BGM210LA22JNF2R

BLUETOOTH MODULE

⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
Manufacturer: SILICON LABS
Product type: Bluetooth Modules & Adaptors
SVHC: To Be Advised
Delivery and price
Units per pack	1000
Price	4.17 €
Current stock	10+
Lead time	30 days
Datasheet
## **BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet** 

## The BGM210L is a module designed and built to meet the performance, security, and reliability requirements of line-powered, smart LED lighting products. 

Based on the EFR32BG21 Gecko SoC, it enables Bluetooth 5.x and Bluetooth Mesh connectivity delivering best-in-class RF performance, CA Title 20 energy consumption compliance, future-proof capability for feature and OTA firmware updates, enhanced security, and a form factor and temperature rating suited for enclosed operation in lightbulb housings. 

## **KEY FEATURES** 

- Bluetooth 5.x and Bluetooth Mesh connectivity 

- PCB Trace antenna 

- +12.5 dBm Max TX power 

- -97 dBm Bluetooth RX sensitivity @ 1 Mbps 

- 32-bit ARM Cortex-M33 core at 38.4 MHz 

The BGM210L is a complete solution that comes with fully-upgradeable, robust software stacks, world-wide regulatory certifications, advanced development and debugging tools, and support that will simplify and minimize the development cycle of your product helping to accelerate its time-to-market. 

The BGM210L is targeted for key applications that include: 

- Smart LED lightbulbs 

   - 1024/96 kB of flash/RAM memory 

   - Enhanced security features 

   - Optimal set of MCU peripherals 

   - 12 GPIO pins 

   - -40 to (105 or 125)°C 

   - 15.5 mm x 22.5 mm (custom form factor) 

- Connected lighting 

**==> picture [482 x 242] intentionally omitted <==**

**----- Start of picture text -----**<br>
Core / Memory Crystal Clock Management Energy  Security<br>Management<br>38.4  HF Crystal  HF Fast Startup Crypto<br>ARM Cortex [TM]  M33 processor MHz Oscillator RC Oscillator RC Oscillator Voltage  Acceleration<br>with DSP extensions, Flash Program  Regulator<br>FPU and TrustZone Memory EM23 HF RC  Secure Debug<br>Oscillator Brown-Out Detector True Random<br>Number Generator<br>ETM Debug Interface RAM Memory ControllerLDMA  LF Crystal Oscillator Ultra LF RC Oscillator RC OscillatorLF Power-On Reset Security Core<br>32-bit bus<br>Peripheral Reflex System<br>Antenna Radio Transceiver Serial  I/O Ports Timers and Triggers Analog I/F<br>Interfaces<br>PCB Trace<br>Antenna RF Frontend I DEMOD USART InterruptsExternal  Timer/Counter Protocol Timer ADC<br>LNA<br>Matching Q PGA IFADC I [2] C Purpose I/OGeneral  Low Energy Timer Watchdog Timer ComparatorAnalog<br>PA<br>AGC Pin Reset Capture CounterReal Time<br>PA Frequency<br>Synth<br>MOD Pin Wakeup Back-Up Real Time Counter<br>Lowest power mode with peripheral operational:<br>EM0—Active EM1—Sleep EM2—Deep Sleep EM3—Stop EM4—Shutoff<br>FRC BUFC<br>CRC RAC<br>**----- End of picture text -----**<br>


**Copyright © 2025 by Silicon Laboratories** 

**silabs.com** | Building a more connected world. 

Rev. 1.4 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Features 

## **1.  Features** 

- **Supported Protocols** 

   - Bluetooth 5.x 

   - Bluetooth Mesh 

- **Wireless System-on-Chip** 

   - 2.4 GHz radio 

   - TX power up to +12.5 dBm 

   - 32-bit ARM Cortex[®] -M33 with DSP instruction and floatingpoint unit for efficient signal processing 

   - 1024 kB flash program memory 

   - 96 kB RAM data memory 

   - Embedded Trace Macrocell (ETM) for advanced debugging 

- **Receiver Performance** 

   - -104.4 dBm sensitivity (0.1% BER) at 125 kbps GFSK 

   - -100.1 dBm sensitivity (0.1% BER) at 500 kbps GFSK 

   - -97 dBm sensitivity (0.1% BER) at 1 Mbps GFSK 

   - -93.9 dBm sensitivity (0.1% BER) at 2 Mbps GFSK 

- **Current Consumption** 

   - 9.3 mA RX current at 1 Mbps GFSK 

   - 70 mA TX current at +12.5 dBm output power 

   - 50.9 µA/MHz in Active Mode (EM0) 

   - 5.1 μA EM2 DeepSleep current (RTCC running from LFXO, Bluetooth Stack not running) 

   - 8.5 μA EM2 DeepSleep current (RTCC running from LFXO, Bluetooth Stack running) 

- **Regulatory Certifications** 

   - CE, UKCA, Serbia 

   - ISED, FCC, Dominican Republic 

   - Japan, South Korea, Taiwan 

   - China, Hong Kong, Thailand, Australia 

   - Bahrain, Israel, Qatar 

   - Egypt, Morocco 

- **Operating Range** 

   - 1.8 to 3.8 V 

   - -40 to +105 °C or -40 to +125 °C 

- **Dimensions** 

   - 15.5 x 22.5 mm (custom form factor) 

- **Security** 

   - Secure Boot with Root of Trust and Secure Loader (RTSL) **[1]** 

   - Hardware Cryptographic Acceleration with DPA countermeasures **[1]** for AES128/256, SHA-1, SHA-2 (up to 256-bit), ECC (up to 256-bit), ECDSA, and ECDH 

   - True Random Number Generator (TRNG) compliant with NIST SP800-90 and AIS-31 

   - ARM[®] TrustZone[®] 

   - Secure Debug Interface lock/unlock 

- **MCU Peripherals** 

   - 12-bit 1 Msps SAR Analog to Digital Converter (ADC) 

   - 2 × Analog Comparator (ACMP) 

   - 12 General Purpose I/O pins with output state retention and asynchronous interrupts 

   - 8 Channel DMA Controller 

   - 12 Channel Peripheral Reflex System (PRS) 

   - 3 × 16-bit Timer/Counter (3 Compare/Capture/PWM channels) 

   - 1 × 32-bit Timer/Counter (3 Compare/Capture/PWM channels) 

   - 32-bit Real Time Counter 

   - 24-bit Low Energy Timer for waveform generation 

   - 2 × Watchdog Timer 

   - 3 × Universal Synchronous/Asynchronous Receiver/Transmitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I[2] S) 

   - 2 × I[2] C interface with SMBus support 

1. With Secure Engine (SE) firmware v1.1.2 or newer 

**silabs.com** | Building a more connected world. 

Rev. 1.4  |  2 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Ordering Information 

## **2.  Ordering Information** 

**Table 2.1.  Ordering Information** 

|**Ordering Code**|**Protocol Stack**|**Max TX**<br>**Power**|**Freq**<br>**Band**|**Antenna**|**Flash**<br>**(kB)**|**RAM**<br>**(kB)**|**GPIO**|**Temp Range**|**Packaging**|
|---|---|---|---|---|---|---|---|---|---|
|BGM210LA22JIF2|Bluetooth 5.x|12.5 dBm|2.4 GHz|Inverted-F<br>PCB Trace|1024|96|12|-40 to 125 °C|Cut Tape|
|BGM210LA22JIF2R|Bluetooth 5.x|12.5 dBm|2.4 GHz|Inverted-F<br>PCB Trace|1024|96|12|-40 to 125 °C|Reel|
|BGM210LA22JNF2|Bluetooth 5.x|12.5 dBm|2.4 GHz|Inverted-F<br>PCB Trace|1024|96|12|-40 to 105 °C|Cut Tape|
|BGM210LA22JNF2R|Bluetooth 5.x|12.5 dBm|2.4 GHz|Inverted-F<br>PCB Trace|1024|96|12|-40 to 105 °C|Reel|



Bluetooth 5.x: As the Bluetooth standard evolves, Silicon Labs is regularly adding new features. For more information on supported Bluetooth capabilities, visit https://www.silabs.com/bluetooth-hardware. 

End-product manufacturers must verify that the module is configured to meet regulatory limits for each region in accordance with the formal certification test reports. 

BGM210L modules are pre-programmed with BGAPI UART DFU bootloader. 

**SLWRB4309B** radio board is available for BGM210L evaluation and development. 

The modules may be referred to by their product family name (BGM210L), model name (BGM210L22F) or full ordering code throughout this document. 

