BAL99-7-F

**BAL99** 

**SURFACE MOUNT SWITCHING DIODE** 

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Green<br>**----- End of picture text -----**<br>


## **Features** 

- Fast Switching Speed: Maximum of 4ns 

- Low Forward Voltage: Maximum of 0.715V at 1mA 

- Low Capacitance: Maximum of 2pF 

- Surface Mount Package Ideally Suited for Automated Insertion 

- For General Purpose Switching Applications 

- **Lead-Free Finish; RoHS Compliant (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

## **Mechanical Data** 

- Case: SOT23 

- Case Material:  Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 

- Moisture Sensitivity: Level 1 per J-STD-020D 

- Terminals: Solderable per MIL-STD-202, Method 208 **e3** 

- Lead Free Plating (Matte Tin Finish annealed over Alloy 42 leadframe). 

- Polarity: See Diagram 

- Weight: 0.008 grams (approximate) 

wm SOT23 ( ~~5~~ TOP VIEW TOP VIEW Internal Schematic 

## **Ordering Information** (Note 4 & 5) 

|**Ordering Informationg Information Information**(Note 4 & 5)|||
|---|---|---|
|**Part Number**|**Case**|**Packaging**|
|BAL99-7-F|SOT23|3000/Tape & Reel|



- Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 

   2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

   3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

   4. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. 

   5. Product manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code 

   - V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. 

## **Marking Information** 

|K = SAT (Shanghai Assembly / Test site)<br>JF = Product Type Marking Code<br>YM = Date Code Marking<br>Y = Year ex: Z = 2012<br>KJF<br>YM|K = SAT (Shanghai Assembly / Test site)<br>JF = Product Type Marking Code<br>YM = Date Code Marking<br>Y = Year ex: Z = 2012<br>KJF<br>YM|K = SAT (Shanghai Assembly / Test site)<br>JF = Product Type Marking Code<br>YM = Date Code Marking<br>Y = Year ex: Z = 2012<br>KJF<br>YM|CJF||||YM||C = CAT (Chengdu Assembly / Test site)<br>JF = Product Type Marking Code<br>YM = Date Code Marking<br>Y = Year ex: Z = 2012|C = CAT (Chengdu Assembly / Test site)<br>JF = Product Type Marking Code<br>YM = Date Code Marking<br>Y = Year ex: Z = 2012|C = CAT (Chengdu Assembly / Test site)<br>JF = Product Type Marking Code<br>YM = Date Code Marking<br>Y = Year ex: Z = 2012|
|---|---|---|---|---|---|---|---|---|---|---|---|
|M = Month ex: 9 = September|||||||||M = Month ex: 9 = September|||
|Date Code Key<br>**Year**<br>**1998**<br>**1999**<br>**2000**<br>**2001**<br>**2002**<br>**Code**<br>J<br>K<br>L<br>M<br>N<br>**Month**<br>**Jan**<br>**Feb**<br>**Mar**<br>**Apr**<br>**Code**<br>1<br>2<br>3<br>4<br>~~**e**e~~<br>~~ee~~||**…..**<br>**2012**<br>**2013**<br>**2014**<br>**2015**<br>**2016**<br>**2017**<br>**2018**<br>**2019**<br>**2020**<br>…..<br>Z<br>A<br>B<br>C<br>D<br>E<br>F<br>G<br>H<br>**May**<br>**Jun**<br>**Jul**<br>**Aug**<br>**Sep**<br>**Oct**<br>**Nov**<br>**Dec**<br>5<br>6<br>7<br>8<br>9<br>O<br>N<br>D<br>~~e~~||||||||||



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BAL99 Document number: DS12009 Rev. 16 - 2 

July 2012 © Diodes Incorporated 

**BAL99** 

## **Maximum Ratings** (@TA = +25°C, unless otherwise specified.) 

|**Maximum Ratingsgss** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|(@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|||
|---|---|---|---|
|**Characteristic**|**Symbol **|**Value**|**Unit**|
|Non-Repetitive Peak Reverse Voltage|VRM|100|V|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|75|V|
|RMS Reverse Voltage|VR(RMS)|53|V|
|Forward Continuous Current(Note 6)|IFM|300|mA|
|Non-Repetitive Peak Forward Surge Current<br>@ t = 1.0µs<br>@ t= 1.0s|IFSM|2.0<br>1.0|A|



## **Thermal Characteristics** 

|**Thermal Characteristics**||||
|---|---|---|---|
|**Characteristic**|**Symbol **|**Value**|**Unit**|
|Power Dissipation(Note 6)|PD|350|mW|
|Thermal Resistance Junction to Ambient Air(Note 6)|RθJA|357|°C/W|
|Operating and Storage Temperature Range|TJ, TSTG|-65 to +150|°C|



