BAV199Q-7-F

**BAV199** a **DUAL SURFACE MOUNT LOW LEAKAGE DIODE** 

## **Features** 

## **Mechanical Data** 

- Surface Mount Package Ideally Suited for Automated Insertion 

- Very-Low Leakage Current 

- **Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

- **PPAP Capable (Note 4)** 

- **Qualified to AEC-Q101 Standards for High Reliability** 

- Case: SOT23 

- Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 

- Moisture Sensitivity: Level 1 per J-STD-020 

- Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe (Lead-Free Plating). Solderable per MIL-STD-202, Method 208 

- Polarity: See Diagram 

- Weight: 0.008 grams (Approximate) 

SOT23 

Top View 

Top View Internal Schematic 

## **Ordering Information** (Note 6) 

|**Ordering Informationg Information Information** (Note 6)|(Note 6)|||
|---|---|---|---|
|**Part Number**|**Qualification**|**Case**|**Packaging**|
|BAV199-7-F(Note 5)|Commercial|SOT23|3000/Tape & Reel|
|BAV199-13-F(Note 5)|Commercial|SOT23|10,000/Tape & Reel|
|BAV199Q-7-F|Automotive|SOT23|3000/Tape & Reel|
|BAV199Q-13-F|Automotive|SOT23|10,000/Tape &Reel|



- Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 

   2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

   3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

   4. Automotive products are AEC-Q101 qualified and are PPAP capable. Automotive, AEC-Q101 and standard products are electrically and thermally the same, except where specified. For more information, please refer to https://www.diodes.com/quality/. 

   5. Product manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. 

   6. For packaging details, go to our website at http://www.diodes.com. 

## **Marking Information** 

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**----- Start of picture text -----**<br>
K52<br>YM<br>**----- End of picture text -----**<br>


K52 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: G = 2019) 

M = Month (ex: 9 = September) 

## Date Code Key 

||**Year**||**2001**||**2002**||**…..**||**2013**||**2014**<br>**2015**||**2016**||**2017**||**2018**||**2019**||**2020**||**2021**||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||**Code**||M||N||**…..**||A||B<br>C||D||E||F||G||H||I||
||||||||||||||||||||||||||
|**Month**<br>**Jan**<br>**Feb**<br>**Mar**<br>**Apr**<br>**May**<br>**Jun**<br>**Jul**<br>**Aug**<br>**Sep**<br>**Oct**<br>**Nov**<br>**Dec**<br>**Code**<br>1<br>2<br>3<br>4<br>5<br>6<br>7<br>8<br>9<br>O<br>N<br>D<br>~~ee~~|||||||||||||||||||||||||
||BAV199||||||||||1 of 5||||||||||||April 2019|April 2019|
||Document number: DS30232 Rev. 10 - 2||||||||||**www.diodes.com**||||||||||© Diodes Incorporated|||© Diodes Incorporated|



April 2019 © Diodes Incorporated 

**BAV199** 

## **Maximum Ratings** @TA = 25°C unless otherwise specified 

|**Maximum Ratingsgss** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|@TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|85|V|
|RMS Reverse Voltage|VR(RMS)|60|V|
|Forward Continuous Current (Note 7)<br>Single Diode<br>Double Diode|IFM|160<br>140|mA|
|Repetitive Peak Forward Current(Note 7)|IFRM|500|mA|
|Non-Repetitive Peak Forward Surge Current<br>@ t = 1.0µs<br>@ t = 1.0ms<br>@ t= 1.0s|IFSM|4.0<br>1.0<br>0.5|A|



## **Thermal Characteristics** 

|**Thermal Characteristics**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Power Dissipation(Note 7)|PD|250|mW|
|Thermal Resistance Junction to Ambient Air(Note 7)|RϴJA|500|°C/W|
|Operatingand Storage Temperature Range|TJ,TSTG|-65 to +150|°C|



## **Electrical Characteristics** @TA = 25°C unless otherwise specified 

|**Electrical Characteristics **@TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|@TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|@TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|||||
|---|---|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|**Test Condition**|
|Reverse Breakdown Voltage(Note 8)|V(BR)R|85|—|—|V|IR= 100µA|
|Forward Voltage|VF|—|—|0.90<br>1.0<br>1.1<br>1.25|V|IF= 1.0mA<br>IF= 10mA<br>IF= 50mA<br>IF= 150mA|
|Leakage Current (Note 8)|IR|—|—|5.0<br>80|nA<br>nA|VR= 75V<br>VR= 75V,TJ= 150°C|
|Total Capacitance|CT|—|2||pF|VR= 0,f = 1.0MHz|
|Reverse Recovery Time|trr|—|—|3.0|µs|IF= IR= 10mA,<br>Irr=0.1 × IR,RL= 100Ω|



Notes: 7. Part mounted on FR-4 PC board with recommended pad layout, which can be found at website at http://www.diodes.com. 8. Short duration pulse test used to minimize self-heating effect. 

