

As long as all the conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for the fulfillment of any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). 

## **CAN ICES-003 (B)** 

This Class B digital apparatus complies with Canadian ICES-003. 

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## **ISED (Français)** 

Le présent émetteur radio (IC: 5123A-GM260P) a été approuvé par Innovation, Sciences et Développement Économique Canada (ISED Canada, anciennement Industrie Canada) pour fonctionner avec l'antenne intégrée. 

L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes: 

1. L’appareil ne doit pas produire de brouillage; 

2. L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptibled’en compromettre le fonctionnement. 

## **Déclaration d'exposition RF** 

L'exception tirée des limites courantes d'évaluation SAR est donnée dans le document RSS-102 Issue 6. 

Le module répond aux exigences pour les cas d'utilisation Mobile lorsque la distance minimale de séparation du corps humain est de 20 cm ou plus, conformément à la (aux) limite(s) exposée(s) dans l'analyse de l'exposition RF. 

Pour les cas d'utilisation Portables, l'exposition aux fréquences radio ou l'évaluation du SAR n'est pas nécessaire lorsque les distances de séparation du corps humain sont égales ou supérieures à 16.9 mm pour le BGM260P22A et à 41.9 mm pour le BGM260P32A dans le cas de Bluetooth Low Energy. 

Si la distance de séparation du corps humain est inférieure aux valeurs indiquées ci-dessus, également indiquées dans le tableau 11.2 pour des raisons de commodité, l'intégrateur OEM est responsable de l'évaluation du SAR avec le produit final, ou de la reconfiguration du module radio dans l'hôte en termes de réduction de la puissance RF TX maximale et/ou du rapport cyclique. Une modification permissive serait également nécessaire, sous la responsabilité du fabricant de l'hôte, suite à une autorisation de cotation multiple par le titulaire du certificat du module d'origine. 

## **Responsabilités du fabricant de se conformer à la réglementation IC** 

Le module a été certifié pour l'intégration dans les produits uniquement par les intégrateurs OEM dans les conditions suivantes: 

- L'antenne doit être installée de manière à maintenir une distance de séparation minimale, comme indiqué ci-dessus, entre le radiateur (antenne) et toutes les personnes. 

- Le module émetteur ne doit pas être localisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur. 

**Remarque Importante:** au cas où ces conditions ne pourraient pas être remplies, le produit final devra être soumis à des tests supplémentaires pour évaluer l'exposition RF, ou passer par une reconfiguration de la puissance de sortie maximale et/ou du rapport cyclique, afin que l'autorisation ISED reste valable; une modification permissive devra également être appliqué. L'évaluation de l'exposition aux radiofréquences (SAR, ou éventuellement une reconfiguration) est sous la responsabilité du fabricant du produit final, ainsi que le changement permissif qui peut être effectué avec l'aide de l'organisme de certification des télécommunications du client, après autorisation de cotation multiple par le titulaire de la certification du module. 

## **Étiquetage des produits finis** 

Les modules BGM260P est étiqueté avec son propre ID de certification.Si l'ID de certification n'est pas visible lorsque le module est installé dans un autre appareil, l'extérieur de l'appareil dans lequel le module est installé doit également afficher une étiquette faisant référence au module inclus. Dans ce cas, le produit final doit être étiqueté dans une zone visible avec les éléments suivants: 

## “ **Contient le module transmetteur IC: 5123A-GM260P** ” 

## ou 

## “ **Contient IC: 5123A-GM260P”** 

L’intégrateur OEM doit être conscient de ne pas fournir à l’utilisateur final d’informations sur la procédure d’installation ou de retrait de ce module RF ni sur la modification des paramètres liés à la RF dans le manuel d’utilisation du produit final. 

Tant que toutes les conditions ci-dessus sont remplies, aucun test supplémentaire de l'émetteur ne sera nécessaire. Toutefois, l’intégrateur OEM reste responsable de l’essai de son produit final pour déterminer les exigences de conformité supplémentaires requises avec ce module installé (par exemple, émissions d’appareils numériques, exigences relatives aux périphériques PC, etc.) 

## **CAN ICES-003 (B)** 

Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003. 

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## **11.4  MIC - Japan** 

The BGM260P modules are certified in Japan with following certification numbers: 

- Low-power (+10 dBm) parts with model name BGM260P22A: 020-240374 

- High-power (+19.5 dBm) parts with model name BGM260P32A: 020-240376 

While the module manufacturer takes all reasonable steps to prevent non-compliant operation, it is still the end-product manufacturer's responsibility to ensure that a module is configured to meet the compliance requirements, for example in relation to the maximum allowed RF TX power. When applicable, refer to the SDK documentation and/or API reference manuals and/or integration and certification guides, to learn how to configure (limit) the maximum RF TX power for ensuring the compliance of the end-product during regular operation, if need be. Refer as well to the power setting table(s) and measurements in the test report(s) in order to realize the maximum output power levels allowed for the regulatory compliance in Japan, especially with the high-power variant(s). 

