B72590D0050A060

## **CeraDiodes** 

## Standard series 

## **Series/Type:** 

Date: November 2025 

The following products presented in this data sheet are being withdrawn. 

|Ordering Code|Substitute Product|Date of<br>Withdrawal|Deadline Last<br>Orders|Last Shipments|
|---|---|---|---|---|
|B72714D0200A060||**2021-10-01**|**2022-01-07**|**2022-04-08**|
|B72440C0050A160||2021-10-01|2022-01-07|2022-04-08|



For further information please contact your nearest TDK sales office, which will also support you in selecting a suitable substitute. The addresses of our worldwide sales network are presented at www.tdk-electronics.tdk.com/sales. 

© TDK Electronics AG 2025. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without TDK Electronics’ prior express consent is prohibited. 

## **CeraDiodes Standard series** 

## **T ype designation** 

**==> picture [347 x 410] intentionally omitted <==**

**----- Start of picture text -----**<br>
CD S 2 C05 GTA<br>CD  � CeraDiode<br>Device<br>S � Single device<br>A � Array device<br>Case sizes of single devices<br>Code Case size<br>(inch/mm)<br>1 0201/0603<br>2 0402/1005<br>3 0603/1608<br>4 1003/2508<br>Case sizes of array devices<br>Code Case size<br>(inch/mm)<br>3 0506/1216<br>4 0508/1220<br>5 0612/1632<br>6 1012/2532<br>Rated voltage<br>Code VDC<br>040 4<br>050 5.5/ 5.6<br>090 9<br>120 12<br>150 15<br>160 16<br>180 18<br>200 20/ 22<br>300 30<br>360 36<br>480 48<br>700 70<br>900 90<br>201 200<br>Type<br>GTA � Standard<br>GTB � LED<br>GTH � High-speed<br>HDMI1 � Capacitance value <1 pF<br>HDMI2 � Capacitance value <1 pF<br>**----- End of picture text -----**<br>


Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 2 of 25 

## **CeraDiodes Standard series** 

## **Ordering code system** 

B72590 D 0050 A0 60 **Type, case sizes and device** Chip size Device Ordering code (inch/mm) 0201/0603 Single B72440... 0402/1005 Single B72590... 0603/1608 Single B72500... 1003/2508 Single B72570... 0506/1216 Array B72755... 0508/1220 Array B72714... 0612/1632 Array B72724... 1012/2532 Array B72735... **D** � **CeraDiode Rated voltage** Code VDC 0040 4 0050 5.5/ 5.6 0090 9 0120 12 0150 15 0160 16 0180 18 0200 20/ 22 0300 30 0360 36 0480 48 0700 70 0900 90 0201 200 **Type** A0 � Standard B0 � LED H0 � High-speed H1 � Capacitance value <1 pF H2 � Capacitance value <1 pF **Packaging** 60 � Cardboard tape, 180-mm reel 62 � Blister tape, 180-mm reel 70 � Cardboard tape, 330-mm reel 72 � Blister tape, 330-mm reel 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 3 of 25 

## **CeraDiodes Standard series** ~~—————~~ 

## **Features** 

ESD protection to IEC 61000-4-2, level 4 

- Bidirectional ESD protection in one component No change in ESD protection performance at temperatures up to 85 ° C (temperature derating) 

- Use of parasitic capacitance for EMI suppression and high-frequency filtering (replacement of additional MLCC) High surge current capability 

Single chip 4-fold array 

- Low parasitic inductance 

- Low leakage current 

- Fast response time <0.5 ns 

- Lead-free nickel barrier terminations suitable for lead-free soldering RoHS-compatible 

## **Applications** 

- Interfaces, data lines, power lines and audio lines, pushbuttons, serial ports, ICs and I/O ports 

- Consumer electronic products (TV, DVD player/recorder, set-top box, game consoles, MP3 player, digital still/video camera, etc.) EDP products (desktop and notebook computer, monitor, PDA, printer, memory card, control unit, head set, speaker, HDD, optical drive, etc.) 

Industrial applications 

## **Design** 

Multilayer technology 

Nickel barrier termination (Ag/Ni/Sn) for lead-free soldering 

## **Marking** 

Due to the symmetrical configuration no marking information is needed. 

