B57254V5104F360

## **NTC thermistors for temperature measurement** 

## SMD NTC thermistors for automotive applications 

**Series/Type: Automotive series Ordering code: B57*V5** Date: 2025-10-30 Version: 5 

>  TDK Electronics AG 2025. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without TDK Electronics' prior express consent is prohibited. 

**NTC thermistors for temperature measurement SMD NTC thermistors for automotive applications** 

**B57*V5 Automotive series** 

## **Applications** 

Temperature measurement and compensation in various automotive circuits such as 

- charging and temperature control of battery packs and battery management systems (BMS) 

- electronic control units (ECUs), e.g. motor management, HVAC, electronic power steering (EPS), gearbox controls, ABS systems 

- temperature sensor for air-conditioning 

- LED lighting 

- DC/DC converters, inverters, on-board chargers (OBC) 

- thermal protection of semiconductors (GaN / SiC) in power modules. 

## **Features** 

- Qualification based on AEC-Q200 

- Multilayer SMD NTC thermistor with nickel barrier termination (AgNiSn) 

- Accurate temperature measurement from -55 °C to 150 °C 

- Excellent long-term aging stability in high temperature and high humidity environment 

- Tight R and B tolerances 

- Short response time 

- High mechanical robustness (selected types also available with soft termination) 

- 100% Pb free, RoHS 

- UL approval, file number E69802 

**Dimensional drawing** 

**Case size l w h k EIA/mm mm mm mm mm** 0402/1005 1.0 ±0.1 0.5 ±0.05 0.6 max. 0.25 ±0.15 0603/1608 1.6 ±0.15 0.8 ±0.15 0.9 max. 0.35 ±0.15 0805/2012 2.0 ±0.2 1.25 ±0.15 1.3 max. 0.5 ±0.25 ~~mo~~ **Recommended solder pad layout** 

|**l**<br>**mm**<br>1.0 ±0.1<br>1.6 ±0.15<br>2.0 ±0.2<br>~~mo~~|**w**<br>**mm**<br>0.5 ±0.05<br>0.8 ±0.15<br>1.25 ±0.15<br>~~mo~~|**h**<br>**mm**<br>0.6 max.<br>0.9 max.<br>1.3 max.<br>~~mo~~|**k**<br>**mm**<br>0.25 ±0.15<br>0.35 ±0.15<br>0.5 ±0.25<br>~~mo~~|
|---|---|---|---|
|**Case size**<br>**EIA/mm**|**A**<br>**mm**|**B**<br>**mm**|**C**<br>**mm**|
|0402/1005|0.6|0.6|1.7|
|0603/1608|1.0|1.0|3.0|
|0805/2012|1.3|1.2|3.4|



2025-10-30 

PPD ML PD 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

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~~LO~~ **NTC thermistors for temperature measurement B57*V5 SMD NTC thermistors for automotive applications Automotive series** 

## **General technical data, case size 0402 (1005)** 

|Operating temperature|Top<br>-55 … 150<br>~~fT~~|°C|
|---|---|---|
|Maximum power<br>Rated temperature<br>Dissipation factor<br>Thermal cooling time constant<br>Heat capacity<br>Weight of component|(at 25 °C, on PCB) P251)<br>150<br>TR<br>25<br>(on PCB)<br>δth1)<br>approx. 2.5<br>(on PCB)<br>τc1)<br>approx. 3<br>Cth1)<br>approx. 7.5<br>approx. 2<br>~~fT~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~fT~~|mW<br>°C<br>mW/K<br>s<br>mJ/K<br>mg|



