BAP51-02,115
RF / Pin Diode, Single, 1.5 ohm, 50 V, SOD-523, 2 Pin, 0.2 pF
- Manufacturer: NXP
- Product type: RF / Pin Diodes
- Diode Configuration:Single; Resistance @ If:1.5ohm; Breakdown Voltage Vbr:50V; Diode Case Style:SOD-523; No. of Pins:2 Pin; Total Capacitance Ct:0.2pF; Forward Current If(AV):50mA; Operati
- SVHC: To Be Advised
- No. of Pins: 2 Pin
- Product Range: -
- Diode Mounting: Surface Mount
- Forward Current: 50mA
- Forward Voltage: 1.1V
- Resistance @ If: 1.5ohm
- Reverse Voltage: 50V
- Diode Case Style: SOD-523
- Diode Capacitance: 0.2pF
- Power Dissipation: 715mW
- Diode Configuration: Single
- Operating Temperature Max: 150°C
| Delivery and price | |
|---|---|
| Units per pack | 3000 |
| Price | 0.076 € |
| Current stock | 50+ |
| Lead time | 7 days |
**==> picture [63 x 51] intentionally omitted <==** ## **BAP51-02** ## **General purpose PIN diode** **Rev. 03 — 2 January 2008** ## **Product data sheet** ## **IMPORTANT NOTICE** Dear customer, As from October 1st, 2006 Philips Semiconductors has a new trade name - NXP Semiconductors, which will be used in future data sheets together with new contact details. In data sheets where the previous Philips references remain, please use the new links as shown below. http://www.philips.semiconductors.com use http://www.nxp.com http://www.semiconductors.philips.com use http://www.nxp.com (Internet) sales.addresses@www.semiconductors.philips.com use salesaddresses@nxp.com (email) The copyright notice at the bottom of each page (or elsewhere in the document, depending on the version) - © Koninklijke Philips Electronics N.V. (year). All rights reserved - is replaced with: - © NXP B.V. (year). All rights reserved. - If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or phone (details via salesaddresses@nxp.com). Thank you for your cooperation and understanding, NXP Semiconductors **==> picture [211 x 101] intentionally omitted <==** **NXP Semiconductors** ## **General purpose PIN diode** ## **BAP51-02** ## **FEATURES** - Low diode capacitance - Low diode forward resistance. ## **APPLICATIONS** - General RF applications. ## **DESCRIPTION** General purpose PIN diode in a SOD523 ultra small SMD plastic package. ## **PINNING** **==> picture [243 x 140] intentionally omitted <==** **----- Start of picture text -----**<br> PIN DESCRIPTION<br>1 cathode<br>2 anode<br>handbook, halfpage 1 2<br>�<br>Top view MAM405<br>Marking code: K1.<br>**----- End of picture text -----**<br> **==> picture [214 x 23] intentionally omitted <==** **----- Start of picture text -----**<br> Fig.1 Simplified outline (SOD523) and symbol.<br>**----- End of picture text -----**<br> ## **LIMITING VALUES** In accordance with the Absolute Maximum Rating System (IEC 60134). |**SYMBOL**|**PARAMETER**|**CONDITIONS**|**MIN.**|**MAX.**|**UNIT**| |---|---|---|---|---|---| |VR|continuous reverse voltage||−|60|V| |IF|continuous forward current||−|50|mA| |Ptot|total power dissipation|Ts= 90°C|−|715|mW| |Tstg|storage temperature||−65|+150|°C| |Tj|junction temperature||−65|+150|°C| ## **ELECTRICAL CHARACTERISTICS** Tj = 25 ° |**SYMBOL**|**PARAMETER**|**CONDITIONS**|**MIN.**|**TYP.**|**MAX.**|**UNIT**| |---|---|---|---|---|---|---| |VF|forward voltage|IF= 50 mA|−|0.95|1.1|V| |VR|reverse voltage|IR= 10µA|50|−|−|V| |IR|reverse current|VR= 50 V|−|−|100|nA| |Cd|diode capacitance|VR= 0; f = 1 MHz|−|0.4|−|pF| |||VR= 1 V; f = 1 MHz|−|0.3|0.55|pF| |||VR= 5 V; f = 1 MHz|−|0.2|0.35|pF| |rD|diode forward resistance|IF= 0.5 mA; f = 100 MHz; note 1|−|5.5|9|Ω| |||IF= 1 mA; f = 100 MHz; note 1|−|3.6|6.5|Ω| |||IF= 10 mA; f = 100 MHz; note 1|−|1.5|2.5|Ω| ## **Note** 1. Guaranteed on AQL basis: inspection level S4, AQL 1.0. ## **THERMAL CHARACTERISTICS** |**SYMBOL**|**PARAMETER**|**VALUE**|**UNIT**| |---|---|---|---| |Rth j-s|thermal resistance from junction to soldering point|85|K/W| 2 of 6 Rev. 03 - 2 January 2008 NXP Semiconductors ## General purpose PIN diode ## BAP51-02 ## **GRAPHICAL DATA** **==> picture [241 x 188] intentionally omitted <==** **----- Start of picture text -----**<br> MGS322<br>10<br>handbook, halfpage<br>rD<br>(Ω)<br>5<br>2<br>1<br>10 [−][1] 1 10<br>IF (mA)<br>**----- End of picture text -----**<br> **==> picture [100 x 8] intentionally omitted <==** **----- Start of picture text -----**<br> f = 100 MHz; Tj = 25 °C.<br>**----- End of picture text -----**<br> Fig.2 Forward resistance as a function of forward current; typical values. **==> picture [241 x 238] intentionally omitted <==** **----- Start of picture text -----**<br> MGT264<br>0<br>handbook, halfpage<br>|s21| [2]<br>(dB)<br>−0.5<br>(1) (2) (3)<br>−1<br>−1.5<br>−2<br>−2.5<br>0.5 1 1.5 2 2.5 3<br>f (GHz)<br>(1) IF = 10 mA. (2) IF = 1 mA. (3) IF = 0.5 mA.<br>Diode inserted in series with a 50 Ω stripline circuit and biased via the<br>analyzer Tee network.<br>Tamb = 25 °C.<br>**----- End of picture text -----**<br> Fig.4 Insertion loss (|s21|[2] ) of the diode as a function of frequency; typical values. **==> picture [241 x 188] intentionally omitted <==** **----- Start of picture text -----**<br> MGS323<br>500<br>handbook, halfpage<br>Cd<br>(fF)<br>400<br>300<br>200<br>100<br>0<br>0 4 8 12 16 20<br>VR (V)<br>**----- End of picture text -----**<br> **==> picture [93 x 8] intentionally omitted <==** **----- Start of picture text -----**<br> f = 1 MHz; Tj = 25 °C.