B32320I4206K000
Power Film Capacitor, Metallized PP, Can, 20 µF, ± 10%, DC Link, Through Hole
- Manufacturer: TDK
- Product type: Power Film Capacitors
- ESR: 3800µohm
- SVHC: No SVHC (25-Jun-2025)
- Capacitance: 20µF
- Voltage(AC): -
- Voltage(DC): 450V
- Lead Spacing: -
- Peak Current: 400A
- dv/dt Rating: -
- Output (kvar): -
- Product Range: B32320I Series
- Product Width: -
- Qualification: -
- Product Height: 53mm
- Product Length: -
- Ripple Current: -
- Dielectric Type: Metallized PP
- Humidity Rating: -
- Product Diameter: 35mm
- Capacitor Mounting: Through Hole
- RMS Current (Irms): 20A
- Capacitor Terminals: PC Pin
- Typical Applications: DC Link
- Capacitance Tolerance: ± 10%
- Capacitor Case / Package: Can
- Operating Temperature Max: 105°C
- Operating Temperature Min: -40°C
| Delivery and price | |
|---|---|
| Units per pack | 50 |
| Price | 2.36 € |
| Current stock | 50+ |
| Lead time | 30 days |
## **Film Capacitors**
## Metallized Polypropylene Film Capacitors (MKP)
|**Series/Type:**|**B32320I**|
|---|---|
|**Ordering code:**|**B32320I***|
|Date:|October 2020|
|Version:|V1.0|
> TDK Electronics AG 2020. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without TDK Electronics' prior express consent is prohibited.
~~ee~~ **Film Capacitors B32320I* Metallized Polypropylene Film Capacitors (MKP) B32320I**
## **Typical applications**
- Frequency converters
- Inverter based home appliances
- Solar inverters
- Variable speed motor drives
## **Climatic**
- Max. operating temperature: 105 °C (Hotspot)
- Climatic category (IEC 60068-1:2013): 40/085/56
## **Construction**
- Dielectric: Polypropylene (MKP)
- Plastic case (UL 94 V-0)
- Epoxy resin sealing (UL 94 V-0)
## **Features**
- Capacitance values 6.5 up to 260 µF
- High CV product, compact
- Good self-healing properties
- Over-voltage capability
- Low losses with high current capability
- High reliability
- Long useful life
- RoHS-compatible
## **Terminals**
- Parallel wire leads, lead-free tinned
- 5-pin
- Standard lead lengths: 4.5 ±0.5 mm
## **Marking**
Manufacturer's logo and lot number, date code, rated capacitance (coded), capacitance tolerance (code letter) and rated DC voltage
## **Delivery mode**
- Bulk (untaped)
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## ~~eae~~ **Film Capacitors B32320I* Metallized Polypropylene Film Capacitors (MKP) B32320I**
## **Dimensional drawings**
|Number of<br>wires|Lead spacing (P1)<br>mm|Lead pacing (P2)<br>mm|Lead diameter (d1)<br>mm|Lead diameter (d2)<br>mm|Type|
|---|---|---|---|---|---|
