BGM220SC22WGA2R

BLUETOOTH MODULE

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Manufacturer: SILICON LABS
Product type: Bluetooth Modules & Adaptors
SVHC: To Be Advised
Delivery and price
Units per pack	2500
Price	3.06 €
Current stock	10+
Lead time	30 days
Datasheet
## **BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet** 

The BGM220S is a module designed and built to meet the performance, security, and reliability requirements of battery-powered IoT products running on Bluetooth networks. 

Based on the EFR32BG22 SoC, the BGM220S enables Bluetooth[®] Low Energy connectivity while delivering best-in-class RF range and performance, future-proof capability for feature and OTA firmware updates, enhanced security features, and low energy consumption. 

BGM220S modules are a full solution that comes with fully-upgradeable, robust software stacks, world-wide regulatory certifications, advanced development and debugging tools, and support that will minimize and simplify the engineering and development of your end-products helping to accelerate their time-to-market. 

## **KEY FEATURES** 

- Bluetooth 5.4 

- Built-in antenna or RF pin 

- Up to 6 dBm TX power 

- -98.6 dBm BLE RX sensitivity at 1 Mbps 

- 32-bit ARM Cortex-M33 core at up to 76.8 MHz 

- 512/32 kB of Flash/RAM memory 

- Optimal selection of MCU peripherals 

- 25 GPIO pins 

- 6 mm × 6 mm × 1.1 mm 

The BGM220S is intended for a broad range of applications, including: 

- Asset Tags and Beacons 

- Portable Medical 

- Sports, Fitness, and Wellness devices 

- Connected Home 

- Industrial and Building Automation 

- Bluetooth mesh Low Power Nodes 

**==> picture [410 x 208] intentionally omitted <==**

**----- Start of picture text -----**<br>
Core / Memory Crystals Clock Management Energy Security<br>Management<br>ARM Cortexwith DSP extensions,FPU and TrustZone [TM]  M33 processor Flash Program Memory 38.4 MHz Fast StartupHF Crystal Oscillator RC OscillatorPrecision LF HF RegulatorVoltage  ConverterDC-DC  Crypto Acceleration<br>RC Oscillator RC Oscillator<br>ETM Debug Interface RAM Memory ControllerLDMA  LF Crystal Oscillator Ultra LF RC Oscillator Power-On Reset Brown-Out Detector Number GeneratorTrue Random<br>32-bit bus<br>Peripheral Reflex System<br>Antenna Radio Subsystem Serial  I/O Ports Timers and Triggers Analog I/F<br>Interfaces<br>AntennaDiscrete  w/ OOK DetectRFSENSE DEMOD ARM CortexM0+ Radio Controller [TM] USART InterruptsExternal  CounterTimer/ Protocol Timer ADC<br>Matching RX/TX Frontend  IFADC BUFC RAM PDM Purpose I/OGeneral  Low Energy Timer Watchdog Timer Temperature Sensor<br>with Integrated PA<br>Frequency  AGC FRC EUART Pin Reset Real Time CounterCapture  Back-Up Real Time Counter<br>Synthesizer MOD CRC I [2] C Pin Wakeup<br>Lowest power mode with peripheral operational:<br>EM0—Active EM1—Sleep EM2—Deep Sleep EM3—Stop EM4—Shutoff<br>**----- End of picture text -----**<br>


**Copyright © 2025 by Silicon Laboratories** 

**silabs.com** | Building a more connected world. 

Rev. 1.3 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Feature List 

## **1.  Feature List** 

- **Supported Protocols** 

   - Bluetooth Low Energy (Bluetooth 5.4) 

      - Direction finding 

      - 1M, 2M, and LE Coded PHYs 

   - Bluetooth Mesh Low Power Node 

- **Wireless System-on-Chip** 

   - 2.4 GHz radio 

   - TX power up to 6 dBm 

   - High-performance 32-bit ARM Cortex-M33[®] with DSP instruction and floating-point unit for efficient signal processing 

   - Up to 512 kB flash program memory 

   - 32 kB RAM data memory 

   - Embedded Trace Macrocell (ETM) for advanced debugging 

- **High Receiver Performance** 

   - -106.4 dBm sensitivity (0.1% BER) at 125 kbps GFSK 

   - -102.3 dBm sensitivity (0.1% BER) at 500 kbps GFSK 

   - -98.6 dBm sensitivity (0.1% BER) at 1 Mbps GFSK 

   - -95.9 dBm sensitivity (0.1% BER) at 2 Mbps GFSK 

- **Low-Energy Consumption** 

   - 4.2 mA RX current at 1 Mbps GFSK 

   - 4.6 mA TX current at 0 dBm output power 

   - 26 µA/MHz in Active Mode (EM0) 

   - 1.40 μA EM2 DeepSleep current (RTCC running from LFXO, Full RAM retention) 

- **Regulatory Certifications** 

   - CE and UKCA - EU and UK 

   - FCC - USA 

   - ISED - Canada 

   - MIC - Japan 

   - KC - South Korea 

   - NCC - Taiwan 

   - ANATEL - Brazil 

- **Wide Operating Range** 

   - 1.8 to 3.8 V 

   - -40 to +105 °C and -40 to +85 °C Versions Available 

- **Dimensions** 

   - 6 mm × 6 mm × 1.1 mm 

- **Security Features** 

   - Secure Boot with Root of Trust and Secure Loader (RTSL) 

   - Hardware Cryptographic Acceleration for AES128/256, SHA-1, SHA-2 (up to 256-bit), ECC (up to 256-bit), ECDSA, and ECDH 

   - True Random Number Generator (TRNG) compliant with NIST SP800-90 and AIS-31 

   - ARM[®] TrustZone[®] 

   - Secure Debug with lock/unlock 

- **Wide Selection of MCU Peripherals** 

   - Analog to Digital Converter (ADC) 

      - 12-bit @ 1 Msps 

      - 16-bit @ 76.9 ksps 

   - 25 General Purpose I/O pins with output state retention and asynchronous interrupts 

   - 8 Channel DMA Controller 

   - 12 Channel Peripheral Reflex System (PRS) 

   - 4 × 16-bit Timer/Counter with 3 Compare/Capture/PWM channels 

   - 1 × 32-bit Timer/Counter with 3 Compare/Capture/PWM channels 

   - 32-bit Real Time Counter 

   - 24-bit Low Energy Timer for waveform generation 

   - 1 × Watchdog Timer 

   - 2 × Universal Synchronous/Asynchronous Receiver/Transmitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I[2] S) 

   - 1 × Enhanced Universal Asynchronous Receiver/Transmitter (EUART) 

   - 2 × I[2] C interface with SMBus support 

   - Digital microphone interface (PDM) 

   - RFSENSE with selective OOK mode 

**silabs.com** | Building a more connected world. 

Rev. 1.3  |  2 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Ordering Information 

## **2.  Ordering Information** 

**Table 2.1.  Ordering Information** 

|**Ordering Code**|**Protocol Stack**|**TX Pow-**<br>**er Rating**|**Max CPU**<br>**Speed**|**Anten-**<br>**na**|**RF**<br>**Shield**|**Flash**<br>**(kB)**|**RAM**<br>**(kB)**|**GPIO**|**Temp Range**|**Packaging**|
|---|---|---|---|---|---|---|---|---|---|---|
|BGM220SC12WG<br>A2|Bluetooth 5.4|0 dBm|38.4 MHz|Built-in|No|352|32|25|-40 to 85 °C|Cut Tape|
|BGM220SC12WG<br>A2R|Bluetooth 5.4|0 dBm|38.4 MHz|Built-in|No|352|32|25|-40 to 85 °C|Reel|
|BGM220SC22HNA<br>2|Bluetooth 5.4<br>• Direction<br>Finding Rx|6 dBm|76.8 MHz|Built-in|Yes|512|32|25|-40 to 105 °C|Cut Tape|
|BGM220SC22HNA<br>2R|Bluetooth 5.4<br>• Direction<br>Finding Rx|6 dBm|76.8 MHz|Built-in|Yes|512|32|25|-40 to 105 °C|Reel|
|BGM220SC22WG<br>A2|Bluetooth 5.4|6 dBm|76.8 MHz|Built-in|Yes|352|32|25|-40 to 85 °C|Cut Tape|
|BGM220SC22WG<br>A2R|Bluetooth 5.4|6 dBm|76.8 MHz|Built-in|Yes|352|32|25|-40 to 85 °C|Reel|



## **Note:** 

1. End-product manufacturers must verify that the module is configured to meet regulatory limits for each region in accordance with the formal certification test reports. 

2. Devices are pre-programmed with BGAPI UART DFU bootloader v1.10.2. 

3. Throughout this document, the devices in the table above may be referred to by their product family name (e.g. BGM220S), by their model name (BGM220S12A for 0 dBm TX power, BGM220S22A for 6 dBm TX power), or by the full ordering code. 

4. LE Long Range (125 kbps and 500 kbps) PHYs are only supported on part numbers which include direction-finding capability. 

5. In accordance with the Bluetooth specification, the module operates over the following frequency range: 2402 - 2480 MHz. The module is also capable of operating in a separate BLE-like custom SRD transmit-only mode where proprietary packets are sent over the channels 2401 MHz and 2481 MHz using the same 1 Mbps GFSK modulation. 

6. All devices in the table above support transmitting CTE (Constant Tone Extension) which is required in Direction Finding, but only specific devices support CTE receive. These devices are marked with "Direction Finding Rx" in the Protocol Stack Column. 

7. The **SLWSTK6103A Wireless Starter Kit** is available for BGM220S evaluation and development, as well as the **SLWRB4312A** radio board. 

**silabs.com** | Building a more connected world. 

Rev. 1.3  |  3 

## **Table of Contents** 

|**1.**|**Feature List .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 2**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**2.**|**Ordering Information**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 3**|
|**3.**|**System Overview .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 6**|
||3.1  Introduction .<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 6|
||3.2  EFR32BG22 SoC .<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 7|
||3.3  Antenna .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 7|
||3.4  Power Supply<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 7|
|**4.**|**Electrical Characteristics .**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 8**|
||4.1  Absolute Maximum Ratings.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 8|
||4.2  General Operating Conditions .<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 9|
||4.2.1  DC-DC Operating Limits<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.10|
||4.3  MCU Current Consumption with 3 V Supply||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.11|
||4.4  Radio Current Consumption with 3|V Supply .||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.12|
||4.5  RF Transmitter General Characteristics for the|||||2.4|GHz||Band||.|.|.|.|.|.|.|.|.|.|.|.|.|.13|
||4.6  RF Receiver General Characteristics for the||||2.4 GHz|||Band .|||.|.|.|.|.|.|.|.|.|.|.|.|.|.13|
||4.7  RF Receiver Characteristics for Bluetooth Low|||||Energy in the 2.4||||||GHz Band 1 Mbps Data Rate||||||||||.|.|.14|
||4.8  RF Receiver Characteristics for Bluetooth Low|||||Energy in the 2.4||||||GHz Band 2 Mbps Data Rate||||||||||.|.|.15|
||4.9  RF Receiver Characteristics for Bluetooth Low|||||Energy in the 2.4||||||GHz Band 500 kbps|||||||Data||Rate||.|.16|
||4.10  RF Receiver Characteristics for Bluetooth Low Energy||||||||in the 2.4 GHz Band 125|||||||||kbps Data Rate .||||||.17|
||4.11  High-Frequency Crystal<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.18|
||4.12  Low Frequency Crystal Oscillator|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.18|
||4.13  Precision Low Frequency RC Oscillator|||(LFRCO) .||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.19|
||4.14  GPIO Pins .<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.20|
||4.15  Microcontroller Peripherals<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.21|
||4.16  Typical Performance Curves .<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.21|
||4.16.1  Antenna Typical Characteristics||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.22|
|**5.**|**Reference Diagrams.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**24**|
||5.1  Network Co-Processor (NCP) Application with|||||UART||Host||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.24|
||5.2  SoC Application<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.25|
|**6.**|**Pin Definitions .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**26**|
||6.1  44-Pin SiP Module Device Pinout.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.26|
||6.2  Alternate Function Table.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.28|
||6.3  Analog Peripheral Connectivity<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.28|
||6.4  Digital Peripheral Connectivity .<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.29|
|**7.**|**Design Guidelines**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 32**|



