Image not available
Illustrative purposes only
BC54PA
Bipolar (BJT) Single Transistor, NPN, 45 V, 1 A, 1.65 W, SOT-1061, Surface Mount
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: NEXPERIA
- Product type: Single Bipolar Junction Transistors - BJT
- No. of Pins: 3Pins
- Product Range: BC54PA
- Power Dissipation: 1.65W
- DC Current Gain hFE: 40hFE
- Transistor Mounting: Surface Mount
- Transistor Polarity: NPN
- Transition Frequency: 180MHz
- Transistor Case Style: SOT-1061
- DC Current Gain hFE Min: 40hFE
- Operating Temperature Max: 150°C
- Continuous Collector Current: 1A
- Collector Emitter Voltage Max: 45V
| Delivery and price | |
|---|---|
| Units per pack | 20000 |
| Price | 0.069 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
## **BCP54; BCX54; BC54PA 45 V, 1 A NPN medium power transistors** **Rev. 8 — 21 October 2011 Product data sheet** ## **1. Product profile** ## **1.1 General description** NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages. ## **Table 1. Product overview** |**Type numbe**~~**r**~~**[1]**|**Package**|**Package**|**Package**|**PNP complement**| |---|---|---|---|---| ||**NXP**|**JEITA**|**JEDEC**|| |BCP54|SOT223<br>SC-73<br>-<br>BCP51|||| |BCX54|SOT89<br>SC-62<br>TO-243<br>BCX51|||| |BC54PA|SOT1061<br>-<br>-<br>BC51PA|||| [1] Valid for all available selection groups. ## **1.2 Features and benefits** - High current - Three current gain selections - High power dissipation capability - Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061) - Leadless very small SMD plastic package with medium power capability (SOT1061) - AEC-Q101 qualified ## **1.3 Applications** - Linear voltage regulators - Low-side switches - Battery-driven devices - Power management - MOSFET drivers - Amplifiers ## **1.4 Quick reference data** ## **Table 2. Quick reference data** |**Symbol**|**Parameter**<br>**Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**| |---|---| |VCEO|collector-emitter voltage<br>open base<br>-<br>-<br>45<br>V| |IC|collector current<br>-<br>-<br>1<br>A| |ICM|peak collector current<br>single pulse; tp1 ms<br>-<br>-<br>2<br>A| |hFE|DC current gain<br>VCE= 2 V; IC= 150 mA<br>[1]<br>63<br>-<br>250| ||hFEselection -10<br>VCE= 2 V; IC= 150 mA<br>[1]<br>63<br>-<br>160| ||hFEselection -16<br>VCE= 2 V; IC= 150 mA<br>[1]<br>100<br>-<br>250| [1] Pulse test: tp 300 s; = 0.02. **==> picture [172 x 101] intentionally omitted <==** **BCP54 BCX54 BC54PA ; ;** **NXP Semiconductors** **45 V, 1 A NPN medium power transistors** ## **2. Pinning information** **==> picture [396 x 337] intentionally omitted <==** **----- Start of picture text -----**<br> Table 3. Pinning<br>Pin Description Simplified outline Graphic symbol<br>SOT223<br>1 base<br>4 2, 4<br>2 collector<br>3 emitter 1<br>4 collector<br>1 2 3 3<br>sym016<br>SOT89<br>1 emitter<br>2<br>2 collector<br>3 base 3<br>1<br>3 2 1<br>sym042<br>SOT1061<br>1 base<br>3 3<br>2 emitter<br>3 collector 1<br>2<br>1 2 sym021<br>Transparent top view<br>**----- End of picture text -----**<br> ## **3. Ordering information** **Table 4. Ordering information** |**Type numbe**~~**r**~~**[1]**|**Package**|**Package**|**Package**| |---|---|---|---| ||**Name**|**Description**<br>|**Version**| |BCP54|SC-73<br>plastic surface-mounted package with increased<br>heatsink; 4 leads<br>SOT223||| |BCX54|SC-62<br>plastic surface-mounted package; exposed die pad for<br>good heat transfer; 3 leads<br>SOT89||| |BC54PA|HUSON3<br>plastic thermal enhanced ultra thin small outline<br>package; no leads; 3 terminals; body 220.65 mm<br>SOT1061||| - [1] Valid for all available selection groups. © NXP B.V. 2011. All rights reserved. BCP54_BCX54_BC54PA All information provided in this document is subject to legal disclaimers. **Rev. 8 — 21 October 2011** **Product data sheet** **2 of 22** **BCP54 BCX54 BC54PA ; ;** **NXP Semiconductors** **45 V, 1 A NPN medium power transistors** ## **4. Marking** |**Table 5.