<br>**----- End of picture text -----**<br> Fig.3 Diode capacitance as a function of reverse voltage; typical values. **==> picture [242 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> MGT265<br>0<br>handbook, halfpage<br>|s21| [2]<br>(dB)<br>−5<br>−10<br>−15<br>−20<br>−25<br>0.5 1 1.5 2 2.5 3<br>f (GHz)<br>**----- End of picture text -----**<br> Diode zero biased and inserted in series with a 50 Ω stripline circuit. Tamb = 25 °C. Fig.5 Isolation (|s21|[2] ) of the diode as a function of frequency; typical values. 3 of 6 Rev. 03 - 2 January 2008 NXP Semiconductors ## General purpose PIN diode ## BAP51-02 ## **PACKAGE OUTLINE** **==> picture [479 x 284] intentionally omitted <==** **----- Start of picture text -----**<br> Plastic surface-mounted package; 2 leads SOD523<br>A<br>c<br>HE v M A<br>D A<br>0 0.5 1 mm<br>scale<br>1 2<br>DIMENSIONS (mm are the original dimensions)<br>E bp<br>UNIT A bp c D E HE v<br>0.65 0.34 0.17 1.25 0.85 1.65<br>mm 0.1<br>(1) 0.58 0.26 0.11 1.15 0.75 1.55<br>Note<br>1. The marking bar indicates the cathode.<br>OUTLINE REFERENCES EUROPEAN<br>ISSUE DATE<br>VERSION IEC JEDEC JEITA PROJECTION<br>02-12-13<br> SOD523 SC-79<br>06-03-16<br>**----- End of picture text -----**<br> 4 of 6 Rev. 03 - 2 January 2008 **BAP51-02** **NXP Semiconductors** **General purpose PIN diode** ## **Legal information** ## **Data sheet status** |**Document statu**|**s**<br>**[1]**<br>**[2]**<br>**Product status**<br>**[3]**<br>**Defnition**| |---|---| |Objective [short] data sheet<br>Development<br>This document contains data from the objective specifcation for product development.|| |Preliminary [short] data sheet<br>Qualifcation<br>This document contains data from the preliminary specifcation.|| |Product [short] data sheet<br>Production<br>This document contains the product specifcation.|| [1] Please consult the most recently issued document before initiating or completing a design. [2] [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. ## **Draft —** The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. **Short data sheet —** A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. ## **Disclaimers** **General —** Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. **Right to make changes —** NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. **Suitability for use —** NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. **Applications —** Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. **Limiting values —** the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. **Terms and conditions of sale —** NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. **No offer to sell or license —** Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. ## **Trademarks** Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. ## **Contact information** For additional information, please visit: **http://www.nxp.com** **salesaddresses@nxp.com** 5 of 6 Rev. 03 - 2 January 2008 **BAP51-02** **NXP Semiconductors** **General purpose PIN diode** ## **Revision history** ## **Revision history** |**Document ID**|**Release date**|**Data sheet status**|**Change notice**|**Supersedes**| |---|---|---|---|---| |BAP51-02_N_3|20080102|Product data sheet|-|BAP51-02_2| |Modifcations:|**•** Package outline drawing on page 4 changed|||| |BAP51-02_2|20000706|Product specifcation|-|BAP51-02_N_1| |(9397 750 07151)||||| |BAP51-02_N_1|19990628|Preliminary specifcation|-|-| |(9397 750 06152)||||| **==> picture [151 x 121] intentionally omitted <==** Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. **All rights reserved.** **© NXP B.V. 2008.** For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com **Date of release: 2 January 2008 Document identifier: BAP51-02_N_3**
Updated at March 24, 2026
NXP Semiconductors is a global leader in secure connectivity solutions, driving innovation across the automotive, industrial, IoT, mobile, and communications infrastructure markets. By developing advanced, purpose-built technologies, NXP enables devices to sense, think, connect, and act intelligently, delivering rigorously tested components that make the connected world safer and more efficient. Within the semiconductor space, NXP is highly regarded for its extensive range of high-performance integrated circuits and discrete devices. The brand's portfolio excels in drivers and interfaces, featuring a comprehensive selection of I/O expanders designed to streamline complex system architectures. For demanding high-frequency and wireless applications, NXP provides industry-leading RF FETs and RF/PIN diodes engineered to deliver exceptional signal integrity, efficiency, and reliability. The NXP product lineup further extends to essential discrete components, including versatile bipolar transistors, JFETs, and small signal diodes optimized for precision switching and amplification. Additionally, the portfolio supports advanced automation and smart applications with precision IC sensors, such as MEMS accelerometers, alongside specialized power management solutions like AC/DC LED driver ICs and single MOSFETs for cutting-edge electronics design.
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