B32320I4207K000

## i T DIK 

## Film Capacitors 

## Metallized Polypropylene Film Capacitors (MKP) 

Series/Type: B323201 Ordering code: B323201* Date: October 2020 Version: V1.0 

© TDK Electronics AG 2020. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without TDK Electronics’ prior express consent is prohibited. 

B32320I* B323201 

## Film Capacitors Metallized Polypropylene Film Capacitors (MKP) 

## Typical applications 

- m Frequency converters 

- m Inverter based home appliances m= Solar inverters 

- = Variable speed motor drives Climatic 

m Max. operating temperature: 105 °C (Hotspot) 

- = Climatic category (IEC 60068-1:2013): 40/085/56 

## Construction 

- = Dielectric: Polypropylene (MKP) 

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- m Plastic case (UL 94 V-0) m Epoxy resin sealing (UL 94 V-0) 

## Features 

- m Capacitance values 6.5 up to 260 UF 

- m High CV product, compact 

- = Good self-healing properties 

- = Over-voltage capability 

- m Low losses with high current capability = High reliability 

- m Long useful life 

- m™ RoHS-compatible 

## Terminals 

- = Parallel wire leads, lead-free tinned 

- m 5-pin 

- m= Standard lead lengths: 4.5 +0.5 mm 

## Marking 

Manufacturer's logo and lot number, date code, rated capacitance (coded), capacitance tolerance (code letter) and rated DC voltage 

## Delivery mode 

- m Bulk (untaped) 

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Film Capacitors Metallized Polypropylene Film Capacitors (MKP) 

B32320I* 

B323201 

## Dimensional drawings 

|Number|of|_|Lead|spacing|(P1)|Lead|pacing|(P2)||Lead diameter (di)||Lead diameter (d2)||Type|
|---|---|---|---|---|---|---|---|---|---|---|
|wires||mm|||mm|||mm|mm||
|5-pin||12.7|+0.4||22.5|+0.4||1.2 +0.05|2.0 +0.05||
|5-pin||20.3|+0.4||42.5|+0.4||1.2+0.05|2.0+0.05||



## Dimensional drawings 5-pin version 

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| —» [aaa]<br>KLK2171-N<br>**----- End of picture text -----**<br>


Note: 4 x 1.2 mm terminal-electrode (d1) 1 x 2 mm terminal-electrode (d2) 

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“TDI 

B32320I 

## Metallized Polypropylene Film Capacitors (MKP) 

## Overview of available types 

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|||||
|---|---|---|---|
|Vr|(85|°C)|1300 V DC|
|Cr|(HF)|
|15|Po|fF|
|20|ee eee|
|2721|esee|
|ee|
|30|ee|ee|
|50|Pp|||
|66|ee|
|70|rr|eee|
|88|ee|
|100|es ee|
|100|es|
|110|Pp|Po|
|150|ee|ee|
|150|Pp|Pp|
|200|PO|Pp|
|200|ee eee|
|260|ee ee|

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B323201 

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## Metallized Polypropylene Film Capacitors (MKP) 

## Ordering codes and packing units 

|Cr?) |Max.<br>P1/P2<br>dimensions|Ordering code<br>(composition see|IRMs,max”) | Tpeak<br> |60°CAmb.|IRMs,max”) | Tpeak<br> |60°CAmb.|ESRyp||ESLtyp*||tand —<br>max.||Pcs./<br>|Pkg.|
|---|---|---|---|---|---|---|---|
|DxH|Belew)|10 kHz||10 kHz||1 kHz||
|||||||(10-*)||
|UF<br>mm<br>mm||Arms|kA|mQ|nH|||
|Vre5°c =450 V DC||||||||
|Vresec = 800V DC||||||||
|Vre5°c = 1100<br>V DC||||||||
|Vr,85°c=1300VDC||||||||



*) Intermediate capacitance values are available on request 

Composition of ordering code += Capacitance tolerance code i Packing code K=+10% 000 = Untapped (lead length 4.5 mm) Other lead lengths can be made available on request 

1) Capacitance value measured at 1 KHz 

2) Max ripple current Irws@60 °C Amb@10 kHz for a AT $25 °C at AESRiyp S$ +5% 

3) Typical ESL value are calculated out of the resonance frequency (See specific graphs of Z versus frequency) 

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October 2020 

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B32320I* B323201 

## Film Capacitors Metallized Polypropylene Film Capacitors (MKP) 

## Technical data 

Reference standard: IEC 61071: 2007. 

