BD243CG
Bipolar (BJT) Single Transistor, General Purpose, NPN, 100 V, 6 A, 65 W, TO-220, Through Hole
- Manufacturer: ONSEMI
- Product type: Single Bipolar Junction Transistors - BJT
- No. of Pins: 3Pins
- Power Dissipation: 65W
- DC Current Gain hFE: 30hFE
- Transistor Mounting: Through Hole
- Transistor Polarity: NPN
- Transition Frequency: 3MHz
- Transistor Case Style: TO-220
- DC Current Gain hFE Min: 30hFE
- Operating Temperature Max: 150°C
- Continuous Collector Current: 6A
- Collector Emitter Voltage Max: 100V
| Delivery and price | |
|---|---|
| Units per pack | 5000 |
| Price | 0.475 € |
| Current stock | 10+ |
| Lead time | 30 days |
## BD243B, BD243C (NPN), BD244B, BD244C (PNP) ## Complementary Silicon Plastic Power Transistors These devices are designed for use in general purpose amplifier and switching applications. ## **Features** - High Current Gain Bandwidth Product - These Devices are Pb−Free and are RoHS Compliant* ## **MAXIMUM RATINGS** ## **www.onsemi.com** ## **6 AMPERE POWER TRANSISTORS COMPLEMENTARY SILICON 80−100 VOLTS 65 WATTS** |**Rating**|**Symbol**|**Value**|**Unit**|||||||| |---|---|---|---|---|---|---|---|---|---|---| ||||||**PNP**|||**NPN**||| |Collector−Emitter Voltage<br>BD243B, BD244B|VCEO|80|Vdc|COLLECTOR 2, 4||||COLLECTOR 2, 4||| |BD243C, BD244C<br>Collector−Base Voltage<br>BD243B, BD244B<br>BD243C, BD244C<br>Emitter−Base Voltage|VCB<br>VEB|100<br>80<br>100<br>5.0|Vdc<br>Vdc|1<br>BASE<br>EMITTER 3<br>~~6)~~||||1<br>BASE<br>EMITTER 3||| |Collector Current − Continuous|IC|6|Adc|||||||| |Collector Current − Peak<br>Base Current<br>Total Device Dissipation<br>@ TC= 25°C<br>Derate above 25°C|ICM<br>IB<br>PD|10<br>2.0<br>65<br>0.52|Adc<br>Adc<br>W<br>W/°C||4<br>ry|||**TO−220**<br>**CASE 221A**<br>**STYLE 1**||| |Operating and Storage Junction<br>Temperature Range|TJ, Tstg|−65 to +150|°C||1 2<br>3|||||| Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. |**THERMAL CHARACTERISTICS**<br>**Characteristics**<br>~~a~~|**Symbol**<br>~~en~~|**Max**|**Unit**| |---|---|---|---| |Thermal Resistance, Junction−to−Case|R JC|1.92|°C/W| ## **MARKING DIAGRAM** BD24xy = Device Code x = 3 or 4 ~~0 |~~ y = B or C BD24xyG A = Assembly Location AY WW Y = Year WW = Work Week G = Pb−Free Package ## **ORDERING INFORMATION** *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. |**Device**|**Package**|**Shipping**| |---|---|---| |BD243BG|TO−220<br>(Pb−Free)|50 Units / Rail| |BD243CG|TO−220<br>(Pb−Free)|50 Units / Rail| |BD244BG|TO−220<br>(Pb−Free)|50 Units / Rail| |BD244CG|TO−220<br>(Pb−Free)|50 Units / Rail| Publication Order Number: **1** © Semiconductor Components Industries, LLC, 2014 **November, 2014 − Rev. 15** **BD243B/D** ## **BD243B, BD243C (NPN), BD244B, BD244C (PNP)** ## **ELECTRICAL CHARACTERISTICS** (TC = 25 ° C unless otherwise noted) |**ELECTRICAL CHARACTERISTICS**(TC= 25°C unless otherwise noted)||||| |---|---|---|---|---| |**Characteristic**|**Symbol**|**Min**|**Max**|**Unit**| |Collector−Emitter Sustaining