BGM220SC12WGA2
Bluetooth Module, BLE 5.2, 2 Mbps, -98.6 dBm, 1.8 V to 3.8 V Supply, -40 °C to 85 °C
- Manufacturer: SILICON LABS
- Product type: Bluetooth Modules & Adaptors
- SVHC: To Be Advised
- Interfaces: I2C, SPI, UART, USART
- Product Range: -
- Certifications: ANATEL, CE, FCC, ISED, KC, MIC, NCC, UKCA
- Bluetooth Class: -
- Bluetooth Version: Bluetooth LE 5.2
- Supply Voltage Range: 1.8 V to 3.8 V
- Receiver Sensitivity Rx: -98.6 dBm
- Operating Temperature Range: -40 °C to 85 °C
| Delivery and price | |
|---|---|
| Units per pack | 250 |
| Price | 3.51 € |
| Current stock | 500+ |
| Lead time | 30 days |
## **BGM220S** 无线 **Gecko Bluetooth[®]** 模块数据 表 ## BGM220S 是旨在满足 Bluetooth 网络中运行的电池供电式 IoT 产 品的性能、安全性和可靠性要求的模块。 BGM220S 基于 EFR32BG22 SoC ,支持 Bluetooth[®] 低能耗连接,可提供一流的 RF 范围和性能, 其功能和 OTA 固件更新可满足未来需求,具有增强的安全性和较低的能耗。 BGM220S 模块是全面的解决方案,具有完全可升级的强大软件栈、全球范围内的法规认证、先进的 开发和调试工具,以及可尽量缩减和简化最终产品工程和开发工作的支持功能,从而帮助缩短产品上 市时间。 BGM220S 适用于各类应用领域,包括: - 资产标记和信标 - 便携式医疗设备 - 运动、健身和康体器材 - 联网家居 - 工业和楼宇自动化 ## 主要特点 - Bluetooth 5.2 - 内置天线或 RF 引脚 - 高达 6 dBm 的 TX 功率 - 在 1 Mbps 时, dBm BLE RX 灵敏度为 -98.6 - 32 位 ARM Cortex-M33 (内核高达 76.8 MHz ) - 512/32 kB 闪存 /RAM 内存 - 最优的 MCU 外围设备选择 - 25 个 GPIO 引脚 - 6 mm × 6 mm × 1.1 mm - Bluetooth 网状网络低功耗节点 **==> picture [410 x 208] intentionally omitted <==** **----- Start of picture text -----**<br> Core / Memory Crystals Clock Management Energy Security<br>Management<br>ARM Cortexwith DSP extensions,FPU and TrustZone [TM] M33 processor Flash Program Memory 38.4 MHz Fast StartupHF Crystal Oscillator RC OscillatorPrecision LF HF RegulatorVoltage ConverterDC-DC Crypto Acceleration<br>RC Oscillator RC Oscillator<br>ETM Debug Interface RAM Memory ControllerLDMA LF Crystal Oscillator Ultra LF RC Oscillator Power-On Reset Brown-Out Detector Number GeneratorTrue Random<br>32-bit bus<br>Peripheral Reflex System<br>Antenna Radio Subsystem Serial I/O Ports Timers and Triggers Analog I/F<br>Interfaces<br>AntennaDiscrete w/ OOK DetectRFSENSE DEMOD ARM CortexM0+ Radio Controller [TM] USART InterruptsExternal CounterTimer/ Protocol Timer ADC<br>Matching RX/TX Frontend IFADC BUFC RAM PDM Purpose I/OGeneral Low Energy Timer Watchdog Timer Temperature Sensor<br>with Integrated PA<br>Frequency AGC FRC EUART Pin Reset Real Time CounterCapture Back-Up Real Time Counter<br>Synthesizer MOD CRC I [2] C Pin Wakeup<br>Lowest power mode with peripheral operational:<br>EM0—Active EM1—Sleep EM2—Deep Sleep EM3—Stop EM4—Shutoff<br>**----- End of picture text -----**<br> **silabs.com** | Building a more connected world. Rev. 1.1 BGM220S 无线 Gecko Bluetooth[®] 模块数据表 功能列表 ## 1. 功能列表 - 支持的协议 - Bluetooth 低能耗( Bluetooth 5.2 ) - 定向检测 - 1M 、 2M 和 LE 编码 PHY - Bluetooth 网状网络低功耗节点 - 无线片上系统 - 2.4 GHz 无线电 - TX 功率高达 6 dBm - 高性能 32 位 ARM Cortex-M33[®] ,带有 DSP 指令和浮点单元,可实现 高效的信号处理 - 高达 512 kB 的闪存程序存储器 - 32 kB RAM 数据存储器 - 嵌入式跟踪宏单元 (ETM) ,可用于高级调试 - 接收器性能高 - 在 125 kbps GFSK 的条件下,灵敏度为 -106.4 dBm (0.1% BER) - 在 500 kbps GFSK 的条件下,灵敏度为 -102.3 dBm (0.1% BER) - 在 1 Mbps GFSK 的条件下,灵敏度为 -98.6 dBm (0.1% BER) - 在 2 Mbps GFSK 的条件下,灵敏度为 -95.9 dBm (0.1% BER) - 低能耗 - 在 1 Mbps GFSK 的条件下, RX 电流为 4.2 mA - 在 0 dBm 输出功率下, TX 电流为 4.6 mA - 在活动模式 (EM0) 下,运行功耗为 26 μA/MHz - 1.40 μA EM2 深度睡眠电流( RTCC 从 LFXO 中运行,保留全部 RAM ) - 监管认证 - CE and UKCA - EU and UK - FCC - USA - ISED - Canada - MIC - Japan - KC - South Korea - 较宽工作范围 - 1.8 至 3.8 V - 提供 -40 至 +105 °C 和 -40 至 +85 °C 版本 - 尺寸 - 6 mm × 6 mm × 1.1 mm - 安全特性 - 通过信任根和安全加载程序 (RTSL) 进行的安全启动 - 硬件加密加速,适用于 AES128/256 、 SHA-1 、 SHA-2 (高达 256 位)、 ECC (高达 256 位)、 ECDSA 和 ECDH - 符合 NIST SP800-90 和 AIS-31 标准的真随机数生成器 (TRNG) - ARM[®] TrustZone[®] - 使用锁定 / 解锁功能进行安全调试 - 广泛的 **MCU** 外围设备选择 - 模拟数字转换器 (ADC) - 12 位, 1 Msps - 16 位, 76.9 ksps - 25 个带有输出状态保持和异步中断功能的通用 I/O 引脚 - 8 信道 DMA 控制器 - 12 信道外围设备反射系统 (PRS) - 4 个 16 位定时器 / 计数器( 3 个比较 / 捕获 /PWM 通道) - 1 个 32 位定时器 / 计数器( 3 个比较 / 捕获 /PWM 通道) - 32 位实时计数器 - 24 位低能耗定时器,用于波形生成 - 1 个看门狗定时器 - 2 个通用同步 / 异步接收器 / 传输器 (UART/SPI/SmartCard (ISO 7816)/ IrDA/I[2] S) - 1 个增强型通用异步接收器 / 传输器 (EUART) - 2 个 I[2] C 接口,带 SMBus 支持 - 数字麦克风接口 (PDM) - 可选 OOK 模式的 RFSENSE **silabs.com** | Building a more connected world. Rev. 1.1 | 2 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Ordering Information ## **2. Ordering Information** **Table 2.1. Ordering Information** |**Ordering Code**|**Protocol Stack**|**TX Power**<br>**Rating**|**Max CPU**<br>**Speed**|**Anten-**<br>**na**|**RF**<br>**Shield**|**Flash**<br>**(kB)**|**RAM**<br>**(kB)**|**GPIO**|**Temp Range**| |---|---|---|---|---|---|---|---|---|---| |BGM220SC12WGA2|Bluetooth 5.2|0 dBm|38.4 MHz|Built-in|No|352|32|25|-40 to 85 °C| |BGM220SC22HNA2|Bluetooth 5.2<br>• Direction Find-<br>ing Rx|6 dBm|76.8 MHz|Built-in|Yes|512|32|25|-40 to 105 °C| |BGM220SC22WGA2|Bluetooth 5.2|6 dBm|76.8 MHz|Built-in|Yes|352|32|25|-40 to 85 °C| ## **Note:** 1. End-product manufacturers must verify that the module is configured to meet regulatory limits for each region in accordance with the formal certification test reports. 2. Devices are pre-programmed with BGAPI UART DFU bootloader v1.10.2. 3. Throughout this document, the devices in the table above may be referred to by their product family name (e.g. BGM220S), by model name (BGM220S12A for 0 dBm TX power, BGM220S22A for 6 dBm TX power), or by full ordering code. 4. LE Long Range (125 kbps and 500 kbps) PHYs are only supported on part numbers which include direction-finding capability. 5. In accordance with the Bluetooth specification, the module operates over the following frequency range: 2402 - 2480 MHz. The module is also capable of operating in a separate custom transmit-only mode where proprietary packets are sent over the channels 2401 MHz and 2481 MHz using the same 1 Mbps GFSK modulation. 6. All devices in the table above support transmitting CTE (Constant Tone Extension) which is required in Direction Finding, but only specific devices support CTE receive. These devices are marked with "Direction Finding Rx" in the Protocol Stack Column. 7. The **SLWSTK6103A Wireless Starter Kit** is available for BGM220S evaluation and development, as well as the **SLWRB4312A** radio board. **silabs.com** | Building a more connected world. Rev. 1.1 | 3 ## **Table of Contents** |**1.**|**Feature List .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 2**| |---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---| |**2.**|**Ordering Information**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 3**| |**3.**|**System Overview .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 6**| ||3.1 Introduction .<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 6| ||3.2 EFR32BG22 SoC .<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 7| ||3.3 Antenna .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 7| ||3.4 Power Supply<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 7| |**4.**|**Electrical Characteristics .**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 8**| ||4.1 Absolute Maximum Ratings.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 8| ||4.2 General Operating Conditions .<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 9| ||4.2.1 DC-DC Operating Limits<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.10| ||4.3 MCU Current Consumption with 3 V Supply||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.11| ||4.4 Radio Current Consumption with 3|V Supply .||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.12| ||4.5 RF Transmitter General Characteristics for the|||||2.4|GHz||Band||.|.|.|.|.|.|.|.|.|.|.|.|.|.13| ||4.6 RF Receiver General Characteristics for the||||2.4 GHz|||Band .|||.|.|.|.|.|.|.|.|.|.|.|.|.|.13| ||4.7 RF Receiver Characteristics for Bluetooth Low|||||Energy in the 2.4||||||GHz Band 1 Mbps Data Rate||||||||||.|.|.14| ||4.8 RF Receiver Characteristics for Bluetooth Low|||||Energy in the 2.4||||||GHz Band 2 Mbps Data Rate||||||||||.|.|.15| ||4.9 RF Receiver Characteristics for Bluetooth Low|||||Energy in the 2.4||||||GHz Band 500 kbps|||||||Data||Rate||.|.16| ||4.10 RF Receiver Characteristics for Bluetooth Low Energy||||||||in the 2.4 GHz Band 125|||||||||kbps Data Rate .||||||.17| ||4.11 High-Frequency Crystal<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.18| ||4.12 Low Frequency Crystal Oscillator|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.18| ||4.13 Precision Low Frequency RC Oscillator|||(LFRCO) .||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.19| ||4.14 GPIO Pins .<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.20| ||4.15 Microcontroller Peripherals<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.21| ||4.16 Typical Performance Curves .<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.21| ||4.16.1 Antenna Typical Characteristics||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.22| |**5.**|**Reference Diagrams.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**24**| ||5.1 Network Co-Processor (NCP) Application with|||||UART||Host||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.24| ||5.2 SoC Application<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.25| |**6.**|**Pin Definitions .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**26**| ||6.1 44-Pin SiP Module Device Pinout.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.26| ||6.2 Alternate Function Table.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.28| ||6.3 Analog Peripheral Connectivity<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.28| ||6.4 Digital Peripheral Connectivity .<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.29| |**7.**|**Design Guidelines**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 32**| **silabs.com** | Building a more connected world. Rev. 1.1 | 4 |7.1 Layout and Placement<br>.|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.32| |---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---| |7.2 Best Design Practices<br>.|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.35| |7.3 Radio Performance vs. Carrier Board||||||Size||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.37| |7.4 Proximity to Other Materials||.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.38| |7.5 Proximity to Human Body|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.38| |**8. Package Specifications**|**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.39**| |8.1 Package Dimensions .<br>.|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.39| |8.2 Recommended PCB Land|Pattern||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.41| |8.3 Top Marking .<br>.<br>.<br>.<br>.|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.42| |**9. Soldering Recommendations**|||**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 43**| |**10. Tape and Reel**<br>**.**<br>**.**<br>**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.44**| |**11. Certifications .**<br>**.**<br>**.**<br>**.**<br>**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**46**| |11.1 Regulatory Certifications|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.46| |11.1.1 Qualified Antennas.|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.46| |11.1.2 EU and UK - CE and|UKCA.||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.46| |11.1.3 USA - FCC<br>.<br>.<br>.|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.47| |11.1.4 ISED Canada<br>.<br>.|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.49| |11.1.5 Proximity to Human Body||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.52| |11.1.6 Japan - MIC .