BGM240SB22VNA2R

Bluetooth Module, BLE 5.3, 2 Mbps, -94.3 dBm, 1.8 V to 3.8 V Supply, -40 °C to 105 °C

⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
Manufacturer: SILICON LABS
Product type: Bluetooth Modules & Adaptors
SVHC: To Be Advised
Product Range: BGM240S Series
Bluetooth Class: -
Bluetooth Version: Bluetooth LE 5.3
Supply Voltage Range: 1.8 V to 3.8 V
Receiver Sensitivity Rx: -94.3 dBm
Operating Temperature Range: -40 °C to 105 °C
Delivery and price
Units per pack	2500
Price	3.89 €
Current stock	10+
Lead time	30 days
Datasheet
## **BGM240S Bluetooth[™] SiP Module Data Sheet** 

The BGM240S is a secure, high-performance wireless module optimized for the needs of battery and line-powered IoT devices running on Bluetooth networks. 

Based on the Series 2 EFR32BG24 SoC, it enables Bluetooth[®] Low Energy connectivity, delivering exceptional RF performance and energy efficiency, industry-leading Secure Vault[®] technology, and future-proofing capabilities. 

The BGM240S is a complete System in Package solution offered with robust and fullyupgradeable software stacks, global regulatory certifications, advanced development and debugging tools, and documentation that simplifies and minimizes the development cycle of your end-product, helping to accelerate its time-to-market. 

The BGM240S is targeted for a broad range of applications, including: 

- Smart Home Devices 

## **KEY FEATURES** 

   - Bluetooth Low Energy 5.3 and Bluetooth Mesh connectivity 

   - Built-in antenna or RF pin 

   - Up to 10 dBm TX output power 

   - -97 dBm BLE 1M RX sensitivity 

   - 32-bit ARM® Cortex®-M33 core running up to 78 MHz 

   - 1536/256 kB of Flash/RAM memory 

   - Vault High or Vault Mid security 

   - Rich set of analog and digital peripherals 

   - 32 GPIO pins 

   - -40 to 105 °C 

- Lighting 

   - 7mm x 7mm x 1.18mm 

- Gateways and Digital Assistants 

- Building Automation and Security 

**==> picture [522 x 263] intentionally omitted <==**

**----- Start of picture text -----**<br>
Core / Memory Crystal Clock Management Power Management Supply Security<br>ARM Cortex [TM]  M33 processor 39 MHz HF Crystal Oscillator OscillatorHF RC  DC-DC Converter DC-DC LC AccelerationCrypto  Secure Engine<br>Flash Program<br>with DSP extensions,FPU and TrustZone Memory Fast Startup Precision LF  Voltage Regulator Decoupling TRNG Secure Debug<br>RC Oscillator RC Oscillator Authentication<br>Power-On Reset<br>ETM InterfaceDebug  MemoryRAM  ControllerLDMA  LF Crystal Oscillator Ultra LF RC Oscillator Brown-Out Detector DPA Countermeasures<br>32-bit Bus<br>Peripheral Reflex System<br>Antenna Radio Subsystem Serial  I/O Ports Timers and Triggers Analog I/F<br>Interfaces<br>Antenna or RF Pin DEMOD ARM CortexM0+ Radio  [TM] USART Keypad Scanner Timer/Counter Protocol Timer ADC<br>RX/TX Front-End<br>with Controller External<br>Matching Integrated PA  IFADC BUFC RAM EUSART Interrupts Low Energy Timer Watchdog Timer ACMP<br>General<br>AGC EUSART Purpose I/O System Real  Back-Up Real  VDAC<br>FRC Time Counter Time Counter<br>Pin Reset<br>Frequency<br>Synthesizer MOD CRC I [2] C Pin Wakeup Pulse Counter Temperature Sensor<br>Lowest power mode with peripheral operational:<br>EM0—Active EM1—Sleep EM2—Deep Sleep EM3—Stop EM4—Shutoff<br>**----- End of picture text -----**<br>


**Copyright © 2022 by Silicon Laboratories** 

**silabs.com** | Building a more connected world. 

Rev. 1.0 

BGM240S Bluetooth[™] SiP Module Data Sheet Features 

## **1.  Features** 

- **Supported Protocols** 

   - Bluetooth Low Energy (BLE) 5.3 

   - Bluetooth Mesh 

   - Matter-ready Smart Home Connectivity 

- **Wireless System-on-Chip** 

   - 2.4 GHz radio 

   - TX power up to +10 dBm 

   - 32-bit ARM Cortex[®] -M33 with DSP instruction and floatingpoint unit for efficient signal processing 

   - 1536 kB flash program memory 

   - 256 kB RAM data memory 

   - Embedded Trace Macrocell (ETM) for advanced debugging 

- **Receiver Sensitivity** 

   - -105.1 dBm (0.1% BER) at 125 kbps GFSK 

   - -100.7 dBm (0.1% BER) at 500 kbps GFSK 

   - -97.0 dBm (0.1% BER) at 1 Mbps GFSK 

   - -94.3 dBm (0.1% BER) at 2 Mbps GFSK 

- **Current Consumption** 

   - 5.1 mA RX current at 1 Mbps GFSK 

   - 4.6 mA TX current at 0 dBm 

   - 23.4 mA TX current at 10 dBm 

   - 33.4 µA/MHz in Active Mode (EM0) at 39.0 MHz 

   - 1.3 μA EM2 DeepSleep current (16 kB RAM retention and RTC running from LFRCO) 

- **Regulatory Certification** 

   - CE (EU) 

   - UKCA (UK) 

   - FCC (USA) 

   - ISED (Canada) 

   - MIC (Japan) 

   - KC (South Korea) 

- **Operating Range** 

   - 1.8 to 3.8 V 

   - -40 to +105 °C 

- **Dimensions** 

   - 7 mm x 7 mm x 1.18 mm 

- **Security** 

   - Secure Boot with Root of Trust and Secure Loader (RTSL) 

   - Hardware Cryptographic Acceleration with DPA countermeasures for AES128/256, SHA-1, SHA-2 (up to 256-bit), ECC (up to 256-bit), ECDSA, and ECDH 

   - True Random Number Generator (TRNG) compliant with NIST SP800-90 and AIS-31 

   - ARM[®] TrustZone[®] 

   - Secure Debug Interface lock/unlock 

   - Secure Key Management with PUF 

   - Anti-Tamper 

   - Secure Attestation 

- **MCU Peripherals** 

   - Analog to Digital Converter (ADC) 

      - 12-bit @ 1 Msps 

      - 16-bit @ 76.9 ksps 

   - 2 × Analog Comparator (ACMP) 

   - 2 × Digital to Analog Converter (VDAC) 

   - Up to 32 General Purpose I/O pins with output state retention and asynchronous interrupts 

   - 8 Channel DMA Controller 

   - 16 Channel Peripheral Reflex System (PRS) 

   - 3 × 16-bit Timer/Counter with 3 Compare/Capture/PWM channels 

   - 2 × 32-bit Timer/Counter with 3 Compare/Capture/PWM channels 

   - 2 x 32-bit Real Time Counter (SYSRTC/BURTC) 

   - 24-bit Low Energy Timer for waveform generation (LETIMER) 

   - 16-bit Pulse Counter with asynchronous operation (PCNT) 

   - 2 × Watchdog Timer (WDOG) 

   - 1 × Universal Synchronous/Asynchronous Receiver/Transmitter (USART), supporting UART/SPI/SmartCard (ISO 7816)/IrDA/I[2] S 

   - 2 × Enhanced Universal Synchronous/Asynchronous Receiver/Transmitter (EUSART) supporting UART/SPI/DALI/ IrDA 

   - 2 × I[2] C interface with SMBus support 

   - Low-Frequency RC Oscillator with precision mode to replace 32 kHz sleep crystal (LFRCO) 

   - Keypad scanner supporting up to 6x8 matrix (KEYSCAN) 

   - Die temperature sensor with +/- 1.5 °C accuracy after single-point calibration 

**silabs.com** | Building a more connected world. 

Rev. 1.0  |  2 

BGM240S Bluetooth[™] SiP Module Data Sheet Ordering Information 

## **2.  Ordering Information** 

## **Table 2.1.  Ordering Information** 

|**Ordering Code**|**Protocol**<br>**Stack**|**TX**<br>**Power**|**Freq**<br>**Band**|**Antenna**|**Secure**<br>**Vault**|**Flash/**<br>**RAM(kB)**|**GPIO**|**Temp Range**|**Pack-**<br>**aging**|
|---|---|---|---|---|---|---|---|---|---|
|BGM240SA22VNA2|Bluetooth 5.3|10 dBm|2.4 GHz|Built in<br>or RF<br>PIN|MID|1536/256|32|-40 to 105 °C|Tray|
|BGM240SA22VNA2R|Bluetooth 5.3|10 dBm|2.4 GHz|Built in<br>or RF<br>PIN|MID|1536/256|32|-40 to 105 °C|Reel|
|BGM240SB22VNA2|Bluetooth 5.3|10 dBm|2.4 GHz|Built in<br>or RF<br>PIN|HIGH|1536/256|32|-40 to 105 °C|Tray|
|BGM240SB22VNA2R|Bluetooth 5.3|10 dBm|2.4 GHz|Built in<br>or RF<br>PIN|HIGH|1536/256|32|-40 to 105 °C|Reel|



## **Note:** 

1. BGM240S modules operate over the 2.4 GHz ISM band (BLE range: 2402 - 2480 MHz). 

2. The maximum RF TX power allowed by different regional regulatory authorities may differ from the maximum output power a module can produce. End-product manufacturers must then verify that the module is configured to meet the regulatory limits for each region in accordance with the local rules and the formal certification test reports. 

3. BGM240S modules are pre-programmed with UART BGAPI bootloader. 

4. Throughout this document, the modules may be referred to by their product family/marketing name (e.g. BGM240S), by their model name (BGM240S22A), or by their full ordering codes as seen in the table above. 

5. Radio board **xGM240-RB4318A** (+10 dBm) is available for BGM240S evaluation and development. 

6. Devices are pre-programmed for xGM240-RB4318A (+10dBm), which uses the pin configuration in Section 5. Reference Diagrams. 

**silabs.com** | Building a more connected world. 

Rev. 1.0  |  3 

## **Table of Contents** 

|**1.**|**Features .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**<br>**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 2**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**2.**|**Ordering Information**<br>**.**<br>**.**<br>**.**<br>**.**|**.**<br>**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 3**|
|**3.**|**System Overview .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**<br>**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 6**|
||3.1  Block Diagram .<br>.<br>.<br>.<br>.<br>.|.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|. 6|
||3.2  EFR32BG24 SoC .<br>.<br>.<br>.<br>.|.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|. 7|
||3.3  Antenna .<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|. 7|
||3.4  Power Supply<br>.<br>.<br>.<br>.<br>.<br>.|.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|. 7|
||3.5  General Purpose Input/Output (GPIO)||.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|. 8|
||3.6  Security<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|. 8|
||3.6.1  Secure Boot with Root of Trust and Secure||||||Loader (RTSL)|||||||.|.|.|.||.|.|.|.|.|.|.|.|. 9|
||3.6.2  Cryptographic Accelerator.|.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|. 9|
||3.6.3  True Random Number Generator||.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|. 9|
||3.6.4  Secure Debug with Lock/Unlock.||.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|. 9|
||3.6.5  DPA Countermeasures.<br>.|.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|. 9|
||3.6.6  Secure Key Management with PUF|||.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.10|
||3.6.7  Anti-Tamper<br>.<br>.<br>.<br>.<br>.|.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.10|
||3.6.8  Secure Attestation<br>.<br>.<br>.|.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.10|
|**4.**|**Electrical Specifications**<br>**.**<br>**.**<br>**.**|**.**<br>**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**||**.**||**.**|**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**. 11**|
||4.1  Absolute Maximum Ratings.<br>.|.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.11|
||4.2  General Operating Conditions .|.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.12|
||4.3  MCU current consumption at 3.0|V .|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.13|
||4.4  Radio Current Consumption with|3.0 V|Supply||||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.14|
||4.5  RF Transmitter General Characteristics for the|||||2.4||GHz Band||||.||.|.|.|.||.|.|.|.|.|.|.|.|.15|
||4.6  RF Receiver General Characteristics for the||||2.4||GHz||Band||.|.||.|.|.|.||.|.|.|.|.|.|.|.|.15|
||4.7  RF Receiver Characteristics for Bluetooth|||Low||Energy in||||the 2.4|||GHz|||Band||1|Mbps|||Data Rate .||||.|.16|
||4.8  RF Receiver Characteristics for Bluetooth|||Low||Energy in||||the 2.4|||GHz|||Band||2|Mbps|||Data Rate .||||.|.17|
||4.9  RF Receiver Characteristics for Bluetooth|||Low||Energy in||||the 2.4|||GHz|||Band||500||kbps Data||||Rate||.|.18|
||4.10  RF Receiver Characteristics for|Bluetooth Low|||||Energy in the|||||2.4||GHz Band|||||125||kbps||Data Rate .||||.19|
||4.11  High-Frequency Crystal<br>.<br>.|.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.20|
||4.12  Low Frequency Crystal Oscillator<br>.||.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.20|
||4.13  Precision Low Frequency RC Oscillator (LFRCO)|||||||.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.21|
||4.14  GPIO Pins .<br>.<br>.<br>.<br>.<br>.<br>.|.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.22|
||4.15  Microcontroller Peripherals<br>.|.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.23|
||4.16  Typical Performance Curves .|.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.24|
|**5.**|**Reference Diagrams.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**<br>**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**27**|
||5.1  Network Co-Processor (NCP) Application|||with||UART|||Host||.|.||.|.|.|.||.|.|.|.|.|.|.|.|.27|
||5.2  SoC Application<br>.<br>.<br>.<br>.<br>.|.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.28|



