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Illustrative purposes only
BGM240PB32VNA3
Bluetooth Module, BLE 5.3, 2 Mbps, -95.7 dBm, 20 dBm Power, Vault High, Built-In Antenna
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: SILICON LABS
- Product type: Bluetooth Modules & Adaptors
- SVHC: To Be Advised
- Interfaces: I2C, SPI, UART, USART
- Product Range: Wireless Gecko BGM240P Series
- Certifications: CE, FCC, ISED, KC, MIC, UKCA
- Bluetooth Class: -
- Bluetooth Version: Bluetooth LE 5.3
- Supply Voltage Range: 1.8 V to 3.8 V
- Receiver Sensitivity Rx: -95.7 dBm
- Operating Temperature Range: -40 °C to 105 °C
| Delivery and price | |
|---|---|
| Units per pack | 250 |
| Price | 4.92 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
## **BGM240P Wireless Gecko Bluetooth Module Data Sheet**
The BGM240P is a secure, high-performance wireless module optimized for the needs of battery and line-powered IoT devices running on Bluetooth networks.
Based on the Series 2 EFR32BG24 SoC, it enables Bluetooth[®] Low Energy connectivity, delivering exceptional RF performance and energy efficiency, industry-leading Secure Vault[®] technology, and future-proofing capabilities.
The BGM240P is a complete solution offered with robust and fully-upgradeable software stacks, global regulatory certifications, advanced development and debugging tools, and documentation that simplifies and minimizes the development cycle of your end-product, helping to accelerate its time-to-market.
The BGM240P is targeted for a broad range of applications, including:
- Smart Home Devices
- Lighting
## **KEY FEATURES**
- Bluetooth Low Energy 5.3 and Bluetooth Mesh connectivity
- Built-in antenna or RF pin
- +10 or +20 dBm TX output power
- -98.5 dBm BLE 1M RX sensitivity
- 32-bit ARM® Cortex®-M33 core at 39 MHz
- 1536/256 kB of Flash/RAM memory
- Vault High or Vault Mid security
- Rich set of analog and digital peripherals
- 26 GPIO pins
- -40 °C to 105 °C
- 12.9 mm x 15.0 mm
- Gateways and Digital Assistants
- Building Automation and Security
**==> picture [522 x 263] intentionally omitted <==**
**----- Start of picture text -----**<br>
Core / Memory Crystal Clock Management Power Management Supply Security<br>ARM Cortex [TM] M33 processor 39 MHz HF Crystal Oscillator OscillatorHF RC DC-DC Converter DC-DC LC AccelerationCrypto Secure Engine<br>Flash Program<br>with DSP extensions,FPU and TrustZone Memory Fast Startup Precision LF Voltage Regulator Decoupling TRNG Secure Debug<br>RC Oscillator RC Oscillator Authentication<br>Power-On Reset<br>ETM InterfaceDebug MemoryRAM ControllerLDMA LF Crystal Oscillator Ultra LF RC Oscillator Brown-Out Detector DPA Countermeasures<br>32-bit Bus<br>Peripheral Reflex System<br>Antenna Radio Subsystem Serial I/O Ports Timers and Triggers Analog I/F<br>Interfaces<br>Antenna or RF Pin DEMOD ARM CortexM0+ Radio [TM] USART Keypad Scanner Timer/Counter Protocol Timer ADC<br>RX/TX Front-End<br>with Controller External<br>Matching Integrated PA IFADC BUFC RAM EUSART Interrupts Low Energy Timer Watchdog Timer ACMP<br>General<br>AGC EUSART Purpose I/O System Real Back-Up Real VDAC<br>FRC Time Counter Time Counter<br>Pin Reset<br>Frequency<br>Synthesizer MOD CRC I [2] C Pin Wakeup Pulse Counter Temperature Sensor<br>Lowest power mode with peripheral operational:<br>EM0—Active EM1—Sleep EM2—Deep Sleep EM3—Stop EM4—Shutoff<br>**----- End of picture text -----**<br>
**Copyright © 2022 by Silicon Laboratories**
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Rev. 1.0
BGM240P Wireless Gecko Bluetooth Module Data Sheet Features
## **1. Features**
- **Supported Protocols**
- Bluetooth Low Energy (BLE) 5.3
- Bluetooth Mesh
- Matter-ready Smart Home Connectivity
- **Wireless System-on-Chip**
- 2.4 GHz radio
- TX power up to +20 dBm
- 32-bit ARM Cortex[®] -M33 with DSP instruction and floatingpoint unit for efficient signal processing
- 1536 kB flash program memory
- 256 kB RAM data memory
- Embedded Trace Macrocell (ETM) for advanced debugging
- **Receiver Sensitivity**
- -106.5 dBm (0.1% BER) at 125 kbps GFSK
- -102.2 dBm (0.1% BER) at 500 kbps GFSK
- -98.5 dBm (0.1% BER) at 1 Mbps GFSK
- -95.7 dBm (0.1% BER) at 2 Mbps GFSK
- **Current Consumption**
- 4.5 mA RX current at 1 Mbps GFSK
- 4.8 mA TX current at 0 dBm (BGM240Px22)
- 18.8 mA TX current at 10 dBm (BGM240Px22)
- 154.8 mA TX current at 19.6 dBm (BGM240Px32)
- 33.4 µA/MHz in Active Mode (EM0) at 39.0 MHz
- 1.3 μA EM2 DeepSleep current (16 kB RAM retention and RTC running from LFRCO)
- **Regulatory Certifications**
- CE (EU)
- UKCA (UK)
- FCC (USA)
- ISED (Canada)
- MIC (Japan)
- KC (South Korea)
- **Operating Range**
- 1.8 V to 3.8 V
- -40 °C to +105 °C
- **Dimensions**
- 12.9 mm x 15.0 mm
- **Security**
- Secure Boot with Root of Trust and Secure Loader (RTSL)
- Hardware Cryptographic Acceleration with DPA countermeasures for AES128/256, SHA-1, SHA-2 (up to 256-bit), ECC (up to 256-bit), ECDSA, and ECDH
- True Random Number Generator (TRNG) compliant with NIST SP800-90 and AIS-31
- ARM[®] TrustZone[®]
- Secure Debug Interface lock/unlock
- Secure Key Management with PUF
- Anti-Tamper
- Secure Attestation
- **MCU Peripherals**
- Analog to Digital Converter (ADC)
- 12-bit @ 1 Msps
- 16-bit @ 76.9 ksps
- 2 × Analog Comparator (ACMP)
- 2 × Digital to Analog Converter (VDAC)
- Up to 26 General Purpose I/O pins with output state retention and asynchronous interrupts
- 8 Channel DMA Controller
- 16 Channel Peripheral Reflex System (PRS)
- 3 × 16-bit Timer/Counter with 3 Compare/Capture/PWM channels
- 2 × 32-bit Timer/Counter with 3 Compare/Capture/PWM channels
- 2 x 32-bit Real Time Counter (SYSRTC/BURTC)
- 24-bit Low Energy Timer for waveform generation (LETIMER)
- 16-bit Pulse Counter with asynchronous operation (PCNT)
- 2 × Watchdog Timer (WDOG)
- 1 × Universal Synchronous/Asynchronous Receiver/Transmitter (USART), supporting UART/SPI/SmartCard (ISO 7816)/IrDA/I[2] S
- 2 × Enhanced Universal Synchronous/Asynchronous Receiver/Transmitter (EUSART) supporting UART/SPI/DALI/ IrDA
- 2 × I[2] C interface with SMBus support
- Low-Frequency RC Oscillator with precision mode to replace 32 kHz sleep crystal (LFRCO)
- Keypad scanner supporting up to 6x8 matrix (KEYSCAN)
- Die temperature sensor with +/- 1.5 °C accuracy after single-point calibration
**Note:** Sensitivity values above are for +10 dBm parts (BGM240x22).
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Rev. 1.0 | 2
BGM240P Wireless Gecko Bluetooth Module Data Sheet Ordering Information
## **2. Ordering Information**
## **Table 2.1. Ordering Information**
|**Ordering Code**|**Protocol Stack**|**Max**<br>**TX**<br>**Power**|**Security**|**Antenna**|**Flash**<br>**(kB)**|**RAM**<br>**(kB)**|**GPIO**|**Temp Range**|**Carrier**|
|---|---|---|---|---|---|---|---|---|---|
|BGM240PA22VNA3|• Bluetooth Low<br>Energy 5.3<br>• Bluetooth Mesh|+10<br>dBm|Vault Mid|Built-in|1536|256|26|-40 to 105 °C|Cut<br>Tape|
|BGM240PA22VNA3R|• Bluetooth Low<br>Energy 5.3<br>• Bluetooth Mesh|+10<br>dBm|Vault Mid|Built-in|1536|256|26|-40 to 105 °C|Reel|
|BGM240PB22VNA3|• Bluetooth Low<br>Energy 5.3<br>• Bluetooth Mesh|+10<br>dBm|Vault<br>High|Built-in|1536|256|26|-40 to 105 °C|Cut<br>Tape|
|BGM240PB22VNA3R|• Bluetooth Low<br>Energy 5.3<br>• Bluetooth Mesh|+10<br>dBm|Vault<br>High|Built-in|1536|256|26|-40 to 105 °C|Reel|
|BGM240PA32VNA3|• Bluetooth Low<br>Energy 5.3<br>• Bluetooth Mesh|+20<br>dBm|Vault Mid|Built-in|1536|256|26|-40 to 105 °C|Cut<br>Tape|
|BGM240PA32VNA3R|• Bluetooth Low<br>Energy 5.3<br>• Bluetooth Mesh|+20<br>dBm|Vault Mid|Built-in|1536|256|26|-40 to 105 °C|Reel|
|BGM240PA32VNN3|• Bluetooth Low<br>Energy 5.3<br>• Bluetooth Mesh|+20<br>dBm|Vault Mid|RF Pin|1536|256|26|-40 to 105 °C|Cut<br>Tape|
|BGM240PA32VNN3R|• Bluetooth Low<br>Energy 5.3<br>• Bluetooth Mesh|+20<br>dBm|Vault Mid|RF Pin|1536|256|26|-40 to 105 °C|Reel|
|BGM240PB32VNA3|• Bluetooth Low<br>Energy 5.3<br>• Bluetooth Mesh|+20<br>dBm|Vault<br>High|Built-in|1536|256|26|-40 to 105 °C|Cut<br>Tape|
|BGM240PB32VNA3R|• Bluetooth Low<br>Energy 5.3<br>• Bluetooth Mesh|+20<br>dBm|Vault<br>High|Built-in|1536|256|26|-40 to 105 °C|Reel|
|BGM240PB32VNN3|• Bluetooth Low<br>Energy 5.3<br>• Bluetooth Mesh|+20<br>dBm|Vault<br>High|RF Pin|1536|256|26|-40 to 105 °C|Cut<br>Tape|
|BGM240PB32VNN3R|• Bluetooth Low<br>Energy 5.3<br>• Bluetooth Mesh|+20<br>dBm|Vault<br>High|RF Pin|1536|256|26|-40 to 105 °C|Reel|
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Rev. 1.0 | 3
BGM240P Wireless Gecko Bluetooth Module Data Sheet Ordering Information
## **Note:**
1. BGM240P modules operate in the 2.4 GHz ISM frequency band.
2. The maximum RF TX power allowed by different regional regulatory authorities may differ from the maximum output power a module can produce. End-product manufacturers must then verify that the module is configured to meet the regulatory limits for each region in accordance with the local rules and the formal certification test reports.
3. Throughout this document, the modules may be referred to by their product family/marketing name (e.g. BGM240P), by their model names (BGM240P32A, BGM240P22A or BGM240P32N) or by their full ordering codes as seen in the table above.
4. Radio boards **xGM240-RB4316A** (+10 dBm) and **xGM240-RB4317A** (+20 dBm) are available for BGM240P evaluation and development.
5. Devices are pre-programmed with BGAPI UART DFU bootloader version 2.1.0.2, which uses the pin configuration in Section 5. Reference Diagrams.
