B57850T0103F000

## **NTC Thermistors for Temperature Measurement** 

## Small-outline no-lead NTC 

**Series/Type: T850/10k/F Ordering code: B57850T0103F000** Date: 2023-08-20 Version: 1 

 TDK Electronics AG 2023. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without TDK Electronics' prior express consent is prohibited. 

**NTC Thermistors for Temperature Measurement Small-outline no-lead NTC** 

**B57850T0103F000 T850/10k/F** 

## **Applications** 

Surface temperature measurement 

## **Features** 

- Lead free and halogen free 

- Miniature size thermistor 10 x 3 x 3 mm 

- NTC chip is fully sealed with epoxy 

- High humidity resistance 

- High degree of electrical insulation between measurement surface and NTC provided by Al2O3 ceramic 

- Wider sensing surface area 

- Phosphor bronze electrodes 

- Process automation friendly design 

- Attachable to metal heatsink or bars and chassis directly 

- Good mechanical robustness 

## **Ratings and characteristics** 

|Climatic category (IEC 60068-1)<br>(test without voltage)<br>~~|~~|-<br>~~||~~|- 40/155/56<br>~~|~~|- 40/155/56|
|---|---|---|---|
|Lower category temperature<br>~~|~~|-<br>~~|~~<br>~~a~~|°C –40<br><br>~~a~~|°C –40|
|Upper category temperature|-<br>~~a~~<br>~~a~~|°C 155<br>~~a~~<br>~~a~~|°C 155|
|Rated resistance RR// Tolerance|RR<br>~~a~~|Ω// % 10000 // ±1<br>~~a~~|// % 10000 // ±1|
|Rated temperature|TR<br>~~a~~|°C 25<br>~~a~~|°C 25|
|B-value: B(25/100)// Tolerance|B<br>~~a~~|K // % 3988 // ±1<br>~~a~~|K // % 3988 // ±1|
|R/T curve no. // R25|~~a~~|n //Ω8016 // 10000<br>~~a~~|8016 // 10000|
|Max power rating at 25 °C|P25<br>~~a~~|mW 60<br>~~a~~|mW 60|
|Dissipation factor (in air)|δth<br>~~a~~|mW/K 4.2<br>~~a~~|mW/K 4.2|
|Heat capacity<br>~~|~~|Cth<br>~~a~~<br>~~|~~|mJ/K 178<br>~~a~~<br>|mJ/K 178|
|Thermal time constant – t (0.63)1)<br>Response time<br>~~|~~|τa<br>~~||~~|s approx. 2<br>~~|~~|s approx. 2|
|Voltage proof<br>~~|~~|Vis<br>~~|~~<br>~~a~~|VAC// t 2500 // 60 s<br><br>~~a~~|// t 2500 // 60 s|



¹ ⁾ NTC sensor from ambient temperature is pressed to metal surface with a temperature of 85 °C 

## **Ordering code** 

## **B57850T0103F000** 

TPS NTC E PD 

2023-08-20 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 2 of 10 

**NTC Thermistors for Temperature Measurement Small-outline no-lead NTC** 

**B57850T0103F000 T850/10k/F** 

## **Dimensional drawing** 

Dimensions in mm 

## **Delivery mode** 

According to typical semiconductor packaging tube 272 x 11 x 4.5 mm (see below). 50 components as packaging unit per tube. 

Other options on request, e.g. according to JEDEC standard, tray: 12.7 x 5.35 inches, 294 components per tray. 