Voltage (Note 1)<br>(IC= 30 mAdc, IB= 0)<br>BD243B, BD244B<br>BD243C, BD244C|VCEO(sus)|80<br>100|−<br>−|Vdc| |Collector Cutoff Current<br>(VCE= 60 Vdc, IB= 0)<br>BD243B, BD243C, BD244B, BD244C|ICEO|−|0.7|mAdc| |Collector Cutoff Current<br>(VCE= 80 Vdc, VEB= 0)<br>BD243B, BD244B<br>(VCE= 100 Vdc, VEB= 0)<br>BD243C, BD244C|ICES|−<br>−|400<br>400|�Adc| |Emitter Cutoff Current<br>(VBE= 5.0 Vdc, IC= 0)|IEBO|−|1.0|mAdc| |**ON CHARACTERISTICS**(Note 1)||||| |DC Current Gain<br>(IC= 0.3 Adc, VCE= 4.0 Vdc)<br>(IC= 3.0 Adc, VCE= 4.0 Vdc)|hFE|30<br>15|−<br>−|−| |Collector−Emitter Saturation Voltage<br>(IC= 6.0 Adc, IB= 1.0 Adc)|VCE(sat)|−|1.5|Vdc| |Base−Emitter On Voltage<br>(IC= 6.0 Adc, VCE= 4.0 Vdc)|VBE(on)|−|2.0|Vdc| |**DYNAMIC CHARACTERISTICS**||||| |Current−Gain − Bandwidth Product (Note 2)<br>(IC= 500 mAdc, VCE= 10 Vdc, ftest= 1.0 MHz)|fT|3.0|−|MHz| |Small−Signal Current Gain<br>(IC= 0.5 Adc, VCE= 10 Vdc, f = 1.0 kHz)|hfe|20|−|−| Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Pulse Test: Pulsewidth ≤ 300 � s, Duty Cycle ≤ 2.0%. 2. fT = hfe • ftest **==> picture [238 x 170] intentionally omitted <==** **----- Start of picture text -----**<br> 80<br>60<br>40<br>20<br>0<br>0 20 40 60 80 100 120 140 160<br>TC, CASE TEMPERATURE (°C)<br>PD, POWER DISSIPATION (WATTS)<br>**----- End of picture text -----**<br> **Figure 1. Power Derating** **www.onsemi.com** **2** **BD243B, BD243C (NPN), BD244B, BD244C (PNP)** **==> picture [490 x 611] intentionally omitted <==** **----- Start of picture text -----**<br> VCC 2.0<br>- 30 V 1.0 TJ = 25°C<br>+ 11 V 25 �s RC 0.70.5 IVCCC/IB = 30 V = 10<br>SCOPE<br>0 RB 0.3<br>0.2 tr<br>- 9.0 V<br>51 D1 0.1<br>DUTY CYCLE = 1.0%tr, tf � 10 ns - 4 V 0.07 td @ VBE(off) = 5.0 V<br>0.05<br>RB AND RC VARIED TO OBTAIN DESIRED CURRENT LEVELS<br>0.03<br>D1 MUST BE FAST RECOVERY TYPE eg.<br>0.02<br>�1N5825 USED ABOVE IB � 100 mA 0.06 0.1 0.2 0.4 0.6 1.0 2.0 4.0 6.0<br>�MSD6100 USED BELOW IB � 100 mA IC, COLLECTOR CURRENT (AMP)<br>Figure 2. Switching Time Test Circuit Figure 3. Turn−On Time<br>1.0<br>0.7 D = 0.5<br>0.5<br>0.3<br>0.2<br>0.2<br>0.1<br>0.1 0.05 P(pk) R�JC(max) = 1.92°C/W<br>0.07 0.02 D CURVES APPLY FOR POWER<br>0.05 PULSE TRAIN SHOWN<br>0.030.02 0.01 SINGLE PULSE t 1 t 2 SINGLE PULSE T READ TIME AT J(pk) - T C = P (pk)t1 R� JC(t)<br>DUTY CYCLE, D = t 1 /t 2<br>0.010.01 0.02 0.03 0.05 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200 300 500 1000<br>t, TIME OR PULSE WIDTH (ms)<br>Figure 4. Thermal Response<br>10 There are two limitations on the power handling ability of<br>5.0 0.5 ms a transistor: average junction temperature and second<br>3.0 breakdown. Safe operating area curves indicate IC − VC − V− VCE<br>1.0 limits of the transistor that must be observed for reliable<br>2.0 TJ = 150°C 5.0 msms operation, i.e., the transistor must not be subjected to greaterdissipation than the curves indicate.dissipation than the curves indicate.