BC557CG..
Bipolar (BJT) Single Transistor, General Purpose, PNP, 45 V, 100 mA, 1.5 W, TO-92, Through Hole
- Manufacturer: ONSEMI
- Product type: Single Bipolar Junction Transistors - BJT
- Transistor Polarity:PNP; Collector Emitter Voltage V(br)ceo:-45V; Transition Frequency ft:320MHz; Power Dissipation Pd:1.5W; DC Collector Current:-100mA; DC Current Gain hFE:420hFE
- No. of Pins: 3Pins
- Product Range: -
- Qualification: -
- Power Dissipation: 1.5W
- Transistor Mounting: Through Hole
- Transistor Polarity: PNP
- Transition Frequency: 320MHz
- Transistor Case Style: TO-92
- DC Current Gain hFE Min: 420hFE
- Operating Temperature Max: 150°C
- Continuous Collector Current: 100mA
- Collector Emitter Voltage Max: 45V
| Delivery and price | |
|---|---|
| Units per pack | 1000 |
| Price | 0.044 € |
| Current stock | 10+ |
| Lead time | 30 days |
## BC556B, BC557A, B, C, BC558B ## Amplifier Transistors ## **PNP Silicon** ## **Features** ## **http://onsemi.com** • Pb−Free Packages are Available* COLLECTOR 1 **MAXIMUM RATINGS** 2 BASE **Rating Symbol Value Unit** Collector - Emitter Voltage VCEO Vdc ® BC556 −65 3 BC557 −45 EMITTER BC558 −30 Collector - Base Voltage VCBO Vdc BC556 −80 BC557 −50 BC558 −30 **TO−92** Emitter - Base Voltage VEBO −5.0 Vdc **CASE 29 STYLE 17** Collector Current − Continuous IC −100 mAdc Collector Current − Peak ICM −200 1 2 Base Current − Peak IBM −200 mAdc 1 23 3 Total Device Dissipation @ TA = 25 ° C PD 625 mW STRAIGHT LEAD BENT LEAD Derate above 25 ° C 5.0 mW/ ° C BULK PACK TAPE & REEL AMMO PACK Total Device Dissipation @ TC = 25 ° C PD 1.5 W Derate above 25 ° C 12 mW/ ° C **MARKING DIAGRAM** Operating and Storage Junction TJ, Tstg −55 to +150 ° C Temperature Range ~~Sy~~ **THERMAL CHARACTERISTICS Characteristic Symbol Max Unit** BC Thermal Resistance, Junction−to−Ambient R JA 200 ° C/W AYWW55xx Thermal Resistance, Junction−to−Case R JC 83.3 ° C/W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. xx = 6B, 7A, 7B, 7C, or 8B A = Assembly Location Y = Year WW = Work Week = Pb−Free Package (Note: Microdot may be in either location) ## **ORDERING INFORMATION** > *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. Publication Order Number: **BC556B/D** **1** © Semiconductor Components Industries, LLC, 2007 **March, 2007 − Rev. 3** ## **BC556B, BC557A, B, C, BC558B** ## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) |**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise note|d)||||| |---|---|---|---|---|---| |**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**| |**OFF CHARACTERISTICS**|||||| |Collector−Emitter Breakdown Voltage<br>(IC= −2.0 mAdc, IB= 0)<br>BC556<br>BC557<br>BC558|V(BR)CEO|−65<br>−45<br>−30|−<br>−<br>−|−<br>−<br>−|V| |Collector−Base Breakdown Voltage<br>(IC= −100�Adc)<br>BC556<br>BC557<br>BC558|V(BR)CBO|−80<br>−50<br>−30|−<br>−<br>−|−<br>−<br>−|V| |Emitter−Base Breakdown Voltage<br>(IE= −100�Adc, IC= 0)<br>BC556<br>BC557<br>BC558|V(BR)EBO|−5.0<br>−5.0<br>−5.0|−<br>−<br>−|−<br>−<br>−|V| |Collector−Emitter