## **General technical data** 

|Maximum DC operating voltage<br>Typical capacitance<br>Air discharge ESD capability<br>to IEC 61000-4-2<br>Contact discharge ESD capability<br>to IEC 61000-4-2<br>Leakage current1)<br>(Vleak= 5.6 V)<br>Operating temperature<br>(without derating)<br>Storage temperature|VDC,max<br>Ctyp<br>VESD,air<br>VESD,contact<br>Ileak<br>Top<br>LCT/UCT|5.5 ... 22<br>1.5 ... 470<br>15<br>8<br>1<br>40/+85<br>40/+125|V<br>pF<br>kV<br>kV<br>µA<br>°C<br>°C|
|---|---|---|---|



1) Except CDS2C05GTA and CDS3C05GTA Vleak = 3.3 V. Any operating voltage lower than Vleak results in lower leakage current. 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 4 of 25 

**CeraDiodes Standard series** 

## **Electrical specifications and ordering codes** 

**Maximum ratings (Top,max = 85** ° **C) and characteristics (TA = 25** ° **C)** 

|Type|Ordering code|VDC,max<br>V|VBR,min<br>(1 mA)<br>V|<br>Vclamp,max<br>(1 A)<br>V|IPP<br>(8/20 µs)<br>A|PPP<br>(8/20 µs)<br>W|Ctyp<br>(1 MHz, 1 V)<br>pF|
|---|---|---|---|---|---|---|---|
|Array, 4-fold, 0508, no semiconductor diode equivalent||||||||
|CDA4C20GTA|B72714D0200A060|22|24|60|10|600|33|
|Array, 4-fold, 0612, no semiconductor diode equivalent||||||||
|CDA5C20GTA|B72724D0200A062|22|25|50|30|2200|56|
|Single, 0201, no semiconductor diode equivalent||||||||
|CDS1C05GTA1|B72440C0050A160|5.5|11|22|-|-|15|
|Single, 0402, SOD-723||||||||
|CDS2C05GTA<br>CDS2C15GTA|B72590D0050A060<br>B72590D0150A060|5.6<br>15|6.4<br>20|24<br>46|10<br>10|320<br>670|1801)<br>47|
|Single, 0603, SOD-523||||||||
|CDS3C05GTA<br>CDS3C09GTA<br>CDS3C15GTA<br>CDS3C20GTA|B72500D0050A060<br>B72500D0090A060<br>B72500D0150A060<br>B72500D0200A060|5.6<br>9<br>15<br>22|6.4<br>10<br>22<br>25|19<br>30<br>42<br>50|30<br>30<br>30<br>30|1000<br>1600<br>2000<br>2200|4701)<br>2201)<br>1601)<br>56|
|Single, 1003, SOD-323||||||||
|CDS4C12GTA|B72570D0120A060|12|16|46|20|1000|82|



## **Typical characteristics** 

1) Ctyp measured at V = 1 V, f = 1 kHz. 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 5 of 25 

## **CeraDiodes** 

## **Standard series** 

## **Dimensional drawings** 

## Single device 

## Dimensions in mm 

|Case<br>size<br>(inch)<br>(mm)|0201<br>0603||0402<br>1005||0603<br>1608||1003<br>2508||
|---|---|---|---|---|---|---|---|---|
||Min.|Max.|Min.|Max.|Min.|Max.|Min.|Max.|
|l|0.57|0.63|0.85|1.15|1.45|1.75|2.34|2.74|
|w|0.27|0.33|0.4|0.6|0.7|0.9|0.7|0.9|
|h|0.27|0.33|0.4|0.6|0.7|0.9|0.7|0.9|
|k|0.1|0.2|0.1|0.3|0.1|0.4|0.13|0.75|



## Array device 

## Dimensions in mm 

**==> picture [83 x 90] intentionally omitted <==**

|Case<br>size<br>(inch)<br>(mm)|0508<br>1220||0612<br>1632|
|---|---|---|---|
||Min.|Max.|Min.|
|l|1.8|2.2|3.0|
|w|1.05|1.45|1.45|
|h|-|0.9|-|
|d|0.2|0.4|0.25|
|e|0.4|0.6|0.61|
|k|-|0.35|-|



Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 6 of 25 

## **CeraDiodes** 

## **Standard series** 

## **Recommended solder pads** 

## Single device 

**==> picture [35 x 65] intentionally omitted <==**

## Dimensions in mm 

|Dimensions in mm|||||
|---|---|---|---|---|
|Case size<br>(inch)<br>(mm)|0201<br>0603|0402<br>1005|0603<br>1608|1003<br>2508|
|A|0.3|0.6|1.0|0.8|
|B|0.25|0.6|1.0|0.8|
|C|0.3|0.5|1.0|1.45|



## Array device 

## Dimensions in mm 

**==> picture [84 x 66] intentionally omitted <==**

|Dimensions in mm|||
|---|---|---|
|Case size<br>(inch)<br>(mm)|0508<br>1220|0612<br>1632|
|A|0.35|0.5|
|B|0.9|0.7|
|C|0.4|1.2|
|E|0.5|0.76|



Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 7 of 25 

## **CeraDiodes** 

## **Standard series** 

## **Pin configurations** 

Single device 

|Pin|Description|
|---|---|
|P1|GND|
|P2|I/O line|



## Array device 

**==> picture [62 x 41] intentionally omitted <==**

|Pin|Description|
|---|---|
|P1|GND|
|P2|GND|
|P3|GND|
|P4|GND|
|P5|I/O line 1|
|P6|I/O line 2|
|P7|I/O line 3|
|P8|I/O line 4|



Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 8 of 25 

**CeraDiodes Standard series** 

## **Termination** 

Single device 

**==> picture [232 x 139] intentionally omitted <==**

Array device 

**==> picture [187 x 118] intentionally omitted <==**

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 9 of 25 

## **CeraDiodes** 

## **Standard series** 

## **Delivery mode** 

|EIA case size|Taping|Reel size<br>mm|Packing unit<br>pcs.|Type|Ordering code|
|---|---|---|---|---|---|
|0201<br>0402<br>0402<br>0508<br>0603<br>0603<br>0603<br>0603<br>0612<br>1003|Cardboard<br>Cardboard<br>Cardboard<br>Cardboard<br>Cardboard<br>Cardboard<br>Cardboard<br>Cardboard<br>Blister<br>Cardboard|180<br>180<br>180<br>180<br>180<br>180<br>180<br>180<br>180<br>180|15000<br>10000<br>10000<br>4000<br>4000<br>4000<br>4000<br>4000<br>3000<br>4000|CDS1C05GTA1<br>CDS2C05GTA<br>CDS2C15GTA<br>CDA4C20GTA<br>CDS3C05GTA<br>CDS3C09GTA<br>CDS3C15GTA<br>CDS3C20GTA<br>CDA5C20GTA<br>CDS4C12GTA|B72440C0050A160<br>B72590D0050A060<br>B72590D0150A060<br>B72714D0200A060<br>B72500D0050A060<br>B72500D0090A060<br>B72500D0150A060<br>B72500D0200A060<br>B72724D0200A062<br>B72570D0120A060|



Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 10 of 25 

## **CeraDiodes Standard series** 

## **1 Taping and packing for chip and array CeraDiodes** 

## **1.1 Cardboard tape (taping to IEC 60286-3)** 

**==> picture [104 x 46] intentionally omitted <==**

## Dimensions in mm 

|ions in mm||||||
|---|---|---|---|---|---|
|ze (inch)<br>(mm)||**0201**<br>**0**<br>**0603**<br>**1**|**402**<br>**0603**<br>**10**<br>**005**<br>**1608**<br>**25**|**03**<br>**0508**<br>**08**<br>**1220**|**Toler**|
|rtment width|A0|0.38±0.05<br>0.|6<br>0.95<br>1.|0<br>1.6|±0.2|
|rtment length|B0|0.68±0.05<br>1.|15<br>1.8<br>2.|85<br>2.4|±0.2|
|et hole diameter|D0|1.5±0.1<br>1.|5<br>1.5<br>1.|5<br>1.5|+0.1/|
|et holepitch|P0|4.0±0.11)<br>4.|0<br>4.0<br>4.|0<br>4.0|±0.11)|
|e center hole to center<br>tment|P2|2.0±0.05<br>2.|0<br>2.0<br>2.|0<br>2.0|±0.05|
|component compartments|P1|2.0±0.05<br>2.|0<br>4.0<br>4.|0<br>4.0|±0.1|
|idth|W|8.0±0.3<br>8.|0<br>8.0<br>8.|0<br>8.0|±0.3|
|e edge to center of hole|E|1.75±0.1<br>1.|75<br>1.75<br>1.|75<br>1.75|±0.1|
|e center hole to center<br>tment|F|3.5±0.05<br>3.|5<br>3.5<br>3.|5<br>3.5|±0.05|
|e compartment to edge|G|0.75 min.<br>0.|75<br>0.75<br>0.|75<br>0.75|min.|
|ss tape|T|0.42±0.02<br>0.|6<br>0.9<br>0.|95<br>0.95|max.|
|thickness|T2|0.4 min.<br>0.|7<br>1.1<br>1.|1<br>1.10|max.|



1) ≤± 0.2 mm over 10 sprocket holes 

**==> picture [168 x 47] intentionally omitted <==**

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 11 of 25 

## **CeraDiodes** 

## **Standard series** 

## **1.2 Blister tape (taping to IEC 60286-3)** 

**==> picture [174 x 105] intentionally omitted <==**

## Dimensions in mm 

|ions in mm||||||
|---|---|---|---|---|---|
|ize (inch)<br>(mm)||**0506**<br>**1216**|**0612**<br>**1632**|**1012**<br>**2532**|**Tolerance**|
|rtment width|A0|1.5|1.8|2.8|±0.2|
|rtment length|B0|1.8|3.4|3.5|±0.2|
|rtment height|K0|0.8|1.8|1.8|max.|
|et hole diameter|D0|1.5|1.5|1.5|+0.1/�0|
|rtment hole diameter|D1|0.3|0.3|0.3|min.|
|et holepitch|P0|4.0|4.0|4.0|±0.11)|
|e center hole to center<br>tment|P2|2.0|2.0|2.0|±0.05|
|component compartments|P1|4.0|4.0|4.0|±0.1|
|idth|W|8.0|8.0|8.0|±0.3|
|e edge to center of hole|E|1.75|1.75|1.75|±0.1|
|e center hole to center<br>tment|F|3.5|3.5|3.5|±0.05|
|e compartment to edge|G|0.75|0.75|0.75|min.|
|ess tape|T|0.3|0.3|0.3|max.|
|thickness|T2|1.3|2.5|2.5|max.|



1) ≤± 0.2 mm over 10 sprocket holes 

**==> picture [168 x 47] intentionally omitted <==**

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 12 of 25 

## **CeraDiodes** 

## **Standard series** 

## **1.3 Reel packing** 

**==> picture [79 x 100] intentionally omitted <==**

## Dimensions in mm 

||**Di**|**mensions**|**Tolerance**|**Dimensions**|**Tolerance**|
|---|---|---|---|---|---|
|Reel diameter|A<br>18|0|+0/ –3|330|+0/ –2|
|Reel width(inside)|W1<br>8.|4|+1.5/ –0|8.4|+1.5/ –0|
|Reel width(outside)|W2<br>14|.4|max.|14.4|max.|



Package: 8-mm tape Reel material: Plastic 

## **1.4 Packing units** 

|**Case size**<br>**(inch) /(mm)**|∅**180-mm reel**<br>**pieces**|∅**330-mm reel**<br>**pieces**|**Tape**|
|---|---|---|---|
|0201 / 0603|15000|-|cardboard|
|0402 / 1005|10000|50000|cardboard|
|0603 / 1608|4000|16000|cardboard|
|1003 / 2508|4000|16000|cardboard|
|0506 / 1216|3000|12000|blister|
|0508 / 1220|4000|16000|cardboard|
|0612 / 1632|3000|12000|blister|
|1012 / 2532|2000|8000|blister|



Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 13 of 25 

**CeraDiodes Standard series** 

## **Soldering directions** 

## **1 Reflow soldering temperature profile** 

## **Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D** 

**==> picture [135 x 87] intentionally omitted <==**

|**Profile feature**||**Sn-Pb eutectic assembly**|**Pb-free assembly**|
|---|---|---|---|
|Preheat and soak<br>- Temperature min<br>- Temperature max<br>- Time|Tsmin<br>Tsmax<br>tsmin to tsmax|100°C<br>150°C<br>60 ... 120 s|150°C<br>200°C<br>60 ... 180 s|
|Average ramp-uprate|Tsmaxto Tp|3°C/ s max.|3°C/ s max.|
|Liquidous temperature<br>Time at liquidous|TL<br>tL|183°C<br>60 ... 150 s|217°C<br>60 ... 150 s|
|Peakpackage bodytemperature|Tp1)|220°C ... 235°C2)|245°C ... 260°C2)|
|Time (tP)3) within 5°C of specified<br>classification temperature(Tc)||20 s3)|30 s3)|
|Average ramp-down rate|Tpto Tsmax|6°C/ s max.|6°C/ s max.|
|Time 25°C topeak temperature||maximum 6 min|maximum 8 min|



1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum. 

2) Depending on package thickness. For details please refer to JEDEC J-STD-020D. 

3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum. 

**Note:** All temperatures refer to topside of the package, measured on the package body surface. Number of reflow cycles: 3 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 14 of 25 

## **CeraDiodes Standard series** 

## **2 Soldering guidelines** 

The use of mild, non-activated fluxes for soldering is recommended, as well as proper cleaning of the PCB. 

The components are suitable for reflow soldering to JEDEC J-STD-020D. 

## **3 Solder joint profiles / solder quantity** 

## **3.1 Cement quantity** 

The component is fixed onto the circuit board with cement prior to soldering. It must still be able to move slightly. When the board is placed into the reflow oven, excessively rigid fixing can lead to high forces acting on the component and thus to a break. In addition, too much cement can lead to unsymmetrical stressing and thus to mechanical fracture of the component. The cement must also be so soft during mounting that no mechanical stressing occurs. 

## **3.2 Mounting the components on the board** 

It is best to mount the components on the board before soldering so that one termination does not enter the oven first and the second termination is soldered subsequently. The ideal case is simultaneous wetting of both terminations. 

## **3.3 Solder joint profiles** 

If the meniscus height is too low, that means the solder quantity is too low, the solder joint may break, i.e. the component becomes detached from the joint. This problem is sometimes interpreted as leaching of the external terminations. 

If the solder meniscus is too high, i.e. the solder quantity is too large, the vise effect may occur. As the solder cools down, the solder contracts in the direction of the component. If there is too much solder on the component, it has no leeway to evade the stress and may break, as in a vise. 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 15 of 25 

**CeraDiodes Standard series** 

## **3.3.1 Solder joint profiles for nickel barrier termination** 

**==> picture [326 x 98] intentionally omitted <==**

**==> picture [149 x 76] intentionally omitted <==**

Good and poor solder joints caused by amount of solder in infrared reflow soldering 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 16 of 25 

## **CeraDiodes** 

## **Standard series** 

## **4 Solderability tests** 

|**Test**|**Standard**|**Test conditions /**<br>**Sn-Pb soldering**|**Test conditions /**<br>**Pb-free soldering**|**Criteria / test results**|
|---|---|---|---|---|
|Wettability|IEC<br>60068-2-58|Immersion in<br>60/40 SnPb solder<br>using non-activated<br>flux at 215±3°C for<br>3±0.3 s|Immersion in<br>Sn96.5Ag3.0Cu0.5<br>solder using non- or<br>low activated flux<br>at 245±5°C<br>for 3±0.3 s|Covering of 95%<br>of end termination,<br>checked by visual<br>inspection|
|Leaching<br>resistance|IEC<br>60068-2-58|Immersion in<br>60/40 SnPb<br>solder using<br>mildly activated flux<br>without preheating<br>at 255±5°C<br>for 10±1 s|Immersion in<br>Sn96.5Ag3.0Cu0.5<br>solder using non- or<br>low activated flux<br>without preheating<br>at 255±5°C<br>for 10±1 s|No leaching of<br>contacts|
|Tests of<br>resistance to<br>soldering heat<br>for SMDs|IEC<br>60068-2-58|Immersion in<br>60/40 SnPb for 10 s<br>at 260°C|Immersion in<br>Sn96.5Ag3.0Cu0.5<br>for 10 s at 260°C|Capacitance change:<br>�15%≤∆C≤15%|



## **Note:** 

## **Leaching of the termination** 

Effective area at the termination might be lost if the soldering temperature and/or immersion time are not kept within the recommended conditions. Leaching of the outer electrode should not exceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B, shown below as mounted on the substrate. 