**silabs.com** | Building a more connected world. 

Rev. 1.4  |  3 

## **Table of Contents** 

|**1.**|**Features .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 2**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**2.**|**Ordering Information**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 3**|
|**3.**|**System Overview .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 6**|
||3.1  Block Diagram .<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 6|
||3.2  EFR32BG21 SoC .<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 6|
||3.3  Antenna .<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 6|
||3.4  Power Supply<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 6|
|**4.**|**Electrical Specifications .**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 7**|
||4.1  Electrical Characteristics<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 7|
||4.1.1  Absolute Maximum Ratings|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 7|
||4.1.2  General Operating Conditions||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 8|
||4.1.3  MCU Current Consumption at 3.0V.||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 9|
||4.1.4  Radio Current Consumption|at|3.0V||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.10|
||4.1.5  RF Transmitter General Characteristics|||||for|the 2.4 GHz Band.|||||||.|.|.|.|.|.|.|.|.|.|.|.11|
||4.1.6  RF Receiver General Characteristics||||for the 2.4||||GHz Band||||.|.|.|.|.|.|.|.|.|.|.|.|.11|
||4.1.7  RF Receiver Characteristics for Bluetooth Low Energy||||||||||at|1 Mbps|||.|.|.|.|.|.|.|.|.|.|.12|
||4.1.8  RF Receiver Characteristics for Bluetooth Low Energy||||||||||at|2 Mbps|||.|.|.|.|.|.|.|.|.|.|.13|
||4.1.9  RF Receiver Characteristics for Bluetooth Low Energy||||||||||at|500 kbps|||.|.|.|.|.|.|.|.|.|.|.14|
||4.1.10  RF Receiver Characteristics for Bluetooth Low||||||||Energy at 125|||||kbps||.|.|.|.|.|.|.|.|.|.15|
||4.1.11  High-Frequency Crystal .|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.16|
||4.1.12  GPIO Pins<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.17|
||4.1.13  Microcontroller Peripherals .||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.18|
||4.2  Typical Performance Curves<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.18|
||4.2.1  Antenna Radiation and Efficiency|||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.19|
|**5.**|**Reference Diagrams.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**20**|
|**6.**|**Pin Definitions .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**21**|
||6.1  Module Pinout .<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.21|
||6.2  Alternate Pin Functions .<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.22|
||6.3  Analog Peripheral Connectivity|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.22|
||6.4  Digital Peripheral Connectivity .|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.23|
|**7.**|**Design Guidelines**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 26**|
||7.1  Module Placement.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.26|
||7.2  Antenna Optimization.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.27|
||7.3  Reset .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.27|
||7.4  Debug .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.27|
||7.5  Packet Trace Interface (PTI)<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.28|
|**8.**|**Package Specifications**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.29**|
||8.1  Package Outline<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.29|



**silabs.com** | Building a more connected world. 

Rev. 1.4 |  4 

|8.2  PCB Land Pattern|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.30|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|8.3  Marking<br>.<br>.<br>.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.31|
|**9.  Soldering Recommendations**||||||**.**|**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**. 32**|
|**10.  Tape and Reel**|**.**|**.**|**.**|**.**|**.**|**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**|**.33**|
|**11.  Certifications .**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**|**34**|
|11.1  CE and UKCA.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.34|
|11.2  FCC .<br>.<br>.<br>.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.35|
|11.3  ISED Canada .|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.36|
|11.4  Australia (ACMA).||.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.37|
|11.5  Dominican Republic||(INDOTEL).||||||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.37|
|11.6  Hong Kong (OFCA)||.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.38|
|11.7  Israel (MOC) .|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.38|
|11.8  Serbia (RATEL)|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.38|
|11.9  Bahrain (BTRA)|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.38|
|11.10  China (SRRC)|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.38|
|11.11  Egypt (NTRA)|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.38|
|11.12  Japan (MIC) .|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.39|
|11.13  South Korea (KC)||.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.39|
|11.14  Morocco (ANRT)||.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.39|
|11.15  Qatar (CRA) .|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.39|
|11.16  Thailand (NBTC)||.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.40|
|11.17  NCC Taiwan .|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.40|
|11.18  Bluetooth Qualification||||.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.40|
|**12.  Revision History.**|**.**|**.**|**.**|**.**|**.**|**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**|**41**|



**silabs.com** | Building a more connected world. 

Rev. 1.4 |  5 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet System Overview 

## **3.  System Overview** 

## **3.1  Block Diagram** 

The BGM210L module is a highly-integrated, high-performance system with all the hardware components needed to enable 2.4 GHz wireless connectivity and support robust networking capabilities via multiple protocols. 

Built around the EFR32BG21 Wireless Gecko SoC, the BGM210L includes a built-in PCB trace antenna, an RF matching network (optimized for transmit power efficiency), supply decoupling and filtering components, a 38.4 MHz reference crystal, and an RF shield. A general block diagram of the module is shown below. 

**==> picture [254 x 174] intentionally omitted <==**

**----- Start of picture text -----**<br>
Supply Decoupling LPF VDD<br>DEC<br>Antenna<br>RF Match Silicon Labs (up to 12) GP IO<br>EFR32BG21<br>HF XTAL GND<br>RF SHIELD<br>**----- End of picture text -----**<br>


**Figure 3.1.  BGM210L Block Diagram** 

## **3.2  EFR32BG21 SoC** 

The EFR32BG21 SoC features a 32-bit ARM Cortex M33 core, a 2.4 GHz high-performance radio, 1 MB of Flash memory, a dedicated core for security, a rich set of MCU peripherals, and various clock management and serial interfacing options. Consult the EFR32xG21 Wireless Gecko Reference Manual and the EFR32BG21 Data Sheet for details (See EFR32BG21A020F1024IM32). 

## **3.3  Antenna** 

BGM210L modules include a meandered inverted-F antenna (MIFA) with the characteristics seen below. 

**Table 3.1.  Antenna Efficiency and Peak Gain** 

|**Parameter**|**With optimal layout **|**Note**|
|---|---|---|
|Efficiency|-2 to -2.5 dB|Antenna efficiency, gain and radiation pattern are highly depend-<br>ent on the application PCB layout and mechanical design. Refer<br>to Section7. Design Guidelinesfor PCB layout and antenna inte-<br>gration guidelines to achieve optimal performance.|
|Peak gain|0.5 dBi||



## **3.4  Power Supply** 

The BGM210L requires a single nominal supply level of 3.0 V. All the necessary decoupling and filtering components are included in the module. The module can tolerate supply voltage noise of up to 700 mVpp. 

The supply voltage is filtered internally in the module with a 100 kHz low-pass filter to guarantee operation across the full supply range of 1.8 to 3.8 V. Additional external filtering is neither required nor recommended as it may cause voltage drops below the minimum level tolerable by the SoC (1.71 V) during transmit bursts. 

For typical use cases, the decouple pin (DEC) should be left disconnected. 

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Rev. 1.4  |  6 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Electrical Specifications 

## **4.  Electrical Specifications** 

## **4.1  Electrical Characteristics** 

All electrical parameters in all tables are specified under the following conditions, unless stated otherwise: 

- Typical values are based on TA=25 °C and VDD = 3.0 V, by production test and/or technology characterization. 

- Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output power-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna. 

- Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise. 

## **4.1.1  Absolute Maximum Ratings** 

Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx. 

**Table 4.1.  Absolute Maximum Ratings** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Storage temperature range|TSTG||-50|—|+150|°C|
|Voltage on VDD supply pin|VDDMAX||-0.3|—|3.8|V|
|Voltage ramp rate on VDD<br>supply pin|VDDRAMPMAX||—|—|1.0|V / µs|
|DC voltage on any GPIO pin|VDIGPIN||-0.3|—|VDD+ 0.3|V|
|DC voltage on RESETn pin1|VRESETn||-0.3|—|3.8|V|
|Total current into VDD pin|IVDDMAX|Source|—|—|200|mA|
|Total current into GND pin|IGNDMAX|Sink|—|—|200|mA|
|Current per I/O pin|IIOMAX|Sink|—|—|50|mA|
|||Source|—|—|50|mA|
|Current for all I/O pins|IIOALLMAX|Sink|—|—|200|mA|
|||Source|—|—|200|mA|
|Junction temperature|TJMAX||—|—|+125|°C|
|**Note:**<br>1. The RESETn pin has a pull-up device to the VDD supply. For minimum leakage, RESETn should not exceed the voltage at VDD.|||||||



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Rev. 1.4  |  7 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Electrical Specifications 

## **4.1.2  General Operating Conditions** 

This table specifies the general operating temperature range and supply voltage range for all supplies. The minimum and maximum values of all other tables are specifed over this operating range, unless otherwise noted. 

**Table 4.2.  General Operating Conditions** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Operating ambient tempera-<br>ture range|TA|-N temperature grade|-40|—|+105|°C|
|||-I temperature grade|-40|—|+125|° C|
|VDD Supply Voltage|VDD||1.8|3.0|3.8|V|
|HCLK and Core frequency|fHCLK|MODE = WS1, RAMWSEN = 11|—|—|80|MHz|
|||MODE = WS1, RAMWSEN = 01|—|—|50|MHz|
|||MODE = WS0, RAMWSEN = 01|—|—|39|MHz|
|PCLK frequency|fPCLK||—|—|50|MHz|
|EM01 Group A clock fre-<br>quency|fEM01GRPACLK||—|—|80|MHz|
|HCLK Radio frequency|fHCLKRADIO||—|38.4|—|MHz|
|External Clock Input|fCLKIN|VSCALE2 or VSCALE1, IOVDD ≥<br>2.7 V|—|—|40|MHz|
|DPLL Reference Clock|fDPLLREFCLK|VSCALE2 or VSCALE1|—|—|40|MHz|
|**Note:**<br>1. Flash wait states are set by the MODE field in the MSC_READCTRL register. RAM wait states are enabled by setting the RAMW-<br>SEN bit in the SYSYCFG_DMEM0RAMCTRL register.|||||||



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Rev. 1.4  |  8 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Electrical Specifications 

## **4.1.3  MCU Current Consumption at 3.0V** 

Unless otherwise indicated, typical conditions are: VDD = 3.0 V. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 °C. 