<br>.<br>.|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.53| |11.1.7 South Korea - KC .|.|.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.54| |11.2 Standards-Based Certifications||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.54| |11.2.1 Bluetooth Qualification||.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.54| |**12. Revision History.**<br>**.**<br>**.**<br>**.**|**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**55**| **silabs.com** | Building a more connected world. Rev. 1.1 | 5 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet System Overview ## **3. System Overview** ## **3.1 Introduction** The BGM220S module combines an energy-friendly MCU with a highly integrated radio transceiver in a SiP module with a robust, integrated antenna. This section gives a short introduction to the features of the module. The block diagram for the BGM220S module is shown in the figure below. The wireless module includes the EFR32BG22 wireless System on a Chip (SoC), required decoupling capacitors and inductors, 38.4 MHz crystal, RF matching circuit, and integrated antenna. **==> picture [430 x 239] intentionally omitted <==** **----- Start of picture text -----**<br> 2400 – 2483.5 MHz<br>External<br>Antenna 2400 – 2483.5 MHz 1.8 - 3.8 V<br>VREGVDD<br>or ANT_OUT<br>Integral IOVDD<br>Supply Decoupling<br>Antenna<br>ANT_IN and DC-DC Support VREG<br>DECOUPLE<br>0 Ohm<br>RF_2G4 RF Match<br>Silicon Labs (up to 25)<br>G PIO<br>EFR32BG22<br>HF XTAL<br>GND<br>38.4 MHz<br>**----- End of picture text -----**<br> **Figure 3.1. BGM220S Block Diagram** A simplified internal schematic for the BGM220S module is shown in the figure below. **==> picture [396 x 187] intentionally omitted <==** **----- Start of picture text -----**<br> EFR32BG22<br>VREGVDD VREGVDD Integral ANT_OUT<br>4.7µF AVDD Antenna ANT_IN<br>IOVDD IOVDD<br>Matching<br>VREGSW RF2G4_IO RF_2G4<br>Network<br>2.2µH<br>PA0x PAx (0-8)<br>PB0x PBx (0-4)<br>VREG DVDD PC0x PCx (0-6)<br>RFVDD PD0x PDx (0-3)<br>PAVDD<br>HFXTAL_I<br>4.7µF 38.4 MHz<br>DECOUPLE DECOUPLE HFXTAL_O<br>2.2µF<br>**----- End of picture text -----**<br> **Figure 3.2. BGM220S Module Schematic** **silabs.com** | Building a more connected world. Rev. 1.1 | 6 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet System Overview ## **3.2 EFR32BG22 SoC** The EFR32BG22 SoC features a 32-bit ARM Cortex M33 core, a 2.4 GHz high-performance radio, 512 kB of flash memory, a rich set of MCU peripherals, and various clock management and serial interfacing options. Consult the EFR32xG22 Wireless Gecko Reference Manual and the EFR32BG22 Data Sheet for details. ## **3.3 Antenna** BGM220S modules include an integral antenna on board with the characteristics detailed in the tables below. ## **Table 3.1. Antenna Efficiency and Peak Gain (BGM220S12A)** |**Parameter**|**With optimal layout **|**Note**| |---|---|---| |Efficiency|-1.4 to -2.6 dB|Antenna efficiency, gain and radiation pattern are highly depend-<br>ent on the application PCB layout and mechanical design. Refer<br>to7. Design Guidelinesfor recommendations to achieve optimal<br>antenna performance.| |Peak gain|1.5 dBi|| **Table 3.2. Antenna Efficiency and Peak Gain (BGM220S22A)** |**Parameter**|**With optimal layout **|**Note**| |---|---|---| |Efficiency|-1 to -2 dB|Antenna efficiency, gain and radiation pattern are highly depend-<br>ent on the application PCB layout and mechanical design. Refer<br>to7. Design Guidelinesfor recommendations to achieve optimal<br>antenna performance.| |Peak gain|2.3 dBi|| ## **3.4 Power Supply** The BGM220S requires a single nominal supply level of 3.0 V to operate. All necessary decoupling and filtering components are included in the module, and the supply is fully regulated internally. **silabs.com** | Building a more connected world. Rev. 1.1 | 7 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics ## **4. Electrical Characteristics** All electrical parameters in all tables are specified under the following conditions, unless stated otherwise: - Typical values are based on TA=25 °C and VREGVDD supply at 3.0 V, by production test and/or technology characterization. - Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise. ## **4.1 Absolute Maximum Ratings** Stresses beyond those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions beyond those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx. **Table 4.1. Absolute Maximum Ratings** |**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |Storage temperature range|TSTG||-40|—|+125|°C| |Voltage on any supply pin|VDDMAX||-0.3|—|3.8|V| |Junction temperature|TJMAX|-G grade|—|—|+105|°C| |||-N grade|—|—|+105|°C| |Voltage ramp rate on any<br>supply pin|VDDRAMPMAX||—|—|1.0|V / µs| |DC voltage on any GPIO pin|VDIGPIN||-0.3|—|VIOVDD+<br>0.3|V| |Input RF level on RF pin<br>RF_2G4|PRFMAX2G4||—|—|+10|dBm| |Absolute voltage on RF pin<br>RF_2G4|VMAX2G4||-0.3|—|VVREG+<br>0.3|V| |Total current into VDD power<br>lines|IVDDMAX|Source|—|—|200|mA| |Total current into VSS<br>ground lines|IVSSMAX|Sink|—|—|200|mA| |Current per I/O pin|IIOMAX|Sink|—|—|50|mA| |||Source|—|—|50|mA| |Current for all I/O pins|IIOALLMAX|Sink|—|—|200|mA| |||Source|—|—|200|mA| **silabs.com** | Building a more connected world. Rev. 1.1 | 8 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics ## **4.2 General Operating Conditions** This table specifies the general operating temperature range and supply voltage range for all supplies. The minimum and maximum values of all other tables are specifed over this operating range, unless otherwise noted. **Table 4.2. General Operating Conditions** |**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |Operating ambient tempera-<br>ture range|TA|-G temperature grade|-40|—|+85|°C| |||-N temperature grade|-40|—|+105|°C| |IOVDDx operating supply<br>voltage (All IOVDD pins)|VIOVDDx||1.71|3.0|3.8|V| |VREGVDD operating supply<br>voltage|VVREGVDD|DCDC in regulation1|2.2|3.0|3.8|V| |||DCDC in bypass|1.8|3.0|3.8|V| |HCLK and SYSCLK frequen-<br>cy|fHCLK|VSCALE2, MODE = WS1|—|—|76.8|MHz| |||VSCALE2, MODE = WS0|—|—|40|MHz| |PCLK frequency|fPCLK|VSCALE2|—|—|50|MHz| |||VSCALE1|—|—|40|MHz| |EM01 Group A clock fre-<br>quency|fEM01GRPACLK|VSCALE2|—|—|76.8|MHz| |||VSCALE1|—|—|40|MHz| |EM01 Group B clock fre-<br>quency|fEM01GRPBCLK|VSCALE2|—|—|76.8|MHz| |||VSCALE1|—|—|40|MHz| |Radio HCLK frequency2|fRHCLK|VSCALE2 or VSCALE1|—|38.4|—|MHz| |**Note:**<br>1. The supported maximum VVREGVDDin regulation mode is a function of temperature and 10-year lifetime average load current.<br>See more details in4.2.1 DC-DC Operating Limits.<br>2. The recommended radio crystal frequency is 38.4 MHz. Any crystal frequency other than 38.4 is expressly not supported.||||||| **silabs.com** | Building a more connected world. Rev. 1.1 | 9 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics ## **4.2.1 DC-DC Operating Limits** The maximum supported voltage on the VREGVDD supply pin is limited under certain conditions. Maximum input voltage is a function of temperature and the average load current over a 10-year lifetime. Figure 4.1 Lifetime average load current limit vs. Maximum input voltage on page 10 shows the safe operating region under specific conditions. Exceeding this safe operating range may impact the reliability and performance of the DC-DC converter. The average load current for an application can typically be determined by examining the current profile during the time the device is powered. For example, an application that is continuously powered which spends 99% of the time asleep consuming 2 µA and 1% of the time active and consuming 10 mA has an average lifetime load current of about 102 µA. **==> picture [225 x 167] intentionally omitted <==** **----- Start of picture text -----**<br> 60 Tj ≤ 105 °C<br>5<br>3.3 3.8<br>Maximum VVREGVDD (V)<br> (mA)<br>LOAD<br>Average Lifetime I<br>**----- End of picture text -----**<br> **Figure 4.1. Lifetime average load current limit vs. Maximum input voltage** The minimum input voltage for the DC-DC in EM0/EM1 mode is a function of the maximum load current, and the peak current setting. Figure 4.2 Transient maximum load current vs. Minimum input voltage on page 10 shows the max load current vs. input voltage for different DC-DC peak inductor current settings. **==> picture [225 x 167] intentionally omitted <==** **----- Start of picture text -----**<br> 60<br>36<br>IPEAK = 150 mA<br>5 IPEAK = 90 mA<br>1.8 2.2<br>Minimum VVREGVDD (V)<br> (mA)<br>LOAD<br>Maximum I<br>**----- End of picture text -----**<br> **Figure 4.2. Transient maximum load current vs. Minimum input voltage** **silabs.com** | Building a more connected world. Rev. 1.1 | 10 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics ## **4.3 MCU Current Consumption with 3 V Supply** Unless otherwise indicated, typical conditions are: Module supply voltage = 3.0 V. Voltage scaling level = VSCALE1. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 °C. **Table 4.3. MCU Current Consumption with 3 V Supply** |**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |Current consumption in EM0<br>mode with all peripherals dis-<br>abled|IACTIVE|76.8 MHz HFRCO w/ DPLL refer-<br>enced to 38.4 MHz crystal, CPU<br>running while loop from flash,<br>VSCALE2|—|27|—|µA/MHz| |||76.8 MHz HFRCO w/ DPLL refer-<br>enced to 38.4 MHz crystal, CPU<br>running CoreMark loop from flash,<br>VSCALE2|—|37|—|µA/MHz| |||38.4 MHz crystal, CPU running<br>Prime from flash|—|28|—|µA/MHz| |||38.4 MHz crystal, CPU running<br>while loop from flash|—|26|—|µA/MHz| |||38.4 MHz crystal, CPU running<br>CoreMark loop from flash|—|38|—|µA/MHz| |||38 MHz HFRCO, CPU running<br>while loop from flash|—|22|—|µA/MHz| |||76.8 MHz HFRCO w/ DPLL refer-<br>enced to 38.4 MHz crystal, CPU<br>running Prime from flash,<br>VSCALE2|—|28|—|µA/MHz| |Current consumption in EM1<br>mode with all peripherals dis-<br>abled|IEM1|76.8 MHz HFRCO w/ DPLL refer-<br>enced to 38.4 MHz crystal,<br>VSCALE2|—|17|—|µA/MHz| |||38.4 MHz crystal|—|17|—|µA/MHz| |||38 MHz HFRCO|—|13|—|µA/MHz| |Current consumption in EM2<br>mode, VSCALE0|IEM2_VS|Full RAM retention and RTC run-<br>ning from LFXO|—|1.40|—|µA| |||Full RAM retention and RTC run-<br>ning from LFRCO|—|1.40|—|µA| |||Full RAM retention and RTC run-<br>ning from LFRCO in precision<br>mode|—|1.75|—|µA| |||24 kB RAM retention and RTC<br>running from LFXO|—|1.32|—|µA| |||24 kB RAM retention and RTC<br>running from LFRCO in precision<br>mode|—|1.66|—|µA| |||8 kB RAM retention and RTC run-<br>ning from LFXO|—|1.21|—|µA| |||8 kB RAM retention and RTC run-<br>ning from LFRCO|—|1.20|—|µA| |Current consumption in EM3<br>mode, VSCALE0|IEM3_VS|8 kB RAM retention and RTC run-<br>ning from ULFRCO|—|1.05|—|µA| **silabs.com** | Building a more connected world. Rev. 1.1 | 11 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics |**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |Current consumption in EM4<br>mode|IEM4|No BURTC, No LF Oscillator,<br>DCDC bypassed|—|0.17|—|µA| |Additional current in EM2 or<br>EM3 when any peripheral in<br>PD0B is enabled1|IPD0B_VS||—|0.37|—|µA| |**Note:**<br>1. Extra current consumed by power domain. Does not include current associated with the enabled peripherals. See for a list of the<br>peripherals in each power domain.