**==> picture [51 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
As single chip<br>**----- End of picture text -----**<br>


As mounted on substrate 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 17 of 25 

## **CeraDiodes** 

## **Standard series** 

## **5 Notes for proper soldering** 

## **5.1 Preheating and cooling** 

**==> picture [5 x 5] intentionally omitted <==**

**==> picture [5 x 5] intentionally omitted <==**

The average ramp-up rate must not exceed 3 ° C/s. The cooling rate must not exceed 8 ° C/s. 

## **5.2 Repair / rework** 

Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for making repairs. 

## **5.3 Cleaning** 

All environmentally compatible agents are suitable for cleaning. Select the appropriate cleaning solution according to the type of flux used. The temperature difference between the components and cleaning liquid must not be greater than 100 ° C. Ultrasonic cleaning should be carried out with the utmost caution. Too high ultrasonic power can impair the adhesive strength of the metallized surfaces. Insufficient or excessive cleaning can be detrimental to CeraDiode performance. 

## **5.4 Solder paste printing (reflow soldering)** 

An excessive application of solder paste results in too high a solder fillet, thus making the chip more susceptible to mechanical and thermal stress. This will lead to the formation of cracks. Too little solder paste reduces the adhesive strength on the outer electrodes and thus weakens the bonding to the PCB. The solder should be applied smoothly to the end surface to a height of min. 0.2 mm. 

## **5.5 Selection of flux** 

Used flux should have less than or equal to 0.1 wt % of halogenated content, since flux residue after soldering could lead to corrosion of the termination and/or increased leakage current on the surface of the CeraDiode. Strong acidic flux must not be used. The amount of flux applied should be carefully controlled, since an excess may generate flux gas, which in turn is detrimental to solderability. 

## **5.6 Storage** 

Solderability is guaranteed for one year from date of delivery, provided that components are stored in their original packages. 

Storage temperature: �25 ° C to +45 ° C Relative humidity: ≤ 75% annual average, ≤ 95% on 30 days a year 

The solderability of the external electrodes may deteriorate if SMDs are stored where they are exposed to high humidity, dust or harmful gas (hydrogen chloride, sulfurous acid gas or hydrogen sulfide). 

Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise the packing material may be deformed or SMDs may stick together, causing problems during mounting. 

After opening the factory seals, such as polyvinyl-sealed packages, it is recommended to use the SMDs as soon as possible. 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 18 of 25 

**CeraDiodes Standard series** 

## **5.7 Placement of components on circuit board** 

It is of advantage to place the components on the board before soldering so that their two terminals do not enter the solder oven at different times. Ideally, both terminals should be wetted simultaneously. 

## **5.8 Soldering caution** 

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Sudden heating or cooling of the component results in thermal destruction by cracks. 

An excessively long soldering time or high soldering temperature results in leaching of the outer electrodes, causing poor adhesion due to loss of contact between electrodes and termination. 

Avoid manual soldering with a soldering iron. 

Wave soldering must not be applied for CeraDiodes designated for reflow soldering only. Keep to the recommended down-cooling rate. 

## **5.9 Standards** 

CECC 00802 IEC 60068-2-58 IEC 60068-2-20 JEDEC J-STD-020D 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