## **Electrical Characteristics** (@TA = +25°C, unless otherwise specified.) 

|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.)A = +25°C, unless otherwise specified.)= +25°C, unless otherwise specified.)|
|---|---|---|---|---|---|
|||||||
|**Characteristic**|**Symbol **|**Min**|**Max **|**Unit**|**Test Condition **|
|Reverse Breakdown Voltage(Note 7)|V(BR)R|75|⎯|V|IR= 100µA|
|Forward Voltage|(BR)R<br>VF|⎯|0.715<br>0.855<br>1.0<br>1.25|V|IF= 1.0mA<br>IF= 10mA<br>IF= 50mA<br>IF= 150mA|
|Reverse Current (Note 7)|IR|⎯|2.5<br>50<br>30<br>25|µA<br>µA<br>µA<br>nA|VR= 75V<br>VR= 75V, TJ= +150°C<br>VR= 25V, TJ= +150°C<br>VR= 20V|
|Total Capacitance|CT|⎯|2.0|pF|VR= 0,f = 1.0MHz|
|Reverse Recovery Time|trr|⎯|4.0|ns|IF= IR= 10mA,<br>Irr= 0.1 x IR,RL= 100Ω|



Notes: 6.   Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 7.   Short duration pulse test used to minimize self-heating effect. 

2 of 4 **www.diodes.com** 

BAL99 Document number: DS12009 Rev. 16 - 2 

July 2012 © Diodes Incorporated 

**BAL99** 

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500<br>400<br>pi td dt See Note 6<br>tet ey tt tt<br>300<br>200<br>SENS<br>|i} N yt tt<br>100 Se eeeNeeee<br>See<br>0 Pt | eeeNeee| EERE |<br>0 100 200<br>TA, AMBIENT TEMPERATURE (°C)<br>Figure 1  Power Derating Curve<br>, POWER DISSIPATION (mW)<br>D<br>P<br>**----- End of picture text -----**<br>


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10,0001,000 == =<br>—_—_=_—_—_—_—_=_—_=_=_=_==_=_ =<br>100<br>Se S E<br>===> ==——<br>10 ====S==——<br>1 2<br>0.1 =2=62=====A<br>0 20 40 60 80 100<br>VR, INSTANTANEOUS REVERSE VOLTAGE (V)<br>Figure 3  Typical Reverse Characteristics<br>, INSTANTANEOUS REVERSE CURRENT (nA)<br>IR<br>**----- End of picture text -----**<br>


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1<br>a72a<br>0.1 e/ a<br>Ee<br>0.01<br>Y P<br>S n<br>as<br>0.001<br>SyLPR<br>0 0.5 1.0 1.5<br>VF, INSTANTANEOUS FORWARD VOLTAGE (V)<br>Figure 2  Typical Forward Characteristics<br>2.0<br>1.8<br>1.6 RU TTRTATMIT<br>1.4<br>1.2<br>NUTT TTTTT<br>1.0<br>PSE<br>0.8<br>0.6<br>Peo<br>0.4 SRR RRRRReeeneee<br>0.2<br>0.0 ete PEELELLELEL ELLE<br>0 10 20 30 40<br>VR, DC REVERSE VOLTAGE (V)<br>Figure 4  Total Capacitance vs. Reverse Voltage<br>, INSTANTANEOUS FORWARD CURRENT (A)<br>IF<br>, TOTAL CAPACITANCE (pF)<br>T<br>C<br>**----- End of picture text -----**<br>


## **Package Outline Dimensions** 

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A SOT23<br>aL ie ee Dim  Min  Max  Typ<br>A  0.37  0.51  0.40<br>ee ee<br>B  1.20  1.40  1.30<br>B C C 2.30 2.50 2.40<br>D  0.89 1.03 0.915<br>ma ee<br>F  0.45 0.60 0.535<br>TF y | ee G 1.7 ee 8 2. ee 05 1.83<br>a a ee ee ee<br>H H  2.80  3.00  2.90<br>J  0.013 0.10  0.05<br>== TE<br>K M K  0.903 1.10 1.00<br>K1<br>K1  -  -  0.400<br>D<br>J F G f L t FSS M L  0.0850.45 00.18 .61  00.11 .55<br>α  0°  8°  -<br>ee ee ee ee<br>All Dimensions in mm<br>(G a) ee ee ee<br>**----- End of picture text -----**<br>


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BAL99 Document number: DS12009 Rev. 16 - 2 

July 2012 © Diodes Incorporated 

**BAL99** 

## **Suggested Pad Layout** 

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Y<br>Z<br>C<br>LE Lt<br>X E<br>maha<br>**----- End of picture text -----**<br>


|**Dimensions**|**Value (in mm)**|
|---|---|
|**Z**|**()**<br>2.9|
|**X**|0.8|
|**Y**|0.9|
|**C**|2.0|
|**E**|1.35|



## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others.  Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

Products described herein may be covered by one or more United States, international or foreign patents pending.  Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

A.   Life support devices or systems are devices or systems which: 

1. are intended to implant into the body, or 

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated.  Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2012, Diodes Incorporated 

**www.diodes.com** 

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BAL99 Document number: DS12009 Rev. 16 - 2 

July 2012 

© Diodes Incorporated