Manufacturers integrating a radio module into their host equipment are supposed to make the certification mark and the certification number visible on the outside of the host equipment. This combination of mark and number, and their relative placement, is depicted in Figure 11.1, and depending on the overall size it might also appear among the top shield markings of the radio module. The compliance mark and certification number must be placed close to the text in the Japanese language which is provided below. This requirement in the Radio Law has been made in order to enable users of the combination of host and radio module to verify if they are actually using a radio device which is approved for use in Japan. 

Certification Text to be Placed on the Outside Surface of the Host Equipment: 

Translation of the text: 

“This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law.” 

The "Giteki" Mark shown in the following figures must be affixed to an easily noticeable section of the specified radio-enabled host equipment. Note that such section may be required to contain additional information if the end-device embedding the module is also subject to a Telecom approval. 

The manufacturer of the final product is also responsible to provide a Japanese language version of the User Manual and/or Installation Instructions as a companion document coming with the final product when placed on the market in Japan. Such a document will have to mention the integrated radio component and the related certification information. 

**Figure 11.1.  Example of GITEKI Mark with placeholder for actual Certification Number** 

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**Figure 11.2.  Detail of the GITEKI Compliance Mark** 

## **11.5  KC - South Korea** 

The low-power variant of the BGM260P modules, with model name BGM260P22A, has a RF registration for import and use in South Korea. 

Registration number is R-R-BGT-GM260P. 

These modules are meant to be integrated into end-products, which then become exempted from doing the RF emission testing, as long as the recommended design guidance is followed, and as long as, where applicable, any additional transmit power back-off is implemented in accordance with the measurements and configurations seen in the formal test report(s). 

EMC testing and any other relevant test applicable to the end-product as a whole, plus appropriate labeling of the end-product, might still be required for the full regulatory compliance in the country. 

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## **11.6  NCC - Taiwan** 

The BGM260P modules are certified in Taiwan with NCC certification number as follows: BGM260P #3 ORS Bsess, NCC sesestibe0 F : 

BGM260P22A: CCAI25Y1005AT0 

BGM260P32A: CCAI25Y1006AT0 

Manufacturers are required to mark their end-products with the following sentence: _"This product contains a radio frequency module with certification number CCAI25Y100x0Tx"_ , where CCAI25Y100x0Tx corresponds to the above-listed certification number of the embedded module. 

Note: The outer packaging of the final product must also be marked with the NCC conformity mark by the manufacturer 

Additionally, the final product will have to be listed in the NCC database of approved radio-equipped devices. Consequently, the end manufacturer is also supposed to contact a certification body or the certification house that originally released the modular approval and apply for the registration of their platform under the applicable certification number above. Fees might apply, and an authorization by the module manufacturer might be required too. 

NCC Statement 

- For low-power radio frequency equipment that has been certified, companies, firms, or users are not allowed to change the frequency, increase the power, or change the characteristics and functions of the original design without further NCC approval. 

- The use of low-power radio frequency equipment shall not affect flight safety and interfere with legal communications. 

- If interference is found, it shall be immediately stopped, and the equipment can be brought back into use only after it has been improved, so that interference is found no more. 

- The aforementioned legal communication refers to radio communications operating in accordance with the provisions of the Telecommunications Management Act. 

- Low-power radio frequency equipment must withstand interference from legitimate communications or radiating electrical equipment for industrial, scientific, and medical applications. 

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NCC 

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## **11.7  RF Exposure and Proximity to Human Body** 

When using the BGM260P modules in an application where the radio-equipped end-product is located close to the human body, the human RF Exposure must be taken into account. FCC, ISED, and CE/UKCA all have different standards and rules for evaluating the RF Exposure. In particular, each regulator has different requirements when it comes to the exemption from having to perform RF Exposure and SAR (Specific Absorption Rate) measurements, and the minimum separation distances between the module's antenna and the human body varies accordingly. The properties of the BGM260P modules allow for the minimum separation distances detailed below in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 72 for the SAR measurement exemption in Portable use cases (less than 20 cm from human body). These modules are approved for the Mobile use case (more than 20 cm) without any need for RF Exposure evaluation. 

**Table 11.2.  Minimum Separation Distances for SAR Evaluation Exemption** 

|**Certification**|**BGM260P22A**|**BGM260P32A**|
|---|---|---|
|FCC|Bluetooth: 11.6 mm|Bluetooth: 35.1 mm|
|ISED|Bluetooth: 16.9 mm|Bluetooth: 41.9 mm|
|CE|In general, the RF exposure should always be evaluated with the end-product when transmitting with EIRP<br>power levels higher than 20 mW (13 dBm) while operating at distances closer than 20 cm from the human<br>body.||



The exemption distances above, calculated for reference in the full output power use case, are based on the rules in force at the time of writing this data sheet. Even though changes happen rarely, always ensure to apply the rules in force at the time of placing the endproduct into the market. 