**|**Marking codes**|| |---|---|---| |**Type number**||**Marking code**| |BCP54||BCP54| |BCP54-10||BCP54/10| |BCP54-16||BCP54/16| |BCX54||BA| |BCX54-10||BC| |BCX54-16||BD| |BC54PA||AT| |BC54-10PA||BF| |BC54-16PA||BG| © NXP B.V. 2011. All rights reserved. BCP54_BCX54_BC54PA **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 8 — 21 October 2011** **3 of 22** **BCP54 BCX54 BC54PA ; ;** **NXP Semiconductors** **45 V, 1 A NPN medium power transistors** ## **5. Limiting values** ## **Table 6. Limiting values** _In accordance with the Absolute Maximum Rating System (IEC 60134)._ |**Symbol**|**Parameter**<br>**Conditions**|**Min**<br>**Max**<br>**Unit**| |---|---|---| |VCBO|collector-base voltage<br>open emitter|-<br>45<br>V| |VCEO|collector-emitter voltage<br>open base|-<br>45<br>V| |VEBO|emitter-base voltage<br>open collector|-<br>5<br>V| |IC|collector current|-<br>1<br>A| |ICM|peak collector current<br>single pulse;<br>tp1 ms|-<br>2<br>A| |IB|base current|-<br>0.3<br>A| |IBM|peak base current<br>single pulse;<br>tp1 ms|-<br>0.3<br>A| |Ptot|total power dissipation<br>Tamb25C|| ||BCP54|[1]<br>-<br>0.65<br>W| |||[2]<br>-<br>1.00<br>W| |||[3]<br>-<br>1.35<br>W| ||BCX54|[1]<br>-<br>0.50<br>W| |||[2]<br>-<br>0.95<br>W| |||[3]<br>-<br>1.35<br>W| ||BC54PA|[1]<br>-<br>0.42<br>W| |||[2]<br>-<br>0.83<br>W| |||[3]<br>-<br>1.10<br>W| |||[4]<br>-<br>0.81<br>W| |||[5]<br>-<br>1.65<br>W| |Tj|junction temperature|-<br>150<br>C| |Tamb|ambient temperature|55<br>+150<br>C| |Tstg|storage temperature|65<br>+150<br>C| [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm[2] . [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm[2] . [4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. - [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm[2] . © NXP B.V. 2011. All rights reserved. BCP54_BCX54_BC54PA **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 8 — 21 October 2011** **4 of 22** **BCP54 BCX54 BC54PA ; ;** **NXP Semiconductors** ## **45 V, 1 A NPN medium power transistors** **==> picture [497 x 268] intentionally omitted <==** **----- Start of picture text -----**<br> 006aac674 006aac675<br>1.5 1.5<br>(1) (1)<br>Ptot Ptot<br>(W) (W)<br>(2)<br>1.0 1.0 (2)<br>(3)<br>(3)<br>0.5 0.5<br>0.0 0.0<br>–75 –25 25 75 125 175 –75 –25 25 75 125 175<br>Tamb (°C) Tamb (°C)<br>(1) FR4 PCB, mounting pad for collector 6 cm [2] (1) FR4 PCB, mounting pad for collector 6 cm [2]<br>(2) FR4 PCB, mounting pad for collector 1 cm [2] (2) FR4 PCB, mounting pad for collector 1 cm [2]<br>(3) FR4 PCB, standard footprint (3) FR4 PCB, standard footprint<br>Fig 1. Power derating curves SOT223 Fig 2. Power derating curves SOT89<br>**----- End of picture text -----**<br> **==> picture [233 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> 006aac676<br>2.0<br>Ptot<br>(W) (1)<br>1.5<br>(2)<br>1.0<br>(3)<br>(4)<br>0.5 (5)<br>0.0<br>–75 –25 25 75 125 175<br>Tamb (°C)<br>**----- End of picture text -----**<br> - (1) FR4 PCB, 4-layer copper, mounting pad for collector 1 cm[2] (2) FR4 PCB, single-sided copper, mounting pad for collector 6 cm[2] (3) FR4 PCB, single-sided copper, mounting pad for collector 1 cm[2] - (4) FR4 PCB, 4-layer copper, standard footprint - (5) FR4 PCB, single-sided copper, standard footprint **Fig 3. Power derating curves SOT1061** © NXP B.V. 2011. All rights reserved. BCP54_BCX54_BC54PA **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 8 — 21 October 2011** **5 of 22** **BCP54 BCX54 BC54PA ; ;** **NXP Semiconductors** **45 V, 1 A NPN medium power transistors** ## **6. Thermal characteristics** ## **Table 7. Thermal characteristics** |**Symbol**|**Parameter**<br>**Conditions**|**Min**<br>**Typ**<br>**Max**<br>**Unit**| |---|---|---| |Rth(j-a)|thermal resistance from<br>junction to ambient<br>in free air|| ||BCP54|[1]<br>-<br>-<br>192<br>K/W| |||[2]<br>-<br>-<br>125<br>K/W| |||[3]<br>-<br>-<br>93<br>K/W| ||BCX54|[1]<br>-<br>-<br>250<br>K/W| |||[2]<br>-<br>-<br>132<br>K/W| |||[3]<br>-<br>-<br>93<br>K/W| ||BC54PA|[1]<br>-<br>-<br>298<br>K/W| |||[2]<br>-<br>-<br>151<br>K/W| |||[3]<br>-<br>-<br>114<br>K/W| |||[4]<br>-<br>-<br>154<br>K/W| |||[5]<br>-<br>-<br>76<br>K/W| |Rth(j-sp)|thermal