|5-pin|12.70.4|22.50.4|1.20.05|2.00.05|B32320I|
|5-pin|160.4|37.50.4|1.20.05|2.00.05||
|5-pin|20.30.4|42.50.4|1.20.05|2.00.05||
## **Dimensional drawings 5-pin version**
**==> picture [36 x 8] intentionally omitted <==**
**----- Start of picture text -----**<br>
KLK2160-A<br>**----- End of picture text -----**<br>
**Note** : 4 × 1.2 mm terminal-electrode (d1) 1 × 2 mm terminal-electrode (d2)
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~~LT~~ **Film Capacitors B32320I* Metallized Polypropylene Film Capacitors (MKP) B32320I**
## **Overview of available types**
|VR (85 ºC)|450 V DC<br>~~a~~|800 V DC|1100 V DC|1300 V DC|
|---|---|---|---|---|
|CR (µF)|~~a~~||||
|6.5|~~ee~~|~~ee~~|~~ee~~||
|9.5<br>~~Se~~|~~ee~~<br>~~ee~~<br>~~Se~~|~~ee~~<br>~~e~~<br>~~Pp~~|~~ee~~<br>~~Pp~~||
|15<br>~~Se~~|~~ee~~<br>~~Se~~|~~e~~<br>~~Pp~~<br>~~ee~~|~~Pp~~<br>~~ee~~||
|20<br>~~Se~~|~~Se~~|~~Pp~~<br>~~ee~~<br>~~ee~~|~~Pp~~<br>~~ee~~<br>~~ee~~||
|21|~~es~~<br>~~ee~~|~~ee~~<br>~~es~~<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~es~~<br>~~ee~~<br>~~ee~~||
|27<br>~~P|~~|~~es~~<br>~~ee~~<br>~~P|~~|~~es~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|~~es~~<br>~~ee~~<br>~~ee~~<br>~~pe~~||
|30<br>~~P|~~|~~ee~~<br>~~P|~~|~~ee~~<br>~~ee~~|~~ee~~<br>~~pe~~||
|50<br>~~P|~~|~~ee~~<br>~~P|~~|~~ee~~<br>~~ee~~|~~ee~~<br>~~pe~~||
|66<br>~~P|~~|~~P|~~<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~<br>~~eee~~|~~pe~~<br>~~ee~~||
|70|~~ee~~<br>~~ee~~|~~ee~~<br>~~eee~~|~~ee~~||
|88|~~ee ~~|~~eee~~<br>~~pO~~|~~O~~||
|100|~~ee~~|~~pO~~<br>~~ee~~|~~O~~||
|100<br>~~Pp~~|~~ee~~<br>~~a~~<br>~~Pp~~|~~ee~~|~~Se~~||
|110<br>~~Pp~~|~~a~~<br>~~Pp~~||~~Se~~||
|150<br>~~Pp~~<br>~~Pp~~|~~Pp~~<br>~~ee~~<br>~~Pp~~|~~e~~<br>~~Pp~~|~~Se~~<br>~~Pp~~||
|150<br>~~Pp~~<br>~~Se~~|~~ee~~<br>~~Pp~~<br>~~Se~~|~~e~~<br>~~Pp~~<br>~~Pp~~|~~Pp~~<br>~~Pp~~||
|200<br>~~Pp~~<br>~~Se~~|~~Pp~~<br>~~Se~~|~~Pp~~<br>~~Pp~~|~~Pp~~<br>~~Pp~~||
|200<br>~~Se~~|~~Se~~|~~Pp~~<br>~~po~~|~~Pp~~<br>~~po~~||
|260||~~po~~<br>~~po~~|~~po~~<br>~~po~~||
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|**Film Capacitors**<br>**B32320I***|
|---|
|**Metallized Polypropylene Film Capacitors (MKP)**<br>**B32320I**|
|**Ordering codes and packing units**|
|CR1) *)<br>Max.<br>dimensions<br>P1/P2<br>Ordering code<br>(composition see<br>below)<br>IRMS, max.2)<br>60 ºC Amb.<br>Îpeak<br>ESRtyp<br>ESLtyp3) tanδ<br>max.<br>Pcs./<br>Pkg.<br>D × H<br>10 kHz<br>10 kHz<br>1 kHz<br>(10-3)<br>µF<br>mm<br>mm<br>ARMS<br>kA<br>m<br>nH<br>~~SRE~~|
|VR,85 °C= 450 V DC|
