AUIRFS3607
Power MOSFET, N Channel, 75 V, 80 A, 0.00734 ohm, TO-263AB, Surface Mount
- Manufacturer: INFINEON
- Product type: Single MOSFETs
- No. of Pins: 3Pins
- Channel Type: N Channel
- Qualification: AEC-Q101
- Power Dissipation: 140W
- Transistor Mounting: Surface Mount
- Transistor Polarity: N Channel
- Power Dissipation Pd: 140W
- Rds(on) Test Voltage: 10V
- On Resistance Rds(on): 0.00734ohm
- Transistor Case Style: TO-263AB
- Drain Source Voltage Vds: 75V
- Operating Temperature Max: 175°C
- Continuous Drain Current Id: 80A
- Drain Source On State Resistance: 0.00734ohm
- Automotive Qualification Standard: AEC-Q101
- Gate Source Threshold Voltage Max: 2V
| Delivery and price | |
|---|---|
| Units per pack | 1 |
| Price | 0.389 € |
| Current stock | 10+ |
| Lead time | 30 days |
AUIRFS3607 **AUTOMOTIVE GRADE** AUIRFSL3607 ~~pO~~ ## ~~Cinfin eon~~ HEXFET[® ] Power MOSFET ## **Features** - Advanced Process Technology - Low On-Resistance - 175°C Operating Temperature - Fast Switching - Repetitive Avalanche Allowed up to Tjmax - Lead-Free, RoHS Compliant - Automotive Qualified * ## **Description** Specifically designed for Automotive applications, this HEXFET[®] Power MOSFET utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this design are a 175°C junction operating temperature, fast switching speed and improved repetitive avalanche rating . These features combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications **VDSS 75V RDS(on) typ. 7.34m** **max. 9.0m** **ID 80A** ~~=——~~ D D S S G G[D ] D[2] Pak TO-262 AUIRFS3607 AUIRFSL3607 **G D S** Gate Drain Source ~~-—}+}_}—_~~ |reliable device for use in Automotive applications and a wide variety<br>of other applications|reliable device for use in Automotive applications and a wide variety|reliable device for use in Automotive applications and a wide variety<br>Gate<br>~~-—}+}_}—_~~|reliable device for use in Automotive applications and a wide variety<br>Gate<br>~~-—}+}_}—_~~|Gate<br>Drain<br>Source<br>~~-—}+}_}—_~~| |---|---|---|---|---| |**Base part number**|**Package Type**|**Standard Pack**||**Orderable Part Number**| |||**Form**|**Quantity**|| |AUIRFSL3607|TO-262|Tube|50|AUIRFSL3607| |AUIRFS3607|D2-Pak|Tube|50|AUIRFS3607| |||Tape andReel Left|800|AUIRFS3607TRL| ## **Absolute Maximum Ratings** Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified. |**Symbol**<br>**Parameter**<br>**Max.**<br>**Units**<br>ID@ TC= 25°C<br>Continuous Drain Current, VGS@ 10V<br>80<br>A<br>ID @TC= 100°C<br>Continuous Drain Current,VGS @10V<br>56<br>IDM<br>Pulsed Drain Current<br>310<br>PD@TC= 25°C<br>Maximum Power Dissipation<br>140<br>W<br>~~—————~~|| |---|---| |Linear Derating Factor<br>0.96<br>W/°C|| |VGS<br>Gate-to-SourceVoltage<br>± 20<br>V|| |dv/dt<br>Peak Diode Recovery <br>27<br>V/ns|| |EAS<br>Single Pulse Avalanche Energy (ThermallyLimited) <br>120<br>mJ<br>IAR<br>Avalanche Current<br>46<br>A<br>EAR<br>Repetitive Avalanche Energy <br>14<br>mJ<br>TJ<br>Operating Junction and<br>-55 to + 175<br>TSTG<br>Storage Temperature Range<br>°C<br>SolderingTemperature,for 10 seconds(1.6mm from case)<br>300<br>~~—_—_—————~~|| |**Thermal Resistance**|| |**Symbol**<br>**Parameter**<br>**Typ.