## **Tube drawing** 

50 components packed inside one ESD IC plastic tube 

TPS NTC E PD 

2023-08-20 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 3 of 10 

**NTC Thermistors for Temperature Measurement Small-outline no-lead NTC** 

**B57850T0103F000 T850/10k/F** 

## **NTC resistance temperature curve** 

|**R at 25 °C**|10000Ω||**RR at 25 °C**|**at 25 °C**<br>10000|10000Ω±1%|
|---|---|---|---|---|---|
|**T**<br>**°C**|**RNom**<br>Ω<br>~~rs~~<br>~~a~~|**RMin**<br>Ω<br>~~rs~~<br>~~ee~~|**RMax **<br>Ω<br>~~rs~~<br>~~ee~~|∆**R**<br>**±%**<br>~~rs~~<br>~~eee~~|∆**T**<br>**±°C**|
|-40|336500<br>~~a~~|320419<br>~~ee~~|352582<br>~~ee~~|4.8<br>~~eee~~|0.7|
|-35|242589<br>~~a~~<br>~~Ge~~|231867<br>~~ee~~<br>~~Ge~~|253311<br>~~ee~~<br>~~Ge~~|4.4<br>~~eee~~<br>~~Ge~~|0.7|
|-30|177000<br>~~Ge~~|169786<br>~~Ge~~|184214<br>~~Ge~~|4.1<br>~~Ge~~|0.7|
|-25|130370<br>~~Ge~~|125487<br>~~Ge~~|135252<br>~~Ge~~|3.7<br>~~Ge~~|0.6|
|-20|97070<br>~~Ge~~|93743<br>~~Ge~~|100397<br>~~Ge~~|3.4<br>~~Ge~~|0.6|
|-15|72929<br>~~es~~|70652<br>~~es~~|75206<br>~~es~~|3.1<br>~~es~~|0.6|
|-10|55330<br>~~es~~<br>~~Ge~~|53765<br>~~es~~<br>~~Ge~~|56895<br>~~es~~<br>~~Ge~~|2.8<br>~~es~~<br>~~Ge~~|0.5|
|-5|42315<br>~~Ge~~<br>~~ee~~|41237<br>~~Ge~~<br>~~ee~~|43393<br>~~Ge~~<br>~~ee~~|2.5<br>~~Ge~~<br>~~ee~~|0.5|
|0|32650<br>~~ee~~<br>~~Ge~~|31907<br>~~ee~~<br>~~Ge~~|33393<br>~~ee~~<br>~~Ge~~|2.3<br>~~ee~~<br>~~Ge~~|0.4|
|5|25388<br>~~Ge~~<br>~~Ge~~|24877<br>~~Ge~~<br>~~Ge~~|25898<br>~~Ge~~<br>~~Ge~~|2.0<br>~~Ge~~<br>~~Ge~~|0.4|
|10|19900<br>~~Ge~~|19550<br>~~Ge~~|20250<br>~~Ge~~|1.8<br>~~Ge~~|0.4|
|15|15708<br>~~Ge~~|15470<br>~~Ge~~|15946<br>~~Ge~~|1.5<br>~~Ge~~|0.3|
|20|12490<br>~~Ge~~|12330<br>~~Ge~~|12650<br>~~Ge~~|1.3<br>~~Ge~~|0.3|
|**25**|**10000**<br>~~es~~|**9900**<br>~~es~~|**10100**<br>~~es~~|**1.0**<br>~~es~~|**0.2**|
|30|8057.0<br>~~es~~<br>~~ee~~|7954.6<br>~~es~~<br>~~ee~~|8159.4<br>~~es~~<br>~~ee~~|1.3<br>~~es~~<br>~~ee~~|0.3|
|35|6531.3<br>~~ee~~<br>~~ee~~|6434.4<br>~~ee~~<br>~~ee~~|6628.2<br>~~ee~~<br>~~ee~~|1.5<br>~~ee~~<br>~~ee~~|0.4|
|40|5327.0<br>~~ee~~<br>~~ee~~|5236.9<br>~~ee~~<br>~~ee~~|5417.1<br>~~ee~~<br>~~ee~~|1.7<br>~~ee~~<br>~~ee~~|0.4|
|45|4368.7<br>~~ee~~<br>~~Ge~~|4286.1<br>~~ee~~<br>~~Ge~~|4451.3<br>~~ee~~<br>~~Ge~~|1.9<br>~~ee~~<br>~~Ge~~|0.5|
|50|3603.0<br>~~Ge~~|3527.9<br>~~Ge~~|3678.1<br>~~Ge~~|2.1<br>~~Ge~~|0.5|
|55|2986.2<br>~~Ge~~|2918.3<br>~~Ge~~|3054.1<br>~~Ge~~|2.3<br>~~Ge~~|0.6|
|60|2488.0<br>~~Ge~~|2426.9<br>~~Ge~~|2549.1<br>~~Ge~~|2.5<br>~~Ge~~|0.7|
|65|2083.0<br>~~es~~|2028.2<br>~~es~~|2137.9<br>~~es~~|2.6<br>~~es~~|0.8|
|70|1752.0<br>~~ee~~|1702.9<br>~~ee~~|1801.1<br>~~ee~~|2.8<br>~~ee~~|0.8|
|75|1481.4<br>~~es~~|1437.4<br>~~es~~|1525.4<br>~~es~~|3.0<br>~~es~~|0.9|
|80|1258.0<br>~~ee~~|1218.6<br>~~ee~~|1297.4<br>~~ee~~|3.1<br>~~ee~~|1.0|
|85|1072.3<br>~~Ge~~|1037.1<br>~~Ge~~|1107.6<br>~~Ge~~|3.3<br>~~Ge~~|1.0|
|90|917.70<br>~~Ge~~|886.09<br>~~Ge~~|949.31<br>~~Ge~~|3.4<br>~~Ge~~|1.1|
|95|788.52<br>~~Ge~~|760.18<br>~~Ge~~|816.85<br>~~Ge~~|3.6<br>~~Ge~~|1.2|
|100|680.00<br>~~Ge~~|654.58<br>~~Ge~~|705.42<br>~~Ge~~|3.7<br>~~Ge~~|1.3|
|105|588.59<br>~~ee~~|565.76<br>~~ee~~|611.43<br>~~ee~~|3.9<br>~~ee~~|1.4|
|110|511.20<br>~~Ge~~|490.66<br>~~Ge~~|531.74<br>~~Ge~~|4.0<br>~~Ge~~|1.4|
|115|445.41<br>~~ee~~|426.92<br>~~ee~~|463.90<br>~~ee~~|4.2<br>~~ee~~|1.5|
|120|389.30<br>~~ee~~|372.63<br>~~ee~~|405.97<br>~~ee~~|4.3<br>~~ee~~|1.6|
|125|341.70<br>~~Ge~~|326.63<br>~~Ge~~|356.77<br>~~Ge~~|4.4<br>~~Ge~~|1.7|
|130|300.90<br>~~Ge~~|287.26<br>~~Ge~~|314.54<br>~~Ge~~|4.5<br>~~Ge~~|1.8|
|135|265.44<br>~~Ge~~|253.09<br>~~Ge~~|277.80<br>~~Ge~~|4.7<br>~~Ge~~|1.9|
|140|234.80<br>~~Ge~~|223.59<br>~~Ge~~|246.01<br>~~Ge~~|4.8<br>~~Ge~~|2.0|
|145|208.32<br>~~es~~|198.14<br>~~es~~|218.50<br>~~es~~|4.9<br>~~es~~|2.1|
|150|185.30<br>~~ee~~|176.03<br>~~ee~~|194.57<br>~~ee~~|5.0<br>~~ee~~|2.2|
|155|165.35<br>~~ee~~|156.90<br>~~ee~~|173.80<br>~~ee~~|5.1<br>~~ee~~|2.3|