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Rev. 1.0 |  4 

|**6.  Pin Definitions .**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**29**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|6.1  Module Pinout .<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.29|
|6.2  Alternate Pin Functions|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.31|
|6.3  Analog Peripheral Connectivity||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.32|
|6.4  Digital Peripheral Connectivity .||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.33|
|**7.  Design Guidelines**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 37**|
|7.1  Layout and Placement|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.37|
|7.2  Best Design Practices|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.40|
|7.3  Radio Performance vs.|Carrier Board|||||Size||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.42|
|7.4  Impact of Human Body|and Other Materials|||||||in|Close||Proximity .||||.|.|.|.|.|.|.|.|.|.|.|.|.42|
|7.5  Reset .<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.42|
|7.6  Debug .<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.42|
|7.7  Packet Trace Interface (PTI)|||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.43|
|**8.  Package Specifications**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.44**|
|8.1  Package Outline<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.44|
|8.2  PCB Land Pattern .<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.47|
|8.3  Package Marking .<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.49|
|**9.  Soldering Recommendations**||||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 50**|
|**10.  Tray and Reel .**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**51**|
|**11.  Certifications .**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**52**|
|11.1  Qualified Antennas .|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.52|
|11.2  CE and UKCA - EU and UK|||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.52|
|11.3  FCC - USA .<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.53|
|11.4  ISED - Canada<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.55|
|11.5  MIC - Japan<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.57|
|11.6  KC - South Korea<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.58|
|11.7  RF Exposure and Proximity|||to|Human Body|||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.59|
|11.8  Bluetooth Qualification .||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.59|
|**12.  Revision History.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**60**|



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Rev. 1.0 |  5 

BGM240S Bluetooth[™] SiP Module Data Sheet System Overview 

## **3.  System Overview** 

## **3.1  Block Diagram** 

The BGM240S module is a highly-integrated, high-performance system in package with all the hardware components needed to enable 2.4 GHz wireless connectivity and support robust networking capabilities via multiple wireless protocols. 

Built around the EFR32BG24 Wireless SoC, the BGM240S includes a built-in antenna, an RF matching network (optimized for transmit power efficiency), supply decoupling and filtering components, an LC tank for DC-DC conversion, a 39 MHz reference crystal, and an RF shield. Also, it supports the use of an external 32 kHz crystal as a low frequency reference signal via GPIO pins for use cases demanding maximum energy efficiency. 

For designs where an external antenna solution may be beneficial, a module variant with a 50 Ω-matched RF pin instead of the built-in antenna is available. 

**Figure 3.1.  BGM240S Block Diagram - Integral Antenna** 

**Figure 3.2.  BGM240S Block Diagram - External Antenna** 

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Rev. 1.0  |  6 

BGM240S Bluetooth[™] SiP Module Data Sheet System Overview 

A simplified internal schematic for the BGM240S module is shown in Figure 3.3 BGM240S Module Schematic on page 7. 

**Figure 3.3.  BGM240S Module Schematic** 

## **3.2  EFR32BG24 SoC** 

The EFR32BG24 SoC features a 32-bit ARM Cortex M33 core, a 2.4 GHz high-performance radio, 1536 kB of Flash memory, 256 kB of RAM, a dedicated core for security, a rich set of MCU peripherals, and various clock management and serial interfacing options. See the EFR32xG24 Reference Manual for details. 

## **3.3  Antenna** 

BGM240S modules come with two antenna solution variants: a built-in integral ground loop type antenna realized by a PCB trace design, or a 50Ω-matched RF pin to support an external antenna. Typical performance characteristics for the built-in antenna are detailed in the table below. See Section 4.16 Typical Performance Curves and Section 11.1 Qualified Antennas for other relevant details. 

**Table 3.1.  BGM240S antenna specification** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Antenna frequency range|FRANGE||2400|—|2483.5|MHz|
|Antenna Gain|GMAX|Maximum relative to isotropic|—|—|1.48|dBi|
|Antenna Efficiency|Efficiency||-2.5|—|-1.36|dB|
|Reference impedance|Z||—|50|—|Ω|
|Dielectric Constant Host<br>Board|DICONST||—|4.3|—||
|Trace Thickness|TTHICKNESS||—|47|—|um|
|VSWR|VSWR|Maximum|—|—|2:1||



Antenna efficiency, gain and radiation pattern are dependent on the application PCB layout and mechanical design. Antenna specification is based on the assumption that the host board design guidelines in Section 7. Design Guidelines are followed. 

## **3.4  Power Supply** 

The BGM240S requires a primary supply (VDD) and IO supply (VDDIO) voltage to operate. All necessary decoupling, filtering and DCDC-related components are included in the module. 

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Rev. 1.0  |  7 

BGM240S Bluetooth[™] SiP Module Data Sheet System Overview 

## **3.5  General Purpose Input/Output (GPIO)** 

The BGM240S has up to 32 General Purpose Input/Output pins. Each GPIO pin can be individually configured as either an output or input. More advanced configurations including open-drain, open-source, and glitch-filtering can be configured for each individual GPIO pin. The GPIO pins can be overridden by peripheral connections, like SPI communication. Each peripheral connection can be routed to several GPIO pins on the device. The input value of a GPIO pin can be routed through the Peripheral Reflex System to other peripherals. The GPIO subsystem supports asynchronous external pin interrupts. 

All of the pins on ports A and port B are EM2 capable. These pins may be used by Low-Energy peripherals in EM2/3 and may also be used as EM2/3 pin wake-ups. Pins on ports C and D are latched/retained in their current state when entering EM2 until EM2 exit upon which internal peripherals could once again drive those pads. 

A few GPIOs also have EM4 wake functionality. These pins are listed in the Table 6.2 GPIO Alternate Functions Table on page 31 

## **3.6  Security** 

BGM240S modules support one of two levels in the Security Portfolio offered by Silicon Labs: Secure Vault Mid or Secure Vault High. 

Secure Vault is a collection of technologies that deliver state-of-the-art security and upgradability features to protect and future-proof IoT devices against costly threats, attacks, and tampering. A dedicated security CPU enables the Secure Vault functions and isolates cryptographic functions and data from the Cortex-M33 core. BGM240SA part numbers support Secure Mid Vault and BGM240SB part numbers support Secure Vault High. 

**Table 3.2.  Secure Vault Features** 

|**Feature**|**Secure Vault Mid**|**Secure Vault High**|
|---|---|---|
|True Random Number Generator (TRNG)|Yes|Yes|
|Secure Boot with Root of Trust and Secure<br>Loader (RTSL)|Yes|Yes|
|Secure Debug with Lock/Unlock|Yes|Yes|
|DPA Countermeasures|Yes|Yes|
|Anti-Tamper||Yes|
|Secure Attestation||Yes|
|Secure Key Management||Yes|
|Symmetric Encryption|• AES 128 / 192 / 256 bit<br>• ECB, CTR, CBC, CFB, CCM, GCM,<br>CBC-MAC, and GMAC|• AES 128 / 192 / 256 bit<br>• ECB, CTR, CBC, CFB, CCM, GCM,<br>CBC-MAC, and GMAC<br>• ChaCha20|
|Public Key Encryption - ECDSA / ECDH /<br>EdDSA|• p192 and p256|• p192, p256, p384 and p521<br>• Curve25519 (ECDH)<br>• Ed25519 (EdDSA)|
|Key Derivation|• ECJ-PAKE p192 and p256|• ECJ-PAKE p192, p256, p384, and p521<br>• PBKDF2<br>• HKDF|
|Hashes|• SHA-1<br>• SHA-2/256|• SHA-1<br>• SHA-2 256, 384, and 512<br>• Poly1305|



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Rev. 1.0  |  8 

BGM240S Bluetooth[™] SiP Module Data Sheet System Overview 

## **3.6.1  Secure Boot with Root of Trust and Secure Loader (RTSL)** 

The Secure Boot with RTSL authenticates a chain of trusted firmware that begins from an immutable memory (ROM). 

It prevents malware injection, prevents rollback, ensures that only authentic firmware is executed, and protects Over The Air updates. 

For more information about this feature, see AN1218: Series 2 Secure Boot with RTSL. 

## **3.6.2  Cryptographic Accelerator** 

The Cryptographic Accelerator is an autonomous hardware accelerator with Differential Power Analysis (DPA) countermeasures to protect keys. 

It supports AES encryption and decryption with 128/192/256-bit keys, ChaCha20 encryption, and Elliptic Curve Cryptography (ECC) to support public key operations, and hashes. 

Supported block cipher modes of operation for AES include: 

- ECB (Electronic Code Book) 

- CTR (Counter Mode) 

- CBC (Cipher Block Chaining) 

- CFB (Cipher Feedback) 

- GCM (Galois Counter Mode) 

- CCM (Counter with CBC-MAC) 

- CBC-MAC (Cipher Block Chaining Message Authentication Code) 

- GMAC (Galois Message Authentication Code) 

The Cryptographic Accelerator accelerates Elliptical Curve Cryptography and supports the NIST (National Institute of Standards and Technology) recommended curves including P-192, P-256, P-384, and P-521 for ECDH (Elliptic Curve Diffie-Hellman) key derivation, and ECDSA (Elliptic Curve Digital Signature Algorithm) sign and verify operations. Also supported is the non-NIST Curve25519 for ECDH and Ed25519 for EdDSA (Edwards-curve Digital Signature Algorithm) sign and verify operations. 

Secure Vault also supports ECJ-PAKE (Elliptic Curve variant of Password Authenticated Key Exchange by Juggling) and PBKDF2 (Password-Based Key Derivation Function 2). 

Supported hashes include SHA-1, SHA-2/256/384/512 and Poly1305. 

This implementation provides a fast and energy efficient solution to state of the art cryptographic needs. 

## **3.6.3  True Random Number Generator** 

The True Random Number Generator module is a non-deterministic random number generator that harvests entropy from a thermal energy source. It includes start-up health tests for the entropy source as required by NIST SP800-90B and AIS-31 as well as online health tests required for NIST SP800-90C. 

The TRNG is suitable for periodically generating entropy to seed an approved pseudo random number generator. 

## **3.6.4  Secure Debug with Lock/Unlock** 

For obvious security reasons, it is critical for a product to have its debug interface locked before being released in the field. 

In addition, Secure Vault High also provides a secure debug unlock function that allows authenticated access based on public key cryptography. This functionality is particularly useful for supporting failure analysis while maintaining confidentiality of IP and sensitive enduser data. 

For more information about this feature, see AN1190: Series 2 Secure Debug. 

## **3.6.5  DPA Countermeasures** 

The AES and ECC accelerators have Differential Power Analysis (DPA) countermeasures support. This makes it very expensive from a time and effort standpoint to use DPA to recover secret keys. 

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Rev. 1.0  |  9 

BGM240S Bluetooth[™] SiP Module Data Sheet System Overview 

## **3.6.6  Secure Key Management with PUF** 

Key material in Secure Vault High products is protected by "key wrapping" with a standardized symmetric encryption mechanism. This method has the advantage of protecting a virtually unlimited number of keys, limited only by the storage that is accessible by the Cortex-M33, which includes off-chip storage as well. The symmetric key used for this wrapping and unwrapping must be highly secure because it can expose all other key materials in the system. The Secure Vault Key Management system uses a Physically Unclonable Function (PUF) to generate a persistent device-unique seed key on power up to dynamically generate this critical wrapping/unwrapping key which is only visible to the AES encryption engine and is not retained when the device loses power. 

## **3.6.7  Anti-Tamper** 

Secure Vault High devices provide internal tamper protection which monitors parameters such as voltage, temperature, and electromagnetic pulses as well as detecting tamper of the security sub-system itself. Additionally, 8 external configurable tamper pins support external tamper sources, such as enclosure tamper switches. 

For each tamper event, the user is able to select the severity of the tamper response ranging from an interrupt, to a reset, to destroying the PUF reconstruction data which will make all protected key materials un-recoverable and effectively render the device inoperable. The tamper system also has an internal resettable event counter with programmable trigger threshold and refresh periods to mitigate false positive tamper events. 

For more information about this feature, see AN1247: Anti-Tamper Protection Configuration and Use. 

## **3.6.8  Secure Attestation** 

Secure Vault High products support Secure Attestation, which begins with a secure identity that is created during the Silicon Labs manufacturing process. During device production, each device generates its own public/private keypair and securely stores the wrapped private key into immutable OTP memory and this key never leaves the device. The corresponding public key is extracted from the device and inserted into a binary DER-encoded X.509 device certificate, which is signed into a Silicon Labs CA chain and then programmed back into the chip into an immutable OTP memory. 