All data given at T=20 °C, unless otherwise is specified. 

Operating temperature range Max. operating temperature, THot spot, max +105 °C Upper category temperature Tmax. +85 °C Lower category temperature Tmin. -40 °C Insulation Resistance Rins, given as t>10 000 s (after 1 min) time constant t = Cre Rins, rel. humidity <65% For Vr 2500 V measured at 500 V (minimum as-delivered values) Par Wy <S00y messured ati DC voltage test between terminals (10 s) 1.5°VpR Voltage test terminal to case (10 s) 2110 V AC, 50Hz Reliability: Failure rate 7 75 fit ($1 * 10-9) at 0.5 * Vr, 40 °C For conversion to other operating conditions and temperatures, refer to chapter "Quality, 2 Reliability" Service life ts. 100 000 h at Vr, 70 °C Vr (DC) 450 V 800 V 1100 V 1300 V Continuous operation voltage (Vop) at Top of 85°C 3=— |450 V 800 V 1100 V 1300 V For temperatures between 85 °C and 105 °C 2.5% | °C Of Vop derating compared to Vop at 85 °C Typical waveforms: V rv VA » Vac VR Vp, max + j t["] tel | KLK1635-E KLK1267-S 

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B323201* B323201 

## Film Capacitors Metallized Polypropylene Film Capacitors (MKP) 

## Restrictions 

Vr: Maximum operating peak voltage of either polarity but of a non-reversing waveform, for which the capacitor has been designed for continuous operation. 

## Gac, max <0.2 * Vr 

|Gac, max <0.2 * VrVr|||
|---|---|---|
|Overvoltage|Maximum duration within|Observation|
||one day||
|1.1°VR|30 % ofon-load duration|System regulation|
|115-Va||System regulation|
|12<br>Va||System regulation|
|Ta+Vr||Systemregulation|



## NOTE 1 

An overvoltage equal to 1.5 » Vr for 30 ms is permitted 1000 times during the life of the capacitor. 

The amplitudes of the overvoltages that may be tolerated without significant reduction in the life time of the capacitor depend on their duration, the number of application and the capacitor temperature. In addition, these values assume that the overvoltages may appear when the internal temperature of the capacitor is less than 0 °C but within the temperature category. 

## NOTE 2 

The average applied voltage must not be higher than the specified voltage. 

## Pulse handling capability 

"dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal voltages, expressed in V/ms. 

Note: 

The values of dV/dt provided below must not be exceeded in order to avoid damaging the capacitor. 

## dV/dt values (available types) 

|Type|B32320I||
|---|---|---|
|Capacitors|53|57|
|height (mm)|||
|Capacitors|95|120|
|height(mm)|||



Ipeak (Peak current that can be handled by capacitor) = C(uF) x dV/dt 

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October 2020 

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B32320I* B32320I 

## Film Capacitors Metallized Polypropylene Film Capacitors (MKP) 

## Characteristics curves (Z/ ESR vs freq) 

Impedance Z versus frequency f (Typical values) 450 VDC 

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1 j<br>2 eg B3232014 F<br>FAoo<br>iz) 10sttL dd<br>t SS<br>10° oe Sr<br>107 EHH Sacra PNR Eee<br>5 LLEs 2 0 p7 u r LeSeesPRN<br>E=4) eere<br>102 88 pF ZG P [ES] Re ETH<br>200 wr LACTNNT<br>193Lonoo<br>10? 5 10° 5 104 5 10° Hz 108<br>—-f<br>**----- End of picture text -----**<br>


Impedance Z versus frequency f (Typical values) 800 V DC 

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GO?mgAME TOSD<br>Pa yea eeSEA<br>ORR DUE<br>Eat — SSNS SS — tt<br>-2 WAN<br>1932LOnn<br>10? 5 10° 5 104 5 105 Hz 10°<br>—~f<br>**----- End of picture text -----**<br>


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ei .<br>yP<br>450 V DC<br>107 a<br>Q | B3232014 So e eee<br>aee<br>ESR TTTTT 960 pe TT<br>t | ee ol<br>Te AN NSlll|<br>SS 2 SSSSeSss<br>aa<br>————ee<br>ijdttee SatTT<br>anisa . a . Allaa ae ae<br>f<br>ESR versus frequency f<br>(Typical values)<br>800 V DC<br>10°! eee<br>LL<br>PT A aso pe TTT TTT<br>10 |_| | ad 15pF ERR<br>—— TIT<br>0°a a all<br>10? 5 10° 5 104 Hz 10°<br>—-~f<br>**----- End of picture text -----**<br>