TPS NTC E PD 

2023-08-20 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 4 of 10 

**NTC Thermistors for Temperature Measurement B57850T0103F000 Small-outline no-lead NTC T850/10k/F** 

## **Reliability data** 

|**Reliability data**||||
|---|---|---|---|
|**Test**|**Test conditions**|∆**R25/R25**<br>**(typical)**|**Remarks**|
|Storage in dry heat|Storage at T = 155 °C, Duration: 1000 h|< 3%|No visible<br>damage|
|Storage in coldness|Storage at T = -40 °C, Duration: 1000 h|< 3%|No visible<br>damage|
|Storage in damp heat,<br>steady state with test<br>voltage|Temperature of air: 85 °C; Relative humidity of air: 85%<br>Duration: 56 days<br>Voltage across NTC: 0.3 VDC|< 2%|No visible<br>damage|
|Rapid change of<br>temperature in air|Lower test temperature: –40 °C<br>Upper test temperature: 155 °C<br>Dwell time: 10 min; Transition time: < 30 s<br>Number of cycles: 1000|< 3%|No visible<br>damage|
|Voltage proof test|The sensors are placed on a metal plate surface at<br>ambient temperature, max relative humidity 75%.<br>The applied voltage, between metal plate and NTC<br>electrodes, is 2500 VAC/60 s/1 mA.||No flash<br>over|
|Insulation test|The sensors are placed on a metal plate surface at<br>ambient temperature, max relative humidity 75%.<br>The applied voltage between metal plate and NTC<br>electrodes is 500 VDC.||Above<br>100 MΩ|