**Table 4.3.  MCU Current Consumption at 3.0V** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Current consumption in EM0<br>mode with all peripherals dis-<br>abled1|IACTIVE|80 MHz HFRCO, CPU running<br>Prime from flash|—|50.9|—|µA/MHz|
|||80 MHz HFRCO, CPU running<br>while loop from flash|—|45.6|55.5|µA/MHz|
|||80 MHz HFRCO, CPU running<br>CoreMark loop from flash|—|59.8|—|µA/MHz|
|||38.4 MHz crystal, CPU running<br>while loop from flash|—|63.8|—|µA/MHz|
|Current consumption in EM1<br>mode with all peripherals dis-<br>abled1|IEM1|80 MHz HFRCO|—|28.7|37.6|µA/MHz|
|||38.4 MHz crystal|—|46.9|—|µA/MHz|
|Current consumption in EM2<br>mode|IEM2|Full RAM retention and RTC run-<br>ning from LFXO (Bluetooth Stack<br>not running)|—|5.1|—|µA|
|||Full RAM retention, RTCC run-<br>ning, and Bluetooth Stack running<br>from LFXO|—|8.5|—|µA|
|||1 bank (16 kB) RAM retention and<br>RTC running from LFRCO|—|4.5|10.5|µA|
|Current consumption in EM3<br>mode|IEM3|Full RAM retention and RTC run-<br>ning from ULFRCO|—|4.8|11.4|µA|
|||1 bank (16 kB) RAM retention and<br>RTC running from ULFRCO|—|4.3|—|µA|
|Current consumption in EM4<br>mode|IEM4|No BURTC, no LF oscillator|—|0.21|0.5|µA|
|Current consumption during<br>reset|IRST|Hard pin reset held|—|146|—|µA|
|Current consumption per re-<br>tained 16kB RAM bank in<br>EM2|IRAM||—|0.10|—|µA|
|**Note:**<br>1. The typical EM0/EM1 current measurement includes some current consumed by the security core for periodical housekeeping<br>purposes. This does not include current consumed by user-triggered security operations, such as cryptographic calculations.|||||||



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Rev. 1.4  |  9 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Electrical Specifications 

## **4.1.4  Radio Current Consumption at 3.0V** 

RF current consumption measured with MCU in EM1, HCLK = 38.4 MHz, and all MCU peripherals disabled. Unless otherwise indicated, typical conditions are: VDD = 3.0V. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 °C. 

**Table 4.4.  Radio Current Consumption at 3.0V** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Current consumption in re-<br>ceive mode, active packet<br>reception|IRX_ACTIVE|125 kbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|9.3|—|mA|
|||500 kbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|9.3|—|mA|
|||1 Mbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|9.3|—|mA|
|||2 Mbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|9.9|—|mA|
|Current consumption in re-<br>ceive mode, Stack running|IRX_LISTEN|125 kbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|9.1|—|mA|
|||500 kbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|9.1|—|mA|
|||1 Mbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooth stack running|—|9.1|—|mA|
|||2 Mbit/s, 2GFSK, f = 2.4 GHz,<br>Bluetooh stack running|—|9.8|—|mA|
|Current consumption in<br>transmit mode|ITX|f = 2.4 GHz, CW, 12.5 dBm output<br>power, VDD = 3.3 V|—|70|—|mA|



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Rev. 1.4  |  10 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Electrical Specifications 

## **4.1.5  RF Transmitter General Characteristics for the 2.4 GHz Band** 

Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. RF center frequency 2.45 GHz.[1] 

**Table 4.5.  RF Transmitter General Characteristics for the 2.4 GHz Band** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|RF tuning frequency range|FRANGE|Frequency Range for Bluetooth<br>Low-Energy|2402|—|2480|MHz|
|Maximum TX power23|POUTMAX|12 dBm PA, VDD = 3.3 V|—|12.5|—|dBm|
|Minimum active TX Power|POUTMIN|12 dBm PA, VDD = 3.3 V|—|-20.5|—|dBm|
|Output power variation vs<br>VDD supply voltage varia-<br>tion, frequency = 2450MHz|POUTVAR_V|12 dBm PA Pout= POUTMAXout-<br>put power with VDD voltage swept<br>from 3.8V to 3.0V.|—|+/- 0.5|—|dB|
|||12 dBm PA Pout= POUTMAXout-<br>put power with VDD voltage swept<br>from 3.8V to 1.8V|—|+0.5/-4.5|—|dB|
|Output power variation vs RF<br>frequency|POUTVAR_F|12 dBm PA, POUTMAX, VDD =<br>3.3 V.|—|+/- 0.1|—|dB|
|**Note:**<br>1. For regulatory compliance please refer to the official certification test reports<br>2. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-<br>ered in this data sheet can be found in the TX Power column of the Ordering Information Table.<br>3. The maximum TXP to comply with ETSI PSD and EIRP limits depend on antenna gain which in turn depend on the end product<br>mechanical design. In optimal conditions the module is compliant to the ETSI PSD and EIRP limits at maximum TXP of 8.2 dBm.<br>End product manufacturer must ensure compliance to the limits for CE marking of the end product.|||||||



## **4.1.6  RF Receiver General Characteristics for the 2.4 GHz Band** 

Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. RF center frequency 2.45 GHz. 

**Table 4.6.  RF Receiver General Characteristics for the 2.4 GHz Band** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|RF tuning frequency range|FRANGE||2400|—|2483.5|MHz|



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Rev. 1.4  |  11 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Electrical Specifications 

## **4.1.7  RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps** 

Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. RF center frequency 2.45 GHz. 

**Table 4.7.  RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Rx Max Strong Signal Input<br>Level for 0.1% BER|RXSAT|Signal is reference signal, packet<br>length is 37 bytes1|—|10|—|dBm|
|Sensitivity|SENS|Signal is reference signal, 37 byte<br>payload1|—|-97|—|dBm|
|||With non-ideal signals2 1|—|-96.5|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 3|—|+6.6|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +1<br>MHz offset1 4 3 5|—|-8.3|—|dB|
|||Interferer is reference signal at -1<br>MHz offset1 4 3 5|—|-8.7|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +2<br>MHz offset1 4 3 5|—|-42.1|—|dB|
|||Interferer is reference signal at -2<br>MHz offset1 4 3 5|—|-48.9|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +3<br>MHz offset1 4 3 5|—|-42.4|—|dB|
|||Interferer is reference signal at -3<br>MHz offset1 4 3 5|—|-54.8|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 5|—|-42.1|—|dB|
|Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision1 5|—|-42.4|—|dB|
|||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision1 5|—|-8.3|—|dB|
|Intermodulation performance|IM|n = 36|—|-23|—|dBm|
|**Note:**<br>1. 0.1% Bit Error Rate.<br>2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>3. Desired signal -67 dBm.<br>4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>5. With allowed exceptions.<br>6. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4|||||||



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Rev. 1.4  |  12 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Electrical Specifications 

## **4.1.8  RF Receiver Characteristics for Bluetooth Low Energy at 2 Mbps** 

Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. RF center frequency 2.45 GHz. 

**Table 4.8.  RF Receiver Characteristics for Bluetooth Low Energy at 2 Mbps** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Max usable receiver input<br>level|SAT|Signal is reference signal, packet<br>length is 37 bytes1|—|10|—|dBm|
|Sensitivity|SENS|Signal is reference signal, 37 byte<br>payload1|—|-93.9|—|dBm|
|||With non-ideal signals2 1|—|-93.4|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 3|—|+6.0|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +2<br>MHz offset1 4 3 5|—|-8.0|—|dB|
|||Interferer is reference signal at -2<br>MHz offset1 4 3 5|—|-8.8|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +4<br>MHz offset1 4 3 5|—|-42.2|—|dB|
|||Interferer is reference signal at -4<br>MHz offset1 4 3 5|—|-50.3|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +6<br>MHz offset1 4 3 5|—|-54.4|—|dB|
|||Interferer is reference signal at -6<br>MHz offset1 4 3 5|—|-55.4|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 5|—|-8.0|—|dB|
|Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +2 MHz with 1<br>MHz precision1 5|—|-42.2|—|dB|
|||Interferer is reference signal at im-<br>age frequency -2 MHz with 1 MHz<br>precision1 5|—|+6.0|—|dB|
|Intermodulation performance|IM|n = 36|—|-22.3|—|dBm|
|**Note:**<br>1. 0.1% Bit Error Rate.<br>2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>3. Desired signal -67 dBm.<br>4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>5. With allowed exceptions.<br>6. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4|||||||



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Rev. 1.4  |  13 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Electrical Specifications 

## **4.1.9  RF Receiver Characteristics for Bluetooth Low Energy at 500 kbps** 

Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. RF center frequency 2.45 GHz. 