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Rev. 1.0 | 4
## **Table of Contents**
|**1.**|**Features .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 2**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**2.**|**Ordering Information**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 3**|
|**3.**|**System Overview .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 7**|
||3.1 Block Diagram .<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|. 7|
||3.2 EFR32BG24 SoC .<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|. 8|
||3.3 Antenna .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|. 8|
||3.4 Power Supply<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|. 8|
||3.5 General Purpose Input/Output (GPIO)|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|. 9|
||3.6 Security<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|. 9|
||3.6.1 Secure Boot with Root of Trust and Secure|||||Loader (RTSL)|||||||.|.|.|.||.|.|.|.|.|.|.|.|.10|
||3.6.2 Cryptographic Accelerator.<br>.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.10|
||3.6.3 True Random Number Generator|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.10|
||3.6.4 Secure Debug with Lock/Unlock.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.10|
||3.6.5 DPA Countermeasures.<br>.<br>.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.10|
||3.6.6 Secure Key Management with PUF||.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.11|
||3.6.7 Anti-Tamper<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.11|
||3.6.8 Secure Attestation<br>.<br>.<br>.<br>.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.11|
|**4.**|**Electrical Specifications**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**||**.**||**.**|**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**. 12**|
||4.1 Absolute Maximum Ratings.<br>.<br>.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.12|
||4.2 General Operating Conditions .<br>.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.13|
||4.3 MCU current consumption at 3.0 V .|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.14|
||4.4 Radio Current Consumption with 3.0 V|Supply||||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.15|
||4.5 RF Transmitter General Characteristics for the||||2.4||GHz Band||||.||.|.|.|.||.|.|.|.|.|.|.|.|.16|
||4.6 RF Receiver General Characteristics for the|||2.4||GHz||Band||.|.||.|.|.|.||.|.|.|.|.|.|.|.|.17|
||4.7 RF Receiver Characteristics for Bluetooth||Low||Energy in||||the 2.4|||GHz|||Band||1|Mbps|||Data Rate .||||.|.18|
||4.8 RF Receiver Characteristics for Bluetooth||Low||Energy in||||the 2.4|||GHz|||Band||2|Mbps|||Data Rate .||||.|.20|
||4.9 RF Receiver Characteristics for Bluetooth||Low||Energy in||||the 2.4|||GHz|||Band||500||kbps Data||||Rate||.|.22|
||4.10 RF Receiver Characteristics for Bluetooth Low|||||Energy in the|||||2.4||GHz Band|||||125||kbps||Data Rate .||||.24|
||4.11 High-Frequency Crystal<br>.<br>.<br>.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.25|
||4.12 Low Frequency Crystal Oscillator<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.26|
||4.13 Precision Low Frequency RC Oscillator (LFRCO)||||||.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.27|
||4.14 GPIO Pins .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.28|
||4.15 Microcontroller Peripherals<br>.<br>.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.29|
||4.16 Antenna Radiation and Efficiency<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.30|
|**5.**|**Reference Diagrams.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**33**|
||5.1 Network Co-Processor (NCP) Application||with||UART|||Host||.|.||.|.|.|.||.|.|.|.|.|.|.|.|.33|
||5.2 SoC Application<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.||.|.|.|.|.|.||.|.|.|.||.|.|.|.|.|.|.|.|.34|
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Rev. 1.0 | 5
|**6. Pin Definitions .**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**35**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|6.1 Module Pinout .<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.35|
|6.2 Alternate Pin Functions|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.37|
|6.3 Analog Peripheral Connectivity||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.38|
|6.4 Digital Peripheral Connectivity .||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.39|
|**7. Design Guidelines**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 43**|
|7.1 Layout and Placement|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.43|
|7.2 Proximity to Other Materials|||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.45|
|7.3 Proximity to Human Body||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.45|
|7.4 Reset .<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.45|
|7.5 Debug .<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.45|
|7.6 Packet Trace Interface (PTI)|||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.46|
|**8. Package Specifications**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.47**|
|8.1 Package Outline<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.47|
|8.2 PCB Land Pattern .<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.48|
|8.3 Package Marking .<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.49|
|**9. Soldering Recommendations**||||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 50**|
|**10. Tape and Reel**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.51**|
|**11. Certifications .**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**52**|
|11.1 Qualified Antennas .|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.52|
|11.2 CE and UKCA - EU and UK|||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.53|
|11.3 FCC - USA .<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.53|
|11.4 ISED - Canada<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.56|
|11.5 MIC - Japan<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.58|
|11.6 KC - South Korea<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.59|
|11.7 Human Body Proximity.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.60|
|11.8 Bluetooth Qualification .||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.60|
|**12. Revision History.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**61**|
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Rev. 1.0 | 6
BGM240P Wireless Gecko Bluetooth Module Data Sheet System Overview
## **3. System Overview**
## **3.1 Block Diagram**
The BGM240P module is a highly-integrated, high-performance system with all the hardware components needed to enable 2.4 GHz wireless connectivity and support robust networking capabilities via multiple wireless protocols.
Built around the EFR32BG24 Wireless SoC, the BGM240P includes a built-in antenna, an RF matching network (optimized for transmit power efficiency), supply decoupling and filtering components, an LC tank for DC-DC conversion, a 39 MHz reference crystal, and an RF shield. Also, it supports the use of an external 32 kHz crystal as a low frequency reference signal via GPIO pins for use cases demanding maximum energy efficiency.
For designs where an external antenna solution may be beneficial, a module variant with a 50 Ω-matched RF pin instead of the built-in antenna is available (for 20 dBm TX power only).
Because the RF matching network is optimized for transmit power efficiency, modules rated for +20 dBm will show non-optimal current consumption and performance when operated at a lower output power (e.g. +10 or 0 dBm).
**Figure 3.1. BGM240P Block Diagram - Built-in Antenna Variant**
**Figure 3.2. BGM240P Block Diagram - RF pin Variant**
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Rev. 1.0 | 7
BGM240P Wireless Gecko Bluetooth Module Data Sheet System Overview
A simplified internal schematic for the BGM240P module is shown in Figure 3.3 BGM240P Module Schematic on page 8.
**==> picture [388 x 186] intentionally omitted <==**
**----- Start of picture text -----**<br>
EFR32xG24<br>VDD VREGIN 2G4RF1 Matching RFOUT<br>IOVDD Network<br>4.7µF<br>AVDD<br>PA0x PA0x (x:0-8)<br>VREGSW PB0x PB0x (x:0-4)<br>PC0x PC0x (x:0-7)<br>PD0x PD0x (x:0-3)<br>2.2µH<br>RESET RESET<br>DVDD 0.1µF<br>RFVDD<br>PAVDD HFXTAL_I<br>4.7µF 39 MHz<br>HFXTAL_O<br>DECOUPLE<br>2.2µF<br>**----- End of picture text -----**<br>
**Figure 3.3. BGM240P Module Schematic**
## **3.2 EFR32BG24 SoC**
The EFR32BG24 SoC features a 32-bit ARM Cortex M33 core, a 2.4 GHz high-performance radio, 1536 kB of Flash memory, 256 kB of RAM, a dedicated core for security, a rich set of MCU peripherals, and various clock management and serial interfacing options. See the EFR32xG24 Reference Manual and EFR32BG24 Data Sheet for details.
## **3.3 Antenna**
BGM240P modules come with two antenna solution variants: A built-in antenna or a 50 Ω-matched RF pin to support an external antenna. Typical performance characteristics for the built-in antenna are detailed in the table below. See 4.16 Antenna Radiation and Efficiency and 11.1 Qualified Antennas for other relevant details.
**Table 3.1. Antenna Efficiency and Peak Gain**
|**Parameter**|**With optimal layout **|**Note**|
|---|---|---|
|Efficiency|-1 dB|Antenna efficiency, gain and radiation pattern are highly depend-<br>ent on the application PCB layout and mechanical design. Refer<br>to7. Design Guidelinesfor recommendations to achieve optimal<br>antenna performance.|
|Peak gain|1.82 dBi||
## **3.4 Power Supply**
The BGM240P requires a single nominal supply level (VDD) to operate and supports an operating range of 1.8 to 3.8 V. The nominal level needed for +10 dBm devices (Model: BGM240P22A) is 3.0 V whereas +20 dBm devices (Model: BGM240P32A, BGM240P32N) require 3.3 V in order to achieve higher TX output power. All necessary decoupling, filtering and DC-DC-related components are included in the module.
**Note:** The power amplifier for +10 dBm modules is supplied through an internal LDO, and thus is independent of the VDD supply. Respectively, the power amplifier for +20 dBm modules is supplied through the VDD pin with a target level of 3.3 V.
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BGM240P Wireless Gecko Bluetooth Module Data Sheet System Overview
## **3.5 General Purpose Input/Output (GPIO)**
The BGM240P has up to 26 General Purpose Input/Output pins. Each GPIO pin can be individually configured as either an output or input. More advanced configurations including open-drain, open-source, and glitch-filtering can be configured for each individual GPIO pin. The GPIO pins can be overridden by peripheral connections, like SPI communication. Each peripheral connection can be routed to several GPIO pins on the device. The input value of a GPIO pin can be routed through the Peripheral Reflex System to other peripherals. The GPIO subsystem supports asynchronous external pin interrupts.
All of the pins on ports A and port B are EM2 capable. These pins may be used by Low-Energy peripherals in EM2/3 and may also be used as EM2/3 pin wake-ups. Pins on ports C and D are latched/retained in their current state when entering EM2 until EM2 exit upon which internal peripherals could once again drive those pads.
A few GPIOs also have EM4 wake functionality. These pins are listed in the Table 6.2 GPIO Alternate Functions Table on page 37.
## **3.6 Security**
BGM240P modules support one of two levels in the Security Portfolio offered by Silicon Labs: Secure Vault Mid or Secure Vault High.
Secure Vault is a collection of technologies that deliver state-of-the-art security and upgradability features to protect and future-proof IoT devices against costly threats, attacks, and tampering. A dedicated security CPU enables the Secure Vault functions and isolates cryptographic functions and data from the Cortex-M33 core. BGM240PB part numbers support Secure Vault High and BGM240PA part numbers support Secure Vault Mid.
**Table 3.2. Secure Vault Features**
|**Feature**|**Secure Vault Mid**|**Secure Vault High**|
|---|---|---|
|True Random Number Generator (TRNG)|Yes|Yes|
|Secure Boot with Root of Trust and Secure<br>Loader (RTSL)|Yes|Yes|
|Secure Debug with Lock/Unlock|Yes|Yes|
|DPA Countermeasures|Yes|Yes|
|Anti-Tamper||Yes|
|Secure Attestation||Yes|
|Secure Key Management||Yes|
|Symmetric Encryption|• AES 128 / 192 / 256 bit<br>• ECB, CTR, CBC, CFB, CCM, GCM,<br>CBC-MAC, and GMAC|• AES 128 / 192 / 256 bit<br>• ECB, CTR, CBC, CFB, CCM, GCM,<br>CBC-MAC, and GMAC<br>• ChaCha20|
|Public Key Encryption - ECDSA / ECDH /<br>EdDSA|• p192 and p256|• p192, p256, p384 and p521<br>• Curve25519 (ECDH)<br>• Ed25519 (EdDSA)|
|Key Derivation|• ECJ-PAKE p192 and p256|• ECJ-PAKE p192, p256, p384, and p521<br>• PBKDF2<br>• HKDF|
|Hashes|• SHA-1<br>• SHA-2/256|• SHA-1<br>• SHA-2 256, 384, and 512<br>• Poly1305|
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BGM240P Wireless Gecko Bluetooth Module Data Sheet System Overview
## **3.6.1 Secure Boot with Root of Trust and Secure Loader (RTSL)**
The Secure Boot with RTSL authenticates a chain of trusted firmware that begins from an immutable memory (ROM).
It prevents malware injection, prevents rollback, ensures that only authentic firmware is executed, and protects Over The Air updates.
For more information about this feature, see AN1218: Series 2 Secure Boot with RTSL.
## **3.6.2 Cryptographic Accelerator**
The Cryptographic Accelerator is an autonomous hardware accelerator with Differential Power Analysis (DPA) countermeasures to protect keys.
It supports AES encryption and decryption with 128/192/256-bit keys, ChaCha20 encryption, and Elliptic Curve Cryptography (ECC) to support public key operations, and hashes.