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Film Capacitors Metallized Polypropylene Film Capacitors (MKP) 

B32320I* B32320I 

## Characteristics curves (Z/ ESR vs freq) 

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Impedance Z versus frequency f ei .<br>(Typical values) sae —<br>1100 V DC<br>KLK2165-F io"! ee<br>zi 10°O ESSS SSISeroEEE ESR Eeepo we<br>5 i+}SSS SS t Lt TTT too pe NUTTT TTT<br>10° “NES ON EH 70 uF NON]<br>LULUESTATE , 30 uF WN<br>5 === 90 uk peeee ——— eee<br>E-FF) 70 pF eo -—aa<br>102 100 pe LACIE NNN ZT LT TTTETTTT<br>5 Ss 150 pr GSSee<br>yo3L_La 10°<br>10? LTT5 10° TT5 TTT104 5 10° Hz 108 402 5 103 5 104 Hz 10°<br>—wf f<br>**----- End of picture text -----**<br>


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Impedance Z versus frequency f<br>(Typical values)<br>1300 V DC<br>**----- End of picture text -----**<br>


ESR versus frequency f (Typical values) 

1300 V DC 

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10° en SSee 10" $55 EEE<br>Q SNES<br>re See eeeSS B32920115 QF SS83232011A EHOS 0<br>iz} 10° SSeSSE esp FOO eee eee<br>5 ESSSes SSS eeit |_|Cat 10066 pF UF HtCN |_|<br>5 i aSN i ee NANT<br>ro [LLU] —SS—a [&5] HEF “VNOLR STSUT Ng TT FeeEe 6.5ORT pF CNRS Searr<br>21 FF “SSeS SSSee rr<br>a yO NAAN ANT |<br>-. tH 10066 peUF “ooV7 VY a ll<br>yosL_LSeTTTTTT 10°a a alll<br>102 =65 10°) ~— 5 10 = 5 108 ~—sz_‘ 108 10? 5 10° 5 10° Hz 10°<br>— =f —~ f<br>**----- End of picture text -----**<br>


CAP FILM I&A AC PD Please read Cautions and warnings and Important notes at the end of this document. 

October 2020 

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B32320I 

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TDK<br>**----- End of picture text -----**<br>


## Metallized Polypropylene Film Capacitors (MKP) 

## Irms derating vs Ta 

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11 KLK2169-J<br>ELETT |<br>pL<br>{ cot LTT TTT<br>yLEL ELAINE<br>oot |} tttTTA<br>os +t ttt tt A<br>ot ett ttt Tt A<br>ot tt EE ET<br>ot tt ttt tt<br>ott ttt ty tT<br>oo40Litt45 50 55 60 65ttt70 75 tt80 °C 90<br>——+T,<br>**----- End of picture text -----**<br>


Maximum Irs Current as function of the ambient temperature: Irms (Ta) = Factor = Irms (60 °C) 

## Service life 

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Life time expectancy-typical curve B32320I (450 V DC / 800 V DC / 1100 V DC / 1300 V DC)<br>1.3 KLK2140-J<br>LU ANN LUI EL<br>7 CMT AT<br>| UME LT El<br>_so TITTATT<br>wel LINNsalina AVI<br>PTTTT MES Yl<br>sol Lf ae atl Nl<br>Lee 7A<br>0808 7 10° h 10%<br>Lifetime expectancy ———><br>**----- End of picture text -----**<br>


Note: Confidence level of 70% 

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## Film Capacitors Metallized Polypropylene Film Capacitors (MKP) 

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B323201*<br>B323201<br>**----- End of picture text -----**<br>