1) Depends on mounting situation 

## **Electrical specifications and ordering codes, case size 0402 (1005)** 

|R25<br>kΩ|∆RR/RR<br>%|B25/50<br>K|B25/85<br>K|B25/100<br>K|Ordering code|
|---|---|---|---|---|---|
|4.7 k|±5|3940|3980|4000±3%|B57251V5472J060|
|10 k|±0.5,±1,±3,±5|3380|3435|3455±1%|B57232V5103+360|
|10 k|±5|3940|3980|4000±3%|B57251V5103J060|
|47 k|±1,±3,±5|4050|4108|4131±1%|B57259V5473+360|
|100 k|±1,±3,±5|4250|4311|4334±1%|B57254V5104+360 *)|



+ = Resistance tolerance D = ±0.5%, F = ±1%, H = ±3%, J = ±5% 

*) Operating temperature range -40 °C to 150 °C 

2025-10-30 

PPD ML PD 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 3 of 13 

~~LO~~ **NTC thermistors for temperature measurement B57*V5 SMD NTC thermistors for automotive applications Automotive series** 

## **General technical data, case size 0603 (1608)** 

|**General technical data, case size 0603 (1608), case size 0603 (1608) case size 0603 (1608)(1608)1608)**|**General technical data, case size 0603 (1608), case size 0603 (1608) case size 0603 (1608)(1608)1608))**|||
|---|---|---|---|
|Operating temperature|Top<br>~~fT~~|-55 … 150<br>~~fT~~|°C|
|Maximum power<br>(at 25 °C, on PCB) P|(at 25 °C, on PCB) P251)<br>~~fT~~<br>~~a~~<br>~~ee~~|180<br>~~fT~~<br>~~ee~~|mW<br>~~ee~~|
|Rated temperature|TR<br>~~a~~<br>~~ee~~|25<br>~~ee~~|°C<br>~~ee~~|
|Dissipation factor<br>(on PCB)|δth1)<br>~~ee ~~<br>~~fT~~|approx. 3<br> ~~ee~~<br>~~fT~~|mW/K<br>~~ee~~|
|Thermal cooling time constant<br>(on PCB)|τc1)<br>~~fT~~<br>~~a~~<br>~~ee~~|approx. 4<br>~~fT~~<br>~~ee~~|s<br>~~ee~~|
|Heat capacity<br>~~—~~|Cth1)<br>~~a~~<br>~~ee~~<br>~~—~~|approx. 12<br>~~ee~~<br>|mJ/K<br>~~ee~~|
|Weight of component<br>~~—~~|~~ee ~~<br>~~—fT~~|approx. 6<br> ~~ee~~<br>~~fT~~|mg<br>~~ee~~|



