BC63916-D27Z

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December 2013<br>**----- End of picture text -----**<br>


## **BC63916 NPN Epitaxial Silicon Transistor** 

## **Features** 

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• Switching and Amplifier Applications<br>**----- End of picture text -----**<br>


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1 TO-92<br>1. Emitter   2. Collector   3. Base<br>**----- End of picture text -----**<br>


## **Ordering Information** 

|**Part Number**|**Top Mark**|**Package**|**Packing Method**|
|---|---|---|---|
|BC63916_D74Z|BC639-16|TO-92 3L|Ammo|
|BC63916_D27Z|BC639-16|TO-92 3L|Tape and Reel|



## **Absolute Maximum Ratings**[(1)] 

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted. 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|VCER|Collector-Emitter Voltage at RBE= 1 kΩ|100|V|
|VCES|Collector-Emitter Voltage|100|V|
|VCEO|Collector-Emitter Voltage|80|V|
|VEBO|Emitter-Base Voltage|5|V|
|IC|Collector Current|1|A|
|TJ, TSTG|Operating and Storage Junction Temperature Range|-55 to 150|°C|



## **Note:** 

1. Pulse test: pulse width ≤ 300 μ s, duty cycle ≤ 2.0%. 

© 2003 Fairchild Semiconductor Corporation BC63916 Rev. 1.1.0 

www.fairchildsemi.com 

1 

## **Thermal Characteristics**[(2)] 

Values are at TA = 25°C unless otherwise noted. **Symbol Parameter Value Unit** Power Dissipation 830 mW PD Derate Above TA = 25°C 6.6 mW/°C R θ JA Thermal Resistance, Junction to Ambient 150 ° C/W ~~<==~~ **Note:** 2. PCB size: FR-4 76 x 114 x 0.6T mm[3] (3.0 inch x 4.5 inch x 0.062 inch) with minimum land pattern size. 

## **Electrical Characteristics** 

Values are at TA = 25°C unless otherwise noted. **Symbol Parameter Conditions Min. Typ. Max. Unit** BVCBO Collector-Base Breakdown Voltage IC = 100 μ A, IE = 0 100 V BVCEO Collector-Emitter Breakdown Voltage IC = 10 mA, IB = 0 80 V BVEBO Emitter-Base Breakdown Voltage IE = 10 μ A, IC = 0 5.0 V ICBO Collector Cut-Off Current VCB = 30 V, IE = 0 100 nA IEBO Emitter Cut-Off Current VEB = 5 V, IC = 0 10 μ A hFE1 VCE = 2 V, IC = 5 mA 25 hFE2 DC Current Gain VCE = 2 V, IC = 150 mA 100 250 hFE3 VCE = 2 V, IC = 500 mA 25 VCE(sat) Collector-Emitter Saturation Voltage IC = 500 mA, IB = 50 mA 0.5 V VBE(on) Base-Emitter On Voltage VCE = 2 V, IC = 500 mA 1 V fT Current Gain Bandwidth Product Vf = 50 MHzCE = 5 V, IC = 10 mA, 100 MHz ~~au~~ © 2003 Fairchild Semiconductor Corporation BC63916 Rev. 1.1.0 2 

www.fairchildsemi.com 

## **Physical Dimension** 

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                      TO-92<br>**----- End of picture text -----**<br>


## **Figure 1. 3-LEAD, TO-92, MOLDED 0.200 IN-LINE SPACING LD FORM (J61Z OPTION) (ACTIVE)** 

_Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products._ 

_Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/dwg/ZA/ZA03F.pdf ._ 

_For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area: http://www.fairchildsemi.com/packing_dwg/PKG-ZA03F.pdf._ 

© 2003 Fairchild Semiconductor Corporation BC63916 Rev. 1.1.0 

www.fairchildsemi.com 

3 

## **TRADEMARKS** 

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. 

AccuPower ™ F-PFS ™ Sync-Lock™ AX-CAP[®] * FRFET[® ] ® BitSiC ™ Global Power ResourceSM PowerTrench[® ] S GENERALSYSTEM ®* Build it Now ™ GreenBridge ™ PowerXS™ TinyBoost[®] CorePLUS ™ Green FPS ™ Programmable Active Droop ™ TinyBuck[®] CorePOWER ™ Green FPS ™ e-Series ™ QFET[®] TinyCalc _CROSSVOLT_ ™ G _max_ ™ QS ™ TinyLogic[®] CTL ™ GTO ™ Quiet Series TINYOPTO Current Transfer Logic ™ IntelliMAX ™ RapidConfigure ™ TinyPower DEUXPEED[®] ISOPLANAR ™ TinyPWM Dual Cool™ Making Small Speakers Sound Louder 2)™M TinyWire ™™ EcoSPARK[®] and Better™ Saving our world, 1mW/W/kW at a time™ TranSiC ™ EfficientMax ™ MegaBuck ™ SignalWise ™ TriFault Detect ™ ESBC ™ MICROCOUPLER ™ SmartMax ™ TRUECURRENT[®] * ® MicroFET SMART START SerDes ~~-~~ MicroPak ™™ Solutions for Your Success ™ os m ™ FairchildFairchild SemiconductorFACT Quiet SeriesFACT[®][®] ™[®] MicroPak2MillerDriveMotionMaxmWSaver[®] ™™ SPMSTEALTHSuperFETSuperSOT[®] ™™[®] 3 UHCUltra FRFETUniFET[®] Des FASTFastvCoreFETBenchFPS ™[®] ™™ OptoHiTOPTOLOGICOPTOPLANAR ™[®][® ] SuperSOTSuperSOTSupreMOSSyncFET ™™™[®] -6 -8 VCXVisualMaxVoltagePlusXS™ ™ ™™ 

* Trademarks of System General Corporation, used under license by Fairchild Semiconductor. 

## **DISCLAIMER** 

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. 

## **LIFE SUPPORT POLICY** 

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. 

As used herein: 

1. Life support devices or systems are devices or systems which, (a) are 2. A critical component in any component of a life support, device, or intended for surgical implant into the body or (b) support or sustain system whose failure to perform can be reasonably expected to life, and (c) whose failure to perform when properly used in cause the failure of the life support device or system, or to affect its accordance with instructions for use provided in the labeling, can be safety or effectiveness. reasonably expected to result in a significant injury of the user. 

## **ANTI-COUNTERFEITING POLICY** 

Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support. 

Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. 

## **PRODUCT STATUS DEFINITIONS** 

|**Definition of Terms**|||
|---|---|---|
|**Datasheet Identification**|**Product Status**|**Definition**|
|Advance Information|Formative / In Design|Datasheet contains the design specifications for product development. Specifications may change<br>in anymanner without notice.|
|Preliminary|First Production|Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild<br>Semiconductor reserves the right to make changes at anytime without notice to improve design.|
|No Identification Needed|Full Production|Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make<br>changes at anytime without notice to improve the design.|
|Obsolete|Not In Production|Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.<br>The datasheet is for reference information only.|



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