BCR20RM-30LA#B00

To our customers, 

## Old Com an Name in Catalo s and Other Documents p y g 

On April 1[st] , 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. 

Renesas Electronics website: http://www.renesas.com 

April 1[st] , 2010 Renesas Electronics Corporation 

Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. 

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Notice<br>1.  All information included in this document is current as of the date this document is issued. Such information, however, is<br>subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please<br>confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to<br>additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.<br>2.  Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights<br>of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.<br>No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights<br>of Renesas Electronics or others.<br>3.  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## **BCR20RM-30LA** 

## Triac 

Medium Power Use 

REJ03G1725-0100 Rev.1.00 Jul 23, 2008 

## **Features** 

- IT (RMS) : 20 A 

- VDRM : 1500 V 

- IFGTI, IRGTI, IRGT III : 50 mA 

- Viso : 2000 V 

- Insulated Type 

- Planar Passivation Type 

## **Outline** 

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RENESAS Package code: PRSS0003ZA-A<br>(Package name: TO-3PFM)<br>2<br>1.  T1 Terminal<br>2.  T2 Terminal<br>3.  Gate Terminal<br>3<br>1<br>1<br>2<br>3<br>**----- End of picture text -----**<br>


## **Applications** 

Motor and heater 

## **Maximum Ratings** 

|**Maximum Ratings**||||
|---|---|---|---|
|**Parameter**|**Symbol**|**Voltage class**|**Unit**|
|||30||
|Repetitivepeak off-state voltageNote1|VDRM|1500|V|
|Non-repetitivepeak off-state voltageNote1|VDSM|1600|V|



REJ03G1725-0100  Rev.1.00  Jul 23, 2008 Page 1 of 6 

**BCR20RM-30LA** 

|**Parameter**|**Symbo**<br>**l**|**Ratings**|**Unit**|**Conditions**|
|---|---|---|---|---|
|RMS on-state current|IT (RMS)|20|A|Commercial frequency, sine full wave<br>360° conduction, Tc = 83°C|
|Surge on-state current|ITSM|200|A|50 Hz sinewave 1 full cycle, peak value,<br>non-repetitive|
|I2t for fusing|I2t|200|A2s|Value corresponding to 1 cycle of half<br>wave 50 Hz, surge on-state current|
|Peakgatepower dissipation|PGM|5|W||
|Averagegatepower dissipation|PG(AV)|0.5|W||
|Peakgate voltage|VGM|10|V||
|Peakgate current|IGM|3|A||
|Junction temperature|Tj|– 40 to +125|°C||
|Storage temperature|Tstg|– 40 to +125|°C||
|Mass|—|5.2|g|Typical value|
|Isolation voltage|Viso|2000|V|Ta = 25°C, AC 1 minute,<br>T1·T2·G terminal to case|



Notes: 1. Gate open. 

## **Electrical Characteristics** 

|**Parameter**|**Parameter**|**Symbol**|**Min.**|**Typ. **|**Max.**|**Unit**|**Test conditions**|
|---|---|---|---|---|---|---|---|
|Repetitivepeak off-state current||IDRM|—|—|10|mA|Tj= 125°C, VDRMapplied|
|On-state voltage||VTM|—|—|1.6|V|Tc = 25°C, ITM= 30 A,<br>Instantaneous measurement|
|Gate trigger voltageNote2|Ι|VFGTΙ|—|—|3.0|V|Tj = 25°C, VD= 6 V, RL= 6Ω,<br>RG= 330Ω|
||ΙΙ|VRGTΙ|—|—|3.0|V||
||ΙΙΙ|VRGTΙΙΙ|—|—|3.0|V||
|Gate trigger currentNote2|Ι|IFGTΙ|—|—|50|mA|Tj = 25°C, VD= 6 V, RL= 6Ω,<br>RG= 330Ω|
||ΙΙ|IRGTΙ|—|—|50|mA||
||ΙΙΙ|IRGTΙΙΙ|—|—|50|mA||
|Gate non-trigger voltage||VGD|0.2|—|—|V|Tj= 125°C, VD= 1/2 VDRM|
|Thermal resistance||Rth(j-c)|—|—|1.6|°C/W|Junction to caseNote3|
|Critical-rate of rise of off-state<br>commutatingvoltageNote4||(dv/dt)c|20|—|—|V/µs|Tj = 125°C|



Notes: 2. Measurement using the gate trigger characteristics measurement circuit. 