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|**CeraDiodes**||||
|---|---|---|---|
|**Standard series**||||
|**Symbols and terms**||||
|**CeraDiode**|**Semiconductor diode**|||
|Cmax<br>Ctyp<br>IBR<br>Ileak<br>IPP<br>PPP<br>Top<br>Tstg<br>VBR<br>VBR,min<br>Vclamp<br>Vclamp,max<br>VDC<br>VDC,max<br>VESD,air<br>VESD,contact<br>Vleak<br>- *)<br>- *)<br>- *)|IR, IT<br>IRM<br>IP, IPP<br>PPP<br>VBR<br>Vcl,VC<br>VRM, VRWM, VWM, VDC<br>VRM, VRWM, VWM, VDC<br>IF<br>IRM, IRM,max@VRM<br>VF||Maximum capacitance<br>Typical capacitance<br>(Reverse) current @ breakdown voltage<br>(Reverse) leakage current<br>Current @ clamping voltage, peak pulse<br>current<br>Peak pulse power<br>Operating temperature<br>Storage temperature<br>(Reverse) breakdown voltage<br>Minimum breakdown voltage<br>Clamping voltage<br>Maximum clamping voltage<br>(Reverse) stand-off voltage, working<br>voltage, operating voltage<br>Maximum DC operating voltage<br>Air discharge ESD capability<br>Contact discharge ESD capability<br>(Reverse) voltage @ leakage current<br>Current @ forward voltage<br>(Reverse) current @ maximum reverse<br>stand-off voltage, working voltage,<br>operating voltage<br>Forward voltage|



*) Not applicable due to bidirectional characteristics of CeraDiodes 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 20 of 25 

**CeraDiodes Standard series** 

## **Cautions and warnings** 

## **General** 

Some parts of this publication contain statements about the suitability of our CeraDiodes for certain areas of application, including recommendations about incorporation/design-in of these products into customer applications. The statements are based on our knowledge of typical requirements often made of our CeraDiodes in the particular areas. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our CeraDiodes for a particular customer application. As a rule, TDK Electronics is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always incumbent on the customer to check and decide whether the CeraDiodes with the properties described in the product specification are suitable for use in a particular customer application. 

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- Do not use TDK CeraDiodes for purposes not identified in our specifications, application notes and data books. 

- Ensure the suitability of a CeraDiode in particular by testing it for reliability during design-in. Always evaluate a CeraDiode under worst-case conditions. 

- Pay special attention to the reliability of CeraDiodes intended for use in safety-critical applications (e.g. medical equipment, automotive, spacecraft, nuclear power plant). 

## **Design notes** 

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Always connect a CeraDiode in parallel with the electronic circuit to be protected. 

- Consider maximum rated power dissipation if a CeraDiode has insufficient time to cool down between a number of pulses occurring within a specified isolated time period. Ensure that electrical characteristics do not degrade. 

- Consider derating at higher operating temperatures. Choose the highest voltage class compatible with derating at higher temperatures. 

- Surge currents beyond specified values will puncture a CeraDiode. In extreme cases a CeraDiode will burst. 

- If steep surge current edges are to be expected, make sure your design is as low-inductance as possible. 

- In some cases the malfunctioning of passive electronic components or failure before the end of their service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. Do not use CeraDiodes in applications requiring a very high level of operational safety and especially when the malfunction or failure of a passive electronic component could endanger human life or health (e.g. in accident prevention, life-saving systems, or automotive battery line applications such as clamp 30), ensure by suitable design of the application or other measures (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of such a malfunction or failure. 

- Specified values only apply to CeraDiodes that have not been subject to prior electrical, mechanical or thermal damage. The use of CeraDiodes in line-to-ground applications is therefore not advisable, and it is only allowed together with safety countermeasures like thermal fuses. 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 21 of 25 

## **CeraDiodes Standard series** 

## **Storage** 

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- Only store CeraDiodes in their original packaging. Do not open the package before storage. Storage conditions in original packaging: temperature -25 to +45 ° C, relative humidity ≤ 75% annual average, maximum 95%, dew precipitation is inadmissible. 

- Do not store CeraDiodes where they are exposed to heat or direct sunlight. Otherwise the packaging material may be deformed or CeraDiodes may stick together, causing problems during mounting. 

- Avoid contamination of the CeraDiode surface during storage, handling and processing. 

- Avoid storing CeraDiodes in harmful environments where they are exposed to corrosive gases for example (SOx, Cl). 

- Use CeraDiodes as soon as possible after opening factory seals such as polyvinyl-sealed packages. 

Solder CeraDiodes after shipment from TDK Electronics within the time specified: 12 months. 

## **Handling** 

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Do not drop CeraDiodes and allow them to be chipped. 