Leakage Current<br>(VCES= −40 V)<br>BC556<br>(VCES= −20 V)<br>BC557<br>BC558<br>(VCES= −20 V, TA= 125°C)<br>BC556<br>BC557<br>BC558|ICES|−<br>−<br>−<br>−<br>−<br>−|−2.0<br>−2.0<br>−2.0<br>−<br>−<br>−|−100<br>−100<br>−100<br>−4.0<br>−4.0<br>−4.0|nA<br>�A| |**ON CHARACTERISTICS**|||||| |DC Current Gain<br>(IC= −10�Adc, VCE= −5.0 V)<br>A Series Device<br>B Series Devices<br>C Series Devices<br>(IC= −2.0 mAdc, VCE= −5.0 V)<br>BC557<br>A Series Device<br>B Series Devices<br>C Series Devices<br>(IC= −100 mAdc, VCE= −5.0 V)<br>A Series Device<br>B Series Devices<br>C Series Devices|hFE|−<br>−<br>−<br>120<br>120<br>180<br>420<br>−<br>−<br>−|90<br>150<br>270<br>−<br>170<br>290<br>500<br>120<br>180<br>300|−<br>−<br>−<br>800<br>220<br>460<br>800<br>−<br>−<br>−|−| |Collector−Emitter Saturation Voltage<br>(IC= −10 mAdc, IB= −0.5 mAdc)<br>(IC= −10 mAdc, IB= see Note 1)<br>(IC= −100 mAdc, IB= −5.0 mAdc)|VCE(sat)|−<br>−<br>−|−0.075<br>−0.3<br>−0.25|−0.3<br>−0.6<br>−0.65|V| |Base−Emitter Saturation Voltage<br>(IC= −10 mAdc, IB= −0.5 mAdc)<br>(IC= −100 mAdc, IB= −5.0 mAdc)|VBE(sat)|−<br>−|−0.7<br>−1.0|−<br>−|V| |Base−Emitter On Voltage<br>(IC= −2.0 mAdc, VCE= −5.0 Vdc)<br>(IC= −10 mAdc, VCE= −5.0 Vdc)|VBE(on)|−0.55<br>−|−0.62<br>−0.7|−0.7<br>−0.82|V| |**SMALL−SIGNAL CHARACTERISTICS**|||||| |Current−Gain − Bandwidth Product<br>(IC= −10 mA, VCE= −5.0 V, f = 100 MHz)<br>BC556<br>BC557<br>BC558|fT|−<br>−<br>−|280<br>320<br>360|−<br>−<br>−|MHz| |Output Capacitance<br>(VCB= −10 V, IC= 0, f = 1.0 MHz)|Cob|−|3.0|6.0|pF| |Noise Figure<br>(IC= −0.2 mAdc, VCE= −5.0 V,<br>BC556<br>RS= 2.0 k�, f = 1.0 kHz,�f = 200 Hz)<br>BC557<br>BC558|NF|−<br>−<br>−|2.0<br>2.0<br>2.0|10<br>10<br>10|dB| |Small−Signal Current Gain<br>(IC= −2.0 mAdc, VCE= 5.0 V, f = 1.0 kHz)<br>BC557<br>A Series Device<br>B Series Devices<br>C Series Devices|hfe|125<br>125<br>240<br>450|−<br>−<br>−<br>−|900<br>260<br>500<br>900|−| 1. IC = −10 mAdc on the constant base current characteristics, which yields the point IC = −11 mAdc, VCE = −1.0 V. **http://onsemi.com** **2** **BC556B, BC557A, B, C, BC558B** ## **BC557/BC558** **==> picture [492 x 597] intentionally omitted <==** **----- Start of picture text -----**<br> 2.0 −1.0<br>1.5 VCE = −10 V −0.9 TA = 25°C<br>TA = 25°C −0.8 VBE(sat) @ IC/IB = 10<br>1.0 −0.7<br>−0.6 VBE(on) @ VCE = −10 V<br>0.7<br>−0.5<br>0.5 −0.4<br>−0.3<br>−0.2<br>0.3<br>−0.1 VCE(sat) @ IC/IB = 10<br>0.2 0<br>−0.2 −0.5 −1.0 −2.0 −5.0 −10 −20 −50 −100 −200 −0.1 −0.2 −0.5 −1.0 −2.0 −5.0 −10 −20 −50 −100<br>IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc)<br>Figure 1. Normalized DC Current Gain Figure 2. “Saturation” and “On” Voltages<br>−2.0 1.0<br>TA = 25°C −55°C to +125°C<br>1.2<br>−1.6<br>1.6<br>−1.2<br>2.0<br>−0.8 IC = IC = −50 mA IC = −200 mA<br>−10 mA<br>2.4<br>IC = −100 mA<br>−0.4 IC = −20 mA<br>2.8<br>0<br>−0.02 −0.1 −1.0 −10 −20 −0.2 −1.0 −10 −100<br>IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)<br>Figure 3. Collector Saturation Region Figure 4. Base−Emitter Temperature Coefficient<br>10 