B82473M1104K000

## **SMT power inductors** 

Size 8.3 x 7.5 x 5.5 (mm) 

**Series/Type: B82473M1 Ordering code:** Date: June 2012 

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Content of header bars 1 and 2 of data sheet will be automatically entered in headers and footers! Please fill in the<br>table and then change the color to "white". This ensures that the table disappears (invisible) for the customer PDF.<br>Don't change formatting when entering or pasting text in the table and don't add any cell or line in and to it!<br>Identification/Classification 1   SMT power inductors<br>(header 1 + top left bar):<br>Identification/Classification 2   Size 8.3 x 7.5 x 5.5 (mm)<br>(header 2 + bottom left header bar):<br>Ordering code: (top right header bar)<br>Series/Type: (bottom right header bar)  B82473M1<br>Preliminary data (optional):<br>(if necessary)<br>Department:  IN TCF PMD A<br>**----- End of picture text -----**<br>


Date:  EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information June 2012 contained therein without EPCOS' prior express consent is prohibited. 

EPCOS AG is a TDK Group Company. 

~~Lo~~ **SMT power inductors Size 8.3 x 7.5 x 5.5 (mm) B82473M1** 

**Rated inductance 10 ... 470** µ **H Rated current 0.34 ... 2.3 A** 

## **Construction** 

■ Ferrite core 

■ Winding: enamel copper wire 

■ Winding soldered to terminals ■ Injection molded base 

## **Features** 

■ High mechanical stability 

■ Temperature range up to +150 °C 

■ High rated current 

■ Low DC resistance 

■ Suitable for lead-free reflow soldering as referenced in JEDEC J-STD 020D 

■ Qualification to AEC-Q200 

■ RoHS-compatible 

## **Applications** 

■ Filtering of supply voltages ■ Coupling, decoupling 

■ DC/DC converters 

■ Automotive electronics 

## **Terminals** 

■ Base material CuSn6P ■ Layer composition Ni, Sn (lead-free) ■ Electro-plated 

## **Marking** 

■ Marking on component: L value (µH, coded), manufacturing date (YWWD) ■ Minimum data on reel: Manufacturer, ordering code, L value, quantity, date of packing 

## **Delivery mode and packing unit** 

■ 16-mm blister tape, wound on 330-mm reel ■ Packing unit: 1000 pcs./reel 

IN TCF PMD A 

June 2012 

_**Please read Cautions and warnings and Important notes at the end of this document**_ . 

Page 2 of 7 

~~ee~~ **SMT power inductors Size 8.3 x 7.5 x 5.5 (mm) B82473M1** 

## **Dimensional drawing and layout recommendation** 

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7.5 max.<br>3.9<br>1)<br>NoeZ oe<br>a 1) i<br>=, |<br>Marking<br>7.3 max.<br>_<br>2.8<br>2.3<br>2.8<br>5.5 max.<br>8.3 max.<br>**----- End of picture text -----**<br>


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1) Soldering area<br>**----- End of picture text -----**<br>


## Dimensions in mm 

Component tolerances 0.2 mm unless otherwise noted. 

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IND0482-K-E<br>**----- End of picture text -----**<br>


## **Taping and packing** 

## Blister tape 

## Reel 

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4±0.1<br>21±0.5 2.5±0.5<br>Component 1.5+0.1 2±0.1<br>13±0.2<br>re<br>1.0<br>: yy b 6 - -4 aka y<br>330±1 22.4 max.<br>1.5 min. IND0347-5<br>6.05 max. 12±0.1<br>Direction of unreeling<br>IND0364-H-E<br>1.75±0.1<br>7.5±0.1 75±1<br>8.4 16±0.3<br>**----- End of picture text -----**<br>


Dimensions in mm 

IN TCF PMD A 

June 2012 

_**Please read Cautions and warnings and Important notes at the end of this document**_ . 

Page 3 of 7 

~~a~~ **SMT power inductors Size 8.3 x 7.5 x 5.5 (mm) B82473M1** 

## **Technical data and measuring conditions** 

|Rated inductance LR|Measured with LCR meter Agilent 4284A at frequency fL,<br>0.1 V,+20°C|
|---|---|
|Rated temperature TR|+85 °C|
|Rated current IR|Max. permissible DC with temperature increase of ≤40 K<br>at rated temperature|
|Saturation current ISat|Max. permissible DC with inductance decrease ∆L/L0of<br>approx. 10%,|
|DC resistance Rtyp|Measured at +20 °C|
|Solderability (lead-free)|Dip and look method Sn95.5Ag3.8Cu0.7:<br>+(2455) °C, (30.3) s<br>Wetting of soldering area90%<br>(based on IEC 60068-2-58)|
|Resistance to solderingheat|+260 °C,40 s(as referenced in JEDEC J-STD 020D)|
|Climatic category|55/150/56(to IEC 60068-1)|
|Storage conditions|Mounted:   –55 °C … +150 °C<br>Packaged:–25°C …+40°C,≤75% RH|
|Weight|Approx. 0.8g|