|*) Intermediate capacitance values are available on request<br>20<br>35 × 53<br>22.5/12.7<br>B32320I4206K000 20<br>0.4<br>3.8<br>30<br>1.0<br>84<br>27<br>35 × 53<br>22.5/12.7<br>B32320I4276K000 20<br>0.54<br>4.0<br>30<br>1.2<br>84<br>88<br>50 × 57<br>37.5/16.0<br>B32320I4886K000 27.6<br>1.75<br>2.4<br>35<br>1.7<br>32<br>200<br>50 × 95<br>37.5/16.0<br>B32320I4207K000 25<br>1.4<br>4.0<br>60<br>5.5<br>32<br>260<br>50 × 120<br>37.5/16.0<br>B32320I4267K000 23<br>1.56<br>5.0<br>75<br>8.0<br>32<br>VR,85 °C= 800 V DC<br>15<br>35 × 53<br>22.5/12.7<br>B32320I8156K000 20<br>0.33<br>3.8<br>30<br>1<br>84<br>50<br>50 × 57<br>37.5/16.0<br>B32320I8506K000 26.5<br>1.1<br>3.2<br>35<br>1.5<br>32<br>110<br>50 × 95<br>37.5/16.0<br>B32320I8117K000 22<br>1.0<br>5.0<br>60<br>4.3<br>32<br>150<br>50 × 120<br>37.5/16.0<br>B32320I8157K000 23<br>1.1<br>5.0<br>75<br>6.15<br>32<br>200<br>60 × 120<br>42.5/20.3<br>B32320I8207K000 27.5<br>1.5<br>3.6<br>75<br>6.15<br>21<br>VR,85 °C= 1100 V DC<br>9.5<br>35 × 53<br>22.5/12.7<br>B32320I0955K000 16.4<br>0.38<br>5.2<br>30<br>1<br>84<br>30<br>50 × 57<br>37.5/16.0<br>B32320I0306K000 22.5<br>1.2<br>4.0<br>35<br>1.2<br>32<br>70<br>50 × 95<br>37.5/16.0<br>B32320I0706K000 23<br>1.4<br>4.7<br>60<br>3.5<br>32<br>100<br>50 × 120<br>37.5/16.0<br>B32320I0107K000 23<br>1.5<br>5.0<br>75<br>4.5<br>32<br>150<br>60 × 120<br>42.5/20.3<br>B32320I0157K000 22.4<br>2.2<br>4.3<br>75<br>5.3<br>21<br>VR,85 °C= 1300 V DC<br>6.5<br>35 × 53<br>22.5/12.7<br>B32320I1655K000 16.4<br>0.39<br>4.9<br>30<br>1.0<br>84<br>21<br>50 × 57<br>37.5/16.0<br>B32320I1216K000 20<br>1.26<br>5.0<br>35<br>1.2<br>32<br>50<br>50 × 95<br>37.5/16.0<br>B32320I1506K000 24<br>1.5<br>4.0<br>60<br>2.4<br>32<br>66<br>50 × 120<br>37.5/16.0<br>B32320I1666K000 23<br>1.65<br>5.0<br>75<br>3.9<br>32<br>100<br>60 × 120<br>42.5/20.3<br>B32320I1107K000 22.4<br>2.5<br>4.3<br>75<br>3.2<br>21<br>~~SSS EEE~~<br>~~SSS EEE~~<br>~~SSS EEE~~<br>~~See aaa~~|
|**Composition of ordering code**|
|+ =<br>Capacitance tolerance code<br>*** =<br>Packing code|
|K = ±10%<br>000 = Untapped (lead length 4.5 mm)|
|Other lead lengths can be made available on request|
…………………
- 1) Capacitance value measured at 1 kHz
> 2) Max ripple current IRMS@60 ºC Amb@10 kHz for a ∆T ≤25 ºC at ∆ESRtyp ≤ ± 5%
- 3) Typical ESL value are calculated out of the resonance frequency (See specific graphs of Z versus frequency)
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~~I~~ **Film Capacitors B32320I* Metallized Polypropylene Film Capacitors (MKP) B32320I**
## **Technical data**
Reference standard: IEC 61071: 2007.