Supported block cipher modes of operation for AES include:
- ECB (Electronic Code Book)
- CTR (Counter Mode)
- CBC (Cipher Block Chaining)
- CFB (Cipher Feedback)
- GCM (Galois Counter Mode)
- CCM (Counter with CBC-MAC)
- CBC-MAC (Cipher Block Chaining Message Authentication Code)
- GMAC (Galois Message Authentication Code)
The Cryptographic Accelerator accelerates Elliptical Curve Cryptography and supports the NIST (National Institute of Standards and Technology) recommended curves including P-192, P-256, P-384, and P-521 for ECDH (Elliptic Curve Diffie-Hellman) key derivation, and ECDSA (Elliptic Curve Digital Signature Algorithm) sign and verify operations. Also supported is the non-NIST Curve25519 for ECDH and Ed25519 for EdDSA (Edwards-curve Digital Signature Algorithm) sign and verify operations.
Secure Vault also supports ECJ-PAKE (Elliptic Curve variant of Password Authenticated Key Exchange by Juggling) and PBKDF2 (Password-Based Key Derivation Function 2).
Supported hashes include SHA-1, SHA-2/256/384/512 and Poly1305.
This implementation provides a fast and energy efficient solution to state of the art cryptographic needs.
## **3.6.3 True Random Number Generator**
The True Random Number Generator module is a non-deterministic random number generator that harvests entropy from a thermal energy source. It includes start-up health tests for the entropy source as required by NIST SP800-90B and AIS-31 as well as online health tests required for NIST SP800-90C.
The TRNG is suitable for periodically generating entropy to seed an approved pseudo random number generator.
## **3.6.4 Secure Debug with Lock/Unlock**
For obvious security reasons, it is critical for a product to have its debug interface locked before being released in the field.
In addition, Secure Vault High also provides a secure debug unlock function that allows authenticated access based on public key cryptography. This functionality is particularly useful for supporting failure analysis while maintaining confidentiality of IP and sensitive enduser data.
For more information about this feature, see AN1190: Series 2 Secure Debug.
## **3.6.5 DPA Countermeasures**
The AES and ECC accelerators have Differential Power Analysis (DPA) countermeasures support. This makes it very expensive from a time and effort standpoint to use DPA to recover secret keys.
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BGM240P Wireless Gecko Bluetooth Module Data Sheet System Overview
## **3.6.6 Secure Key Management with PUF**
Key material in Secure Vault High products is protected by "key wrapping" with a standardized symmetric encryption mechanism. This method has the advantage of protecting a virtually unlimited number of keys, limited only by the storage that is accessible by the Cortex-M33, which includes off-chip storage as well. The symmetric key used for this wrapping and unwrapping must be highly secure because it can expose all other key materials in the system. The Secure Vault Key Management system uses a Physically Unclonable Function (PUF) to generate a persistent device-unique seed key on power up to dynamically generate this critical wrapping/unwrapping key which is only visible to the AES encryption engine and is not retained when the device loses power.
## **3.6.7 Anti-Tamper**
Secure Vault High devices provide internal tamper protection which monitors parameters such as voltage, temperature, and electromagnetic pulses as well as detecting tamper of the security sub-system itself. Additionally, 8 external configurable tamper pins support external tamper sources, such as enclosure tamper switches.
For each tamper event, the user is able to select the severity of the tamper response ranging from an interrupt, to a reset, to destroying the PUF reconstruction data which will make all protected key materials un-recoverable and effectively render the device inoperable. The tamper system also has an internal resettable event counter with programmable trigger threshold and refresh periods to mitigate false positive tamper events.
For more information about this feature, see AN1247: Anti-Tamper Protection Configuration and Use.
## **3.6.8 Secure Attestation**
Secure Vault High products support Secure Attestation, which begins with a secure identity that is created during the Silicon Labs manufacturing process. During device production, each device generates its own public/private keypair and securely stores the wrapped private key into immutable OTP memory and this key never leaves the device. The corresponding public key is extracted from the device and inserted into a binary DER-encoded X.509 device certificate, which is signed into a Silicon Labs CA chain and then programmed back into the chip into an immutable OTP memory.
The secure identity can be used to authenticate the chip at any time in the life of the product. The production certification chain can be requested remotely from the product. This certification chain can be used to verify that the device was authentically produced by Silicon Labs. The device unique public key is also bound to the device certificate in the certification chain. A challenge can be sent to the chip at any point in time to be signed by the device private key. The public key in the device certificate can then be used to verify the challenge response, proving that the device has access to the securely-stored private key, which prevents counterfeit products or impersonation attacks.
For more information about this feature, see AN1268: Authenticating Silicon Labs Devices Using Device Certificates.
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications
## **4. Electrical Specifications**
All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:
- Typical values are based on TA=25 °C and VDD supply at 3.0 V, by production test and/or technology characterization.
- Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output power-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.
- Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise.
## **4.1 Absolute Maximum Ratings**
**Table 4.1. Absolute Maximum Ratings**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Storage temperature range|TSTG||-40|—|+105|°C|
|Voltage on any supply pin|VDDMAX||-0.3|—|3.8|V|
|Voltage ramp rate on any<br>supply pin|VDDRAMPMAX||—|—|1.0|V / µs|
|DC voltage on any GPIO pin|VDIGPIN||-0.3|—|VVDD+ 0.3|V|
|DC voltage on RESETn pin1|VRESETn||-0.3|—|3.8|V|
|Absolute voltage on RFOUT<br>pin|VMAX2G4||-0.3|—|VVDD+ 0.3|V|
|Total current into VDD pin|IVDDMAX|Source|—|—|200|mA|
|Total current into GND pin|IVSSMAX|Sink|—|—|200|mA|
|Current per I/O pin|IIOMAX|Sink|—|—|50|mA|
|||Source|—|—|50|mA|
|Current for all I/O pins|IIOALLMAX|Sink|—|—|200|mA|
|||Source|—|—|200|mA|
|**Note:**<br>1. The RESETn pin has a pull-up device to the internal DVDD supply. For minimum leakage, RESETn should not exceed the volt-<br>age at DVDD, which is generated by the DC-DC converter. DVDD is equal to 1.8 V when DC-DC is active and bypassed to VDD<br>when DC-DC is inactive.|||||||
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications
## **4.2 General Operating Conditions**
**Table 4.2. General Operating Conditions**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Operating ambient tempera-<br>ture range|TA||-40|—|+105|°C|
|VDD operating supply volt-<br>age|VVDD|10 dBm Module, DC-DC in regula-<br>tion|2.2|3.0|3.8|V|
|||20 dBm Module, DC-DC in regula-<br>tion|2.2|3.3|3.8|V|
|||10 dBm Module, DC-DC in by-<br>pass|1.8|3.0|3.8|V|
|||20 dBm Module, DC-DC in by-<br>pass|1.8|3.3|3.8|V|
|HCLK and SYSCLK frequen-<br>cy|fHCLK|VSCALE2, MODE = WS1|—|—|78|MHz|
|||VSCALE2, MODE = WS0|—|—|40|MHz|
|EM01 Group A clock fre-<br>quency|fEM01GRPACLK|VSCALE2|—|—|78|MHz|
|||VSCALE1|—|—|40|MHz|
|EM01 Group C clock fre-<br>quency|fEM01GRPCCLK|VSCALE2|—|—|78|MHz|
|||VSCALE1|—|—|40|MHz|
|Radio HCLK frequency|fRHCLK|VSCALE2 or VSCALE1|—|39.0|—|MHz|
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications
## **4.3 MCU current consumption at 3.0 V**
Unless otherwise indicated, typical conditions are: VDD = 3.0 V, DC-DC in regulation. Voltage scaling level = VSCALE1. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 °C.
**Table 4.3. MCU current consumption at 3.0 V**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Current consumption in EM0<br>mode with all peripherals dis-<br>abled|IACTIVE|78 MHz HFRCO w/ DPLL refer-<br>enced to 39 MHz crystal, CPU<br>running Prime from flash,<br>VSCALE2|—|33.3|—|µA/MHz|
|||78 MHz HFRCO w/ DPLL refer-<br>enced to 39 MHz crystal, CPU<br>running while loop from flash,<br>VSCALE2|—|32.8|—|µA/MHz|
|||78 MHz HFRCO w/ DPLL refer-<br>enced to 39 MHz crystal, CPU<br>running CoreMark loop from flash,<br>VSCALE2|—|49.1|—|µA/MHz|
|||39 MHz crystal, CPU running<br>Prime from flash|—|33.9|—|µA/MHz|
|||39 MHz crystal, CPU running<br>while loop from flash|—|33.4|—|µA/MHz|
|||39 MHz crystal, CPU running<br>CoreMark loop from flash|—|49.4|—|µA/MHz|
|||38 MHz HFRCO, CPU running<br>while loop from flash|—|28.1|—|µA/MHz|
|Current consumption in EM1<br>mode with all peripherals dis-<br>abled|IEM1|78 MHz HFRCO w/ DPLL refer-<br>enced to 39 MHz crystal,<br>VSCALE2|—|22.6|—|µA/MHz|
|||39 MHz crystal|—|24.4|—|µA/MHz|
|||38 MHz HFRCO|—|19.0|—|µA/MHz|
|Current consumption in EM2<br>mode, VSCALE0|IEM2_VS|256 kB RAM and full Radio RAM<br>retention, RTC running from<br>LFXO1|—|2.9|—|µA|
|||256 kB RAM and full Radio RAM<br>retention, RTC running from<br>LFRCO1|—|2.9|—|µA|
|||16 kB RAM and full Radio RAM<br>retention, RTC running from<br>LFXO1|—|1.3|—|µA|
|||16 kB RAM and full Radio RAM<br>retention, RTC running from<br>LFRCO1|—|1.3|—|µA|
|||16 kB RAM and full Radio RAM<br>retention, RTC running from<br>LFRCO in precision mode1|—|1.9|—|µA|
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Current consumption in EM3<br>mode, VSCALE0|IEM3_VS|256 kB RAM and full Radio RAM<br>retention, RTC running from<br>ULFRCO1|—|2.7|—|µA|
|||16 kB RAM and full Radio RAM<br>retention, RTC running from<br>ULFRCO1|—|1.1|—|µA|
|Current consumption in EM4<br>mode|IEM4|No BURTC, no LF oscillator|—|0.27|—|µA|
|||BURTC with LFXO|—|0.64|—|µA|
|Current consumption during<br>reset|IRST|Hard pin reset held|—|467|—|µA|
|**Note:**<br>1. CPU cache retained, EM0/1 peripheral states retained|||||||
## **4.4 Radio Current Consumption with 3.0 V Supply**
RF current consumption measured with MCU in EM1 and all MCU peripherals disabled. Unless otherwise indicated, typical conditions are: VDD = 3.0 V, DC-DC in regulation. TA = 25 °C.
**Table 4.4. Radio Current Consumption with 3.0 V Supply**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Current consumption in re-<br>ceive mode, active packet<br>reception, VSCALE1, EM1P|IRX_ACTIVE|125 kbit/s, 2GFSK, f = 2.4 GHz|—|4.8|—|mA|
|||500 kbit/s, 2GFSK, f = 2.4 GHz|—|4.9|—|mA|
|||1 Mbit/s, 2GFSK, f = 2.4 GHz|—|4.5|—|mA|
|||2 Mbit/s, 2GFSK, f = 2.4 GHz|—|5.2|—|mA|
|Current consumption in re-<br>ceive mode, listening for<br>packet, VSCALE1, EM1P|IRX_LISTEN|125 kbit/s, 2GFSK, f = 2.4 GHz|—|4.8|—|mA|
|||500 kbit/s, 2GFSK, f = 2.4 GHz|—|4.8|—|mA|
|||1 Mbit/s, 2GFSK, f = 2.4 GHz|—|4.5|—|mA|
|||2 Mbit/s, 2GFSK, f = 2.4 GHz|—|5.2|—|mA|
|Current consumption in<br>transmit mode|ITX|f = 2.4 GHz, CW, 20 dBm output<br>power, VDD = 3.3 V1|—|154.8|—|mA|
|||f = 2.4 GHz, CW, 10 dBm output<br>power|—|18.8|—|mA|
|||f = 2.4 GHz, CW, 0 dBm output<br>power|—|4.8|—|mA|
|**Note:**<br>1. The maximum output power for Bluetooth Low Energy is limited to 19.6 dBm for compliance with the Bluetooth Core Specifica-<br>tion.|||||||
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications
## **4.5 RF Transmitter General Characteristics for the 2.4 GHz Band**
Unless otherwise indicated, typical conditions are: VDD = 3.0 V, DC-DC in regulation. RF center frequency 2.45 GHz. TA = 25 °C.