1) Depends on mounting situation 

## **Electrical specifications and ordering codes, case size 0603 (1608)** 

||~~a~~|||~~ee~~||
|---|---|---|---|---|---|
|R25<br>kΩ|∆RR/RR<br>%<br>~~a ee~~<br>~~a~~|B25/50<br>K<br>~~ee~~|B25/85<br>K<br>~~ee~~|B25/100<br>K<br>~~ee~~<br>~~ee~~|Ordering code|
|10 k|±1<br>~~a ee~~<br>~~a~~|3366<br>~~ee~~|3419<br>~~ee~~|3439±0.5%<br>~~ee~~<br>~~ee~~|B57333V5103F460|
|10 k|±1<br>~~a~~<br>~~a~~|3415|3435|3440±1%<br>~~ee~~|B57334V5103F360|
|10 k|±0.5<br>~~a~~<br>~~a~~|3380|3435|3455±0.7%|B57332V5103D560|
|10 k|±1,±3,±5<br>~~a~~<br>~~ee~~|3380<br>~~ee~~|3435<br>~~ee~~|3455±1%<br>~~ee~~|B57332V5103+360 **)<br>~~ee~~|
|10 k|±1,±3,±5<br>~~ee~~<br>~~ee~~|3568<br>~~ee~~<br>~~ee~~|3610<br>~~ee~~<br>~~ee~~|3624±1%<br>~~ee~~<br>~~ee~~|B57343V5103+360 *) **)<br>~~ee~~|
|10 k|±3,±5<br>~~ee~~|3590<br>~~ee~~|3635<br>~~ee~~|3650±3%<br>~~ee~~|B57342V5103+060 **)<br>~~ee~~|
|10 k|±1,±3,±5<br>~~ee~~<br>~~a ee~~|3940<br>~~ee~~<br>~~ee~~|3980<br>~~ee~~<br>~~ee~~|4000 ±1%<br>~~ee~~<br>~~ee~~|B57358V5103+360<br>~~ee~~|
|10 k|±3,±5<br>~~a ee~~<br>~~a~~|3940<br>~~ee~~<br>|3980<br>~~ee~~<br>|4000±3%<br>~~ee~~<br>|B57351V5103+060<br>|
|10 k|±3,±5<br>~~ee~~|4386<br>~~ee~~|4455<br>~~ee~~|4480±3%<br>~~ee~~|B57352V5103+060<br>~~ee~~|
|22 k|±3,±5<br>~~ee~~<br>~~a~~|3940<br>~~ee~~<br>|3980<br>~~ee~~<br>|4000±3%<br>~~ee~~<br>|B57351V5223+060<br>~~ee~~<br>|
|22 k|±3,±5<br>~~ee~~|4386<br>~~ee~~|4455<br>~~ee~~|4480±3%<br>~~ee~~|B57352V5223+060<br>~~ee~~|
|47 k|±1,±3,±5<br>~~ee~~<br>~~a~~|4050<br>~~ee~~<br>|4108<br>~~ee~~<br>|4131±1.5%<br>~~ee~~<br>|B57359V5473+260 **)<br>~~ee~~<br>|
|47 k|±3,±5<br>~~ee~~|4050<br>~~ee~~|4108<br>~~ee~~|4131±2%<br>~~ee~~|B57359V5473+160<br>~~ee~~|
|47 k|±3,±5<br>~~ee~~<br>~~a~~|4386<br>~~ee~~|4455<br>~~ee~~|4480±3%<br>~~ee~~|B57352V5473+060<br>~~ee~~<br>~~ee~~|
|100 k|±1,±3,±5<br>~~es~~|4200<br>~~es~~|4260<br>~~es~~|4282±1%<br>~~es~~|B57355V5104+360 *)|
|100 k|±3,±5<br>~~ee~~|4250<br>~~ee~~|4311<br>~~ee~~|4334±2%<br>~~ee~~|B57354V5104+160<br>~~ee~~|
|100 k|±1,±3,±5<br>~~ee~~<br>~~a~~|4050<br>~~ee~~<br>|4108<br>~~ee~~<br>|4131±1.5%<br>~~ee~~<br>|B57359V5104+260<br>~~ee~~<br>|
|100 k|±1,±3,±5<br>~~ee~~|4386<br>~~ee~~|4455<br>~~ee~~|4480±1%<br>~~ee~~|B57352V5104+360<br>~~ee~~|
|100 k|±3,±5<br>~~ee~~<br>~~a~~|4386<br>~~ee~~|4455<br>~~ee~~|4480±3%<br>~~ee~~|B57352V5104+060<br>~~ee~~|



+ = Resistance tolerance F = ±1%, G = ±2%, H = ±3%, J = ±5% 

*) Operating temperature range -40 °C to 150 °C 

**) also available in soft termination 

2025-10-30 

PPD ML PD 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 4 of 13 

~~LO~~ **NTC thermistors for temperature measurement B57*V5 SMD NTC thermistors for automotive applications Automotive series** 