All data given at T=20 ºC, unless otherwise is specified.
|Operating temperature range|Max. operating temperature, THot Spot, max<br>+105 ºC<br>Upper category temperature Tmax.<br>+85 ºC<br>Lower category temperature Tmin.<br>-40 ºC|
|---|---|
|Insulation Resistance RINS, given as<br>time constant= CR• RINS, rel. humidity ≤65%<br>(minimum as-delivered values)|>10 000 s (after 1 min)<br>For VR≥500 V measured at 500 V<br>For VR<500 V measured at VR|
|DC voltage test between terminals (10 s)|1.5 • VR|
|Voltage test terminal to case (10 s)|2110 V AC, 50Hz|
|Reliability:<br>Failure rate<br>Service life tSL|75 fit (≤1 • 10-9) at 0.5 • VR, 40 ºC<br>For conversion to other operating conditions and<br>temperatures, refer to chapter "Quality, 2 Reliability"<br>100 000 h at VR, 70 ºC|
|VR (DC)|450 V<br>800 V<br>1100 V<br>1300 V|
|Continuous operation voltage (Vop) at Topof 85 ºC|450 V<br>800 V<br>1100 V<br>1300 V|
|For temperatures between 85 ºC and 105 ºC|2.5% / ºC of Vopderating compared to Vopat 85 ºC|
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**Film Capacitors Metallized Polypropylene Film Capacitors (MKP)**
**B32320I* B32320I**
## **Restrictions**
**VR** : Maximum operating peak voltage of either polarity but of a non-reversing waveform, for which the capacitor has been designed for continuous operation.
## **ûAC, max** ≤ **0.2 • VR**
|**ûAC, maxAC, max max**≤**0.2 • VRR**|||
|---|---|---|
|**Overvoltage**|**Maximum duration within**<br>**one day**|**Observation**|
|1.1 • VR|30 % of on-load duration|System regulation|
|1.15 • VR|30 min|System regulation|
|1.2 • VR|5 min|System regulation|
|1.3 • VR|1 min|System regulation|
## NOTE 1
An overvoltage equal to 1.5 • VR for 30 ms is permitted 1000 times during the life of the capacitor.
The amplitudes of the overvoltages that may be tolerated without significant reduction in the life time of the capacitor depend on their duration, the number of application and the capacitor temperature.
In addition, these values assume that the overvoltages may appear when the internal temperature of the capacitor is less than 0 °C but within the temperature category.
## NOTE 2
The average applied voltage must not be higher than the specified voltage.
## **Pulse handling capability**
"dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal voltages, expressed in V/ms.
Note:
The values of dV/dt provided below must not be exceeded in order to avoid damaging the capacitor.
## **dV/dt values (available types)**
|Type|B32320I|B32320I|||||||
|---|---|---|---|---|---|---|---|---|
|Capacitors|53||||57||||
|height (mm)|||||||||
|VR(85 ºC)|450|800|1100|1300|450|800|1100|1300|
|dV/dt in V/µs|20|22|40|60|20|22|40|60|
|Capacitors<br>height (mm)<br>95<br>120<br>VR(85 ºC)<br>450<br>800<br>1100<br>1300<br>450<br>800<br>1100<br>1300<br>dV/dt in V/µs<br>8<br>9<br>20<br>30<br>6<br>7.5<br>15<br>25<br>Îpeak(Peak current that can be handled by capacitor) = C(µF) × dV/dt<br>~~ee~~|||||||||
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**Film Capacitors Metallized Polypropylene Film Capacitors (MKP)**
**B32320I* B32320I**
## **Characteristics curves (Z / ESR vs freq)**
**Impedance Z versus frequency f** (Typical values)
## **450 V DC**
## **Impedance Z versus frequency f** (Typical values) **800 V DC**
**ESR versus frequency f** (Typical values)
## **450 V DC**
**ESR versus frequency f** (Typical values)
## **800 V DC**
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**Film Capacitors Metallized Polypropylene Film Capacitors (MKP)**