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Rev. 1.3 |  4 

|7.1  Layout and Placement<br>.|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.32|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|7.2  Best Design Practices<br>.|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.35|
|7.3  Radio Performance vs. Carrier Board||||||Size and|||Other PCB||||Characteristics .||||||.|.|.|.|.|.|.|.|.37|
|7.4  Proximity to Other Materials||.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.38|
|7.5  Proximity to Human Body|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.38|
|7.6  Antenna Tuning and Validity of|||Modular Certifications .|||||||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.39|
|**8.  Package Specifications**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.40**|
|8.1  Package Dimensions .<br>.|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.40|
|8.2  Recommended PCB Land|Pattern||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.42|
|8.3  Top Marking .<br>.<br>.<br>.<br>.|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.43|
|**9.  Soldering Recommendations**|||**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 44**|
|**10.  Tape and Reel**<br>**.**<br>**.**<br>**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.45**|
|**11.  Certifications .**<br>**.**<br>**.**<br>**.**<br>**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**47**|
|11.1  Regulatory Certifications|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.47|
|11.1.1  Qualified Antennas.|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.47|
|11.1.2  EU and UK - CE and|UKCA.||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.48|
|11.1.3  USA - FCC<br>.<br>.<br>.|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.48|
|11.1.4  Canada - ISED .<br>.|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.51|
|11.1.5  Proximity to Human Body||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.54|
|11.1.6  Japan - MIC .<br>.<br>.|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.55|
|11.1.7  South Korea - KC .|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.56|
|11.1.8  Taiwan - NCC<br>.<br>.|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.57|
|11.1.9  Brazil - ANATEL<br>.|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.58|
|11.2  Standards-Based Certifications||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.58|
|11.2.1  Bluetooth Qualification||.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.58|
|**12.  Revision History.**<br>**.**<br>**.**<br>**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**59**|



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Rev. 1.3 |  5 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet System Overview 

## **3.  System Overview** 

## **3.1  Introduction** 

The BGM220S module combines an energy-friendly MCU with a highly integrated radio transceiver in a SiP module with a robust, integrated antenna. This section gives a short introduction to the features of the module. 

The block diagram for the BGM220S module is shown in the figure below. The wireless module includes the EFR32BG22 wireless System on a Chip (SoC), required decoupling capacitors and inductors, 38.4 MHz crystal, RF matching circuit, and integrated antenna. 

**==> picture [430 x 239] intentionally omitted <==**

**----- Start of picture text -----**<br>
2400 – 2483.5 MHz<br>External<br>Antenna 2400 – 2483.5 MHz 1.8 - 3.8 V<br>VREGVDD<br>or ANT_OUT<br>Integral  IOVDD<br>Supply Decoupling<br>Antenna<br>ANT_IN and DC-DC Support VREG<br>DECOUPLE<br>0 Ohm<br>RF_2G4 RF Match<br>Silicon Labs (up to 25)<br>G PIO<br>EFR32BG22<br>HF XTAL<br>GND<br>38.4 MHz<br>**----- End of picture text -----**<br>


**Figure 3.1.  BGM220S Block Diagram** 

A simplified internal schematic for the BGM220S module is shown in the figure below. 

**==> picture [396 x 187] intentionally omitted <==**

**----- Start of picture text -----**<br>
EFR32BG22<br>VREGVDD VREGVDD Integral ANT_OUT<br>4.7µF AVDD Antenna ANT_IN<br>IOVDD IOVDD<br>Matching<br>VREGSW RF2G4_IO RF_2G4<br>Network<br>2.2µH<br>PA0x PAx (0-8)<br>PB0x PBx (0-4)<br>VREG DVDD PC0x PCx (0-6)<br>RFVDD PD0x PDx (0-3)<br>PAVDD<br>HFXTAL_I<br>4.7µF 38.4 MHz<br>DECOUPLE DECOUPLE HFXTAL_O<br>2.2µF<br>**----- End of picture text -----**<br>


**Figure 3.2.  BGM220S Module Schematic** 

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Rev. 1.3  |  6 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet System Overview 

## **3.2  EFR32BG22 SoC** 

The EFR32BG22 SoC features a 32-bit ARM Cortex M33 core, a 2.4 GHz high-performance radio, 512 kB of flash memory, a rich set of MCU peripherals, and various clock management and serial interfacing options. Consult the EFR32xG22 Wireless Gecko Reference Manual and the EFR32BG22 Data Sheet for details. 

## **3.3  Antenna** 

BGM220S modules include an integral antenna on board with the characteristics detailed in the tables below. 

## **Table 3.1.  Antenna Efficiency and Peak Gain (BGM220S12A)** 

|**Parameter**|**With optimal layout **|**Note**|
|---|---|---|
|Efficiency|-1.4 to -2.6 dB|Antenna efficiency, gain and radiation pattern are highly depend-<br>ent on the application PCB layout and mechanical design. Refer<br>to7. Design Guidelinesfor recommendations to achieve optimal<br>antenna performance.|
|Peak gain|1.5 dBi||



**Table 3.2.  Antenna Efficiency and Peak Gain (BGM220S22A)** 

|**Parameter**|**With optimal layout **|**Note**|
|---|---|---|
|Efficiency|-1 to -2 dB|Antenna efficiency, gain and radiation pattern are highly depend-<br>ent on the application PCB layout and mechanical design. Refer<br>to7. Design Guidelinesfor recommendations to achieve optimal<br>antenna performance.|
|Peak gain|2.3 dBi||



## **3.4  Power Supply** 

The BGM220S requires a single nominal supply level of 3.0 V to operate. All necessary decoupling and filtering components are included in the module, and the supply is fully regulated internally. 

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Rev. 1.3  |  7 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics 

## **4.  Electrical Characteristics** 

All electrical parameters in all tables are specified under the following conditions, unless stated otherwise: 

- Typical values are based on TA=25 °C and VREGVDD supply at 3.0 V, by production test and/or technology characterization. 

- Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise. 

## **4.1  Absolute Maximum Ratings** 

Stresses beyond those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions beyond those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx. 

**Table 4.1.  Absolute Maximum Ratings** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Storage temperature range|TSTG||-40|—|+125|°C|
|Voltage on any supply pin|VDDMAX||-0.3|—|3.8|V|
|Junction temperature|TJMAX|-G grade|—|—|+105|°C|
|||-N grade|—|—|+105|°C|
|Voltage ramp rate on any<br>supply pin|VDDRAMPMAX||—|—|1.0|V / µs|
|DC voltage on any GPIO pin|VDIGPIN||-0.3|—|VIOVDD+<br>0.3|V|
|Input RF level on RF pin<br>RF_2G4|PRFMAX2G4||—|—|+10|dBm|
|Absolute voltage on RF pin<br>RF_2G4|VMAX2G4||-0.3|—|VVREG+<br>0.3|V|
|Total current into VDD power<br>lines|IVDDMAX|Source|—|—|200|mA|
|Total current into VSS<br>ground lines|IVSSMAX|Sink|—|—|200|mA|
|Current per I/O pin|IIOMAX|Sink|—|—|50|mA|
|||Source|—|—|50|mA|
|Current for all I/O pins|IIOALLMAX|Sink|—|—|200|mA|
|||Source|—|—|200|mA|



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Rev. 1.3  |  8 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics 

## **4.2  General Operating Conditions** 

This table specifies the general operating temperature range and supply voltage range for all supplies. The minimum and maximum values of all other tables are specifed over this operating range, unless otherwise noted. 

**Table 4.2.  General Operating Conditions** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Operating ambient tempera-<br>ture range|TA|-G temperature grade|-40|—|+85|°C|
|||-N temperature grade|-40|—|+105|°C|
|IOVDDx operating supply<br>voltage (All IOVDD pins)|VIOVDDx||1.71|3.0|3.8|V|
|VREGVDD operating supply<br>voltage|VVREGVDD|DCDC in regulation1|2.2|3.0|3.8|V|
|||DCDC in bypass|1.8|3.0|3.8|V|
|HCLK and SYSCLK frequen-<br>cy|fHCLK|VSCALE2, MODE = WS1|—|—|76.8|MHz|
|||VSCALE2, MODE = WS0|—|—|40|MHz|
|PCLK frequency|fPCLK|VSCALE2|—|—|50|MHz|
|||VSCALE1|—|—|40|MHz|
|EM01 Group A clock fre-<br>quency|fEM01GRPACLK|VSCALE2|—|—|76.8|MHz|
|||VSCALE1|—|—|40|MHz|
|EM01 Group B clock fre-<br>quency|fEM01GRPBCLK|VSCALE2|—|—|76.8|MHz|
|||VSCALE1|—|—|40|MHz|
|Radio HCLK frequency2|fRHCLK|VSCALE2 or VSCALE1|—|38.4|—|MHz|
|**Note:**<br>1. The supported maximum VVREGVDDin regulation mode is a function of temperature and 10-year lifetime average load current.<br>See more details in4.2.1 DC-DC Operating Limits.<br>2. The recommended radio crystal frequency is 38.4 MHz. Any crystal frequency other than 38.4 is expressly not supported.|||||||



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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics 

## **4.2.1  DC-DC Operating Limits** 

The maximum supported voltage on the VREGVDD supply pin is limited under certain conditions. Maximum input voltage is a function of temperature and the average load current over a 10-year lifetime. Figure 4.1 Lifetime average load current limit vs. Maximum input voltage on page 10 shows the safe operating region under specific conditions. Exceeding this safe operating range may impact the reliability and performance of the DC-DC converter. 

The average load current for an application can typically be determined by examining the current profile during the time the device is powered. For example, an application that is continuously powered which spends 99% of the time asleep consuming 2 µA and 1% of the time active and consuming 10 mA has an average lifetime load current of about 102 µA. 

**==> picture [225 x 167] intentionally omitted <==**

**----- Start of picture text -----**<br>
60 Tj ≤ 105 °C<br>5<br>3.3 3.8<br>Maximum VVREGVDD (V)<br> (mA)<br>LOAD<br>Average Lifetime I<br>**----- End of picture text -----**<br>


**Figure 4.1.  Lifetime average load current limit vs. Maximum input voltage** 

The minimum input voltage for the DC-DC in EM0/EM1 mode is a function of the maximum load current, and the peak current setting. Figure 4.2 Transient maximum load current vs. Minimum input voltage on page 10 shows the max load current vs. input voltage for different DC-DC peak inductor current settings. 

**==> picture [225 x 167] intentionally omitted <==**

**----- Start of picture text -----**<br>
60<br>36<br>IPEAK = 150 mA<br>5 IPEAK = 90 mA<br>1.8 2.2<br>Minimum VVREGVDD (V)<br> (mA)<br>LOAD<br>Maximum I<br>**----- End of picture text -----**<br>


**Figure 4.2.  Transient maximum load current vs. Minimum input voltage** 

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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics 

## **4.3  MCU Current Consumption with 3 V Supply** 

Unless otherwise indicated, typical conditions are: Module supply voltage = 3.0 V. Voltage scaling level = VSCALE1. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 °C. 