In the cases of FCC and ISED, it is allowed to use a module at its max RF TX power in an end-product where the typical separation distance from the human body is smaller than mentioned above, but it requires evaluating the RF Exposure in the final assembly and applying for a Class 2 Permissive Change to the FCC and ISED approvals of the module. In order to proceed with any permissive change, first the module manufacturer should be asked for an authorization to do an FCC's Change in ID and/or an ISED's Multiple Listing; then, the new Portable condition will be added to the new parallel FCC grant and/or ISED certificate owned by the end-product manufacturer, for extending the approvals to their unique host under their unique configuration and mode of use. 

For those end-products where the embedded module supporting multiple wireless protocols is configured to implement only a single one of them, which would allow for the exemption at a shorter distance than the overall minimum distance, there would be no need to the evaluate the RF Exposure at such a shorter distance and above. However, a permissive change would still be needed as a mean to notify the FCC / ISED of the reason why in the field the module is allowed to operate at a shorter distance than in the table above. 

An example of another use case where the module could operate at a shorter distance than in the table above, without having to do the RF Exposure evaluation / SAR measurement, is when the power or the duty-cycle is reduced during normal operation. However, the new minimum distance for the exemption should be re-calculated, and still a permissive change would be needed to notify the regulators of the new conditions. 

For the CE/UKCA compliance, RF Exposure must be considered and evaluated by the OEM in all cases when the end-product is transmitting at higher power level than indicated in the table above. 

**Note:** Placing the module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thus a reduced range is to be expected. 

## **11.8  Bluetooth Qualification** 

The BGM260P modules are included in a pre-qualified Bluetooth Low Energy RF-PHY design based on Core Specification 5.4 having DN of **Q306497** . 

The RF-PHY design should be imported and combined with the latest Wireless Gecko Link Layer and Host qualified design(s) by Silicon Labs when qualifying a Product (Core-Complete Configuration Design) that embeds the BGM260P, using the Bluetooth SIG's Qualification Workspace tool. 

Please find out more about Bluetooth Qualification on docs.silabs.com. 

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## **12.  Revision History** 

## **Revision 1.1** 

April, 2025 

- Added certification number in section 11.6 NCC - Taiwan. 

- Added registration number in section 11.5 KC - South Korea. 

- Removed "certification pending" statement from Note in section 1. Features. 

## **Revision 1.0** 

February, 2025 

- Updated remaining TBDs in Electrical Characteristics tables 

- Updated 11.8 Bluetooth Qualification chapter 

- Updated Figure 10.1 Carrier Tape Dimensions on page 62 

- Updated 11.7 RF Exposure and Proximity to Human Body 

## **Revision 0.5** 

December, 2024 

- Initial draft 

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## **Disclaimer** 

Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and “Typical” parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A “Life Support System” is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications. 

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**www.silabs.com**
Updated at April 28, 2026
Silicon Labs is a recognized industry leader in secure, intelligent wireless technology and precision timing solutions. Renowned for driving innovation in the Internet of Things (IoT) and industrial automation, the company develops electronic components that deliver the performance, energy savings, and design simplicity required to build a seamlessly connected world. Our extensive portfolio of Silicon Labs components prominently features their robust wireless connectivity and timing products. This includes a comprehensive selection of Bluetooth modules and adaptors engineered for reliable, low-power communication in smart devices. Complementing these wireless offerings is a broad array of precision timing devices, particularly standard and advanced MEMS oscillators, which are critical for ensuring exact synchronization and stable frequency control in demanding circuit designs. To support a wider spectrum of networking and communication requirements, the lineup also encompasses versatile WLAN modules and USB adaptors. Additionally, engineers will find highly integrated sub-2.4GHz ISM band RF transceivers, available as both standalone integrated circuits and complete RF modules, providing exceptional range and signal resilience for complex wireless deployments.
About Novapart

Novapart is a B2B electronic component broker specialising in stock shortages and cost reduction. We source hard-to-find parts and identify compliant alternatives across a catalogue of 420,000+ components from 500+ manufacturers.
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Stock Shortage Specialist

When a component is unavailable, discontinued or has an unacceptable lead time, we tap into our network of vetted European and Asian distributors to source what you need — without compromising on quality or traceability.
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Compliant Alternatives

We identify pin-to-pin, electrically equivalent substitutes that meet the same certifications (RoHS, AEC-Q100, REACH) as your original specification — validated against datasheets, not just part numbers. Often at a lower cost.
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