400<br>Cib 300<br>7.0<br>TA = 25°C 200<br>5.0<br>150 VCE = −10 V<br>TA = 25°C<br>3.0 Cob 100<br>80<br>60<br>2.0<br>40<br>30<br>1.0 20<br>−0.4 −0.6 −1.0 −2.0 −4.0 −6.0 −10 −20 −30 −40 −0.5 −1.0 −2.0 −3.0 −5.0 −10 −20 −30 −50<br>VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mAdc)<br>V, VOLTAGE (VOLTS)<br>hFE, NORMALIZED DC CURRENT GAIN<br>C)°<br>VCE, COLLECTOR−EMITTER VOLTAGE (V) VB, TEMPERATURE COEFFICIENT (mV/<br>θ<br>C, CAPACITANCE (pF)<br>f�, CURRENT−GAIN − BANDWIDTH PRODUCT (MHz)T<br>**----- End of picture text -----**<br> **Figure 5. Capacitances** **Figure 6. Current−Gain − Bandwidth Product** **http://onsemi.com** **3** **BC556B, BC557A, B, C, BC558B** ## **BC556** **==> picture [490 x 383] intentionally omitted <==** **----- Start of picture text -----**<br> −1.0<br>TJ = 25°C<br>VCE = −5.0 V<br>TA = 25°C −0.8<br>VBE(sat) @ IC/IB = 10<br>2.0<br>−0.6<br>VBE @ VCE = −5.0 V<br>1.0<br>−0.4<br>0.5<br>−0.2<br>0.2<br>VCE(sat) @ IC/IB = 10<br>0<br>−0.1 −0.2 −1.0 −2.0 −5.0 −10 −20 −50 −100 −200 −0.2 −0.5 −1.0 −2.0 −5.0 −10 −20 −50 −100 −200<br>IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)<br>Figure 7. DC Current Gain Figure 8. “On” Voltage<br>−2.0 −1.0<br>−1.6 −1.4<br>IC = −20 mA −50 mA −100 mA −200 mA<br>−10 mA<br>−1.2 −1.8<br>�VB for VBE<br>−55°C to 125°C<br>−0.8 −2.2<br>−0.4 −2.6<br>TJ = 25°C<br>0 −3.0<br>−0.02 −0.05 −0.1 −0.2 −0.5 −1.0 −2.0 −5.0 −10 −20 −0.2 −0.5 −1.0 −2.0 −5.0 −10 −20 −50 −100 −200<br>IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)<br>V, VOLTAGE (VOLTS)<br>hFE, DC CURRENT GAIN (NORMALIZED)<br>C)°<br>VB, TEMPERATURE COEFFICIENT (mV/<br>VCE, COLLECTOR−EMITTER VOLTAGE (VOLTS) θ<br>**----- End of picture text -----**<br> **Figure 9. Collector Saturation Region** **Figure 10. Base−Emitter Temperature Coefficient** **==> picture [239 x 172] intentionally omitted <==** **----- Start of picture text -----**<br> 40<br>TJ = 25°C<br>20<br>Cib<br>10<br>8.0<br>6.0<br>Cob<br>4.0<br>2.0<br>−0.1 −0.2 −0.5 −1.0 −2.0 −5.0 −10 −20 −50 −100<br>VR, REVERSE VOLTAGE (VOLTS)<br>C, CAPACITANCE (pF)<br>**----- End of picture text -----**<br> **Figure 11. Capacitance** **==> picture [236 x 169] intentionally omitted <==** **----- Start of picture text -----**<br> VCE = −5.0 V<br>500<br>200<br>100<br>50<br>20<br>−1.0 −10 −100<br>IC, COLLECTOR CURRENT (mA)<br>f�, CURRENT−GAIN − BANDWIDTH PRODUCTT<br>**----- End of picture text -----**<br> **Figure 12. Current−Gain − Bandwidth Product** **http://onsemi.com** **4** **BC556B, BC557A, B, C, BC558B** **==> picture [493 x 374] intentionally omitted <==** **----- Start of picture text -----**<br> 1.0<br>0.7<br>D = 0.5<br>0.5<br>0.2<br>0.3<br>0.2<br>0.1 0.05 SINGLE PULSE Z � JC(t) = (t) R � JC<br>0.070.050.1 SINGLE PULSE P(pk) t1 RRZD CURVES APPLY FOR POWER ��� JAJCJA(t) = r(t) R = 200 = 83.3 °° C/W MAXC/W MAX � JA<br>0.03 t2 PULSE TRAIN SHOWN<br>0.02 DUTY CYCLE, D = t1/t2 READ TIME AT t1<br>TJ(pk) − TC = P(pk) R � JC(t)<br>0.01<br>0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0�k 2.0�k 5.0�k 10�<br>t, TIME (ms)<br>Figure 13. Thermal Response<br>−200<br>1 s 3 ms<br>−100<br>The safe operating area curves indicate IC−VCE limits of the<br>−50 TA = 25°C TJ = 25°C transistor that must be observed for reliable operation. Collector<br>load lines for specific circuits must fall below the limits indicated by<br>the applicable curve.