B57371V2104J060

## **NTC thermistors for temperature measurement** 

## SMD NTC thermistors 

**Series/Type: Standard series Ordering code: B57*V2** Date: 2024-03-12 Version: 3 

>  TDK Electronics AG 2024. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without TDK Electronics' prior express consent is prohibited. 

**NTC thermistors for temperature measurement SMD NTC thermistors** 

**B57*V2 Standard series** 

## **Applications** 

Temperature measurement and compensation for 

- charging control of battery packs in portable devices 

- air-conditioning and heating control systems 

- contrast optimization in LCDs displays 

- consumer appliances 

- fire alarm 

- industrial automation 

- smart meter 

- healthcare 

- temperature control in LED modules. 

## **Features** 

- Multilayer SMD NTC thermistor with nickel barrier termination (AgNiSn) 

- Excellent long-term aging stability in high temperature and high humidity environment 

- Accurate temperature sensing up to 125 °C 

- 100% Pb free, RoHS and UL compliant (E69802) 

- Narrow tolerances 

**==> picture [125 x 13] intentionally omitted <==**

**----- Start of picture text -----**<br>
Dimensional drawing<br>**----- End of picture text -----**<br>


|**Case size**<br>**EIA/mm**<br>**l**<br>**mm**<br>**w**<br>**mm**<br>**h**<br>**mm**<br>**k**<br>**mm**<br>0402/1005<br>1.0 ± 0.1<br>0.5 ± 0.05<br>0.6 max.<br>0.25 ± 0.15<br>0603/1608<br>1.6 ± 0.15<br>0.8 ± 0.15<br>0.9 max.<br>0.35 ± 0.15<br>0805/2012<br>2.0 ± 0.2<br>1.25 ± 0.15<br>1.3 max.<br>0.5 ± 0.25<br>~~mo~~|**Case size**<br>**EIA/mm**<br>**l**<br>**mm**<br>**w**<br>**mm**<br>**h**<br>**mm**<br>**k**<br>**mm**<br>0402/1005<br>1.0 ± 0.1<br>0.5 ± 0.05<br>0.6 max.<br>0.25 ± 0.15<br>0603/1608<br>1.6 ± 0.15<br>0.8 ± 0.15<br>0.9 max.<br>0.35 ± 0.15<br>0805/2012<br>2.0 ± 0.2<br>1.25 ± 0.15<br>1.3 max.<br>0.5 ± 0.25<br>~~mo~~|**Case size**<br>**EIA/mm**<br>**l**<br>**mm**<br>**w**<br>**mm**<br>**h**<br>**mm**<br>**k**<br>**mm**<br>0402/1005<br>1.0 ± 0.1<br>0.5 ± 0.05<br>0.6 max.<br>0.25 ± 0.15<br>0603/1608<br>1.6 ± 0.15<br>0.8 ± 0.15<br>0.9 max.<br>0.35 ± 0.15<br>0805/2012<br>2.0 ± 0.2<br>1.25 ± 0.15<br>1.3 max.<br>0.5 ± 0.25<br>~~mo~~|**Case size**<br>**EIA/mm**<br>**l**<br>**mm**<br>**w**<br>**mm**<br>**h**<br>**mm**<br>**k**<br>**mm**<br>0402/1005<br>1.0 ± 0.1<br>0.5 ± 0.05<br>0.6 max.<br>0.25 ± 0.15<br>0603/1608<br>1.6 ± 0.15<br>0.8 ± 0.15<br>0.9 max.<br>0.35 ± 0.15<br>0805/2012<br>2.0 ± 0.2<br>1.25 ± 0.15<br>1.3 max.<br>0.5 ± 0.25<br>~~mo~~|**Case size**<br>**EIA/mm**<br>**l**<br>**mm**<br>**w**<br>**mm**<br>**h**<br>**mm**<br>**k**<br>**mm**<br>0402/1005<br>1.0 ± 0.1<br>0.5 ± 0.05<br>0.6 max.<br>0.25 ± 0.15<br>0603/1608<br>1.6 ± 0.15<br>0.8 ± 0.15<br>0.9 max.<br>0.35 ± 0.15<br>0805/2012<br>2.0 ± 0.2<br>1.25 ± 0.15<br>1.3 max.<br>0.5 ± 0.25<br>~~mo~~|
|---|---|---|---|---|
|**Recommended solder pad layout**|||||
||**Case size**|**A**|**B**|**C**|
||**EIA/mm**|**mm**|**mm**|**mm**|
||0402/1005|0.6|0.6|1.7|
||0603/1608|1.0|1.0|3.0|
||0805/2012|1.3|1.2|3.4|



