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BGA-STD-045
Heat Sink, For Ball Grid Array, Standard, 14.7 °C/W, BGA, 23 mm, 18 mm, 23 mm
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: ABL HEATSINKS
- Product type: Natural Convection Heat Sinks
- Thermal Resistance:14.7°C/W; Packages Cooled:BGA; External Width - Metric:23mm; External Height - Metric:18mm; External Length - Metric:23mm; External Diameter - Metric:-; Heat Sink Ma
- Product Range: -
- Packages Cooled: BGA
- Heat Sink Material: Aluminium
- Thermal Resistance: 14.7°C/W
- External Width - Metric: 23mm
- External Height - Metric: 18mm
- External Length - Metric: 23mm
- External Width - Imperial: 0.91"
- External Diameter - Metric: -
- External Height - Imperial: 0.71"
- External Length - Imperial: 0.91"
- External Diameter - Imperial: -
| Delivery and price | |
|---|---|
| Units per pack | 100 |
| Price | 1.82 € |
| Current stock | 1000+ |
| Lead time | 30 days |
**==> picture [7 x 5] intentionally omitted <==** **----- Start of picture text -----**<br> *<br>**----- End of picture text -----**<br> **All ABL's BGA heatsinks are supplied with thermal tape** |**Model**<br>~~SS~~<br>~~a~~|**Width**<br>~~SS~~|**Length**<br>~~SS~~|**Height**<br>~~SS~~|**Pad**|**Wire Form**|**°C/W**|**°C/W**| |---|---|---|---|---|---|---|---| ||**[mm]**<br>~~SS~~|**[mm]**<br>~~SS~~|**[mm]**<br>~~SS~~|**Size**||**Natural**|**Forced**| ||~~SS~~<br>~~es~~|~~SS~~|~~SS~~|**[mm]**|||**2M/s**| |BGA-STD-010<br>~~a~~<br>~~es~~|13.5<br>~~es~~|13.0|10.0|12x12|-|27.00|14.50| |BGA-STD-015<br>~~a~~<br>~~es~~|14.0<br>~~es~~|14.0|10.0|18x18|-|26.50|14.00| |BGA-STD-020<br>~~es~~<br>~~Re~~|21.0<br>~~Re~~|21.0|9.0|20X20|-|24.50|13.00| |BGA-STD-025|23.0|23.0|6.0|20x20|-|22.00|10.50| |BGA-STD-030<br>~~ee~~|27.0|27.0|6.0|20x20|WF700/WF300|20.00|10.00| |BGA-STD-035<br>~~ee~~|26.0|26.0|8.0|20x20|WF700/WF300|18.50|9.70| |BGA-STD-040|27.0|27.0|6.0|20x20|WF700/WF300|16.00|10.20| |*BGA-STD-045|23.0|23.0|18.0|20x20|WF700/WF300|14.70|7.30| |BGA-STD-050|20.0|20.0|19.1|18x18|-|14.00|5.80| |BGA-STD-055<br>~~a es~~|25.9<br>~~es~~|23.9<br>~~es~~|10.0<br>~~es~~|20x20<br>~~es~~|WF700/WF300/WF151<br>~~es~~|14.00<br>~~es~~|6.00<br>~~es~~| |BGA-STD-060|40.0|40.0|10.0|30x30|-|13.50|7.50| |BGA-STD-065<br>~~ee~~|27.8|27.8|11.2|20x20|WF700/WF300|12.20|5.80| |BGA-STD-070<br>~~ee~~|40.0|40.0|25.0|30x30|WF700/WF300/WF151|11.50|6.00| |BGA-STD-075|40.0|40.0|23.0|18x18|WF700/WF300/WF151|11.00|5.60| |BGA-STD-080|27.0|27.0|25.0|20x20|WF700/WF300/WF151|10.50|4.50| |BGA-STD-085|30.7|30.7|14.1|20x20|WF700/WF300|10.00|5.20| |BGA-STD-090|40.0|23.9|10.0|20x20|-|10.00|5.20| |BGA-STD-095<br>~~ee~~|40.0|40.0|10.0|18x18|WF700/WF300|9.70|4.00| |BGA-STD-100<br>~~ee~~|38.1|38.1|16.0|30x30|-|9.20|4.10| |BGA-STD-105<br>~~a~~|35.0|35.0|18.0|30x30|WF700/WF300/WF151|9.20|5.20| |BGA-STD-110|35.0|35.0|25.0|30x30|WF700/WF300/WF151|8.50|5.00| |BGA-STD-115<br>~~a~~|40.0<br>~~ss~~|40.0<br>~~ss~~|18.0<br>~~ss~~|30x30<br>~~se~~|WF700/WF300/WF151<br>~~se~~|8.20|5.10| |BGA-STD-120<br>~~a~~|40.6<br>~~ss~~|38.8<br>~~ss~~|30.5<br>~~ss~~|30x30<br>~~se~~|-<br>~~se~~|7.00|3.70| ## **Thermally Conductive Aluminium Foil** All ABL's BGA heatsinks are supplied with thermal tape. |Colour|-|White| |---|---|---| |BackingType/Thickness|Mm|Aluminium Foil/0.10| |Adhesive Type/Thickness|Mm|Arylic 0.075(on clear liner side)| |Total Thickness|mm|0,27| |Adhesion|Kg/25mm|1,5| |Thermal Conductivity<br>Thermal Resistance|W/m-K<br>°C-in2/W|0,95<br>0,2| |HoldingPower@23°C|Hour|>72| |HoldingPower@130°C|Hour|>2| With excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated, on both sides, with a very high temperature resistance acrylic adhesive. Due to its high heat performance and adhesive properties this tape can also be use to attach components to a vertical heatsink and to metal enclosure surfaces.
Updated at April 29, 2026
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