**<br>**Max.**<br>**Units**<br>RJC<br>Junction-to-Case<br>–––<br>1.045<br>°C/W<br>RJA<br>Junction-to-Ambient(PCB Mount),D2Pak<br>–––<br>40<br>~~—SSL==—~~|| |HEXFET® is a registered trademark of Infineon.|| |1<br>2016-2-12<br>*****Qualification standards can be found atwww.infineon.com<br>~~—_—~~|| AUIRFS/SL3607 ~~LLL~~ ## ~~Cinfin eon~~ |Qg<br>~~ee~~|Total Gate Charge<br>~~es~~|–––<br>~~es~~|56<br>~~es~~|84<br>~~es~~|nC|ID= 46A<br>VDS= 38V<br>VGS= 10V| |---|---|---|---|---|---|---| |g<br>Qgs<br>~~ee~~<br>~~ee~~|Gate-to-Source Charge<br>~~es~~<br>~~es~~|–––<br>~~es~~<br>~~es~~|13<br>~~es~~<br>~~es~~|–––<br>~~es~~<br>~~es~~||| |gs<br>Qgd<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|Gate-to-DrainCharge<br>~~es~~<br>~~es~~<br>~~ee~~|–––<br>~~es~~<br>~~es~~<br>~~ee~~<br>~~es~~|16<br>~~es~~<br>~~es~~<br>~~ee~~<br>~~ee~~|–––<br>~~es~~<br>~~es~~<br>~~ee~~||| |gd<br>Qsync<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|Total Gate Charge Sync.(Qg - Qgd)<br>~~es~~<br>~~ee~~<br>~~rs~~|–––<br>~~es~~<br>~~ee~~<br>~~es~~<br>~~Gs~~|40<br>~~es~~<br>~~ee~~<br>~~ee~~|–––<br>~~es~~<br>~~ee~~||| |RG<br>~~ee~~<br>~~ee~~<br>~~ee~~|Internal Gate Resistance<br>~~ee~~<br>~~rs~~|–––<br>~~ee~~<br>~~es~~<br>~~Gs~~|0.55<br>~~ee~~<br>~~ee~~|–––<br>~~ee~~||| |td(on)<br>~~ee~~<br>~~ee~~<br>~~es~~|Turn-On Delay Time<br>~~rs~~<br>~~es~~|–––<br>~~es ~~<br>~~Gs~~<br>~~es~~|16<br> ~~ee~~<br>~~es~~|–––<br>~~es~~|ns|VDD= 49V<br>ID= 46A<br>RG= 6.8<br>VGS= 10V<br>~~ee~~| |d(on)<br>tr<br>~~ee~~<br>~~es~~|RiseTime<br>~~rs~~<br>~~es~~|–––<br>~~Gs~~<br>~~es~~|110<br>~~es~~|–––<br>~~es~~||| |td(off)<br>~~es~~<br>~~as~~|Turn-Off DelayTime<br>~~es~~<br>~~ee~~|–––<br>~~es~~<br>~~ee~~|43<br>~~es~~<br>~~ee~~|–––<br>~~es~~<br>~~ee~~||| |d(off)<br>tf<br>~~as~~<br>~~ee~~<br>~~**es** en~~|Fall Time<br>~~ee~~<br>~~ee~~<br>~~en~~|–––<br>~~ee~~<br>~~ee~~|96<br>~~ee~~<br>~~ee~~|–––<br>~~ee~~<br>~~ee~~||| |Ciss<br>~~as~~<br>~~ee~~<br>~~**es** en~~<br>~~|~~|Input Capacitance<br>~~ee~~<br>~~ee~~<br>~~en~~<br>~~|~~|–––<br>~~ee~~<br>~~ee~~<br>~~|~~|3070<br>~~ee~~<br>~~ee~~<br>~~|~~|–––<br>~~ee~~<br>~~ee~~<br>~~|~~|pF<br>~~|~~<br>~~res~~|VGS= 0V<br>VDS= 50V<br>ƒ= 1.0MHz, See Fig. 5<br>~~ee~~| |Coss<br>~~ee~~<br>~~**es** en~~<br>~~|~~|Output Capacitance<br>~~ee~~<br>~~en~~<br>~~|~~|–––<br>~~ee~~<br>~~|~~|280<br>~~ee~~<br>~~|~~|–––<br>~~ee~~<br>~~|~~||| |Crss<br>~~**es** en~~<br>~~|~~|Reverse Transfer Capacitance<br>~~en~~<br>~~|~~|–––<br>~~|~~|130<br>~~|~~|–––<br>~~|~~||| |Coss eff.(ER)<br>~~**es** en~~<br>~~|~~<br>~~ee~~|Effective Output Capacitance (Energy Related)<br>~~en~~<br>~~|~~<br>~~es~~|–––<br>~~|~~<br>~~es~~<br>~~ts~~|380<br>~~|~~<br>~~es~~<br>~~ts~~|–––<br>~~|~~<br>~~es~~<br>~~r~~||VGS= 0V, VDS= 0V to 60V<br>~~ee~~| |Coss eff.(TR)<br>~~|~~<br>~~ee~~|Effective Output Capacitance(Time Related)<br>~~|~~<br>~~es~~|–––<br>~~|~~<br>~~es~~<br>~~ts~~|610<br>~~|~~<br>~~es~~<br>~~ts~~|–––<br>~~|~~<br>~~es~~<br>~~r~~||VGS= 0V,VDS= 0V to 60V| |**Diode Characteristics**<br>~~eees~~<br>~~ts ts~~<br>~~res~~||||||| |~~pf~~|**Parameter **<br>~~pf~~|**Min.