<br>1.0 SECOND BREAKDOWN LIMITED The data of Figure 5 is based on TJ(pk) = 150°C: TCJ(pk) = 150°C: TC = 150°C: TC°C: TCC: TCC is<br>BONDING WIRE LIMITED<br>0.5 THERMAL LIMITATION @ TC = 25°C variable depending on conditions. Second breakdown pulse<br>0.3 CURVES APPLY BELOW RATED VCEO ≤limits are valid for duty cycles to 10% provided T 150°C, TJ(pk) may be calculated from the data in Figure 4.J(pk)limits are valid for duty cycles to 10% provided T 150°C, TJ(pk) may be calculated from the data in Figure 4.J(pk) 150°C, TJ(pk) may be calculated from the data in Figure 4.J(pk)°C, TJ(pk) may be calculated from the data in Figure 4.J(pk)C, TJ(pk) may be calculated from the data in Figure 4.J(pk)J(pk) may be calculated from the data in Figure 4.J(pk) may be calculated from the data in Figure 4.J(pk)J(pk)<br>0.2 At high case temperatures, thermal limitations will reduce<br>BD243B, BD244B<br>BD243C, BD244C the power that can be handled to values less than the<br>0.15.0 10 20 40 60 80 100 limitations imposed by second breakdown.<br>VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)<br>μ<br>t, TIME (��s)<br>r(t) EFFECTIVE TRANSIENT<br>THERMAL RESISTANCE (NORMALIZED)<br>IC, COLLECTOR CURRENT (AMP)<br>**----- End of picture text -----**<br> There are two limitations on the power handling ability of a transistor: average junction temperature and second breakdown. Safe operating area curves indicate IC − VC − V− VCE limits of the transistor that must be observed for reliable operation, i.e., the transistor must not be subjected to greaterdissipation than the curves indicate.dissipation than the curves indicate. The data of Figure 5 is based on TJ(pk) = 150°C: TCJ(pk) = 150°C: TC = 150°C: TC°C: TCC: TCC is variable depending on conditions. Second breakdown pulse ≤limits are valid for duty cycles to 10% provided T 150°C, TJ(pk) may be calculated from the data in Figure 4.J(pk)limits are valid for duty cycles to 10% provided T 150°C, TJ(pk) may be calculated from the data in Figure 4.J(pk) 150°C, TJ(pk) may be calculated from the data in Figure 4.J(pk)°C, TJ(pk) may be calculated from the data in Figure 4.J(pk)C, TJ(pk) may be calculated from the data in Figure 4.J(pk)J(pk) may be calculated from the data in Figure 4.J(pk) may be calculated from the data in Figure 4.J(pk)J(pk) At high case temperatures, thermal limitations will reduce the power that can be handled to values less than the limitations imposed by second breakdown. **Figure 5. Active Region Safe Operating Area** **www.onsemi.com** **3** **BD243B, BD243C (NPN), BD244B, BD244C (PNP)** **==> picture [493 x 610] intentionally omitted <==** **----- Start of picture text -----**<br> 5.0 300<br>3.0 TJ = 25°C TJ = 25°C<br>2.0 VCC = 30 V 200<br>ts IC/IB = 10<br>1.0 IB1 = IB2 Cib<br>0.7<br>0.5 100<br>0.3 70<br>0.2 Cob<br>tf<br>50<br>0.1<br>0.07<br>0.05 30<br>0.06 0.1 0.2 0.4 0.6 1.0 2.0 4.0 6.0 0.5 1.0 2.0 3.0 5.0 10 20 30 50<br>IC, COLLECTOR CURRENT (AMP) VR, REVERSE VOLTAGE (VOLTS)<br>Figure 6. Turn-Off Time Figure 7. Capacitance<br>500 2.0<br>300 VCE = 2.0 V TJ = 