||||||| ## **4.4 Radio Current Consumption with 3 V Supply** RF current consumption measured with MCU in EM1, HCLK = 38.4 MHz, and all MCU peripherals disabled. Unless otherwise indicated, typical conditions are: VREGVDD = 3.0 V. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 °C. **Table 4.4. Radio Current Consumption with 3 V Supply** |**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |System current consumption<br>in receive mode, active pack-<br>et reception|IRX_ACTIVE|125 kbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|4.2|—|mA| |||500 kbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|4.3|—|mA| |||1 Mbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|4.2|—|mA| |||2 Mbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|4.8|—|mA| |System current consumption<br>in receive mode, listening for<br>packet|IRX_LISTEN|125 kbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|4.3|—|mA| |||500 kbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|4.3|—|mA| |||1 Mbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|4.2|—|mA| |||2 Mbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|4.7|—|mA| |System current consumption<br>in transmit mode|ITX|f = 2.4 GHz, CW, 0 dBm output<br>power|—|4.6|—|mA| |||f = 2.4 GHz, CW, 6 dBm output<br>power|—|8.8|—|mA| **silabs.com** | Building a more connected world. Rev. 1.1 | 12 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics ## **4.5 RF Transmitter General Characteristics for the 2.4 GHz Band** Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz. **Table 4.5. RF Transmitter General Characteristics for the 2.4 GHz Band** |**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |RF tuning frequency range|FRANGE||2400|—|2483.5|MHz| |Maximum TX power1|POUTMAX|6 dBm output power|—|6.0|—|dBm| |||0 dBm output power|—|-0.5|—|dBm| |Minimum active TX Power|POUTMIN||—|-27|—|dBm| |Output power variation vs<br>VREGVDD supply voltage<br>variation, frequency = 2450<br>MHz|POUTVAR_V|6 dBm output power with<br>VREGVDD voltage swept from<br>1.8 V to 3.0 V|—|0.04|—|dB| |||0 dBm output power, with<br>VREGVDD voltage swept from<br>1.8 to 3.0 V|—|0.04|—|dB| |Output power variation vs<br>temperature, Frequency =<br>2450 MHz|POUTVAR_T|6 dBm output power, (-40 to +105<br>°C)|—|0.2|—|dB| |||0 dBm output power, (-40 to +105<br>°C)|—|1.3|—|dB| |||6 dBm output power, (-40 to +85<br>°C)|—|0.1|—|dB| |||0 dBm output power, (-40 to +85<br>°C)|—|1.0|—|dB| |Output power variation vs RF<br>frequency|POUTVAR_F|6 dBm output power|—|0.09|—|dB| |||0 dBm output power|—|0.15|—|dB| |**Note:**<br>1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-<br>ered in this data sheet can be found in the Max TX Power column of the Ordering Information Table.||||||| ## **4.6 RF Receiver General Characteristics for the 2.4 GHz Band** Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz. **Table 4.6. RF Receiver General Characteristics for the 2.4 GHz Band** |**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |RF tuning frequency range|FRANGE||2400|—|2483.5|MHz| **silabs.com** | Building a more connected world. Rev. 1.1 | 13 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics ## **4.7 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate** Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz. **Table 4.7. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate** |**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |Max usable receiver input<br>level|SAT|Signal is reference signal1|—|10|—|dBm| |Sensitivity|SENS|Signal is reference signal, 37 byte<br>payload2|—|-98.6|—|dBm| |||Signal is reference signal, 255<br>byte payload1|—|-97.2|—|dBm| |||With non-ideal signals3 1|—|-96.6|—|dBm| |Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 4|—|8.7|—|dB| |N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +1<br>MHz offset1 5 4 6|—|-6.6|—|dB| |||Interferer is reference signal at -1<br>MHz offset1 5 4 6|—|-6.5|—|dB| |N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +2<br>MHz offset1 5 4 6|—|-40.9|—|dB| |||Interferer is reference signal at -2<br>MHz offset1 5 4 6|—|-39.9|—|dB| |N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +3<br>MHz offset1 5 4 6|—|-45.9|—|dB| |||Interferer is reference signal at -3<br>MHz offset1 5 4 6|—|-46.2|—|dB| |Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 6|—|-23.5|—|dB| |Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision1 6|—|-40.9|—|dB| |||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision1 6|—|-6.6|—|dB| |Intermodulation performance|IM|n = 3 (see note7)|—|-17.1|—|dBm| |**Note:**<br>1. 0.017% Bit Error Rate.<br>2. 0.1% Bit Error Rate.<br>3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>4. Desired signal -67 dBm.<br>5. Measured frequency is 2401 MHz ≤ Fc ≤ 2481 MHz.<br>6. With allowed exceptions.<br>7. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4||||||| **silabs.com** | Building a more connected world. Rev. 1.1 | 14 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics ## **4.8 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate** Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz. **Table 4.8. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate** |**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |Max usable receiver input<br>level|SAT|Signal is reference signal1|—|10|—|dBm| |Sensitivity|SENS|Signal is reference signal, 37 byte<br>payload2|—|-95.9|—|dBm| |||Signal is reference signal, 255<br>byte payload1|—|-94.3|—|dBm| |||With non-ideal signals3 1|—|-94.0|—|dBm| |Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 4|—|8.8|—|dB| |N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +2<br>MHz offset1 5 4 6|—|-9.2|—|dB| |||Interferer is reference signal at -2<br>MHz offset1 5 4 6|—|-6.6|—|dB| |N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +4<br>MHz offset1 5 4 6|—|-43.3|—|dB| |||Interferer is reference signal at -4<br>MHz offset1 5 4 6|—|-44.0|—|dB| |N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +6<br>MHz offset1 5 4 6|—|-48.6|—|dB| |||Interferer is reference signal at -6<br>MHz offset1 5 4 6|—|-50.7|—|dB| |Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 6|—|-23.8|—|dB| |Selectivity to image frequen-<br>cy ± 2 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +2 MHz with 1<br>MHz precision1 6|—|-43.3|—|dB| |||Interferer is reference signal at im-<br>age frequency -2 MHz with 1 MHz<br>precision1 6|—|-9.2|—|dB| |Intermodulation performance|IM|n = 3 (see note7)|—|-18.8|—|dBm| |**Note:**<br>1. 0.017% Bit Error Rate.<br>2. 0.1% Bit Error Rate.<br>3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>4. Desired signal -64 dBm.<br>5. Measured frequency is 2401 MHz ≤ Fc ≤ 2481 MHz.<br>6. With allowed exceptions.<br>7. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4||||||| **silabs.com** | Building a more connected world. Rev. 1.1 | 15 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics ## **4.9 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate** Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz. **Table 4.9. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate** |**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |Max usable receiver input<br>level|SAT|Signal is reference signal1|—|10|—|dBm| |Sensitivity|SENS|Signal is reference signal, 37 byte<br>payload2|—|-102.3|—|dBm| |||Signal is reference signal, 255<br>byte payload1|—|-100.9|—|dBm| |||With non-ideal signals3 1|—|-99.8|—|dBm| |Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 4|—|2.7|—|dB| |N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +1<br>MHz offset1 5 4 6|—|-8.0|—|dB| |||Interferer is reference signal at -1<br>MHz offset1 5 4 6|—|-7.9|—|dB| |N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +2<br>MHz offset1 5 4 6|—|-46.5|—|dB| |||Interferer is reference signal at -2<br>MHz offset1 5 4 6|—|-49.9|—|dB| |N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +3<br>MHz offset1 5 4 6|—|-48.9|—|dB| |||Interferer is reference signal at -3<br>MHz offset1 5 4 6|—|-53.8|—|dB| |Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 6|—|-48.3|—|dB| |Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision1 6|—|-49.9|—|dB| |||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision1 6|—|-46.5|—|dB| |**Note:**<br>1. 0.017% Bit Error Rate.<br>2. 0.1% Bit Error Rate.<br>3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>4. Desired signal -72 dBm.<br>5. Measured frequency is 2401 MHz ≤ Fc ≤ 2481 MHz.<br>6. With allowed exceptions.||||||| **silabs.com** | Building a more connected world. Rev. 1.1 | 16 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics ## **4.10 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate** Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz. **Table 4.10. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate** |**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |Max usable receiver input<br>level|SAT|Signal is reference signal1|—|10|—|dBm| |Sensitivity|SENS|Signal is reference signal, 37 byte<br>payload2|—|-106.4|—|dBm| |||Signal is reference signal, 255<br>byte payload1|—|-106.0|—|dBm| |||With non-ideal signals3 1|—|-105.6|—|dBm| |Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 4|—|0.9|—|dB| |N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +1<br>MHz offset1 5 4 6|—|-13.6|—|dB| |||Interferer is reference signal at -1<br>MHz offset1 5 4 6|—|-13.4|—|dB| |N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +2<br>MHz offset1 5 4 6|—|-52.6|—|dB| |||Interferer is reference signal at -2<br>MHz offset1 5 4 6|—|-55.8|—|dB| |N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +3<br>MHz offset1 5 4 6|—|-53.7|—|dB| |||Interferer is reference signal at -3<br>MHz offset1 5 4 6|—|-59.0|—|dB| |Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 6|—|-52.7|—|dB| |Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision1 6|—|-53.7|—|dB| |||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision1 6|—|-52.6|—|dB| |**Note:**<br>1. 0.017% Bit Error Rate.<br>2. 0.1% Bit Error Rate.<br>3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>4. Desired signal -79 dBm.<br>5. Measured frequency is 2401 MHz ≤ Fc ≤ 2481 MHz.<br>6. With allowed exceptions.||||||| **silabs.com** | Building a more connected world. Rev. 1.1 | 17 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics ## **4.11 High-Frequency Crystal** **Table 4.11. High-Frequency Crystal** |**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |Crystal frequency|fHFXTAL||—|38.4|—|MHz| |Initial calibrated accuracy|ACCHFXTAL||-10|—|10|ppm| |Temperature drift|DRIFTHFXTAL|Across specified temperature<br>range|-20|—|20|ppm| ## **4.12 Low Frequency Crystal Oscillator** **Table 4.12. Low Frequency Crystal Oscillator** |**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |Crystal Frequency|FLFXO||—|32.768|—|kHz| |Supported Crystal equivalent<br>series resistance (ESR)|ESRLFXO|GAIN = 0|—|—|80|kΩ| |||GAIN = 1 to 3|—|—|100|kΩ| |Supported range of crystal<br>load capacitance1|CLFXO_CL|GAIN = 0|4|—|6|pF| |||GAIN = 1|6|—|10|pF| |||GAIN = 2 (see note2)|10|—|12.5|pF| |||GAIN = 3 (see note2)|12.5|—|18|pF| |Current consumption|ICL12p5|ESR = 70 kOhm, CL = 12.5 pF,<br>GAIN3= 2, AGC4= 1|—|357|—|nA| |Startup Time|TSTARTUP|ESR = 70 kOhm, CL = 7 pF,<br>GAIN3= 1, AGC4= 1|—|63|—|ms| |On-chip tuning cap step size|SSLFXO||—|0.26|—|pF| |On-chip tuning capacitor val-<br>ue at minimum setting5|CLFXO_MIN|CAPTUNE = 0|—|4|—|pF| |On-chip tuning capacitor val-<br>ue at maximum setting5|CLFXO_MAX|CAPTUNE = 0x4F|—|24.5|—|pF| |**Note:**<br>1. Total load capacitance seen by the crystal<br>2. Crystals with a load capacitance of greater than 12 pF require external load capacitors.