## **General technical data, case size 0805 (2012)** 

|Operating temperature<br>Top<br>-55 … 150<br>°C<br>~~fT~~|
|---|
|Maximum power<br>(at 25 °C, on PCB) P251)<br>210<br>mW<br>Rated temperature<br>TR<br>25<br>°C<br>Dissipation factor<br>(on PCB)<br>δth1)<br>approx. 3.5<br>mW/K<br>Thermal cooling time constant<br>(on PCB)<br>τc1)<br>approx. 10<br>s<br>Heat capacity<br>Cth1)<br>approx. 35<br>mJ/K<br>Weight of component<br>approx. 13<br>mg<br>~~fT~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~fT~~|
|1)Depends on mounting situation|
|**Electrical specifications and ordering codes, case size 0805(2012)**|
|R25<br>kΩ<br>∆RR/RR<br>%<br>B25/50<br>K<br>B25/85<br>K<br>B25/100<br>K<br>Ordering code<br>4.7 k<br>±3,±5<br>3590<br>3635<br>3650±3%<br>B57442V5472+062<br>4.7 k<br>±3,±5<br>4386<br>4455<br>4480±3%<br>B57452V5472+062<br>5 k<br>±1,±3,±5<br>3380<br>3435<br>3455±1%<br>B57432V5502+362**)<br>10 k<br>±1,±3,±5<br>3380<br>3435<br>3455±1%<br>B57432V5103+362<br>~~a~~<br>~~ee ee~~<br>~~ee~~<br>~~po~~<br>~~po~~<br>~~ee~~<br>~~po~~|
|10 k<br>±3,±5<br>3590<br>3635<br>3650±3%<br>B57442V5103+062<br>10 k<br>±3,±5<br>3940<br>3980<br>4000±3%<br>B57451V5103+062<br>~~po~~<br>~~po~~|
|10 k<br>±3,±5<br>4386<br>4455<br>4480±3%<br>B57452V5103+062<br>33 k<br>±3,±5<br>3940<br>3980<br>4000±3%<br>B57451V5333+062<br>~~po~~<br>~~po~~|
|47 k<br>±3,±5<br>3940<br>3980<br>4000±3%<br>B57451V5473+062<br>47 k<br>±1,±3,±5<br>4050<br>4108<br>4131±1.5%<br>B57459V5473+262 **)<br>~~ee~~<br>~~po~~|
|100 k<br>±3,±5<br>4386<br>4455<br>4480±3%<br>B57452V5104+062<br>~~ee~~|



+ = Resistance tolerance F = ±1%, G = ±2%, H = ±3%, J = ±5% 

**) also available in soft termination 

2025-10-30 

PPD ML PD 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

Page 5 of 13 

~~Lo~~ **NTC thermistors for temperature measurement B57*V5 SMD NTC thermistors for automotive applications Automotive series** 

## **Reliability data** 

Tests of SMD NTC thermistors are based on AEC-Q200. 

The parts are mounted on standardized PCB. 

|Test|Standard<br>~~en~~|Test conditions<br>~~en~~|∆R25/ R25<br>(typical)<br>~~en~~|Remarks|
|---|---|---|---|---|
|Pre-stress and post-<br>stress electrical test|~~re~~|Resistance at: 25 °C and 100 °C -<br>~~re~~|Resistance at: 25 °C and 100 °C -<br>~~re~~||
|High temperature<br>exposure (storage)|MIL-STD-202,<br>method 108|Test temperature: 150 °C<br>Duration: 1000 h<br>Unpowered<br>**Except**<br>B57*32V5*, B57*58V5*<br>and B57*59V5*<br>B57*54V5* and B57*55V5*|< 5%<br>< 1%<br>< 2%||
|Temperature cycling|JESD22,<br>method JA-104|Lower test temperature: Top min<br>Upper test temperature: Top<br>max<br>Number of cycles: 1000<br>Transfer time: < 10 s<br>Dwell time: 15 min<br>Air – Air|< 5%|Temperature<br>cycling is<br>performed acc.<br>MIL-STD-202,<br>method 107.<br>No warranty is<br>given for the<br>reliability of solder<br>joint.|
|Biased humidity|MIL-STD-202,<br>method 103|Test temperature: 85 °C<br>Rel. humidity of air: 85%<br>Duration: 1000 h<br>Test voltage: VNTC= 0.3 V DC|< 5%||
|Operational life|MIL-STD-202,<br>method 108|Test temperature: 150 °C<br>Pmax= 0.35 mW<br>Duration: 1000 h|< 5%||
|External visual|MIL-STD-883E,<br>method 2009<br>~~po~~|Visual inspection<br>~~po~~|~~po~~||
|Physical dimensions|JESD22,<br>method JB-100<br>~~re~~|Measured with callipers<br>~~re~~|~~re~~|Within the specified<br>values|
|Resistance to<br>solvents|MIL-STD-202,<br>method 215|Not applicable for SMD NTC thermistors<br>(component has no marking. color coding or coating)|||
|Mechanical shock|MIL-STD-202,<br>method 213<br>~~po~~|Peak value: 1500_g_<br>Half sine<br>Condition F<br>~~po~~|< 5%<br>~~po~~||