## **For information only** 

## **Achievable performance, indicated as a design reference for applications** 

|**Test**|**Test conditions**|∆**R25/R25**<br>**(typical)**|**Remarks**|
|---|---|---|---|
|Immersion test|Medium: Deionized water<br>Temperature: 80 °C; Voltage across NTC: 0.3 VDC<br>Tested on NTC assembly with extension wires, soldered<br>onto electrodes. Solder joints and electrodes are sealed<br>with a hydrophobic coating material.<br>Duration: 1000 h|< 2%|No visible<br>damage|
|Rapid change of<br>temperature in water<br>(T-shock)|Medium: Deionized water<br>Lower test temperature: 5 °C<br>Upper test temperature: 95 °C<br>Dwell time: 10 min; Transition time: < 30 s<br>5 VDCapplied with series resistor 10 kΩ<br>Tested on NTC assembly with extension wires, soldered<br>onto electrodes. Solder joints and electrodes are sealed<br>with a hydrophobic coating material.<br>Number of cycles: 500|< 2%|No visible<br>damage|



TPS NTC E PD 

2023-08-20 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 5 of 10 

~~|~~ **NTC Thermistors for Temperature Measurement B57850T0103F000 Small-outline no-lead NTC T850/10k/F** 

**Reliability data according to AEC-Q200, Rev. D** 

|**Test**|**Test conditions**<br>~~Be~~|∆**R25/R25**<br>**(typical)**<br>~~Be~~|**Remarks**|
|---|---|---|---|
|High temperature<br>exposure (storage)|Storage at T = 125 °C<br>t = 1000 h<br>~~<r~~|< 2%<br>~~<r~~|No visible<br>damage|
|Biased humidity|T = 85 °C<br>Relative humidity of air: 85%<br>t = 1000 h<br>Test voltage 0.3 VDCon NTC1)<br>~~<r~~|< 2%<br>~~<r~~|No visible<br>damage|
|Operational life|T = 125 °C<br>t = 1000 h<br>Test voltage 0.3 VDCon NTC1)<br>~~hr~~|< 2%<br>~~hr~~|No visible<br>damage|
|Temperature cycling|Lower test temperature: –55 °C<br>Upper test temperature: 125 °C<br>Dwell time: max. 30 min. at each temperature<br>Transition time in air: max. 1 min<br>Number of cycles: 1000<br>~~hr~~|< 2%<br>~~hr~~|No visible<br>damage|
|Mechanical shock|Acceleration: 40_g_2)<br>Pulse duration: 6 ms<br>Number of bumps: 3, each direction<br>~~hr~~<br>~~———-~~|< 1%<br>~~hr~~<br>~~———-~~|No visible<br>damage|
|Vibration|Acceleration: 5_g_<br>t = 20 min.<br>12 cycles in each of 3 directions<br>Frequencyrange: 10 ... 2000 Hz<br>~~———-~~|< 1%<br>~~———-~~|No visible<br>damage|



TPS NTC E PD 

2023-08-20 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 6 of 10 

**NTC Thermistors for Temperature Measurement Small-outline no-lead NTC** 

**B57850T0103F000 T850/10k/F** 

## **Cautions and warnings** 

## **Storage** 

- Store thermistors only in original packaging, Moisture Barrier Bag. Do not open the MBB prior to storage. 

- Storage conditions in original MBB: storage temperature −25 °C to +45 °C, relative humidity ≤ 75% annual mean, < 95% maximum 30 days per annum 

- Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed, causing problems during processing. 

- Avoid any sort of aggressive and harmful contamination of alumina ceramic sensing pad surface and the electrode surface during storage, handling, and processing. 

- Avoid storage of thermistors in harmful environments like corrosive gases (SOx, Cl etc). 

- Use up the components from the IC packaging tube after opening the MBB. 

- Use thermistors within the time specified after shipment. For leadless components this is 12 months. 

## **Handling** 

- The alumina ceramic sensing pad surface and the electrodes must not be scratched or damaged before/during/after the mounting and assembly process. 

- Use suitable surface cleaning and activating agent prior to the process and avoid aggressive contamination of the ceramic sensing pad surface and the electrode surface during mounting and assembly. 

- Washing processes may damage the product due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts, which might lead to reduced reliability or lifetime. 

## **Soldering/Welding** 

- Soldering process: 

   - Use rosin type flux in soldering process. Do not use strong acid flux, water soluble flux or flux exceeding 0.1wt% halogen and halogenated substances, as this might affect the product characteristics or reliability. 

