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Final Product Change Notification  201811008F01<br>Issue Date:          10-Apr-2019<br>Effective Date:     23-Jul-2019<br>Dear  Patricio Gomez Bello ,<br>Here's your personalized quality information<br>concerning products Premier Farnell PLC purchased<br>from Nexperia.<br>For detailed information we invite you to view this<br>notification online<br>\<br>Quality<br>Change Category<br>[X] Wafer Fab Process   [ ] Assembly [ ] Product Marking   [ ] Test  [ ] Design<br>Process   Location<br>[X] Wafer Fab Materials   [X]  [ ] Mechanical  [ ]Test  [ ] Errata<br>Assembly  Specification   Process<br>Materials<br>[ ] Wafer Fab Location   [ ] Assembly [ ]  [ ] Test  [ ] Electrical<br>Location   Packing/Shipping/Labeling Equipment   spec./Test<br>coverage<br>**----- End of picture text -----**<br>


Release of 8 inch wafer diameter for generalpurpose bipolar transistors 

## **Details of this Change** 

Release of 8 inch wafer diameter for general-purpose bipolar transistors. 

Old products: Production using 6 inch wafer diameter Changed products: Production using 6 and 8 inch wafer diameter 

In addition the thickness of the top side metallization for parts of the affected bipolar transistors will be adapted from 1.4 to 1.5µm for standardization reasons. Selected types have a change in die pitch size along with release of 8 inch wafer diameter. Some product types in SOT323 package have a release of lead frame design version SOT323 R1. Please refer to the Self Qualification Report for details and list of affected product types. 

Production on 8 inch wafer diameter implies the use of the respective 8 inch wafer process technology. **Why do we Implement this Change** To increase flexibility and volume ramp-up. 

## **Identification of Affected Products** 

The 8 inch products can be identified by a marker on the die surface. Changed products can be identified by date code after implementation. 

## **Product Availability** 

**Sample Information** Samples are available upon request Latest sample request date for PCN samples is 10-May-2019. **Production** Planned first shipment 01-Aug-2019 **Impact** 

No impact to the products' functionality anticipated. **Data Sheet Revision** No impact to existing datasheet **Disposition of Old Products** Existing inventory will be shipped until depleted. Supply using 6 inch wafer will be continued in parallel to 8 inch wafer production. 

**Related Notifications** 

**Notification Issue Date Effective DateTitle** 201110021F01 15-Nov13-Feb-2012 Release of 8 inch wafer diameter and change of die pitch size for 2011 PMBT2222A family 201208006F01 05-Sep03-Dec-2012 Release of 8 inch wafer diameter for general purpose NPN / 2012 PNP transistors 201602003F01 22-May03-Sep-2016 Release of 8 inch wafer diameter for low VCEsat (BISS) 2016 transistors 201712005F01 30-Apr-2018 29-Jul-2018 Change of lead frame version in SOT323 package 

## **Additional information** 

Affected products and sales history information: see attached file Self qualification: view online Additional documents: view online 

## **Timing and Logistics** 

Your acknowledgement of this change, conform JEDEC J-STD-046, is expected till 10-May-2019. Lack of acknowledgement of the PCN constitutes acceptance of the change. 

**Contact and Support** 

For all inquiries regarding the ePCN tool application or access issues, please contact Nexperia "Global " Quality Support Team . 

For all Quality Notification content inquiries, please contact your local Nexperia Sales Support team. 

For specific questions on this notice or the products affected please contact our specialist directly: **e-mail address** PCN-Bipolar.Discretes@nexperia.com 

At Nexperia B.V. we are constantly striving to improve our product and processes to ensure they reach the highest possible Quality Standards. 

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