25°C<br>200 TJ = 150°C<br>1.6<br>100 IC = 1.0 A 2.5 A 5.0 A<br>70 25°C 1.2<br>50<br>30 0.8<br>20 -�55°C<br>10 0.4<br>7.0<br>5.0 0<br>0.06 0.1 0.2 0.3 0.4 0.6 1.0 2.0 4.0 6.0 10 20 30 50 100 200 300 500 1000<br>IC, COLLECTOR CURRENT (AMP) IB, BASE CURRENT (mA)<br>Figure 8. DC Current Gain Figure 9. Collector Saturation Region<br>2.0 +�2.5<br>TJ = 25°C +�2.0 *APPLIES FOR IC/IB ≤ 5.0<br>1.6 +�1.5<br>+�1.0<br>VBE(sat) @ IC/IB = 10 + 25°C to + 150°C<br>1.2 +�0.5 *�VC FOR VCE(sat)<br>0<br>VBE @ VCE = 4.0 V - 55°C to + 25°C<br>0.8 -�0.5<br>-�1.0 + 25°C to + 150°C<br>0.4 VCE(sat) @ IC/IB = 10 -�1.5 �VB FOR VBE - 55°C to + 25°C<br>-�2.0<br>0 -�2.5<br>0.06 0.1 0.2 0.3 0.4 0.6 1.0 2.0 3.0 4.0 6.0 0.06 0.1 0.2 0.3 0.5 1.0 2.0 3.0 0.4 0.6<br>IC, COLLECTOR CURRENT (AMPS) IC, COLLECTOR CURRENT (AMP)<br>μ<br>t, TIME (��s)<br>CAPACITANCE (pF)<br>hFE, DC CURRENT GAIN<br>VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)<br>C)°<br>V, VOLTAGE (VOLTS)<br>V, TEMPERATURE COEFFICIENTS (mV/<br>θ<br>**----- End of picture text -----**<br> **Figure 10. “On” Voltages** **Figure 11. Temperature Coefficients** **www.onsemi.com** **4** **BD243B, BD243C (NPN), BD244B, BD244C (PNP)** **==> picture [240 x 173] intentionally omitted <==** **----- Start of picture text -----**<br> 10 [3]<br>V CE = 30 V<br>10 [2]<br>TJ = 150 ° C<br>10 [1] 100°C<br>25°C<br>10 [0]<br>10 [-1] IC = ICES<br>10 [-�2] REVERSE FORWARD<br>10 [-�3]<br>-�0.3 -�0.2 -�0.1 0 +�0.1 +�0.2 +�0.3 +�0.4 +�0.5 +�0.6 +�0.7<br>VBE, BASE‐EMITTER VOLTAGE (VOLTS)<br>μ<br>, COLLECTOR CURRENT (��A)<br>IC<br>**----- End of picture text -----**<br> **Figure 12. Collector Cut-Off Region** **==> picture [238 x 184] intentionally omitted <==** **----- Start of picture text -----**<br> 10 [M]<br>VCE = 30 V<br>1.0 [M] IC = 10 x ICES<br>100 [k] IC = 2 x ICES<br>10 [k] IC ≈ ICES<br>1.0 [k]<br>(TYPICAL ICES VALUES<br>OBTAINED FROM FIGURE 12)<br>0.1 [k]<br>20 40 60 80 100 120 140 160<br>TJ, JUNCTION TEMPERATURE (°C)<br>RBE, EXTERNAL BASE-EMITTER RESISTANCE (OHMS)<br>**----- End of picture text -----**<br> **Figure 13. Effects of Base−Emitter Resistance** **www.onsemi.com** **5** **BD243B, BD243C (NPN), BD244B, BD244C (PNP)** ## **PACKAGE DIMENSIONS** **TO−220** CASE 221A−09 ISSUE AH **==> picture [233 x 185] intentionally omitted <==** **----- Start of picture text -----**<br> SEATING<br>−T− PLANE<br>B F C<br>T S<br>4<br>Q A<br>1 2 3 U<br>H<br>K<br>Z<br>L R<br>THe V J |<br>G<br>D<br>;<br>N<br>**----- End of picture text -----**<br> - NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. |**DIM**|**INCHES**|**INCHES**|**MILLIMETERS**|**MILLIMETERS**| |---|---|---|---|---| ||**MIN**<br>**INCHES**|**MAX**<br>**INCHES**|**MIN**<br>**MILLIMETERS**|**MAX**<br>**MILLIMETERS**| |**DIM**<br>**A**|**MIN**<br>0.570|**MAX**<br>0.620|**MIN**<br>14.48|**MAX**<br>15.75| |**B**|0.380|0.415|9.66|10.53| |**B**<br>**C**|0.380<br>0.160|0.415<br>0.190|9.66<br>4.07|10.53<br>4.83| |**D**|0.025|0.038|0.64|0.96| |**F**|0.142|0.161|3.61|4.09| |**G**