**Table 4.9.  RF Receiver Characteristics for Bluetooth Low Energy at 500 kbps** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Max usable receiver input<br>level|SAT|Signal is reference signal, packet<br>length is 37 bytes1|—|10|—|dBm|
|Sensitivity|SENS|Signal is reference signal1|—|-100.1|—|dBm|
|||With non-ideal signals2 1|—|-99.5|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 3|—|+2.1|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +1<br>MHz offset1 4 3 5|—|-9.0|—|dB|
|||Interferer is reference signal at -1<br>MHz offset1 4 3 5|—|-9.5|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +2<br>MHz offset1 4 3 5|—|-44.4|—|dB|
|||Interferer is reference signal at -2<br>MHz offset1 4 3 5|—|-51.9|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +3<br>MHz offset1 4 3 5|—|-44.3|—|dB|
|||Interferer is reference signal at -3<br>MHz offset1 4 3 5|—|-58.3|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 5|—|-44.4|—|dB|
|Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision1 5|—|-44.3|—|dB|
|||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision1 5|—|-9.0|—|dB|
|**Note:**<br>1. 0.1% Bit Error Rate.<br>2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>3. Desired signal -72 dBm.<br>4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>5. With allowed exceptions.|||||||



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Rev. 1.4  |  14 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Electrical Specifications 

## **4.1.10  RF Receiver Characteristics for Bluetooth Low Energy at 125 kbps** 

Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. RF center frequency 2.45 GHz. 

**Table 4.10.  RF Receiver Characteristics for Bluetooth Low Energy at 125 kbps** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Max usable receiver input<br>level|SAT|Signal is reference signal, packet<br>length is 37 bytes1|—|10|—|dBm|
|Sensitivity|SENS|Signal is reference signal1|—|-104.4|—|dBm|
|||With non-ideal signals2 1|—|-104.1|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 3|—|+0.8|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +1<br>MHz offset1 4 3 5|—|-13.1|—|dB|
|||Interferer is reference signal at -1<br>MHz offset1 4 3 5|—|-13.6|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +2<br>MHz offset1 4 3 5|—|-49.5|—|dB|
|||Interferer is reference signal at -2<br>MHz offset1 4 3 5|—|-56.9|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +3<br>MHz offset1 4 3 5|—|-47.0|—|dB|
|||Interferer is reference signal at -3<br>MHz offset1 4 3 5|—|-63.1|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 5|—|-49.5|—|dB|
|Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision1 5|—|-47.0|—|dB|
|||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision1 5|—|-13.1|—|dB|
|**Note:**<br>1. 0.1% Bit Error Rate.<br>2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>3. Desired signal -79 dBm.<br>4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>5. With allowed exceptions.|||||||



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Rev. 1.4  |  15 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Electrical Specifications 

## **4.1.11  High-Frequency Crystal** 

**Table 4.11.  High-Frequency Crystal** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Crystal frequency|fHFXTAL||—|38.4|—|MHz|
|Initial calibrated accuracy|ACCHFXTAL||-10|—|+10|ppm|
|Temperature drift|DRIFTHFXTAL|Across specified temperature<br>range|-30|—|+30|ppm|



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Rev. 1.4  |  16 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Electrical Specifications 

## **4.1.12  GPIO Pins** 

Unless otherwise indicated, typical conditions are: VDD = 3.0 V. 

**Table 4.12.  GPIO Pins** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Leakage current|ILEAK_IO|MODEx = DISABLED, VDD =<br>1.71V|—|1.9|—|nA|
|||MODEx = DISABLED, VDD = 3.0<br>V|—|2.5|—|nA|
|||MODEx = DISABLED, VDD = 3.8<br>V TA= 125 °C|—|—|200|nA|
|Input low voltage|VIL|Any GPIO pin and RESETn|—|—|0.3 * VDD|V|
|Input high voltage|VIH|Any GPIO pin and RESETn|0.7 * VDD|—|—|V|
|Output low voltage|VOL|Sinking 20mA, VDD = 3.0 V|—|—|0.2 * VDD|V|
|||Sinking 8mA, VDD = 1.62 V|—|—|0.4 * VDD|V|
|Output high voltage|VOH|Sourcing 20mA, VDD = 3.0 V|0.8 * VDD|—|—|V|
|||Sourcing 8mA, VDD = 1.62 V|0.6 * VDD|—|—|V|
|GPIO rise time|TGPIO_RISE|VDD = 3.0V, Cload= 50pF, SLEW-<br>RATE = 4, 10% to 90%|—|8.4|—|ns|
|||VDD = 1.7V, Cload= 50pF, SLEW-<br>RATE = 4, 10% to 90%|—|13|—|ns|
|GPIO fall time|TGPIO_FALL|VDD = 3.0V, Cload= 50pF, SLEW-<br>RATE = 4, 90% to 10%|—|7.1|—|ns|
|||VDD = 1.7V, Cload= 50pF, SLEW-<br>RATE = 4, 90% to 10%|—|11.9|—|ns|
|Pull up/down resistance1|RPULL|Any GPIO pin. Pull-up to IOVDD:<br>MODEn = DISABLE DOUT=1.<br>Pull-down to VSS: MODEn =<br>WIREDORPULLDOWN DOUT =<br>0.|35|44|55|kΩ|
|Maximum filtered glitch width|TGF|MODE = INPUT, DOUT = 1|—|26|—|ns|
|RESETn low time to ensure<br>pin reset|TRESET||100|—|—|ns|
|**Note:**<br>1. GPIO and RESETn pull-ups connect to the VDD supply. Pull-downs on GPIO connect to VSS.|||||||



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Rev. 1.4  |  17 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Electrical Specifications 

## **4.1.13  Microcontroller Peripherals** 

The MCU peripherals set available in BGM210L modules includes: 

- 12-bit 1 Msps ADC 

- Analog Comparators 

- 16-bit and 32-bit Timers/Counters 

- 24-bit Low Energy Timer for waveform generation 

- 32-bit Real Time Counter 

- USART (UART/SPI/SmartCards/IrDA/I2S) 

- I[2] C peripheral interfaces 

- 12 Channel Peripheral Reflex System 

For details on their electrical performance, consult the relevant portions of Section 4 in the SoC datasheet. 

To learn which GPIO ports provide access to every peripheral, consult Section 6.3 Analog Peripheral Connectivity and Section 6.4 Digital Peripheral Connectivity. 

## **4.2  Typical Performance Curves** 

Typical performance curves indicate typical characterized performance under the stated conditions. 

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Rev. 1.4  |  18 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Electrical Specifications 

## **4.2.1  Antenna Radiation and Efficiency** 

Typical BGM210L antenna radiation patterns and efficiency under optimal operating conditions are plotted in the figure below. Antenna gain and radiation patterns have a strong dependence on the size and shape of the application PCB the module is mounted on and, also, on the proximity of any mechanical design to the antenna. 

**Figure 4.1.  Typical 2D Antenna Radiation Patterns and Efficiency** 

Top Left: Phi 0[o] , Top Right: Phi 90[o] , Bottom Left: Theta 90[o] , Bottom Right: Radiation Efficiency 

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Rev. 1.4  |  19 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Reference Diagrams 

## **5.  Reference Diagrams** 

A typical application circuit for the BGM210L module is shown below. 

**==> picture [309 x 361] intentionally omitted <==**

**----- Start of picture text -----**<br>
VDD<br>1 18<br>SWCLK 2 PA01 PC05 17 PTI_SYNC<br>SWDIO 3 PA02 PC04 16 PTI_DATA<br>SWO/TDO 4 PA03 PC03 15 UART_CTS<br>TDI 5 PA04 PC02 14 UART_RTS<br>6 DEC GND 13<br>GND VDD<br>U1<br>xGM210L<br>MINI SIMPLICITY CONNECTOR FOR DEBUGGING<br>VDD<br>J5<br>1 2<br>3 4<br>RESET UART_RX<br>5 6<br>UART_TX SWO/TDO<br>7 8<br>SWDIO SWCLK<br>9 10<br>PTI_SYNC PTI_DATA<br>HEADER_10PIN_1.27MM_SMD_DUAL<br>PC00 PC01 PD01 D00P RESET DNC<br>7 8 9 10 11 12<br>UART_TX UART_RX GPIO GPIO RESET<br>**----- End of picture text -----**<br>


**Figure 5.1.  BGM210L Application Schematic** 

Interconnection labels correspond to supported pin functions described in 7.4 Debug, 7.5 Packet Trace Interface (PTI) and 6.4 Digital Peripheral Connectivity. 

Placing the module horizontally on the end-application board permits access to all module pins. Placing it vertically restricts access to pins 13 through 18 only. The reference schematic above is applicable for the former case only. Refer to 7. Design Guidelines for more details. 

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Rev. 1.4  |  20 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Pin Definitions 

## **6.  Pin Definitions** 

## **6.1  Module Pinout** 

**Figure 6.1.  BGM210L Lighting Module Pinout** 

The next table shows the BGM210L pinout and general descriptions for each pin. Refer to 6.2 Alternate Pin Functions, 6.3 Analog Peripheral Connectivity, and 6.4 Digital Peripheral Connectivity for details on functions and peripherals supported by GPIOs. 

**Table 6.1.  BGM210L Lighting Module Pin Definitions** 

**==> picture [427 x 180] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||||||||
|---|---|---|---|---|---|---|---|
|Pin Name|Pin(s)|Description|Pin Name|Pin(s)|Description|
|PA01|1|GPIO/Debug|PA02|2|GPIO/Debug|
|PA03|3|GPIO/Debug|PA04|4|GPIO/Debug|
|DEC|5|Decouple|[1]|GND|6|Ground|
|PC00|7|GPIO|PC01|8|GPIO|
|PD01|9|GPIO|PD00|10|GPIO|
|RESETn|11|Reset Pin|[3]|DNC|12|Do not connect|
|VDD|13|VDD|GND|14|Ground|
|PC02|15|GPIO|[2]|PC03|16|GPIO|[2]|
|PC04|17|GPIO|[2]|PC05|18|GPIO|[2]|

**----- End of picture text -----**<br>


**Note:** 

1. Available for powering module through external PMIC. Should be left disconnected typically. Do not use Decouple supply to power external circuitry. 