**B32320I* B32320I**
## **Characteristics curves (Z / ESR vs freq)**
**Impedance Z versus frequency f** (Typical values)
## **1100 V DC**
**Impedance Z versus frequency f** (Typical values)
## **1300 V DC**
**ESR versus frequency f** (Typical values)
## **1100 V DC**
## **ESR versus frequency f** (Typical values) **1300 V DC**
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## ~~ee~~ **Film Capacitors B32320I* Metallized Polypropylene Film Capacitors (MKP) B32320I**
## **IRMS derating vs TA**
Maximum IRMS current as function of the ambient temperature: IRMS (TA) = Factor × IRMS (60 ºC)
## **Service life**
Life time expectancy-typical curve B32320I (450 V DC / 800 V DC / 1100 V DC / 1300 V DC)
**Note** : Confidence level of 70%
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~~LT~~ **Film Capacitors B32320I* Metallized Polypropylene Film Capacitors (MKP) B32320I**
## **Testing and standards**
|**Test**|**Reference**|**Conditions of test**|**Performance**<br>**requirements**|
|---|---|---|---|
|Electrical<br>parameters<br>(Routine test)|IEC61071: 2007<br>~~Pf~~|Voltage between terminals,<br>1.5 VR, during 10 s<br>Insulation resistance, RINSat VRif VR<br><500 V or 500 V if VR≥500 V<br>Capacitance, C at 1 kHz<br>(room temperature)<br>Dissipation factor, tandat 1/10 kHz<br>(room temperature)<br>~~Pf~~|Within specified limits|
|Robustness of<br>terminations<br>(Type test)|IEC 60068-2-21: 2006 Tensile strength (test Ua1)|IEC 60068-2-21: 2006 Tensile strength (test Ua1)<br>Wire diameter<br>Tensile force<br>0.8 <d1 ≤1.25 mm<br>>1.25 mm<br>20 N<br>40 N|Capacitance and tan <br>within specified limits|
|Resistance to<br>soldering heat<br>(Type test)|IEC 60068-2-20: 2008,<br>test Tb,<br>method 1A|Solder bath temperature at 260 ±5 °C,<br>immersion for 10 seconds||∆C/C0| ≤2%<br>|∆tan| ≤0.002<br>RINS≥50% of initial limit<br>Mechanical:<br>No visible damage|
|Rapid change<br>of temperature<br>(Type test)|IEC 61071: 2007|TA = lower category temperature<br>TB = upper category temperature<br>Five cycles, duration t = 30 min||∆C/C0| ≤2%<br>|∆tan| ≤0.002<br>RINS≥50% of initial limit<br>Mechanical:<br>No visible damage|
|Vibration and<br>shocks<br>(Type test)|IEC 61071: 2007|In accordance with IEC 60068-2-6<br>f = 10 Hz to 55 Hz a = ±0.35 mm<br>Test duration per axis = 10 frequency<br>cycles<br>(3 axes offset from each other by 90°),<br>1 octave/min.<br>Mounting conditions:<br>The leads shall fix the capacitor and the<br>body must be properly clamped.|Electrical:<br>|∆C/C0| ≤0.5% at 1 kHz<br>Mechanical:<br>No visible damage|
|Climatic<br>sequence<br>(Type test)|IEC 60384-16: 2005|Dry heat Tb / 16 h<br>Damp heat cyclic, 1st cycle<br>+55 °C / 24 h / 95% ... 100% RH<br>Cold Ta / 2 h<br>Damp heat cyclic, 5 cycles<br>+55 °C / 24h / 95% ... 100% RH|No visible damage<br>|∆C/C0| ≤3%<br>|∆tan| ≤0.001<br>RINS≥ 50% of initial limit|
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## ~~LT~~ **Film Capacitors B32320I* Metallized Polypropylene Film Capacitors (MKP) B32320I**
|**Test**|**Reference**|**Conditions of test**|**Performance**|
|---|---|---|---|
||||**requirements**|
|Damp heat|IEC 60384-16: 2005|Test Ca|No visible damage|
|Steady state||40 °C / 93% RH / 56 days||∆C/C0| ≤5%|
|(Type test)|||I∆tan| ≤0.005|
||||RINS≥50% of initial limit|
|Endurance|IEC 61071: 2007|+85 °C / 1.3 VR/ 500 hours and|No visible damage|
|(Type test)||1000 discharges at 1.4 IRand<br>+85 °C / 1.3 VR/ 500 hours||∆C/C0|≤3%|
|||||∆tan| 0.015 (10 kHz)|
||||RINS≥50% of initial limit|
||||Mechanical:|
||||No visible damage|
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~~[~~ **Film Capacitors B32320I* Metallized Polypropylene Film Capacitors (MKP) B32320I**
## **Cautions and warnings**
- Do not exceed the upper category temperature (UCT).