The secure identity can be used to authenticate the chip at any time in the life of the product. The production certification chain can be requested remotely from the product. This certification chain can be used to verify that the device was authentically produced by Silicon Labs. The device unique public key is also bound to the device certificate in the certification chain. A challenge can be sent to the chip at any point in time to be signed by the device private key. The public key in the device certificate can then be used to verify the challenge response, proving that the device has access to the securely-stored private key, which prevents counterfeit products or impersonation attacks. 

For more information about this feature, see AN1268: Authenticating Silicon Labs Devices Using Device Certificates. 

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Rev. 1.0  |  10 

BGM240S Bluetooth[™] SiP Module Data Sheet Electrical Specifications 

## **4.  Electrical Specifications** 

All electrical parameters in all tables are specified under the following conditions, unless stated otherwise: 

- Typical values are based on TA=25 °C and VDD = VDDIO = 3.0 V, by production test and/or technology characterization. 

- Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output power-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna. 

- Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise. 

## **4.1  Absolute Maximum Ratings** 

**Table 4.1.  Absolute Maximum Ratings** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Storage temperature range|TSTG||-40|—|+105|°C|
|Voltage on any supply pin|VDDMAX||-0.3|—|3.8|V|
|Voltage ramp rate on any<br>supply pin|VDDRAMPMAX||—|—|1.0|V / µs|
|DC voltage on any GPIO pin|VDIGPIN||-0.3|—|VVDDIO+<br>0.3|V|
|DC voltage on RESETn pin1|VRESETn||-0.3|—|3.8|V|
|Absolute voltage on RFOUT<br>pin|VMAX2G4||-0.3|—|VVDD+ 0.3|V|
|Total current into VDD pin|IVDDMAX|Source|—|—|200|mA|
|Total current into GND pin|IVSSMAX|Sink|—|—|200|mA|
|Current per I/O pin|IIOMAX|Sink|—|—|50|mA|
|||Source|—|—|50|mA|
|Current for all I/O pins|IIOALLMAX|Sink|—|—|200|mA|
|||Source|—|—|200|mA|
|**Note:**<br>1. The RESETn pin has a pull-up device to the internal DVDD supply. For minimum leakage, RESETn should not exceed the volt-<br>age at DVDD, which is generated by the DC-DC converter. DVDD is equal to 1.8 V when DC-DC is active and bypassed to VDD<br>when DC-DC is inactive.|||||||



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Rev. 1.0  |  11 

BGM240S Bluetooth[™] SiP Module Data Sheet Electrical Specifications 

## **4.2  General Operating Conditions** 

**Table 4.2.  General Operating Conditions** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Operating ambient tempera-<br>ture range|TA||-40|—|+105|°C|
|VDD operating supply volt-<br>age|VVDD|DC-DC in regulation|2.2|3.0|3.8|V|
|||DC-DC in bypass|1.8|3.0|3.8|V|
|VDDIO operating supply volt-<br>age|VVDDIO|AVDDBODEN=0, IOVDDxBO-<br>DEN=01|1.71|3.0|3.8|V|
|HCLK and SYSCLK frequen-<br>cy|fHCLK|VSCALE2, MODE = WS1|—|—|78|MHz|
|||VSCALE2, MODE = WS0|—|—|40|MHz|
|||VSCALE1, MODE = WS0|—|—|40|MHz|
|EM01 Group A clock fre-<br>quency|fEM01GRPACLK|VSCALE2|—|—|78|MHz|
|||VSCALE1|—|—|40|MHz|
|EM01 Group C clock fre-<br>quency|fEM01GRPCCLK|VSCALE2|—|—|78|MHz|
|||VSCALE1|—|—|40|MHz|
|Radio HCLK frequency|fRHCLK|VSCALE2 or VSCALE1|—|39.0|—|MHz|
|**Note:**<br>1. The AVDD and IOVDD BOD enable bits are||in the EMU_BOD3SENSE register. These BODs are disabled on reset.|||||



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Rev. 1.0  |  12 

BGM240S Bluetooth[™] SiP Module Data Sheet Electrical Specifications 

## **4.3  MCU current consumption at 3.0 V** 

Unless otherwise indicated, typical conditions are: VDD = VDDIO = 3.0 V, DC-DC in regulation. Voltage scaling level = VSCALE1. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 °C. 

**Table 4.3.  MCU current consumption at 3.0 V** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Current consumption in EM0<br>mode with all peripherals dis-<br>abled|IACTIVE|78 MHz HFRCO w/ DPLL refer-<br>enced to 39 MHz crystal, CPU<br>running Prime from flash,<br>VSCALE2|—|33.3|—|µA/MHz|
|||78 MHz HFRCO w/ DPLL refer-<br>enced to 39 MHz crystal, CPU<br>running while loop from flash,<br>VSCALE2|—|32.8|—|µA/MHz|
|||78 MHz HFRCO w/ DPLL refer-<br>enced to 39 MHz crystal, CPU<br>running CoreMark loop from flash,<br>VSCALE2|—|49.1|—|µA/MHz|
|||39 MHz crystal, CPU running<br>Prime from flash|—|33.9|—|µA/MHz|
|||39 MHz crystal, CPU running<br>while loop from flash|—|33.4|—|µA/MHz|
|||39 MHz crystal, CPU running<br>CoreMark loop from flash|—|49.4|—|µA/MHz|
|||38 MHz HFRCO, CPU running<br>while loop from flash|—|28.1|—|µA/MHz|
|Current consumption in EM1<br>mode with all peripherals dis-<br>abled|IEM1|78 MHz HFRCO w/ DPLL refer-<br>enced to 39 MHz crystal,<br>VSCALE2|—|22.6|—|µA/MHz|
|||39 MHz crystal|—|24.4|—|µA/MHz|
|||38 MHz HFRCO|—|19.0|—|µA/MHz|
|Current consumption in EM2<br>mode, VSCALE0|IEM2_VS|256 kB RAM and full Radio RAM<br>retention, RTC running from<br>LFXO1|—|3.1|—|µA|
|||256 kB RAM and full Radio RAM<br>retention, RTC running from<br>LFRCO1|—|3.1|—|µA|
|||16 kB RAM and full Radio RAM<br>retention, RTC running from<br>LFXO1|—|1.3|—|µA|
|||16 kB RAM and full Radio RAM<br>retention, RTC running from<br>LFRCO1|—|1.3|—|µA|
|||16 kB RAM and full Radio RAM<br>retention, RTC running from<br>LFRCO in precision mode1|—|1.9|—|µA|



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Rev. 1.0  |  13 

BGM240S Bluetooth[™] SiP Module Data Sheet Electrical Specifications 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Current consumption in EM3<br>mode, VSCALE0|IEM3_VS|256 kB RAM and full Radio RAM<br>retention, RTC running from<br>ULFRCO1|—|2.9|—|µA|
|||16 kB RAM and full Radio RAM<br>retention, RTC running from<br>ULFRCO1|—|1.1|—|µA|
|Current consumption in EM4<br>mode|IEM4|No BURTC, no LF oscillator|—|0.31|—|µA|
|||BURTC with LFXO|—|0.64|—|µA|
|Current consumption during<br>reset|IRST|Hard pin reset held|—|467|—|µA|
|**Note:**<br>1. CPU cache retained, EM0/1 peripheral states retained|||||||



## **4.4  Radio Current Consumption with 3.0 V Supply** 

RF current consumption measured with MCU in EM1 and all MCU peripherals disabled. Unless otherwise indicated, typical conditions are: VDD = VDDIO = 3.0 V, DC-DC in regulation. TA = 25 °C. 

**Table 4.4.  Radio Current Consumption with 3.0 V Supply** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Current consumption in re-<br>ceive mode, active packet<br>reception, VSCALE1, EM1P|IRX_ACTIVE|125 kbit/s, 2GFSK, f = 2.4 GHz|—|5.4|—|mA|
|||500 kbit/s, 2GFSK, f = 2.4 GHz|—|5.5|—|mA|
|||1 Mbit/s, 2GFSK, f = 2.4 GHz|—|5.1|—|mA|
|||2 Mbit/s, 2GFSK, f = 2.4 GHz|—|5.8|—|mA|
|Current consumption in re-<br>ceive mode, listening for<br>packet, VSCALE1, EM1P|IRX_LISTEN|125 kbit/s, 2GFSK, f = 2.4 GHz|—|5.4|—|mA|
|||500 kbit/s, 2GFSK, f = 2.4 GHz|—|5.4|—|mA|
|||1 Mbit/s, 2GFSK, f = 2.4 GHz|—|5.0|—|mA|
|||2 Mbit/s, 2GFSK, f = 2.4 GHz|—|5.8|—|mA|
|Current consumption in<br>transmit mode|ITX|f = 2.4 GHz, CW, 10 dBm output<br>power|—|23.4|—|mA|



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Rev. 1.0  |  14 

BGM240S Bluetooth[™] SiP Module Data Sheet Electrical Specifications 

## **4.5  RF Transmitter General Characteristics for the 2.4 GHz Band** 

Unless otherwise indicated, typical conditions are: VDD = VDDIO = 3.0 V, DC-DC in regulation. RF center frequency 2.45 GHz. TA = 25 °C. 

**Table 4.5.  RF Transmitter General Characteristics for the 2.4 GHz Band** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|RF tuning frequency range|FRANGE||2402|—|2480|MHz|
|Maximum TX power|POUTMAX|10 dBm|—|10.0|—|dBm|
|||0 dBm|—|-1.4|—|dBm|
|Minimum active TX power|POUTMIN|10 dBm|—|-29.1|—|dBm|
|||0 dBm|—|-24.9|—|dBm|
|Output power step size|POUTSTEP|0 dBm|0.1|0.6|10|dB|
|||10 dBm, -5 dBm < Output power <<br>0 dBm|0.2|0.7|1.7|dB|
|||10 dBm, 0 dBm < Output power <<br>10 dBm|0.04|0.2|0.8|dB|
|Output power variation vs<br>supply voltage variation, fre-<br>quency = 2450 MHz|POUTVAR_V|10 dBm output power with VDD<br>voltage swept from 1.8 V to 3.8 V|—|0.02|—|dB|
|||0 dBm output power with VDD<br>voltage swept from 1.8 V to 3.8 V|—|0.06|—|dB|
|Output power variation vs<br>temperature, Frequency =<br>2450 MHz|POUTVAR_T|0 dBm, (-40 to +105 °C)|—|1.1|—|dB|
|Output power variation over<br>the RF tuning frequency<br>range|POUTVAR_F|10 dBm|—|0.6|—|dB|
|||0 dBm|—|0.07|—|dB|



## **4.6  RF Receiver General Characteristics for the 2.4 GHz Band** 

Unless otherwise indicated, typical conditions are: VDD = VDDIO = 3.0 V, DC-DC in regulation. RF center frequency 2.45 GHz. TA = 25 °C. 

**Table 4.6.  RF Receiver General Characteristics for the 2.4 GHz Band** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|RF tuning frequency range|FRANGE||2402|—|2480|MHz|



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Rev. 1.0  |  15 

BGM240S Bluetooth[™] SiP Module Data Sheet Electrical Specifications 

## **4.7  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate** 

Unless otherwise indicated, typical conditions are: VDD = VDDIO = 3.0 V, DC-DC in regulation. RF center frequency 2.45 GHz. TA = 25 °C. 

**Table 4.7.  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Rx Max Strong Signal Input<br>Level for 0.1% BER|RXSAT|Signal is reference signal1|—|10|—|dBm|
|Sensitivity|SENS|Signal is reference signal, 37 byte<br>payload1|—|-97|—|dBm|
|||Signal is reference signal, 255<br>byte payload1|—|-95.4|—|dBm|
|||With non-ideal signals2 1|—|-95.0|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 3|—|8.7|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +1<br>MHz offset1 4 3 5|—|-5.4|—|dB|
|||Interferer is reference signal at -1<br>MHz offset1 4 3 5|—|-5.3|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +2<br>MHz offset1 4 3 5|—|-40.9|—|dB|
|||Interferer is reference signal at -2<br>MHz offset1 4 3 5|—|-39.7|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +3<br>MHz offset1 4 3 5|—|-45.5|—|dB|
|||Interferer is reference signal at -3<br>MHz offset1 4 3 5|—|-45.7|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 5|—|-23.3|—|dB|
|Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision1 5|—|-40.9|—|dB|
|||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision1 5|—|-5.4|—|dB|
|Intermodulation performance|IM|n = 3 (see note6)|—|-17.3|—|dBm|
|**Note:**<br>1. 0.017% Bit Error Rate.<br>2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>3. Desired signal -67 dBm.<br>4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>5. With allowed exceptions.<br>6. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4|||||||



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Rev. 1.0  |  16 

BGM240S Bluetooth[™] SiP Module Data Sheet Electrical Specifications 

## **4.8  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate** 

Unless otherwise indicated, typical conditions are: VDD = VDDIO = 3.0 V, DC-DC in regulation. RF center frequency 2.45 GHz. TA = 25 °C. 