2. Internally terminated with series 56 ohm resistor. 

3. Connected to pull-up resistor to VDD internally. External pull-up is not required. 

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Rev. 1.4  |  21 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Pin Definitions 

## **6.2  Alternate Pin Functions** 

Some GPIOs support alternate functions like debugging, wake-up from EM4, access to an external low frequency crystal, etc.. The following table shows which module pins have alternate capabilities and the functions they support. Refer to the SoC's reference manual for more information. 

**Table 6.2.  GPIO Alternate Functions Table** 

|**GPIO**|**Alternate Function**|**Alternate Function**|**Alternate Function**|
|---|---|---|---|
|PA01|GPIO.SWCLK|||
|PA02|GPIO.SWDIO|||
|PA03|GPIO.SWV|GPIO.TDO|GPIO.TRACEDATA0|
|PA04|GPIO.TDI|GPIO.TRACECLK||
|PC00|GPIO.EM4WU6|||
|PD01|LFXO.LFXTAL_I|LFXO.LF_EXTCLK||
|PD00|LFXO.LFXTAL_O|||
|PC05|GPIO.EM4WU7|||



## **6.3  Analog Peripheral Connectivity** 

Many analog resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port. When a differential connection is being used Positive inputs are restricted to the EVEN pins and Negative inputs are restricted to the ODD pins. When a single ended connection is being used positive input is avaliable on all pins. See the device Reference Manual for more details on the ABUS and analog peripherals. 

## **Table 6.3.  ABUS Routing Table** 

|**Peripheral**|**Signal**|**PA**|**PA**|**PC**|**PC**|**PD**|**PD**|
|---|---|---|---|---|---|---|---|
|||**EVEN**|**ODD**|**EVEN**|**ODD**|**EVEN**|**ODD**|
|ACMP0|ana_neg|Yes|Yes|Yes|Yes|Yes|Yes|
||ana_pos|Yes|Yes|Yes|Yes|Yes|Yes|
|ACMP1|ana_neg|Yes|Yes|Yes|Yes|Yes|Yes|
||ana_pos|Yes|Yes|Yes|Yes|Yes|Yes|
|IADC0|ana_neg|Yes|Yes|Yes|Yes|Yes|Yes|
||ana_pos|Yes|Yes|Yes|Yes|Yes|Yes|



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Rev. 1.4  |  22 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Pin Definitions 

## **6.4  Digital Peripheral Connectivity** 

Many digital resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port. 

**Table 6.4.  DBUS Routing** 

|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|
||**PA**|**PC**|**PD**|
|ACMP0.DIGOUT|Available|Available|Available|
|ACMP1.DIGOUT|Available|Available|Available|
|CMU.CLKIN0||Available|Available|
|CMU.CLKOUT0||Available|Available|
|CMU.CLKOUT1||Available|Available|
|CMU.CLKOUT2|Available|||
|FRC.DCLK||Available|Available|
|FRC.DFRAME||Available|Available|
|FRC.DOUT||Available|Available|
|I2C0.SCL|Available|Available|Available|
|I2C0.SDA|Available|Available|Available|
|I2C1.SCL||Available|Available|
|I2C1.SDA||Available|Available|
|LETIMER0.OUT0|Available|||
|LETIMER0.OUT1|Available|||
|PRS.ASYNCH0|Available|||
|PRS.ASYNCH1|Available|||
|PRS.ASYNCH10||Available|Available|
|PRS.ASYNCH11||Available|Available|
|PRS.ASYNCH2|Available|||
|PRS.ASYNCH3|Available|||
|PRS.ASYNCH4|Available|||
|PRS.ASYNCH5|Available|||
|PRS.ASYNCH6||Available|Available|
|PRS.ASYNCH7||Available|Available|
|PRS.ASYNCH8||Available|Available|
|PRS.ASYNCH9||Available|Available|
|PRS.SYNCH0|Available|Available|Available|
|PRS.SYNCH1|Available|Available|Available|
|PRS.SYNCH2|Available|Available|Available|
|PRS.SYNCH3|Available|Available|Available|



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BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Pin Definitions 

|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|
||**PA**|**PC**|**PD**|
|TIMER0.CC0|Available|Available|Available|
|TIMER0.CC1|Available|Available|Available|
|TIMER0.CC2|Available|Available|Available|
|TIMER0.CDTI0|Available|Available|Available|
|TIMER0.CDTI1|Available|Available|Available|
|TIMER0.CDTI2|Available|Available|Available|
|TIMER1.CC0|Available|Available|Available|
|TIMER1.CC1|Available|Available|Available|
|TIMER1.CC2|Available|Available|Available|
|TIMER1.CDTI0|Available|Available|Available|
|TIMER1.CDTI1|Available|Available|Available|
|TIMER1.CDTI2|Available|Available|Available|
|TIMER2.CC0|Available|||
|TIMER2.CC1|Available|||
|TIMER2.CC2|Available|||
|TIMER2.CDTI0|Available|||
|TIMER2.CDTI1|Available|||
|TIMER2.CDTI2|Available|||
|TIMER3.CC0||Available|Available|
|TIMER3.CC1||Available|Available|
|TIMER3.CC2||Available|Available|
|TIMER3.CDTI0||Available|Available|
|TIMER3.CDTI1||Available|Available|
|TIMER3.CDTI2||Available|Available|
|USART0.CLK|Available|Available|Available|
|USART0.CS|Available|Available|Available|
|USART0.CTS|Available|Available|Available|
|USART0.RTS|Available|Available|Available|
|USART0.RX|Available|Available|Available|
|USART0.TX|Available|Available|Available|
|USART1.CLK|Available|||
|USART1.CS|Available|||
|USART1.CTS|Available|||
|USART1.RTS|Available|||
|USART1.RX|Available|||
|USART1.TX|Available|||



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Rev. 1.4  |  24 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Pin Definitions 

|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|
||**PA**|**PC**|**PD**|
|USART2.CLK||Available|Available|
|USART2.CS||Available|Available|
|USART2.CTS||Available|Available|
|USART2.RTS||Available|Available|
|USART2.RX||Available|Available|
|USART2.TX||Available|Available|



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Rev. 1.4  |  25 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Design Guidelines 

## **7.  Design Guidelines** 

## **7.1  Module Placement** 

The BGM210L should be placed at the edge of the end-application PCB as seen below. The copper clearance area under the antenna must be void of traces or components to prevent parasitic loading or undesired coupling of signals or noise to the antenna. The width of the GND pour on the end-application PCB should match at least the width of the antenna (e.g. 12.5 mm or greater) to have negligible effect on antenna performance. 

**==> picture [71 x 41] intentionally omitted <==**

**----- Start of picture text -----**<br>
12.5 mm<br>5.0 mm<br>**----- End of picture text -----**<br>


**Figure 7.1.  Inverted-F Antenna Clearance** 

BGM210L modules do not support the use of an external, alternative antenna. The U.FL connector land pattern on the top layer of the module should not be used, populated or tampered with. 

Figure 7.2 Horizontal Mounting on page 26 illustrates the placement recommended when mounting the module horizontally to an endapplication PCB. It also shows examples of layout cases that will result in severe RF performance degradation for the module. 

**Figure 7.2.  Horizontal Mounting** 

Vertical mounting provides mechanical design flexibility that could be advantageous for certain applications. Figure 7.3 Vertical Mounting on page 27 illustrates the placement recommended when mounting the module vertically to an end-application PCB. It also shows layout examples that will result in severe RF performance degradation for the module. 

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Rev. 1.4  |  26 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Design Guidelines 

Notice that vertical mounting limits the number of pins available to interact with the module to six (VDD, GND and four GPIOs) which may be suitable for specific use cases only (e.g. to generate PWM outputs for LED control). The trade offs of vertical mounting should be carefully considered prior to choosing such arrangement. 

**==> picture [40 x 34] intentionally omitted <==**

**----- Start of picture text -----**<br>
ea<br>5.0 mm<br>**----- End of picture text -----**<br>


**Figure 7.3.  Vertical Mounting** 

## **7.2  Antenna Optimization** 

Due to the nature of PCB trace antennas, the BGM210L is sensitive to the thickness of the application PCB on which it is mounted, as well as to any plastics, metal or dielectric materials in close proximity to the antenna. The layout guide shown in Figure 7.2 Horizontal Mounting on page 26 is optimal for an application board thickness of 0.8 mm. 

For cases where the application board is of a thickness different than the optimal, the impedance and performance of the antenna may be experimentally adjusted by 

1. Cutting out the end-application PCB's FR4 material that is under the antenna, or by 

2. Adjusting the separation between the lower side of the antenna and the edge of the application board's GND plane underneath the module 

Impedance and performance optimization can be verified by measuring RSSI or radiated output power until either is maximized. 

## **7.3  Reset** 

The BGM210L can be reset by pulling the RESET line low, by the internal watchdog timer, or by software command. All three methods are applicable when the module is mounted horizontally on a given end-application board and, hence, all module pins are accessible. When mounted vertically, however, only the second and third methods apply. 

The reset state does not provide power saving functionality and it is not recommended as a means to conserve power. 

## **7.4  Debug** 

See _AN958: Debugging and Programming Interfaces for Custom Designs_ . 