**Table 4.5. RF Transmitter General Characteristics for the 2.4 GHz Band**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|RF tuning frequency range|FRANGE||2402|—|2480|MHz|
|Maximum TX power1|POUTMAX|20 dBm, VDD = 3.3 V2|—|19.6|—|dBm|
|||10 dBm|—|10|—|dBm|
|||0 dBm|—|-0.3|—|dBm|
|Minimum active TX power|POUTMIN|20 dBm, VDD = 3.3 V|—|-33.7|—|dBm|
|||10 dBm|—|-30|—|dBm|
|||0 dBm|—|-24|—|dBm|
|Output power step size|POUTSTEP|0 dBm|0.1|0.7|9.9|dB|
|||10 dBm, -5 dBm < Output power <<br>0 dBm|0.6|1.1|1.8|dB|
|||10 dBm, 0 dBm < Output power <<br>10 dBm|0.1|0.3|0.8|dB|
|||20 dBm, VDD = 3.3 V, Output<br>power < 0 dBm|0.9|3.6|14.4|dB|
|||20 dBm, 0 dBm < Output power <<br>20 dBm|0.1|0.2|1.3|dB|
|Output power variation vs<br>supply voltage variation, fre-<br>quency = 2450 MHz|POUTVAR_V|20 dBm output power with VDD<br>voltage swept from 1.8 V to 3.8 V|—|5.4|—|dB|
|||10 dBm output power with VDD<br>voltage swept from 1.8 V to 3.8 V|—|0.05|—|dB|
|||0 dBm output power with VDD<br>voltage swept from 1.8 V to 3.8 V|—|0.01|—|dB|
|Output power variation vs<br>temperature, Frequency =<br>2450 MHz|POUTVAR_T|20 dBm, VDD = 3.3 V, (-40 to<br>+105 °C)|—|0.2|—|dB|
|||10 dBm, (-40 to +105 °C)|—|0.3|—|dB|
|||0 dBm, (-40 to +105 °C)|—|1.0|—|dB|
|Output power variation over<br>the RF tuning frequency<br>range|POUTVAR_F|20 dBm, VDD = 3.3 V|—|0.2|—|dB|
|||10 dBm|—|0.2|—|dB|
|||0 dBm|—|0.2|—|dB|
|**Note:**<br>1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-<br>ered in this data sheet can be found in the TX Power column of the Ordering Information Table.<br>2. The maximum output power for Bluetooth Low Energy is limited to 19.6 dBm for compliance with the Bluetooth Core Specifica-<br>tion.|||||||
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications
## **4.6 RF Receiver General Characteristics for the 2.4 GHz Band**
Unless otherwise indicated, typical conditions are: VDD = 3.0 V, DC-DC in regulation. RF center frequency 2.45 GHz. TA = 25 °C.
**Table 4.6. RF Receiver General Characteristics for the 2.4 GHz Band**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|RF tuning frequency range|FRANGE||2402|—|2480|MHz|
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications
## **4.7 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate**
Unless otherwise indicated, typical conditions are: VDD = 3.0 V, DC-DC in regulation. RF center frequency 2.45 GHz. TA = 25 °C.
**Table 4.7. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Max usable receiver input<br>level|SAT|Signal is reference signal1|—|10|—|dBm|
|Sensitivity|SENS|10 dBm Module, Signal is refer-<br>ence signal, 37 byte payload1|—|-98.5|—|dBm|
|||10 dBm Module, Signal is refer-<br>ence signal, 255 byte payload1|—|-96.9|—|dBm|
|||10 dBm Module, With non-ideal<br>signals2 1|—|-96.5|—|dBm|
|||20 dBm Module, Signal is refer-<br>ence signal, 37 byte payload1|—|-97.6|—|dBm|
|||20 dBm Module, Signal is refer-<br>ence signal, 255 byte payload1|—|-96|—|dBm|
|||20 dBm Module, With non-ideal<br>signals2 1|—|-95.6|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 3|—|8.7|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +1<br>MHz offset1 4 3 5|—|-5.4|—|dB|
|||Interferer is reference signal at -1<br>MHz offset1 4 3 5|—|-5.3|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +2<br>MHz offset1 4 3 5|—|-40.9|—|dB|
|||Interferer is reference signal at -2<br>MHz offset1 4 3 5|—|-39.7|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +3<br>MHz offset1 4 3 5|—|-45.5|—|dB|
|||Interferer is reference signal at -3<br>MHz offset1 4 3 5|—|-45.7|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 5|—|-23.3|—|dB|
|Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision1 5|—|-40.9|—|dB|
|||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision1 5|—|-5.4|—|dB|
|Intermodulation performance|IM|n = 3 (see note6)|—|-17.3|—|dBm|
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|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|**Note:**<br>1. 0.017% Bit Error Rate.<br>2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>3. Desired signal -67 dBm.<br>4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>5. With allowed exceptions.<br>6. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4|||||||
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## **4.8 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate**
Unless otherwise indicated, typical conditions are: VDD = 3.0 V, DC-DC in regulation. RF center frequency 2.45 GHz. TA = 25 °C.
**Table 4.8. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Max usable receiver input<br>level|SAT|Signal is reference signal1|—|10|—|dBm|
|Sensitivity|SENS|10 dBm Module, Signal is refer-<br>ence signal, 37 byte payload1|—|-95.7|—|dBm|
|||10 dBm Module, Signal is refer-<br>ence signal, 255 byte payload1|—|-94.2|—|dBm|
|||10 dBm Module, With non-ideal<br>signals2 1|—|-93.9|—|dBm|
|||20 dBm Module, Signal is refer-<br>ence signal, 37 byte payload1|—|-94.8|—|dBm|
|||20 dBm Module, Signal is refer-<br>ence signal, 255 byte payload1|—|-93.3|—|dBm|
|||20 dBm Module, With non-ideal<br>signals2 1|—|-93.1|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 3|—|8.6|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +2<br>MHz offset1 4 3 5|—|-5.3|—|dB|
|||Interferer is reference signal at -2<br>MHz offset1 4 3 5|—|-5.8|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +4<br>MHz offset1 4 3 5|—|-42.2|—|dB|
|||Interferer is reference signal at -4<br>MHz offset1 4 3 5|—|-44.2|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +6<br>MHz offset1 4 3 5|—|-48.1|—|dB|
|||Interferer is reference signal at -6<br>MHz offset1 4 3 5|—|-50.2|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 5|—|-22.8|—|dB|
|Selectivity to image frequen-<br>cy ± 2 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +2 MHz with 1<br>MHz precision1 5|—|-42.2|—|dB|
|||Interferer is reference signal at im-<br>age frequency -2 MHz with 1 MHz<br>precision1 5|—|-5.3|—|dB|
|Intermodulation performance|IM|n = 3 (see note6)|—|-18.3|—|dBm|
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|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|**Note:**<br>1. 0.017% Bit Error Rate.<br>2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>3. Desired signal -64 dBm.<br>4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>5. With allowed exceptions.<br>6. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4|||||||
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## **4.9 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate**
Unless otherwise indicated, typical conditions are: VDD = 3.0 V, DC-DC in regulation. RF center frequency 2.45 GHz. TA = 25 °C.
**Table 4.9. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Max usable receiver input<br>level|SAT|Signal is reference signal1|—|10|—|dBm|
|Sensitivity|SENS|10 dBm Module, Signal is refer-<br>ence signal, 37 byte payload1|—|-102.2|—|dBm|
|||10 dBm Module, Signal is refer-<br>ence signal, 255 byte payload1|—|-101|—|dBm|
|||10 dBm Module, With non-ideal<br>signals2 1|—|-100|—|dBm|
|||20 dBm Module, Signal is refer-<br>ence signal, 37 byte payload1|—|-101.4|—|dBm|
|||20 dBm Module, Signal is refer-<br>ence signal, 255 byte payload1|—|-100|—|dBm|
|||20 dBm Module, With non-ideal<br>signals2 1|—|-99|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 3|—|2.7|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +1<br>MHz offset1 4 3 5|—|-7.1|—|dB|
|||Interferer is reference signal at -1<br>MHz offset1 4 3 5|—|-7.4|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +2<br>MHz offset1 4 3 5|—|-46.8|—|dB|
|||Interferer is reference signal at -2<br>MHz offset1 4 3 5|—|-49.7|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +3<br>MHz offset1 4 3 5|—|-49.4|—|dB|
|||Interferer is reference signal at -3<br>MHz offset1 4 3 5|—|-54.5|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 5|—|-49|—|dB|
|Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision1 5|—|-49.4|—|dB|
|||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision1 5|—|-46.8|—|dB|
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|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|**Note:**<br>1. 0.017% Bit Error Rate.<br>2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>3. Desired signal -72 dBm.<br>4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>5. With allowed exceptions.|||||||
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## **4.10 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate**
Unless otherwise indicated, typical conditions are: VDD = 3.0 V, DC-DC in regulation. RF center frequency 2.45 GHz. TA = 25 °C.