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~~LO~~ **NTC thermistors for temperature measurement B57*V5 SMD NTC thermistors for automotive applications Automotive series** 

|Test|Standard|Test conditions|∆R25/ R25<br>(typical)|Remarks|
|---|---|---|---|---|
|Vibration|MIL-STD-202,<br>method 204|Acceleration: 5_g_<br>Sweep time: 20 min<br>Frequency range: 10 … 2000 Hz<br>3 x 12 cycles<br>**Except**<br>B574*V5*|< 1%<br>< 5%||
|Resistance to<br>soldering heat|MIL-STD-202,<br>method 210|Dip: 260 °C; 10 s<br>1 heat cycle<br>**Except**<br>B57*32V5* and B57*59V5*<br>B57*54V5* and B57*55V5*|< 3%<br>< 1%<br>< 1%||
|ESD|AEC-Q200-002,<br>method -002|Discharge capacitance: 150 pF<br>Discharge resistance: 2 kΩ<br>Charging voltage: 6 kV<br>Contact discharge<br>2 pulses in each polarity|< 5%||
|Solderability|J-STD-002|a) Dip: 235 °C; 5 s:<br>aging 4 h @ 155 °C<br>b) Dip: 215 °C; 5 s:<br>steam aging 8 h @ 92 °C<br>c) Dip: 260 °C; 7 s:<br>steam aging 8 h @ 92 °C||95% of termination<br>wetted|
|Electrical<br>characterization|~~a ee~~|R(25 °C), R(100 °C), B(25/100)<br>~~ee~~|~~ee~~|Within the specified<br>values|
|Flammability|UL-94<br>V-0 or V-1<br>~~pf~~|Not applicable for SMD NTC thermistors<br>(component is not coated or encapsulated with plastic materials)<br>~~pf|~~|||
|Board flex|AEC-Q200-005,<br>method -005<br>~~pf~~|B572*V5* max. bending 1 mm<br>B573*V5* max. bending 2 mm<br>B574*V5* max. bending 2 mm<br>Duration @ max. bending: 60 s<br>~~pf|~~|< 2%<br>< 2%<br>< 5%<br>~~|~~||
|Terminal strength|AEC-Q200-006,<br>method -006<br>~~pf~~|B572*V5* max. F: 5 N<br>B573*V5* max. F: 10 N<br>B574*V5* max. F: 17 N<br>~~pf |~~|< 2%<br>< 2%<br>< 5%<br>~~|~~||
|Resistance drift after<br>soldering|~~po~~|Reflow soldering profile<br>~~po~~|< 1%<br>~~po~~||



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**NTC thermistors for temperature measurement B57*V5 SMD NTC thermistors for automotive applications Automotive series** 

## **Recommended soldering profiles** 

## **Reflow soldering** 

Temperature ranges for reflow soldering acc. To IEC 60068-2-58 recommendations. 