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Rev. 1.4  |  27 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Design Guidelines 

The BGM210L supports hardware debugging via 4-pin JTAG or 2-pin serial-wire debug (SWD) interfaces. It is recommended to expose the debug pins in your own hardware design for firmware update and debug purposes. The table below lists the required pins for JTAG and SWD debug interfacing, which are also presented in 6.2 Alternate Pin Functions. 

If JTAG interfacing is enabled, the module must be power cycled to return to a SWD debug configuration if necessary. 

## **Table 7.1.  Debug Pins** 

|**Pin Name**|**Pin Number**|**JTAG Signal**|**SWD Signal**|**Comments**|
|---|---|---|---|---|
|PA04|4|TDI|N/A|This pin is disabled after reset. Once enabled the pin<br>has a built-in pull-up.|
|PA03|3|TDO|N/A|This pin is disabled after reset.|
|PA02|2|TMS|SWDIO|Pin is enabled after reset and has a built-in pull-up.|
|PA01|1|TCK|SWCLK|Pin is enabled after reset and has a built-in pull-down.|



## **7.5  Packet Trace Interface (PTI)** 

The BGM210L integrates a true PHY-level packet trace interface (PTI) peripheral that can capture packets non-intrusively to monitor and log device and network traffic without burdening processing resources in the module's SoC. The PTI generates two output signals that can serve as a powerful debugging tool, especially in conjunction with other hardware and software development tools available from Silicon Labs. The PTI_DATA and PTI_SYNC signals can be accessed through any GPIO on ports C and D (see FRC.DOUT and FRC.DFRAME peripheral resources in Table 6.4 DBUS Routing on page 23). 

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Rev. 1.4  |  28 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Package Specifications 

## **8.  Package Specifications** 

## **8.1  Package Outline** 

**==> picture [302 x 224] intentionally omitted <==**

**----- Start of picture text -----**<br>
3.0 mm 12.5 mm 0.9 mm (±0.1)<br>(±0.2)<br>2.25 mm<br>(±0.2)<br>4.5 mm<br>(±0.1)<br>ay ULE<br>11.5 mm<br>5.0 mm<br>| | =e 2.5 mm<br>(±0.1)<br>i i | : 22.5 mm<br>(±0.2)<br>;— e ; —<br>12.0 mm<br>(±0.1)<br>11.0 mm 9.5 mm<br>(±0.1) SILICON LABS } Maas (±0.1)<br><<br>1.0 mm 0.9 mm<br>10.18 mm (±0.1) 2.5 mm<br>(±0.1)<br>13.0 mm (±0.1)<br>1.35 mm<br>15.50 mm (±0.2) (±0.1)<br>**----- End of picture text -----**<br>


**Figure 8.1.  Top and Side Views** 

**Figure 8.2.  Bottom View** 

NOTE: Solder paste thickness adds 0.1 ± 0.05 mm to overall module height 

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Rev. 1.4  |  29 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Package Specifications 

## **8.2  PCB Land Pattern** 

**==> picture [226 x 225] intentionally omitted <==**

**----- Start of picture text -----**<br>
5.00 mm<br>3.30 mm<br>1.60 mm<br>1.30 mm<br>1.10 mm 1<br>(2.65, 6.45) 1.90 mm<br>1.71 mm<br>1.40 mm<br>1.40 mm<br>o<br>origo<br>1.71 mm<br>**----- End of picture text -----**<br>


**Figure 8.3.  Recommended Module PCB Land Pattern** 

**Table 8.1.  Pad Sizing and Location** 

|**Pad Number**|**X Coordinate**|**Y Coordinate**|**Pad Dimensions**|
|---|---|---|---|
|1|0.5|9.78|1.1 x 1.6|
|6|0.5|1.23|1.1 x 1.6|
|7|2.23|0.5|1.1 x 1.6|
|12|10.78|0.5|1.1 x 1.6|
|13|14.67|2.25|1.3 x 3.3|
|18|14.67|11.75|1.3 x 3.3|
|**Note:**<br>1. All dimensions in mm unless otherwise stated.<br>2. X and Y coordinates are specified relative to origo at indicated package corner in the figure above.<br>3. The module has a test point for VDD on the bottom layer at (X=2.65, Y=6.45). A keep-out area of 1.4 mm x 1.4 mm around this<br>point is recommended to prevent the possibility of a short circuit.||||



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Rev. 1.4  |  30 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Package Specifications 

## **8.3  Marking** 

The figure below shows the markings engraved on the RF shield of the module. 

**Figure 8.4.  BGM210L Shield Marking** 

## **Mark Description** 

The module shield marking includes the following: 

- BGM210Lxxxxxxx - Part number designation 

- Model: BGM210L22F - Model number designation 

- QR Code: YYWWMMABCDE 

   - YY – Last two digits of the assembly year. 

   - WW – Two-digit workweek when the device was assembled. 

   - MMABCDE – Silicon Labs unit code 

- YYWWTTTTTT 

   - YY – Last two digits of the assembly year. 

   - WW – Two-digit workweek when the device was assembled. 

   - TTTTTT – Manufacturing trace code. The first letter is the device revision. 

- Certification marks such as the CE logo, FCC and IC IDs, etc. will be engraved on the grayed out area or printed on the back side of the module, according to regulatory body requirements. 

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Rev. 1.4  |  31 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Soldering Recommendations 

## **9.  Soldering Recommendations** 

It is recommended that final PCB assembly of the BGM210L follows the industry standard as identified by the Institute for Printed Circuits (IPC). This product is assembled in compliance with the J-STD-001 requirements and the guidelines of IPC-AJ-820. Surface mounting of this product by the end user is recommended to follow IPC-A-610 to meet or exceed class 2 requirements. 

## **CLASS 1 General Electronic Products** 

Includes products suitable for applications where the major requirement is function of the completed assembly. 

## **CLASS 2 Dedicated Service Electronic Products** 

Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically the end-use environment would not cause failures. 

## **CLASS 3 High Performance/Harsh Environment Electronic Products** 

Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems. 

**Note:** General SMT application notes are provided in the AN1223 document. 

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Rev. 1.4  |  32 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Tape and Reel 

## **10.  Tape and Reel** 

All dimensions are given in mm unless otherwise indicated. 

**Figure 10.1.  Carrier Tape Dimensions** 

**Figure 10.2.  Reel Dimensions** 

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Rev. 1.4  |  33 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Certifications 

## **11.  Certifications** 

This section details the certification status of the BGM210L modules with regards to regional regulatory radio type approvals. Where applicable, the status with the qualifications against the specifications of the supported global industrial wireless standards is also provided. 

The address of the legal manufacturer (technology owner) and certifications applicant/holder is: 

SILICON LABS / SILICON LABORATORIES FINLAND OY Alberga Business Park, Bertel Jungin aukio 3, 02600 Espoo, Finland 

The BGM210L modules have brand name of "SILICON LABS". For certifications and qualifications purposes, the modules are referred to by their formal Model Name of "BGM210L22F". 

"SILICON LABS" (and "Silicon Labs") is a trademark globally owned by the Silicon Laboratories Inc. corporation, and all branches and subsidiaries, including the above applicant, holds the right to use it. 

For any clarification on regulatory certifications, or if you need to discuss topics such as Permissive Changes or Change in ID requests, please contact your Sales Representative or our Technical Support. You can get started by visiting Contact Us. 

## **11.1  CE and UKCA** 

BGM210L modules have been tested against the relevant harmonized/designated standards and are in conformity with the essential requirements and other relevant requirements of the EU's Radio Equipment Directive (RED) (2014/53/EU) and of the UK's Radio Equipment Regulations (RER) (S.I. 2017/1206). 

Every end-product integrating the BGM210L module will need to perform radio EMC tests on the whole assembly according to the ETSI 301 489-x relevant standard. 

Furthermore, it is ultimately the responsibility of the manufacturers to ensure the compliance of their end-products as a whole. The specific product assembly is likely to have an impact on the RF radiated characteristics, when compared to the bare module. Hence, manufacturers should also carefully consider RF radiated testing with the final product assembly to confirm the compliance. 

The modules are entitled to carry the CE and UKCA compliance marks, and a formal Declaration of Conformity (DoC) is available at the product web page which is reachable starting from https://www.silabs.com/ or upon request. 

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Rev. 1.4  |  34 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Certifications 

## **11.2  FCC** 

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 

1. This device may not cause harmful interference, and 

2. This device must accept any interference received, including interference that may cause undesirable operation. 

Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment. 

## **FCC RF Radiation Exposure Statement:** 

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter meets both portable and mobile requirements in accordance to the limits exposed in the RF Exposure Analysis. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. 

## **OEM Responsibilities to comply with FCC Regulations:** 

OEM integrator is responsible for testing their end-product for any additional compliance requirements needed with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Additionally, investigative measurements and spot checking are strongly recommended to verify that the full system compliance is maintained when the module is integrated, in accordance to the "Host Product Testing Guidance" in FCC's KDB 996369 D04 Module Integration Guide V01. 

- In the typical case when the integral antenna of the BGM210L is used, a minimum separation distance of 12 mm must be maintained at all times between the human body and the radiator (antenna) to meet the SAR exemption for portable conditions. 

- The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. 

## **Important Note:** 

In the event that these conditions cannot be met, then for the FCC authorization to remain valid the final product will have to undergo additional testing to evaluate the RF exposure, and a permissive change will have to be applied with the help of the customer's own Telecommunication Certification Body. 