**Table 4.3.  MCU Current Consumption with 3 V Supply** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Current consumption in EM0<br>mode with all peripherals dis-<br>abled|IACTIVE|76.8 MHz HFRCO w/ DPLL refer-<br>enced to 38.4 MHz crystal, CPU<br>running while loop from flash,<br>VSCALE2|—|27|—|µA/MHz|
|||76.8 MHz HFRCO w/ DPLL refer-<br>enced to 38.4 MHz crystal, CPU<br>running CoreMark loop from flash,<br>VSCALE2|—|37|—|µA/MHz|
|||38.4 MHz crystal, CPU running<br>Prime from flash|—|28|—|µA/MHz|
|||38.4 MHz crystal, CPU running<br>while loop from flash|—|26|—|µA/MHz|
|||38.4 MHz crystal, CPU running<br>CoreMark loop from flash|—|38|—|µA/MHz|
|||38 MHz HFRCO, CPU running<br>while loop from flash|—|22|—|µA/MHz|
|||76.8 MHz HFRCO w/ DPLL refer-<br>enced to 38.4 MHz crystal, CPU<br>running Prime from flash,<br>VSCALE2|—|28|—|µA/MHz|
|Current consumption in EM1<br>mode with all peripherals dis-<br>abled|IEM1|76.8 MHz HFRCO w/ DPLL refer-<br>enced to 38.4 MHz crystal,<br>VSCALE2|—|17|—|µA/MHz|
|||38.4 MHz crystal|—|17|—|µA/MHz|
|||38 MHz HFRCO|—|13|—|µA/MHz|
|Current consumption in EM2<br>mode, VSCALE0|IEM2_VS|Full RAM retention and RTC run-<br>ning from LFXO|—|1.40|—|µA|
|||Full RAM retention and RTC run-<br>ning from LFRCO|—|1.40|—|µA|
|||Full RAM retention and RTC run-<br>ning from LFRCO in precision<br>mode|—|1.75|—|µA|
|||24 kB RAM retention and RTC<br>running from LFXO|—|1.32|—|µA|
|||24 kB RAM retention and RTC<br>running from LFRCO in precision<br>mode|—|1.66|—|µA|
|||8 kB RAM retention and RTC run-<br>ning from LFXO|—|1.21|—|µA|
|||8 kB RAM retention and RTC run-<br>ning from LFRCO|—|1.20|—|µA|
|Current consumption in EM3<br>mode, VSCALE0|IEM3_VS|8 kB RAM retention and RTC run-<br>ning from ULFRCO|—|1.05|—|µA|



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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Current consumption in EM4<br>mode|IEM4|No BURTC, No LF Oscillator,<br>DCDC bypassed|—|0.17|—|µA|
|Additional current in EM2 or<br>EM3 when any peripheral in<br>PD0B is enabled1|IPD0B_VS||—|0.37|—|µA|
|**Note:**<br>1. Extra current consumed by power domain. Does not include current associated with the enabled peripherals. See for a list of the<br>peripherals in each power domain.|||||||



## **4.4  Radio Current Consumption with 3 V Supply** 

RF current consumption measured with MCU in EM1, HCLK = 38.4 MHz, and all MCU peripherals disabled. Unless otherwise indicated, typical conditions are: VREGVDD = 3.0 V. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 °C. 

**Table 4.4.  Radio Current Consumption with 3 V Supply** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|System current consumption<br>in receive mode, active pack-<br>et reception|IRX_ACTIVE|125 kbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|4.2|—|mA|
|||500 kbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|4.3|—|mA|
|||1 Mbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|4.2|—|mA|
|||2 Mbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|4.8|—|mA|
|System current consumption<br>in receive mode, listening for<br>packet|IRX_LISTEN|125 kbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|4.3|—|mA|
|||500 kbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|4.3|—|mA|
|||1 Mbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|4.2|—|mA|
|||2 Mbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|4.7|—|mA|
|System current consumption<br>in transmit mode|ITX|f = 2.4 GHz, CW, 0 dBm output<br>power|—|4.6|—|mA|
|||f = 2.4 GHz, CW, 6 dBm output<br>power|—|8.8|—|mA|



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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics 

## **4.5  RF Transmitter General Characteristics for the 2.4 GHz Band** 

Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz. 

**Table 4.5.  RF Transmitter General Characteristics for the 2.4 GHz Band** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|RF tuning frequency range|FRANGE||2400|—|2483.5|MHz|
|Maximum TX power1|POUTMAX|6 dBm output power|—|6.0|—|dBm|
|||0 dBm output power|—|-0.5|—|dBm|
|Minimum active TX Power|POUTMIN||—|-27|—|dBm|
|Output power variation vs<br>VREGVDD supply voltage<br>variation, frequency = 2450<br>MHz|POUTVAR_V|6 dBm output power with<br>VREGVDD voltage swept from<br>1.8 V to 3.0 V|—|0.04|—|dB|
|||0 dBm output power, with<br>VREGVDD voltage swept from<br>1.8 to 3.0 V|—|0.04|—|dB|
|Output power variation vs<br>temperature, Frequency =<br>2450 MHz|POUTVAR_T|6 dBm output power, (-40 to +105<br>°C)|—|0.2|—|dB|
|||0 dBm output power, (-40 to +105<br>°C)|—|1.3|—|dB|
|||6 dBm output power, (-40 to +85<br>°C)|—|0.1|—|dB|
|||0 dBm output power, (-40 to +85<br>°C)|—|1.0|—|dB|
|Output power variation vs RF<br>frequency|POUTVAR_F|6 dBm output power|—|0.09|—|dB|
|||0 dBm output power|—|0.15|—|dB|
|**Note:**<br>1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-<br>ered in this data sheet can be found in the Max TX Power column of the Ordering Information Table.|||||||



## **4.6  RF Receiver General Characteristics for the 2.4 GHz Band** 

Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz. 

**Table 4.6.  RF Receiver General Characteristics for the 2.4 GHz Band** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|RF tuning frequency range|FRANGE||2400|—|2483.5|MHz|



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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics 

## **4.7  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate** 

Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz. 

**Table 4.7.  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Max usable receiver input<br>level|SAT|Signal is reference signal1|—|10|—|dBm|
|Sensitivity|SENS|Signal is reference signal, 37 byte<br>payload2|—|-98.6|—|dBm|
|||Signal is reference signal, 255<br>byte payload1|—|-97.2|—|dBm|
|||With non-ideal signals3 1|—|-96.6|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 4|—|8.7|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +1<br>MHz offset1 5 4 6|—|-6.6|—|dB|
|||Interferer is reference signal at -1<br>MHz offset1 5 4 6|—|-6.5|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +2<br>MHz offset1 5 4 6|—|-40.9|—|dB|
|||Interferer is reference signal at -2<br>MHz offset1 5 4 6|—|-39.9|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +3<br>MHz offset1 5 4 6|—|-45.9|—|dB|
|||Interferer is reference signal at -3<br>MHz offset1 5 4 6|—|-46.2|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 6|—|-23.5|—|dB|
|Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision1 6|—|-40.9|—|dB|
|||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision1 6|—|-6.6|—|dB|
|Intermodulation performance|IM|n = 3 (see note7)|—|-17.1|—|dBm|
|**Note:**<br>1. 0.017% Bit Error Rate.<br>2. 0.1% Bit Error Rate.<br>3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>4. Desired signal -67 dBm.<br>5. Measured frequency is 2401 MHz ≤ Fc ≤ 2481 MHz.<br>6. With allowed exceptions.<br>7. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4|||||||



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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics 

## **4.8  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate** 

Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz. 

**Table 4.8.  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Max usable receiver input<br>level|SAT|Signal is reference signal1|—|10|—|dBm|
|Sensitivity|SENS|Signal is reference signal, 37 byte<br>payload2|—|-95.9|—|dBm|
|||Signal is reference signal, 255<br>byte payload1|—|-94.3|—|dBm|
|||With non-ideal signals3 1|—|-94.0|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 4|—|8.8|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +2<br>MHz offset1 5 4 6|—|-9.2|—|dB|
|||Interferer is reference signal at -2<br>MHz offset1 5 4 6|—|-6.6|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +4<br>MHz offset1 5 4 6|—|-43.3|—|dB|
|||Interferer is reference signal at -4<br>MHz offset1 5 4 6|—|-44.0|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +6<br>MHz offset1 5 4 6|—|-48.6|—|dB|
|||Interferer is reference signal at -6<br>MHz offset1 5 4 6|—|-50.7|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 6|—|-23.8|—|dB|
|Selectivity to image frequen-<br>cy ± 2 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +2 MHz with 1<br>MHz precision1 6|—|-43.3|—|dB|
|||Interferer is reference signal at im-<br>age frequency -2 MHz with 1 MHz<br>precision1 6|—|-9.2|—|dB|
|Intermodulation performance|IM|n = 3 (see note7)|—|-18.8|—|dBm|
|**Note:**<br>1. 0.017% Bit Error Rate.<br>2. 0.1% Bit Error Rate.<br>3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>4. Desired signal -64 dBm.<br>5. Measured frequency is 2401 MHz ≤ Fc ≤ 2481 MHz.<br>6. With allowed exceptions.<br>7. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4|||||||



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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics 

## **4.9  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate** 

Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz. 

**Table 4.9.  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Max usable receiver input<br>level|SAT|Signal is reference signal1|—|10|—|dBm|
|Sensitivity|SENS|Signal is reference signal, 37 byte<br>payload2|—|-102.3|—|dBm|
|||Signal is reference signal, 255<br>byte payload1|—|-100.9|—|dBm|
|||With non-ideal signals3 1|—|-99.8|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 4|—|2.7|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +1<br>MHz offset1 5 4 6|—|-8.0|—|dB|
|||Interferer is reference signal at -1<br>MHz offset1 5 4 6|—|-7.9|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +2<br>MHz offset1 5 4 6|—|-46.5|—|dB|
|||Interferer is reference signal at -2<br>MHz offset1 5 4 6|—|-49.9|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +3<br>MHz offset1 5 4 6|—|-48.9|—|dB|
|||Interferer is reference signal at -3<br>MHz offset1 5 4 6|—|-53.8|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 6|—|-48.3|—|dB|
|Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision1 6|—|-49.9|—|dB|
|||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision1 6|—|-46.5|—|dB|
|**Note:**<br>1. 0.017% Bit Error Rate.<br>2. 0.1% Bit Error Rate.<br>3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>4. Desired signal -72 dBm.<br>5. Measured frequency is 2401 MHz ≤ Fc ≤ 2481 MHz.<br>6. With allowed exceptions.|||||||



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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics 

## **4.10  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate** 

Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz. 

**Table 4.10.  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Max usable receiver input<br>level|SAT|Signal is reference signal1|—|10|—|dBm|
|Sensitivity|SENS|Signal is reference signal, 37 byte<br>payload2|—|-106.4|—|dBm|
|||Signal is reference signal, 255<br>byte payload1|—|-106.0|—|dBm|
|||With non-ideal signals3 1|—|-105.6|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 4|—|0.9|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +1<br>MHz offset1 5 4 6|—|-13.6|—|dB|
|||Interferer is reference signal at -1<br>MHz offset1 5 4 6|—|-13.4|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +2<br>MHz offset1 5 4 6|—|-52.6|—|dB|
|||Interferer is reference signal at -2<br>MHz offset1 5 4 6|—|-55.8|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +3<br>MHz offset1 5 4 6|—|-53.7|—|dB|
|||Interferer is reference signal at -3<br>MHz offset1 5 4 6|—|-59.0|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 6|—|-52.7|—|dB|
|Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision1 6|—|-53.7|—|dB|
|||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision1 6|—|-52.6|—|dB|
|**Note:**<br>1. 0.017% Bit Error Rate.<br>2. 0.1% Bit Error Rate.<br>3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>4. Desired signal -79 dBm.<br>5. Measured frequency is 2401 MHz ≤ Fc ≤ 2481 MHz.<br>6. With allowed exceptions.|||||||



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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics 

## **4.11  High-Frequency Crystal** 

**Table 4.11.  High-Frequency Crystal** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Crystal frequency|fHFXTAL||—|38.4|—|MHz|
|Initial calibrated accuracy|ACCHFXTAL||-10|—|10|ppm|
|Temperature drift|DRIFTHFXTAL|Across specified temperature<br>range|-20|—|20|ppm|



## **4.12  Low Frequency Crystal Oscillator** 

**Table 4.12.  Low Frequency Crystal Oscillator** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Crystal Frequency|FLFXO||—|32.768|—|kHz|
|Supported Crystal equivalent<br>series resistance (ESR)|ESRLFXO|GAIN = 0|—|—|80|kΩ|
|||GAIN = 1 to 3|—|—|100|kΩ|
|Supported range of crystal<br>load capacitance1|CLFXO_CL|GAIN = 0|4|—|6|pF|
|||GAIN = 1|6|—|10|pF|
|||GAIN = 2 (see note2)|10|—|12.5|pF|
|||GAIN = 3 (see note2)|12.5|—|18|pF|
|Current consumption|ICL12p5|ESR = 70 kOhm, CL = 12.5 pF,<br>GAIN3= 2, AGC4= 1|—|357|—|nA|
|Startup Time|TSTARTUP|ESR = 70 kOhm, CL = 7 pF,<br>GAIN3= 1, AGC4= 1|—|63|—|ms|
|On-chip tuning cap step size|SSLFXO||—|0.26|—|pF|
|On-chip tuning capacitor val-<br>ue at minimum setting5|CLFXO_MIN|CAPTUNE = 0|—|4|—|pF|
|On-chip tuning capacitor val-<br>ue at maximum setting5|CLFXO_MAX|CAPTUNE = 0x4F|—|24.5|—|pF|
|**Note:**<br>1. Total load capacitance seen by the crystal<br>2. Crystals with a load capacitance of greater than 12 pF require external load capacitors.<br>3. In LFXO_CAL Register<br>4. In LFXO_CFG Register<br>5. The effective load capacitance seen by the crystal will be CLFXO/2. This is because each XTAL pin has a tuning cap and the two<br>caps will be seen in series by the crystal|||||||