resistance from<br>junction to solder point|| ||BCP54|-<br>-<br>16<br>K/W| ||BCX54|-<br>-<br>16<br>K/W| ||BC54PA|-<br>-<br>20<br>K/W| [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. - [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm[2] . [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm[2] . [4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. - [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm[2] . © NXP B.V. 2011. All rights reserved. BCP54_BCX54_BC54PA **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 8 — 21 October 2011** **6 of 22** **BCP54 BCX54 BC54PA ; ;** **NXP Semiconductors** **45 V, 1 A NPN medium power transistors** **==> picture [481 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> 006aac677<br>10 [3]<br>Zth(j-a)<br>(K/W)<br>duty cycle = 1<br>10 [2] 0.75<br>0.5<br>0.33<br>0.2<br>0.1<br>10 0.05<br>0.02<br>0.01<br>1 0<br>10 [–1]<br>10 [–5] 10 [–4] 10 [–3] 10 [–2] 10 [–1] 1 10 10 [2] 10 [3]<br>tp (s)<br>**----- End of picture text -----**<br> FR4 PCB, standard footprint **Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values** **==> picture [481 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> 006aac678<br>10 [3]<br>Zth(j-a)<br>(K/W)<br>duty cycle = 1<br>10 [2]<br>0.75<br>0.5<br>0.33<br>0.2<br>0.1<br>10<br>0.05<br>0.02<br>1<br>0 0.01<br>10 [–1]<br>10 [–5] 10 [–4] 10 [–3] 10 [–2] 10 [–1] 1 10 10 [2] 10 [3]<br>tp (s)<br>**----- End of picture text -----**<br> FR4 PCB, mounting pad for collector 1 cm[2] **Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values** © NXP B.V. 2011. All rights reserved. BCP54_BCX54_BC54PA **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 8 — 21 October 2011** **7 of 22** **BCP54 BCX54 BC54PA ; ;** **NXP Semiconductors** **45 V, 1 A NPN medium power transistors** **==> picture [481 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> 006aac679<br>10 [3]<br>Zth(j-a)<br>(K/W)<br>10 [2] duty cycle = 1<br>0.75<br>0.5<br>0.33<br>0.2<br>10 0.1<br>0.05<br>1 0.02<br>0 0.01<br>10 [–1]<br>10 [–5] 10 [–4] 10 [–3] 10 [–2] 10 [–1] 1 10 10 [2] 10 [3]<br>tp (s)<br>**----- End of picture text -----**<br> FR4 PCB, mounting pad for collector 6 cm[2] **Fig 6. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values** **==> picture [481 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> 006aac680<br>10 [3]<br>Zth(j-a)<br>(K/W) duty cycle = 1<br>0.75<br>10 [2] 0.5<br>0.33<br>0.2<br>0.1<br>0.05<br>10<br>0.02<br>0.01<br>1 0<br>10 [–1]<br>10 [–5] 10 [–4] 10 [–3] 10 [–2] 10 [–1] 1 10 10 [2] 10 [3]<br>tp (s)<br>**----- End of picture text -----**<br> FR4 PCB, standard footprint **Fig 7. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values** © NXP B.V. 2011. All rights reserved. BCP54_BCX54_BC54PA **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 8 — 21 October 2011** **8 of 22** **BCP54 BCX54 BC54PA ; ;** **NXP Semiconductors** **45 V, 1 A NPN medium power transistors** **==> picture [481 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> 006aac681<br>10 [3]<br>Zth(j-a)<br>(K/W)<br>duty cycle = 1<br>10 [2] 0.75<br>0.5<br>0.33<br>0.2<br>0.1<br>10<br>0.05<br>0.02<br>0.01<br>1<br>0<br>10 [–1]<br>10 [–5] 10 [–4] 10 [–3] 10 [–2] 10 [–1] 1 10 10 [2] 10 [3]<br>tp (s)<br>**----- End of picture text -----**<br> FR4 PCB, mounting pad for collector 1 cm[2] **Fig 8. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values** **==> picture [481 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> 006aac682<br>10 [3]<br>Zth(j-a)<br>(K/W)<br>10 [2] duty cycle = 1<br>0.75<br>0.5<br>0.33<br>0.2<br>10 0.1<br>0.05<br>1 0.02<br>0 0.01<br>10 [–1]<br>10 [–5] 10 [–4] 10 [–3] 10 [–2] 10 [–1] 1 10 10 [2] 10 [3]<br>tp (s)<br>**----- End of picture text -----**<br> FR4 PCB, mounting pad for collector 6 cm[2] **Fig 9. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values** © NXP B.V. 2011. All rights reserved. BCP54_BCX54_BC54PA All information provided in this document is subject to legal disclaimers. **Rev. 8 — 21 October 2011** **Product data sheet** **9 of 22** **BCP54 BCX54 BC54PA ; ;** **NXP Semiconductors** **45 V, 1 A NPN medium power transistors** **==> picture [481 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> 006aac683<br>10 [3]<br>Zth(j-a) duty cycle = 1<br>(K/W)<br>0.75<br>0.5<br>10 [2] 0.33<br>0.25<br>0.2<br>0.1<br>0.05<br>10<br>0.02<br>0.01<br>1 0<br>10 [–1]<br>10 [–5] 10 [–4] 10 [–3] 10 [–2] 10 [–1] 1 10 10 [2] 10 [3]<br>tp (s)<br>**----- End of picture text -----**<br> FR4 PCB, single-sided copper, standard footprint **Fig 10. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values** **==> picture [481 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> 006aac684<br>10 [3]<br>Zth(j-a)<br>(K/W)<br>duty cycle = 1<br>10 [2] 0.75<br>0.5<br>0.33<br>0.25<br>0.2<br>0.1<br>10 0.05<br>0.02 0.01<br>1 0<br>10 [–1]<br>10 [–5] 10 [–4] 10 [–3] 10 [–2] 10 [–1] 1 10 10 [2] 10 [3]<br>tp (s)<br>**----- End of picture text -----**<br> FR4 PCB, single-sided copper, mounting pad for collector 1 cm[2] **Fig 11. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values** © NXP B.V. 2011. All rights reserved. BCP54_BCX54_BC54PA **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 8 — 21 October 2011** **10 of 22** **BCP54 BCX54 BC54PA ; ;** **NXP Semiconductors** **45 V, 1 A NPN medium power transistors** **==> picture [481 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> 006aac685<br>10 [3]<br>Zth(j-a)<br>(K/W)<br>duty cycle = 1<br>10 [2]<br>0.75<br>0.5<br>0.33<br>0.25<br>0.2<br>0.1<br>10<br>0.05<br>0.02<br>1 0<br>0.01<br>10 [–1]<br>10 [–5] 10 [–4] 10 [–3] 10 [–2] 10 [–1] 1 10 10 [2] 10 [3]<br>tp (s)<br>**----- End of picture text -----**<br> FR4 PCB, single-sided copper, mounting pad for collector 6 cm[2] **Fig 12. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values** **==> picture [481 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> 006aac686<br>10 [3]<br>Zth(j-a)<br>(K/W)<br>duty cycle = 1<br>10 [2] 0.75<br>0.5<br>0.33<br>0.25<br>0.2<br>0.1<br>10 0.05<br>0.02<br>1 0.01<br>0<br>10 [–1]<br>10 [–5] 10 [–4] 10 [–3] 10 [–2] 10 [–1] 1 10 10 [2] 10 [3]<br>tp (s)<br>**----- End of picture text -----**<br> FR4 PCB, 4-layer copper, standard footprint **Fig 13. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values** © NXP B.V. 2011. All rights reserved. BCP54_BCX54_BC54PA **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 8 — 21 October 2011** **11 of 22** **BCP54 BCX54 BC54PA ; ;** **NXP Semiconductors** ## **45 V, 1 A NPN medium power transistors** **==> picture [481 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> 006aac687<br>10 [3]<br>Zth(j-a)<br>(K/W)<br>10 [2] duty cycle = 1<br>0.75<br>0.5<br>0.33<br>0.25<br>0.2<br>10<br>0.1<br>0.05<br>0.02<br>1<br>0 0.01<br>10 [–1]<br>10 [–5] 10 [–4] 10 [–3] 10 [–2] 10 [–1] 1 10 10 [2] 10 [3]<br>tp (s)<br>**----- End of picture text -----**<br> FR4 PCB, 4-layer copper, mounting pad for collector 1 cm[2] **Fig 14. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values** ## **7. Characteristics** ## **Table 8. Characteristics** _Tamb = 25_ _C unless otherwise specified._ |**Symbol**|**Parameter**|**Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**| |---|---|---| |ICBO|collector-base cut-off<br>current|VCB= 30 V; IE= 0 A<br>-<br>-<br>100<br>nA| |||VCB= 30 V; IE= 0 A;<br>Tj= 150C<br>-<br>-<br>10<br>A| |IEBO|emitter-base cut-off<br>current|VEB= 5 V; IC= 0 A<br>-<br>-<br>100<br>nA| |hFE|DC current gain|VCE= 2 V| |||IC= 5 mA<br>[1]<br>63<br>-<br>-| |||IC= 150 mA<br>[1]<br>63<br>-<br>250| |||IC= 500 mA<br>[1]<br>40<br>-<br>-| ||DC current gain|VCE= 2 V| ||hFEselection -10|IC= 150 mA<br>[1]<br>63<br>-<br>160| ||hFEselection -16|IC= 150 mA<br>[1]<br>100<br>-<br>250| |VCEsat|collector-emitter<br>saturation voltage|IC= 500 mA; IB= 50 mA<br>[1]<br>-<br>-<br>0.5<br>V| |VBE|base-emitter voltage|VCE= 2 V; IC= 500 mA<br>[1]<br>-<br>-<br>1<br>V| |Cc|collector