## **End Product Labeling** 

The variants of BGM210L Modules are labeled with their own FCC ID. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: 

## **"Contains Transmitter Module FCC ID: QOQMGM210L"** 

Or 

## **"Contains FCC ID: QOQMGM210L"** 

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. 

## **Class B Device Notice** 

**Note:** This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: 

- Reorient or relocate the receiving antenna 

- Increase the separation between the equipment and receiver 

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected 

- Consult the dealer or an experienced radio/TV technician for help 

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Rev. 1.4  |  35 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Certifications 

## **11.3  ISED Canada** 

## **ISEDC** 

This radio transmitter (IC: 5123A-MGM210L) has been approved by Industry Canada to operate with the embedded antenna. Any other antenna types are strictly prohibited for use with this device. 

This device complies with Industry Canada’s license-exempt RSS standards. Operation is subject to the following two conditions: 

1. This device may not cause interference; and 

2. This device must accept any interference, including interference that may cause undesired operation of the device 

## **RF Exposure Statement** 

Exception from routine SAR evaluation limits are given in RSS-102 Issue 5. 

The module meets the given requirements when the minimum separation distance to human body is 20 mm. 

RF exposure or SAR evaluation is not required when the separation distance is same or more than stated above. If the separation distance is less than stated above the OEM integrator is responsible for evaluating the SAR. 

## **OEM Responsibilities to comply with IC Regulations** 

The module has been certified for integration into products only by OEM integrators under the following conditions: 

- The antenna must be installed such that a minimum separation distance as stated above is maintained between the radiator (antenna) and all persons at all times. 

- The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. 

As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). 

## **IMPORTANT NOTE** 

In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the ISEDC authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate ISEDC authorization. 

## **End Product Labeling** 

The BGM210L module is labeled with its own IC ID. If the IC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: 

## “ **Contains Transmitter Module IC: 5123A-MGM210L** ” 

## or 

## “ **Contains IC: 5123A-MGM210L”** 

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. 

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Rev. 1.4  |  36 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Certifications 

## **ISEDC (Français)** 

Industrie Canada a approuvé l’utilisation de cet émetteur radio (IC: 5123A-MGM210L) en conjonction avec l'antenne intégrée. L’utilisation de tout autre type d’antenne avec ce composant est proscrite. 

Ce composant est conforme aux normes RSS, exonérées de licence d'Industrie Canada. Son mode de fonctionnement est soumis aux deux conditions suivantes: 

1. Ce composant ne doit pas générer d’interférences. 

2. Ce composant doit pouvoir est soumis à tout type de perturbation y compris celle pouvant nuire à son bon fonctionnement. 

## **Déclaration d'exposition RF** 

L'exception tirée des limites courantes d'évaluation SAR est donnée dans le document RSS-102 Issue 5. 

Le module répondent aux exigences requises lorsque la distance minimale de séparation avec le corps humain est de 20 mm. 

La déclaration d’exposition RF ou l'évaluation SAR n'est pas nécessaire lorsque la distance de séparation est identique ou supérieure à celle indiquée ci-dessus. Si la distance de séparation est inférieure à celle mentionnées plus haut, il incombe à l'intégrateur OEM de procédé à une évaluation SAR. 

## **Responsabilités des OEM pour une mise en conformité avec le Règlement du Circuit Intégré** 

Le module a été approuvé pour l'intégration dans des produits finaux exclusivement réalisés par des OEM sous les conditions suivantes: 

- L'antenne doit être installée de sorte qu'une distance de séparation minimale indiquée ci-dessus soit maintenue entre le radiateur (antenne) et toutes les personnes avoisinante, ce à tout moment. 

- Le module émetteur ne doit pas être localisé ou fonctionner avec une autre antenne ou un autre transmetteur que celle indiquée plus haut. 

Tant que les deux conditions ci-dessus sont respectées, il n’est pas nécessaire de tester ce transmetteur de façon plus poussée. Cependant, il incombe à l’intégrateur OEM de s’assurer de la bonne conformité du produit fini avec les autres normes auxquelles il pourrait être soumis de fait de l’utilisation de ce module (par exemple, les émissions des périphériques numériques, les exigences de périphériques PC, etc.). 

## **REMARQUE IMPORTANTE** 

Ans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou co-implantation avec un autre émetteur), l'autorisation ISEDC n'est plus considérée comme valide et le numéro d’identification ID IC ne peut pas être apposé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera responsable de la réévaluation du produit final (y compris le transmetteur) et de l'obtention d'une autorisation ISEDC distincte. 

## **Étiquetage des produits finis** 

Les modules BGM210L sont étiquetés avec leur propre ID IC. Si l'ID IC n'est pas visible lorsque le module est intégré au sein d'un autre produit, cet autre produit dans lequel le module est installé devra porter une étiquette faisant apparaitre les référence du module intégré. Dans un tel cas, sur le produit final doit se trouver une étiquette aisément lisible sur laquelle figurent les informations suivantes: 

## “ **Contient le module transmetteur: 5123A-MGM210L** ” 

## or 

## “ **Contient le circuit: 5123A-MGM210L”** 

L'intégrateur OEM doit être conscient qu’il ne doit pas fournir, dans le manuel d’utilisation, d'informations relatives à la façon d'installer ou de d’enlever ce module RF ainsi que sur la procédure à suivre pour modifier les paramètres liés à la radio. 

## **11.4  Australia (ACMA)** 

The BGM210L22F is compliant to RCM requirements in Australia and New Zealand and it is labeled with the RCM compliance mark. The formal DoC is available at https://www.silabs.com/ or upon request. 

## **11.5  Dominican Republic (INDOTEL)** 

The BGM210L22F has INDOTEL type approval in the Dominican Republic. The formal type approval certificate is available at https:// www.silabs.com/ or upon request. 

**silabs.com** | Building a more connected world. 

Rev. 1.4  |  37 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Certifications 

## **11.6  Hong Kong (OFCA)** 

The BGM210L has approval in Hong Kong. The formal type approval certificate is available at https://www.silabs.com/ or upon request. 

## **11.7  Israel (MOC)** 

Products based solely on Bluetooth are exempted since 2017 from needing a formal radio type approval. The BGM210L22F comes with a declaration of exemption written by the MOC, which is available at https://www.silabs.com/ or upon request. 

## **11.8  Serbia (RATEL)** 

The BGM210L has type approval in Serbia. The formal type approval certificate is available at https://www.silabs.com/ or upon request. 

## **11.9  Bahrain (BTRA)** 

The BGM210L22F is compliant to IGA requirements in the Kingdom of Bahrain. The formal IGA Approval Certificate is available at https://www.silabs.com/ or upon request. 

## **11.10  China (SRRC)** 

The BGM210L22F modules have a full modular radio type approval for re-use by OEM integrators, with certification identification of CMIIT ID: 2019DJ13188. 

Note for modules with a full modular approval: every end-product integrating the module must be labeled with the following statement, or alternatively the statement will have to go to the end-product's user manual: 

(Translation of above example statement: "This equipment contains a radio transmitter module with type approval code: CMIIT ID: 2019DJ13188") 

## **–SRRC** 

## **11.11  Egypt (NTRA)** 

The BGM210L22F is compliant to NTRA requirements in Egypt and is labeled with the CE mark. The formal NTRA certificate is available at https://www.silabs.com/ or upon request. 

**silabs.com** | Building a more connected world. 

Rev. 1.4  |  38 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Certifications 

## **11.12  Japan (MIC)** 

The BGM210L22F modules are certified in Japan with certification number 203-JN1039. 

It is the end product manufacturer's responsibility to ensure that the module is configured to meet the limits documented in the formal certification test report available at https://www.silabs.com/ or upon request. The maximum TX power allowed for regulatory compliance in Japan is +9.5 dBm. 

Manufacturer integrating a radio module in their host equipment are supposed to make the compliance mark and the certification number (same as depicted on the label of the radio module) visible on the outside of their device. The certification mark and certification number must be placed close to the text in the Japanese language which is provided below. This requirement in the Radio Law has been made in order to enable users of the combination of host and radio module to verify if they are actually using a radio device which is approved for use in Japan. 

Certification-related text to be placed on the outside surface of the host equipment: 

## **Translation of the text:** 

“This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law.” 

The "Giteki" compliance mark shown in the figure below must be affixed to an easily noticeable section of the specified radio equipment. Note that additional information may be required if the device is also subject to a telecom approval. 

**Figure 11.1.  GITEKI Compliance Mark** 

## **11.13  South Korea (KC)** 

The BGM210L22F is certified in South Korea with number R-C-BGT-MGM210L22F. 

It is the end product manufacturer's responsibility to ensure that the module is configured to meet the limits documented in the formal certification test report available at https://www.silabs.com/ or upon request. The maximum TX power allowed for regulatory compliance in South Korea is +10 dBm. 

## **11.14  Morocco (ANRT)** 

The BGM210L22F is compliant to ANRT requirements in Morocco with Certificate Number MR 19524 ANRT 2019 and Date of Issue 30/04/2019. The formal ANRT Certificate is available at https://www.silabs.com/ or upon request. 

## **11.15  Qatar (CRA)** 

The BGM210L22F is compliant to CRA requirements in Qatar with ictQATAR certification number CRA/SM/2019/R-7904. The formal CRA Certificate of Type Approval is available at https://www.silabs.com/ or upon request. 