**Table 4.8.  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Rx Max Strong Signal Input<br>Level for 0.1% BER|RXSAT|Signal is reference signal1|—|10|—|dBm|
|Sensitivity|SENS|Signal is reference signal, 37 byte<br>payload1|—|-94.3|—|dBm|
|||Signal is reference signal, 255<br>byte payload1|—|-92.7|—|dBm|
|||With non-ideal signals2 1|—|-92.5|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 3|—|8.6|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +2<br>MHz offset1 4 3 5|—|-5.3|—|dB|
|||Interferer is reference signal at -2<br>MHz offset1 4 3 5|—|-5.8|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +4<br>MHz offset1 4 3 5|—|-42.2|—|dB|
|||Interferer is reference signal at -4<br>MHz offset1 4 3 5|—|-44.2|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +6<br>MHz offset1 4 3 5|—|-48.1|—|dB|
|||Interferer is reference signal at -6<br>MHz offset1 4 3 5|—|-50.2|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 5|—|-22.8|—|dB|
|Selectivity to image frequen-<br>cy ± 2 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +2 MHz with 1<br>MHz precision1 5|—|-42.2|—|dB|
|||Interferer is reference signal at im-<br>age frequency -2 MHz with 1 MHz<br>precision1 5|—|-5.3|—|dB|
|Intermodulation performance|IM|n = 3 (see note6)|—|-18.3|—|dBm|
|**Note:**<br>1. 0.017% Bit Error Rate.<br>2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>3. Desired signal -64 dBm.<br>4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>5. With allowed exceptions.<br>6. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4|||||||



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BGM240S Bluetooth[™] SiP Module Data Sheet Electrical Specifications 

## **4.9  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate** 

Unless otherwise indicated, typical conditions are: VDD = VDDIO = 3.0 V, DC-DC in regulation. RF center frequency 2.45 GHz. TA = 25 °C. 

**Table 4.9.  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Rx Max Strong Signal Input<br>Level for 0.1% BER|RXSAT|Signal is reference signal1|—|10|—|dBm|
|Sensitivity|SENS|Signal is reference signal, 37 byte<br>payload1|—|-100.7|—|dBm|
|||Signal is reference signal, 255<br>byte payload1|—|-99.4|—|dBm|
|||With non-ideal signals2 1|—|-98.4|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 3|—|2.7|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +1<br>MHz offset1 4 3 5|—|-7.1|—|dB|
|||Interferer is reference signal at -1<br>MHz offset1 4 3 5|—|-7.4|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +2<br>MHz offset1 4 3 5|—|-46.8|—|dB|
|||Interferer is reference signal at -2<br>MHz offset1 4 3 5|—|-49.7|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +3<br>MHz offset1 4 3 5|—|-49.4|—|dB|
|||Interferer is reference signal at -3<br>MHz offset1 4 3 5|—|-54.5|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 5|—|-49|—|dB|
|Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision1 5|—|-49.4|—|dB|
|||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision1 5|—|-46.8|—|dB|
|**Note:**<br>1. 0.017% Bit Error Rate.<br>2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>3. Desired signal -72 dBm.<br>4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>5. With allowed exceptions.|||||||



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BGM240S Bluetooth[™] SiP Module Data Sheet Electrical Specifications 

## **4.10  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate** 

Unless otherwise indicated, typical conditions are: VDD = VDDIO = 3.0 V, DC-DC in regulation. RF center frequency 2.45 GHz. TA = 25 °C. 

**Table 4.10.  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Rx Max Strong Signal Input<br>Level for 0.1% BER|RXSAT|Signal is reference signal1|—|10|—|dBm|
|Sensitivity|SENS|Signal is reference signal, 37 byte<br>payload1|—|-105.1|—|dBm|
|||Signal is reference signal, 255<br>byte payload1|—|-104.7|—|dBm|
|||With non-ideal signals2 1|—|-104.3|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 3|—|0.9|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +1<br>MHz offset1 4 3 5|—|-12.4|—|dB|
|||Interferer is reference signal at -1<br>MHz offset1 4 3 5|—|-12.8|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +2<br>MHz offset1 4 3 5|—|-52.6|—|dB|
|||Interferer is reference signal at -2<br>MHz offset1 4 3 5|—|-55.5|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +3<br>MHz offset1 4 3 5|—|-53.8|—|dB|
|||Interferer is reference signal at -3<br>MHz offset1 4 3 5|—|-60|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 5|—|-53|—|dB|
|Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision1 5|—|-53.8|—|dB|
|||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision1 5|—|-52.6|—|dB|
|**Note:**<br>1. 0.017% Bit Error Rate.<br>2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>3. Desired signal -79 dBm.<br>4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>5. With allowed exceptions.|||||||



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BGM240S Bluetooth[™] SiP Module Data Sheet Electrical Specifications 

## **4.11  High-Frequency Crystal** 

**Table 4.11.  High-Frequency Crystal** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Crystal frequency|fHFXTAL||—|39|—|MHz|
|Initial calibrated accuracy|ACCHFXTAL||-5|—|+5|ppm|
|Temperature drift|DRIFTHFXTAL|Across specified temperature<br>range|-30|—|30|ppm|



## **4.12  Low Frequency Crystal Oscillator** 

**Table 4.12.  Low Frequency Crystal Oscillator** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Crystal Frequency|FLFXO||—|32.768|—|kHz|
|Supported Crystal equivalent<br>series resistance (ESR)|ESRLFXO|GAIN = 0|—|—|80|kΩ|
|||GAIN = 1 to 3|—|—|100|kΩ|
|Supported range of crystal<br>load capacitance1|CL_LFXO|GAIN = 0|4|—|6|pF|
|||GAIN = 1|6|—|10|pF|
|||GAIN = 2 (see note2)|10|—|12.5|pF|
|||GAIN = 3 (see note2)|12.5|—|18|pF|
|Current consumption|ICL12p5|ESR = 70 kΩ, CL= 12.5 pF,<br>GAIN3= 2, AGC4= 1|—|294|—|nA|
|Startup Time|TSTARTUP|ESR = 70 kΩ, CL= 7 pF, GAIN3=<br>1, AGC4= 1|—|52|—|ms|
|On-chip tuning cap step size|SSLFXO||—|0.26|—|pF|
|On-chip tuning capacitor val-<br>ue at minimum setting5|CLFXO_MIN|CAPTUNE = 0|—|5.2|—|pF|
|On-chip tuning capacitor val-<br>ue at maximum setting5|CLFXO_MAX|CAPTUNE = 0x4F|—|26.2|—|pF|
|**Note:**<br>1. Total load capacitance seen by the crystal<br>2. Crystals with a load capacitance of greater than 12 pF require external load capacitors.<br>3. In LFXO_CAL Register<br>4. In LFXO_CFG Register<br>5. The effective load capacitance seen by the crystal will be CLFXO/2. This is because each XTAL pin has a tuning cap and the two<br>caps will be seen in series by the crystal|||||||



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BGM240S Bluetooth[™] SiP Module Data Sheet Electrical Specifications 

## **4.13  Precision Low Frequency RC Oscillator (LFRCO)** 

**Table 4.13.  Precision Low Frequency RC Oscillator (LFRCO)** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Nominal oscillation frequen-<br>cy|FLFRCO||—|32.768|—|kHz|
|Frequency accuracy|FLFRCO_ACC|Normal mode|-3|—|3|%|
|||Precision mode1, across operat-<br>ing temperature range2|-500|—|500|ppm|
|Startup time|tSTARTUP|Normal mode|—|204|—|µs|
|||Precision mode1|—|11.7|—|ms|
|Current consumption|ILFRCO|Normal mode|—|189.9|—|nA|
|||Precision mode1, T = stable at 25<br>°C3|—|649.8|—|nA|
|**Note:**<br>1. The LFRCO operates in high-precision mode when CFG_HIGHPRECEN is set to 1. High-precision mode is not available in EM4.<br>2. Includes ± 40 ppm frequency tolerance of the HFXO crystal.<br>3. Includes periodic re-calibration against HFXO crystal oscillator.|||||||



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BGM240S Bluetooth[™] SiP Module Data Sheet Electrical Specifications 

## **4.14  GPIO Pins** 

## **Table 4.14.  GPIO Pins** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Leakage current|ILEAK_IO|MODEx = DISABLED, VDD =<br>VDDIO = 3.0 V|—|2.5|—|nA|
|Input low voltage1|VIL|Any GPIO pin|—|—|0.3 *<br>VDDIO|V|
|||RESETn|—|—|0.3 * DVDD|V|
|Input high voltage1|VIH|Any GPIO pin|0.7 *<br>VDDIO|—|—|V|
|||RESETn|0.7 * DVDD|—|—|V|
|Hysteresis of input voltage|VHYS|Any GPIO pin|0.05 *<br>VDDIO|—|—|V|
|||RESETn|0.05 *<br>DVDD|—|—|V|
|Output high voltage|VOH|Sourcing 20 mA, VDDIO = 3.0 V|0.8 *<br>VDDIO|—|—|V|
|Output low voltage|VOL|Sinking 20 mA, VDDIO = 3.0 V|—|—|0.2 *<br>VDDIO|V|
|GPIO rise time|TGPIO_RISE|VDDIO = 3.0 V, Cload= 50pF,<br>SLEWRATE = 4, 10% to 90%|—|8.4|—|ns|
|GPIO fall time|TGPIO_FALL|VDDIO = 3.0 V, Cload= 50pF,<br>SLEWRATE = 4, 90% to 10%|—|7.1|—|ns|
|Pull up/down resistance2|RPULL|Any GPIO pin. Pull-up to VDDIO:<br>MODEn = DISABLE DOUT=1.<br>Pull-down to GND: MODEn =<br>WIREDORPULLDOWN DOUT =<br>0.|35|44|55|kΩ|
|||RESETn pin. Pull-up to DVDD|35|44|55|kΩ|
|Maximum filtered glitch width|TGF|MODE = INPUT, DOUT = 1|—|27|—|ns|
|**Note:**<br>1. GPIO input thresholds are proportional to the VDDIO pin. RESETn input thresholds are proportional to the internal DVDD supply,<br>which is generated by the DC-DC converter. DVDD is equal to 1.8 V when DC-DC is active and bypassed to VDD when DC-DC<br>is inactive.<br>2. GPIO pull-ups connect to VDDIO supply, pull-downs connect to GND. RESETn pull-up connects to internal DVDD supply, which<br>is generated by the DC-DC converter. DVDD is equal to 1.8 V when DC-DC is active and bypassed to VDD when DC-DC is inac-<br>tive.|||||||



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BGM240S Bluetooth[™] SiP Module Data Sheet Electrical Specifications 

## **4.15  Microcontroller Peripherals** 

The set of peripherals available in BGM240S modules includes: 

- 12-bit 1 Msps ADC 

- Analog Comparators 

- 16-bit and 32-bit Timers/Counters 

- 24-bit Low Energy Timer for waveform generation 

- 32-bit Real Time Counter 

- USART (UART/SPI/SmartCards/IrDA/I2S) 

- I[2] C peripheral interfaces 

- 12 Channel Peripheral Reflex System 

Details on their electrical performance can be found in the relevant portions of Section 4 of the EFR32BG24 SoC data sheet. 

To learn which GPIO ports provide access to every peripheral, consult the 6.4 Digital Peripheral Connectivity and 6.3 Analog Peripheral Connectivity tables. 

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BGM240S Bluetooth[™] SiP Module Data Sheet Electrical Specifications 

## **4.16  Typical Performance Curves** 

Typical BGM240S radiation patterns for the built-in antenna under optimal operating conditions are plotted in the figures that follow. Antenna gain and radiation patterns have a strong dependence on the size and shape of the application PCB the module is mounted on, as well as on the proximity of any mechanical design to the antenna. 

**Figure 4.1.  Typical 2D Antenna Radiation Patterns - Phi 0[o] (Side View) Gain (dBi)** 

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BGM240S Bluetooth[™] SiP Module Data Sheet Electrical Specifications 

**Figure 4.2.  Typical 2D Antenna Radiation Patterns - Phi 90[o] (Top View) Gain (dBi)** 

**Figure 4.3.  Typical 2D Antenna Radiation Patterns - Theta 90[o] (Front View) Gain (dBi)** 

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BGM240S Bluetooth[™] SiP Module Data Sheet Electrical Specifications 

**Figure 4.4.  3D Radiation Pattern at 2440MHz** 

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BGM240S Bluetooth[™] SiP Module Data Sheet Reference Diagrams 

## **5.  Reference Diagrams** 

## **5.1  Network Co-Processor (NCP) Application with UART Host** 

The BGM240S can be controlled via the UART interface as a peripheral to an external host processor. Typical power supply, programming/debug interface, and host interface connections are shown in the figure below. For more details, see _AN958: Debugging and Programming Interfaces for Custom Designs_ . 

**Figure 5.1.  UART NCP Configuration** 

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BGM240S Bluetooth[™] SiP Module Data Sheet Reference Diagrams 

## **5.2  SoC Application** 

The BGM240S can be used in a stand-alone SoC configuration without an external host processor. Typical power supply and programming/debug interface connections are shown in the figure below. For more details, see _AN958: Debugging and Programming Interfaces for Custom Designs_ . 