## Testing and standards 

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Test Reference Conditions of test Performance<br>requirements<br>Electrical IEC61071: 2007 Voltage between terminals, Within specified limits<br>oe 1.5 Vr, during 10 s<br>(Routine test) Insulation resistance, Rins at Vr if Vr<br><500 V or 500 V if Vr 2500 V<br>Capacitance, C at 1 kHz<br>(room temperature)<br>Dissipation factor, tan d at 1/10 kHz<br>(room temperature)<br>Robustness of | IEC 60068-2-21: 2006 | Tensile strength (test Ua1) Capacitance and tan 5<br>fenailnalipns Wire diameter Tensile force within specified limits<br>(Type test)<br>0.8 <d1<1.25mm | 20N<br>>1.25mm | 4on<br>Resistance to | IEC 60068-2-20: 2008, | Solder bath temperature at 260 +5 °C, =| |AC/Co| <2%<br>soldering heat | test Tb, immersion for 10 seconds <<br>(Type test) method TW |Atan 9] aianinagl a<br>Rins 250% of initial limit<br>Mechanical:<br>No visible damage<br>Rapid change | IEC 61071: 2007 TA = lower category temperature |AC/Co| <2%<br>of temperature TB = upper category temperature \Atan 8| <0.002:<br>(TypeT testtest) Fivei cycles, durationi t == 30 mini Rine 250% of initial lirnit<br>Mechanical:<br>No visible damage<br>Vibration and IEC 61071: 2007 In accordance with IEC 60068-2-6 Electrical:<br>shocks f = 10 Hz to 55 Hz a = +0.35 mm |AC/Co| s0.5% at 1 kHz<br>(Type test) Test duration per axis = 10 frequency<br>cycles Mechanical:<br>(3 axes offset from each other by 90°), No visible damage<br>1 octave/min.<br>Mounting conditions:<br>The leads shall fix the capacitor and the<br>body must be properly clamped.<br>Climatic IEC 60384-16: 2005 | Dry heat Tb/16h No visible damage<br>(Typeype test)tes Damp°  heat cyclic, 1st cycle |AC/Co| $3%<br>+55 °C / 24h/ 95% ... 100% RH |Atan 5| <0.001<br>Cala reh Rins2 50% of initial limit<br>Damp heat cyclic, 5 cycles<br>+55 °C/ 24h / 95% ... 100% RH<br>**----- End of picture text -----**<br>


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Film Capacitors Metallized Polypropylene Film Capacitors (MKP) 

B32320I* B323201 

|Test|Reference|Conditions of test|Performance|
|---|---|---|---|
||||requirements|
|Damp heat|IEC 60384-16: 2005||TestCa|No visible damage|
|Steady state||40 °C /93% RH /56 days||AC/Co| <5%|
|(Type test)|||\Atan 8] <0.005|
||||Rins250% of initial limit|
|Endurance|IEC 61071: 2007|+85 °C/ 1.3 Vr/500 hours and|No visibledamage|
|(Type test)||1000 discharges at 1.4 Ir and<br>+85 °C / 1.3Vr/500 hours|<39<br>GEA]<br>PP|
|||||Atan 5] 0.015 (10 kHz)|
||||Rins250% of initial limit|
||||Mechanical:|
||||Novisibledamage|



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B323201* B323201 

## Film Capacitors Metallized Polypropylene Film Capacitors (MKP) 

## Cautions and warnings 

- m@ Do not exceed the upper category temperature (UCT). @ Do not apply any mechanical stress to the capacitor terminals. m Avoid any compressive, tensile or flexural stress. 

- m@ Donot move the capacitor after it has been soldered to the PC board. @ Do not pick up the PC board by the soldered capacitor. @ Do not place the capacitor on on a PC board whose PTH hole spacing 

- @ Do not place the capacitor on on a PC board whose PTH hole spacing differs from the specified lead spacing. m@ Do not exceed the specified time or temperature limits during soldering. m Avoid external energy inputs, such as fire or electricity. @ Avoid overload of the capacitors. 

The table below summarizes the safety instructions that must always be observed. A detailed description can be found in the relevant sections of the chapters "General technical information" and "Mounting guidelines". 

|Topic||Safety information|Reference chapter|
|---|---|---|---|
||||"General technical|
||||information"|
|Storage conditions||Make sure that capacitors are stored within the|4.5 "Storage conditions"|
|||specified range of time, temperature and humidity||
|||conditions.||
|Flammability||Avoid external energy, such as fire or electricity|5.3 "Flammability"|
|||(passive flammability), avoid overload ofthe capacitors||
|||(active flammability) and consider the flammability of||
|||materials.||
|Resistance to||Do notexceed the tested ability to withstand vibration.||5.2 "Resistance to vibration"|
|vibration||The capacitors are tested to IEC 60068-2-6.||
|||EPCOS offers film capacitors specially designed for||
|||operation under more severe vibration regimes such||
|||as those found in automotive applications.||
|||Consult our catalog "Film Capacitors forAutomotive||
|||Electronics".||
|Topic||Safety information|Reference chapter|
||||"Mounting guidelines"|
|Soldering||Do not exceed the specified time ortemperature limits|| 1 "Soldering"|
|||during soldering.||
|Cleaning||Use only suitable solvents forcleaning capacitors.|2 "Cleaning"|
|Embedding of||When embedding finished circuit assemblies in plastic||3 "Embedding ofcapacitors in|
|capacitors in<br>re<br>s<br>finished assemblies||resins, chemical and thermal influences must be taken<br>into account.|finished assemblies"|
|||}<br>oo<br>;<br>Caution: Consult us first, ifyou also wish to embed||
|||otheruncoatedcomponenttypes!||



