BAS16HTW-13

**BAS16HTW** 7 **SURFACE MOUNT SWITCHING DIODE ARRAY** 

## **Features** 

## **Mechanical Data** 

- Fast Switching Speed 

- High Reverse Breakdown Voltage 

- Low Leakage Current 

- Low Capacitance 

- **Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

- **Qualified to AEC-Q101 Standards for High Reliability** 

- **An Automotive-Compliant Part is Available Under Separate Datasheet (BAS16HTWQ)** 

- Case: SOT363 

- Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 

- Moisture Sensitivity:  Level 1 per J-STD-020 

- Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe. (Lead-Free Plating). Solderable per MIL-STD-202, Method 208 

- Polarity: See Diagram 

- Weight: 0.006 grams (Approximate) 

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SOT363<br>**----- End of picture text -----**<br>


Top View 

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C1 C2 C3<br> A1 A2 A3<br>Top View<br>Internal Schematic<br>**----- End of picture text -----**<br>


## **Ordering Information** (Note 4) 

|**Ordering Informationg Information Information** (Note 4)|**Ordering Informationg Information Information** (Note 4)|**Ordering Informationg Information Information** (Note 4)|**Ordering Informationg Information Information** (Note 4)|
|---|---|---|---|
|||||
|**Part Number**|**Qualification**|**Case**|**Packaging**|
|BAS16HTW-13|AEC-Q101|SOT363|10,000/Tape &Reel|
|BAS16HTW-13R|AEC-Q101|SOT363|10,000/Tape & Reel|



- Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 

   2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

   3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

   4. The "-13R" suffix indicates that the devices are rotated 180° in the carrier tape as compared with the standard "-13" suffix devices. For exact packaging details, go to our website at http://www.diodes.com/products/packages.html. 

## **Marking Information** 

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SOT363<br>**----- End of picture text -----**<br>


KD2 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: C = 2015) M = Month (ex: 9 = September) 

## Date Code Key 

|**Year**||**2015**|**2015**|||**2016**||**2017**|**2017**|||**2018**||**2019**|**2019**|||**2020**||**2021**|**2021**|||**2022**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**Code**||C||||D||E||||F||G||||H||I||||J|
||||||||||||||||||||||||||
|**Month**||**Jan**|**Feb**|||**Mar**||**Apr**|**May**|||**Jun**||**Jul**|**Aug**|||**Sep**||**Oct**|**Nov**|||**Dec**|
|**Code**||1||2||3||4||5||6||7|8|||9||O|N|||D|



1 of 5 **www.diodes.com** 

BAS16HTW Document number: DS37694 Rev. 5 - 2 

April 2016 © Diodes Incorporated 

**BAS16HTW** 

## **Maximum Ratings** (@TA = +25°C, unless otherwise specified.) 

|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|
|---|---|---|---|---|
||||||
|**Characteristic**||**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage||VRRM<br>VRWM<br>VR|100|V|
|RMS Reverse Voltage||VR(RMS)|71|V|
|Forward Continuous Current(Note 5)||IFM|200|mA|
|Repetitive Peak Forward Current||IFRM|500|mA|
|Non-Repetitive Peak Forward Surge Current|@ t = 1.0µs|IFSM|4|A|
||@ t = 1.0ms||1.0||
||@ t = 1.0s||0.5||



## **Thermal Characteristics** 

|**Thermal Characteristics**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Power Dissipation(Note 5)|PD|250|mW|
|Thermal Resistance Junction to Ambient Air(Note 5)|RθJA|500|°C/W|
|Thermal Resistance Junction to Solder Point(Note 6)|RθJSP|260|°C/W|
|Operatingand Storage Temperature Range|TJ,TSTG|-65 to +150|°C|



**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.) **Characteristic Symbol Min Max Unit Test Condition** Reverse Breakdown Voltage (Note 7) V(BR)R 100  V IR = 2.5µA  0.715 IF = 1.0mA Forward Voltage VF  0.855 V IF = 10mA  1.0 IF = 50mA ~~=o~~  1.25 IF = 150mA  0.5 VR = 80V  50 µA VR = 80V ~~——~~ , TJ = +150°C Reverse Current (Note 7) IR  30 VR = 25V, TJ = +150°C ~~EE~~  30 nA VR = 25V Total Capacitance CT  1.5 pF VR = 0, f = 1.0MHz Reverse Recovery Time tRR ~~rs~~  4.0 ns IF = IR = 10mA, ~~=~~ IRR = 0.1 x IR, RL = 100Ω ~~_—SSSE~~ Forward Recovery Voltage VFR  ~~EE es~~ 1.75 ~~ee~~ V IF = 10mA; tR = 20ns Notes: 5. Part mounted on FR-4 PC board with recommended pad layout, please see http://www.diodes.com/package-outlines.html for the latest version. 6. Soldering points at pins C1, C2 and C3. 7. Short duration pulse test used to minimize self-heating effect. BAS16HTW 2 of 5 April 2016 **www.diodes.com** © Diodes Incorporated 