- Do not apply any mechanical stress to the capacitor terminals.
- Avoid any compressive, tensile or flexural stress.
- Do not move the capacitor after it has been soldered to the PC board.
- Do not pick up the PC board by the soldered capacitor.
- Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified lead spacing.
- Do not exceed the specified time or temperature limits during soldering.
- Avoid external energy inputs, such as fire or electricity.
- Avoid overload of the capacitors.
The table below summarizes the safety instructions that must always be observed. A detailed description can be found in the relevant sections of the chapters "General technical information" and "Mounting guidelines".
|Topic|Safety information|Reference chapter<br>"General technical<br>information"|
|---|---|---|
|Storage conditions|Make sure that capacitors are stored within the<br>specified range of time, temperature and humidity<br>conditions.|4.5 "Storage conditions"|
|Flammability|Avoid external energy, such as fire or electricity<br>(passive flammability), avoid overload of the capacitors<br>(active flammability) and consider the flammability of<br>materials.|5.3 "Flammability"|
|Resistance to<br>vibration|Do not exceed the tested ability to withstand vibration.<br>The capacitors are tested to IEC 60068-2-6.<br>EPCOS offers film capacitors specially designed for<br>operation under more severe vibration regimes such<br>as those found in automotive applications.<br>Consult our catalog "Film Capacitors for Automotive<br>Electronics".|5.2 "Resistance to vibration"|
|Topic|Safety information|Reference chapter<br>"Mounting guidelines"|
|Soldering|Do not exceed the specified time or temperature limits<br>during soldering.<br>~~eo~~|1 "Soldering"|
|Cleaning|Use only suitable solvents for cleaning capacitors.<br>~~OO~~|2 "Cleaning"|
|Embedding of<br>capacitors in<br>finished assemblies|When embedding finished circuit assemblies in plastic<br>resins, chemical and thermal influences must be taken<br>into account.<br>Caution: Consult us first, if you also wish to embed<br>other uncoated component types!|3 "Embedding of capacitors in<br>finished assemblies"|
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~~LT~~ **Film Capacitors B32320I* Metallized Polypropylene Film Capacitors (MKP) B32320I**
## **Soldering**
## **Solderability of leads**
The solderability of terminal leads is tested to IEC 60068-2-20:2008, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to IEC 60068-2-2:2007, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature is far higher than the upper category temperature of the capacitors, the terminal wires should be cut off from the capacitor before the ageing procedure to prevent the solderability being impaired by the products of any capacitor decomposition that might occur.