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Film Capacitors Metallized Polypropylene Film Capacitors (MKP) 

B32320I* B323201 

## Soldering 

## Solderability of leads 

## The solderability of terminal leads is tested to IEC 60068-2-20:2008, test Ta, method 1. 

Before a solderability test is carried out, terminals are subjected to accelerated ageing (to IEC 60068-2-2:2007, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature is far higher than the upper category temperature of the capacitors, the terminal wires should be cut off from the capacitor before the ageing procedure to prevent the solderability being impaired by the products of any capacitor decomposition that might occur. 

|Solder bath temperature|235 4+5°C|
|---|---|
|Soldering time|2.00+05s|
|Immersion depth|2.0 +0/0.5 mm from capacitor body or seating plane|
|Evaluation criteria:Visual inspection|Wetting ofwire surface bynew solder >90%, free-|
||flowingsolder|



## Resistance to soldering heat 

Resistance to soldering heat is tested to IEC 60068-2-20:2008, test Tb, method 1. Conditions: 

|Series|Solder bath temperature|Soldering time|
|---|---|---|
|MKT boxed (except 2.5 x 6.5 x 7.2 mm)|260 +5 °C|10+15s|
|coated uncoated (lead spacing >10 mm)|||
|MFP|||
|MKP round can|||
|MKT boxed (case 2.5 x 6.5 x 7.2 mm)||5418S|
|MKP (lead spacing <7.5 mm)||<4 s recommended soldering|
|MKT uncoated (lead spacing <10mm)<br>AMIS<br>Ee ERRISES<br>insulated<br>(<br>)||Proile forMISTMpepated (see<br>spacing < 10mm)and<br>insulated(B32559)|



CAP FILM I&A AC PD Please read Cautions and warnings and Page 14 of 20 Important notes at the end of this document. 

October 2020 

B32320I* B323201 

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Metallized Polypropylene Film Capacitors (MKP)<br>**----- End of picture text -----**<br>


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300 KMK1242-V<br>° | |, “° : °<br>174<br>. 4n0n0<br>0<br>0 50 100 150 200 s 250<br>—»|<br>Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane<br>Shield Heat-absorbing board, (1.5 +0.5) mm thick, between<br>capacitor body and liquid solder<br>Evaluation criteria: Visual inspection No visible damage<br>AC/Co 2% for MKT/MKP/MFP<br>5% for EMI suppression capacitors<br>tans As specified in sectional specification<br>**----- End of picture text -----**<br>


## General notes on soldering 

Permissible heat exposure loads on film capacitors are primarily characterized by the upper category temperature Tmax. Long exposure to temperatures above this type-related temperature limit can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical characteristics. For short exposures (as in practical soldering processes) the heat load (and thus the possible effects on a capacitor) will also depend on other factors like: 

- m Pre-heating temperature and time 

- m Forced cooling immediately after soldering 

- = Terminal characteristics: diameter, length, thermal resistance, special configurations (e.g. crimping) 

- = Height of capacitor above solder bath 

- m Shadowing by neighboring components 

- m= Additional heating due to heat dissipation by neighboring components 

- m Use of solder-resist coatings 

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October 2020 

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B32320I* B323201 

## Film Capacitors Metallized Polypropylene Film Capacitors (MKP) 

The overheating associated with some of these factors can usually be reduced by suitable countermeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced cooling process may possibly have to be included. 

## Recommendations 

As a reference, the recommended wave soldering profile for our film capacitors is as follows: 

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Tenperatire Total contact < 10s<br>°C .<br>26025 Maximum solder<br>-----------}y} temperature<br>Wave soldering profile<br>s<br>T<br>P \fs Capacitor body<br>Pi ‘\ temperature<br>Sig<br>ts s<br>, [o]<br>o* ~ s<br>?<br>¢<br>¢  Pre-heating<br>Time<br>0 < 150 s<br>**----- End of picture text -----**<br>


T,:Capacitor body maximum temperature at wave soldering 

T,: Capacitor body maximum temperature at pre-heating 

KMK1745-A-E 

Body temperature should follow the description below: 

m MKP capacitor — During pre-heating: Tp <110 °C — During soldering: T; <120 °C, t,<45s 

m MKT capacitor 

— During pre-heating: T, <125 °C -— During soldering: T; $160 °C, t,;<45s When SMD components are used together with leaded ones, the film capacitors should not pass into the SMD adhesive curing oven. The leaded components should be assembled after the SMD curing step. 