2024-03-12 

PPD ML PD 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 2 of 12 

~~Lo~~ **NTC thermistors for temperature measurement B57*V2 SMD NTC thermistors Standard series** 

## **General technical data, case size 0402 (1005)** 

|Operating temperature||Top<br>-55 ... 125<br>~~ee~~|°C|
|---|---|---|---|
|Maximum power|(at 25 °C, on PCB) P|(at 25 °C, on PCB) P251)<br>150<br>~~es~~|mW|
|Rated temperature||TR<br>25<br>~~es~~|°C|
|Dissipation factor|(on PCB)|δth1)<br>approx. 2.5<br>~~es~~|mW/K|
|Thermal cooling time constant|(on PCB)|τc1)<br>approx. 3<br>~~es~~|s|
|Heat capacity||Cth1)<br>approx. 7.5<br>~~es~~|mJ/K|
|Weight of component||approx. 2<br>~~es~~|mg|



1) Depends on mounting situation 

|R25<br>kΩ|∆RR/RR<br>%<br>~~a~~<br>~~a~~|B25/50<br>K<br>~~ee~~|B25/85<br>K<br>~~ee~~|B25/100<br>K<br>~~ee~~<br>~~ee~~|Ordering code<br>~~ee~~|
|---|---|---|---|---|---|
|4.7|±5<br>~~a ~~<br>~~a~~|3940<br> ~~ee~~|3980<br>~~ee~~|4000 ±3%<br>~~ee~~<br>~~ee~~|B57221V2472J060<br>~~ee~~|
|10|±0.5, ±1, ±3, ±5<br>~~a~~<br>~~a~~|3380|3435|3455 ±1%<br>~~ee~~|B57230V2103+260<br>~~ee~~|
|10|±5<br>~~a~~<br>~~a~~|3940|3980|4000 ±3%|B57221V2103J060|
|47|±5<br>~~a~~<br>~~a~~|3940|3980|4000 ±3%|B57221V2473J060|
|47|±1, ±3, ±5<br>~~a~~<br>~~a~~|4050<br>~~a~~|4108|4131 ±1%|B57250V2473+660|
|100|±1, ±3, ±5<br>~~a ~~<br>~~a~~|4250<br> ~~a~~|4311|4334 ±1%|B57250V2104+360|



+ = Resistance tolerance D = ±0.5%, F = ±1%, G = ±2%, H = ±3%, J = ±5% 

2024-03-12 

PPD ML PD 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 3 of 12 

~~LO~~ **NTC thermistors for temperature measurement B57*V2 SMD NTC thermistors Standard series** 

## **General technical data, case size 0603 (1608)** 

|**General technical data, case size 0603 (1608), case size 0603 (1608) case size 0603 (1608)(1608)1608)**|**General technical data, case size 0603 (1608), case size 0603 (1608) case size 0603 (1608)(1608)1608))**|||
|---|---|---|---|
|Operating temperature|Top<br>~~a~~<br>~~es~~|-55 ... 125<br>~~ee~~|°C|
|Maximum power<br>(at 25 °C, on PCB) P|(at 25 °C, on PCB) P251)<br>~~a~~<br>~~es~~|180<br>~~ee~~|mW|
|Rated temperature|TR<br>~~es~~<br>~~a~~|25<br>~~ee~~|°C|
|Dissipation factor<br>(on PCB)|δth1)<br>~~a~~<br>~~a~~|approx. 3|mW/K|
|Thermal cooling time constant<br>(on PCB)|τc1)<br>~~a~~<br>~~a~~|approx. 4|s|
|Heat capacity|Cth1)<br>~~a~~<br>~~a~~|approx. 12|mJ/K|
|Weight of component|~~a~~<br>~~a~~|approx. 6|mg|