|Solder bath temperature|235±5°C|
|---|---|
|Soldering time|2.0±0.5 s|
|Immersion depth|2.0 +0/0.5 mm from capacitor body or seating plane|
|Evaluation criteria:Visual inspection|Wetting of wire surface by new solder≥90%, free-<br>flowing solder|
## **Resistance to soldering heat**
Resistance to soldering heat is tested to IEC 60068-2-20:2008, test Tb, method 1. Conditions:
|Series|Solder bath temperature<br>~~-_~~|Soldering time|
|---|---|---|
|MKT boxed (except 2.5×6.5×7.2 mm)<br>coated uncoated (lead spacing >10 mm)|260±5°C<br>~~-_~~|10±1 s|
|MFP<br>MKP round can|||
|MKT boxed (case 2.5×6.5×7.2 mm)||5±1 s|
|MKP (lead spacing≤7.5 mm)<br>MKT uncoated (lead spacing≤10 mm)<br>insulated (B32559)||<4 s recommended soldering<br>profile for MKT uncoated (lead<br>spacing≤10 mm) and<br>insulated (B32559)|
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## ~~LT~~ **Film Capacitors B32320I* Metallized Polypropylene Film Capacitors (MKP) B32320I**
Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane Shield Heat-absorbing board, (1.5 ±0.5) mm thick, between capacitor body and liquid solder Evaluation criteria: Visual inspection No visible damage ΔC/C0 2% for MKT/MKP/MFP 5% for EMI suppression capacitors tan δ As specified in sectional specification
## **General notes on soldering**
Permissible heat exposure loads on film capacitors are primarily characterized by the upper category temperature Tmax. Long exposure to temperatures above this type-related temperature limit can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical characteristics. For short exposures (as in practical soldering processes) the heat load (and thus the possible effects on a capacitor) will also depend on other factors like:
- Pre-heating temperature and time
- Forced cooling immediately after soldering
- Terminal characteristics: diameter, length, thermal resistance, special configurations (e.g. crimping)
- Height of capacitor above solder bath
- Shadowing by neighboring components
- Additional heating due to heat dissipation by neighboring components
- Use of solder-resist coatings
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CAP FILM I&A AC PD
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**Film Capacitors Metallized Polypropylene Film Capacitors (MKP)**
**B32320I* B32320I**
The overheating associated with some of these factors can usually be reduced by suitable countermeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced cooling process may possibly have to be included.
## **Recommendations**
As a reference, the recommended wave soldering profile for our film capacitors is as follows:
Body temperature should follow the description below:
- MKP capacitor
- During pre-heating: Tp ≤110 °C
- During soldering: Ts ≤120 °C, ts ≤45 s
- MKT capacitor
- During pre-heating: Tp ≤125 °C
- During soldering: Ts ≤160 °C, ts ≤45 s
When SMD components are used together with leaded ones, the film capacitors should not pass into the SMD adhesive curing oven. The leaded components should be assembled after the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
In order to ensure proper conditions for manual or selective soldering, the body temperature of the capacitor (Ts) must be ≤120 °C.
One recommended condition for manual soldering is that the tip of the soldering iron should be <360 °C and the soldering contact time should be no longer than 3 seconds.
CAP FILM I&A AC PD
October 2020
Please read _Cautions and warnings_ and _Important notes_ at the end of this document.
Page 16 of 20
~~LT~~ **Film Capacitors B32320I* Metallized Polypropylene Film Capacitors (MKP) B32320I**
For uncoated MKT capacitors with lead spacings ≤10 mm, the following measures are recommended:
- pre-heating to not more than 110 °C in the preheater phase
- rapid cooling after soldering
## **Cleaning**
To determine whether the following solvents, often used to remove flux residues and other substances, are suitable for the capacitors described, refer to the table below:
|Type|Ethanol, isopropanol, n-propanol|n-propanol-water mixtures, water with<br>surface tension-reducing tensides (neutral)|
|---|---|---|
|MKT<br>(uncoated)|Suitable|Unsuitable|
|MKT, MKP, MFP<br>(coated/boxed)||Suitable|
Even when suitable solvents are used, a reversible change of the electrical characteristics may occur in uncoated capacitors immediately after they are washed. Thus it is always recommended to dry the components (e.g. 4 h at 70 °C) before they are subjected to subsequent electrical testing.
## **Caution:**
Consult us first if you wish to use new solvents!
## **Embedding of capacitors in finished assemblies**
In many applications, finished circuit assemblies are embedded in plastic resins. In this case, both chemical and thermal influences of the embedding ("potting") and curing processes must be taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum curing temperature of 100 °C.