Leaded film capacitors are not suitable for reflow soldering. 

In order to ensure proper conditions for manual or selective soldering, the body temperature of the capacitor (T;) must be <120 °C. 

One recommended condition for manual soldering is that the tip of the soldering iron should be <360 °C and the soldering contact time should be no longer than 3 seconds. 

CAP FILM I&A AC PD 

October 2020 

Please read Cautions and warnings and Page 16 of 20 Important notes at the end of this document. 

Film Capacitors Metallized Polypropylene Film Capacitors (MKP) 

B323201* B323201 

For uncoated MKT capacitors with lead spacings <10 mm, the following measures are recommended: ™ pre-heating to not more than 110 °C in the preheater phase ™ rapid cooling after soldering 

## Cleaning 

To determine whether the following solvents, often used to remove flux residues and other substances, are suitable for the capacitors described, refer to the table below: 

|Type|Ethanol, isopropanol, n-propanol|n-propanol-water mixtures, water with|
|---|---|---|
|||surface tension-reducing tensides (neutral)|
|MKT|Suitable|Unsuitable|
|(uncoated)|||
|MKT, MKP, MFP||Suitable|
|(coated/boxed)|||



Even when suitable solvents are used, a reversible change of the electrical characteristics may occur in uncoated capacitors immediately after they are washed. Thus it is always recommended to dry the components (e.g. 4 h at 70 °C) before they are subjected to subsequent electrical testing. 

## Caution: 

Consult us first if you wish to use new solvents! 

## Embedding of capacitors in finished assemblies 

In many applications, finished circuit assemblies are embedded in plastic resins. In this case, both chemical and thermal influences of the embedding ("potting") and curing processes must be taken into account. 

Our experience has shown that the following potting materials can be recommended: non-flexible epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum curing temperature of 100 °C. 

Caution: 

Consult us first if you wish to embed uncoated types! 

## Marking 

## Capacitor markings 

Depending on the capacitor size, the markings are positioned either on the side and/or the top of the component. The coded forms specified in IEC 60062:2004 are used to indicate the rated capacitance, capacitance tolerance and date of manufacture. 

The lot number (production batch number) ensures unique identification of a particular capacitor and allows, together with the date of manufacture, exact assignment to the process data of the entire production run (traceability). 

CAP FILM I&A AC PD Please read Cautions and warnings and Page 17 of 20 Important notes at the end of this document. 

October 2020 

B32320I* B323201 

## Film Capacitors Metallized Polypropylene Film Capacitors (MKP) 

## Marking examples 

## Canned capacitors (without EMI suppression capacitors) 

|Style||Marking example||||Marking|
|---|---|---|---|---|---|---|
|MKP_||B32320I|||||Side stamping:|
||||pF|VDC|WW.YYN|Manufacturer's logo, Cr,|
|||||||tolerance, Vr|
|||TDK|+10%<br>B323201||P.ONumber<br>IEC 61071||
||||SH-Noadditional||internalprotection||



## Marking types 

The capacitors may have either an ink-jet marking or a laser marking. The main advantage of laser marking is that it cannot be removed by solvents, which ensures the reliable identification of the capacitor. Moreover, because the laser marking process reduces the amount of chemicals used, it is an environmentally friendly marking solution. 

## Display of ordering codes for TDK Electronics products 

The ordering code for one and the same product can be represented differently in data sheets, data books, other publications, on the company website, or in order-related documents such as shipping notes, order confirmations and product labels. The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products. Detailed information can be found on the Internet under www.tdk-electronics.tdk.com/orderingcodes. 

CAP FILM I&A AC PD 

October 2020 

Please read Cautions and warnings and Important notes at the end of this document. 

Page 18 of 20 

The following applies to all products named in this publication: 

1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule we are either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 

2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 

3. The warnings, cautions and product-specific notes must be observed. 

4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our sales offices. 

5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. 

   - We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 

6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and Conditions of Supply. 

7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only requirements mutually agreed upon can and will be implemented in our Quality Management System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become legally binding if individually agreed upon. 

Page 19 of 20 

## Important notes 

8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap, XieldCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks. 

## Release 2020-06 

Page 20 of 20