<br>The data of Figure 14 is based upon TJ(pk) = 150 ° C; TC or TA is<br>BC558 variable depending upon conditions. Pulse curves are valid for<br>−10 BC557 duty cycles to 10% provided TJ(pk) ≤ 150 ° C. TJ(pk) may be<br>BC556 calculated from the data in Figure 13. At high case or ambient<br>−5.0 BONDING WIRE LIMIT temperatures, thermal limitations will reduce the power than can<br>be handled to values less than the limitations imposed by second<br>THERMAL LIMIT<br>breakdown.<br>SECOND BREAKDOWN LIMIT<br>−2.0<br>−1.0 −5.0 −10 −30 −45 −65 −100<br>VCE, COLLECTOR−EMITTER VOLTAGE (V)<br>r(t), TRANSIENT THERMAL<br>RESISTANCE (NORMALIZED)<br>IC, COLLECTOR CURRENT (mA)<br>**----- End of picture text -----**<br> **Figure 14. Active Region − Safe Operating Area** **http://onsemi.com** **5** **BC556B, BC557A, B, C, BC558B** ## **ORDERING INFORMATION** |**ORDERING INFORMATION**||| |---|---|---| |**Device**|**Package**|**Shipping**†| |BC556BG|TO−92<br>(Pb−Free)|5000 Units / Bulk| |BC556BZL1G|TO−92<br>(Pb−Free)|2000 / Ammo Box| |BC557AZL1G|TO−92<br>(Pb−Free)|2000 / Ammo Box| |BC557BG|TO−92<br>(Pb−Free)|5000 Units / Bulk| |BC557BRL1|TO−92|2000 / Tape & Reel| |BC557BRL1G|TO−92<br>(Pb−Free)|2000 / Tape & Reel| |BC557BZL1G|TO−92<br>(Pb−Free)|2000 / Ammo Box| |BC557CG|TO−92<br>(Pb−Free)|5000 Units / Bulk| |BC557CZL1G|TO−92<br>(Pb−Free)|2000 / Ammo Box| |BC558BRLG|TO−92<br>(Pb−Free)|2000 / Tape & Reel| |BC558BRL1G|TO−92<br>(Pb−Free)|2000 / Tape & Reel| |BC558BZL1G|TO−92<br>(Pb−Free)|2000 / Ammo Box| †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. **http://onsemi.com** **6** **BC556B, BC557A, B, C, BC558B** ## **PACKAGE DIMENSIONS** **TO−92 (TO−226)** CASE 29−11 ISSUE AM NOTES: **==> picture [377 x 179] intentionally omitted <==** **----- Start of picture text -----**<br> ||||||||||| |---|---|---|---|---|---|---|---|---|---| |A| |eae|ae|B|STRAIGHT LEAD|1.|DIMENSIONING AND TOLERANCING PER ANSI| |BULK PACK|Y14.5M, 1982.| |2.|CONTROLLING DIMENSION: INCH.| |R|3.|CONTOUR OF PACKAGE BEYOND DIMENSION R| |Fi|IS UNCONTROLLED.| |4.|LEAD DIMENSION IS UNCONTROLLED IN P AND| |P|BEYOND DIMENSION K MINIMUM.| |L| |SEATING|INCHES|MILLIMETERS| |PLANE|K|DIM|MIN|MAX|MIN|MAX| |A|0.175|0.205|4.45|5.20| |B|0.170|0.210|4.32|5.33| |C|0.125|0.165|3.18|4.19| |D|0.016|0.021|0.407|0.533| |X|i|X|D|ce|G|0.045|0.055|1.15|1.39| |G|H|0.095|0.105|2.42|2.66| |J|0.015|0.020|0.39|0.50| |eB|H|J|||K|0.500|K+|−−−|12.70|−−−| |L|0.250|−−−|6.35|−−−| |V|C|N|0.080|0.105|2.04|2.66| |P|−−−|0.100|−−−|2.54| |SECTION X−X|R|0.115|−−−|2.93|−−−| |1|N|V|0.135|−−−|3.43|−−−| |N| **----- End of picture text -----**<br> ## NOTES: **==> picture [372 x 182] intentionally omitted <==** **----- Start of picture text -----**<br> R oa A a B BENT LEAD 1. DIMENSIONING AND TOLERANCING PER<br>TAPE & REEL ASME Y14.5M, 1994.