**Table 4.10. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Max usable receiver input<br>level|SAT|Signal is reference signal1|—|10|—|dBm|
|Sensitivity|SENS|10 dBm Module, Signal is refer-<br>ence signal, 37 byte payload1|—|-106.5|—|dBm|
|||10 dBm Module, Signal is refer-<br>ence signal, 255 byte payload1|—|-106.1|—|dBm|
|||10 dBm Module, With non-ideal<br>signals2 1|—|-105.7|—|dBm|
|||20 dBm Module, Signal is refer-<br>ence signal, 37 byte payload1|—|-105.6|—|dBm|
|||20 dBm Module, Signal is refer-<br>ence signal, 255 byte payload1|—|-105.3|—|dBm|
|||20 dBm Module, With non-ideal<br>signals2 1|—|-104.8|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 3|—|0.9|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +1<br>MHz offset1 4 3 5|—|-12.4|—|dB|
|||Interferer is reference signal at -1<br>MHz offset1 4 3 5|—|-12.8|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +2<br>MHz offset1 4 3 5|—|-52.6|—|dB|
|||Interferer is reference signal at -2<br>MHz offset1 4 3 5|—|-55.5|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +3<br>MHz offset1 4 3 5|—|-53.8|—|dB|
|||Interferer is reference signal at -3<br>MHz offset1 4 3 5|—|-60|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 5|—|-53|—|dB|
|Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision1 5|—|-53.8|—|dB|
|||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision1 5|—|-52.6|—|dB|
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|**Note:**<br>1. 0.017% Bit Error Rate.<br>2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>3. Desired signal -79 dBm.<br>4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>5. With allowed exceptions.|||||||
## **4.11 High-Frequency Crystal**
**Table 4.11. High-Frequency Crystal**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Crystal frequency|fHFXTAL||—|39|—|MHz|
|Initial calibrated accuracy|ACCHFXTAL||-10|+/-5|10|ppm|
|Temperature drift|DRIFTHFXTAL|Across specified temperature<br>range|-20|—|20|ppm|
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## **4.12 Low Frequency Crystal Oscillator**
**Table 4.12. Low Frequency Crystal Oscillator**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Crystal Frequency|FLFXO||—|32.768|—|kHz|
|Supported Crystal equivalent<br>series resistance (ESR)|ESRLFXO|GAIN = 0|—|—|80|kΩ|
|||GAIN = 1 to 3|—|—|100|kΩ|
|Supported range of crystal<br>load capacitance1|CL_LFXO|GAIN = 0|4|—|6|pF|
|||GAIN = 1|6|—|10|pF|
|||GAIN = 2 (see note2)|10|—|12.5|pF|
|||GAIN = 3 (see note2)|12.5|—|18|pF|
|Current consumption|ICL12p5|ESR = 70 kΩ, CL= 12.5 pF,<br>GAIN3= 2, AGC4= 1|—|294|—|nA|
|Startup Time|TSTARTUP|ESR = 70 kΩ, CL= 7 pF, GAIN3=<br>1, AGC4= 1|—|52|—|ms|
|On-chip tuning cap step size|SSLFXO||—|0.26|—|pF|
|On-chip tuning capacitor val-<br>ue at minimum setting5|CLFXO_MIN|CAPTUNE = 0|—|5.2|—|pF|
|On-chip tuning capacitor val-<br>ue at maximum setting5|CLFXO_MAX|CAPTUNE = 0x4F|—|26.2|—|pF|
|**Note:**<br>1. Total load capacitance seen by the crystal<br>2. Crystals with a load capacitance of greater than 12 pF require external load capacitors.<br>3. In LFXO_CAL Register<br>4. In LFXO_CFG Register<br>5. The effective load capacitance seen by the crystal will be CLFXO/2. This is because each XTAL pin has a tuning cap and the two<br>caps will be seen in series by the crystal|||||||
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications
## **4.13 Precision Low Frequency RC Oscillator (LFRCO)**
**Table 4.13. Precision Low Frequency RC Oscillator (LFRCO)**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Nominal oscillation frequen-<br>cy|FLFRCO||—|32.768|—|kHz|
|Frequency accuracy|FLFRCO_ACC|Normal mode|-3|—|3|%|
|||Precision mode1, across operat-<br>ing temperature range2|-500|—|500|ppm|
|Startup time|tSTARTUP|Normal mode|—|204|—|µs|
|||Precision mode1|—|11.7|—|ms|
|Current consumption|ILFRCO|Normal mode|—|189.9|—|nA|
|||Precision mode1, T = stable at 25<br>°C3|—|649.8|—|nA|
|**Note:**<br>1. The LFRCO operates in high-precision mode when CFG_HIGHPRECEN is set to 1. High-precision mode is not available in EM4.<br>2. Includes ± 40 ppm frequency tolerance of the HFXO crystal.<br>3. Includes periodic re-calibration against HFXO crystal oscillator.|||||||
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications
## **4.14 GPIO Pins**
## **Table 4.14. GPIO Pins**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Leakage current|ILEAK_IO|MODEx = DISABLED, VDD = 3.0<br>V|—|2.5|—|nA|
|Input low voltage1|VIL|Any GPIO pin|—|—|0.3*VDD|V|
|||RESETn|—|—|0.3 * DVDD|V|
|Input high voltage1|VIH|Any GPIO pin|0.7*VDD|—|—|V|
|||RESETn|0.7 * DVDD|—|—|V|
|Hysteresis of input voltage|VHYS|Any GPIO pin|0.05*VDD|—|—|V|
|||RESETn|0.05 *<br>DVDD|—|—|V|
|Output high voltage|VOH|Sourcing 20 mA, VDD = 3.0 V|0.8 * VDD|—|—|V|
|Output low voltage|VOL|Sinking 20 mA, VDD = 3.0 V|—|—|0.2 * VDD|V|
|GPIO rise time|TGPIO_RISE|VDD = 3.0 V, Cload= 50pF,<br>SLEWRATE = 4, 10% to 90%|—|8.4|—|ns|
|GPIO fall time|TGPIO_FALL|VDD = 3.0 V, Cload= 50pF,<br>SLEWRATE = 4, 90% to 10%|—|7.1|—|ns|
|Pull up/down resistance2|RPULL|Any GPIO pin. Pull-up to VDD:<br>MODEn = DISABLE DOUT=1.<br>Pull-down to GND: MODEn =<br>WIREDORPULLDOWN DOUT =<br>0.|35|44|55|kΩ|
|||RESETn pin. Pull-up to DVDD|35|44|55|kΩ|
|Maximum filtered glitch width|TGF|MODE = INPUT, DOUT = 1|—|27|—|ns|
|RESETn low time to ensure<br>pin reset|TRESET||100|—|—|ns|
|**Note:**<br>1. GPIO input thresholds are proportional to the VDD pin. RESETn input thresholds are proportional to the internal DVDD supply,<br>which is generated by the DC-DC converter. DVDD is equal to 1.8 V when DC-DC is active and bypassed to VDD when DC-DC<br>is inactive.<br>2. GPIO pull-ups connect to VDD supply, pull-downs connect to GND. RESETn pull-up connects to internal DVDD supply, which is<br>generated by the DC-DC converter. DVDD is equal to 1.8 V when DC-DC is active and bypassed to VDD when DC-DC is inac-<br>tive.|||||||
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications
## **4.15 Microcontroller Peripherals**
The MCU peripherals set available in BGM240P modules includes:
- ADC: 12-bit at 1 Msps, 16-bit at 76.9 ksps
- 16-bit and 32-bit Timers/Counters
- 24-bit Low Energy Timer for waveform generation
- 32-bit Real Time Counter
- USART (UART/SPI/SmartCards/IrDA/I2S)
- EUSART (UART/IrDA)
- I[2] C peripheral interfaces
- 12 Channel Peripheral Reflex System
For details on their electrical performance, consult the relevant portions of Section 4 in the SoC datasheet.
To learn which GPIO ports provide access to every peripheral, consult 6.3 Analog Peripheral Connectivity and 6.4 Digital Peripheral Connectivity.
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications
## **4.16 Antenna Radiation and Efficiency**
Typical BGM240P radiation patterns for the built-in antenna under optimal operating conditions are plotted in the figures that follow. Antenna gain and radiation patterns have a strong dependence on the size and shape of the application PCB the module is mounted on, as well as on the proximity of any mechanical design to the antenna.
**==> picture [459 x 187] intentionally omitted <==**
**----- Start of picture text -----**<br>
Z<br>Z<br>Y<br>X<br>X<br>**----- End of picture text -----**<br>
**Figure 4.1. Typical 2D Antenna Radiation Patterns - Phi 0[o] (Side View) Gain (dBi)**
**==> picture [458 x 187] intentionally omitted <==**
**----- Start of picture text -----**<br>
Z<br>Z<br>Y<br>Y<br>X<br>**----- End of picture text -----**<br>
**Figure 4.2. Typical 2D Antenna Radiation Patterns - Phi 90[o] (Top View) Gain (dBi)**
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**==> picture [456 x 188] intentionally omitted <==**
**----- Start of picture text -----**<br>
X<br>Z<br>Y<br>Y<br>X<br>**----- End of picture text -----**<br>
**Figure 4.3. Typical 2D Antenna Radiation Patterns - Theta 90[o] (Front View) Gain (dBi)**
**Figure 4.4. 3D Radiation Pattern at 2440MHz**
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**Figure 4.5. Efficiency of the Built-in Antenna as Function of the Carrier Board Width(mm)**
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Reference Diagrams
## **5. Reference Diagrams**
## **5.1 Network Co-Processor (NCP) Application with UART Host**
The BGM240P can be controlled over the UART interface as a peripheral to an external host processor. Typical power supply, programming/debug interface, and host interface connections are shown in the figure below. For more details, see _AN958: Debugging and Programming Interfaces for Custom Designs_ .
**Figure 5.1. UART NCP Configuration**
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Reference Diagrams
## **5.2 SoC Application**
The BGM240P can be used in a stand-alone SoC configuration without an external host processor. Typical power supply and programming/debug interface connections are shown in the figure below. For more details, see _AN958: Debugging and Programming Interfaces for Custom Designs_ .
**Figure 5.2. Stand-Alone SoC Configuration**
**Figure 5.3. Stand-Alone SoC Configuration with External Antenna**
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Pin Definitions
## **6. Pin Definitions**
## **6.1 Module Pinout**
**==> picture [187 x 201] intentionally omitted <==**
**----- Start of picture text -----**<br>
Pin 1<br>Index<br>GND 1 36 GND<br>PB04 2 35 GND<br>PB03 3 34 GND<br>PB02 4 33 RFOUT<br>PB01 5 32 GND<br>PB00 6 31 RESET<br>PA00 7 30 PC07<br>PA01 8 29 PC06<br>PA02 9 28 PC05<br>PA03 10 27 PC04<br>PA04 11 26 PC03<br>PA05 12 25 PC02<br>PA06 13 24 PC01<br>GND 14 15 16 17 18 19 20 21 22 23 GND<br>VDD PA07 PA08 PD03 PD02 PD01 PD00 PC00<br>**----- End of picture text -----**<br>
**Figure 6.1. BGM240P Module Pinout**
The next table shows the BGM240P pinout and general descriptions for each pin. Refer to 6.2 Alternate Pin Functions, 6.3 Analog Peripheral Connectivity, and 6.4 Digital Peripheral Connectivity for details on functions and peripherals supported by each GPIO pin.
**Table 6.1. BGM240P Module Pin Definitions**
|**Pin Name**|**No.**|**Description**||**Pin Name**|**No.**|**Description**|
|---|---|---|---|---|---|---|
|GND|1|Ground||PB04|2|GPIO|
|PB03|3|GPIO||PB02|4|GPIO|
|PB01|5|GPIO||PB00|6|GPIO|
|PA00|7|GPIO||PA01|8|GPIO|
|PA02|9|GPIO||PA03|10|GPIO|
|PA04|11|GPIO||PA05|12|GPIO|
|PA06|13|GPIO||GND|14|Ground|
|VDD|15|Power supply||PA07|16|GPIO|
|PA08|17|GPIO||PD03|18|GPIO|
|PD02|19|GPIO||PD01|20|GPIO|
|PD00|21|GPIO||PC00|22|GPIO|
|GND|23|Ground||PC01|24|GPIO|
|PC02|25|GPIO||PC03|26|GPIO|
|PC04|27|GPIO||PC05|28|GPIO|
|PC06|29|GPIO||PC07|30|GPIO|
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|**Pin Name**|**No.**|**Description**||**Pin Name**|**No.**|**Description**|
|---|---|---|---|---|---|---|
|RESETn|31|Reset Pin. The RESETn pin is pulled up<br>to an internal DVDD supply. An external<br>pull-up is not recommended. To apply<br>an external reset source to this pin, it is<br>required to only drive this pin low during<br>reset, and let the internal pull-up ensure<br>that reset is released. The RESETn pin<br>can be left unconnected if no external<br>reset switch or source is used.||GND|32|Ground|
|RFOUT|33|RF input/output||GND|34|Ground|
|GND|35|Ground||GND|36|Ground|
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Pin Definitions
## **6.2 Alternate Pin Functions**
Some GPIOs support alternate functions like debugging, wake-up from EM4, external low frequency crystal access, etc.. The following table shows which module pins have alternate capabilities and the functions they support. Refer to the SoC's reference manual for more details.
**Table 6.2. GPIO Alternate Functions Table**
|**GPIO**|**Alternate Functions**|**Alternate Functions**|**Alternate Functions**|
|---|---|---|---|
|PA00|IADC0.VREFP|||
|PA01|GPIO.SWCLK|||
|PA02|GPIO.SWDIO|||
|PA03|GPIO.SWV<br>GPIO.TDO<br>GPIO.TRACEDATA0|||
|PA04|GPIO.TDI<br>GPIO.TRACECLK|||
|PA05|GPIO.TRACEDATA1<br>GPIO.EM4WU0|||
|PA06|GPIO.TRACEDATA2|||
|PA07|GPIO.TRACEDATA3|||
|PB00|VDAC0.VDAC_CH0_MAIN_OU<br>TPUT|||
|PB01|GPIO.EM4WU3|VDAC0.VDAC_CH1_MAIN_OU<br>TPUT||
|PB02|VDAC1.VDAC_CH0_MAIN_OU<br>TPUT|||
|PB03|GPIO.EM4WU4|VDAC1.VDAC_CH1_MAIN_OU<br>TPUT||
|PC00|GPIO.EM4WU6|||
|PC01|GPIO.EFP_TX_SDA|||
|PC02|GPIO.EFP_TX_SCL|||
|PC05|GPIO.EFP_INT<br>GPIO.EM4WU7|||
|PC07|GPIO.EM4WU8|GPIO.THMSW_EN|GPIO.THMSW_HALFSWITCH|
|PD00|LFXO.LFXTAL_O|||
|PD01|LFXO.LFXTAL_I<br>LFXO.LF_EXTCLK|||
|PD02|GPIO.EM4WU9|||
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Pin Definitions
## **6.3 Analog Peripheral Connectivity**
Many analog resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port. When a differential connection is being used positive inputs are restricted to the EVEN pins and negative inputs are restricted to the ODD pins. When a single ended connection is being used positive input is avaliable on all pins. See the SoC's Reference Manual for more details on the ABUS and analog peripherals.