BAS16HTW Document number: DS37694 Rev. 5 - 2 

April 2016 © Diodes Incorporated 

**BAS16HTW** 

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300<br>Note 5<br>250<br>200<br>150<br>100<br>50<br>0<br>0 25 50 75 100 125 150<br>TA, AMBIENT TEMPERATURE ( C)<br>Fig. 1  Power Derating Curve, Total Package<br>100000 SSS SSSSS<br>a| T  = 150°CA<br>10000 T A = 125°C<br>—————————<br>fo<br>1000<br>ee T A = 75°C<br>== SSS —<br>100 ee<br>SS<br>T A  = 25°C<br>10 ee<br>=SSeee====a T A = 0°C<br>I $$ |<br>1 ee T A  = -40°C<br>Fe a|<br>SSS<br>0.1 | A<br>0 10 20 30 40 50 60 70 80 90 100<br>VR, INSTANTANEOUS REVERSE VOLTAGE (V)<br>Fig. 3 Typical Reverse Characteristics, Per Element<br>, INSTANTANEOUS REVERSE CURRENT (nA)<br>IR<br>, POWER DISSIPATION (mW)<br>P<br>D<br>**----- End of picture text -----**<br>


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10000<br>aa aa OCa sea |<br>a<br>1000<br>T A = 150°C<br>100 eee T A = 75°C 7 ee<br>10 49/2 T  A = 25°C<br>1 NASeaea Sf FOeee T A = 0°C<br>pf tT 7t fF Ms fA fp<br>0.1 —_ _ _TY]<br>T A  = -40°C<br>0.01 LLL /L<br>[fP | Fl TF Ff<br>0.001 Eli7)| FF A | | | tl ht ld<br>0 100 200 300 400 500 600 700 800 900 1000 1100 1200<br>V F, INSTANTANEOUS FORWARD VOLTAGE (mV)<br>Fig. 2 Typical Forward Characteristics, Per Element<br>, INSTANTANEOUS FORWARD CURRENT (mA)<br>I<br>F<br>**----- End of picture text -----**<br>


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0.7<br>f = 1MHz<br>0.65<br>0.6 Soeeeeee<br>0.55 N —<br>0.5<br>a el<br>HEEL<br>0.45 SEPP<br>0.4<br>0.350.3 HEE<br>0 5 10 15 20 25 30 35 40<br>VR, DC REVERSE VOLTAGE (V)<br>Fig. 4 Total Capacitance vs.<br>Reverse Voltage, Per Element<br>, TOTAL CAPACITANCE (pF)<br>T<br>C<br>**----- End of picture text -----**<br>


3 of 5 **www.diodes.com** 

BAS16HTW Document number: DS37694 Rev. 5 - 2 

April 2016 © Diodes Incorporated 

**BAS16HTW** 

## **Package Outline Dimensions** 

Please see http://www.diodes.com/package-outlines.html for the latest version. 

## **SOT363** 

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E poy E1 SOT363<br>Dim  Min  Max  Typ<br>A1  0.00 0.10 0.05<br>A2  0.90 1.00 1.00<br>b  0.10 0.30 0.25<br>F c  0.10 0.22  0.11<br>b D  1.80 2.20 2.15<br>E  2.00 2.20 2.10<br>E1  1.15 1.35 1.30<br>D<br>e 0.650 BSC<br>F  0.40 0.45 0.425<br>L  0.25 0.40 0.30<br>a  0°  8°  –<br>A2<br>All Dimensions in mm<br>c a<br>ie<br>A1 e L<br>**----- End of picture text -----**<br>


## **Suggested Pad Layout** 

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Please see http://www.diodes.com/package-outlines.html for the latest version.<br>SOT363<br>C<br>Value<br>Dimensions<br>(in mm)<br>C  0.650<br>Po<br>Y1 G G  1.300<br>X  0.420<br>Y  0.600<br>Y1  2.500<br>Y<br>ot X =<br>**----- End of picture text -----**<br>


4 of 5 **www.diodes.com** 

BAS16HTW Document number: DS37694 Rev. 5 - 2 

April 2016 © Diodes Incorporated 

**BAS16HTW** 

## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. 

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A.   Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 

||2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the|
|---|---|
||labeling can be reasonably expected to result in significant injury to the user.|
|B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the|B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the|
|failure of the life support device or to affect its safety or effectiveness.|failure of the life support device or to affect its safety or effectiveness.|



Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2016, Diodes Incorporated 

**www.diodes.com** 

5 of 5 **www.diodes.com** 

BAS16HTW Document number: DS37694 Rev. 5 - 2 

April 2016 © Diodes Incorporated