<br>3. In LFXO_CAL Register<br>4. In LFXO_CFG Register<br>5. The effective load capacitance seen by the crystal will be CLFXO/2. This is because each XTAL pin has a tuning cap and the two<br>caps will be seen in series by the crystal||||||| **silabs.com** | Building a more connected world. Rev. 1.1 | 18 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics ## **4.13 Precision Low Frequency RC Oscillator (LFRCO)** **Table 4.13. Precision Low Frequency RC Oscillator (LFRCO)** |**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |Nominal oscillation frequen-<br>cy|FLFRCO||—|32.768|—|kHz| |Frequency accuracy|FLFRCO_ACC|Normal mode|-3|—|3|%| |||Precision mode1, across operat-<br>ing temperature range2|-500|—|500|ppm| |Startup time|tSTARTUP|Normal mode|—|204|—|µs| |||Precision mode1|—|11.7|—|ms| |Current consumption|ILFRCO|Normal mode|—|175|—|nA| |||Precision mode1, T = stable at 25<br>°C3|—|655|—|nA| |**Note:**<br>1. The LFRCO operates in high-precision mode when CFG_HIGHPRECEN is set to 1. High-precision mode is not available in EM4.<br>2. Includes ± 40 ppm frequency tolerance of the HFXO crystal.<br>3. Includes periodic re-calibration against HFXO crystal oscillator.||||||| **silabs.com** | Building a more connected world. Rev. 1.1 | 19 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics ## **4.14 GPIO Pins** Unless otherwise indicated, typical conditions are: IOVDD = 3.0 V. **Table 4.14. GPIO Pins** |**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |Leakage current|ILEAK_IO|MODEx = DISABLED, IOVDD =<br>1.71 V|—|1.9|—|nA| |||MODEx = DISABLED, IOVDD =<br>3.0 V|—|2.5|—|nA| |Input low voltage1|VIL|Any GPIO pin|—|—|0.3*IOVDD|V| |||RESETn|—|—|0.3*DVDD|V| |Input high voltage1|VIH|Any GPIO pin|0.7*IOVDD|—|—|V| |||RESETn|0.7*DVDD|—|—|V| |Hysteresis of input voltage|VHYS|Any GPIO pin|0.05*IOVD<br>D|—|—|V| |||RESETn|0.05*DVDD|—|—|V| |Output high voltage|VOH|Sourcing 20mA, IOVDD = 3.0 V|0.8 *<br>IOVDD|—|—|V| |||Sourcing 8mA, IOVDD = 1.71 V|0.6 *<br>IOVDD|—|—|V| |Output low voltage|VOL|Sinking 20mA, IOVDD = 3.0 V|—|—|0.2 *<br>IOVDD|V| |||Sinking 8mA, IOVDD = 1.71 V|—|—|0.4 *<br>IOVDD|V| |GPIO rise time|TGPIO_RISE|IOVDD = 3.0 V, Cload= 50pF,<br>SLEWRATE = 4, 10% to 90%|—|8.4|—|ns| |||IOVDD = 1.71 V, Cload= 50pF,<br>SLEWRATE = 4, 10% to 90%|—|13|—|ns| |GPIO fall time|TGPIO_FALL|IOVDD = 3.0 V, Cload= 50pF,<br>SLEWRATE = 4, 90% to 10%|—|7.1|—|ns| |||IOVDD = 1.71 V, Cload= 50pF,<br>SLEWRATE = 4, 90% to 10%|—|11.9|—|ns| |Pull up/down resistance2|RPULL|Any GPIO pin. Pull-up to IOVDD:<br>MODEn = DISABLE DOUT=1.<br>Pull-down to VSS: MODEn =<br>WIREDORPULLDOWN DOUT =<br>0.|35|44|55|kΩ| |||RESETn pin. Pull-up to DVDD|35|44|55|kΩ| |Maximum filtered glitch width|TGF|MODE = INPUT, DOUT = 1|—|27|—|ns| |RESETn low time to ensure<br>pin reset|TRESET||100|—|—|ns| |**Note:**<br>1. GPIO input thresholds are proportional to the IOVDD pin. RESETn input thresholds are proportional to DVDD.<br>2. GPIO pull-ups connect to IOVDD supply, pull-downs connect to VSS. RESETn pull-up connects to DVDD.||||||| **silabs.com** | Building a more connected world. Rev. 1.1 | 20 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics ## **4.15 Microcontroller Peripherals** The MCU peripherals set available in BGM220S modules includes: - ADC: 12-bit at 1 Msps, 16-bit at 76.9 ksps - 16-bit and 32-bit Timers/Counters - 24-bit Low Energy Timer for waveform generation - 32-bit Real Time Counter - USART (UART/SPI/SmartCards/IrDA/I2S) - EUART (UART/IrDA) - I[2] C peripheral interfaces - PDM interface - 12 Channel Peripheral Reflex System For details on their electrical performance, consult the relevant portions of Section 4 in the SoC datasheet. To learn which GPIO ports provide access to every peripheral, consult Analog Peripheral Connectivity and Digital Peripheral Connectivity. ## **4.16 Typical Performance Curves** Typical performance curves indicate typical characterized performance under the stated conditions. **silabs.com** | Building a more connected world. Rev. 1.1 | 21 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics ## **4.16.1 Antenna Typical Characteristics** Typical BGM220S radiation patterns for the on-board chip antenna under optimal operating conditions are plotted in the figures that follow. Antenna gain and radiation patterns have a strong dependence on the size and shape of the application PCB the module is mounted on, as well as on the proximity of any mechanical design to the antenna. Top Left: Phi 0[o] , Top Right: Phi 90[o] , Bottom Left: Theta 90[o] **Figure 4.3. BGM220S12A Typical 2D Antenna Radiation Patterns on 50 mm x 30 mm board** **silabs.com** | Building a more connected world. Rev. 1.1 | 22 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Electrical Characteristics Top Left: Phi 0[o] , Top Right: Phi 90[o] , Bottom Left: Theta 90[o] **Figure 4.4. BGM220S22A Typical 2D Antenna Radiation Patterns on 55 mm x 20 mm board** **silabs.com** | Building a more connected world. Rev. 1.1 | 23 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Reference Diagrams ## **5. Reference Diagrams** ## **5.1 Network Co-Processor (NCP) Application with UART Host** The BGM220S can be controlled over the UART interface as a peripheral to an external host processor. Typical power supply, programming/debug interface, and host interface connections are shown in the figure below. For more details, refer to _AN958: Debugging and Programming Interfaces for Custom Designs_ . **==> picture [492 x 272] intentionally omitted <==** **----- Start of picture text -----**<br> Antenna Loop<br>RESETn<br>0.1 µF<br>(optional)<br>PTI_FRAME<br>PTI_DATA<br>(recommended)<br>0 Ohm NC PC02<br>ANT_IN PC01<br>RF_2G4 BGM220S PC00<br>GND PD00<br>32.768 kHz<br>GND PD01 (optional)<br>PB04 PD02<br>VDD<br>PB03 PD03<br>VDD<br>PB02 IOVDD<br>1 2 PB01 VREGVDD<br>RESETn 3 4 PB00 VREG<br>5 6 SWO (PA03)<br>SWDIO (PA02) 7 8 SWCLK (PA01)<br>PTI_FRAME (PC05) 9 10 PTI_DATA (PC04) GPIO RESETn<br>RTS<br>Mini Simplicity Debug Connector CTS Host CPU<br>TX<br>RX<br>ANT_OUT NC NC NC GND RESETn PC06 PC05 PC04 PC03<br>PA00 PA01 PA02 DECOUPLE PA03 PA04 PA05 PA06 PA07 PA08<br>VDD<br>SWCLK SWDIO SWO<br>GND<br>**----- End of picture text -----**<br> **Figure 5.1. UART NCP Configuration** **silabs.com** | Building a more connected world. Rev. 1.1 | 24 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Reference Diagrams ## **5.2 SoC Application** The BGM220S can be used in a stand-alone SoC configuration without an external host processor. Typical power supply and programming/debug interface connections are shown in the figure below. For more details, refer to _AN958: Debugging and Programming Interfaces for Custom Designs_ . **==> picture [486 x 342] intentionally omitted <==** **----- Start of picture text -----**<br> Antenna Loop<br>RESETn<br>0.1 µF<br>(optional)<br>PTI_FRAME<br>PTI_DATA<br>(recommended)<br>0 Ohm NC PC02<br>ANT_IN PC01<br>RF_2G4 BGM220S PC00<br>GND PD00<br>32.768 kHz<br>GND PD01 (optional)<br>PB04 PD02<br>PB03 PD03<br>PB02 IOVDD<br>PB01 VREGVDD<br>VDD<br>PB00 VREG<br>1 2<br>3 4<br>RESETn<br>5 6<br>SWO (PA03)<br>7 8<br>SWDIO (PA02) SWCLK (PA01)<br>9 10<br>PTI_FRAME (PC05) PTI_DATA (PC04)<br>Mini Simplicity Debug Connector<br>ANT_OUT NC NC NC GND RESETn PC06 PC05 PC04 PC03<br>PA00 PA01 PA02 DECOUPLE PA03 PA04 PA05 PA06 PA07 PA08<br>SWCLK SWDIO SWO<br>**----- End of picture text -----**<br> **Figure 5.2. Stand-Alone SoC Configuration** **silabs.com** | Building a more connected world. Rev. 1.1 | 25 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Pin Definitions ## **6. Pin Definitions** ## **6.1 44-Pin SiP Module Device Pinout** **==> picture [576 x 433] intentionally omitted <==** ## **Figure 6.1. 44-Pin SiP Module Device Pinout** The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the supported features for each GPIO pin, see 6.2 Alternate Function Table, 6.3 Analog Peripheral Connectivity, and 6.4 Digital Peripheral Connectivity. **Table 6.1. 44-Pin SiP Module Device Pinout** |**Pin Name**|**Pin(s)**|**Description**||**Pin Name**|**Pin(s)**|**Description**| |---|---|---|---|---|---|---| |NC|1|Do not connect||ANT_IN|2|Antenna In| |RF_2G4|3|2.4 GHz RF input/output||GND|4|Ground| |GND|5|Ground||PB04|6|GPIO| |PB03|7|GPIO||PB02|8|GPIO| |PB01|9|GPIO||PB00|10|GPIO| **silabs.com** | Building a more connected world. Rev. 1.1 | 26 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Pin Definitions |**Pin Name**|**Pin(s)**|**Description**||**Pin Name**|**Pin(s)**|**Description**| |---|---|---|---|---|---|---| |PA00|11|GPIO||PA01|12|GPIO| |PA02|13|GPIO||DECOUPLE|14|Decouple output for on-chip voltage<br>regulator. This pin is internally decou-<br>pled, and should be left disconnected.| |PA03|15|GPIO||PA04|16|GPIO| |PA05|17|GPIO||PA06|18|GPIO| |PA07|19|GPIO||PA08|20|GPIO| |VREG|21|Regulated supply voltage. This pin is in-<br>ternally connected to the SoC DVDD,<br>RFVDD, and PAVDD supply lines. It is<br>not intended to power external circuitry.||VREGVDD|22|Module input power supply. This pin is<br>internally connected to the SoC AVDD<br>and VREGVDD supply lines.| |IOVDD|23|I/O power supply||PD03|24|GPIO| |PD02|25|GPIO||PD01|26|GPIO| |PD00|27|GPIO||PC00|28|GPIO| |PC01|29|GPIO||PC02|30|GPIO| |PC03|31|GPIO||PC04|32|GPIO| |PC05|33|GPIO||PC06|34|GPIO| |RESETn|35|Reset Pin. The RESETn pin is internally<br>pulled up to VREG (DVDD).||GND|36|Ground| |NC|37|Do not connect||NC|38|Do not connect| |NC|39|Do not connect||ANT_OUT|40|Antenna Out| |GND|41|Ground||GND|42|Ground| |GND|43|Ground||GND|44|Ground| **silabs.com** | Building a more connected world. Rev. 1.1 | 27 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Pin Definitions ## **6.2 Alternate Function Table** A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows what functions are available on each device pin. **Table 6.2. GPIO Alternate Function Table** |**GPIO**|**Alternate Functions**|**Alternate Functions**|**Alternate Functions**|**Alternate Functions**| |---|---|---|---|---| |PB03|GPIO.EM4WU4|||| |PB01|GPIO.EM4WU3|||| |PB00||IADC0.VREFN||| |PA00||IADC0.VREFP||| |PA01|GPIO.SWCLK|||| |PA02|GPIO.SWDIO|||| |PA03|GPIO.SWV<br>GPIO.TDO<br>GPIO.TRACEDATA0|||| |PA04|GPIO.TDI<br>GPIO.TRACECLK|||| |PA05|GPIO.EM4WU0|||| |PD02|GPIO.EM4WU9|||| |PD01||LFXO.LFXTAL_I<br>LFXO.LF_EXTCLK||| |PD00||LFXO.LFXTAL_O||| |PC00|GPIO.EM4WU6<br>GPIO.THMSW_EN|||| |PC05|GPIO.EM4WU7|||| ## **6.3 Analog Peripheral Connectivity** Many analog resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port. When a differential connection is being used Positive inputs are restricted to the EVEN pins and Negative inputs are restricted to the ODD pins. When a single ended connection is being used positive input is avaliable on all pins. See the device Reference Manual for more details on the ABUS and analog peripherals. **Table 6.3. ABUS Routing Table** |**Peripheral**|**Signal**|**PA**|**PA**|**PB**|**PB**|**PC**|**PC**|**PD**|**PD**| |---|---|---|---|---|---|---|---|---|---| |||**EVEN**|**ODD**|**EVEN**|**ODD**|**EVEN**|**ODD**|**EVEN**|**ODD**| |IADC0|ANA_NEG|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes| ||ANA_POS|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes| **silabs.com** | Building