1) Depends on mounting situation 

**Electrical specifications and ordering codes, case size 0603 (1608)** 

||~~a~~|~~ee~~|~~ee~~|~~ee~~||
|---|---|---|---|---|---|
|R25<br>kΩ|∆RR/RR<br>%<br>~~a~~|B25/50<br>K<br>~~ee~~|B25/85<br>K<br>~~ee~~|B25/100<br>K<br>~~ee~~|Ordering code|
|1.0|±3, ±5<br>~~a~~<br>~~se~~<br>~~Rs~~|3940<br>~~ee ~~<br>~~se~~|3980<br> ~~ee~~<br>~~se~~|4000 ±3%<br>~~ee~~<br>~~se~~|B57321V2102+060|
|2.2|±3, ±5<br>~~se~~<br>~~Rs~~<br>~~es~~|3940<br>~~se~~|3980<br>~~se~~|4000 ±3%<br>~~se~~|B57321V2222+060|
|4.7|±3, ±5<br>~~Rs~~<br>~~es~~<br>~~es~~|3590|3635|3650 ±3%|B57301V2472+060|
|10|±0.5<br>~~es~~<br>~~es~~<br>~~Rs~~|3380|3435|3455 ±0.7%|B57334V2103D260|
|10|±1, ±3, ±5<br>~~es~~<br>~~Rs~~<br>~~es~~|3380|3435|3455 ±1%|B57330V2103+260|
|10|±3, ±5<br>~~Rs~~<br>~~es~~<br>~~Rs~~|3590|3635|3650 ±3%|B57301V2103+060|
|10|±3, ±5<br>~~es~~<br>~~Rs~~<br>~~Rs~~|3940|3980|4000 ±3%|B57321V2103+060|
|10|±3, ±5<br>~~Rs~~<br>~~Rs~~<br>~~es~~|4386|4455|4480 ±3%|B57371V2103+060|
|22|±3, ±5<br>~~Rs~~<br>~~es~~|3940|3980|4000 ±3%|B57321V2223+060|
|22|±3, ±5<br>~~es~~<br>~~A~~<br>~~Rs~~|4386|4455|4480 ±3%|B57371V2223+060|
|47|±3, ±5<br>~~A~~<br>~~Rs~~<br>~~es~~|3940|3980|4000 ±3%|B57321V2473+060|
|47|±1, ±3, ±5<br>~~Rs~~<br>~~es~~|4050|4108|4131 ±1.5%|B57357V2473+660|
|47|±3, ±5<br>~~es~~<br>~~se~~<br>~~Rs~~|4050<br>~~se~~|4108<br>~~se~~|4131 ±2%<br>~~se~~|B57358V2473+560|
|47|±3, ±5<br>~~se~~<br>~~Rs~~<br>~~es~~|4386<br>~~se~~|4455<br>~~se~~|4480 ±3%<br>~~se~~|B57371V2473+060|
|68|±3, ±5<br>~~Rs~~<br>~~es~~<br>~~Rs~~|4386|4455|4480 ±3%|B57371V2683+060|
|100|±1, ±3, ±5<br>~~es~~<br>~~Rs~~<br>~~Rs~~|4200|4260|4282 ±1%|B57350V2104+460|
|100|±3, ±5<br>~~Rs~~<br>~~Rs~~<br>~~es~~|4250|4311|4334 ±2%|B57358V2104+360|
|100|±1, ±3, ±5<br>~~Rs~~<br>~~es~~<br>~~Rs~~|4386|4455|4480 ±1%|B57374V2104+060|
|100|±3, ±5<br>~~es~~<br>~~Rs~~|4386|4455|4480 ±3%|B57371V2104+060|
|470|±3, ±5<br>~~Rs~~<br>~~se~~|4386<br>~~se~~|4455<br>~~se~~|4480 ±3%<br>~~se~~|B57371V2474+060|



+ = Resistance tolerance F = ±1%, G = ±2%, H = ±3%, J = ±5% 

2024-03-12 

PPD ML PD 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 4 of 12 

~~LO~~ **NTC thermistors for temperature measurement B57*V2 SMD NTC thermistors Standard series** 