## **Caution:**
Consult us first if you wish to embed uncoated types!
## **Marking**
## **Capacitor markings**
Depending on the capacitor size, the markings are positioned either on the side and/or the top of the component. The coded forms specified in IEC 60062:2004 are used to indicate the rated capacitance, capacitance tolerance and date of manufacture.
The lot number (production batch number) ensures unique identification of a particular capacitor and allows, together with the date of manufacture, exact assignment to the process data of the entire production run (traceability).
October 2020
CAP FILM I&A AC PD
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**Film Capacitors Metallized Polypropylene Film Capacitors (MKP)**
**B32320I* B32320I**
## **Marking examples**
## **Canned capacitors (without EMI suppression capacitors)**
|Style|Type|Marking example||||Marking|
|---|---|---|---|---|---|---|
|MKP|B32320I|||||Side stamping:|
||||pF|VDC|=(WW-.YYN|Manufacturer's logo, CR,|
|||||||tolerance, VR|
## **Marking types**
The capacitors may have either an ink-jet marking or a laser marking. The main advantage of laser marking is that it cannot be removed by solvents, which ensures the reliable identification of the capacitor. Moreover, because the laser marking process reduces the amount of chemicals used, it is an environmentally friendly marking solution.
## **Display of ordering codes for TDK Electronics products**
The ordering code for one and the same product can be represented differently in data sheets, data books, other publications, on the company website, or in order-related documents such as shipping notes, order confirmations and product labels. **The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products** . Detailed information can be found on the Internet under www.tdk-electronics.tdk.com/orderingcodes.
October 2020
CAP FILM I&A AC PD
Please read _Cautions and warnings_ and _Important notes_ at the end of this document.
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~~LT~~ **Important notes**
The following applies to all products named in this publication:
1. Some parts of this publication contain **statements about the suitability of our products for certain areas of application** . These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out **that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application.** As a rule we are either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application.
2. We also point out that **in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified.** In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component.
3. **The warnings, cautions and product-specific notes must be observed.**
4. In order to satisfy certain technical requirements, **some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous)** . Useful information on this will be found in our Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, **the products described in this publication may change from time to time** . The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order.
We also **reserve the right to discontinue production and delivery of products** . Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, **all orders are subject to our General Terms and Conditions of Supply.**
7. **Our manufacturing sites serving the automotive business apply the IATF 16949 standard.** The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that **only requirements mutually agreed upon can and will be implemented in our Quality Management System.** For clarification purposes we like to point out that obligations from IATF 16949 shall only become legally binding if individually agreed upon.
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## ~~LT~~ **Important notes**
8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap, XieldCap are **trademarks registered or pending** in Europe and in other countries. Further information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks.
## Release 2020-06
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Updated at June 7, 2026
TDK Corporation is a globally recognized leader in electronic components and magnetic materials. Founded in 1935 to commercialize ferrites, the Tokyo-based company has evolved into a comprehensive manufacturer of high-performance passive components, sensors, and power electronics. TDK’s advanced materials technology serves as the foundation for its extensive portfolio, driving innovation across automotive, industrial, consumer electronics, and communication technologies. Our selection of TDK components heavily features their industry-leading passive components, with a primary focus on magnetics. TDK excels in manufacturing reliable inductive solutions, offering a vast array of power inductors and RF inductors optimized for demanding power management and high-frequency applications. Furthermore, their expertise in electromagnetic compatibility is showcased through a comprehensive range of EMC and RFI suppression products. This includes common mode chokes, power line filters, and specialized shielding materials designed to ensure superior signal integrity in complex designs. Beyond inductors and filtering components, TDK provides robust circuit protection and sensing solutions essential for modern engineering. The portfolio includes precision temperature sensing and compensation NTC thermistors, alongside TVS varistors and inrush current limiting components that safeguard sensitive electronics. Complemented by fixed value inductors, supercapacitors, and charging coils, TDK's versatile product offering delivers the reliability and performance required for sophisticated circuit design.
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