**Table 6.3. ABUS Routing Table**
|**Peripheral**|**Signal**|**PA**|**PA**|**PB**|**PB**|**PC**|**PC**|**PD**|**PD**|
|---|---|---|---|---|---|---|---|---|---|
|||**EVEN**|**ODD**|**EVEN**|**ODD**|**EVEN**|**ODD**|**EVEN**|**ODD**|
|ACMP0|ANA_NEG|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
||ANA_POS|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
|ACMP1|ANA_NEG|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
||ANA_POS|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
|IADC0|ANA_NEG|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
||ANA_POS|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
|VDAC0|VDAC_CH0_ABUS_OUT-<br>PUT|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
||VDAC_CH1_ABUS_OUT|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
|VDAC1|VDAC_CH0_ABUS_OUT-<br>PUT|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
||VDAC_CH1_ABUS_OUT|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Pin Definitions
## **6.4 Digital Peripheral Connectivity**
Many digital resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port.
**Table 6.4. DBUS Routing Table**
|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|---|
||**PA**|**PB**|**PC**|**PD**|
|ACMP0.DIGOUT|Available|Available|Available|Available|
|ACMP1.DIGOUT|Available|Available|Available|Available|
|CMU.CLKIN0|||Available|Available|
|CMU.CLKOUT0|||Available|Available|
|CMU.CLKOUT1|||Available|Available|
|CMU.CLKOUT2|Available|Available|||
|EUSART0.CS|Available|Available|||
|EUSART0.CTS|Available|Available|||
|EUSART0.RTS|Available|Available|||
|EUSART0.RX|Available|Available|||
|EUSART0.SCLK|Available|Available|||
|EUSART0.TX|Available|Available|||
|EUSART1.CS|Available|Available|Available|Available|
|EUSART1.CTS|Available|Available|Available|Available|
|EUSART1.RTS|Available|Available|Available|Available|
|EUSART1.RX|Available|Available|Available|Available|
|EUSART1.SCLK|Available|Available|Available|Available|
|EUSART1.TX|Available|Available|Available|Available|
|FRC.DCLK|||Available|Available|
|FRC.DFRAME|||Available|Available|
|FRC.DOUT|||Available|Available|
|HFXO0.BUFOUT_REQ_IN_ASYNC|Available|Available|||
|I2C0.SCL|Available|Available|Available|Available|
|I2C0.SDA|Available|Available|Available|Available|
|I2C1.SCL|||Available|Available|
|I2C1.SDA|||Available|Available|
|KEYSCAN.COL_OUT_0|Available|Available|Available|Available|
|KEYSCAN.COL_OUT_1|Available|Available|Available|Available|
|KEYSCAN.COL_OUT_2|Available|Available|Available|Available|
|KEYSCAN.COL_OUT_3|Available|Available|Available|Available|
|KEYSCAN.COL_OUT_4|Available|Available|Available|Available|
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BGM240P Wireless Gecko Bluetooth Module Data Sheet
Pin Definitions
|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|---|
||**PA**|**PB**|**PC**|**PD**|
|KEYSCAN.COL_OUT_5|Available|Available|Available|Available|
|KEYSCAN.COL_OUT_6|Available|Available|Available|Available|
|KEYSCAN.COL_OUT_7|Available|Available|Available|Available|
|KEYSCAN.ROW_SENSE_0|Available|Available|||
|KEYSCAN.ROW_SENSE_1|Available|Available|||
|KEYSCAN.ROW_SENSE_2|Available|Available|||
|KEYSCAN.ROW_SENSE_3|Available|Available|||
|KEYSCAN.ROW_SENSE_4|Available|Available|||
|KEYSCAN.ROW_SENSE_5|Available|Available|||
|LETIMER0.OUT0|Available|Available|||
|LETIMER0.OUT1|Available|Available|||
|MODEM.ANT0|Available|Available|Available|Available|
|MODEM.ANT1|Available|Available|Available|Available|
|MODEM.ANT_ROLL_OVER|||Available|Available|
|MODEM.ANT_RR0|||Available|Available|
|MODEM.ANT_RR1|||Available|Available|
|MODEM.ANT_RR2|||Available|Available|
|MODEM.ANT_RR3|||Available|Available|
|MODEM.ANT_RR4|||Available|Available|
|MODEM.ANT_RR5|||Available|Available|
|MODEM.ANT_SW_EN|||Available|Available|
|MODEM.ANT_SW_US|||Available|Available|
|MODEM.ANT_TRIG|||Available|Available|
|MODEM.ANT_TRIG_STOP|||Available|Available|
|MODEM.DCLK|Available|Available|||
|MODEM.DIN|Available|Available|||
|MODEM.DOUT|Available|Available|||
|PCNT0.S0IN|Available|Available|||
|PCNT0.S1IN|Available|Available|||
|PRS.ASYNCH0|Available|Available|||
|PRS.ASYNCH1|Available|Available|||
|PRS.ASYNCH2|Available|Available|||
|PRS.ASYNCH3|Available|Available|||
|PRS.ASYNCH4|Available|Available|||
|PRS.ASYNCH5|Available|Available|||
|PRS.ASYNCH6|||Available|Available|
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BGM240P Wireless Gecko Bluetooth Module Data Sheet
Pin Definitions
|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|---|
||**PA**|**PB**|**PC**|**PD**|
|PRS.ASYNCH7|||Available|Available|
|PRS.ASYNCH8|||Available|Available|
|PRS.ASYNCH9|||Available|Available|
|PRS.ASYNCH10|||Available|Available|
|PRS.ASYNCH11|||Available|Available|
|PRS.ASYNCH12|Available|Available|||
|PRS.ASYNCH13|Available|Available|||
|PRS.ASYNCH14|Available|Available|||
|PRS.ASYNCH15|Available|Available|||
|PRS.SYNCH0|Available|Available|Available|Available|
|PRS.SYNCH1|Available|Available|Available|Available|
|PRS.SYNCH2|Available|Available|Available|Available|
|PRS.SYNCH3|Available|Available|Available|Available|
|RAC.LNAEN|Available|Available|Available|Available|
|RAC.PAEN|Available|Available|Available|Available|
|TIMER0.CC0|Available|Available|Available|Available|
|TIMER0.CC1|Available|Available|Available|Available|
|TIMER0.CC2|Available|Available|Available|Available|
|TIMER0.CDTI0|Available|Available|Available|Available|
|TIMER0.CDTI1|Available|Available|Available|Available|
|TIMER0.CDTI2|Available|Available|Available|Available|
|TIMER1.CC0|Available|Available|Available|Available|
|TIMER1.CC1|Available|Available|Available|Available|
|TIMER1.CC2|Available|Available|Available|Available|
|TIMER1.CDTI0|Available|Available|Available|Available|
|TIMER1.CDTI1|Available|Available|Available|Available|
|TIMER1.CDTI2|Available|Available|Available|Available|
|TIMER2.CC0|Available|Available|||
|TIMER2.CC1|Available|Available|||
|TIMER2.CC2|Available|Available|||
|TIMER2.CDTI0|Available|Available|||
|TIMER2.CDTI1|Available|Available|||
|TIMER2.CDTI2|Available|Available|||
|TIMER3.CC0|||Available|Available|
|TIMER3.CC1|||Available|Available|
|TIMER3.CC2|||Available|Available|
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BGM240P Wireless Gecko Bluetooth Module Data Sheet
Pin Definitions
|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|---|
||**PA**|**PB**|**PC**|**PD**|
|TIMER3.CDTI0|||Available|Available|
|TIMER3.CDTI1|||Available|Available|
|TIMER3.CDTI2|||Available|Available|
|TIMER4.CC0|Available|Available|||
|TIMER4.CC1|Available|Available|||
|TIMER4.CC2|Available|Available|||
|TIMER4.CDTI0|Available|Available|||
|TIMER4.CDTI1|Available|Available|||
|TIMER4.CDTI2|Available|Available|||
|USART0.CLK|Available|Available|Available|Available|
|USART0.CS|Available|Available|Available|Available|
|USART0.CTS|Available|Available|Available|Available|
|USART0.RTS|Available|Available|Available|Available|
|USART0.RX|Available|Available|Available|Available|
|USART0.TX|Available|Available|Available|Available|
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Design Guidelines
## **7. Design Guidelines**
## **7.1 Layout and Placement**
For optimal performance of the BGM240P,
- Place the module aligned to the edge of the application PCB, as illustrated in the figures below.
- Optional on the module with the RF pin.
- Leave the antenna clearance area void of any traces, components, or copper on all layers of the application PCB if you are going to use the built-in antenna.
- Antenna clearance area is not necessary if you are using an external antenna attached to the RF pin.
- RFOUT can be left floating if not used.
- Antennas external to the module, either connectorized off-the-shelf antennas or PCB trace antennas, must be well-matched to 50 Ω.
- For external antenna use cases, use a 50 Ω grounded coplanar transmission line to trace the signal from the RF pin to an external RF connector if applicable (see Figure 7.2 Recommended Layout for BGM240P Using External Antenna on page 44).
- A general rule is to use 50 Ω transmission lines where the length of the RF trace is longer than λ/16 at the fundamental frequency, which for 2.4 GHz is approximately 3.5 mm.
- A U.FL connector can be used in the host PCB for the connection to an external antenna. The use of a U.FL connector is also recommended for conductive tests. The integrator must use a unique connector, such as a “reverse polarity SMA” or “reverse thread SMA”, if detachable antenna is offered with the host chassis. This is especially required for the FCC and ISED approvals to remain valid, and any other kind of direct connector to the antenna might require a permissive change.
- A trace length of 1.84 mm was used in the certifications host board to connect the module RF pin to the U.FL connector.
- For reference, Figure 7.4 RF Trace Design Example on page 45 shows a set of parameters for a 50 Ω trace. Trace impedance should always be matched to the particular stack-up used on the host board.
- Connect all ground pads directly to a solid ground plane.
- Place the ground vias as close to the ground pads as possible.
- Avoid plastic or any other dielectric material in contact with the antenna.
**==> picture [270 x 207] intentionally omitted <==**
**----- Start of picture text -----**<br>
Align module edge with PCB edge<br>GND GND<br>Antenna Clearance No metal in this area GND<br>GND<br>Place vias close to<br>each of the<br>module’s GND pads GND<br>Wireless Module<br>(Top View)<br>GND GND<br>Place vias along all PCB edges<br>**----- End of picture text -----**<br>
**Figure 7.1. Recommended Layout for BGM240P Using Built-in Antenna**
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Design Guidelines
**==> picture [246 x 207] intentionally omitted <==**
**----- Start of picture text -----**<br>
Align module edge with PCB edge (OPTIONAL)<br>1 j J | f<br>GND GND<br>GND<br>GND U.FL<br>Place vias close to RFOUT connector<br>module’s GND padseach of the GND for external antenna<br>50 Ohm<br>Wireless Module trace<br>(Top View) for RF signal<br>GND GND<br>oh<br>Place vias along all PCB edges<br>**----- End of picture text -----**<br>
**Figure 7.2. Recommended Layout for BGM240P Using External Antenna**
The figure below illustrates layout scenarios that will lead to severely degraded RF performance for the module.
**==> picture [212 x 150] intentionally omitted <==**
**----- Start of picture text -----**<br>
Copper<br>Clearance<br>Area<br>“NI Ss —<br>GND plane width<br>X<br>**----- End of picture text -----**<br>
**Figure 7.3. Non-Optimal Layout Examples**
The width of the GND plane to the sides the module will impact the efficiency of the built-in antenna. To achieve optimal performance, a GND plane width of 55 - 60 mm is recommended. Narrower ground planes can be used but will result in compromised RF performance. See 4.16 Antenna Radiation and Efficiency for reference.
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Design Guidelines
**Figure 7.4. RF Trace Design Example**
## **7.2 Proximity to Other Materials**
Avoid placing plastic or any other dielectric material in close proximity to the antenna. Conformal coating and other thin dielectric layers are acceptable directly on top of the antenna region, but this will also negatively impact antenna efficiency and reduce range.
Any metallic objects in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended distance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCB ground planes.
## **7.3 Proximity to Human Body**
Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range.
## **7.4 Reset**
The BGM240P can be reset by pulling the RESET line low, by the internal watchdog timer, or by software command.
The reset state does not provide power saving functionality and it is not recommended as a means to conserve power.
## **7.5 Debug**
See _AN958: Debugging and Programming Interfaces for Custom Designs_ .
The BGM240P supports hardware debugging via 4-pin JTAG or 2-pin serial-wire debug (SWD) interfaces. It is recommended to expose the debug pins in your own hardware design for firmware update and debug purposes. The table below lists the required pins for JTAG and SWD debug interfacing, which are also presented in Section 6.2 Alternate Pin Functions.