## **General technical data, case size 0805 (2012)** 

|Operating temperature|Top<br>~~fT~~|-55 ... 125<br>~~fT~~|°C|
|---|---|---|---|
|Maximum power<br>(at 25 °C, on PCB) P|(at 25 °C, on PCB) P251)<br>~~fT~~<br>~~fT~~<br>~~ee~~|210<br>~~fT~~<br>~~fT~~<br>~~ee~~|mW|
|Rated temperature|TR<br>~~fT~~<br>~~ee~~<br>~~ee~~|25<br>~~fT~~<br>~~ee~~<br>~~ee~~|°C|
|Dissipation factor<br>(on PCB)|δth1)<br>~~ee~~<br>~~ee~~<br>~~ee~~|approx. 3.5<br>~~ee~~<br>~~ee~~<br>~~ee~~|mW/K|
|Thermal cooling time constant<br>(on PCB)|τc1)<br>~~ee~~<br>~~ee~~<br>~~ee~~|approx. 10<br>~~ee~~<br>~~ee~~<br>~~ee~~|s|
|Heat capacity|Cth1)<br>~~ee~~<br>~~ee~~|approx. 35<br>~~ee~~<br>~~ee~~|mJ/K|
|Weight of component|~~ee~~<br>~~fT~~|approx. 13<br>~~ee~~<br>~~fT~~|mg|



1) Depends on mounting situation 

||~~a~~|~~ee~~|~~ee~~|~~ee~~||
|---|---|---|---|---|---|
|R25<br>kΩ|∆RR/RR<br>%<br>~~a~~|B25/50<br>K<br>~~ee~~|B25/85<br>K<br>~~ee~~|B25/100<br>K<br>~~ee~~|Ordering code|
|1.0|±3,±5<br>~~a~~<br>~~se~~|3940<br>~~ee ~~<br>~~se~~|3980<br> ~~ee~~<br>~~se~~|4000±3%<br>~~ee~~<br>~~se~~|B57421V2102+062|
|1.5|±3,±5<br>~~se~~<br>~~a~~|3940<br>~~se~~<br>|3980<br>~~se~~<br>|4000±3%<br>~~se~~<br>|B57421V2152+062|
|2.2|±3,±5<br>~~ase~~|3940<br>~~se~~|3980<br>~~se~~|4000±3%<br>~~se~~|B57421V2222+062|
|3.3|±3,±5<br>~~se~~<br>~~a~~|3940<br>~~se~~<br>|3980<br>~~se~~<br>|4000±3%<br>~~se~~<br>|B57421V2332+062|
|4.7|±5<br>~~apo~~|3590<br>~~po~~|3635<br>~~po~~|3650±3%<br>~~po~~|B57401V2472J062|
|4.7|±3,±5<br>~~a~~|4386<br>|4455<br>|4480±3%<br>|B57471V2472+062|
|6.8|±3,±5<br>~~ase~~|4386<br>~~se~~|4455<br>~~se~~|4480±3%<br>~~se~~|B57471V2682+062|
|10|±1, ±3, ±5<br>~~Ge~~<br>~~ee~~|3380<br>~~Ge~~|3435<br>~~Ge~~|3455 ±1%<br>~~Ge~~|B57430V2103+262|
|10|±3,±5<br>~~ee~~|3590|3635|3650±3%|B57401V2103+062|
|10|±3,±5<br>~~ee~~<br>~~ee~~<br>~~ee~~|3940<br>~~ee~~|3980<br>~~ee~~|4000±3%<br>~~ee~~|B57421V2103+062|
|10|±3,±5<br>~~ee~~|4386|4455|4480±3%|B57471V2103+062|
|15|±5<br>~~ee~~<br>~~eG~~<br>~~ee~~|3940<br>~~eG~~|3980<br>~~eG~~|4000±3%<br>~~eG~~|B57421V2153J062|
|22|±3,±5<br>~~ee~~|3940|3980|4000±3%|B57421V2223+062|
|22|±3,±5<br>~~ee~~<br>~~ee~~|4386<br>~~ee~~|4455<br>~~ee~~|4480±3%<br>~~ee~~|B57471V2223+062|
|33|±3,±5<br>~~a~~|3940<br>|3980<br>|4000±3%<br>|B57421V2333+062|
|33|±3,±5<br>~~ase~~|4386<br>~~se~~|4455<br>~~se~~|4480±3%<br>~~se~~|B57471V2333+062|
|47|±3,±5<br>~~a~~|3940<br>|3980<br>|4000±3%<br>|B57421V2473+062|
|47|±3,±5<br>~~ase~~|4386<br>~~se~~|4455<br>~~se~~|4480±3%<br>~~se~~|B57471V2473+062|
|100|±3,±5<br>~~a~~|4386<br>|4455<br>|4480±3%<br>|B57471V2104+062|
|470|±3,±5<br>~~ase~~|4386<br>~~se~~|4455<br>~~se~~|4480±3%<br>~~se~~|B57471V2474+062|