3. The contact thermal resistance Rth (c-f) in case of greasing is 0.4°C/W. 

4. Test conditions of the critical-rate of rise of off-state commutating voltage is shown in the table below. 

|**Test conditions**|**Commutating voltage and current waveforms**<br>**(inductive load)**|
|---|---|
|1. Junction temperature<br>Tj = 125°C<br>2. Rate of decay of on-state commutating current<br>(di/dt)c = –10 A/ms<br>3. Peak off-state voltage<br>VD= 400 V|Supply Voltage<br>Time<br>Time<br>Time<br>Main Current<br>Main Voltage<br>(di/dt)c<br>VD<br>(dv/dt)c|



REJ03G1725-0100  Rev.1.00  Jul 23, 2008 Page 2 of 6 

**BCR20RM-30LA** 

## **Performance Curves** 

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Maximum On-State Characteristics Rated Surge On-State Current<br>10 [3] 240<br>200<br>Tj = 25°C<br>10 [2] 160<br>Tj = 125°C<br>120<br>10 [1] 80<br>40<br>10 [0] 0<br>0.5 1.0 1.5 2.0 2.5 3.0 3.5 10 [0] 2 3 5 7 10 [1] 2 3 5 7 10 [2]<br>On-State Voltage  (V) Conduction Time  (Cycles at 50 Hz)<br>Gate Trigger Current vs.<br>Gate Characteristics  (I, II and III) Junction Temperature<br>10 [2] 10 [3]<br>Typical Example<br>VFGM = 10 V<br>10 [1] VGT = 3.0 V PGM = 5 W IRGT III<br>IRGT I<br>P =<br>10 [0] G(AV) 0.5 W IFGM = 3 A 10 [2] IFGT I<br>IGT = 50 mA<br>10 [–1] VGD = 0.2 V<br>10 [–2] 10 [1]<br>10 [1] 10 [2] 10 [3] 10 [4] -60 -40 -20 0 20 40 60 80 100 120 140<br>Gate Current  (mA) Junction Temperature  (°C)<br>Gate Trigger Voltage vs. Maximum Transient Thermal Impedance<br>Junction Temperature Characteristics (Junction to case)<br>10 [2] 10 [3] 10 [4]<br>10 [3] 2.0<br>Typical Example<br>1.8<br>1.6<br>1.4<br>1.2<br>10 [2] 1.0<br>0.8<br>0.6<br>1.4<br>1.0<br>10 [1] 0<br>-60 -40 -20 0 20 40 60 80 100 120140<br>10 [-1] 10 [0] 10 [1] 10 [2]<br>Junction Temperature   (°C) Conduction Time (Cycles at 50 Hz)<br>On-State Current  (A)<br>Surge On-State Current  (A)<br> 100 (%)<br>×<br>Gate Voltage  (V)<br>Gate Trigger Current  (Tj = t°C)<br>Gate Trigger Current  (Tj = 25°C)<br> 100 (%)<br>×<br>Transient Thermal Impedance  (°C/W)<br>Gate Trigger Voltage  (Tj = t°C)<br>Gate Trigger Voltage  (Tj = 25°C)<br>**----- End of picture text -----**<br>