- Do not touch CeraDiodes with your bare hands - gloves are recommended. 

- Avoid contamination of the CeraDiode surface during handling. 

- Washing processes may damage the product due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts, which might lead to reduced reliability or lifetime. 

## **Mounting** 

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When CeraDiodes are encapsulated with sealing material or overmolded with plastic material, be aware that potting, sealing or adhesive compounds can produce chemical reactions in the CeraDiode ceramic that will degrade its electrical characteristics and reduce its lifetime. Make sure an electrode is not scratched before, during or after the mounting process. 

- Make sure contacts and housings used for assembly with CeraDiodes are clean before mounting. 

The surface temperature of an operating CeraDiode can be higher. Ensure that adjacent components are placed at a sufficient distance from a CeraDiode to allow proper cooling. Avoid contamination of the CeraDiode surface during processing. 

Only CeraDiodes with an Ni barrier termination are approved for lead-free soldering. 

## **Soldering** 

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- Complete removal of flux is recommended to avoid surface contamination that can result in an instable and/or high leakage current. 

- Use resin-type or non-activated flux. 

- Bear in mind that insufficient preheating may cause ceramic cracks. 

- Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack. 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 22 of 25 

## **CeraDiodes** 

## **Standard series** 

## **Operation** 

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Use CeraDiodes only within the specified operating temperature range. 

Use CeraDiodes only within specified voltage and current ranges. 

- Environmental conditions must not harm a CeraDiode. Only use them in normal atmospheric conditions. Reducing the atmosphere (e.g. hydrogen or nitrogen atmosphere) is prohibited. 

- Prevent a CeraDiode from contacting liquids and solvents. Make sure that no water enters a CeraDiode (e.g. through plug terminals). 

Avoid dewing and condensation. 

TDK CeraDiodes are designed for encased applications. Under all circumstances avoid exposure to: 

- direct sunlight 

- rain or condensation 

- steam, saline spray 

- corrosive gases 

- atmosphere with reduced oxygen content 

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- TDK CeraDiodes are not suitable for switching applications or voltage stabilization where static power dissipation is required. 

This listing does not claim to be complete, it merely reflects the experience of TDK Electronics AG . 

## **Display of ordering codes for TDK Electronics products** 

The ordering code for one and the same product can be represented differently in data sheets, data books, other publications, on the company website, or in order-related documents such as shipping notes, order confirmations and product labels. T **he varying representations of the** 

## **ordering codes are due to different processes employed and do not affect the** 

**specifications of the respective products.** Detailed information can be found on the Internet under www.tdk-electronics.tdk.com/orderingcodes. 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 23 of 25 

## **Important notes** 

The following applies to all products named in this publication: 

1. Some parts of this publication contain **statements about the suitability of our products for certain areas of application** . These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out **that such statements cannot be regarded as bindin g statements about the suitability of our products for a particular customer application** . As a rule we are either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 

2. We also point out that **in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in th e current state of the art, even if they are operated as specified** . In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 

3. **The warnings, cautions and product-specific notes must be observed** . 

4. In order to satisfy certain technical requirements, **some of the products described in th  is publication may contain substances subject to restrictions in certain jurisdiction s (e.g. because they are classed as hazardous)** . Useful information on this will be found in our Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our sales offices. 

5. We constantly strive to improve our products. Consequently, **the products described in th  is publication may change from time to time** . The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also **reserve the right to discontinue production and delivery of products** . Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 

6. Unless otherwise agreed in individual contracts, **all orders are subject to our General Terms and Conditions of Supply** . 

Page 24 of 25 

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7. **Our manufacturing sites serving the automotive business apply the IATF 16949 standard** . The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that **only requirements mutually agreed upon can and will be implemented in our Quality Management System** . For clarification purposes we like to point out that obligations from IATF 16949 shall only become legally binding if individually agreed upon. 

8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, FilterCap, FormFit, InsuGate, LeaXield, MediPlas, MiniBlue, MiniCell, MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PiezoBrush, PlasmaBrush, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SurfIND, ThermoFuse, WindCap, XieldCap are **trademarks registered or pending** in Europe and in other countries. Further information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks. 

Release 2024-02 

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