|Profile feature||Sn-Pb eutectic assembly|Pb-free assembly|
|---|---|---|---|
|Preheat and soak<br>- Temperature min<br>- Temperature max<br>- Time|Tsmin<br>Tsmax<br>ts|100 °C<br>150 °C<br>60 … 120 s|150 °C<br>200 °C<br>60 … 120 s|
|Average ramp-up rate|Tsmaxto Tp|3 °C/s max.|3 °C/s max.|
|Liquidous temperature<br>Time at liquidous|TL<br>tL|183 °C<br>40 … 150 s|217 °C<br>40 … 150 s|
|Peak package body temperature|Tp1)|215 °C … 260 °C|235 °C … 260 °C|
|Time (tp) above (Tp-5 °C)|tp|10 ... 40 s|10 … 40 s|
|Average ramp-down rate|Tpto Tsmax|6 °C/ s max.|6 °C/ s max.|
|Time 25 °C to peak temperature||max. 8 minutes|max. 8 minutes|



1) Depending on package thickness. 

**Note:** All temperatures refer to topside of the package, measured on the package body surface. Number of reflow cycles: 3 

Iron soldering should be avoided hot air methods are recommended for repair purposes. 

## **Recommended solder** 

Flux less Pb-free Sn (95.1 … 96.0), Ag (3.0 … 4.0), Cu (0.5 … 0.9) solder is recommended. 

2025-10-30 

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**NTC thermistors for temperature measurement SMD NTC thermistors for automotive applications** 

**B57*V5 Automotive series** 

## **Taping and packing** 

Tape and reel packing according to IEC 60286-3 

## **Reel dimensions and tolerances** 

|||8-mm tape|8-mm tape|
|---|---|---|---|
|Definition|Symbol|180-mm reel|330-mm reel|
|Reel diameter|A|180 +0/-3|330 +0/-2.0|
|Reel width (inside)|W1|8.4 +1.5/-0|8.4 +1.5/-0|
|Reel width (outside)|W2|14.4 max.|14.4 max.|



## **Packing units for discrete chip** 

|Case size<br>inch/mm|Chip thickness<br>class|=}<br>(0,0 0 0<br>ooo|=}<br>(0,0 0 0<br>ooo|Er<br>™@<br>20|e)<br>(OD<br>=<br>(|<br>|g<br>\q7|
|---|---|---|---|---|---|
|||Cardboard tape<br>W|Blister tape<br>W|∅ 180-mm reel<br>pcs.|∅330-mm reel<br>pcs.|
|0402/1005|0.5 mm|8 mm|-|10000|50000|
|0603/1608|0.8 mm|8 mm|-|4000|16000|
|0805/2012|0.8 mm|-|8 mm|4000*)|16000|
||1.2 mm|-|8 mm|3000|12000|



*) **Except** B57442V5103* 3000 pcs./reel 

## **Packing codes** 

The last two digits of the complete ordering code state the packing mode. 

- 60 ≙ cardboard tape, 180-mm reel 

- 62 ≙ blister tape, 180-mm reel 

70 ≙ cardboard tape, 330-mm reel 

- 72 ≙ blister tape, 330-mm reel 

2025-10-30 

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~~LO~~ **NTC thermistors for temperature measurement B57*V5 SMD NTC thermistors for automotive applications Automotive series** 

## **Cautions and warnings** 

## **Storage** 

- Store thermistors only in original packaging. Do not open the package before storage. 

- Storage conditions in original packaging: storage temperature –25 °C to +45 °C, relative humidity ≤ 75% annual mean, 95% on max. 30 days in a year, dew precipitation and wetness are inadmissible. 

- Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or SMDs may stick together, causing problems during mounting. 

- Avoid contamination of thermistors surface during storage, handling, and processing. Touching the metallization of unsoldered thermistors may change their soldering properties. 

- Avoid storage of thermistor in harmful environments like corrosive gases (SOx, Cl etc.) 

- After opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible. 