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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics 

## **4.13  Precision Low Frequency RC Oscillator (LFRCO)** 

**Table 4.13.  Precision Low Frequency RC Oscillator (LFRCO)** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Nominal oscillation frequen-<br>cy|FLFRCO||—|32.768|—|kHz|
|Frequency accuracy|FLFRCO_ACC|Normal mode|-3|—|3|%|
|||Precision mode1, across operat-<br>ing temperature range2|-500|—|500|ppm|
|Startup time|tSTARTUP|Normal mode|—|204|—|µs|
|||Precision mode1|—|11.7|—|ms|
|Current consumption|ILFRCO|Normal mode|—|175|—|nA|
|||Precision mode1, T = stable at 25<br>°C3|—|655|—|nA|
|**Note:**<br>1. The LFRCO operates in high-precision mode when CFG_HIGHPRECEN is set to 1. High-precision mode is not available in EM4.<br>2. Includes ± 40 ppm frequency tolerance of the HFXO crystal.<br>3. Includes periodic re-calibration against HFXO crystal oscillator.|||||||



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Rev. 1.3  |  19 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics 

## **4.14  GPIO Pins** 

Unless otherwise indicated, typical conditions are: IOVDD = 3.0 V. 

**Table 4.14.  GPIO Pins** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Leakage current|ILEAK_IO|MODEx = DISABLED, IOVDD =<br>1.71 V|—|1.9|—|nA|
|||MODEx = DISABLED, IOVDD =<br>3.0 V|—|2.5|—|nA|
|Input low voltage1|VIL|Any GPIO pin|—|—|0.3*IOVDD|V|
|||RESETn|—|—|0.3*DVDD|V|
|Input high voltage1|VIH|Any GPIO pin|0.7*IOVDD|—|—|V|
|||RESETn|0.7*DVDD|—|—|V|
|Hysteresis of input voltage|VHYS|Any GPIO pin|0.05*IOVD<br>D|—|—|V|
|||RESETn|0.05*DVDD|—|—|V|
|Output high voltage|VOH|Sourcing 20mA, IOVDD = 3.0 V|0.8 *<br>IOVDD|—|—|V|
|||Sourcing 8mA, IOVDD = 1.71 V|0.6 *<br>IOVDD|—|—|V|
|Output low voltage|VOL|Sinking 20mA, IOVDD = 3.0 V|—|—|0.2 *<br>IOVDD|V|
|||Sinking 8mA, IOVDD = 1.71 V|—|—|0.4 *<br>IOVDD|V|
|GPIO rise time|TGPIO_RISE|IOVDD = 3.0 V, Cload= 50pF,<br>SLEWRATE = 4, 10% to 90%|—|8.4|—|ns|
|||IOVDD = 1.71 V, Cload= 50pF,<br>SLEWRATE = 4, 10% to 90%|—|13|—|ns|
|GPIO fall time|TGPIO_FALL|IOVDD = 3.0 V, Cload= 50pF,<br>SLEWRATE = 4, 90% to 10%|—|7.1|—|ns|
|||IOVDD = 1.71 V, Cload= 50pF,<br>SLEWRATE = 4, 90% to 10%|—|11.9|—|ns|
|Pull up/down resistance2|RPULL|Any GPIO pin. Pull-up to IOVDD:<br>MODEn = DISABLE DOUT=1.<br>Pull-down to VSS: MODEn =<br>WIREDORPULLDOWN DOUT =<br>0.|35|44|55|kΩ|
|||RESETn pin. Pull-up to DVDD|35|44|55|kΩ|
|Maximum filtered glitch width|TGF|MODE = INPUT, DOUT = 1|—|27|—|ns|
|RESETn low time to ensure<br>pin reset|TRESET||100|—|—|ns|
|**Note:**<br>1. GPIO input thresholds are proportional to the IOVDD pin. RESETn input thresholds are proportional to DVDD.<br>2. GPIO pull-ups connect to IOVDD supply, pull-downs connect to VSS. RESETn pull-up connects to DVDD.|||||||



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Rev. 1.3  |  20 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics 

## **4.15  Microcontroller Peripherals** 

The MCU peripherals set available in BGM220S modules includes: 

- ADC: 12-bit at 1 Msps, 16-bit at 76.9 ksps 

- 16-bit and 32-bit Timers/Counters 

- 24-bit Low Energy Timer for waveform generation 

- 32-bit Real Time Counter 

- USART (UART/SPI/SmartCards/IrDA/I2S) 

- EUART (UART/IrDA) 

- I[2] C peripheral interfaces 

- PDM interface 

- 12 Channel Peripheral Reflex System 

For details on their electrical performance, consult the relevant portions of Section 4 in the SoC datasheet. 

To learn which GPIO ports provide access to every peripheral, consult Analog Peripheral Connectivity and Digital Peripheral Connectivity. 

## **4.16  Typical Performance Curves** 

Typical performance curves indicate typical characterized performance under the stated conditions. 

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Rev. 1.3  |  21 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics 

## **4.16.1  Antenna Typical Characteristics** 

Typical BGM220S radiation patterns for the on-board chip antenna under optimal operating conditions are plotted in the figures that follow. Antenna gain and radiation patterns have a strong dependence on the size and shape of the application PCB the module is mounted on, as well as on the proximity of any mechanical design to the antenna. 

Top Left: Phi 0[o] , Top Right: Phi 90[o] , Bottom Left: Theta 90[o] 

**Figure 4.3.  BGM220S12A Typical 2D Antenna Radiation Patterns on 50 mm x 30 mm board** 

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Rev. 1.3  |  22 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics 

Top Left: Phi 0[o] , Top Right: Phi 90[o] , Bottom Left: Theta 90[o] 

**Figure 4.4.   BGM220S22A Typical 2D Antenna Radiation Patterns on 55 mm x 20 mm board** 

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Rev. 1.3  |  23 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Reference Diagrams 

## **5.  Reference Diagrams** 

## **5.1  Network Co-Processor (NCP) Application with UART Host** 

The BGM220S can be controlled over the UART interface as a peripheral to an external host processor. Typical power supply, programming/debug interface, and host interface connections are shown in the figure below. For more details, refer to _AN958: Debugging and Programming Interfaces for Custom Designs_ . 

**==> picture [492 x 272] intentionally omitted <==**

**----- Start of picture text -----**<br>
Antenna Loop<br>RESETn<br>0.1 µF<br>(optional)<br>PTI_FRAME<br>PTI_DATA<br>(recommended)<br>0 Ohm NC PC02<br>ANT_IN PC01<br>RF_2G4 BGM220S PC00<br>GND PD00<br>32.768 kHz<br>GND PD01 (optional)<br>PB04 PD02<br>VDD<br>PB03 PD03<br>VDD<br>PB02 IOVDD<br>1 2 PB01 VREGVDD<br>RESETn 3 4 PB00 VREG<br>5 6 SWO (PA03)<br>SWDIO (PA02) 7 8 SWCLK (PA01)<br>PTI_FRAME (PC05) 9 10 PTI_DATA (PC04) GPIO RESETn<br>RTS<br>Mini Simplicity Debug Connector CTS Host CPU<br>TX<br>RX<br>ANT_OUT NC NC NC GND RESETn PC06 PC05 PC04 PC03<br>PA00 PA01 PA02 DECOUPLE PA03 PA04 PA05 PA06 PA07 PA08<br>VDD<br>SWCLK SWDIO SWO<br>GND<br>**----- End of picture text -----**<br>


**Figure 5.1.  UART NCP Configuration** 

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Rev. 1.3  |  24 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Reference Diagrams 

## **5.2  SoC Application** 

The BGM220S can be used in a stand-alone SoC configuration without an external host processor. Typical power supply and programming/debug interface connections are shown in the figure below. For more details, refer to _AN958: Debugging and Programming Interfaces for Custom Designs_ . 

**==> picture [486 x 342] intentionally omitted <==**

**----- Start of picture text -----**<br>
Antenna Loop<br>RESETn<br>0.1 µF<br>(optional)<br>PTI_FRAME<br>PTI_DATA<br>(recommended)<br>0 Ohm NC PC02<br>ANT_IN PC01<br>RF_2G4 BGM220S PC00<br>GND PD00<br>32.768 kHz<br>GND PD01 (optional)<br>PB04 PD02<br>PB03 PD03<br>PB02 IOVDD<br>PB01 VREGVDD<br>VDD<br>PB00 VREG<br>1 2<br>3 4<br>RESETn<br>5 6<br>SWO (PA03)<br>7 8<br>SWDIO (PA02) SWCLK (PA01)<br>9 10<br>PTI_FRAME (PC05) PTI_DATA (PC04)<br>Mini Simplicity Debug Connector<br>ANT_OUT NC NC NC GND RESETn PC06 PC05 PC04 PC03<br>PA00 PA01 PA02 DECOUPLE PA03 PA04 PA05 PA06 PA07 PA08<br>SWCLK SWDIO SWO<br>**----- End of picture text -----**<br>


**Figure 5.2.  Stand-Alone SoC Configuration** 

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Rev. 1.3  |  25 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Pin Definitions 

## **6.  Pin Definitions** 

## **6.1  44-Pin SiP Module Device Pinout** 

**==> picture [576 x 433] intentionally omitted <==**

## **Figure 6.1.  44-Pin SiP Module Device Pinout** 

The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the supported features for each GPIO pin, see 6.2 Alternate Function Table, 6.3 Analog Peripheral Connectivity, and 6.4 Digital Peripheral Connectivity. 

**Table 6.1.  44-Pin SiP Module Device Pinout** 

|**Pin Name**|**Pin(s)**|**Description**||**Pin Name**|**Pin(s)**|**Description**|
|---|---|---|---|---|---|---|
|NC|1|Do not connect||ANT_IN|2|Antenna In|
|RF_2G4|3|2.4 GHz RF input/output||GND|4|Ground|
|GND|5|Ground||PB04|6|GPIO|
|PB03|7|GPIO||PB02|8|GPIO|
|PB01|9|GPIO||PB00|10|GPIO|



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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Pin Definitions 

|**Pin Name**|**Pin(s)**|**Description**||**Pin Name**|**Pin(s)**|**Description**|
|---|---|---|---|---|---|---|
|PA00|11|GPIO||PA01|12|GPIO|
|PA02|13|GPIO||DECOUPLE|14|Decouple output for on-chip voltage<br>regulator. This pin is internally decou-<br>pled, and should be left disconnected.|
|PA03|15|GPIO||PA04|16|GPIO|
|PA05|17|GPIO||PA06|18|GPIO|
|PA07|19|GPIO||PA08|20|GPIO|
|VREG|21|Regulated supply voltage. This pin is in-<br>ternally connected to the SoC DVDD,<br>RFVDD, and PAVDD supply lines. It is<br>not intended to power external circuitry.||VREGVDD|22|Module input power supply. This pin is<br>internally connected to the SoC AVDD<br>and VREGVDD supply lines.|
|IOVDD|23|I/O power supply||PD03|24|GPIO|
|PD02|25|GPIO||PD01|26|GPIO|
|PD00|27|GPIO||PC00|28|GPIO|
|PC01|29|GPIO||PC02|30|GPIO|
|PC03|31|GPIO||PC04|32|GPIO|
|PC05|33|GPIO||PC06|34|GPIO|
|RESETn|35|Reset Pin. The RESETn pin is internally<br>pulled up to VREG (DVDD).||GND|36|Ground|
|NC|37|Do not connect||NC|38|Do not connect|
|NC|39|Do not connect||ANT_OUT|40|Antenna Out|
|GND|41|Ground||GND|42|Ground|
|GND|43|Ground||GND|44|Ground|



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Rev. 1.3  |  27 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Pin Definitions 

## **6.2  Alternate Function Table** 

A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows what functions are available on each device pin. 