REJ03G1725-0100  Rev.1.00  Jul 23, 2008 Page 3 of 6 

**BCR20RM-30LA** 

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Maximum On-State Power Dissipation<br>40<br>30 360° Conduction<br>Resistive,<br>inductive loads<br>20<br>10<br>0<br>0 5 10 15 20 25 30<br>RMS On-State Current  (A)<br>Allowable Ambient Temperature vs.<br>RMS On-State Current<br>160<br>All fins are black painted<br>140 aluminum and greased<br>Natural convection<br>120<br>100<br>160  160   t2.3<br>80<br>120  120   t2.3<br>60<br>100  100   t2.3<br>40<br>20<br>0<br>0 5 10 15 20 25 30<br>RMS On-State Current  (A)<br>Repetitive Peak Off-State Current vs.<br>Junction Temperature<br>10 [5]<br>Typical Example<br>10 [4]<br>10 [3]<br>10 [2]<br>-60 -40 -20 0 20 40 60 80 100 120140<br>Junction Temperature   (°C)<br>On-State Power Dissipation  (W)<br>Ambient Temperature  (°C)<br> 100 (%)<br>×<br>Repetitive Peak Off-State Current (Tj = t°C)<br>Repetitive Peak Off-State Current (Tj = 25°C)<br>**----- End of picture text -----**<br>


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Allowable Case Temperature vs.<br>RMS On-State Current<br>160<br>Curves apply regardless<br>140 of conduction angle<br>120<br>100<br>80<br>60<br>40<br>360° Conduction<br>20 Resistive,<br>inductive loads<br>0<br>0 5 10 15 20 25 30<br>RMS On-State Current  (A)<br>Allowable Ambient Temperature vs.<br>RMS On-State Current<br>160<br>Natural convection<br>140 No Fins<br>Curves apply regardless<br>120 of conduction angle<br>Resistive, inductive loads<br>100<br>80<br>60<br>40<br>20<br>0<br>0 0.5 1 1.5 2 2.5 3 3.5 4<br>RMS On-State Current  (A)<br>Holding Current vs.<br>Junction Temperature<br>10 [3]<br>Typical Example<br>10 [2]<br>10 [1]<br>-60 -40 -20 0 20 40 60 80 100 120140<br>Junction Temperature  (°C)<br>Case Temperature  (°C)<br>Ambient Temperature  (°C)<br> 100 (%)<br>×<br>Holding Current (Tj = t°C)<br>Holding Current (Tj = 25°C)<br>**----- End of picture text -----**<br>


REJ03G1725-0100  Rev.1.00  Jul 23, 2008 Page 4 of 6 

**BCR20RM-30LA** 

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Latching Current vs.<br>Junction Temperature<br>10 [3]<br>Distribution T2 [+] , G [–]<br>Typical Example<br>10 [2]<br>10 [1]<br>T2 [–] , G [–]<br>Typical  T2 [+] , G [+]<br>Example Typical Example<br>10 [0]<br>-60 -40 -20 0 20 40 60 80 100 120140<br>Junction Temperature  (°C)<br>Breakover Voltage vs.<br>Rate of Rise of Off-State Voltage<br>160<br>Typical Example<br>140 Tj = 125°C<br>120<br>100<br>80<br>III Quadrant<br>60<br>40<br>20 I Quadrant<br>0<br>10 [1] 10 [2] 10 [3] 10 [4]<br>Rate of Rise of Off-State Voltage  (V/µs)<br>Latching Current  (mA)<br> 100 (%)<br>×<br>s) s)<br>µ µ<br>Breakover Voltage  (dv/dt = xV/ Breakover Voltage  (dv/dt = 1V/<br>**----- End of picture text -----**<br>


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Breakover Voltage vs.<br>Junction Temperature<br>160<br>Typical Example<br>120<br>80<br>40<br>0<br>-60 -40 -20 0 20 40 60 80 100 120140<br>Junction Temperature  (°C)<br> 100 (%)<br>×<br>Breakover Voltage  (Tj = t°C)<br>Breakover Voltage  (Tj = 25°C)<br>**----- End of picture text -----**<br>


Commutation Characteristics 

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10 [2]<br>Typical Example<br>Tj = 125°C<br>IT = 4 A<br>τ = 500µs<br>VD = 200V III Quadrant<br>f = 3Hz<br>Minimum<br>Characteristics<br>10 [1] Value<br>Main Voltage Time I Quadrant<br>(dv/dt)c VD<br>Main Current<br>IT (di/dt)c<br>τ Time<br>10 [0]<br>10 [0] 10 [1] 10 [2] 10 [3]<br>Rate of Decay of On-State<br>Commutating Current  (A/ms)<br>s)<br>µ<br>Commutating Voltage  (V/<br>Critical Rate of Rise of Off-State<br>**----- End of picture text -----**<br>