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BAV199 Document number: DS30232 Rev. 10 - 2 

April 2019 © Diodes Incorporated 

**BAV199** 

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300 1,000 eee<br>250 Note  47  es ee es es 7) A A<br>100 e/a<br>200<br>EP<br>| T A  = 150ºC Hfifefi<br>150 10 TA = 125ºC<br>T A  = 5ºC8<br>ee<br>100 es ee ee |) ae ee TA = 25ºC<br>1 TR TA = -55ºC<br>50<br>TY<br>0 0.1 ee<br>ee ee<br>0 25 50 75 100 125 150 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4<br>TA, AMBIENT TEMPERATURE (°C) VF, INSTANTANEOUS FORWARD VOLTAGE (V)<br>Fig. 2  Typical Forward Characteristics<br>Fig. 1  Power Derating Curve, Total Package<br>100 2.0<br>=== 1.8 ee<br>——— ee<br>1.6<br>ee ate<br>1.4<br>10 aa TA = 150ºC 1.2 a  ee<br>T A  = 125ºC 1.0<br>Ae<br>ae TA = 85ºC _ 0.8 pS<br>1<br>0.6<br>S785 nesa ee<br>T A = -55ºC TA = 25ºC 0.4<br>0.2<br>foo ee eeeee<br>0.1 0<br>0 FEET 10 20 30 40 50 err 60 70 80 0 ee 10 20 ee 30 40<br>VR, INSTANTANEOUS REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V)<br>Fig. 3  Typical Reverse Characteristics Fig. 4  Typical Capacitance vs. Reverse Voltage<br>, POWER DISSIPATION (mW)<br>D<br>P<br>, INSTANTANEOUS FORWARD CURRENT (mA)<br>IF<br>F)<br>ρ<br>, TYPICAL TOTAL CAPACITANCE (<br>T<br>C<br>, INSTANTANEOUS REVERSE CURRENT (nA)<br>IR<br>**----- End of picture text -----**<br>


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BAV199 Document number: DS30232 Rev. 10 - 2 

April 2019 © Diodes Incorporated 

**BAV199** 

## **Package Outline Dimensions** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

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**----- Start of picture text -----**<br>
SOT23<br>All 7°<br>H<br>SOT23<br>GAUGE PLANE<br>0.25 Dim  Min  Max  Typ<br>J A  0.37  0.51  0.40<br>K1 K<br>B  1.20  1.40  1.30<br>C  2.30  2.50  2.40<br>a D  0.89  1.03  0.915<br>aa A M th; EEE F  0.45  0.60  0.535<br>(TUT) L L1 6BERE G  1.78  2.05  1.83<br>H  2.80  3.00  2.90<br>J  0.013  0.10  0.05<br>K  0.890  1.00  0.975<br>oF ———<br>C B K1  0.903 1.10 1.025<br>L  0.45 0.61  0.55<br>L1  0.25 0.55 0.40<br>| Lo === M  0.085 0.150 0.110<br>D a  0°  8°  --<br>F G + All Dimensions in mm<br>**----- End of picture text -----**<br>


## **Suggested Pad Layout** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

**SOT23** 

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**----- Start of picture text -----**<br>
Y<br>Y1 at C<br>a<br>Co X Lod X1<br>**----- End of picture text -----**<br>


|**Dimensions**|**Value(in mm)**|
|---|---|
|**C**|2.0|
|**X**|0.8|
|**X1**|1.35|
|**Y**|0.9|
|**Y1**|2.9|



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BAV199 Document number: DS30232 Rev. 10 - 2 

April 2019 © Diodes Incorporated 

**BAV199** 

## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. **LIFE SUPPORT** Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

- A.   Life support devices or systems are devices or systems which: 

   1.  are intended to implant into the body, or 

   2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2019, Diodes Incorporated **www.diodes.com** 

5 of 5 **www.diodes.com** 

BAV199 Document number: DS30232 Rev. 10 - 2 

April 2019 © Diodes Incorporated