**Table 6.2.  GPIO Alternate Function Table** 

|**GPIO**|**Alternate Functions**|**Alternate Functions**|**Alternate Functions**|**Alternate Functions**|
|---|---|---|---|---|
|PB03|GPIO.EM4WU4||||
|PB01|GPIO.EM4WU3||||
|PB00||IADC0.VREFN|||
|PA00||IADC0.VREFP|||
|PA01|GPIO.SWCLK||||
|PA02|GPIO.SWDIO||||
|PA03|GPIO.SWV<br>GPIO.TDO<br>GPIO.TRACEDATA0||||
|PA04|GPIO.TDI<br>GPIO.TRACECLK||||
|PA05|GPIO.EM4WU0||||
|PD02|GPIO.EM4WU9||||
|PD01||LFXO.LFXTAL_I<br>LFXO.LF_EXTCLK|||
|PD00||LFXO.LFXTAL_O|||
|PC00|GPIO.EM4WU6<br>GPIO.THMSW_EN||||
|PC05|GPIO.EM4WU7||||



## **6.3  Analog Peripheral Connectivity** 

Many analog resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port. When a differential connection is being used Positive inputs are restricted to the EVEN pins and Negative inputs are restricted to the ODD pins. When a single ended connection is being used positive input is avaliable on all pins. See the device Reference Manual for more details on the ABUS and analog peripherals. 

**Table 6.3.  ABUS Routing Table** 

|**Peripheral**|**Signal**|**PA**|**PA**|**PB**|**PB**|**PC**|**PC**|**PD**|**PD**|
|---|---|---|---|---|---|---|---|---|---|
|||**EVEN**|**ODD**|**EVEN**|**ODD**|**EVEN**|**ODD**|**EVEN**|**ODD**|
|IADC0|ANA_NEG|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
||ANA_POS|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|



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Rev. 1.3  |  28 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Pin Definitions 

## **6.4  Digital Peripheral Connectivity** 

Many digital resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port. 

**Table 6.4.  DBUS Routing Table** 

|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|---|
||**PA**|**PB**|**PC**|**PD**|
|CMU.CLKIN0|||Available|Available|
|CMU.CLKOUT0|||Available|Available|
|CMU.CLKOUT1|||Available|Available|
|CMU.CLKOUT2|Available|Available|||
|EUART0.CTS|Available|Available|Available|Available|
|EUART0.RTS|Available|Available|Available|Available|
|EUART0.RX|Available|Available|Available|Available|
|EUART0.TX|Available|Available|Available|Available|
|FRC.DCLK|||Available|Available|
|FRC.DFRAME|||Available|Available|
|FRC.DOUT|||Available|Available|
|I2C0.SCL|Available|Available|Available|Available|
|I2C0.SDA|Available|Available|Available|Available|
|I2C1.SCL|||Available|Available|
|I2C1.SDA|||Available|Available|
|LETIMER0.OUT0|Available|Available|||
|LETIMER0.OUT1|Available|Available|||
|MODEM.ANT0|Available|Available|Available|Available|
|MODEM.ANT1|Available|Available|Available|Available|
|MODEM.ANT_ROLL_OVER|||Available|Available|
|MODEM.ANT_RR0|||Available|Available|
|MODEM.ANT_RR1|||Available|Available|
|MODEM.ANT_RR2|||Available|Available|
|MODEM.ANT_RR3|||Available|Available|
|MODEM.ANT_RR4|||Available|Available|
|MODEM.ANT_RR5|||Available|Available|
|MODEM.ANT_SW_EN|||Available|Available|
|MODEM.ANT_SW_US|||Available|Available|
|MODEM.ANT_TRIG|||Available|Available|
|MODEM.ANT_TRIG_STOP|||Available|Available|
|MODEM.DCLK|Available|Available|||



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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Pin Definitions 

|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|---|
||**PA**|**PB**|**PC**|**PD**|
|MODEM.DIN|Available|Available|||
|MODEM.DOUT|Available|Available|||
|PDM.CLK|Available|Available|Available|Available|
|PDM.DAT0|Available|Available|Available|Available|
|PDM.DAT1|Available|Available|Available|Available|
|PRS.ASYNCH0|Available|Available|||
|PRS.ASYNCH1|Available|Available|||
|PRS.ASYNCH10|||Available|Available|
|PRS.ASYNCH11|||Available|Available|
|PRS.ASYNCH2|Available|Available|||
|PRS.ASYNCH3|Available|Available|||
|PRS.ASYNCH4|Available|Available|||
|PRS.ASYNCH5|Available|Available|||
|PRS.ASYNCH6|||Available|Available|
|PRS.ASYNCH7|||Available|Available|
|PRS.ASYNCH8|||Available|Available|
|PRS.ASYNCH9|||Available|Available|
|PRS.SYNCH0|Available|Available|Available|Available|
|PRS.SYNCH1|Available|Available|Available|Available|
|PRS.SYNCH2|Available|Available|Available|Available|
|PRS.SYNCH3|Available|Available|Available|Available|
|TIMER0.CC0|Available|Available|Available|Available|
|TIMER0.CC1|Available|Available|Available|Available|
|TIMER0.CC2|Available|Available|Available|Available|
|TIMER0.CDTI0|Available|Available|Available|Available|
|TIMER0.CDTI1|Available|Available|Available|Available|
|TIMER0.CDTI2|Available|Available|Available|Available|
|TIMER1.CC0|Available|Available|Available|Available|
|TIMER1.CC1|Available|Available|Available|Available|
|TIMER1.CC2|Available|Available|Available|Available|
|TIMER1.CDTI0|Available|Available|Available|Available|
|TIMER1.CDTI1|Available|Available|Available|Available|
|TIMER1.CDTI2|Available|Available|Available|Available|
|TIMER2.CC0|Available|Available|||
|TIMER2.CC1|Available|Available|||
|TIMER2.CC2|Available|Available|||



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Rev. 1.3  |  30 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Pin Definitions 

|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|---|
||**PA**|**PB**|**PC**|**PD**|
|TIMER2.CDTI0|Available|Available|||
|TIMER2.CDTI1|Available|Available|||
|TIMER2.CDTI2|Available|Available|||
|TIMER3.CC0|||Available|Available|
|TIMER3.CC1|||Available|Available|
|TIMER3.CC2|||Available|Available|
|TIMER3.CDTI0|||Available|Available|
|TIMER3.CDTI1|||Available|Available|
|TIMER3.CDTI2|||Available|Available|
|TIMER4.CC0|Available|Available|||
|TIMER4.CC1|Available|Available|||
|TIMER4.CC2|Available|Available|||
|TIMER4.CDTI0|Available|Available|||
|TIMER4.CDTI1|Available|Available|||
|TIMER4.CDTI2|Available|Available|||
|USART0.CLK|Available|Available|Available|Available|
|USART0.CS|Available|Available|Available|Available|
|USART0.CTS|Available|Available|Available|Available|
|USART0.RTS|Available|Available|Available|Available|
|USART0.RX|Available|Available|Available|Available|
|USART0.TX|Available|Available|Available|Available|
|USART1.CLK|Available|Available|||
|USART1.CS|Available|Available|||
|USART1.CTS|Available|Available|||
|USART1.RTS|Available|Available|||
|USART1.RX|Available|Available|||
|USART1.TX|Available|Available|||



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Rev. 1.3  |  31 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Design Guidelines 

## **7.  Design Guidelines** 

## **7.1  Layout and Placement** 

For optimal performance of the BGM220S the following guidelines are recommended: 

- Place the module 1.50 mm from the edge of the copper “keep-in” area at the middle of the long edge of the application PCB, as illustrated in Figure 7.1 Recommended Layout for BGM220S on page 32. 

- Copy the exact antenna design from Figure 7.2 Antenna Layout With Coordinates on page 33 with the values for coordinates A to L given in Table 7.1 Antenna Polygon Coordinates, Referenced to Center of BGM220S on page 33. 

- Make a cutout in all lower layers aligned with the right edge and the bottom edge of the antenna as indicated by the yellow box in Figure 7.3 Antenna Clearance in Inner and Bottom Layers on page 34. 

- Connect all ground pads directly to a solid ground plane in the top layer. 

- Connect RF_2G4 to ANT_IN through a 0-ohm resistor. 

   - The 0-ohm gives the ability to test conducted and to evaluate the antenna impedance in the design. 

- Place ground vias as close to the ground pads of the BGM220S as possible. 

- Place ground vias along the antenna loop right and bottom side. 

- Place ground vias along the edges of the application board. 

- Do not place plastic or any other dielectric material in contact with the antenna. 

   - A minimum clearance of 0.5 mm is advised. 

   - Solder mask, conformal coating and other thin dielectric layers are acceptable directly on top of the antenna region. 

**Figure 7.1.  Recommended Layout for BGM220S** 

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Rev. 1.3  |  32 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Design Guidelines 

**Figure 7.2.  Antenna Layout With Coordinates** 

**Table 7.1.  Antenna Polygon Coordinates, Referenced to Center of BGM220S** 

|**Point**|**BGM220SC12WGA2**|**BGM220SC22WGA2**<br>**BGM220SC22HNA2**|
|---|---|---|
|A|(2.87, 2.13)|(2.87, 2.13)|
|B|(2.54, 2.13)|(2.54, 2.13)|
|C|(2.54, 3.69)|(2.54, 3.69)|
|D|(3.36, 4.51)|(3.36, 4.51)|
|E|(8.85, 4.51)|(7.75, 4.51)|
|F|(8.85, 4.15)|(7.75, 4.15)|
|G|(6.84, 4.15)|(6.84, 4.15)|
|H|(6.21, 3.52)|(6.21, 3.52)|
|I|(4.26, 3.52)|(4.26, 3.52)|
|J|(3.97, 3.81)|(3.97, 3.81)|
|K|(3.10, 3.81)|(3.10, 3.81)|
|L|(2.87, 3.58)|(2.87, 3.58)|
|Wloop|5.98|4.88|
|Hloop|4.15|4.15|
|**Note:**<br>1. All coordinates and dimensions listed in mm.|||



## **Note:** 

1. All coordinates and dimensions listed in mm. 

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Rev. 1.3  |  33 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Design Guidelines 

**Figure 7.3.  Antenna Clearance in Inner and Bottom Layers** 

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Rev. 1.3  |  34 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Design Guidelines 

## **7.2  Best Design Practices** 

The design of a good RF system relies on thoughtful placement and routing of the RF signals. The following guidelines are recommended: 

- Place the BGM220S and antenna close to the center of the longest edge of the application board. 

- Do not place any circuitry between the board edge and the antenna. 

- Make sure to tie all GND planes in the application board together with as many vias as can be fitted. 

- Generally ground planes are recommended in all areas of the application board except in the antenna keep-out area shown in Figure 7.3 Antenna Clearance in Inner and Bottom Layers on page 34. 

- Open-ended stubs of copper in the outer layer ground planes must be removed if they are more than 5 mm long to avoid radiation of spurious emissions. 

- The width of the GND plane to the sides of the BGM220S will impact the efficiency of the on-board chip antenna. 

   - To achieve optimal performance, a GND plane width of 50 mm for BGM220S12A or 55 mm for BGM220S22A is recommended as seen on Figure 7.4 Illustration of Recommended Board Width on page 35. 

   - See 4.16.1 Antenna Typical Characteristics for reference. 

Figure 7.5 Non-Optimal Layout Examples on page 36 illustrates layout scenarios that will lead to severely degraded RF performance for the application board. 