**Figure 5.2.  Stand-Alone SoC Configuration** 

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BGM240S Bluetooth[™] SiP Module Data Sheet Pin Definitions 

## **6.  Pin Definitions** 

## **6.1  Module Pinout** 

**Figure 6.1.  BGM240S Module Pinout (Top view)** 

The next table shows the BGM240S pinout and general descriptions for each pin. Refer to 6.2 Alternate Pin Functions, 6.3 Analog Peripheral Connectivity, and 6.4 Digital Peripheral Connectivity for details on functions and peripherals supported by each GPIO pin. 

**Table 6.1.  BGM240S Module Pin Definitions** 

|**Pin Name**<br>a|**No.**<br>ae|**Description**<br>ee|||**Pin Name**<br>ee|**No.**|**Description**|
|---|---|---|---|---|---|---|
|DNC<br>a<br>i|1<br>ae<br>er|Do not connect<br>ee<br>~~es~~||<br>~~es~~|GND<br>ee<br>~~es~~|52<br>~~es~~|GROUND<br>~~es~~|
|ANT OUT<br>a<br>i|2<br>ae<br>er|Integral Ant Out<br>ee<br>~~es~~|| <br>~~es~~|GND<br> ee<br>~~es~~|51<br>~~es~~|GROUND<br>~~es~~|
|DNC<br>i <br>a<br>~~i~~|3<br> er<br>i<br>~~i~~|Do not connect<br>~~es~~<br>~~ee~~<br>ee|~~es~~<br>~~ee~~<br>||GND<br>~~es~~<br>~~ee~~|50<br>~~es~~<br>~~ee~~|GROUND<br>~~es~~<br>~~ee~~|
|DNC<br>~~i~~<br>e~~s~~|4<br>~~i~~<br>~~s~~|Do not connect<br>ee<br>er||<br>||GND|49|GROUND|
|ANT IN<br>~~i~~<br>e~~s~~|5<br>~~i ~~<br>~~s~~|Integral Ant In<br> ee<br>er||<br>||GND|48|GROUND|
|2G4IO<br>e~~s~~<br>ee|6<br>~~s ~~<br>|RF IN/OUT<br> er||<br>||RESETn1<br>re|47|RESET|
|GND<br>i<br>ee<br>es|7<br>i~~es~~<br>i<br>|GROUND<br>~~es~~<br>rs<br>|~~es~~<br>|<br>|<br>|PC09<br>~~es~~<br>re<br>~~e~~<br>|46<br>~~es~~<br>~~e~~e<br>|GPIO<br>~~es~~<br>|
|PB05<br>i <br>ee<br>es<br>a|8<br> i~~es~~<br>i<br>ee|GPIO<br>~~es~~<br>rs<br>~~ee~~|~~es~~<br>|<br>|<br>~~ee~~|PC08<br>~~es~~<br>re<br>~~e~~<br>~~ee~~|45<br>~~es~~<br>~~e~~e<br>~~ee~~|GPIO<br>~~es~~<br>~~ee~~|
|PB04<br>ee <br>es<br>a<br>es|9<br> i<br>ee<br>i<br>|GPIO<br>rs<br>~~ee~~<br>ee|| <br>|<br>~~ee~~<br>|PC07<br> re<br>~~e~~<br>~~ee~~<br>ee|44<br>~~e~~e<br>~~ee~~<br>es|GPIO<br>~~ee~~|
|PB03<br> <br>es <br>a<br>es<br>Rs|10<br> i<br> ee<br>i<br>**es**<br>|GPIO<br>rs <br>~~ee~~<br>ee<br>~~|~~<br>|| <br>~~ee~~<br><br>~~|~~<br>|PC06<br> ~~e~~<br>~~ee~~<br>ee<br>|43<br>~~e~~e<br>~~ee~~<br>es<br>|GPIO<br>~~ee~~<br>|
|PB02<br>es<br>Rs<br>ee|11<br>i<br>**es**<br><br>|GPIO<br>ee<br>~~|~~<br>~~er~~<br>|~~|~~<br>~~er~~<br>||PC05<br>ee<br>~~er~~|42<br>es<br>~~er~~|GPIO<br>~~er~~|
|GND<br>es <br>Rs<br>ee<br>ee|12<br>i<br> **es**<br><br>i<br>|GROUND<br>ee <br>~~|~~<br>~~er~~<br>ee|<br>~~|~~<br>~~er~~<br>|<br>||PC04<br> ee <br>~~er~~<br>rs|41<br> es<br>~~er~~|GPIO<br>~~er~~|
|PB01<br> <br>Rs <br>ee<br>ee<br>es|13<br> **es**<br> <br>i<br>i<br>|GPIO<br>~~|~~<br> ~~er~~<br>ee<br>rr<br>|~~|~~<br>~~er~~<br>|<br>|<br>|<br>|PC03<br>~~er~~<br>rs<br>r~~**s**~~<br>|40<br>~~er~~<br>~~**s**~~|GPIO<br>~~er~~|
|PB00<br>ee <br>ee<br>es|14<br> i<br>i<br>|GPIO<br>ee<br>rr<br>||<br>|<br>|<br>|PC02<br>rs<br>r~~**s**~~<br>|39<br>~~**s**~~|GPIO|
|PA00<br> <br>ee <br>es|15<br> i <br> i<br> i~~e~~|GPIO<br> ee<br>rr<br>~~e~~|| <br>|<br>~~e~~|PC01<br> rs<br>r~~**s**~~<br>~~e~~|38<br>~~**s**~~|GPIO|
|PA01<br> <br>es <br>i <br>~~i~~|16<br> i<br> <br> i<br>~~i~~|GPIO<br>rr <br><br>e~~e~~<br>ee|| <br><br>~~e~~<br>||PC00<br> r~~**s**~~<br><br>~~e~~|37<br>~~**s**~~|GPIO|
|PA02<br>~~i~~|17<br>~~i~~|GPIO<br>ee|||PD00|36|GPIO|



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|**Pin Name**|**No.**|**Description**||**Pin Name**|**No.**|**Description**|
|---|---|---|---|---|---|---|
|PA03|18|GPIO||PD01|35|GPIO|
|PA04|19|GPIO||PD02|34|GPIO|
|PA05|20|GPIO||PD03|33|GPIO|
|PA06|21|GPIO||PD04|32|GPIO|
|PA07|22|GPIO||PD05|31|GPIO|
|PA08|23|GPIO||VDDIO|30|IO power supply|
|PA09|24|GPIO||GND|29|GROUND|
|GND|25|GROUND||VDD|28|Power supply|
|VDCDC|26|Test pin (internal test usage)||DECOUPLE|27|Test pin (internal test usage)|
|**Note:**<br>1. The RESETn pin is pulled up to an internal DVDD supply. An external pull-up is not recommended. To apply an external reset<br>source to this pin, it is, required to only drive this pin low during, reset, and let the internal pull-up ensure that reset is released.<br>The RESETn pin can be left unconnected if no external reset switch or source is used.|||||||



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BGM240S Bluetooth[™] SiP Module Data Sheet Pin Definitions 

## **6.2  Alternate Pin Functions** 

Some GPIOs support alternate functions like debugging, wake-up from EM4, external low frequency crystal access, etc. The following table shows both which module pins have alternate capabilities and the functions they support. Refer to the SoCs reference manual for more details. 

**Table 6.2.  GPIO Alternate Functions Table** 

|**GPIO**|**Alternate Functions**|**Alternate Functions**|**Alternate Functions**|
|---|---|---|---|
|PA00|IADC0.VREFP|||
|PA01|GPIO.SWCLK|||
|PA02|GPIO.SWDIO|||
|PA03|GPIO.SWV<br>GPIO.TDO<br>GPIO.TRACEDATA0|||
|PA04|GPIO.TDI<br>GPIO.TRACECLK|||
|PA05|GPIO.TRACEDATA1<br>GPIO.EM4WU0|||
|PA06|GPIO.TRACEDATA2|||
|PA07|GPIO.TRACEDATA3|||
|PB00|VDAC0.VDAC_CH0_MAIN_OU<br>TPUT|||
|PB01|GPIO.EM4WU3|VDAC0.VDAC_CH1_MAIN_OU<br>TPUT||
|PB02|VDAC1.VDAC_CH0_MAIN_OU<br>TPUT|||
|PB03|GPIO.EM4WU4|VDAC1.VDAC_CH1_MAIN_OU<br>TPUT||
|PC00|GPIO.EM4WU6|||
|PC01|GPIO.EFP_TX_SDA|||
|PC02|GPIO.EFP_TX_SCL|||
|PC05|GPIO.EFP_INT<br>GPIO.EM4WU7|||
|PC07|GPIO.EM4WU8|GPIO.THMSW_EN|GPIO.THMSW_HALFSWITCH|
|PD00|LFXO.LFXTAL_O|||
|PD01|LFXO.LFXTAL_I<br>LFXO.LF_EXTCLK|||
|PD02|GPIO.EM4WU9|||



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BGM240S Bluetooth[™] SiP Module Data Sheet Pin Definitions 

## **6.3  Analog Peripheral Connectivity** 

Many analog resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are available on each GPIO port. When a differential connection is being used positive inputs are restricted to the EVEN pins and negative inputs are restricted to the ODD pins. When a single ended connection is being used positive input is available on all pins. See the SoC's Reference Manual for more details on the ABUS and analog peripherals. 

**Table 6.3.  ABUS Routing Table** 

|**Peripheral**|**Signal**|**PA**|**PA**|**PB**|**PB**|**PC**|**PC**|**PD**|**PD**|
|---|---|---|---|---|---|---|---|---|---|
|||**EVEN**|**ODD**|**EVEN**|**ODD**|**EVEN**|**ODD**|**EVEN**|**ODD**|
|ACMP0|ANA_NEG|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
||ANA_POS|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
|ACMP1|ANA_NEG|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
||ANA_POS|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
|IADC0|ANA_NEG|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
||ANA_POS|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
|VDAC0|VDAC_CH0_ABUS_OUT-<br>PUT|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
||VDAC_CH1_ABUS_OUT|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
|VDAC1|VDAC_CH0_ABUS_OUT-<br>PUT|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
||VDAC_CH1_ABUS_OUT|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|



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BGM240S Bluetooth[™] SiP Module Data Sheet Pin Definitions 

## **6.4  Digital Peripheral Connectivity** 

Many digital resources are routable and can be connected to numerous GPIOs. The table below indicates which peripherals are avaliable on each GPIO port. 

**Table 6.4.  DBUS Routing Table** 

|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|---|
||**PA**|**PB**|**PC**|**PD**|
|ACMP0.DIGOUT|Available|Available|Available|Available|
|ACMP1.DIGOUT|Available|Available|Available|Available|
|CMU.CLKIN0|||Available|Available|
|CMU.CLKOUT0|||Available|Available|
|CMU.CLKOUT1|||Available|Available|
|CMU.CLKOUT2|Available|Available|||
|EUSART0.CS|Available|Available|||
|EUSART0.CTS|Available|Available|||
|EUSART0.RTS|Available|Available|||
|EUSART0.RX|Available|Available|||
|EUSART0.SCLK|Available|Available|||
|EUSART0.TX|Available|Available|||
|EUSART1.CS|Available|Available|Available|Available|
|EUSART1.CTS|Available|Available|Available|Available|
|EUSART1.RTS|Available|Available|Available|Available|
|EUSART1.RX|Available|Available|Available|Available|
|EUSART1.SCLK|Available|Available|Available|Available|
|EUSART1.TX|Available|Available|Available|Available|
|FRC.DCLK|||Available|Available|
|FRC.DFRAME|||Available|Available|
|FRC.DOUT|||Available|Available|
|HFXO0.BUFOUT_REQ_IN_ASYNC|Available|Available|||
|I2C0.SCL|Available|Available|Available|Available|
|I2C0.SDA|Available|Available|Available|Available|
|I2C1.SCL|||Available|Available|
|I2C1.SDA|||Available|Available|
|KEYSCAN.COL_OUT_0|Available|Available|Available|Available|
|KEYSCAN.COL_OUT_1|Available|Available|Available|Available|
|KEYSCAN.COL_OUT_2|Available|Available|Available|Available|
|KEYSCAN.COL_OUT_3|Available|Available|Available|Available|
|KEYSCAN.COL_OUT_4|Available|Available|Available|Available|