capacitance|VCB= 10 V; IE= ie= 0 A;<br>f = 1 MHz<br>-<br>6<br>-<br>pF| |fT|transition frequency|VCE= 5 V; IC= 50 mA;<br>f = 100 MHz<br>100<br>180<br>-<br>MHz| [1] Pulse test: tp 300 s; = 0.02. © NXP B.V. 2011. All rights reserved. BCP54_BCX54_BC54PA **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 8 — 21 October 2011** **12 of 22** **BCP54 BCX54 BC54PA ; ;** **NXP Semiconductors** ## **45 V, 1 A NPN medium power transistors** **==> picture [481 x 249] intentionally omitted <==** **----- Start of picture text -----**<br> 006aac691 006aaa084<br>300 1.6<br>IB (mA) = 50 45 40 35 30<br>IC<br>hFE (A)<br>1.2<br>(1) 25<br>200 20<br>15<br>(2)<br>0.8 10<br>100 (3) 5<br>0.4<br>0 0<br>10 [–4] 10 [–3] 10 [–2] 10 [–1] 1 10 0 0.4 0.8 1.2 1.6 2.0<br>IC (A) VCE (V)<br>VCE = 2 V Tamb = 25 C<br>(1) Tamb = 100 C<br>(2) Tamb = 25 C<br>(3) Tamb = 55 C<br>**----- End of picture text -----**<br> **Fig 15. DC current gain as a function of collector current; typical values** **Fig 16. Collector current as a function of collector-emitter voltage; typical values** **==> picture [482 x 275] intentionally omitted <==** **----- Start of picture text -----**<br> 006aac692 006aac693<br>1.2 1<br>VBE<br>(V) VCEsat<br>(1) (V)<br>0.8<br>(2)<br>10 [–1]<br>(3)<br>(1)<br>0.4<br>(2)<br>(3)<br>0.0 10 [–2]<br>10 [–1] 1 10 10 [2] 10 [3] 10 [4] 10 [–1] 1 10 10 [2] 10 [3] 10 [4]<br>IC (mA) IC (mA)<br>VCE = 2 V IC/IB = 10<br>(1) Tamb = 55 C (1) Tamb = 100 C<br>(2) Tamb = 25 C (2) Tamb = 25 C<br>(3) Tamb = 100 C (3) Tamb = 55 C<br>Fig 17. Base-emitter voltage as a function of collector Fig 18. Collector-emitter saturation voltage as a<br>current; typical values function of collector current; typical values<br>**----- End of picture text -----**<br> © NXP B.V. 2011. All rights reserved. BCP54_BCX54_BC54PA All information provided in this document is subject to legal disclaimers. **Rev. 8 — 21 October 2011** **Product data sheet** **13 of 22** **BCP54 BCX54 BC54PA ; ;** **NXP Semiconductors** **45 V, 1 A NPN medium power transistors** ## **8. Test information** ## **8.1 Quality information** This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard _Q101 - Stress test qualification for discrete semiconductors_ , and is suitable for use in automotive applications. ## **9. Package outline** **==> picture [237 x 164] intentionally omitted <==** **----- Start of picture text -----**<br> 6.7<br>6.3 1.8<br>3.1 1.5<br>2.9<br>4<br>1.1<br>0.7<br>7.3 3.7<br>6.7 3.3<br>1 2 3<br>0.8 0.32<br>2.3<br>0.6 0.22<br>4.6<br>Dimensions in mm 04-11-10<br>**----- End of picture text -----**<br> **Fig 19. Package outline SOT223 (SC-73)** **==> picture [237 x 164] intentionally omitted <==** **----- Start of picture text -----**<br> 4.6<br>4.4 1.6<br>1.8 1.4<br>1.4<br>2.6<br>2.4 4.25<br>3.75<br>1.2<br>1 2 3 0.8<br>0.53<br>0.40 0.48 0.44<br>1.5 0.35 0.23<br>3<br>Dimensions in mm 06-08-29<br>**----- End of picture text -----**<br> **Fig 20. Package outline SOT89 (SC-62/TO-243)** © NXP B.V. 2011. All rights reserved. BCP54_BCX54_BC54PA All information provided in this document is subject to legal disclaimers. **Rev. 8 — 21 October 2011** **Product data sheet** **14 of 22** **BCP54 BCX54 BC54PA ; ;** **NXP Semiconductors** **45 V, 1 A NPN medium power transistors** **==> picture [233 x 163] intentionally omitted <==** **----- Start of picture text -----**<br> 1.3<br>0.35 0.65<br>0.25 max<br>0.45<br>1 2<br>1.05 0.35<br>0.95<br>2.1<br>1.1 1.9<br>0.9<br>0.3<br>0.2 3<br>1.6<br>1.4<br>2.1<br>1.9<br>Dimensions in mm 09-11-12<br>**----- End of picture text -----**<br> **Fig 21. Package outline SOT1061 (HUSON3)** ## **10. Packing information** **Table 9. Packing methods** _The indicated -xxx are the last three digits of the 12NC ordering code.