**silabs.com** | Building a more connected world. 

Rev. 1.4  |  39 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Certifications 

## **11.16  Thailand (NBTC)** 

The BGM210L is compliant to NTC requirements in Thailand. The formal DoC is available at https://www.silabs.com/ or upon request. 

## **11.17  NCC Taiwan** 

BGM210L22F modules are certified in Taiwan with NCC certification number CCAJ20LP0B51T0. The platform manufacturer is required to mark the platform with the following sentence: "This product contains an RF module with ID number CCAJ20LP0B51T0." 

|According to NCC Low Power Radio Wave Radiation Equipment Management Regulations:|According to NCC Low Power Radio Wave Radiation Equipment Management Regulations:|
|---|---|
|Article 12|A low-power RF equipment that has passed the type approval shall not change the frequency, increase the<br>power or change the characteristics and functions of the original design without permission.|
|Article 14|The use of low-power RF equipment shall not affect flight safety and interfere with legal communications; if in-<br>terference is found, it shall be immediately deactivated and improved until no interference is found.<br>Legal communication in the preceding paragraph refers to radio communications operating in accordance with<br>the provisions of the Telecommunications Act.<br>Low-power RF equipment must withstand interference from legitimate communications or radiological, radiated<br>electrical equipment for industrial, scientific, and medical applications.|



## **11.18  Bluetooth Qualification** 

The BGM210L modules came at launch with a pre-qualified Bluetooth Low Energy RF-PHY Tested Component having Declaration ID of D043475 and QDID of 129390, and having a listing date of 2019-04-02. Due to expiry, the Tested Component was renewed on 2024-02-21 with a new Declaration ID of D066522 and QDID of 231202. 

Because the validity set by the SIG for Tested Components is currently of 3 years, during the product lifetime Silicon Labs will renew this Component as it expires, whenever applicable. Renewed Tested Components will come with new DIDs and QDIDs, and these will be then referred to in end-product listings. Such new DIDs and QDIDs can be discovered starting from the original ones. 

This module’s RF-PHY Tested Component should be combined with the latest Wireless Gecko Link Layer and Host pre-qualified Components by Silicon Labs, when in the process of qualifying an end-product embedding the BGM210L via the SIG’s Launch Studio. 

**silabs.com** | Building a more connected world. 

Rev. 1.4  |  40 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Revision History 

## **12.  Revision History** 

## **Revision 1.4** 

August, 2025 

- Removed AoA/AoD from 1. Features as this protocol is not supported. 

## **Revision 1.3** 

May, 2024 

- Changed mentions of "Secure Element" to "Secure Engine". 

- Section 2. Ordering Information: Changed Bluetooth version from 5.3 to 5.x and added note regarding Bluetooth 5.x support. 

- Section 4.1.1 Absolute Maximum Ratings: Added "DC voltage on RESETn pin" specification and added note regarding RESETn pin's pullup to VDD. 

- Section 4.1.2 General Operating Conditions: Added External Clock Input and DPLL Reference Clock maximum specifications. 

- Changed symbol SAT to RXSAT in Table 4.7 RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps on page 12. 

- Updated 11.10 China (SRRC) 

- Updated 11.12 Japan (MIC) 

- Updated Bluetooth Qualification information. 

- Updated 11.7 Israel (MOC) 

- Updated 11. Certifications: removed Jordan, Singapore, United Arab Emirates, Saudi Arabia 

## **Revision 1.2** 

December, 2022 

- Updated supported Bluetooth version from 5.1 to 5.3 

- Updated Bluetooth Qualification information. 

## **Revision 1.1** 

September, 2021 

- Changed number of 16-bit Timer/Counter modules to 3 in 1. Features. 

- Updated TX frequency range in 4.1.5 RF Transmitter General Characteristics for the 2.4 GHz Band to specify limits for BLE 

- Removed footnote and clarified test conditions for Input low voltage and Input high voltage specifications in Table 4.12 GPIO Pins on page 17. 

- Added RESETn low time to ensure pin reset (T_RESET) specification to Table 4.12 GPIO Pins on page 17. 

- Updated figures in 8.3 Marking with new placement of YYWWTTTTTT 

- Added 11.17 NCC Taiwan 

- Added 

- Added 

- Added 11.18 Bluetooth Qualification 

- Updated 11.1 CE and UKCA 

- Updated 

**silabs.com** | Building a more connected world. 

Rev. 1.4  |  41 

BGM210L Wireless Gecko Bluetooth[®] Lighting Module Data Sheet Revision History 

## **Revision 1.0** 

January, 2020 

- Corrected LETIMER's lowest power mode in front page block diagram from EM2 to EM3 

- Resolved remaining TBD entries in Section 4.1 Electrical Characteristics 

- Changed "3.3V" net label in Figure 5.1 BGM210L Application Schematic on page 20 to "VDD", pin U1-12 to DNC and direction of some interconnection labels; also added note on module placement and pinout 

- Updated Note 1, added Note 3, changed pin 12 from "GND" to "DNC" and corrected descriptions for pins 1-4 to "GPIO/Debug" and pins 7, 8 to "GPIO" in Table 6.1 BGM210L Lighting Module Pin Definitions on page 21 

- Updated text for 6.2 Alternate Pin Functions 

- Added text on U.FL land pattern and vertical mounting in Section 7.1 Module Placement 

- Updated text for Section 7.2 Antenna Optimization 

- Added 7.3 Reset, 7.4 Debug, and 7.5 Packet Trace Interface (PTI) 

- Renamed section 8.1 Dimensions as 8.1 Package Outline 

- Renamed Fig 8.1 Module Dimensions as Figure 8.1 Top and Side Views on page 29 

- Added missing outline dimensions and tolerances to Figure 8.1 Top and Side Views on page 29 

- Added Figure 8.2 Bottom View on page 29 and note on impact of solder paste on overall module height 

- Updated Figure 8.2 Bottom View on page 29 and Figure 8.3 Recommended Module PCB Land Pattern on page 30 to show location of bottom layer VDD test point 

- Updated Section 

- Added 11.9 Bahrain (BTRA), 11.10 China (SRRC), 11.11 Egypt (NTRA), 11.12 Japan (MIC), 11.13 South Korea (KC), 11.14 Morocco (ANRT), 11.15 Qatar (CRA), 11.16 Thailand (NBTC) 

## **Revision 0.5.1** 

September, 2019 

- Updated Ordering Information with "210LA" OPNs 

- Updated Package Specifications with corresponding "210LA" top mark figures 

## **Revision 0.5** 

August, 2019 

- Initial Production Release. 

- Updated Features with latest values, certifications, security, etc 

- Updated Ordering Information with OPNs for Reel packaging 

- Added System Overview 

- Updated Electrical Specifications with latest values 

- Updated Tables 6.2 - 6.4 in Pin Definitions 

- Updated wording and figures in Design Guidelines 

- Updated figures in Package Specifications and added Marking section 

- Added Tape and Reel dimensions 

- Updated list of regions/countries in Certifications 

- General wording, spelling, and grammar fixes. 

## **Revision 0.2** 

July, 2019 

- Updated typical specification values to reflect module measurements. 

- Wording, spelling, and grammar fixes. 

## **Revision 0.1** 

## April, 2019 

- Initial Release. 

**silabs.com** | Building a more connected world. 

Rev. 1.4  |  42 

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## **Disclaimer** 

Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and “Typical” parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A “Life Support System” is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications. 

## **Trademark Information** 

Silicon Laboratories Inc.[®] , Silicon Laboratories[®] , Silicon Labs[®] , SiLabs[®] and the Silicon Labs logo[®] , Bluegiga[®] , Bluegiga Logo[®] , EFM[®] , EFM32[®] , EFR, Ember[®] , Energy Micro, Energy Micro logo and combinations thereof, “the world’s most energy friendly microcontrollers”, Redpine Signals[®] , WiSeConnect , n-Link, EZLink[®] , EZRadio[®] , EZRadioPRO[®] , Gecko[®] , Gecko OS, Gecko OS Studio, Precision32[®] , Simplicity Studio[®] , Telegesis, the Telegesis Logo[®] , USBXpress[®] , Zentri, the Zentri logo and Zentri DMS, Z-Wave[®] , and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective holders. 

**Silicon Laboratories Inc. 400 West Cesar Chavez Austin, TX 78701 USA** 

**www.silabs.com**
Updated at April 28, 2026
Silicon Labs is a recognized industry leader in secure, intelligent wireless technology and precision timing solutions. Renowned for driving innovation in the Internet of Things (IoT) and industrial automation, the company develops electronic components that deliver the performance, energy savings, and design simplicity required to build a seamlessly connected world. Our extensive portfolio of Silicon Labs components prominently features their robust wireless connectivity and timing products. This includes a comprehensive selection of Bluetooth modules and adaptors engineered for reliable, low-power communication in smart devices. Complementing these wireless offerings is a broad array of precision timing devices, particularly standard and advanced MEMS oscillators, which are critical for ensuring exact synchronization and stable frequency control in demanding circuit designs. To support a wider spectrum of networking and communication requirements, the lineup also encompasses versatile WLAN modules and USB adaptors. Additionally, engineers will find highly integrated sub-2.4GHz ISM band RF transceivers, available as both standalone integrated circuits and complete RF modules, providing exceptional range and signal resilience for complex wireless deployments.
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