**Figure 7.4.  Illustration of Recommended Board Width** 

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Rev. 1.3  |  35 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Design Guidelines 

- **Figure 7.5.  Non-Optimal Layout Examples** 

- _[tS] 

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Rev. 1.3  |  36 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Design Guidelines 

## **7.3  Radio Performance vs. Carrier Board Size and Other PCB Characteristics** 

For many applications, the carrier board size is determined by the overall form factor or size of the additional circuitry. The recommended carrier board width of 50 mm for the BGM220S12A and 55 mm for the BGM220S22A is thus not always possible in the end-application. If another form factor is required, the antenna performance of the integrated antenna will be compromised but it may still be sufficiently good for providing the required link quality and range of the end-application. Figure 7.6 Efficiency of the Integrated Antenna as Function of the Carrier Board Size for BGM220S12A on page 37 and Figure 7.7 Efficiency of the Integrated Antenna as Function of the Carrier Board Size for BGM220S22A on page 38 show the total efficiency of the integrated antenna for different carrier board sizes. As can be seen the best performance is achieved for the carrier board size of 50 mm x 30 mm for the BGM220S12A and 55 mm x 25 mm for the BGM220S22A, with relatively constant performance for larger boards and rapidly declining performance for smaller boards. 

The performance of all the sizes tested will be adequate for more than 15 m line-of-sight range and all of the sizes are thus usable. 

**Figure 7.6.  Efficiency of the Integrated Antenna as Function of the Carrier Board Size for BGM220S12A** 

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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Design Guidelines 

**Figure 7.7.  Efficiency of the Integrated Antenna as Function of the Carrier Board Size for BGM220S22A** 

Carrier PCB thickness and relative permittivity might also have an impact on the antenna impedance / antenna resonance frequency. Please refer to AN1394: BGM220S Antenna Tuning Guide for additional guidance on these properties. 

## **7.4  Proximity to Other Materials** 

Placing plastic or any other dielectric material directly in contact with the antenna may cause performance degradation. A clearance of minimum 0.5 mm is recommended to avoid excessive detuning of the antenna. Solder mask, conformal coating, and other thin dielectric layers are acceptable directly on top of the antenna region. Any metallic objects in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended distance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCB ground planes. 

## **7.5  Proximity to Human Body** 

Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range. Furthermore, additional certification may be required if the module is used in a wearable device. 

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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Design Guidelines 

## **7.6  Antenna Tuning and Validity of Modular Certifications** 

A modular certification is valid if all the design guidelines from the manufacturer with regards to carrier printed circuit board (PCB) size, thickness, relative permittivity, module placement, and antenna loop dimensions are followed. Modular certification is still valid, if no antenna tuning is applied to compensate for reduced performance in terms of range, which may result from sub-optimal carrier PCB size, thickness, relative permittivity, module placement, and/or proximity to other materials such as assembly housing. 

Any antenna tuning or change of the antenna loop dimensions might invalidate a modular certification, unless it is done to compensate for the degradation caused by a printed circuit board deviating from the manufacturer’s best-case reference in size, thickness, relative permittivity, and/or module placement, or to compensate for the degradation caused by the proximity of assembly housing. Guidance on how to address this type of degradation is provided in AN1394: BGM220S Antenna Tuning Guide, in which case a _Permissive Change_ to the modular approval might become necessary depending on the resulting performance of the end device relative to the certified module test reports. 

Class 1 Permissive Change (C1PC) is considered if the host PCB modifications do not increase emissions. Class 2 Permissive Change (C2PC) is considered if the modifications degrade the emissions, but remain below regulatory limits. 

Whether antenna tuning is applied or not, it is strongly recommended that spot-checking is performed in any case with the end-product having the transmitter(s) operating to confirm that the host product meets all regulatory requirements under any circumstance. 

The emission levels established in the module certification are limits for the end device too, and determine whether or not a _Permissive Change_ should be considered. Since this is evaluated on a case-by-case basis, customers must consult with the company providing certification services for their product to identify the best approach. Additional information on module certification and _Permissive Changes_ is provided in AN1048: Regulatory RF Module Certifications. 

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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Package Specifications 

## **8.  Package Specifications** 

## **8.1  Package Dimensions** 

The package dimensions are shown in Figure 8.1 Package Dimensions - Full on page 40 and Figure 8.2 Package Dimensions - Detail on page 40. 

**Figure 8.1.  Package Dimensions - Full** 

**Figure 8.2.  Package Dimensions - Detail** 

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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Package Specifications 

**Table 8.1.  Package Dimensions** 

|**Dimension**|**MIN**|**NOM**|**MAX**|
|---|---|---|---|
|A|1.080|1.180|1.280|
|A1|0.140|0.180|0.220|
|A2|0.950|1.000|1.050|
|b|0.200|0.250|0.300|
|D|6.000 BSC|||
|D1|4.500 BSC|||
|e|0.500 BSC|||
|E|6.000 BSC|||
|E1|4.500 BSC|||
|L|0.300|0.350|0.400|
|L1|0.125|0.175|0.225|
|L2|0.575|0.625|0.675|
|L3|0.450|0.500|0.550|
|eD1|0.450 BSC|||
|eD2|0.900 BSC|||
|eE1|0.450 BSC|||
|eE2|0.900 BSC|||
|aaa|0.100|||
|bbb|0.100|||
|ccc|0.100|||
|ddd|0.100|||
|eee|0.100|||
|**Note:**<br>1. The dimensions in parenthesis are reference.<br>2. All dimensions in millimeters (mm).<br>3. Unless otherwise specified, tolerances are:<br>a. Decimal: X.X = +/- 0.1<br>X.XX = +/- 0.05<br>X.XXX = +/- 0.03<br>b. Angular: +/- 0.1 (In Deg)<br>4. Hatching lines means package shielding area.||||



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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Package Specifications 

## **8.2  Recommended PCB Land Pattern** 

The recommended PCB Land Pattern is shown in Figure 8.3 Module Land Pattern on page 42 

**Figure 8.3.  Module Land Pattern** 

**Table 8.2.  PCB Land Pattern Dimensions** 

|**Dimension**|**Typ (mm)**|
|---|---|
|D1|4.50|
|D2|2.65|
|E1|4.50|
|E2|2.25|
|eD1|0.45|
|eD2|0.90|
|b|0.25|
|e|0.50|
|L|0.35|
|L1|0.50|



## **Note:** 

1. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05mm is assumed. 

2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 

3. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 4. The stencil thickness should be 0.100 mm (4 mils). 

5. The stencil aperture to land pad size recommendation is 80% paste coverage. 

6. _**Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different parameters and fine tune their SMT process as required for their application and tooling.**_ 

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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Package Specifications 

## **8.3  Top Marking** 

**Figure 8.4.   BGM220S Top Marking** 

**Table 8.3.  Top Marking Definition** 

|**OPN**|**Line 1 Marking**|**Line 2 Marking**|**Line 3 Marking**|
|---|---|---|---|
|BGM220SC12WGA2|BGM220S12A|SC12WGA2|See note below|
|BGM220SC22HNA2|BGM220S22A|SC22HNA2|See note below|
|BGM220SC22WGA2|BGM220S22A|SC22WGA2|See note below|



**Note:** YY = Year. WW = Work Week, TTTTTTT = Trace Code 

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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Soldering Recommendations 

## **9.  Soldering Recommendations** 

It is recommended that final PCB assembly of the BGM220S follows the industry standard as identified by the Institute for Printed Circuits (IPC). This product is assembled in compliance with the J-STD-001 requirements and the guidelines of IPC-AJ-820. Surface mounting of this product by the end user is recommended to follow IPC-A-610 to meet or exceed class 2 requirements. 

## **CLASS 1 General Electronic Products** 

Includes products suitable for applications where the major requirement is function of the completed assembly. 

## **CLASS 2 Dedicated Service Electronic Products** 

Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically the end-use environment would not cause failures. 

## **CLASS 3 High Performance/Harsh Environment Electronic Products** 

Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems. 

**Note:** General SMT application notes are provided in the AN1223 document. 

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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Tape and Reel 

## **10.  Tape and Reel** 

BGM220S modules are delivered to the customer in tray (490 pcs / tray) or reel (2500 pcs / reel) packaging with the dimensions below. All dimensions are given in mm unless otherwise indicated. 

**Figure 10.1.  Carrier Tape Dimensions** 

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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Tape and Reel 

**Figure 10.2.  Reel Dimensions** 

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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Certifications 

## **11.  Certifications** 

This section details the regulatory certification status of the BGM220S modules in various regions. For certification purposes, the modules are mainly referred to by their formal Model Name of BGM220S12A/BGM220S22A. 

The address of the modules' legal manufacturer and certification applicant is: 

## SILICON LABORATORIES FINLAND OY 

Alberga Business Park, Bertel Jungin aukio 3, 02600 Espoo, Finland 

The BGM220S12A/BGM220S22A modules have Brand Name of "SILICON LABS". 

## **11.1  Regulatory Certifications** 

## **11.1.1  Qualified Antennas** 

BGM220S modules have been tested and certified both with the on-board antennas and with external antennas attached to the RF pin (RF_2G4). Performance characteristics for the integral antennas are presented in Table 3.1 Antenna Efficiency and Peak Gain (BGM220S12A) on page 7, Table 3.2 Antenna Efficiency and Peak Gain (BGM220S22A) on page 7 and 4.16.1 Antenna Typical Characteristics. Details for the external qualified reference antennas are summarized in the table below. 

## **Table 11.1.  Qualified External Antennas for BGM220S** 

|**Model**|**Antenna Type**|**Maximum Gain**|**Impedance**|
|---|---|---|---|
|BGM220S12A|Connectorized Coaxial Dipole|3.2 dBi|50 Ω|
|BGM220S22A|Connectorized Coaxial Dipole|2.8 dBi|50 Ω|



Any external antenna of the same general type and of equal or less directional gain as listed in the above table, and having similar inband and out-of-band characteristics, can be used in the regulatory areas that have modular radio approvals, such as USA and Canada, as long as spot-check testing is performed to verify that no performance changes compromising compliance have been introduced. In the particular FCC case, in order to comply with e-CFR Title 47, Part 15, Subpart C, Section 15.203 the module integrator using an external antenna must ensure it has a unique connector or it is undetachable. In countries applying the ETSI standards, like the EU countries, the radiated emissions are always tested with the end-product and the antenna type is not critical, but antennas with higher gain may violate some of the regulatory limits. 

When using instead an external antenna of a different type (such as a chip antenna, a PCB trace antenna or a patch) or having nonsimilar in-band and out-of-band characteristics, but still with a gain less than or equal to the maximum gain listed in the table above, it can be added as a permissive change to the existing grant/certificate. In most of these cases, some radiated emission testing is demanded, but no modular or end-product re-certification is required. 

On the other hand, all products with antennas having more gain than the maximum gain listed in the table above are very likely to require a full new end-product certification. Since the exact permissive change procedure is chosen on a case by case basis, please consult your test house and/or a certification body for understanding the correct approach based on your unique design. You might also want or need to get in touch with Silicon Labs for any authorization letter that your certification body might ask for. 

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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Certifications 

## **11.1.2  EU and UK - CE and UKCA** 

The BGM220S modules have been tested against the relevant harmonized/designated standards and are in conformity with the essential requirements and other relevant requirements of the Radio Equipment Directive (RED) (2014/53/EU) and of the Radio Equipment Regulations (RER) (S.I. 2017/1206). 

Please notice that every end-product integrating a BGM220S module will need to perform the radio EMC tests on the whole assembly, according to the ETSI 301 489-x relevant standards. 

Furthermore, it is ultimately the responsibility of the manufacturer to ensure the compliance of the end-product as a whole. The specific product assembly is likely to have an impact to RF radiated characteristics, when compared to the bare module. Hence, manufacturers should carefully consider RF radiated testing with the final product assembly, especially taking into account the gain of the external antenna if any, and the possible deviations in the PSD, EIRP and spurious emissions measurements, as defined in the ETSI 300 328 standard. 

The modules are entitled to carry the CE and UKCA Marks, and a formal Declaration of Conformity (DoC) is available at the product web page which is reachable starting from https://www.silabs.com/. 

## **11.1.3  USA - FCC** 

This device complies with FCC’s e-CFR Title 47, Part 15, Subpart C, Section 15.247 (and related relevant parts of the ANSI C63.10.2013 standard) when operating with the embedded antenna or with the antenna type(s) listed in 11.1.1 Qualified Antennas. Operation is subject to the following two conditions: 

1. This device may not cause harmful interference, and 

2. This device must accept any interference received, including interference that may cause undesirable operation. 

Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment. 

## **FCC RF Radiation Exposure Statement** 

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. 

This transmitter meets the Mobile requirements at a distance of 20 cm and above from the human body, in accordance to the limit(s) exposed in the RF Exposure Analysis. 