- Solder thermistors after shipment from TDK Electronics within the time specified: 

- SMD NTC thermistors with nickel-barrier termination: 12 months 

## **Handling** 

- NTC thermistors must not be dropped. Chip-offs must not be caused during handling of NTCs. 

- Components must not be touched with bare hands. Gloves are recommended. 

- Avoid contamination of thermistor surface during handling. 

- Washing processes may damage the product due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts, which might lead to reduced reliability or lifetime. 

## **Soldering** 

- Use resin-type flux or non-activated flux. 

- Insufficient preheating may cause ceramic cracks. 

- Rapid cooling by dipping in solvent is not recommended. 

- Complete removal of flux is recommended. 

## **Mounting** 

- When NTC thermistors are encapsulated with sealing material or over molded with plastic material, there must be no mechanical stress caused by thermal expansion during the production process (curing / over molding process) and during later operation. The upper category temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing compound and plastic material) are chemically neutral. 

- Electrode must not be scratched before/during/after the mounting process. 

- Contacts and housing used for assembly with thermistor have to be clean before mounting. 

- Ensure that adjacent materials are designed for operation at temperatures comparable to the surface temperature of the thermistor. Be sure that surrounding parts and materials can withstand the temperature. 

- Avoid contamination of thermistor surface during processing. 

2025-10-30 

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~~LO~~ **NTC thermistors for temperature measurement B57*V5 SMD NTC thermistors for automotive applications Automotive series** 

## **Operation** 

- Use thermistors only within the specified operating temperature range. 

- Environmental conditions must not harm the thermistors. Use thermistors only in normal atmospheric conditions. 

- Contact of NTC thermistors with any liquids and solvents should be prevented. It must be ensured that no water enters the NTC thermistors (e.g. through plug terminals). For measurement purposes (checking the specified resistance vs. temperature), the component must not be immersed in water but in suitable liquids (e.g. Galden). 

- Avoid dewing and condensation. 

- Be sure to provide an appropriate fail-safe function to prevent secondary product damage caused by malfunction (e.g. use VDR for limitation of overvoltage condition). 

This listing does not claim to be complete but merely reflects the experience of TDK Electronics AG. 

## **Display of ordering codes for TDK Electronics products** 

The ordering code for one and the same product can be represented differently in data sheets, data books, other publications, on the company website, or in order-related documents such as shipping notes, order confirmations and product labels. **The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products** . Detailed information can be found on the Internet at www.tdk-electronics.tdk.com/orderingcodes. 

2025-10-30 

PPD ML PD 

Please read _Cautions and warnings_ and _Important notes_ at the end of this document. 

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~~LO~~ **Important notes** 

The following applies to all products named in this publication: 

1. Some parts of this publication contain **statements about the suitability of our products for certain areas of application** . These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out **that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application.** As a rule, we are either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 

2. We also point out that **in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified.** In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 

3. **The warnings, cautions and product-specific notes must be observed.** 

4. In order to satisfy certain technical requirements, **some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous)** . Useful information on this will be found in our Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our sales offices. 

5. We constantly strive to improve our products. Consequently, **the products described in this publication may change from time to time** . The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. 

We also **reserve the right to discontinue production and delivery of products** . Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 

6. Unless otherwise agreed in individual contracts, **all orders are subject to our General Terms and Conditions of Supply.** 

7. **Our manufacturing sites serving the automotive business apply the IATF 16949 standard.** The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that **only requirements mutually agreed upon can and will be implemented in our Quality Management System.** For clarification purposes we like to point out that obligations from IATF 16949 shall only become legally binding if individually agreed upon. 

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~~LO~~ **Important notes** 

8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, FilterCap, FormFit, InsuGate, LeaXield, MediPlas, MiniBlue, MiniCell, MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PiezoBrush, PlasmaBrush, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SurfIND, ThermoFuse, WindCap, XieldCap are **trademarks registered or pending** in Europe and in other countries. Further information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks. 

## Release 2024-02 

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