   - Perform cleaning to fully remove flux and cleaning solvents from the product. Prompt drying of the products after cleaning is required. 

   - The applied solder bit temperature and time shall not exceed 400 °C and 2 seconds respectively on each thermistor electrodes. 

   - Not all available soldering processes are suitable. Please take precautions in selection of your desired process. 

- Welding process: 

   - Excessive pressure to the phosphor bronze electrodes must be avoided, thermistor in normal condition is able to withstand pressure of 30 N/mm². 

   - Excessive heating may damage the epoxy compound. Welding parameters must be defined accordingly. 

   - Not all available welding processes are suitable. Consider the risk of porosity of the welded joint and take precautions in selection of your desired process. 

TPS NTC E PD 

2023-08-20 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 7 of 10 

**NTC Thermistors for Temperature Measurement Small-outline no-lead NTC** 

**B57850T0103F000 T850/10k/F** 

## **Mounting** 

- Make sure a flat base fixture is used to place thermistor before soldering/welding to avoid alumina ceramic sensing pad surface getting cracked during mounting and processing. 

- Make sure no inclination or lift-up of the ceramic sensing pad occurs during the mounting and assembly process. This might cause deviations in the response time. 

- Avoid contamination of the thermistor surface during handling and processing. 

- The connections of sensors (e.g. cable end, wire end, plug terminal) may only be exposed to an environment with normal atmospheric conditions within the defined operating temperature range. 

- Ensure that adjacent materials are designed for operation at temperatures comparable to the surface temperature of the thermistor. Be sure that surrounding parts and materials can withstand the temperature. 

- Avoid using aggressive chemical substances as mounting aids. It must be ensured that no water or other liquids enter the thermistors (e.g. through plug terminals). In particular, water-based substances (e.g. soap suds) must not be used as mounting aids for sensors. 

## **Operation** 

- Use thermistors only within the specified operating temperature range. 

- Use thermistors only within the specified power range. 

- Do not use NTC thermistors under following environments and conditions, as it might lead to some failures like deterioration of product characteristics: 

   - In close proximity to splashing water. A water droplet between the outer electrodes needs to be avoided. Dewing and condensation must be avoided. 

   - Corrosive or deoxidizing gas (Cl2, H2S, NH3, SOX, NOX, etc.) 

   - Volatile or flammable gas 

   - Environment with salt water, oils, chemical liquids, or organic solvents 

   - High vibration environment 

- Be sure to provide an appropriate fail-safe function to prevent secondary product damage caused by malfunction. 

This listing does not claim to be complete, but merely reflects the experience of TDK Electronics. 

## **Display of ordering codes for TDK Electronics products** 

The ordering code for one and the same product can be represented differently in data sheets, data books, other publications, on the company website, or in order-related documents such as shipping notes, order confirmations and product labels. **The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products** . Detailed information can be found on the Internet at www.tdk-electronics.tdk.com/orderingcodes. 

TPS NTC E PD 

2023-08-20 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 8 of 10 

## **Important notes** 

The following applies to all products named in this publication: 

1. Some parts of this publication contain **statements about the suitability of our products for certain areas of application** . These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out **that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application.** As a rule we are either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 

2. We also point out that **in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified.** In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 

3. **The warnings, cautions and product-specific notes must be observed.** 

4. In order to satisfy certain technical requirements, **some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous)** . Useful information on this will be found in our Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our sales offices. 

5. We constantly strive to improve our products. Consequently, **the products described in this publication may change from time to time** . The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. 

We also **reserve the right to discontinue production and delivery of products** . Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 

6. Unless otherwise agreed in individual contracts, **all orders are subject to our General Terms and Conditions of Supply.** 

7. **Our manufacturing sites serving the automotive business apply the IATF 16949 standard.** The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that **only requirements mutually agreed upon can and will be implemented in our Quality Management System.** For clarification purposes we like to point out that obligations from IATF 16949 shall only become legally binding if individually agreed upon. 

Page 9 of 10 

**Important notes** 

8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, FilterCap, FormFit, InsuGate, LeaXield, MediPlas, MiniBlue, MiniCell, MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PiezoBrush, PlasmaBrush, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap, XieldCap are **trademarks registered or pending** in Europe and in other countries. Further information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks. 

## Release 2023-08 

Page 10 of 10