[[][1][]]_ |**Type**<br>**numbe**~~**r**~~**[2]**<br>**Package**|**Description**|**Packing quantity**|**Packing quantity**|**Packing quantity**| |---|---|---|---|---| |||**1000**|**3000**|**4000**| |BCP54<br>SOT223|8 mm pitch, 12 mm tape and reel|-115<br>-<br>-135||| |BCX54<br>SOT89|8 mm pitch, 12 mm tape and reel; T1<br>[3]|-115<br>-<br>-135||| ||8 mm pitch, 12 mm tape and reel; T3<br>[4]|-146<br>-<br>-||| |BC54PA<br>SOT1061|4 mm pitch, 8 mm tape and reel|-<br>-115<br>-||| - [1] For further information and the availability of packing methods, see Section 14. - [2] Valid for all available selection groups. - [3] T1: normal taping - [4] T3: 90 rotated taping © NXP B.V. 2011. All rights reserved. BCP54_BCX54_BC54PA All information provided in this document is subject to legal disclaimers. **Rev. 8 — 21 October 2011** **Product data sheet** **15 of 22** **NXP Semiconductors** **45 V, 1 A NPN medium power transistors** ## **BCP54 BCX54 BC54PA ; ;** ## **11. Soldering** **==> picture [397 x 562] intentionally omitted <==** **----- Start of picture text -----**<br> 7<br>3.85<br>3.6<br>3.5<br>0.3<br>1.3 1.2<br>(4 × ) (4 × )<br>4 solder lands<br>solder resist<br>3.9 6.1 7.65 solder paste<br>occupied area<br>1 2 3<br>Dimensions in mm<br>2.3 2.3<br>1.2<br>(3 × )<br>1.3<br>(3 × )<br>6.15 sot223_fr<br>Fig 22. Reflow soldering footprint SOT223 (SC-73)<br>8.9<br>6.7<br>1.9<br>4 solder lands<br>solder resist<br>6.2 8.7<br>occupied area<br>Dimensions in mm<br>1 2 3<br>preferred transport<br>1.9 direction during soldering<br>(3 × )<br>2.7 2.7<br>1.9<br>1.1<br>(2 × ) sot223_fw<br>**----- End of picture text -----**<br> **Fig 23. Wave soldering footprint SOT223 (SC-73)** All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. **==> picture [31 x 7] intentionally omitted <==** **----- Start of picture text -----**<br> 16 of 22<br>**----- End of picture text -----**<br> BCP54_BCX54_BC54PA **Product data sheet** **Rev. 8 — 21 October 2011** **NXP Semiconductors** ## **BCP54 BCX54 BC54PA ; ;** ## **45 V, 1 A NPN medium power transistors** **==> picture [372 x 258] intentionally omitted <==** **----- Start of picture text -----**<br> 4.75<br>2.25<br>2<br>1.9<br>1.2<br>0.2<br>0.85 solder lands<br>1.7 solder resist<br>1.2<br>4.6 4.85<br>0.5 solder paste<br>occupied area<br>1 1.1<br>(3 × ) (2 × )<br>Dimensions in mm<br>1.5 1.5<br>0.6<br>(3 × )<br>0.7<br>(3 × )<br>3.95 sot089_fr<br>**----- End of picture text -----**<br> **Fig 24. Reflow soldering footprint SOT89 (SC-62/TO-243)** **==> picture [353 x 253] intentionally omitted <==** **----- Start of picture text -----**<br> 6.6<br>2.4<br>3.5<br>solder lands<br>7.6<br>0.5 solder resist<br>occupied area<br>1.8<br>(2 × ) Dimensions in mm<br>preferred transport direction during soldering<br>1.9 1.9<br>1.5<br>0.7<br>(2 × )<br>5.3 sot089_fw<br>**----- End of picture text -----**<br> **Fig 25. Wave soldering footprint SOT89 (SC-62/TO-243)** © NXP B.V. 2011. All rights reserved. BCP54_BCX54_BC54PA **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 8 — 21 October 2011** **17 of 22** **BCP54 BCX54 BC54PA ; ;** **NXP Semiconductors** **45 V, 1 A NPN medium power transistors** **==> picture [356 x 369] intentionally omitted <==** **----- Start of picture text -----**<br> 2.1<br>1.3<br>0.5 (2 × )<br>0.4 (2 × )<br>0.5 (2 × ) 0.6 (2 × )<br>1.05<br>2.3 0.6 0.55<br>0.25<br>1.1 1.2<br>0.25<br>0.25<br>0.4<br>0.5<br>1.6<br>1.7<br>solder paste = solder lands Dimensions in mm<br>solder resist occupied area sot1061_fr<br>Reflow soldering is the only recommended soldering method.<br>Fig 26. Reflow soldering footprint SOT1061 (HUSON3)<br>**----- End of picture text -----**<br> © NXP B.V. 2011. All rights reserved. BCP54_BCX54_BC54PA **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 8 — 21 October 2011** **18 of 22** **BCP54 BCX54 BC54PA ; ;** **NXP Semiconductors** **45 V, 1 A NPN medium power transistors** ## **12. Revision history** **Table 10. Revision history** |**Document ID**|**Release date**|**Release date**|||**Data sheet status**|**Change notice**|**Supersedes**| |---|---|---|---|---|---|---|---| |BCP54_BCX54_BC54PA v.8|20111021||||Product data sheet|-|BC635_BCP54_BCX54 v.7| |Modifications:|**•** Type number removed: BC635||||||| ||**•** Type