This transmitter also meets the Portable requirements at distances equal or above those listed for convenience in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S12A) on page 54 and Table 11.3 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S22A) on page 54. 

This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. 

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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Certifications 

## **OEM Responsibilities to comply with FCC Regulations** 

This module has been tested for compliance to FCC Part 15. 

OEM integrators are responsible for testing their end-product for any additional compliance requirements needed with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Additionally, investigative measurements and spot checking are strongly recommended to verify that the full system compliance is maintained when the module is integrated, in accordance to the "Host Product Testing Guidance" in FCC's KDB 996369 D04 Module Integration Guide V01. 

- **General Considerations** 

This transmitter module is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B (unintentional radiator) rule requirement, which is applicable to the final host. The final host will need to be assessed for compliance to this portion of rule requirements, if applicable. 

- **Manual Information to the End User** 

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module, or how to change RF related parameters, in the user’s manual of the end product which integrates this module. 

The end user manual shall include all required regulatory information/warnings as shown in this manual. 

- **OEM / Host Manufacturer Responsibilities** 

OEM/Host manufacturers are ultimately responsible for the compliance of the host system. 

The BGM220S12A has a limited single-modular transmitter approval due to the radio portion of the module not being contained in its own RF shielding. Consequently, each new host will require a reassessment of radiated spurious emissions and a Class I Permissive Change to the grant. The final product must be reassessed against all the essential requirements of the FCC rule such as FCC Part 15 Subpart B before it can be placed on the US market. This includes reassessing the transmitter module for compliance with the Radio and EMF essential requirements of the FCC rules. This module must not be incorporated into any other radio device or system without retesting for compliance as multi-radio and combined equipment. 

The BGM220S22A is a shielded design, and comes with full modular approval. 

## **Separation** 

- To meet the SAR exemption for portable conditions, the minimum separation distance indicated in 

Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S12A) on page 54 and Table 11.3 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S22A) on page 54 must be maintained between the human body and the radiator (antenna) at all times. 

- This transmitter module is tested in a standalone mobile RF exposure condition, and in case of any co-located radio transmitter being allowed to transmit simultaneously, or in case of portable use at closer distances from the human body than those allowing the exceptions rules to be applied, a separate additional SAR evaluation will be required, ultimately leading to a Class II Permissive Change, or more rarely to a new grant. 

- **Important Note:** In the event that these conditions cannot be met, the final product will have to undergo additional testing to evaluate the RF exposure in order for the FCC authorization to remain valid, and a permissive change will have to be applied. The evaluation (SAR) is in the responsibility of the end-product’s manufacturer, as well as the permissive change that can be carried out with the help of the customer's own Telecommunication Certification Body as the grant holder’s agent. 

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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Certifications 

## **End Product Labeling** 

BGM220S modules are not labeled with their own FCC ID due to their size. Instead, the packaging label contains the FCC ID. In all cases when the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: 

## **For BGM220S12A** 

## **"Contains Transmitter Module FCC ID: QOQ-BGM220S"** 

Or 

## **"Contains FCC ID: QOQ-BGM220S"** 

## **For BGM220S22A** 

## **"Contains Transmitter Module FCC ID: QOQ-BGM220S2"** 

Or 

## **"Contains FCC ID: QOQ-BGM220S2"** 

**Final note** : As long as all the conditions in this and all the above sections are met, further RF testing of the transmitter with full modular approval is not required. However, OEMs are still supposed to follow the good practice and the FCC recommendation to ensure the compliance of the host by spot checking. 

Nevertheless, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements which might be mandatory with this module installed. 

## **Class B Device Notice - BGM220S22A Only** 

**Note:** This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: 

- Reorient or relocate the receiving antenna. 

- Increase the separation between the equipment and receiver. 

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. 

- Consult the dealer or an experienced radio / TV technician for help. 

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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Certifications 

## **11.1.4  Canada - ISED** 

## **ISED** 

This radio transmitter (IC: 5123A-BGM220S for the BGM220S12A and IC: 5123A-BGM220S2 for the BGM220S22A) has been approved by _Innovation, Science and Economic Development Canada (ISED Canada, formerly Industry Canada_ ) to operate with the embedded antenna and with the antenna type(s) listed in 11.1.1 Qualified Antennas, with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain listed, are strictly prohibited for use with this device. 

This device complies with ISED’s license-exempt RSS standards. Operation is subject to the following two conditions: 

1. This device may not cause interference; and 

2. This device must accept any interference, including interference that may cause undesired operation of the device 

## **RF Exposure Statement** 

Exception from routine SAR evaluation limits are given in RSS-102 Issue 5. 

For the Portable use case, RF exposure or SAR evaluation is not required in all cases, at any distance from the human body, except when the BGM220S22A is used at full power with the external reference dipole antenna, in which case the separation distance from the human body must be of 13 mm or more for the exemption. 

For more details, refer to the values stated in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S12A) on page 54 and Table 11.3 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S22A) on page 54: if the separation distances from the human body are less than the distances mentioned in the tables, then the OEM integrator is responsible for evaluating the SAR. 

The module meets the requirements for Mobile use cases when the minimum separation distance from the human body is 20 cm or greater, in accordance to the limit(s) exposed in the RF Exposure Analysis. 

## **OEM Responsibilities to comply with IC Regulations** 

The module has been certified for integration into products only by OEM integrators under the following conditions: 

- The antenna must be installed such that a minimum separation distance as stated above is maintained between the radiator (antenna) and all persons at all times. 

- The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. 

**Important Note:** In the event that these conditions cannot be met, the final product will have to undergo additional testing to evaluate the RF exposure in order for the ISED authorization to remain valid, and a permissive change will have to be applied with the help of the customer's own Telecommunication Certification Body typically acting as the certificate holder’s agent. 

In the case of the BGM220S12A, this variant has a limited approval due to the radio portion of the module not being contained in its own RF shielding: consequently, each new host will require a reassessment of the radiated spurious emissions, and the ISED will have to be notified with a Class IV Permissive Change. 

In the case of the BGM220S22A, this variant is a shielded design, and consequently comes with a full modular approval. 

## **End Product Labeling** 

The BGM220S modules are not labeled with their own IC ID due to their size. Instead, the packaging label contains the IC ID. In all cases when the IC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: 

## **For BGM220S12A** 

## “ **Contains Transmitter Module IC: 5123A-BGM220S** ” 

## or 

## “ **Contains IC: 5123A-BGM220S”** 

## **For BGM220S22A** 

“ **Contains Transmitter Module IC: 5123A-BGM220S2** ” 

## or 

## “ **Contains IC: 5123A-BGM220S2”** 

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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Certifications 

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. 

**Final note:** As long as all the conditions above are met, further RF testing of the transmitter with full modular approval is not required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). 

## **CAN ICES-003 (B) - BGM220S22A Only** 

This Class B digital apparatus complies with Canadian ICES-003. 

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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Certifications 

## **ISEDC (Français)** 

Le présent émetteur radio (IC: 5123A-BGM220S pour le BGM220S12A and IC: 5123A-BGM220S2 pour le BGM220S22A) a été approuvé par Innovation, Sciences et Développement Économique Canada (ISED Canada, anciennement Industrie Canada) pour fonctionner avec l'antenne intégrée et le ou les types d'antenne énumérés à la section 11.1.1 Qualified Antennas, avec le gain maximal admissible indiqué. Les types d'antenne non inclus dans cette liste, ayant un gainsupérieur au gain maximal indiqué, sont strictement interdits d'utilisation avec cet appareil. . 

Ce composant est conforme aux normes RSS, exonérées de licence d'ISED. Son mode de fonctionnement est soumis aux deux conditions suivantes: 

1. Ce composant ne doit pas générer d’interférences. 

2. Ce composant doit pouvoir être soumis à tout type de perturbation y compris celle pouvant nuire à son bon fonctionnement. 

## **Déclaration d'exposition RF** 

L'exception tirée des limites courantes d'évaluation SAR est donnée dans le document RSS-102 Issue 5. 

Pour le cas d'utilisation Portable, l'exposition RF ou l'évaluation SAR n'est pas nécessaire dans tous les cas, à n'importe quelle distance du corps humain, sauf lorsque le BGM220S22A est utilisé à pleine puissance avec l'antenne dipôle de référence externe, auquel cas la distance de séparation du le corps humain doit être de 13 mm ou plus pour l'exemption. 

Pour plus de détails, reportez-vous aux valeurs indiquées dans Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S12A) on page 54 et Table 11.3 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S22A) on page 54: si les distances de séparation du corps humain sont inférieures aux distances mentionnées dans les tableaux, alors l'intégrateur OEM est responsable de l'évaluation du SAR. 

Le module répond aux exigences des cas d'utilisation mobile lorsque la distance de séparation minimale du corps humain est de 20 cm ou plus, conformément aux limites exposées dans l'analyse d'exposition RF. 

## **Responsabilités des OEM pour une mise en conformité avec le Règlement du Circuit Intégré** 

Le module a été approuvé pour l'intégration dans des produits finaux exclusivement réalisés par des OEM sous les conditions suivantes: 

- L'antenne doit être installée de sorte qu'une distance de séparation minimale indiquée ci-dessus soit maintenue entre le radiateur (antenne) et toutes les personnes avoisinante, ce à tout moment. 

- Le module émetteur ne doit pas être localisé ou fonctionner avec une autre antenne ou un autre transmetteur que celle indiquée plus haut. 

Tant que les deux conditions ci-dessus sont respectées, il n’est pas nécessaire de tester ce transmetteur de façon plus poussée. Cependant, il incombe à l’intégrateur OEM de s’assurer de la bonne conformité du produit fini avec les autres normes auxquelles il pourrait être soumis de fait de l’utilisation de ce module (par exemple, les émissions des périphériques numériques, les exigences de périphériques PC, etc.). 

**Remarque Importante:** Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou co-implantation avec un autre émetteur), l'autorisation ISED n'est plus considérée comme valide et le numéro d’identification ID IC ne peut pas être apposé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera responsable de la réévaluation du produit final (y compris le transmetteur) et de l'obtention d'une autorisation ISED distincte. 

Dans le cas du BGM220S12A, l'approbation de cette variante est limitée car la partie radio du module n'est pas incluse dans son propre blindage RF: par conséquent, chaque nouvel hôte est requis dans tous les cas pour réévaluer les émissions rayonnées et le bureau doit être informé par un C4PC. 

Dans le cas du BGM220S22A, cette variante est une conception blindée et est par conséquent livrée avec une approbation modulaire complète. 

## **Étiquetage des produits finis** 

Les modules BGM220S ne sont pas étiquetés avec leur propre ID IC en raison de leur taille. Au lieu de cela, l'étiquette d'emballage contient l'ID IC. Dans tous les cas, lorsque l'ID IC n'est pas visible lorsque le module est intégré au sein d'un autre produit, cet autre produit dans lequel le module est installé devra porter une étiquette faisant apparaitre les référence du module intégré. Dans un tel cas, sur le produit final doit se trouver une étiquette aisément lisible sur laquelle figurent les informations suivantes: 

## **Pour le BGM220S12A** 

## “ **Contient le module transmetteur: 5123A-BGM220S** ” 

or 

“ **Contient le circuit: 5123A-BGM220S”** 

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BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Certifications 

## **Pour le BGM220S12A** 

## “ **Contient le module transmetteur: 5123A-BGM220S2** ” 

or 

## “ **Contient le circuit: 5123A-BGM220S2”** 

**Note finale:** L'intégrateur OEM doit être conscient qu’il ne doit pas fournir, dans le manuel d’utilisation, d'informations relatives à la façon d'installer ou de d’enlever ce module RF ainsi que sur la procédure à suivre pour modifier les paramètres liés à la radio. 

## **CAN ICES-003 (B) - BGM220S22A uniquement** 

Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003. 

## **11.1.5  Proximity to Human Body** 

When using the BGM220S modules in an application where the radio is located close to the human body, the human RF exposure must be taken into account. FCC, ISED, and CE all have different standards and rules for evaluating the RF exposure. In particular, each regulator has different requirements when it comes to the exemption from having to perform RF exposure and SAR (Specific Absorption Rate) measurements, and the minimum separation distances between the module and human body varies accordingly. The properties of the BGM220S modules allows for the minimum separation distances detailed in the tables below for SAR evaluation exemption in portable use cases (less than 20 cm from human body). The module is approved for the Mobile use case (more than 20 cm) without any need for RF Exposure evaluation. 