<br>2. CONTROLLING DIMENSION: MILLIMETERS.<br>AMMO PACK 3. CONTOUR OF PACKAGE BEYOND<br>ia DIMENSION R IS UNCONTROLLED.<br>4. LEAD DIMENSION IS UNCONTROLLED IN P<br>P AND BEYOND DIMENSION K MINIMUM.<br>T<br>SEATINGPLANE K DIM MILLIMETERSMIN MAX<br>A 4.45 5.20<br>B 4.32 5.33<br>a t C 3.18 4.19<br>aii X X D GD 0.402.40 0.542.80<br>G J 0.39 0.50<br>J K 12.70 −−−<br>N 2.04 2.66<br>“Le V C of RP 1.502.93 4.00−−−<br>fi} SECTION X−X “fh = V 3.43 −−−<br>1 N<br>STYLE 17:<br>PIN 1.<br>o n 2.<br>**----- End of picture text -----**<br> 2. CONTROLLING DIMENSION: MILLIMETERS. STYLE 17: PIN 1. COLLECTOR 2. BASE 3. EMITTER **ON Semiconductor** and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. ## **PUBLICATION ORDERING INFORMATION** ## **LITERATURE FULFILLMENT** : Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA **Phone** : 303−675−2175 or 800−344−3860 Toll Free USA/Canada **Fax** : 303−675−2176 or 800−344−3867 Toll Free USA/Canada **Email** : orderlit@onsemi.com **N. American Technical Support** : 800−282−9855 Toll Free USA/Canada **ON Semiconductor Website** : **www.onsemi.com** **Europe, Middle East and Africa Technical Support: Order Literature** : http://www.onsemi.com/orderlit Phone: 421 33 790 2910 **Japan Customer Focus Center** For additional information, please contact your local Phone: 81−3−5773−3850 Sales Representative **http://onsemi.com** **BC556B/D** **7**
Updated at March 22, 2026
onsemi is a premier global supplier of intelligent power and sensing technologies, driving disruptive innovations across the automotive, industrial, and cloud infrastructure markets. Recognized for their commitment to sustainability and reliable supply chains, the company accelerates advancements in vehicle electrification, industrial automation, and 5G networks by solving the industry's most complex design challenges. At the core of their portfolio is an industry-leading selection of discrete semiconductors. This extensive range features thousands of high-performance bipolar transistors, single and dual MOSFETs, and a comprehensive array of diodes, including Zener, Schottky, and fast-recovery rectifiers. Engineered for superior thermal performance and energy efficiency, these foundational components are critical for demanding power conversion, switching, and signal conditioning applications. Beyond essential discretes, onsemi provides a robust suite of advanced power management and circuit protection solutions. Their lineup includes intelligent power modules, single IGBTs, and transient voltage suppression (TVS) diodes designed to safeguard sensitive circuitry. Complimented by integrated passive filters, AC/DC LED driver ICs, and specialized sub-2.4GHz RF transceivers, onsemi equips engineers with the scalable, high-quality technologies needed to build a cleaner, smarter, and more connected world.
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