|0.095|0.105|2.42|2.66| |**H**|0.110|0.161|2.80|4.10| |**J**|0.014|0.024|0.36|0.61| |**K**|0.500|0.562|12.70|14.27| |**L**|0.045|0.060|1.15|1.52| |**N**|0.190|0.210|4.83|5.33| |**Q**|0.100|0.120|2.54|3.04| |**Q**<br>**R**<br>SSEEe|0.100<br>0.080<br>SSEEe|0.120<br>0.110<br>SSEEe|2.54<br>2.04<br>SSEEe|3.04<br>2.79<br>SSEEe| |**S**<br>SSEEe|0.045<br>SSEEe|0.055<br>SSEEe|1.15<br>SSEEe|1.39<br>SSEEe| |**S**<br>**T**<br>SSEEe|0.045<br>0.235<br>SSEEe|0.055<br>0.255<br>SSEEe|1.15<br>5.97<br>SSEEe|1.39<br>6.47<br>SSEEe| |**U**<br>SSEEe|0.000<br>SSEEe|0.050<br>SSEEe|0.00<br>SSEEe|1.27<br>SSEEe| |**V**<br>SSEEe|0.045<br>SSEEe|---<br>SSEEe|1.15<br>SSEEe|---<br>SSEEe| |**Z**<br>SSEEe|---<br>SSEEe|0.080<br>SSEEe|---<br>SSEEe|2.04<br>SSEEe| ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. ## **PUBLICATION ORDERING INFORMATION** ## **LITERATURE FULFILLMENT** : Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA **Phone** : 303−675−2175 or 800−344−3860 Toll Free USA/Canada **Fax** : 303−675−2176 or 800−344−3867 Toll Free USA/Canada **Email** : orderlit@onsemi.com **N. American Technical Support** : 800−282−9855 Toll Free USA/Canada **ON Semiconductor Website** : **www.onsemi.com** **Europe, Middle East and Africa Technical Support: Order Literature** : http://www.onsemi.com/orderlit Phone: 421 33 790 2910 **Japan Customer Focus Center** For additional information, please contact your local Phone: 81−3−5817−1050 Sales Representative **www.onsemi.com** **BD243B/D** **6**
Updated at February 9, 2023
onsemi is a premier global supplier of intelligent power and sensing technologies, driving disruptive innovations across the automotive, industrial, and cloud infrastructure markets. Recognized for their commitment to sustainability and reliable supply chains, the company accelerates advancements in vehicle electrification, industrial automation, and 5G networks by solving the industry's most complex design challenges. At the core of their portfolio is an industry-leading selection of discrete semiconductors. This extensive range features thousands of high-performance bipolar transistors, single and dual MOSFETs, and a comprehensive array of diodes, including Zener, Schottky, and fast-recovery rectifiers. Engineered for superior thermal performance and energy efficiency, these foundational components are critical for demanding power conversion, switching, and signal conditioning applications. Beyond essential discretes, onsemi provides a robust suite of advanced power management and circuit protection solutions. Their lineup includes intelligent power modules, single IGBTs, and transient voltage suppression (TVS) diodes designed to safeguard sensitive circuitry. Complimented by integrated passive filters, AC/DC LED driver ICs, and specialized sub-2.4GHz RF transceivers, onsemi equips engineers with the scalable, high-quality technologies needed to build a cleaner, smarter, and more connected world.
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