numbers added: BC54PA, BC54-10PA and BC54-16PA||||||| ||**•** Section|1“<br>Product profile<br>”<br>:updated|||||| ||**•** Section|2“<br>Pinning information<br>”<br>:updated|||||| ||**•** Table 6<br>|and|||7<br>:updated according to|latest measurements|| ||**•** Figure 1<br>,2<br>,||||4<br>,5<br>,7<br> to9<br>,15<br>, 17<br>and18<br>: updated||| ||**•** Figure 3<br>,6<br>,||||10<br> to14<br>:added||| ||**•** Section|8“<br>Test information<br>”<br>:added|||||| ||**•** Section|10|“<br>Packing information<br>”<br>:updated||||| ||**•** Section|11|“<br>Soldering<br>”<br>:added||||| ||**•** Section|13|“<br>Legal information<br>”<br>:updated||||| ||||||||| |BC635_BCP54_BCX54 v.7|20070604||||Product data sheet|-|BC635_BCP54_BCX54 v.6| |BC635_BCP54_BCX54 v.6|20050225||||Product data sheet|CPCN2004050|BC635_637_639 v.4| |||||||29|BCP54_55_56 v.5| ||||||||BCX54_55_56 v.4| |BC635_637_639 v.4|20011010||||Product specification|-|BC635_637_639 v.3| |BCP54_55_56 v.5|20030206||||Product specification|-|BCP54_55_56 v.4| |BCX54_55_56 v.4|20011010||||Product specification|-|BCX54_55_56 v.3| © NXP B.V. 2011. All rights reserved. BCP54_BCX54_BC54PA **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 8 — 21 October 2011** **19 of 22** **BCP54 BCX54 BC54PA ; ;** **NXP Semiconductors** **45 V, 1 A NPN medium power transistors** ## **13. Legal information** ## **13.1 Data sheet status** |**Document status[1]**<br>**[2]**|**Product statu**~~**s**~~**[3]**|**Definition**| |---|---|---| |Objective [short] data sheet|Development|This document contains data from the objective specification for product development.| |Preliminary [short] data sheet|Qualification|This document contains data from the preliminary specification.| |Product [short] data sheet|Production|This document contains the product specification.| [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. ## **13.2 Definitions** **Draft —** The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. **Short data sheet —** A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. **Product specification —** The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. ## **13.3 Disclaimers** **Limited warranty and liability —** Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the _Terms and conditions of commercial sale_ of NXP Semiconductors. **Right to make changes —** NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. **Suitability for use —** NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. **Applications —** Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. **Limiting values —** Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. **Terms and conditions of commercial sale —** NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. **No offer to sell or license —** Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. **Export control —** This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. BCP54_BCX54_BC54PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. **Product data sheet Rev. 8 — 21 October 2011 20 of 22** **NXP Semiconductors** ## **BCP54 BCX54 BC54PA ; ;** **45 V, 1 A NPN medium power transistors** **Quick reference data —** The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. ## **13.4 Trademarks** Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. ## **14. Contact information** For more information, please visit: **http://www.nxp.com** For sales office addresses, please send an email to: **salesaddresses@nxp.com** © NXP B.V. 2011. All rights reserved. BCP54_BCX54_BC54PA **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 8 — 21 October 2011** **21 of 22** **BCP54 BCX54 BC54PA ; ;** **NXP Semiconductors** **45 V, 1 A NPN medium power transistors** ## **15. Contents** |**1**|**Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1**| |---|---| |1.1|General description . . . . . . . . . . . . . . . . . . . . . 1| |1.2|Features and benefits. . . . . . . . . . . . . . . . . . . . 