a more connected world. Rev. 1.1 | 28 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Pin Definitions ## **6.4 Digital Peripheral Connectivity** Many digital resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port. **Table 6.4. DBUS Routing Table** |**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**| |---|---|---|---|---| ||**PA**|**PB**|**PC**|**PD**| |CMU.CLKIN0|||Available|Available| |CMU.CLKOUT0|||Available|Available| |CMU.CLKOUT1|||Available|Available| |CMU.CLKOUT2|Available|Available||| |EUART0.CTS|Available|Available|Available|Available| |EUART0.RTS|Available|Available|Available|Available| |EUART0.RX|Available|Available|Available|Available| |EUART0.TX|Available|Available|Available|Available| |FRC.DCLK|||Available|Available| |FRC.DFRAME|||Available|Available| |FRC.DOUT|||Available|Available| |I2C0.SCL|Available|Available|Available|Available| |I2C0.SDA|Available|Available|Available|Available| |I2C1.SCL|||Available|Available| |I2C1.SDA|||Available|Available| |LETIMER0.OUT0|Available|Available||| |LETIMER0.OUT1|Available|Available||| |MODEM.ANT0|Available|Available|Available|Available| |MODEM.ANT1|Available|Available|Available|Available| |MODEM.ANT_ROLL_OVER|||Available|Available| |MODEM.ANT_RR0|||Available|Available| |MODEM.ANT_RR1|||Available|Available| |MODEM.ANT_RR2|||Available|Available| |MODEM.ANT_RR3|||Available|Available| |MODEM.ANT_RR4|||Available|Available| |MODEM.ANT_RR5|||Available|Available| |MODEM.ANT_SW_EN|||Available|Available| |MODEM.ANT_SW_US|||Available|Available| |MODEM.ANT_TRIG|||Available|Available| |MODEM.ANT_TRIG_STOP|||Available|Available| |MODEM.DCLK|Available|Available||| **silabs.com** | Building a more connected world. Rev. 1.1 | 29 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Pin Definitions |**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**| |---|---|---|---|---| ||**PA**|**PB**|**PC**|**PD**| |MODEM.DIN|Available|Available||| |MODEM.DOUT|Available|Available||| |PDM.CLK|Available|Available|Available|Available| |PDM.DAT0|Available|Available|Available|Available| |PDM.DAT1|Available|Available|Available|Available| |PRS.ASYNCH0|Available|Available||| |PRS.ASYNCH1|Available|Available||| |PRS.ASYNCH10|||Available|Available| |PRS.ASYNCH11|||Available|Available| |PRS.ASYNCH2|Available|Available||| |PRS.ASYNCH3|Available|Available||| |PRS.ASYNCH4|Available|Available||| |PRS.ASYNCH5|Available|Available||| |PRS.ASYNCH6|||Available|Available| |PRS.ASYNCH7|||Available|Available| |PRS.ASYNCH8|||Available|Available| |PRS.ASYNCH9|||Available|Available| |PRS.SYNCH0|Available|Available|Available|Available| |PRS.SYNCH1|Available|Available|Available|Available| |PRS.SYNCH2|Available|Available|Available|Available| |PRS.SYNCH3|Available|Available|Available|Available| |TIMER0.CC0|Available|Available|Available|Available| |TIMER0.CC1|Available|Available|Available|Available| |TIMER0.CC2|Available|Available|Available|Available| |TIMER0.CDTI0|Available|Available|Available|Available| |TIMER0.CDTI1|Available|Available|Available|Available| |TIMER0.CDTI2|Available|Available|Available|Available| |TIMER1.CC0|Available|Available|Available|Available| |TIMER1.CC1|Available|Available|Available|Available| |TIMER1.CC2|Available|Available|Available|Available| |TIMER1.CDTI0|Available|Available|Available|Available| |TIMER1.CDTI1|Available|Available|Available|Available| |TIMER1.CDTI2|Available|Available|Available|Available| |TIMER2.CC0|Available|Available||| |TIMER2.CC1|Available|Available||| |TIMER2.CC2|Available|Available||| **silabs.com** | Building a more connected world. Rev. 1.1 | 30 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Pin Definitions |**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**| |---|---|---|---|---| ||**PA**|**PB**|**PC**|**PD**| |TIMER2.CDTI0|Available|Available||| |TIMER2.CDTI1|Available|Available||| |TIMER2.CDTI2|Available|Available||| |TIMER3.CC0|||Available|Available| |TIMER3.CC1|||Available|Available| |TIMER3.CC2|||Available|Available| |TIMER3.CDTI0|||Available|Available| |TIMER3.CDTI1|||Available|Available| |TIMER3.CDTI2|||Available|Available| |TIMER4.CC0|Available|Available||| |TIMER4.CC1|Available|Available||| |TIMER4.CC2|Available|Available||| |TIMER4.CDTI0|Available|Available||| |TIMER4.CDTI1|Available|Available||| |TIMER4.CDTI2|Available|Available||| |USART0.CLK|Available|Available|Available|Available| |USART0.CS|Available|Available|Available|Available| |USART0.CTS|Available|Available|Available|Available| |USART0.RTS|Available|Available|Available|Available| |USART0.RX|Available|Available|Available|Available| |USART0.TX|Available|Available|Available|Available| |USART1.CLK|Available|Available||| |USART1.CS|Available|Available||| |USART1.CTS|Available|Available||| |USART1.RTS|Available|Available||| |USART1.RX|Available|Available||| |USART1.TX|Available|Available||| **silabs.com** | Building a more connected world. Rev. 1.1 | 31 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Design Guidelines ## **7. Design Guidelines** ## **7.1 Layout and Placement** For optimal performance of the BGM220S the following guidelines are recommended: - Place the module 1.50 mm from the edge of the copper “keep-in” area at the middle of the long edge of the application PCB, as illustrated in Figure 7.1 Recommended Layout for BGM220S on page 32. - Copy the exact antenna design from Figure 7.2 Antenna Layout With Coordinates on page 33 with the values for coordinates A to L given in Table 7.1 Antenna Polygon Coordinates, Referenced to Center of BGM220S on page 33. - Make a cutout in all lower layers aligned with the right edge and the bottom edge of the antenna as indicated by the yellow box in Figure 7.3 Antenna Clearance in Inner and Bottom Layers on page 34. - Connect all ground pads directly to a solid ground plane in the top layer. - Connect RF_2G4 to ANT_IN through a 0-ohm resistor. - The 0-ohm gives the ability to test conducted and to evaluate the antenna impedance in the design. - Place ground vias as close to the ground pads of the BGM220S as possible. - Place ground vias along the antenna loop right and bottom side. - Place ground vias along the edges of the application board. - Do not place plastic or any other dielectric material in contact with the antenna. - A minimum clearance of 0.5 mm is advised. - Solder mask, conformal coating and other thin dielectric layers are acceptable directly on top of the antenna region. **Figure 7.1. Recommended Layout for BGM220S** **silabs.com** | Building a more connected world. Rev. 1.1 | 32 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Design Guidelines **Figure 7.2. Antenna Layout With Coordinates** **Table 7.1. Antenna Polygon Coordinates, Referenced to Center of BGM220S** |**Point**|**BGM220SC12WGA2**|**BGM220SC22WGA2**<br>**BGM220SC22HNA2**| |---|---|---| |A|(2.87, 2.13)|(2.87, 2.13)| |B|(2.54, 2.13)|(2.54, 2.13)| |C|(2.54, 3.69)|(2.54, 3.69)| |D|(3.36, 4.51)|(3.36, 4.51)| |E|(8.85, 4.51)|(7.75, 4.51)| |F|(8.85, 4.15)|(7.75, 4.15)| |G|(6.84, 4.15)|(6.84, 4.15)| |H|(6.21, 3.52)|(6.21, 3.52)| |I|(4.26, 3.52)|(4.26, 3.52)| |J|(3.97, 3.81)|(3.97, 3.81)| |K|(3.10, 3.81)|(3.10, 3.81)| |L|(2.87, 3.58)|(2.87, 3.58)| |Wloop|5.98|4.88| |Hloop|4.15|4.15| |**Note:**<br>1. All coordinates and dimensions listed in mm.||| ## **Note:** 1. All coordinates and dimensions listed in mm. **silabs.com** | Building a more connected world. Rev. 1.1 | 33 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Design Guidelines **Figure 7.3. Antenna Clearance in Inner and Bottom Layers** **silabs.com** | Building a more connected world. Rev. 1.1 | 34 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Design Guidelines ## **7.2 Best Design Practices** The design of a good RF system relies on thoughtful placement and routing of the RF signals. The following guidelines are recommended: - Place the BGM220S and antenna close to the center of the longest edge of the application board. - Do not place any circuitry between the board edge and the antenna. - Make sure to tie all GND planes in the application board together with as many vias as can be fitted. - Generally ground planes are recommended in all areas of the application board except in the antenna keep-out area shown in Figure 7.3 Antenna Clearance in Inner and Bottom Layers on page 34. - Open-ended stubs of copper in the outer layer ground planes must be removed if they are more than 5 mm long to avoid radiation of spurious emissions. - The width of the GND plane to the sides of the BGM220S will impact the efficiency of the on-board chip antenna. - To achieve optimal performance, a GND plane width of 50 mm for BGM220S12A or 55 mm for BGM220S22A is recommended as seen on Figure 7.4 Illustration of Recommended Board Width on page 35. - See 4.16.1 Antenna Typical Characteristics for reference. Figure 7.5 Non-Optimal Layout Examples on page 36 illustrates layout scenarios that will lead to severely degraded RF performance for the application board. **Figure 7.4. Illustration of Recommended Board Width** **silabs.com** | Building a more connected world. Rev. 1.1 | 35 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Design Guidelines - **Figure 7.5. Non-Optimal Layout Examples** - _[tS] **silabs.com** | Building a more connected world. Rev. 1.1 | 36 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Design Guidelines ## **7.3 Radio Performance vs. Carrier Board Size** For many applications, the carrier board size is determined by the overall form factor or size of the additional circuitry. The recommended carrier board width of 50 mm for the BGM220S12A and 55 mm for the BGM220S22A is thus not always possible in the end-application. If another form factor is required, the antenna performance of the integrated antenna will be compromised but it may still be sufficiently good for providing the required link quality and range of the end-application. Figure 7.6 Efficiency of the Integrated Antenna as Function of the Carrier Board Size for BGM220S12A on page 37 and Figure 7.7 Efficiency of the Integrated Antenna as Function of the Carrier Board Size for BGM220S22A on page 38 show the total efficiency of the integrated antenna for different carrier board sizes. As can be seen the best performance is achieved for the carrier board size of 50 mm x 30 mm for the BGM220S12A and 55 mm x 25 mm for the BGM220S22A, with relatively constant performance for larger boards and rapidly declining performance for smaller boards. The performance of all the sizes tested will be adequate for more than 15 m line-of-sight range and all of the sizes are thus usable. **WARNING: Any antenna tuning or change of the loop dimensions will void the modular certification of modules with modular certification. In that case, a Permissive Change to the modular approval is required.