If JTAG interfacing is enabled, the module must be power cycled to return to a SWD debug configuration if necessary.
**Table 7.1. Debug Pins**
|**Pin Name**|**JTAG Signal**|**SWD Signal**|**Comments**|
|---|---|---|---|
|PA04|TDI|N/A|This pin is disabled after reset. Once enabled the pin has a built-in<br>pull-up.|
|PA03|TDO|N/A|This pin is disabled after reset.|
|PA02|TMS|SWDIO|Pin is enabled after reset and has a built-in pull-up.|
|PA01|TCK|SWCLK|Pin is enabled after reset and has a built-in pull-down.|
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Design Guidelines
## **7.6 Packet Trace Interface (PTI)**
The BGM240P integrates a true PHY-level packet trace interface (PTI) peripheral that can capture packets non-intrusively to monitor and log device and network traffic without burdening processing resources in the module's SoC. The PTI generates two output signals that can serve as a powerful debugging tool, especially in conjunction with other hardware and software development tools available from Silicon Labs. The PTI_DATA and PTI_FRAME signals can be accessed through any GPIO on ports C and D (see FRC.DOUT and FRC.DFRAME peripheral resources in 6. Pin Definitions.
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Package Specifications
## **8. Package Specifications**
## **8.1 Package Outline**
**Figure 8.1. Top and Side Views**
**Figure 8.2. Bottom View**
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Package Specifications
## **8.2 PCB Land Pattern**
**Figure 8.3. Recommended Land Pattern for Modules with a Built-in Antenna**
For modules with an RF pin, the antenna keep out zone seen in the land pattern above should be omitted.
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Package Specifications
## **8.3 Package Marking**
The figure below shows the module markings engraved on the RF shield.
**Figure 8.4. BGM240P Top Marking**
## **Mark Description**
The package marking consists of:
- BGM240Pxxxxxxx - Part number designation
- Model: BGM240Pxxx - Model number designation
- QR Code: YYWWMMABCDE
- YY – Last two digits of the assembly year
- WW – Two-digit workweek when the device was assembled
- MMABCDE – Silicon Labs unit code
- YYWWTTTTTT
- YY – Last two digits of the assembly year
- WW – Two-digit workweek when the device was assembled
- TTTTTT – Manufacturing trace code. The first letter is the device revision
- Certification-related information (such as the CE Mark, FCC and IC IDs, etc.) is being engraved on the grayed out area, or printed on the back side of the module (silkscreen), according to regulatory body requirements.
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Soldering Recommendations
## **9. Soldering Recommendations**
It is recommended that final PCB assembly of the BGM240P follows the industry standard as identified by the Institute for Printed Circuits (IPC). This product is assembled in compliance with the J-STD-001 requirements and the guidelines of IPC-AJ-820. Surface mounting of this product by the end user is recommended to follow IPC-A-610 to meet or exceed class 2 requirements.
## **CLASS 1 General Electronic Products**
Includes products suitable for applications where the major requirement is function of the completed assembly.
## **CLASS 2 Dedicated Service Electronic Products**
Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically the end-use environment would not cause failures.
## **CLASS 3 High Performance/Harsh Environment Electronic Products**
Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems.
**Note:** General SMT application notes are provided in the AN1223 document.
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Tape and Reel
## **10. Tape and Reel**
BGM240P modules are delivered to the customer in cut tape (100 pcs) or reel (1000 pcs) packaging having the dimensions below. All dimensions are given in mm unless otherwise indicated.
**Figure 10.1. Carrier Tape Dimensions**
**Figure 10.2. Reel Dimensions**
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Certifications
## **11. Certifications**
This section details the certification status of the module with regards to regional regulatory radio approvals. Where applicable, the status with the qualifications against the specifications of the supported industrial wireless standards is given too.
The address of the module manufacturer (technology owner) and certification applicant is:
SILICON LABS / SILICON LABORATORIES FINLAND OY Alberga Business Park, Bertel Jungin aukio 3, 02600 Espoo, Finland
The BGM240P modules have brand name of "Silicon Labs".
"Silicon Labs" is a trademark globally owned by the Silicon Laboratories Inc. corporation, and all branches and subsidiaries, including the above applicant, holds the right to use it.
## **11.1 Qualified Antennas**
The BGM240P modules have been tested and certified both with the built-in integral antenna and with a reference external antenna attached to the module's RF pin denoted as RFOUT. The antenna impedance is 50 Ω.
Performance characteristics for the built-in antenna are presented in 3.3 Antenna and 4.16 Antenna Radiation and Efficiency. The details of the qualified external antenna are summarized in the table below.
## **Table 11.1. Qualified External Antennas for BGM240P**
|**Antenna Type**|**Maximum Gain**|**Impedance**|
|---|---|---|
|Connectorized Coaxial Dipole|2.8 dBi|50 Ω|
Any external antenna of the same general type and of equal or less directional gain compared to the one listed in the above table, and having similar in-band and out-of-band characteristics, can be used in the regulatory areas that have modular radio approvals, such as USA and Canada, as long as spot-check testing of the host is performed to verify that no performance changes compromising compliance have been introduced. In the particular FCC case, in order to comply with e-CFR Title 47, Part 15, Subpart C, Section 15.203, the module integrator using an external antenna must ensure it has a unique connector or it is nondetachable.
In countries applying the ETSI standards, where manufacturers issue a self-Declaration of Conformity before placing products in the market, like in the EU countries, the radiated emissions are always tested with the end-product and the antenna type is not critical, but antennas with higher gain may violate some of the regulatory limits.
When using instead an external antenna of a different type (such as a chip antenna, a PCB trace antenna, or a patch) or having nonsimilar in-band and out-of-band characteristics, but still with a gain less than or equal to the maximum gain listed in the table above, in principle it can be added to an existing modular grant/certificate by mean of a permissive change (for example with FCC and ISED), or by the administrative registration of such additional antenna (for example with MIC and KC). In many of these cases, some radiated emission testing is demanded, but no modular or end-product re-certification is required.
On the other hand, all products with external antennas having more gain than the maximum gain listed in the table above are very likely to require a full new end-product certification. Since the exact permissive change or registration or re-certification procedure is chosen on a case-by-case basis, please consult your certification house and/or a certification body for understanding the correct approach based on your unique design. You might also want or need to get in touch with Silicon Labs for any authorization letter that your certification body might ask for.
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Certifications
## **11.2 CE and UKCA - EU and UK**
The BGM240P modules have been tested against the relevant harmonized/designated standards and are in conformity with the essential requirements and other relevant requirements of the EU's Radio Equipment Directive (RED) (2014/53/EU) and of the UK's Radio Equipment Regulations (RER) (S.I. 2017/1206).
Please notice that every end-product integrating a BGM240P module will need to perform the radio EMC tests on the whole assembly, according to the ETSI 301 489-x relevant standards.
Furthermore, it is ultimately the responsibility of the manufacturers to ensure the compliance of their end-products as a whole. The specific product assembly is likely to have an impact to RF radiated characteristics, when compared to the bare module. Hence, manufacturers should carefully consider RF radiated testing with the final product assembly, especially taking into account the gain of the external antenna if any, and the possible deviations in the PSD, EIRP and spurious emissions measurements, as defined in the ETSI EN 300 328 standard.
The modules are entitled to carry the CE and UKCA Marks, and a formal Declaration of Conformity (DoC) is available at the product web page which is reachable starting from https://www.silabs.com/.
## **11.3 FCC - USA**
This device complies with FCC's e-CFR Title 47, Part 15, Subpart C, Section 15.247 (and related relevant parts of the ANSI C63.10 standard) when operating with the built-in integral antenna or with an external antenna type as discussed in chapter 11.1.
Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesirable operation.
Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment.
## **FCC RF Radiation Exposure Statement**
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance.
This transmitter meets the Mobile requirements at a distance of 20 cm and above from the human body, in accordance to the limit(s) exposed in the RF Exposure Analysis. This transmitter also meets the Portable requirements at distances equal or above 9.9 mm for the BGM240P22A, 31.6 mm for the BGM240P32A and 33.9 mm for the BGM240P32N in the case of Bluetooth Low Energy. These distances are reported for convenience also in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 60.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures.
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Certifications
## **OEM Responsibilities to comply with FCC Regulations**
This module has been tested for compliance to FCC Part 15.
OEM integrators are responsible for testing their end-product for any additional compliance requirements needed with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).
Additionally, investigative measurements and spot-checking are strongly recommended to verify that the full system compliance is maintained when the module is integrated, even with a module having a full modular approval, in accordance with the "Host Product Testing Guidance" in FCC's KDB 996369 D04 Module Integration Guide V01.
## • **General Considerations**
This transmitter module is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B (unintentional radiator) rule requirement, which is typically applicable to the final host. The final host will still need to be assessed for compliance to this portion of the rule requirements, if applicable.
- **Manual Information to the End User**
The OEM integrator has to be aware not to provide information to the end-user regarding how to install or remove this RF module, or how to change RF related parameters, in the user’s manual of the final product which integrates this module.
The end user manual shall include all required regulatory information/warnings as shown in this manual.
## • **Host Manufacturer Responsibilities**
Host manufacturers are ultimately responsible for the full compliance of their host system. The final product is supposed to be assessed against all the essential requirements of the FCC rules, such as FCC Part 15 Subpart B, before it can be placed on the US market. This includes re-assuring the compliance of the radio transmitter with the RF and EMF essential requirements of the FCC rules. The modular radio transmitter must not be incorporated into any other radio-equipped device or system without retesting for compliance as multi-radio and combined equipment.
Except for minor cosmetic changes, most changes to an FCC certified equipment require testing to determine whether the change is a Class I or Class II permissive change. For more details about using the Single Modular Transmitter, refer to the following FCC documents:
- KDB 996369 D01 Transmitter Module Equipment Authorization Guide
- KDB 996369 D02 Frequently Asked Questions and Answers about Modules
- KDB 178919 D01 Permissive Change Policy
- KDB 178919 D02 Permissive Change Frequently-Asked Questions
## **Separation**
- To meet the SAR exemption for portable conditions, the minimum separation distance indicated in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 60 must be maintained between the human body and the radiator (antenna) at all times. In particular, in the use case of Bluetooth Low Energy the minimum distance must be 9.9 mm for the BGM240P22A, 31.6 mm for the BGM240P32A and 33.9 mm for the BGM240P32N.
- This transmitter module is tested in a standalone RF Exposure condition, and in case of any co-located radio transmitter being allowed to transmit simultaneously, or in case of portable use at closer distances from the human body than those allowing the exceptions rules to be applied, a separate additional SAR evaluation, or a reduction in the max output power or in the duty-cycle, might be required for the host, ultimately leading to a Class II Permissive Change, or more rarely to a new grant.
- **Important Note:** In the event that the conditions for the exemption cannot be met, the final product will likely have to undergo additional testing to evaluate the RF Exposure, or go through some re-configuration of the max output power and/or duty-cycle in order for the FCC authorization to remain valid, and a permissive change will have to be applied. The SAR evaluation (and/or reconfiguration) is in the responsibility of the end-product’s manufacturer, as well as the permissive change that can be carried out with the help of the customer's own Telecommunication Certification Body, following a Change in ID authorization by the module's original grant holder.
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Certifications
## **End Product Labeling**
BGM240P modules are labeled with their own FCC ID. In all those cases when the FCC ID is not visible after the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final product must be labeled in a visible area with the following:
## **"Contains Transmitter Module FCC ID: QOQ-GM240P"**
or
## **"Contains FCC ID: QOQ-GM240P"**
**Final note** : As long as all the conditions in this and all the above chapters are met, further RF testing of the transmitter will not be strictly required. However, still consider the good practice and the FCC strong recommendation to ensure the compliance of the host by spot-checking. Nevertheless, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements which might be mandatory with this module installed.
## **Class B Device Notice**
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna
- Increase the separation between the equipment and receiver
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected
- Consult the dealer or an experienced radio/TV technician for help
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Certifications
## **11.4 ISED - Canada**
This radio transmitter (IC: 5123A-GM240P) has been approved by _Innovation, Science and Economic Development Canada (ISED Canada, formerly Industry Canada_ ) to operate with the built-in integral antenna and with the antenna type(s) listed in Section 11.1 Qualified Antennas, with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain listed, are strictly prohibited for use with this device.