1| |1.3|Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1| |1.4|Quick reference data . . . . . . . . . . . . . . . . . . . . 1| |**2**|**Pinning information. . . . . . . . . . . . . . . . . . . . . . 2**| |**3**|**Ordering information. . . . . . . . . . . . . . . . . . . . . 2**| |**4**|**Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3**| |**5**|**Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4**| |**6**|**Thermal characteristics . . . . . . . . . . . . . . . . . . 6**| |**7**|**Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 12**| |**8**|**Test information. . . . . . . . . . . . . . . . . . . . . . . . 14**| |8.1|Quality information . . . . . . . . . . . . . . . . . . . . . 14| |**9**|**Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14**| |**10**|**Packing information . . . . . . . . . . . . . . . . . . . . 15**| |**11**|**Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16**| |**12**|**Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19**| |**13**|**Legal information. . . . . . . . . . . . . . . . . . . . . . . 20**| |13.1|Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20| |13.2|Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20| |13.3|Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20| |13.4|Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21| |**14**|**Contact information. . . . . . . . . . . . . . . . . . . . . 21**| |**15**|**Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22**| Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. **© NXP B.V. 2011.** **All rights reserved.** For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com **Date of release: 21 October 2011 Document identifier: BCP54_BCX54_BC54PA**
Updated at February 9, 2023
Nexperia is a dedicated global leader in discretes, logic, and MOSFET devices. Built on over half a century of semiconductor expertise and operating independently since 2017, the company produces consistently reliable components at an exceptional volume of 85 billion units annually. With its own manufacturing facilities, Nexperia delivers industry-leading small packages that combine power and thermal efficiency with best-in-class quality, meeting the rigorous standards of the automotive sector. Our extensive Nexperia portfolio is heavily focused on discrete semiconductors, providing engineers with a robust selection of core building blocks. This includes a comprehensive range of diodes and rectifiers, featuring a vast selection of Zener single diodes and Schottky diodes designed for precise voltage regulation and efficient power routing. Additionally, we offer an expansive array of bipolar transistors and single MOSFETs tailored for reliable switching and amplification in demanding applications. Beyond these primary offerings, the lineup extends into specialized circuit protection and passive components. This includes transient voltage suppressor (TVS) diodes, Zener array diodes, and small signal diodes, alongside dual MOSFETs and fast recovery rectifiers. For comprehensive design needs, the selection also encompasses integrated passive filters, common mode chokes, and precision timers and oscillators, ensuring a complete solution for high-performance electronic systems.
About Novapart
Novapart is a B2B electronic component broker specialising in stock shortages and cost reduction. We source hard-to-find parts and identify compliant alternatives across a catalogue of 410,000+ components from 500+ manufacturers.
Learn more →Stock Shortage Specialist
When a component is unavailable, discontinued or has an unacceptable lead time, we tap into our network of vetted European and Asian distributors to source what you need — without compromising on quality or traceability.
Request a quote →Compliant Alternatives
We identify pin-to-pin, electrically equivalent substitutes that meet the same certifications (RoHS, AEC-Q100, REACH) as your original specification — validated against datasheets, not just part numbers. Often at a lower cost.
BOM Analysis service →