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Gate Trigger Current vs.<br>Gate Current Pulse Width<br>10 [3]<br>Typical Example<br>IRGT III<br>IFGT I<br>IRGT I<br>10 [2]<br>10 [1]<br>10 [0] 10 [1] 10 [2]<br>Gate Current Pulse Width  (µs)<br> 100 (%)<br>×<br>Gate Trigger Current  (tw) Gate Trigger Current  (DC)<br>**----- End of picture text -----**<br>


REJ03G1725-0100  Rev.1.00  Jul 23, 2008 Page 5 of 6 

**BCR20RM-30LA** 

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Gate Trigger Characteristics Test Circuits<br>6Ω 6Ω<br>A A<br>6V 6V<br>330Ω 330Ω<br>V V<br>Test Procedure  I Test Procedure  II<br>6Ω<br>A<br>6V<br>V 330Ω<br>Test Procedure  III<br>**----- End of picture text -----**<br>


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Recommended Circuit Values Around The Triac<br>**----- End of picture text -----**<br>


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Load<br>C1<br>R1 C0 R0<br>C1 = 0.1 to 0.47µF C0 = 0.1µF<br>R1 = 47 to 100Ω R0 = 100Ω<br>**----- End of picture text -----**<br>


REJ03G1725-0100  Rev.1.00  Jul 23, 2008 Page 6 of 6 

**BCR20RM-30LA** 

## **Package Dimensions** 

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Package Name JEITA Package Code RENESAS Code Previous Code MASS[Typ.]<br>TO-3PFM SC-93 PRSS0003ZA-A TO-3PFM / TO-3PFMV 5.2g Unit: mm<br>15.6 ± 0.3 5.5 ± 0.3<br>φ3.2 [+ 0.4] – 0.2<br>3.2 ± 0.3<br>4.0 ± 0.3<br>2.6 1.6<br>0.86 0.86<br>0.66 + 0.2– 0.1 0.9 + 0.2– 0.1<br>5.45 ± 0.5 5.45 ± 0.5<br>5.0 ± 0.3<br>19.9 ± 0.3<br>2.0 ± 0.3 2.7 ± 0.3 5.0 ± 0.3<br>21.0 ± 0.5<br>**----- End of picture text -----**<br>


## **Order Code** 

|**Lead form**|**Standard packing**|**Quantity**|<br>**Standard order code**|**Standard order**<br>**code example**|
|---|---|---|---|---|
|Straight type|Magazine(Tube)|3|0<br>Type name|BCR20RM-30LA|
|Note : Please confirm the specification about the shipping in detail.|||||



REJ03G1725-0100  Rev.1.00  Jul 23, 2008 Page 7 of 6 

Sales Strategic Planning Div.    Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan 

## Notes: 

1.   This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of Renesas or any third party with respect to the information in this document. 

2.   Renesas shall have no liability  for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including, but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples. 

3.   You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws and regulations, and procedures required by such laws and regulations. 

4.   All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this document is issued. Such information, however,  is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document, please confirm the latest product information  with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com ) 

5.   Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document. 

6.   When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability of such information to the intended application.  Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products. 

7.   With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above. 

8.   Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below: 

- (1) artificial life support devices or systems 

- (2) surgical implantations 

- (3) healthcare intervention (e.g., excision, administration of medication, etc.) 

- (4) any other purposes that pose a direct threat to human life 

- Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all damages arising out of such applications. 

9.   You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages arising out of the use of Renesas products beyond such specified ranges. 

10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other applicable measures.  Among others, since the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 

11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products. Renesas shall have no liability for damages arising out of such detachment. 

12. This document may not be reproduced or duplicated, in any form, in  whole or in part, without prior written approval from Renesas. 

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© 2008. Renesas Technology Corp., All rights reserved.  Printed in Japan. Colophon .7.2