** **Figure 7.6. Efficiency of the Integrated Antenna as Function of the Carrier Board Size for BGM220S12A** **silabs.com** | Building a more connected world. Rev. 1.1 | 37 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Design Guidelines **Figure 7.7. Efficiency of the Integrated Antenna as Function of the Carrier Board Size for BGM220S22A** ## **7.4 Proximity to Other Materials** Placing plastic or any other dielectric material directly in contact with the antenna may cause performance degradation. A clearance of minimum 0.5 mm is recommended to avoid excessive detuning of the antenna. Solder mask, conformal coating, and other thin dielectric layers are acceptable directly on top of the antenna region. Any metallic objects in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended distance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCB ground planes. ## **7.5 Proximity to Human Body** Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range. Furthermore, additional certification may be required if the module is used in a wearable device. **silabs.com** | Building a more connected world. Rev. 1.1 | 38 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Package Specifications ## **8. Package Specifications** ## **8.1 Package Dimensions** The package dimensions are shown in Figure 8.1 Package Dimensions - Full on page 39 and Figure 8.2 Package Dimensions - Detail on page 39. **Figure 8.1. Package Dimensions - Full** **Figure 8.2. Package Dimensions - Detail** **silabs.com** | Building a more connected world. Rev. 1.1 | 39 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Package Specifications **Table 8.1. Package Dimensions** |**Dimension**|**MIN**|**NOM**|**MAX**| |---|---|---|---| |A|1.080|1.180|1.280| |A1|0.140|0.180|0.220| |A2|0.950|1.000|1.050| |b|0.200|0.250|0.300| |D|6.000 BSC||| |D1|4.500 BSC||| |e|0.500 BSC||| |E|6.000 BSC||| |E1|4.500 BSC||| |L|0.300|0.350|0.400| |L1|0.125|0.175|0.225| |L2|0.575|0.625|0.675| |L3|0.450|0.500|0.550| |eD1|0.450 BSC||| |eD2|0.900 BSC||| |eE1|0.450 BSC||| |eE2|0.900 BSC||| |aaa|0.100||| |bbb|0.100||| |ccc|0.100||| |ddd|0.100||| |eee|0.100||| |**Note:**<br>1. The dimensions in parenthesis are reference.<br>2. All dimensions in millimeters (mm).<br>3. Unless otherwise specified, tolerances are:<br>a. Decimal: X.X = +/- 0.1<br>X.XX = +/- 0.05<br>X.XXX = +/- 0.03<br>b. Angular: +/- 0.1 (In Deg)<br>4. Hatching lines means package shielding area.|||| **silabs.com** | Building a more connected world. Rev. 1.1 | 40 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Package Specifications ## **8.2 Recommended PCB Land Pattern** The recommended PCB Land Pattern is shown in Figure 8.3 Module Land Pattern on page 41 **Figure 8.3. Module Land Pattern** **Table 8.2. PCB Land Pattern Dimensions** |**Dimension**|**Typ (mm)**| |---|---| |D1|4.50| |D2|2.65| |E1|4.50| |E2|2.25| |eD1|0.45| |eD2|0.90| |b|0.25| |e|0.50| |L|0.35| |L1|0.50| ## **Note:** 1. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05mm is assumed. 2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 3. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 4. The stencil thickness should be 0.100 mm (4 mils). 5. The stencil aperture to land pad size recommendation is 80% paste coverage. 6. _**Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different parameters and fine tune their SMT process as required for their application and tooling.**_ **silabs.com** | Building a more connected world. Rev. 1.1 | 41 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Package Specifications ## **8.3 Top Marking** **Figure 8.4. BGM220S Top Marking** **Table 8.3. Top Marking Definition** |**OPN**|**Line 1 Marking**|**Line 2 Marking**|**Line 3 Marking**| |---|---|---|---| |BGM220SC12WGA2|BGM220S12A|SC12WGA2|See note below| |BGM220SC22HNA2|BGM220S22A|SC22HNA2|See note below| |BGM220SC22WGA2|BGM220S22A|SC22WGA2|See note below| **Note:** YY = Year. WW = Work Week, TTTTTTT = Trace Code **silabs.com** | Building a more connected world. Rev. 1.1 | 42 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Soldering Recommendations ## **9. Soldering Recommendations** It is recommended that final PCB assembly of the BGM220S follows the industry standard as identified by the Institute for Printed Circuits (IPC). This product is assembled in compliance with the J-STD-001 requirements and the guidelines of IPC-AJ-820. Surface mounting of this product by the end user is recommended to follow IPC-A-610 to meet or exceed class 2 requirements. ## **CLASS 1 General Electronic Products** Includes products suitable for applications where the major requirement is function of the completed assembly. ## **CLASS 2 Dedicated Service Electronic Products** Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically the end-use environment would not cause failures. ## **CLASS 3 High Performance/Harsh Environment Electronic Products** Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems. **Note:** General SMT application notes are provided in the AN1223 document. **silabs.com** | Building a more connected world. Rev. 1.1 | 43 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Tape and Reel ## **10. Tape and Reel** BGM220S modules are delivered to the customer in tray (490 pcs / tray) or reel (2500 pcs / reel) packaging with the dimensions below. All dimensions are given in mm unless otherwise indicated. **Figure 10.1. Carrier Tape Dimensions** **silabs.com** | Building a more connected world. Rev. 1.1 | 44 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Tape and Reel **Figure 10.2. Reel Dimensions** **silabs.com** | Building a more connected world. Rev. 1.1 | 45 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Certifications ## **11. Certifications** This section details the regulatory certification status of BGM220S modules in various regions. BGM220S modules are also referred to by their model name BGM220S12A/BGM220S22A. The address for the module manufacturer and certification applicant is: ## SILICON LABORATORIES FINLAND OY Alberga Business Park, Bertel Jungin aukio 3, 02600 Espoo, Finland ## **11.1 Regulatory Certifications** ## **11.1.1 Qualified Antennas** BGM220S modules have been tested and certified both with the on-board antennas and with external antennas attached to the RF pin (RF_2G4). Performance characteristics for the integral antennas are presented in Table 3.1 Antenna Efficiency and Peak Gain (BGM220S12A) on page 7, Table 3.2 Antenna Efficiency and Peak Gain (BGM220S22A) on page 7 and 4.16.1 Antenna Typical Characteristics. Details for the external qualified reference antennas are summarized in the table below. **Table 11.1. Qualified External Antennas for BGM220S** |**Model**|**Antenna Type**|**Maximum Gain**|**Impedance**| |---|---|---|---| |BGM220S12A|Connectorized Coaxial Dipole|3.2 dBi|50 Ω| |BGM220S22A|Connectorized Coaxial Dipole|2.8 dBi|50 Ω| Any external antenna of the same general type and of equal or less directional gain as listed in the above table, and having similar inband and out-of-band characteristics, can be used in the regulatory areas that have modular radio approvals, such as USA and Canada, as long as spot-check testing is performed to verify that no performance changes compromising compliance have been introduced. In the particular FCC case, in order to comply with e-CFR Title 47, Part 15, Subpart C, Section 15.203 the module integrator using an external antenna must ensure it has a unique connector or it is undetachable. In countries applying the ETSI standards, like the EU countries, the radiated emissions are always tested with the end-product and the antenna type is not critical, but antennas with higher gain may violate some of the regulatory limits. When using instead an external antenna of a different type (such as a chip antenna, a PCB trace antenna or a patch) or having nonsimilar in-band and out-of-band characteristics, but still with a gain less than or equal to the maximum gain listed in the table above, it can be added as a permissive change to the existing grant/certificate. In most of these cases, some radiated emission testing is demanded, but no modular or end-product re-certification is required. On the other hand, all products with antennas having more gain than the maximum gain listed in the table above are very likely to require a full new end-product certification. Since the exact permissive change procedure is chosen on a case by case basis, please consult your test house and/or a certification body for understanding the correct approach based on your unique design. You might also want or need to get in touch with Silicon Labs for any authorization letter that your certification body might ask for. ## **11.1.2 EU and UK - CE and UKCA** The BGM220S modules have been tested against the relevant harmonized/designated standards and are in conformity with the essential requirements and other relevant requirements of the Radio Equipment Directive (RED) (2014/53/EU) and of the Radio Equipment Regulations (RER) (S.I. 2017/1206). Please notice that every end-product integrating a BGM220S module will need to perform the radio EMC tests on the whole assembly, according to the ETSI 301 489-x relevant standards. Furthermore, it is ultimately the responsibility of the manufacturer to ensure the compliance of the end-product as a whole. The specific product assembly is likely to have an impact to RF radiated characteristics, when compared to the bare module. Hence, manufacturers should carefully consider RF radiated testing with the final product assembly, especially taking into account the gain of the external antenna if any, and the possible deviations in the PSD, EIRP and spurious emissions measurements, as defined in the ETSI 300 328 standard. The modules are entitled to carry the CE and UKCA Marks, and a formal Declaration of Conformity (DoC) is available at the product web page which is reachable starting from https://www.silabs.com/. **silabs.com** | Building a more connected world. Rev. 1.1 | 46 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Certifications ## **11.1.3 USA - FCC** This device complies with FCC’s e-CFR Title 47, Part 15, Subpart C, Section 15.247 (and related relevant parts of the ANSI C63.10.2013 standard) when operating with the embedded antenna or with the antenna type(s) listed in 11.1.1 Qualified Antennas. Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesirable operation. Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment. ## **FCC RF Radiation Exposure Statement** This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter meets the Mobile requirements at a distance of 20 cm and above from the human body, in accordance to the limit(s) exposed in the RF Exposure Analysis. This transmitter also meets the Portable requirements at distances equal or above those listed for convenience in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S12A) on page 52 and Table 11.3 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S22A) on page 52. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. ## **OEM Responsibilities to comply with FCC Regulations** This module has been tested for compliance to FCC Part 15. OEM integrators are responsible for testing their end-product for any additional compliance requirements needed with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Additionally, investigative measurements and spot checking are strongly recommended to verify that the full system compliance is maintained when the module is integrated, in accordance to the "Host Product Testing Guidance" in FCC's KDB 996369 D04 Module Integration Guide V01. - **General Considerations** This transmitter module is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B (unintentional radiator) rule requirement, which is applicable to the final host. The final host will need to be assessed for compliance to this portion of rule requirements, if applicable. - **Manual Information to the End User** The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module, or how to change RF related parameters, in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warnings as shown in this manual. - **OEM / Host Manufacturer Responsibilities** OEM/Host manufacturers are ultimately responsible for the compliance of the host system. The BGM220S12A has a limited single-modular transmitter approval due to the radio portion of the module not being contained in its own RF shielding. Consequently, each new host will require a reassessment of radiated spurious emissions and a Class I Permissive Change to the grant. The final product must be reassessed against all the essential requirements of the FCC rule such as FCC Part 15 Subpart B before it can be placed on the US market. This includes reassessing the transmitter module for compliance with the Radio and EMF essential requirements of the FCC rules. This module must not be incorporated into any other radio device or system without retesting for compliance as multi-radio and combined equipment. The BGM220S22A is a shielded design, and comes with full modular approval. **silabs.com** | Building a more connected world. Rev. 1.1 | 47 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Certifications ## **Separation** - To meet the SAR exemption for portable conditions, the minimum separation distance indicated in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S12A) on page 52 and Table 11.3 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S22A) on page 52 must be maintained between the human body and the radiator (antenna) at all times. - This transmitter module is tested in a standalone mobile RF exposure condition, and in case of any co-located radio transmitter being allowed to transmit simultaneously, or in case of portable use at closer distances from the human body than those allowing the exceptions rules to be applied, a separate additional SAR evaluation will be required, ultimately leading to a Class II Permissive Change, or more rarely to a new grant. - **Important Note:** In the event that these conditions cannot be met, the final product will have to undergo additional testing to evaluate the RF exposure in order for the FCC authorization to remain valid, and a permissive change will have to be applied. The evaluation (SAR) is in the responsibility of the end-product’s manufacturer, as well as the permissive change that can be carried out with the help of the customer's own Telecommunication Certification Body as the grant holder’s agent. ## **End Product Labeling** BGM220S modules are not labeled with their own FCC ID due to their size. Instead, the packaging label contains the FCC ID. In all cases when the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: ## **For BGM220S12A** ## **"Contains Transmitter Module FCC ID: QOQ-BGM220S"** Or ## **"Contains FCC ID: QOQ-BGM220S"** ## **For BGM220S22A** ## **"Contains Transmitter Module FCC ID: QOQ-BGM220S2"** Or ## **"Contains FCC ID: QOQ-BGM220S2"** **Final note** : As long as all the conditions in this and all the above sections are met, further RF testing of the transmitter with full modular approval is not required. However, OEMs are still supposed to follow the good practice and the FCC recommendation to ensure the compliance of the host by spot checking. Nevertheless, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements which might be mandatory with this module installed. ## **Class B Device Notice - BGM220S22A Only** **Note:** This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio / TV technician for help. **silabs.com** | Building a more connected world. Rev. 1.1 | 48 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Certifications ## **11.1.4 ISED Canada** ## **ISED** This radio transmitter (IC: 5123A-BGM220S for the BGM220S12A and IC: 5123A-BGM220S2 for the BGM220S22A) has been approved by _Innovation, Science and Economic Development Canada (ISED Canada, formerly Industry Canada_ ) to operate with the embedded antenna and with the antenna type(s) listed in 11.1.1 Qualified Antennas, with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain listed, are strictly prohibited for use with this device. This device complies with ISED’s license-exempt RSS standards. Operation is subject to the following two conditions: 1. This device may not cause interference; and 2. This device must accept any interference, including interference that may cause undesired operation of the device ## **RF Exposure Statement** Exception from routine SAR evaluation limits are given in RSS-102 Issue 5. For the Portable use case, RF exposure or SAR evaluation is not required in all cases, at any distance from the human body, except when the BGM220S22A is used at full power with the external reference dipole antenna, in which case the separation distance from the human body must be of 13 mm or more for the exemption. For more details, refer to the values stated in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S12A) on page 52 and Table 11.3 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S22A) on page 52: if the separation distances from the human body are less than the distances mentioned in the tables, then the OEM integrator is responsible for evaluating the SAR. The module meets the requirements for Mobile use cases when the minimum separation distance from the human body is 20 cm or greater, in accordance to the limit(s) exposed in the RF Exposure Analysis. ## **OEM Responsibilities to comply with IC Regulations** The module has been certified for integration into products only by OEM integrators under the following conditions: - The antenna must be installed such that a minimum separation distance as stated above is maintained between the radiator (antenna) and all persons at all times. - The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. **Important Note:** In the event that these conditions cannot be met, the final product will have to undergo additional testing to evaluate the RF exposure in order for the ISED authorization to remain valid, and a permissive change will have to be applied with the help of the customer's own Telecommunication Certification Body typically acting as the certificate holder’s agent. In the case of the BGM220S12A, this variant has a limited approval due to the radio portion of the module not being contained in its own RF shielding: consequently, each new host will require a reassessment of the radiated spurious emissions, and the ISED will have to be notified with a Class IV Permissive Change. In the case of the BGM220S22A, this variant is a shielded design, and consequently comes with a full modular approval. ## **End Product Labeling** The BGM220S modules are not labeled with their own IC ID due to their size. Instead, the packaging label contains the IC ID. In all cases when the IC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: ## **For BGM220S12A** ## “ **Contains Transmitter Module IC: 5123A-BGM220S** ” ## or ## “ **Contains IC: 5123A-BGM220S”** ## **For BGM220S22A** “ **Contains Transmitter Module IC: 5123A-BGM220S2** ” ## or ## “ **Contains IC: 5123A-BGM220S2”** **silabs.com** | Building a more connected world. Rev. 1.1 | 49 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Certifications The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. **Final note:** As long as all the conditions above are met, further RF testing of the transmitter with full modular approval is not required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). ## **CAN ICES-003 (B) - BGM220S22A Only** This Class B digital apparatus complies with Canadian ICES-003. **silabs.com** | Building a more connected world. Rev. 1.1 | 50 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Certifications ## **ISEDC (Français)** Le présent émetteur radio (IC: 5123A-BGM220S pour le BGM220S12A and IC: 5123A-BGM220S2 pour le BGM220S22A) a été approuvé par Innovation, Sciences et Développement Économique Canada (ISED Canada, anciennement Industrie Canada) pour fonctionner avec l'antenne intégrée et le ou les types d'antenne énumérés à la section 11.1.1 Qualified Antennas, avec le gain maximal admissible indiqué. Les types d'antenne non inclus dans cette liste, ayant un gainsupérieur au gain maximal indiqué, sont strictement interdits d'utilisation avec cet appareil. . Ce composant est conforme aux normes RSS, exonérées de licence d'ISED. Son mode de fonctionnement est soumis aux deux conditions suivantes: 1. Ce composant ne doit pas générer d’interférences. 2. Ce composant doit pouvoir être soumis à tout type de perturbation y compris celle pouvant nuire à son bon fonctionnement. ## **Déclaration d'exposition RF** L'exception tirée des limites courantes d'évaluation SAR est donnée dans le document RSS-102 Issue 5. Pour le cas d'utilisation Portable, l'exposition RF ou l'évaluation SAR n'est pas nécessaire dans tous les cas, à n'importe quelle distance du corps humain, sauf lorsque le BGM220S22A est utilisé à pleine puissance avec l'antenne dipôle de référence externe, auquel cas la distance de séparation du le corps humain doit être de 13 mm ou plus pour l'exemption. Pour plus de détails, reportez-vous aux valeurs indiquées dans Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S12A) on page 52 et Table 11.3 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S22A) on page 52: si les distances de séparation du corps humain sont inférieures aux distances mentionnées dans les tableaux, alors l'intégrateur OEM est responsable de l'évaluation du SAR. Le module répond aux exigences des cas d'utilisation mobile lorsque la distance de séparation minimale du corps humain est de 20 cm ou plus, conformément aux limites exposées dans l'analyse d'exposition RF. ## **Responsabilités des OEM pour une mise en conformité avec le Règlement du Circuit Intégré** Le module a été approuvé pour l'intégration dans des produits finaux exclusivement réalisés par des OEM sous les conditions suivantes: - L'antenne doit être installée de sorte qu'une distance de séparation minimale indiquée ci-dessus soit maintenue entre le radiateur (antenne) et toutes les personnes avoisinante, ce à tout moment. - Le module émetteur ne doit pas être localisé ou fonctionner avec une autre antenne ou un autre transmetteur que celle indiquée plus haut. Tant que les deux conditions ci-dessus sont respectées, il n’est pas nécessaire de tester ce transmetteur de façon plus poussée. Cependant, il incombe à l’intégrateur OEM de s’assurer de la bonne conformité du produit fini avec les autres normes auxquelles il pourrait être soumis de fait de l’utilisation de ce module (par exemple, les émissions des périphériques numériques, les exigences de périphériques PC, etc.). **Remarque Importante:** Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou co-implantation avec un autre émetteur), l'autorisation ISED n'est plus considérée comme valide et le numéro d’identification ID IC ne peut pas être apposé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera responsable de la réévaluation du produit final (y compris le transmetteur) et de l'obtention d'une autorisation ISED distincte. Dans le cas du BGM220S12A, l'approbation de cette