**Table 11.2.  Minimum Separation Distances for SAR Evaluation Exemption (BGM220S12A)** 

|**Certification**|**BGM220S12A**|
|---|---|
|FCC|0 mm|
|ISED|0 mm|
|CE|The RF exposure must always be evaluated using the end-product when transmitting with power<br>levels higher than 20 mW (13 dBm).|



**Table 11.3.  Minimum Separation Distances for SAR Evaluation Exemption (BGM220S22A)** 

|**Certification**|**BGM220S22A**|
|---|---|
|FCC|0 mm|
|ISED|13 mm with the reference external antenna<br>12 mm for integral antenna|
|CE|The RF exposure must always be evaluated using the end-product when transmitting with power<br>levels higher than 20 mW (13 dBm).|



For FCC and ISED, using the module in end-products where the separation distance from the human body is smaller than that listed above is allowed but requires evaluation of the RF exposure in the final assembly and applying for a _Class 2 Permissive Change_ or _Change of ID_ to be applied to the existing FCC/ISED approvals of the module. For CE, RF exposure must be evaluated using the endproduct in all cases when transmitting at more than the power level indicated in the table. 

**Note:** Placing the module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thus a reduced range is to be expected. 

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Rev. 1.3  |  54 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Certifications 

## **11.1.6  Japan - MIC** 

The BGM22S12A are certified in Japan with certification number 203-JN1080. 

The BGM22S22A are certified in Japan with certification number 209-J00429. 

It is the end-product manufacturer's responsibility to ensure that the module is configured to meet the limits documented in the formal certification test report available at https://www.silabs.com/. If needed, refer to the API reference manual(s) to learn how to configure the maximum RF TX power for the normal operations. 

Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio module in their host equipment places the certification mark and certification number on the outside of the host equipment. This combination of mark and number, and their relative placement, is depicted in figure 11.1, and depending on the size of the module it might also appear on the top shield markings of the radio module. The certification mark and certification number must be placed close to the text in the Japanese language which is provided below. This change in the Radio Law has been made in order to enable users of the combination of host and radio module to verify if they are actually using a radio device which is approved for use in Japan 

Certification Text to be Placed on the Outside Surface of the Host Equipment: 

## **Translation of the text:** 

“This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law.” 

The "Giteki" marking shown in the figures below must be affixed to an easily noticeable section of the specified radio equipment. 

Note that additional information may be required if the device is also subject to a telecom approval. 

**Figure 11.1.  GITEKI Mark and ID (BGM220S12A)** 

**Figure 11.2.  GITEKI Mark and ID (BGM220S22A)** 

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Rev. 1.3  |  55 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Certifications 

**Figure 11.3.  GITEKI Mark** 

## **11.1.7  South Korea - KC** 

The BGM220S22A modules have a RF registration for import and use in South-Korea. 

Registration number is KC ID: R-R-BGT-BGM220S2 

When integrating this RF-certified module, an end-product is exempted from doing the RF emission testing, as long as the recommended design guidance is followed, and the approved antennas are used. In cases when the custom SRD protocol is additionally enabled and used, the registration is valid only with the integral antenna, and the use of any external antenna will require separate testing and certification of the complete new system. 

EMC testing and any other relevant test applicable to the end-product as a whole, plus appropriate labeling of the end-product, might still be required for the full regulatory compliance in the country. 

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Rev. 1.3  |  56 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Certifications 

## **11.1.8  Taiwan - NCC** 

The BGM220S22A modules are certified in Taiwan with NCC certification number of CCAI23Y10060T8. BGM220S22A ALTE G Ye la NCC Beane A Se CCAI23Y10060T8 Wee | Manufacturers are required to mark their end-products with the following sentence: "This product contains a radio frequency module with certification number CCAI23Y10060T8." 

Note: The outer packaging of the final product must also be marked with the NCC conformity mark by the manufacturer 

Additionally, the final product will have to be listed in the NCC database of approved radio-equipped devices. Consequently, the end manufacturer is also supposed to contact the certification house that originally released the full modular approval and apply for the registration of their device under the above certification number (fees might apply.) 

## NCC Statement 

For low-power radio frequency equipment that has been certified, companies, firms, or users are not allowed to change the frequency, increase the power, or change the characteristics and functions of the original design without further NCC approval. 

The use of low-power radio frequency equipment shall not affect flight safety and interfere with legal communications. 

If interference is found, it shall be immediately stopped, and the equipment can be brought back into use only after it has been improved, so that interference is found no more. 

The aforementioned legal communication refers to radio communications operating in accordance with the provisions of the Telecommunications Management Act. 

Low-power radio frequency equipment must withstand interference from legitimate communications or radiating electrical equipment for industrial, scientific, and medical applications. 

## NCC 

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Rev. 1.3  |  57 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Certifications 

## **11.1.9  Brazil - ANATEL** 

The BGM220S22A and BGM220S12A are certified for Brazil, and come with a homologation by ANATEL with number of 07556-24-03402. 

The user manual of the equipment that integrates this module must contain the following sentences: 

1] "This equipment integrates a Bluetooth radio wireless module having ANATEL homologation code of 07556-24-03402." 

2] "This equipment is not entitled to protection against harmful interference and may not cause interference to other duly authorized systems." 

O BGM220S22A e o BGM220S12A são certificados para o Brasil e possuem homologação na ANATEL com o número 07556-24-03402. 

O manual do usuário do equipamento que integra este módulo deve conter as seguintes frases: 

1] "Este produto contém um módulo de rádio Bluetooth com código de homologação ANATEL 07556-24-03402." 

2] "Este equipamento não tem direito à proteção contra interferência prejudicial e não pode causar interferência em sistemas devidamente autorizados." 

## **11.2  Standards-Based Certifications** 

## **11.2.1  Bluetooth Qualification** 

The BGM220S modules are qualified as a Core Layer RF-PHY Design based on Bluetooth Low Energy Core Specification 5.3, with Declaration ID of D056805 and QDID of 178495. 

Additionally, the modules are included in a pre-qualified RF-PHY design based on Bluetooth Low Energy Core Specification 5.4, with Declaration ID of D065594 and QDID of 231196. 

The RF-PHY design should be imported and combined with the latest Wireless Gecko Link Layer and Host qualified design(s) by Silicon Labs when qualifying a Product (Core-Complete Configuration Design) that embeds the BGM220S, using the Bluetooth SIG's Qualification Workspace tool. 

Please find out more about Bluetooth Qualification on docs.silabs.com. 

**silabs.com** | Building a more connected world. 

Rev. 1.3  |  58 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Revision History 

## **12.  Revision History** 

## **Revision 1.3** 

January, 2025 

- Updated Bluetooth version number throughout the document. 

- Updated 7.3 Radio Performance vs. Carrier Board Size and Other PCB Characteristics 

- Updated 7.6 Antenna Tuning and Validity of Modular Certifications 

- Added Certificaton for Brazil - ANATEL 

- Updated 11.2.1 Bluetooth Qualification. 

- Removed warning in 7.3 Radio Performance vs. Carrier Board Size and Other PCB Characteristics and replaced with new section 7.6 Antenna Tuning and Validity of Modular Certifications. 

## **Revision 1.2** 

October, 2023 

- Added regulatory certifcation for BGM220S22A (see Section 11.1.8 Taiwan - NCC. 

## **Revision 1.1** 

January, 2022 

- Updated regulatory certifications in 1. Feature List. 

- Updated direction finding language in 2. Ordering Information. 

- Added kits available for evaluation in 2. Ordering Information. 

- Corrected Storage Temperature range in 4.1 Absolute Maximum Ratings. 

- Corrected initial calibrated accuracy in 4.11 High-Frequency Crystal. 

- Added footnote for crystal load capacitance with Gain=2 test condition in 4.12 Low Frequency Crystal Oscillator. 

- Added RESETn low time to ensure pin reset (T_RESET) specification to Table 4.14 GPIO Pins on page 20. 

- Updated 11.1.2 EU and UK - CE and UKCA. 

- Updated wording for 11.2.1 Bluetooth Qualification. 

## **Revision 1.0** 

September, 2020 

- Various wording updates to 11.1 Regulatory Certifications to introduce BGM220S22A model. 

- Updated wording for 11.2.1 Bluetooth Qualification. 

## **Revision 0.7** 

July, 2020 

- Updated 2. Ordering Information with devices for model BGM220S22A. 

- Added Table 3.2 Antenna Efficiency and Peak Gain (BGM220S22A) on page 7 for model BGM220S22A. 

- Updated 4. Electrical Characteristics with additional specifications for model BGM220S22A and latest characterization data. 

- Added Figure 4.4  BGM220S22A Typical 2D Antenna Radiation Patterns on 55 mm x 20 mm board on page 23 for model BGM220S22A. 

- Updated 7. Design Guidelines with guidelines and information covering model BGM220S22A. 

- Added marking information for model BGM220S22A to Table 8.3 Top Marking Definition on page 43. 

- Added section to note pending certification for model BGM220S22A. 

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Rev. 1.3  |  59 

BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Revision History 

## **Revision 0.6** 

June, 2020 

- Updated 4.2.1 DC-DC Operating Limits to relax lifetime safe operating region. 

- Updated 5. Reference Diagrams to mark PTI interface as recommended in figures. 

- Updated 4. Electrical Characteristics with latest characterization results and limits. 

- Updated 11. Certifications with additional certification details. 

## **Revision 0.5** 

March, 2019 

- In the front page block diagram, updated the lowest energy mode for LETIMER. 

- Updated part numbers in 2. Ordering Information to reflect new ordering code scheme. 

- In 2. Ordering Information, added note about referencing by family, model, or ordering code. 

- Added 4.13 Precision Low Frequency RC Oscillator (LFRCO). 

- Added supply voltage, crystal frequencies and RF frequencies to Figure 3.1 BGM220S Block Diagram on page 6. 

- Updated 4. Electrical Characteristics with latest characterization details. 

- Updated 5. Reference Diagrams. 

- Added section 11. Certifications. 

- Added section 5. Reference Diagrams. 

- Added section 10. Tape and Reel. 

## **Revision 0.1** 

September, 2019 

Initial release. 

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## **Disclaimer** 

Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and “Typical” parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A “Life Support System” is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications. 

## **Trademark Information** 

Silicon Laboratories Inc.[®] , Silicon Laboratories[®] , Silicon Labs[®] , SiLabs[®] and the Silicon Labs logo[®] , Bluegiga[®] , Bluegiga Logo[®] , EFM[®] , EFM32[®] , EFR, Ember[®] , Energy Micro, Energy Micro logo and combinations thereof, “the world’s most energy friendly microcontrollers”, Redpine Signals[®] , WiSeConnect , n-Link, EZLink[®] , EZRadio[®] , EZRadioPRO[®] , Gecko[®] , Gecko OS, Gecko OS Studio, Precision32[®] , Simplicity Studio[®] , Telegesis, the Telegesis Logo[®] , USBXpress[®] , Zentri, the Zentri logo and Zentri DMS, Z-Wave[®] , and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective holders. 

**61** 

**Silicon Laboratories Inc. 400 West Cesar Chavez**
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Silicon Labs is a recognized industry leader in secure, intelligent wireless technology and precision timing solutions. Renowned for driving innovation in the Internet of Things (IoT) and industrial automation, the company develops electronic components that deliver the performance, energy savings, and design simplicity required to build a seamlessly connected world. Our extensive portfolio of Silicon Labs components prominently features their robust wireless connectivity and timing products. This includes a comprehensive selection of Bluetooth modules and adaptors engineered for reliable, low-power communication in smart devices. Complementing these wireless offerings is a broad array of precision timing devices, particularly standard and advanced MEMS oscillators, which are critical for ensuring exact synchronization and stable frequency control in demanding circuit designs. To support a wider spectrum of networking and communication requirements, the lineup also encompasses versatile WLAN modules and USB adaptors. Additionally, engineers will find highly integrated sub-2.4GHz ISM band RF transceivers, available as both standalone integrated circuits and complete RF modules, providing exceptional range and signal resilience for complex wireless deployments.
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