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Pin Definitions 

|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|---|
||**PA**|**PB**|**PC**|**PD**|
|KEYSCAN.COL_OUT_5|Available|Available|Available|Available|
|KEYSCAN.COL_OUT_6|Available|Available|Available|Available|
|KEYSCAN.COL_OUT_7|Available|Available|Available|Available|
|KEYSCAN.ROW_SENSE_0|Available|Available|||
|KEYSCAN.ROW_SENSE_1|Available|Available|||
|KEYSCAN.ROW_SENSE_2|Available|Available|||
|KEYSCAN.ROW_SENSE_3|Available|Available|||
|KEYSCAN.ROW_SENSE_4|Available|Available|||
|KEYSCAN.ROW_SENSE_5|Available|Available|||
|LETIMER0.OUT0|Available|Available|||
|LETIMER0.OUT1|Available|Available|||
|MODEM.ANT0|Available|Available|Available|Available|
|MODEM.ANT1|Available|Available|Available|Available|
|MODEM.ANT_ROLL_OVER|||Available|Available|
|MODEM.ANT_RR0|||Available|Available|
|MODEM.ANT_RR1|||Available|Available|
|MODEM.ANT_RR2|||Available|Available|
|MODEM.ANT_RR3|||Available|Available|
|MODEM.ANT_RR4|||Available|Available|
|MODEM.ANT_RR5|||Available|Available|
|MODEM.ANT_SW_EN|||Available|Available|
|MODEM.ANT_SW_US|||Available|Available|
|MODEM.ANT_TRIG|||Available|Available|
|MODEM.ANT_TRIG_STOP|||Available|Available|
|MODEM.DCLK|Available|Available|||
|MODEM.DIN|Available|Available|||
|MODEM.DOUT|Available|Available|||
|PCNT0.S0IN|Available|Available|||
|PCNT0.S1IN|Available|Available|||
|PRS.ASYNCH0|Available|Available|||
|PRS.ASYNCH1|Available|Available|||
|PRS.ASYNCH2|Available|Available|||
|PRS.ASYNCH3|Available|Available|||
|PRS.ASYNCH4|Available|Available|||
|PRS.ASYNCH5|Available|Available|||
|PRS.ASYNCH6|||Available|Available|



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BGM240S Bluetooth[™] SiP Module Data Sheet 

Pin Definitions 

|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|---|
||**PA**|**PB**|**PC**|**PD**|
|PRS.ASYNCH7|||Available|Available|
|PRS.ASYNCH8|||Available|Available|
|PRS.ASYNCH9|||Available|Available|
|PRS.ASYNCH10|||Available|Available|
|PRS.ASYNCH11|||Available|Available|
|PRS.ASYNCH12|Available|Available|||
|PRS.ASYNCH13|Available|Available|||
|PRS.ASYNCH14|Available|Available|||
|PRS.ASYNCH15|Available|Available|||
|PRS.SYNCH0|Available|Available|Available|Available|
|PRS.SYNCH1|Available|Available|Available|Available|
|PRS.SYNCH2|Available|Available|Available|Available|
|PRS.SYNCH3|Available|Available|Available|Available|
|RAC.LNAEN|Available|Available|Available|Available|
|RAC.PAEN|Available|Available|Available|Available|
|TIMER0.CC0|Available|Available|Available|Available|
|TIMER0.CC1|Available|Available|Available|Available|
|TIMER0.CC2|Available|Available|Available|Available|
|TIMER0.CDTI0|Available|Available|Available|Available|
|TIMER0.CDTI1|Available|Available|Available|Available|
|TIMER0.CDTI2|Available|Available|Available|Available|
|TIMER1.CC0|Available|Available|Available|Available|
|TIMER1.CC1|Available|Available|Available|Available|
|TIMER1.CC2|Available|Available|Available|Available|
|TIMER1.CDTI0|Available|Available|Available|Available|
|TIMER1.CDTI1|Available|Available|Available|Available|
|TIMER1.CDTI2|Available|Available|Available|Available|
|TIMER2.CC0|Available|Available|||
|TIMER2.CC1|Available|Available|||
|TIMER2.CC2|Available|Available|||
|TIMER2.CDTI0|Available|Available|||
|TIMER2.CDTI1|Available|Available|||
|TIMER2.CDTI2|Available|Available|||
|TIMER3.CC0|||Available|Available|
|TIMER3.CC1|||Available|Available|
|TIMER3.CC2|||Available|Available|



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Rev. 1.0  |  35 

BGM240S Bluetooth[™] SiP Module Data Sheet 

Pin Definitions 

|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|---|
||**PA**|**PB**|**PC**|**PD**|
|TIMER3.CDTI0|||Available|Available|
|TIMER3.CDTI1|||Available|Available|
|TIMER3.CDTI2|||Available|Available|
|TIMER4.CC0|Available|Available|||
|TIMER4.CC1|Available|Available|||
|TIMER4.CC2|Available|Available|||
|TIMER4.CDTI0|Available|Available|||
|TIMER4.CDTI1|Available|Available|||
|TIMER4.CDTI2|Available|Available|||
|USART0.CLK|Available|Available|Available|Available|
|USART0.CS|Available|Available|Available|Available|
|USART0.CTS|Available|Available|Available|Available|
|USART0.RTS|Available|Available|Available|Available|
|USART0.RX|Available|Available|Available|Available|
|USART0.TX|Available|Available|Available|Available|



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Rev. 1.0  |  36 

BGM240S Bluetooth[™] SiP Module Data Sheet Design Guidelines 

## **7.  Design Guidelines** 

## **7.1  Layout and Placement** 

For optimal performance of the BGM240S the following guidelines are recommended: 

- Place the module 1.50 mm from the edge of the copper “keep-in” area at the middle of the long edge of the application PCB, as illustrated in Figure 7.1 on page 37. 

- Copy the exact design from Figure 7.2 on page 38 with the values for coordinates A to L given in Table 7.1 Antenna Polygon Coordinates, Referenced to Center of BGM240S on page 38. 

- Make a cutout in all lower layers aligned with the right edge and the bottom edge of the integral loop antenna as indicated by the red box in Figure 7.3 Antenna Clearance in Inner and Bottom Layers on page 39. 

- Connect all ground pads directly to a solid ground plane in the top layer. 

- Connect 2G4IO to ANT_IN through a 0-ohm resistor. 

- The 0-ohm gives the ability to test conducted and to evaluate the antenna impedance in the design. 

- Place ground vias as close to the ground pads of the BGM240S as possible. 

- Place ground vias along the antenna loop right and bottom side. 

- Place ground vias along the edges of the application board. 

- Do not place plastic or any other dielectric material in contact with the antenna. 

- A minimum clearance of 0.5 mm is advised. 

- Solder mask, conformal coating and other thin dielectric layers are acceptable directly on top of the antenna region. 

- Proper module placement and electrical connection should be ensured by measuring radiated output power from antenna. 

- Impedance of the antenna can be verified by measuring S11 at ANT_IN pin that is corresponding antenna specification. 

- With an external antenna, use a 50Ω trace to connect RF signal to the antenna, as it is illustrated in Figure 7.4 Recommended Layout for BGM240S (External Antenna) on page 39 

**Figure 7.1.  Recommended Layout for BGM240S (Integral Antenna)** 

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BGM240S Bluetooth[™] SiP Module Data Sheet Design Guidelines 

**Figure 7.2.  TOP Layer Antenna Layout With Coordinates** 

**Table 7.1.  Antenna Polygon Coordinates, Referenced to Center of BGM240S** 

|**Point**|**Coordinate**|
|---|---|
|A|(2.10, 3.30)|
|B|(2.40, 3.30|
|C|(2.40, 4.20)|
|D|(2.10, 5.00)|
|E|(7.35, 5.00)|
|F|(7.35, 4.20)|
|G|(7.35, -0.03)|
|H|(6.59, -0.30)|
|I|(3.39, 2.90)|
|J|(3.05, 2.90)|
|K|(2.27, 2.13)|
|L|(-0.08, 2.13)|
|M|(-0.08, 5.00)|



Tolerance for the coordinates is +/- 0.05 mm. 

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Rev. 1.0  |  38 

BGM240S Bluetooth[™] SiP Module Data Sheet Design Guidelines 

**Figure 7.3.  Antenna Clearance in Inner and Bottom Layers** 

**Figure 7.4.  Recommended Layout for BGM240S (External Antenna)** 

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Rev. 1.0  |  39 

BGM240S Bluetooth[™] SiP Module Data Sheet Design Guidelines 

## **7.2  Best Design Practices** 

The design of a good RF system relies on thoughtful placement and routing of the RF signals. The following guidelines are recommended: 

- Place the BGM240S and antenna close to the center of the longest edge of the application board. 

- Do not place any circuitry between the board edge and the antenna. 

- Make sure to tie all GND planes in the application board together with as many vias as can be fitted. 

- Generally ground planes are recommended in all areas of the application board except in the antenna keep-out area shown in Figure 7.3 Antenna Clearance in Inner and Bottom Layers on page 39. 

- Open-ended stubs of copper in the outer layer ground planes must be removed if they are more than 5 mm long to avoid radiation of spurious emissions. 

- The width of the GND plane to the sides of the BGM240S will impact the efficiency of the on-board integral loop antenna. 

- To achieve optimal performance, a GND plane width of 55 mm is recommended as seen on Figure 7.5 Illustration of Recommended Board Width on page 40. 

- See 4.16.1 Antenna Typical Characteristics for reference. Figure 7.6 Non-Recommended Layout Examples on page 41 illustrates layout scenarios that will lead to severely degraded RF performance for the application board. 

**Figure 7.5.  Illustration of Recommended Board Width** 

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Rev. 1.0  |  40 

BGM240S Bluetooth[™] SiP Module Data Sheet Design Guidelines 

**Figure 7.6.  Non-Recommended Layout Examples** 

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Rev. 1.0  |  41 

BGM240S Bluetooth[™] SiP Module Data Sheet Design Guidelines 

## **7.3  Radio Performance vs. Carrier Board Size** 

As with most applications, the carrier board size is determined by the overall form factor or size of the additional circuitry. The recommended carrier board width of 55 mm is thus not always possible in the end-application. If another form factor is required, the antenna performance of the integrated antenna will likely be compromised, but it may still be sufficiently good for providing the required link quality and range of the end-application. As can be seen in Figure 7.7 on page 42, the best performance is achieved for a carrier board size of 55 mm x 30, with relatively constant performance for larger boards and rapidly declining performance for smaller boards. 

**WARNING** : Any antenna tuning, and/or change of the loop dimensions, is likely to invalidate a modular certification, unless it is done to compensate for the degradation caused by a host board deviating in size from the manufacturer's best-case reference. Separate guidance might be provided by the manufacturer to address this particular kind of degradation, in which case a Permissive Change to the modular approval might not even become necessary: however, since this is evaluated on a case-by-case basis, please consult your certification house on the best approach. 

**Figure 7.7.  Efficiency of the Integrated Antenna as Function of the Carrier Board Size for BGM240S** 

## **7.4  Impact of Human Body and Other Materials in Close Proximity** 

Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range. 

Avoid placing plastic or any other dielectric material in close proximity to the antenna. Conformal coating and other thin dielectric layers are acceptable directly on top of the antenna region, but this will also negatively impact antenna efficiency and reduce range. 

Any metallic objects in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended distance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCB ground planes. 

## **7.5  Reset** 

The BGM240S can be reset by pulling the RESET line low, by the internal watchdog timer, or by software command. 

The reset state does not provide power saving functionality and it is not recommended as a means to conserve power. 

## **7.6  Debug** 

See _AN958: Debugging and Programming Interfaces for Custom Designs_ . 

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BGM240S Bluetooth[™] SiP Module Data Sheet Design Guidelines 

The BGM240S supports hardware debugging via 4-pin JTAG or 2-pin serial-wire debug (SWD) interfaces. It is recommended to expose the debug pins in your own hardware design for firmware update and debug purposes. The table below lists the required pins for JTAG and SWD debug interfacing, which are also presented in Section 6.2 Alternate Pin Functions. 

If JTAG interfacing is enabled, the module must be power cycled to return to a SWD debug configuration if necessary. 

**Table 7.2.  Debug Pins** 

|**Pin Name**|**JTAG Signal**|**SWD Signal**|**Comments**|
|---|---|---|---|
|PA04|TDI|N/A|This pin is disabled after reset. Once enabled the pin has a built-in<br>pull-up.|
|PA03|TDO|N/A|This pin is disabled after reset.|
|PA02|TMS|SWDIO|Pin is enabled after reset and has a built-in pull-up.|
|PA01|TCK|SWCLK|Pin is enabled after reset and has a built-in pull-down.|



## **7.7  Packet Trace Interface (PTI)** 

The BGM240S integrates a true PHY-level packet trace interface (PTI) peripheral that can capture packets non-intrusively to monitor and log device and network traffic without burdening processing resources in the module's SoC. The PTI generates two output signals that can serve as a powerful debugging tool, especially in conjunction with other hardware and software development tools available from Silicon Labs. The PTI_DATA and PTI_FRAME signals can be accessed through any GPIO on ports C and D (see FRC.DOUT and FRC.DFRAME peripheral resources in Section 6. Pin Definitions. 