+ = Resistance tolerance F = ±1%, G = ±2%, H = ±3%, J = ±5% 

2024-03-12 

PPD ML PD 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 5 of 12 

~~LO~~ **NTC thermistors for temperature measurement B57*V2 SMD NTC thermistors Standard series** 

## **Reliability data** 

SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a standardized PCB in accordance with IEC 60539-1. 

||||~~ee~~||
|---|---|---|---|---|
|Test|Standard<br>~~a ~~|Test conditions<br> ~~ee~~|DR25/R25<br>(typical)<br>~~ee~~<br>~~ee~~|Remarks|
|Storage in<br>dry heat|IEC<br>60068-2-2<br>JIS C 0021<br>~~pop~~|Storage at upper<br>category temperature<br>T: (125 ±2) °C<br>t: 1000 h<br>~~pop~~|< 2%<br>~~ee~~<br>~~pop~~||
|Storage in damp<br>heat, steady state|IEC<br>60068-2-78<br>JIS C 0022<br>~~po}~~|Temperature of air: (40 ±2) °C<br>Relative humidity of air:<br>(93 +2/-3) %<br>Duration: 56 days<br>~~po}~~|< 2%<br>~~po}~~||
|Rapid temperature<br>cycling|IEC<br>60068-2-14<br>JIS C 0025<br>~~po}~~<br>~~po~~|Lower test temperature: -55 °C<br>Upper test temperature: 125 °C<br>Number of cycles: 100<br>~~po}~~<br>~~po~~|< 2%<br>~~po}~~<br>~~po~~||
|Endurance|~~po~~<br>~~ef~~|Pmax:<br>0402: 150 mW,<br>0603: 180 mW,<br>0805: 210 mW<br>T: (65 ±2) °C<br>t: 1000 h<br>~~po~~<br>~~ef~~|< 2%<br>~~po~~<br>~~ef~~||
|Solderability|IEC<br>60068-2-58<br>JIS C 0054<br>~~P|~~|Solderability:<br>(215 ±3) °C, (3 ±0.3) s<br>(245 ±5) °C, (3 ±0.3) s<br>Resistance to soldering heat:<br>(260 ±5)°C, (10 ±1)s<br>~~P|~~|~~P|~~|95% of<br>terminations<br>wetted|
|Resistance drift<br>after soldering|~~a ~~|Reflow soldering profile<br> ~~ee~~|< 1%<br>~~ee~~||



2024-03-12 

PPD ML PD 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 6 of 12 

**NTC thermistors for temperature measurement SMD NTC thermistors** 

**B57*V2 Standard series** 

## **Recommended soldering profiles** 

## **Reflow soldering** 

Temperature ranges for reflow soldering acc. To IEC 60068-2-58 recommendations. 