variante est limitée car la partie radio du module n'est pas incluse dans son propre blindage RF: par conséquent, chaque nouvel hôte est requis dans tous les cas pour réévaluer les émissions rayonnées et le bureau doit être informé par un C4PC. Dans le cas du BGM220S22A, cette variante est une conception blindée et est par conséquent livrée avec une approbation modulaire complète. ## **Étiquetage des produits finis** Les modules BGM220S ne sont pas étiquetés avec leur propre ID IC en raison de leur taille. Au lieu de cela, l'étiquette d'emballage contient l'ID IC. Dans tous les cas, lorsque l'ID IC n'est pas visible lorsque le module est intégré au sein d'un autre produit, cet autre produit dans lequel le module est installé devra porter une étiquette faisant apparaitre les référence du module intégré. Dans un tel cas, sur le produit final doit se trouver une étiquette aisément lisible sur laquelle figurent les informations suivantes: ## **Pour le BGM220S12A** ## “ **Contient le module transmetteur: 5123A-BGM220S** ” or “ **Contient le circuit: 5123A-BGM220S”** **silabs.com** | Building a more connected world. Rev. 1.1 | 51 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Certifications ## **Pour le BGM220S12A** ## “ **Contient le module transmetteur: 5123A-BGM220S2** ” or ## “ **Contient le circuit: 5123A-BGM220S2”** **Note finale:** L'intégrateur OEM doit être conscient qu’il ne doit pas fournir, dans le manuel d’utilisation, d'informations relatives à la façon d'installer ou de d’enlever ce module RF ainsi que sur la procédure à suivre pour modifier les paramètres liés à la radio. ## **CAN ICES-003 (B) - BGM220S22A uniquement** Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003. ## **11.1.5 Proximity to Human Body** When using the BGM220S modules in an application where the radio is located close to the human body, the human RF exposure must be taken into account. FCC, ISED, and CE all have different standards and rules for evaluating the RF exposure. In particular, each regulator has different requirements when it comes to the exemption from having to perform RF exposure and SAR (Specific Absorption Rate) measurements, and the minimum separation distances between the module and human body varies accordingly. The properties of the BGM220S modules allows for the minimum separation distances detailed in the tables below for SAR evaluation exemption in portable use cases (less than 20 cm from human body). The module is approved for the Mobile use case (more than 20 cm) without any need for RF Exposure evaluation. **Table 11.2. Minimum Separation Distances for SAR Evaluation Exemption (BGM220S12A)** |**Certification**|**BGM220S12A**| |---|---| |FCC|0 mm| |ISED|0 mm| |CE|The RF exposure must always be evaluated using the end-product when transmitting with power<br>levels higher than 20 mW (13 dBm).| **Table 11.3. Minimum Separation Distances for SAR Evaluation Exemption (BGM220S22A)** |**Certification**|**BGM220S22A**| |---|---| |FCC|0 mm| |ISED|13 mm with the reference external antenna<br>12 mm for integral antenna| |CE|The RF exposure must always be evaluated using the end-product when transmitting with power<br>levels higher than 20 mW (13 dBm).| For FCC and ISED, using the module in end-products where the separation distance from the human body is smaller than that listed above is allowed but requires evaluation of the RF exposure in the final assembly and applying for a _Class 2 Permissive Change_ or _Change of ID_ to be applied to the existing FCC/ISED approvals of the module. For CE, RF exposure must be evaluated using the endproduct in all cases when transmitting at more than the power level indicated in the table. **Note:** Placing the module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thus a reduced range is to be expected. **silabs.com** | Building a more connected world. Rev. 1.1 | 52 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Certifications ## **11.1.6 Japan - MIC** The BGM22S12A are certified in Japan with certification number 203-JN1080. The BGM22S22A are certified in Japan with certification number 209-J00429. It is the end-product manufacturer's responsibility to ensure that the module is configured to meet the limits documented in the formal certification test report available at https://www.silabs.com/. If needed, refer to the API reference manual(s) to learn how to configure the maximum RF TX power for the normal operations. Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio module in their host equipment places the certification mark and certification number on the outside of the host equipment. This combination of mark and number, and their relative placement, is depicted in figure 11.1, and depending on the size of the module it might also appear on the top shield markings of the radio module. The certification mark and certification number must be placed close to the text in the Japanese language which is provided below. This change in the Radio Law has been made in order to enable users of the combination of host and radio module to verify if they are actually using a radio device which is approved for use in Japan Certification Text to be Placed on the Outside Surface of the Host Equipment: ## **Translation of the text:** “This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law.” The "Giteki" marking shown in the figures below must be affixed to an easily noticeable section of the specified radio equipment. Note that additional information may be required if the device is also subject to a telecom approval. **Figure 11.1. GITEKI Mark and ID (BGM220S12A)** **Figure 11.2. GITEKI Mark and ID (BGM220S22A)** **silabs.com** | Building a more connected world. Rev. 1.1 | 53 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Certifications ## **Figure 11.3. GITEKI Mark** ## **11.1.7 South Korea - KC** The BGM220S22A modules have a RF certification for import and use in South-Korea. Certification number is: R-R-BGT-BGM220S2 When integrating the RF-certified module, an end-product is exempted from doing the RF emission testing, as long as the recommended design guidance is followed, and the approved antennas are used. EMC testing, and any other relevant test, might still be required for full compliance. ## **11.2 Standards-Based Certifications** ## **11.2.1 Bluetooth Qualification** The BGM220S modules come at launch with a pre-qualified Bluetooth Low Energy RF-PHY Tested Component having Declaration ID of D044526 and QDID of 155407, and having a listing date of 2020-09-04. The BGM220S modules additionally have a pre-qualified Bluetooth Low Energy RF-PHY Tested Component based on Core Specification 5.3 having Declaration ID of D056805 and QDID of 178495, and having a listing date of 2021-11-12. Notice that the validity set by the SIG for Tested Components is currently of 3 years: during the product lifetime, Silicon Labs will reassess or re-qualify an RF-PHY Component as it expires, whenever applicable. In case of a re-qualification an RF-PHY Tesed Component will come with a new DID and a new QDID, and these will be then reffered to in end-product listings. Newer DIDs and QDIDs can be discovered by using the search engine in the SIG's Launch Studio, or by asking Silicon Labs via the technical support platform. This module’s RF-PHY Tested Component should be combined with the latest Wireless Gecko Link Layer and Host pre-qualified Components by Silicon Labs, when in the process of qualifying an end-product embedding the BGM220S via the SIG’s Launch Studio. **silabs.com** | Building a more connected world. Rev. 1.1 | 54 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Revision History ## **12. Revision History** ## **Revision 1.1** January, 2022 - Updated regulatory certifications in 1. Feature List. - Updated direction finding language in 2. Ordering Information. - Added kits available for evaluation in 2. Ordering Information. - Corrected Storage Temperature range in 4.1 Absolute Maximum Ratings. - Corrected initial calibrated accuracy in 4.11 High-Frequency Crystal. - Updated initial calibrated accuracy in 4.12 Low Frequency Crystal Oscillator. - Added footnote for crystal load capacitance with Gain=2 test condition in 4.12 Low Frequency Crystal Oscillator. - Added RESETn low time to ensure pin reset (T_RESET) specification to Table 4.14 GPIO Pins on page 20. - Updated 11.1.2 EU and UK - CE and UKCA. - Updated wording for 11.2.1 Bluetooth Qualification. ## **Revision 1.0** September, 2020 - Various wording updates to 11.1 Regulatory Certifications to introduce BGM220S22A model. - Updated wording for 11.2.1 Bluetooth Qualification. ## **Revision 0.7** July, 2020 - Updated 2. Ordering Information with devices for model BGM220S22A. - Added Table 3.2 Antenna Efficiency and Peak Gain (BGM220S22A) on page 7 for model BGM220S22A. - Updated 4. Electrical Characteristics with additional specifications for model BGM220S22A and latest characterization data. - Added Figure 4.4 BGM220S22A Typical 2D Antenna Radiation Patterns on 55 mm x 20 mm board on page 23 for model BGM220S22A. - Updated 7. Design Guidelines with guidelines and information covering model BGM220S22A. - Added marking information for model BGM220S22A to Table 8.3 Top Marking Definition on page 42. - Added section to note pending certification for model BGM220S22A. ## **Revision 0.6** June, 2020 - Updated 4.2.1 DC-DC Operating Limits to relax lifetime safe operating region. - Updated 5. Reference Diagrams to mark PTI interface as recommended in figures. - Updated 4. Electrical Characteristics with latest characterization results and limits. - Updated 11. Certifications with additional certification details. **silabs.com** | Building a more connected world. Rev. 1.1 | 55 BGM220S Wireless Gecko Bluetooth[®] Module Data Sheet Revision History ## **Revision 0.5** March, 2019 - In the front page block diagram, updated the lowest energy mode for LETIMER. - Updated part numbers in 2. Ordering Information to reflect new ordering code scheme. - In 2. Ordering Information, added note about referencing by family, model, or ordering code. - Added 4.13 Precision Low Frequency RC Oscillator (LFRCO). - Added supply voltage, crystal frequencies and RF frequencies to Figure 3.1 BGM220S Block Diagram on page 6. - Updated 4. Electrical Characteristics with latest characterization details. - Updated 5. Reference Diagrams. - Added section 11. Certifications. - Added section 5. Reference Diagrams. - Added section 10. Tape and Reel. ## **Revision 0.1** September, 2019 Initial release. **silabs.com** | Building a more connected world. Rev. 1.1 | 56 **==> picture [473 x 21] intentionally omitted <==** **----- Start of picture text -----**<br> IoT Portfolio SW/HW Quality Support & Community<br>www.silabs.com/IoT www.silabs.com/simplicity www.silabs.com/quality www.silabs.com/community<br>**----- End of picture text -----**<br> ## **Disclaimer** Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and “Typical” parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A “Life Support System” is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications. **Note: This content may contain offensive terminology that is now obsolete. Silicon Labs is replacing these terms with inclusive language wherever possible. 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