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BGM240S Bluetooth[™] SiP Module Data Sheet Package Specifications 

## **8.  Package Specifications** 

**8.1  Package Outline** 

**Figure 8.1.  Top and Side Views** 

**Figure 8.2.  Bottom View** 

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Rev. 1.0  |  44 

BGM240S Bluetooth[™] SiP Module Data Sheet Package Specifications 

**Figure 8.3.  Bottom View about Package Corner** 

**Table 8.1.   QFN40 Package Dimensions** 

|**Dimension**|**Min**|**Typ**|**Max**|
|---|---|---|---|
|A|1.080|1.180|1.280|
|A1|0.140|0.180|0.220|
|A2|0.950|1.000|1.050|
|b|0.200|0.250|0.300|
|D|7.000 BSC|||
|D1|5.5000 BSC|||
|e|0.500 BSC|||
|E|7.000 BSC|||
|E1|5.500 BSC|||
|L|0.300|0.350|0.400|
|L1|0.125|0.175|0.225|
|L2|0.575|0.625|0.675|
|L3|0.450|0.500|0.550|
|eD1|0.450 BSC|||
|eD2|0.900 BSC|||
|eE1|0.450 BSC|||
|eE2|0.900 BSC|||
|aaa|0.100|||
|bbb|0.100|||
|ccc|0.100|||
|ddd|0.100|||
|eee|0.100|||



1. All dimensions shown are in millimeters (mm) unless otherwise noted. 

2. The dimensions in parenthesis are reference. 

3. Hatching lines indicate package shielding area 

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BGM240S Bluetooth[™] SiP Module Data Sheet Package Specifications 

## 4. Unless otherwise specified, Decimal tolerances are: 

   - X.X = +/- 0.1 

   - X.XX = +/- 0.05 

   - X.XXX = +/- 0.03 

5. Unless otherwise specified, Angular tolerances are: 

   - +/- 0.1 (in Deg) 

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Rev. 1.0  |  46 

BGM240S Bluetooth[™] SiP Module Data Sheet Package Specifications 

## **8.2  PCB Land Pattern** 

**Figure 8.4.  Recommended Land Pattern for Modules with a Built-in Antenna** 

**Table 8.2.  PCB Land Pattern Dimensions** 

|**Dimension**|**Typ**|
|---|---|
|C1|6.43|
|C2|6.43|
|W|0.35|
|L|0.35|
|e|0.5|
|L1|0.50|
|X1|0.45|
|Y1|0.45|
|S1|6.08|
|S2|6.08|
|e1|0.90|



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BGM240S Bluetooth[™] SiP Module Data Sheet Package Specifications 

**Dimension** 

## **Typ** 

## **Note:** 

1. All dimensions shown are in millimeters (mm) unless otherwise noted. 

2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 

3. This Land Pattern Design is based on IPC-SM-782 guidelines. 

4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05mm. 

5. All pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60um minimum, all the way around the pad. 

6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 7. The stencil thickness should be 0.125mm (5 mils). 

8. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads. 

9. A No-Clean, Type-3 solder paste is recommended. 

10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 

11. _**Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different parameters and fine tune their SMT process as required for their application and tooling.**_ 

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BGM240S Bluetooth[™] SiP Module Data Sheet Package Specifications 

## **8.3  Package Marking** 

**Figure 8.5.  BGM240S Top Marking** 

**Table 8.3.  Top Marking Definition** 

|**OPN**|**Line 1 Marking**|**Line 2 Marking**|**Line 3 Marking**|**Line 4 Marking**|
|---|---|---|---|---|
|BGM240SA22VNA2|BGM240S22A|SA22VNA2|See note 1|See note 2|
|BGM240SA22VNA2R|BGM240S22A|SA22VNA2|See note 1|See note 2|
|BGM240SB22VNA2|BGM240S22A|SB22VNA2|See note 1|See note 2|
|BGM240SB22VNA2R|BGM240S22A|SB22VNA2|See note 1|See note 2|



## **Note:** 

1. YY = Year. WW = Work Week, TTTTTTT = Trace Code 

2. Country of Origin ISO Code Abbreviation to be marked as specified in mark instructions of PO. 

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Rev. 1.0  |  49 

BGM240S Bluetooth[™] SiP Module Data Sheet Soldering Recommendations 

## **9.  Soldering Recommendations** 

It is recommended that final PCB assembly of the BGM240S follows the industry standard as identified by the Institute for Printed Circuits (IPC). This product is assembled in compliance with the J-STD-001 requirements and the guidelines of IPC-AJ-820. Surface mounting of this product by the end user is recommended to follow IPC-A-610 to meet or exceed class 2 requirements. 

## **CLASS 1 General Electronic Products** 

Includes products suitable for applications where the major requirement is function of the completed assembly. 

## **CLASS 2 Dedicated Service Electronic Products** 

Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically the end-use environment would not cause failures. 

## **CLASS 3 High Performance/Harsh Environment Electronic Products** 

Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems. 

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BGM240S Bluetooth[™] SiP Module Data Sheet Tray and Reel 

## **10.  Tray and Reel** 

BGM240S modules are delivered to the customer in Tray or reel. Find the packaging dimensions below. All dimensions are given in mm unless otherwise indicated. 

**==> picture [386 x 263] intentionally omitted <==**

**Figure 10.1.  Carrier Tape Dimensions** 

**==> picture [211 x 240] intentionally omitted <==**

**==> picture [45 x 223] intentionally omitted <==**

**==> picture [43 x 98] intentionally omitted <==**

**==> picture [78 x 88] intentionally omitted <==**

**==> picture [160 x 36] intentionally omitted <==**

**Figure 10.2.  Reel Dimensions** 

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BGM240S Bluetooth[™] SiP Module Data Sheet Certifications 

## **11.  Certifications** 

This section details the regulatory certification status of the module in various regions. 

The address for the module manufacturer and certification applicant is: 

SILICON LABORATORIES FINLAND OY Alberga Business Park, Bertel Jungin aukio 3, 02600 Espoo, Finland 

## **11.1  Qualified Antennas** 

The BGM240S modules have been tested and certified both with the built-in integral antenna and with a reference external antenna attached to the module's RF pin denoted as RFOUT. The antenna impedance is 50 Ω. 

Performance characteristics for the built-in antenna are presented in 3.3 Antenna and 4.16 Typical Performance Curves. The details of the qualified external antenna are summarized in the table below. 

## **Table 11.1.  Qualified External Antennas for BGM240S** 

|**Antenna Type**|**Maximum Gain**|**Impedance**|
|---|---|---|
|Connectorized Coaxial Dipole|2.8 dBi|50 Ω|



Any external antenna of the same general type and of equal or less directional gain compared to the one listed in the above table, and having similar in-band and out-of-band characteristics, can be used in the regulatory areas that have modular radio approvals, such as USA and Canada, as long as spot-check testing of the host is performed to verify that no performance changes compromising compliance have been introduced. In the particular FCC case, in order to comply with e-CFR Title 47, Part 15, Subpart C, Section 15.203, the module integrator using an external antenna must ensure it has a unique connector or it is nondetachable. 

In countries applying the ETSI standards, where manufacturers issue a self-Declaration of Conformity before placing products in the market, like in the EU countries, the radiated emissions are always tested with the end-product and the antenna type is not critical, but antennas with higher gain may violate some of the regulatory limits. 

When using instead an external antenna of a different type (such as a chip antenna, a PCB trace antenna, or a patch) or having nonsimilar in-band and out-of-band characteristics, but still with a gain less than or equal to the maximum gain listed in the table above, in principle it can be added to an existing modular grant/certificate by mean of a permissive change (for example with FCC and ISED), or by the administrative registration of such additional antenna (for example with MIC and KC). In many of these cases, some radiated emission testing is demanded, but no modular or end-product re-certification is required. 

On the other hand, all products with external antennas having more gain than the maximum gain listed in the table above are very likely to require a full new end-product certification. Since the exact permissive change or registration or re-certification procedure is chosen on a case-by-case basis, please consult your certification house and/or a certification body for understanding the correct approach based on your unique design. You might also want or need to get in touch with Silicon Labs for any authorization letter that your certification body might ask for. 

## **11.2  CE and UKCA - EU and UK** 

The BGM240S modules have been tested against the relevant harmonized/designated standards and are in conformity with the essential requirements and other relevant requirements of the EU's Radio Equipment Directive (RED) (2014/53/EU) and of the UK's Radio Equipment Regulations (RER) (S.I. 2017/1206). 

Please notice that every end-product integrating a BGM240S module will need to perform the radio EMC tests on the whole assembly, according to the ETSI 301 489-x relevant standards. 

Furthermore, it is ultimately the responsibility of the manufacturers to ensure the compliance of their end-products as a whole. The specific product assembly is likely to have an impact to RF radiated characteristics, when compared to the bare module. Hence, manufacturers should carefully consider RF radiated testing with the final product assembly, especially taking into account the gain of the external antenna if any, and the possible deviations in the PSD, EIRP and spurious emissions measurements, as defined in the ETSI EN 300 328 standard. 

The modules are entitled to carry the CE and UKCA Marks, and a formal Declaration of Conformity (DoC) is available at the product web page which is reachable starting from https://www.silabs.com/. 

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BGM240S Bluetooth[™] SiP Module Data Sheet Certifications 

## **11.3  FCC - USA** 

This device complies with FCC's e-CFR Title 47, Part 15, Subpart C, Section 15.247 (and related relevant parts of the ANSI C63.10 standard) when operating with the built-in integral antenna or with an external antenna type as discussed in Section 11.1 Qualified Antennas. 

Operation is subject to the following two conditions: 

1. This device may not cause harmful interference, and 

2. This device must accept any interference received, including interference that may cause undesirable operation. 

Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment. 

## **FCC RF Radiation Exposure Statement** 

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. 

This transmitter meets the Mobile requirements at a distance of 20 cm and above from the human body, in accordance to the limit(s) exposed in the RF Exposure Analysis. This transmitter also meets the Portable requirements at distances equal or above those reported in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 59. 

This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. 

## **OEM Responsibilities to comply with FCC Regulations** 

This module has been tested for compliance to FCC Part 15. 

OEM integrators are responsible for testing their end-product for any additional compliance requirements needed with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). 

Additionally, investigative measurements and spot-checking are strongly recommended to verify that the full system compliance is maintained when the module is integrated, even with a module having a full modular approval, in accordance with the "Host Product Testing Guidance" in FCC's KDB 996369 D04 Module Integration Guide V01. 

- **General Considerations** 

This transmitter module is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B (unintentional radiator) rule requirement, which is typically applicable to the final host. The final host will still need to be assessed for compliance to this portion of the rule requirements, if applicable. 

- **Manual Information to the End User** 

The OEM integrator has to be aware not to provide information to the end-user regarding how to install or remove this RF module, or how to change RF related parameters, in the user’s manual of the final product which integrates this module. 

The end user manual shall include all required regulatory information/warnings as shown in this manual. 

## • **Host Manufacturer Responsibilities** 

Host manufacturers are ultimately responsible for the full compliance of their host system. The final product is supposed to be assessed against all the essential requirements of the FCC rules, such as FCC Part 15 Subpart B, before it can be placed on the US market. This includes re-assuring the compliance of the radio transmitter with the RF and EMF essential requirements of the FCC rules. The modular radio transmitter must not be incorporated into any other radio-equipped device or system without retesting for compliance as multi-radio and combined equipment. 

Except for minor (cosmetic) modifications, most changes to an FCC certified equipment require preliminary testing to determine whether any of such changes is leading to a Class I or Class II Permissive Change. For more details about using the Single Modular Transmitter, refer to the following FCC documents: 

- KDB 996369 D01 Transmitter Module Equipment Authorization Guide 

- KDB 996369 D02 Frequently Asked Questions and Answers about Modules 

- KDB 178919 D01 Permissive Change Policy 

- KDB 178919 D02 Permissive Change Frequently-Asked Questions 

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BGM240S Bluetooth[™] SiP Module Data Sheet Certifications 

## **Separation** 

- To meet the SAR exemption for portable conditions, the minimum separation distance indicated in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 59 must be maintained between the human body and the radiator (antenna) at all times. 

- This transmitter module is tested in a standalone RF Exposure condition, and in case of any co-located radio transmitter being allowed to transmit simultaneously, or in case of portable use at closer distances from the human body than those allowing the exceptions rules to be applied, a separate additional SAR evaluation, or a reduction in the max output power or in the duty-cycle, might be required for the host, ultimately leading to a Class II Permissive Change, or more rarely to a new grant. 

- **Important Note:** In the event that the conditions for the exemption cannot be met, the final product will likely have to undergo additional testing to evaluate the RF Exposure, or go through some re-configuration of the max output power and/or duty-cycle in order for the FCC authorization to remain valid, and a permissive change will have to be applied. The SAR evaluation (and/or re-configuration) is under the responsibility of the end-product’s manufacturer, as well as the permissive change that can be carried out with the help of the customer's own Telecommunication Certification Body, following a Change in ID authorization by the module's original grant holder. 

## **End Product Labeling** 

BGM240S modules are not labeled with their own FCC ID due their very small size. Instead, the anti-static bags containing the modules' reels or trays come with a special label displaying the FCC ID. In all those cases when the module's FCC ID is not visible after the module is installed inside another device, then the outside of the device into which the module is installed must also have a label with a reference to the enclosed module. In that case, the final product must be labeled in a visible area with the following: 

## **"Contains Transmitter Module FCC ID: QOQ-GM240S"** 

or 

## **"Contains FCC ID: QOQ-GM240S"** 

**Final note** : As long as all the conditions in this and all the above chapters are met, further RF testing of the transmitter will not be strictly required. However, still consider the good practice and the FCC strong recommendation to ensure the compliance of the host by spot-checking. Nevertheless, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements which might be mandatory with this module installed. 