## **Characteristics and ordering codes** 

|||~~i~~|~~ee~~|~~ee~~|~~ee~~||
|---|---|---|---|---|---|---|
|LR<br>µH|Tolerance<br>~~ee~~|fL<br>MHz<br>~~ee~~<br>~~i~~|IR<br>A<br>~~ee~~<br>~~ee~~|Isat<br>A<br>~~ee~~<br>~~ee~~|Rmax<br>Ω<br>~~ee~~<br>~~ee~~|Ordering code|
|10|10% = K|0.1<br>~~i~~|2.30<br>~~ee ~~<br>~~a~~|2.50<br> ~~ee ~~|0.07<br> ~~ee~~|B82473M1103K000|
|15||0.1<br>~~i~~<br>~~ee a~~|1.80<br>~~a~~<br>~~a~~|2.00|0.09|B82473M1153K000|
|22||0.1<br>~~ee a~~|1.50<br>~~a~~|1.60|0.11|B82473M1223K000|
|33||0.1<br>~~ee a~~<br>~~ia~~|1.20<br>~~a~~<br>~~ia~~|1.30<br>~~ia~~|0.13|B82473M1333K000|
|47||0.1<br>~~i~~<br>~~ee~~|1.10<br>~~ia~~<br>|1.20|0.18|B82473M1473K000|
|68||0.1<br><br>~~ee ~~|0.85<br>~~a~~<br> ~~a~~|0.90|0.28|B82473M1683K000|
|100||0.1<br><br>~~ee ~~<br>~~ia~~|0.72<br>~~a~~<br> <br>~~ia~~|0.80<br>~~ia~~|0.43|B82473M1104K000|
|150||0.1<br>~~i~~<br>~~ee~~|0.58<br>~~ia~~<br>|0.65|0.64|B82473M1154K000|
|220||0.1<br><br>~~ee ~~|0.49<br>~~a~~<br> ~~a~~|0.55|0.96|B82473M1224K000|
|330||0.1<br><br>~~ee ~~<br>~~i~~<br>~~ee~~|0.40<br>~~a~~<br> <br>~~a~~|0.45|1.26|B82473M1334K000|
|470||0.1<br>~~ee~~|0.34|0.40|1.96|B82473M1474K000|



IN TCF PMD A 

June 2012 

_**Please read Cautions and warnings and Important notes at the end of this document**_ . 

Page 4 of 7 

~~Lee~~ **SMT power inductors Size 8.3 x 7.5 x 5.5 (mm) B82473M1** 

## **Impedance versus frequency (typical curve)** 

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1000000.0<br>Z/Ohm<br>10000.0<br>100.0<br>1.0<br>SSHSSEet<br>0.0 eeell<br>0.0 0.1 1.0 10.0 100.0<br>f/MHz<br>**----- End of picture text -----**<br>


## **Inductance derating versus load current (typical curve)** 

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1000<br>L/µH<br>100<br>10<br>1<br>0.1 1.0 10.0<br>I/A<br>**----- End of picture text -----**<br>


**Current derating Iop/IR versus ambient temperature TA** (rated temperature TR = +85 °C) 

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IND0602-K<br>1.2<br>| IIopR 1.0 LEEPTE<br>PELE LET ETN EET<br>0.8 PITT ET TT ETN TTT<br>0.6 PLEPTET TTET TETTT TTTTATTATTT<br>PTET ETT TET TN<br>0.4 PTET ETT TTT TT TAL<br>PTET ET TT ETT TT<br>0.2 PTET ETT TTT TT TT<br>PITT ET TT TTT [TTT]<br>0 FL ET [TITEL] TTT ET ˚<br>0 20 40 60 80 100 120 C 150<br>TA<br>**----- End of picture text -----**<br>


IN TCF PMD A 

June 2012 

_**Please read Cautions and warnings and Important notes at the end of this document**_ . 

Page 5 of 7 

~~LT~~ **SMT power inductors Size 8.3 x 7.5 x 5.5 (mm) B82473M1** 

## **Cautions and warnings** 

- Please note the recommendations in our Inductors data book (latest edition) and in the data sheets. 

- Particular attention should be paid to the derating curves given there. 

- The soldering conditions should also be observed. Temperatures quoted in relation to wave soldering refer to the pin, not the housing. 

- If the components are to be washed varnished it is necessary to check whether the washing varnish agent that is used has a negative effect on the wire insulation, any plastics that are used, or on glued joints. In particular, it is possible for washing varnish agent residues to have a negative effect in the long-term on wire insulation 

- Washing processes may damage the product due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts, which might lead to reduced reliability or lifetime. 

- The following points must be observed if the components are potted in customer applications: 

- Many potting materials shrink as they harden. They therefore exert a pressure on the plastic housing or core. This pressure can have a deleterious effect on electrical properties, and in extreme cases can damage the core or plastic housing mechanically. 

- It is necessary to check whether the potting material used attacks or destroys the wire insulation, plastics or glue. 

- The effect of the potting material can change the high-frequency behaviour of the components. 

- Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to breakage of the core. 

- Even for customer-specific products, conclusive validation of the component in the circuit can only be carried out by the customer. 

IN TCF PMD A 

June 2012 

_**Please read Cautions and warnings and Important notes at the end of this document**_ . 

Page 6 of 7 

~~FC~~ **Important notes** 

The following applies to all products named in this publication: 

1. Some parts of this publication contain **statements about the suitability of our products for certain areas of application** . These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out **that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application.** As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 

2. We also point out that **in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified.** In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 

3. **The warnings, cautions and product-specific notes must be observed.** 

4. In order to satisfy certain technical requirements, **some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous)** . Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 

5. We constantly strive to improve our products. Consequently, **the products described in this publication may change from time to time** . The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also **reserve the right to discontinue production and delivery of products** . Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 

6. Unless otherwise agreed in individual contracts, **all orders are subject to the current version of the “General Terms of Delivery for Products and Services in the Electrical Industry” published by the German Electrical and Electronics Industry Association (ZVEI)** . 

7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CeraLink, CSMP, CSSP, CTVS, DeltaCap, DigiSiMic, DSSP, FilterCap, FormFit, MiniBlue, MiniCell, MKD, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are **trademarks registered or pending** in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks. 

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