- This radio-equipped device complies with ISED's license-exempt RSS standards. Operation is subject to the following two conditions: 1. This device may not cause interference; and
2. This device must accept any interference, including interference that may cause undesired operation of the device
## **RF Exposure Statement**
Exception from routine SAR evaluation limits are given in RSS-102 Issue 5.
The module meets the requirements for Mobile use cases when the minimum separation distance from the human body is 20 cm or greater, in accordance to the limit(s) exposed in the RF Exposure Analysis.
For Portable use cases, RF exposure or SAR evaluation is not required when the separation distances from the human body are equal or above 15 mm for the BGM240P22A, 39.3 mm for the BGM240P32A and 40 mm for the BGM240P32N in the case of Bluetooth Low Energy.
If the separation distance from the human body is less than the values stated above, which are also reported in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 60 for convenience, then the OEM integrator is responsible for evaluating the SAR with the end-product, or for the re-configuration of the radio module in the host in terms of lowering the max RF TX power and/or the duty-cycle. A permissive change would be required too, under the responsibility of the host manufacturer, following a Multiple Listing authorization by the original module's certificate holder.
## **OEM Responsibilities to comply with IC Regulations**
The BGM240P modules have been certified for integration into products only by OEM integrators under the following conditions:
- The antenna must be installed such that a minimum separation distance as stated above is maintained between the radiator (antenna) and all persons at all times.
- The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter.
**Important Note:** In the event that the above conditions cannot be met, the final product will have to undergo additional testing to evaluate the RF Exposure, or go through some re-configuration of the max output power and/or duty-cycle in order for the ISED authorization to remain valid; a permissive change will have to be applied too **.** The RF Exposure evaluation (SAR, or possibly a re-configuration) is in the responsibility of the end-product's manufacturer, as well as the permissive change that can be carried out with the help of the customer's own Telecommunication Certification Body, following a Multiple Listing authorization by the module's original grant holder.
## **End Product Labeling**
The BGM240P modules are labeled with their own IC ID. In all those cases when the IC ID is not visible after a module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final product must be labeled in a visible area with the following:
## “ **Contains Transmitter Module IC: 5123A-GM240P** ”
## or
## “ **Contains IC: 5123A-GM240P”**
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end-product.
As long as all the conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).
## **CAN ICES-003 (B)**
This Class B digital apparatus complies with Canadian ICES-003.
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## **ISED (Français)**
Le présent émetteur radio (IC: 5123A-GM240P) a été approuvé par Innovation, Sciences et Développement Économique Canada (ISED Canada, anciennement Industrie Canada) pour fonctionner avec l'antenne intégrée et le ou les types d'antenne énumérés à la section 11.1 Qualified Antennas, avec le gain maximal admissible indiqué. Les types d'antenne non inclus dans cette liste, ayant un gainsupérieur au gain maximal indiqué, sont strictement interdits d'utilisation avec cet appareil. .
L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes:
1. L’appareil ne doit pas produire de brouillage;
2. L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptibled’en compromettre le fonctionnement.
## **Déclaration d'exposition RF**
L'exception tirée des limites courantes d'évaluation SAR est donnée dans le document RSS-102 Issue 5.
Le module répond aux exigences pour les cas d'utilisation Mobile lorsque la distance minimale de séparation du corps humain est de 20 cm ou plus, conformément à la (aux) limite(s) exposée(s) dans l'analyse de l'exposition RF.
Pour les cas d'utilisation Portables, l'exposition aux fréquences radio ou l'évaluation du SAR n'est pas nécessaire lorsque les distances de séparation du corps humain sont égales ou supérieures à 15 mm pour le BGM240P22A, 39.3 mm pour le BGM240P32A et à 40 mm pour le BGM240P32N dans le cas de Bluetooth Low Energy.
Si la distance de séparation du corps humain est inférieure aux valeurs indiquées ci-dessus, également indiquées dans le tableau 11.2 pour des raisons de commodité, l'intégrateur OEM est responsable de l'évaluation du SAR avec le produit final, ou de la reconfiguration du module radio dans l'hôte en termes de réduction de la puissance RF TX maximale et/ou du rapport cyclique. Une modification permissive serait également nécessaire, sous la responsabilité du fabricant de l'hôte, suite à une autorisation de cotation multiple par le titulaire du certificat du module d'origine.
## **Responsabilités du fabricant de se conformer à la réglementation IC**
Le module a été certifié pour l'intégration dans les produits uniquement par les intégrateurs OEM dans les conditions suivantes:
- L'antenne doit être installée de manière à maintenir une distance de séparation minimale, comme indiqué ci-dessus, entre le radiateur (antenne) et toutes les personnes.
- Le module émetteur ne doit pas être localisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur.
**Remarque Importante:** au cas où ces conditions ne pourraient pas être remplies, le produit final devra être soumis à des tests supplémentaires pour évaluer l'exposition RF, ou passer par une reconfiguration de la puissance de sortie maximale et/ou du rapport cyclique, afin que l'autorisation ISED reste valable; une modification permissive devra également être appliqué. L'évaluation de l'exposition aux radiofréquences (SAR, ou éventuellement une reconfiguration) est sous la responsabilité du fabricant du produit final, ainsi que le changement permissif qui peut être effectué avec l'aide de l'organisme de certification des télécommunications du client, après autorisation de cotation multiple par le titulaire de la certification du module.
## **Étiquetage des produits finis**
Les modules BGM240P est étiqueté avec son propre ID de certification.Si l'ID de certification n'est pas visible lorsque le module est installé dans un autre appareil, l'extérieur de l'appareil dans lequel le module est installé doit également afficher une étiquette faisant référence au module inclus. Dans ce cas, le produit final doit être étiqueté dans une zone visible avec les éléments suivants:
## “ **Contient le module transmetteur IC: 5123A-GM240P** ”
## ou
## “ **Contient IC: 5123A-GM240P”**
L’intégrateur OEM doit être conscient de ne pas fournir à l’utilisateur final d’informations sur la procédure d’installation ou de retrait de ce module RF ni sur la modification des paramètres liés à la RF dans le manuel d’utilisation du produit final.
Tant que toutes les conditions ci-dessus sont remplies, aucun test supplémentaire de l'émetteur ne sera nécessaire. Toutefois, l’intégrateur OEM reste responsable de l’essai de son produit final pour déterminer les exigences de conformité supplémentaires requises avec ce module installé (par exemple, émissions d’appareils numériques, exigences relatives aux périphériques PC, etc.)
## **CAN ICES-003 (B)**
Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Certifications
## **11.5 MIC - Japan**
The BGM240P modules are certified in Japan with following certification numbers:
- Low-power (10dBm) parts with model name BGM240P22A: 020-220131
- High-power (20dBm) parts with model names BGM240P32A and BGM240P32N: 020-220132
It is the end-product manufacturer's responsibility to ensure that a module is configured to meet the compliance limits, as documented in the formal certification test report(s) being available at www.silabs.com. Refer to the API reference manual(s) to learn for example how to configure (limit) the maximum RF TX power for the normal operations, and refer as well to the power setting tables in the test report(s) in order to realize the maximum output power allowed for the regulatory compliance in Japan.
Manufacturers integrating a radio module into their host equipment are supposed to make the certification mark and the certification number visible on the outside of the host equipment. This combination of mark and number, and their relative placement, is depicted in Figure 11.1, and depending on the overall size it might also appear among the top shield markings of the radio module. The certification mark and certification number must be placed close to the text in the Japanese language which is provided below. This requirement in the Radio Law has been made in order to enable users of the combination of host and radio module to verify if they are actually using a radio device which is approved for use in Japan.
Certification Text to be Placed on the Outside Surface of the Host Equipment:
Translation of the text:
“This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law.”
The "Giteki" Mark shown in the following figures must be affixed to an easily noticeable section of the specified radio-enabled host equipment. Note that such section may be required to contain additional information if the end-device embedding the module is also subject to a Telecom approval.
The manufacturer of the final product is also responsible to provide a Japanese language version of the User Manual and/or Installation Instructions as a companion document coming with the final product when placed on the market in Japan. Such a document will have to mention the integrated radio component and the related certification information.
**Figure 11.1. GITEKI Mark and ID**
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Certifications
**Figure 11.2. Detail of GITEKI Mark**
## **11.6 KC - South Korea**
The low-power variant of the BGM240P modules has a RF registration for import and use in South Korea.
Registration number is R-R-BGT-GM240P.
These modules are meant to be integrated into end-products, which then become exempted from doing the RF emission testing, as long as the recommended design guidance is followed, and as long as, where applicable, the approved external antennas are used and any additional transmit power backoff is implemented in accordance to the measurements and configurations seen in the formal test report(s).
EMC testing and any other relevant test applicable to the end-product as a whole, plus appropriate labeling of the end-product, might still be required for the full regulatory compliance in the country.
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Certifications
## **11.7 Human Body Proximity**
When using the BGM240P modules in an application where the radio is located close to the human body, the human RF Exposure must be taken into account. FCC, ISED, and CE all have different standards and rules for evaluating the RF Exposure. In particular, each regulator has different requirements when it comes to the exemption from having to perform RF Exposure and SAR (Specific Absorption Rate) measurements, and the minimum separation distances between the module's antenna and the human body varies accordingly. The properties of the BGM240P modules allow for the minimum separation distances detailed below in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 60 for the SAR evaluation exemption in portable use cases (less than 20 cm from human body). The module is approved for the Mobile use case (more than 20 cm) without any need for RF Exposure evaluation.
**Table 11.2. Minimum Separation Distances for SAR Evaluation Exemption**
|**Certification**|**BGM240P22A**|**BGM240P32A**|**BGM240P32N**|
|---|---|---|---|
|FCC|Bluetooth: 9.9 mm|Bluetooth: 31.6 mm|Bluetooth: 33.9 mm|
|ISED|Bluetooth: 15 mm|Bluetooth: 39.3 mm|Bluetooth: 40 mm|
|CE|The RF exposure should always be evaluated with the end-product when transmitting with power levels higher than<br>20 mW (13 dBm).|||
The exemption distances above, calculated for reference in the full output power use case, are based on the rules in force at the time of writing this datasheet. Even though changing rarely, always ensure to apply the rules in force at the time of placing a product in the market.
In the cases of FCC and ISED, it is allowed to use the module at its max RF TX power in end-products where the typical separation distance from the human body is smaller than mentioned above, but it requires evaluating the RF Exposure in the final assembly and applying for a Class 2 Permissive Change to the FCC and ISED approvals of the module. In order to proceed with the permissive change, module manufacturer should be asked for an authorization to proceed first with a Change in ID and/or Multiple Listing, so that the new portable condition will be added to the new parallel grant owned by the end-product manufacturer.
For CE, RF Exposure must be evaluated using the end-product in all cases when transmitting at more than the power level indicated in the table.
**Note:** Placing the module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thus a reduced range is to be expected.
## **11.8 Bluetooth Qualification**
The BGM240P modules are launched with a pre-qualified Bluetooth Low Energy RF-PHY Tested Component based on Core Specification 5.3 having Declaration ID of D059594 and QDID of 184327.
The RF-PHY Tested Component should be imported and combined together with the latest Wireless Gecko Link Layer and Host prequalified Components by Silicon Labs, when in the process of qualifying an end-product which embeds the BGM240P via the SIG's Launch Studio. Please find out more in chapter 2.2 of the quick start guides QSG139 and GSG169.
Notice that the validity set by the SIG for Tested Components is currently of 3 years: during the product lifetime, Silicon Labs will reassess or re-qualify the RF-PHY Component as it expires, whenever applicable. In case of a re-qualification, a Tested Component will come with a new DID and a new QDID, and the latter will be then referred to in new end-product listings. Newer DIDs and QDIDs can be discovered by using the search engine in the SIG's Launch Studio, or by asking Silicon Labs via the technical support platform.
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BGM240P Wireless Gecko Bluetooth Module Data Sheet Revision History
## **12. Revision History**
## **Revision 1.0**
August 2022
- Full production
## **Revision 0.5**
May 2022
- Initial release
## **Revision 0.1**
September, 2021
- Initial Draft
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## **Disclaimer**
Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and “Typical” parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A “Life Support System” is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications. **Note: This content may contain offensive terminology that is now obsolete. Silicon Labs is replacing these terms with inclusive language wherever possible. For more information, visit www.silabs.com/about-us/inclusive-lexicon-project**
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