## **Class B Device Notice** 

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: 

- Reorient or relocate the receiving antenna 

- Increase the separation between the equipment and receiver 

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected 

- Consult the dealer or an experienced radio/TV technician for help 

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BGM240S Bluetooth[™] SiP Module Data Sheet Certifications 

## **11.4  ISED - Canada** 

This radio transmitter (IC: 5123A-GM240S) has been approved by _Innovation, Science and Economic Development Canada (ISED Canada, formerly Industry Canada_ ) to operate with the built-in integral antenna and with the antenna type(s) listed in Section 11.1 Qualified Antennas, with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain listed, are strictly prohibited for use with this device. 

- This radio-equipped device complies with ISED's license-exempt RSS standards. Operation is subject to the following two conditions: 1. This device may not cause interference; and 

2. This device must accept any interference, including interference that may cause undesired operation of the device 

## **RF Exposure Statement** 

Exception from routine SAR evaluation limits are given in RSS-102 Issue 5. 

The module meets the requirements for Mobile use cases when the minimum separation distance from the human body is 20 cm or greater, in accordance to the limit(s) exposed in the RF Exposure Analysis. 

For Portable use cases, RF exposure or SAR evaluation is not required when the separation distances from the human body are equal or above those reported in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 59. 

If the separation distance from the human body is less than the values stated in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 59, then the OEM integrator is responsible for evaluating the SAR with the end-product, or for the reconfiguration of the radio module in the host in terms of lowering the max RF TX power and/or the duty-cycle. A permissive change would be required too, under the responsibility of the host manufacturer, following a Multiple Listing authorization by the original module's certificate holder. 

## **OEM Responsibilities to comply with IC Regulations** 

The BGM240S modules have been certified for integration into products only by OEM integrators under the following conditions: 

- The antenna must be installed so as to maintain the intended minimum separation distance between the radiator (antenna) and all persons at all times. Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 59 indicates the distances in accordance to the use cases. 

- The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. 

**Important Note:** In the event that the above conditions cannot be met, the final product will have to undergo additional testing to evaluate the RF Exposure, or go through some re-configuration of the max output power and/or duty-cycle in order for the ISED authorization to remain valid. A permissive change will have to be applied too **.** The RF Exposure evaluation (SAR, or possibly a re-configuration) is under the responsibility of the end-product's manufacturer, as well as the permissive change that can be carried out with the help of the customer's own Telecommunication Certification Body, following a Multiple Listing authorization by the module's original grant holder. 

## **End Product Labeling** 

The BGM240S modules are not labeled with their own IC ID due their very small size. Instead, the anti-static bags containing the modules' reels or trays come with a special label displaying the IC ID. In all those cases when the module's IC ID is not visible after the module is installed inside another device, then the outside of the device into which the module is installed must also have a label with a reference to the enclosed module. In that case, the final product must be labeled in a visible area with the following: 

## “ **Contains Transmitter Module IC: 5123A-GM240S** ” 

## or 

## “ **Contains IC: 5123A-GM240S”** 

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end-product. 

As long as all the conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). 

## **CAN ICES-003 (B)** 

This Class B digital apparatus complies with Canadian ICES-003. 

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## **ISED (Français)** 

Le présent émetteur radio (IC: 5123A-GM240S) a été approuvé par Innovation, Sciences et Développement Économique Canada (ISED Canada, anciennement Industrie Canada) pour fonctionner avec l'antenne intégrée et le ou les types d'antenne énumérés à la section 11.1 Qualified Antennas, avec le gain maximal admissible indiqué. Les types d'antenne non inclus dans cette liste, ayant un gainsupérieur au gain maximal indiqué, sont strictement interdits d'utilisation avec cet appareil. . 

L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes: 

1. L’appareil ne doit pas produire de brouillage; 

2. L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptibled’en compromettre le fonctionnement. 

## **Déclaration d'exposition RF** 

L'exception tirée des limites courantes d'évaluation SAR est donnée dans le document RSS-102 Issue 5. 

Le module répond aux exigences pour les cas d'utilisation Mobile lorsque la distance minimale de séparation du corps humain est de 20 cm ou plus, conformément à la (aux) limite(s) exposée(s) dans l'analyse de l'exposition RF. 

Pour les cas d'utilisation Portables, l'évaluation de l'Exposition RF ou l'évaluation SAR n'est pas requise lorsque les distances de séparation du corps humain sont égales ou supérieures à celles indiquées dans le tableau 11.2 à la page 57. 

Si la distance de séparation du corps humain est inférieure aux valeurs indiquées dans le tableau 11.2 à la page 57, l'intégrateur OEM est responsable de l'évaluation du SAR avec le produit final, ou de la reconfiguration du module radio dans l'hôte en termes de réduction de la puissance RF TX maximale et/ou du rapport cyclique. Une modification permissive serait également nécessaire, sous la responsabilité du fabricant de l'hôte, suite à une autorisation de cotation multiple par le titulaire du certificat du module d'origine. 

## **Responsabilités du fabricant de se conformer à la réglementation IC** 

Le module a été certifié pour l'intégration dans les produits uniquement par les intégrateurs OEM dans les conditions suivantes: 

- L'antenne doit être installée de manière à maintenir une distance de séparation minimale entre le radiateur (antenne) et toutes les personnes à tout moment. Le tableau 11.2 à la page 57 indique les distances en fonction des cas d'utilisation. 

- Le module émetteur ne doit pas être localisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur. 

**Remarque Importante:** au cas où ces conditions ne pourraient pas être remplies, le produit final devra être soumis à des tests supplémentaires pour évaluer l'exposition RF, ou passer par une reconfiguration de la puissance de sortie maximale et/ou du rapport cyclique, afin que l'autorisation ISED reste valable; une modification permissive devra également être appliqué. L'évaluation de l'exposition aux radiofréquences (SAR, ou éventuellement une reconfiguration) est sous la responsabilité du fabricant du produit final, ainsi que le changement permissif qui peut être effectué avec l'aide de l'organisme de certification des télécommunications du client, après autorisation de cotation multiple par le titulaire de la certification du module. 

## **Étiquetage des produits finis** 

Les modules BGM240S ne sont pas étiquetés avec leur propre IC ID en raison de leur taille. Au lieu de cela, l'étiquette d'emballage contient l'ID IC. Dans tous ces cas, si l'ID IC n'est pas visible après l'installation du module à l'intérieur d'un autre appareil, alors l'extérieur de l'appareil dans lequel le module est installé doit également afficher une étiquette faisant référence au module inclus. Dans ce cas, le produit final doit être étiqueté dans une zone visible avec les éléments suivants: 

## “ **Contient le module transmetteur IC: 5123A-GM240S** ” 

## ou 

## “ **Contient IC: 5123A-GM240S”** 

L’intégrateur OEM doit être conscient de ne pas fournir à l’utilisateur final d’informations sur la procédure d’installation ou de retrait de ce module RF ni sur la modification des paramètres liés à la RF dans le manuel d’utilisation du produit final. 

Tant que toutes les conditions ci-dessus sont remplies, aucun test supplémentaire de l'émetteur ne sera nécessaire. Toutefois, l’intégrateur OEM reste responsable de l’essai de son produit final pour déterminer les exigences de conformité supplémentaires requises avec ce module installé (par exemple, émissions d’appareils numériques, exigences relatives aux périphériques PC, etc.) 

## **CAN ICES-003 (B)** 

Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003. 

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BGM240S Bluetooth[™] SiP Module Data Sheet Certifications 

## **11.5  MIC - Japan** 

The BGM240S modules are certified in Japan with following certification numbers: 

## 020-220206 

It is the end-product manufacturer's responsibility to ensure that a module is configured to meet the compliance limits, as documented in the formal certification test report(s) being available at www.silabs.com. Refer to the API reference manual(s) to learn for example how to configure (limit) the maximum RF TX power for the normal operations, and refer as well to the power setting tables in the test report(s) in order to realize the maximum output power allowed for the regulatory compliance in Japan. 

Manufacturers integrating a radio module into their host equipment are supposed to make the certification mark and the certification number visible on the outside of the host equipment. This combination of mark and number, and their relative placement, is depicted in Figure 11.1, and depending on the overall size it might also appear among the top shield markings of the radio module. The certification mark and certification number must be placed close to the text in the Japanese language which is provided below. This requirement in the Radio Law has been made in order to enable users of the combination of host and radio module to verify if they are actually using a radio device which is approved for use in Japan. 

Certification Text to be Placed on the Outside Surface of the Host Equipment: 

Translation of the text: 

“This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law.” 

The "Giteki" Mark shown in the following figures must be affixed to an easily noticeable section of the specified radio-enabled host equipment. Note that such section may be required to contain additional information if the end-device embedding the module is also subject to a Telecom approval. 

The manufacturer of the final product is also responsible to provide a Japanese language version of the User Manual and/or Installation Instructions as a companion document coming with the final product when placed on the market in Japan. Such a document will have to mention the integrated radio component and the related certification information. 

**Figure 11.1.  GITEKI Mark and ID** 

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BGM240S Bluetooth[™] SiP Module Data Sheet Certifications 

**Figure 11.2.  Detail of GITEKI Mark** 

## **11.6  KC - South Korea** 

The BGM240S modules have a RF registration for import and use in South Korea. 

Registration number is R-R-BGT-GM240S. 

These modules are meant to be integrated into end-products, which then become exempted from doing the RF emission testing, as long as the recommended design guidance is followed, and as long as, where applicable, the approved external antennas are used and any additional transmit power backoff is implemented in accordance to the measurements and configurations seen in the formal test report(s). 

EMC testing and any other relevant test applicable to the end-product as a whole, plus appropriate labeling of the end-product, might still be required for the full regulatory compliance in the country. 

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BGM240S Bluetooth[™] SiP Module Data Sheet Certifications 

## **11.7  RF Exposure and Proximity to Human Body** 

When using the BGM240S modules in an application where the radio-equipped end-product is located close to the human body, the human RF Exposure must be taken into account. FCC, ISED, and CE all have different standards and rules for evaluating the RF Exposure. In particular, each regulator has different requirements when it comes to the exemption from having to perform RF Exposure and SAR (Specific Absorption Rate) measurements, and the minimum separation distances between the module's antenna and the human body varies accordingly. The properties of the BGM240S modules allow for the minimum separation distances detailed in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 59 for the SAR evaluation exemption in portable use cases (less than 20 cm from human body). The module is approved for the Mobile use case (more than 20 cm) without any need for RF Exposure evaluation. 

**Table 11.2.  Minimum Separation Distances for SAR Evaluation Exemption** 

|**Certification**|**BGM240S22A, Bluetooth**|
|---|---|
|FCC|Integral Antenna: 11 mm<br>External Reference Dipole Antenna: 12 mm|
|ISED|Integral Antenna: 16 mm<br>External Reference Dipole Antenna: 18 mm|
|CE|The RF exposure should always be evaluated with the end-prod-<br>uct when transmitting with power levels higher than 20 mW (13<br>dBm).|



The exemption distances above, calculated for reference in the full output power use case, are based on the rules in force at the time of writing this datasheet. Even though changing rarely, always ensure to apply the rules in force at the time of placing a product in the market. 

In the cases of FCC and ISED, it is allowed to use the module at its max RF TX power in end-products where the typical separation distance from the human body is smaller than mentioned above, but it requires evaluating the RF Exposure in the final assembly and applying for a Class 2 Permissive Change to the FCC and ISED approvals of the module. In order to proceed with the permissive change, module manufacturer should be asked for an authorization to proceed first with a Change in ID and/or Multiple Listing, so that the new portable condition will be added to the new parallel grant owned by the end-product manufacturer. 

For CE, RF Exposure must be evaluated using the end-product in all cases when transmitting at more than the power level indicated in the table. 

**Note:** Placing the module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thus a reduced range is to be expected. 

## **11.8  Bluetooth Qualification** 

The BGM240S modules are launched with a pre-qualified Bluetooth Low Energy RF-PHY Tested Component based on Core Specification 5.3 having Declaration ID of D059594 and QDID of 184327. 

The RF-PHY Tested Component should be imported and combined together with the latest Wireless Gecko Link Layer and Host prequalified Components by Silicon Labs, when in the process of qualifying an end-product which embeds the BGM240S via the SIG's Launch Studio. Please find out more in chapter 2.2 of the quick start guides QSG139 and GSG169. 

Notice that the validity set by the SIG for Tested Components is currently of 3 years: during the product lifetime, Silicon Labs will reassess or re-qualify the RF-PHY Component as it expires, whenever applicable. In case of a re-qualification, a Tested Component will come with a new DID and a new QDID, and the latter will be then referred to in new end-product listings. Newer DIDs and QDIDs can be discovered by using the search engine in the SIG's Launch Studio, or by asking Silicon Labs via the technical support platform. 

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BGM240S Bluetooth[™] SiP Module Data Sheet Revision History 

## **12.  Revision History** 

## **Revision 1.0** 

December, 2022 

- Updated front page block diagram 

- Updated top marking 

## **Revision 0.5** 

September, 2022 

- Initial Draft 

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## **Disclaimer** 

Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and “Typical” parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A “Life Support System” is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications. **Note: This content may contain offensive terminology that is now obsolete. Silicon Labs is replacing these terms with inclusive language wherever possible. For more information, visit  www.silabs.com/about-us/inclusive-lexicon-project** 

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Updated at April 28, 2026
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