**==> picture [445 x 195] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||||
|---|---|---|---|---|
|Profile feature|Sn-Pb eutectic assembly|Pb-free assembly|
|Preheat and soak|
|- Temperature min|Tsmin|100 °C|150 °C|
|- Temperature max|Tsmax|150 °C|200 °C|
|- Time|ts|60 … 120 s|60 … 120 s|
|Average ramp-up rate|Tsmax to Tp|3 °C/ s max.|3 °C/ s max.|
|Liquidous temperature|TL|183 °C|217 °C|
|Time at liquidous|tL|40 … 150 s|40 … 150 s|
|Peak package body temperature|Tp|[1) ]|215 °C … 260 °C|235 °C … 260 °C|
|Time (tp) above (Tp -5 °C )|tp|10 ... 40 s|10 … 40 s|
|Average ramp-down rate|Tp to Tsmax|6 °C/ s max.|6 °C/ s max.|
|Time 25 °C to peak temperature|max. 8 minutes|max. 8 minutes|

**----- End of picture text -----**<br>


1) Depending on package thickness. 

**Note:** All temperatures refer to topside of the package, measured on the package body surface. Number of reflow cycles: 3 

Iron soldering should be avoided hot air methods are recommended for repair purposes. 

## **Recommended solder** 

Flux less Pb-free Sn (95.1 … 96.0), Ag (3.0 … 4.0), Cu (0.5 … 0.9) solder is recommended. 

2024-03-12 

PPD ML PD 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 7 of 12 

**NTC thermistors for temperature measurement SMD NTC thermistors** 

**B57*V2 Standard series** 

## **Taping and packing** 

Tape and reel packing according to IEC 60286-3 

## **Reel dimensions** 

|=<br>3°<br>2<br>oo<br>s<br>3:|i=<br>I|iH|iH|||Emptycavities<br>KKE0270-E-E<br>Leader<br>=OG08|Emptycavities<br>KKE0270-E-E<br>Leader<br>=OG08|Emptycavities<br>KKE0270-E-E<br>Leader<br>=OG08|Emptycavities<br>KKE0270-E-E<br>Leader<br>=OG08|Emptycavities<br>KKE0270-E-E<br>Leader<br>=OG08|KKE0270-E-E<br> Top covertape|KKE0270-E-E<br> Top covertape|
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|:||260%|||||||||||
|||||KKE0058--E|||||Minimum400mm||||
||||||||||||Direction of unreeling||
|||||||||||||KKE0289-Q-E|
||||||||||8-mm tape||||
|Definition||Symbol||Symbol|||180-mm reel|||330-mm reel|||
|Reel diameter|Reel diameter|A|||||180 +0/-3|180 +0/-3||330 +0/-2.0|330 +0/-2.0||
|Reel width (inside)||W1|||||8.4 +1.5/-0|||8.4 +1.5/-0|||
|Reel width (outside)||W2|||||14.4 max.|||14.4 max.|||
|**Packing units for discrete chips**|||||||||||||
|||||=|O00 0<br>)000||||5<br>AK<br>sy(D|||‘=<br>=<br>AD<br>3|<br>\C)|
|Case size|Chip thickness|Chip thickness|Cardboard tape||Cardboard tape|Blister tape||Blister tape|∅ 180-mm reel|||∅330-mm reel|
|inch/mm|class||W|||W|||pcs.|||pcs.|
|0402/1005|0.5 mm||8 mm|8 mm||-|||10000|||50000|
|0603/1608|0.8 mm||8 mm|8 mm||-|||4000|||16000|
|0805/2012|0.8 mm||-|||8 mm|||4000|||16000|
||1.2 mm||-|||8 mm|||3000|||12000|



## **Packing units for discrete chips** 

## **Packing codes** 

The last two digits of the complete ordering code state the packing mode. 

60 ≙ cardboard tape, 180-mm reel 

- 62 ≙ blister tape, 180-mm reel 

- 70 ≙ cardboard tape, 330-mm reel 

- 72 ≙ blister tape, 330-mm reel 

2024-03-12 

PPD ML PD 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 8 of 12 

~~LO~~ **NTC thermistors for temperature measurement B57*V2 SMD NTC thermistors Standard series** 

## **Cautions and warnings** 

## **Storage** 

- Store thermistors only in original packaging. Do not open the package before storage. 

- Storage conditions in original packaging: storage temperature –25 °C to +45 °C, relative humidity ≤ 75% annual mean, 95% on max. 30 days in a year, dew precipitation and wetness are inadmissible. 

- Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or SMDs may stick together, causing problems during mounting. 

- Avoid contamination of thermistors surface during storage, handling and processing. Touching the metallization of unsoldered thermistors may change their soldering properties. 

- Avoid storage of thermistor in harmful environments like corrosive gases (SOx, Cl etc.) 

- After opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible. 

- Solder thermistors after shipment from TDK Electronics within the time specified: SMD NTC thermistors with nickel-barrier termination: 12 months 

## **Handling** 

- NTC thermistors must not be dropped. Chip-offs must not be caused during handling of NTCs. 

- Components must not be touched with bare hands. Gloves are recommended. 

- Avoid contamination of thermistor surface during handling. 

- Washing processes may damage the product due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts, which might lead to reduced reliability or lifetime. 

## **Soldering** 

- Use resin-type flux or non-activated flux. 

- Insufficient preheating may cause ceramic cracks. 

- Rapid cooling by dipping in solvent is not recommended. 

- Complete removal of flux is recommended. 

## **Mounting** 

- When NTC thermistors are encapsulated with sealing material or over molded with plastic material, there must be no mechanical stress caused by thermal expansion during the production process (curing/overmolding process) and during later operation. The upper category temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing compound and plastic material) are chemically neutral. 

- Electrode must not be scratched before/during/after the mounting process. 

- Contacts and housing used for assembly with thermistor have to be clean before mounting. 

- Ensure that adjacent materials are designed for operation at temperatures comparable to the surface temperature of the thermistor. Be sure that surrounding parts and materials can withstand the temperature. 

- Avoid contamination of thermistor surface during processing. 

## **Operation** 

- Use thermistors only within the specified operating temperature range. 

- Environmental conditions must not harm the thermistors. Use thermistors only in normal atmospheric conditions. 

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## ~~LO~~ **NTC thermistors for temperature measurement B57*V2 SMD NTC thermistors Standard series** 

- Contact of NTC thermistors with any liquids and solvents should be prevented. It must be ensured that no water enters the NTC thermistors (e.g. through plug terminals). For measurement purposes (checking the specified resistance vs. temperature), the component must not be immersed in water but in suitable liquids (e.g. Galden). 

- Avoid dewing and condensation. 

- Be sure to provide an appropriate fail-safe function to prevent secondary product damage caused by malfunction (e.g. use VDR for limitation of overvoltage condition). 

This listing does not claim to be complete, but merely reflects the experience of TDK Electronics AG. 

## **Display of ordering codes for TDK Electronics products** 

The ordering code for one and the same product can be represented differently in data sheets, data books, other publications, on the company website, or in order-related documents such as shipping notes, order confirmations and product labels. **The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products** . Detailed information can be found on the Internet under www.tdk-electronics.tdk.com/orderingcodes. 

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Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

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~~LO~~ **Important notes** 

The following applies to all products named in this publication: 

1. Some parts of this publication contain **statements about the suitability of our products for certain areas of application** . These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out **that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application.** As a rule, we are either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 

2. We also point out that **in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified.** In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 

3. **The warnings, cautions and product-specific notes must be observed.** 

4. In order to satisfy certain technical requirements, **some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous)** . Useful information on this will be found in our Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our sales offices. 

5. We constantly strive to improve our products. Consequently, **the products described in this publication may change from time to time** . The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. 

We also **reserve the right to discontinue production and delivery of products** . Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 

6. Unless otherwise agreed in individual contracts, **all orders are subject to our General Terms and Conditions of Supply.** 

7. **Our manufacturing sites serving the automotive business apply the IATF 16949 standard.** The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that **only requirements mutually agreed upon can and will be implemented in our Quality Management System.** For clarification purposes we like to point out that obligations from IATF 16949 shall only become legally binding if individually agreed upon. 

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~~LO~~ **Important notes** 

8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, FilterCap, FormFit, InsuGate, LeaXield, MediPlas, MiniBlue, MiniCell, MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PiezoBrush, PlasmaBrush, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SurfIND, ThermoFuse, WindCap, XieldCap are **trademarks registered or pending** in Europe and in other countries. Further information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks. 

## Release 2024-02 

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