**|**Typ. M**|**. Max.**|**Units**|**Conditions**| |IS<br>~~J~~|Continuous Source Current<br>(Body Diode)<br>~~J~~|–––<br>~~J~~|–––<br>~~J~~|80<br>~~J~~|A<br>~~J~~|MOSFET symbol<br>showing the<br>integral reverse<br>p-njunctiondiode.| |ISM|Pulsed Source Current<br>(BodyDiode)|–––|–––|310||| |VSD|Diode Forward Voltage|–––|–––|1.3|V|TJ= 25°C,IS= 46A,VGS= 0V| |trr<br>~~a~~|Reverse Recovery Time<br>~~a~~|–––<br>~~a~~|33<br>~~a~~|50<br>~~a~~|ns<br>~~a~~|TJ =25°CVDD= 64V<br>TJ =125°CIF= 46A,<br>TJ =25°Cdi/dt = 100A/µs<br>TJ =125°C <br>TJ= 25°C| |||–––<br>~~a~~|39<br>~~a~~|59<br>~~a~~||| |Qrr<br>~~a~~<br>~~a eee~~<br>~~es~~|Reverse Recovery Charge<br>~~a~~<br>~~eee~~<br>~~es~~|–––<br>~~a~~<br>~~eee~~|32<br>~~a~~<br>~~eee~~|48<br>~~a~~<br>~~eee~~|nC<br>~~a~~<br>~~eee~~<br>~~es~~|| |||–––<br>~~a~~<br>~~eee~~<br>~~es~~<br>~~rs~~|47<br>~~a~~<br>~~eee~~<br>~~es~~<br>~~ss~~|71<br>~~a~~<br>~~eee~~<br>~~es~~<br>~~ss~~||| |IRRM<br>~~a eee~~<br>~~es~~|ReverseRecovery Current<br>~~eee~~<br>~~es~~|–––<br>~~eee~~<br>~~es~~<br>~~rs~~|1.9<br>~~eee~~<br>~~es~~<br>~~ss~~|–––<br>~~eee~~<br>~~es~~<br>~~ss~~|A<br>~~eee~~<br>~~es~~|| |ton<br>~~es~~|Forward Turn-On Time<br>~~es~~|Intrinsic turn-on time is negligible(turn-on is dominated byLS+LD)<br>~~es~~<br>~~rs ss~~||||| **Notes:** Repetitive rating; pulse width limited by max. junction temperature. Limited by TJmax, starting TJ = 25°C, L = 0.12mH, RG = 25, IAS = 46A, VGS =10V. Part not recommended for use above this value. ISD 46A, di/dt 1920A/µs, VDD V(BR)DSS, TJ 175°C. Pulse width 400µs; duty cycle 2%. Coss eff. (TR) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS. Coss eff. (ER) is a fixed capacitance that gives the same energy as Coss while VDS is rising from 0 to 80% VDSS. When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to application note #AN-994 - R is measured at TJ approximately 90°C. 2 2016-2-12 AUIRFS/SL3607 ~~Ll~~ ## ~~Cinfineon~~ **==> picture [503 x 672] intentionally omitted <==** **----- Start of picture text -----**<br> 1000<br>1000<br>VGS<br>VGS<br>TOP 15V<br>TOP 15V<br>10V<br>10V<br>8.0V<br>8.0V<br>6.0V<br>6.0V<br>5.5V<br>5.5V<br>5.0V<br>5.0V<br>100 4.8V 4.8V<br>BOTTOM 4.5V<br>BOTTOM 4.5V<br>100 tel<br>4.5V<br>10 4.5V<br> 60µs PULSE WIDTH<br>60µs PULSE WIDTH<br>Tj = 175°C<br>Tj = 25°C<br>1 10<br>0.1 1 10 100 0.1 1 10 100<br>ci /<br>VDS, Drain-to-Source Voltage (V)<br>VDS, Drain-to-Source Voltage (V)<br>Fig. 1 Typical Output Characteristics Fig. 2 Typical Output Characteristics<br>1000 3.0<br>ID = 80A<br>VGS = 10V<br>C 2.5 TT<br>100<br>2.0<br>10 He TJ = 175°C T J = 25°C uta<br>1.5<br>1 HH at<br>1.0<br>| VDS = 25V THAT<br>60µs PULSE WIDTH<br>0.1 | 0.5 etna<br>2 3 4 5 6 7 8 -60 -40 -20 0 20 40 60 80 100 120 140 160 180<br>VGS, Gate-to-Source Voltage (V) TJ , Junction Temperature (°C)<br>Fig. 3 Typical Transfer Characteristics Fig. 4 Normalized On-Resistance vs. Temperature<br>100000 12.0<br>VGS = 0V, f = 1 MHZ ID= 46A<br>Ciss = Cgs + Cgd, Cds SHORTED<br>C rss = C gd 10.0 VDS= 60V<br>Coss = Cds + Cgd VDS= 38V<br>10000 LtPn eee el 8.0 |FY| | VDS= 15V Sp |<br>Ciss 6.0<br>Coss<br>1000 ctl 4.0 aany/An<br>Crss<br>TST 2.0 vane<br>100 Pee 0.0 AEE<br>1 10 100 0 10 20 30 40 50 60<br>VDS, Drain-to-Source Voltage (V)<br> QG, Total Gate Charge (nC)<br>C, Capacitance (pF)<br>RDS(on) , Drain-to-Source On Resistance (Normalized)<br>ID, Drain-to-Source Current (A)<br>ID, Drain-to-Source Current (A)<br>ID, Drain-to-Source Current (A)<br>VGS, Gate-to-Source Voltage (V)<br>**----- End of picture text -----**<br> **Fig. 4** Normalized On-Resistance vs. Temperature **Fig 5.** Typical Capacitance vs. Drain-to-Source Voltage **Fig 6.** Typical Gate Charge vs. Gate-to-Source Voltage 3 2016-2-12 AUIRFS/SL3607 ~~LLL~~ ## ~~Cinfineon~~ **==> picture [209 x 670] intentionally omitted <==** **----- Start of picture text -----**<br> 1000<br>100<br>TJ = 175°C<br>10 aa<br>TJ = 25°C<br>1<br>VGS = 0V<br>0.1<br>0.0 0.5 1.0 1.5 2.0<br>VSD, Source-to-Drain Voltage (V)<br>Fig. 7 Typical Source-to-Drain Diode<br> Forward Voltage<br>80<br>70<br>PT TT<br>60<br>PEN<br>50<br>TNO<br>40 a<br>30 Pf<br>20<br>10 PL PLNAT<br>0<br>TTT<br>25 50 75 100 125 150 175<br> TC , Case Temperature (°C)<br>Maximum Drain Current vs. Case Temperature<br>1.20<br>1.00<br>0.80<br>0.60<br>0.40<br>0.20<br>0.00 ae<br>-10 0 10 20 30 40 50 60 70 80<br>VDS, Drain-to-Source Voltage (V)<br>ID, Drain Current (A)<br>ISD, Reverse Drain Current (A)<br>Energy (µJ)<br>**----- End of picture text -----**<br> **Fg 9.** Maximum Drain Current vs. Case Temperature **Fig 11.** Typical COSS Stored Energy **==> picture [205 x 672] intentionally omitted <==** **----- Start of picture text -----**<br> 1000<br>OPERATION IN THIS AREA<br>LIMITED BY R DS(on)<br>100 ve,mo 100µsec<br>1msec<br>pet<br>10msec<br>10<br>Tc = 25°C<br>Tj = 175°C<br>Single Pulse DC<br>1<br>1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>Fig 8. Maximum Safe Operating Area<br>100<br>Id = 5mA<br>95<br>Pee nnananaD<br>90 Ta<br>4<br>85<br>tTAt<br>80<br>75<br>CEETie<br>70<br>-60 PULTE -40 -20 0 20 40 EET 60 80 100 120 140160 180<br>TJ , Temperature ( °C )<br>Fig 10. Drain-to-Source Breakdown Voltage<br>500<br>450 NEG ID<br>TOP 5.6A<br>400 VY [ETT] 11A<br>BOTTOM 46A<br>350<br>NEEERNE<br>300<br>250 PLING TET<br>NON<br>200<br>150 PINE NET EET<br>100 mTNING<br>50 P| |<br>EEE EE<br>0 Pi TTPERTT ESN [TSS]<br>25 50 75 100 125 150 175<br>Starting TJ , Junction Temperature (°C)<br>EAS , Single Pulse Avalanche Energy (mJ)<br>V(BR)DSS, Drain-to-Source Breakdown Voltage (V)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br> **Fig 8.** Maximum Safe Operating Area **Fig 10.** Drain-to-Source Breakdown Voltage **Fig 12.** Maximum Avalanche Energy vs. Drain Current 2016-2-12 4 ~~Cinfineon~~ AUIRFS/SL3607 ~~LLL~~ **==> picture [437 x 443] intentionally omitted <==** **----- Start of picture text -----**<br> 10.00<br>1.00<br>D = 0.50<br>0.20 Ri ( ° C/W) i (sec)<br>0.10 BE 0.10 0.05 J J RT R1 R1 R2 R2 R3 R3 R4R 4 CC 0 0.26925 .01109 0 0.000130 .000003<br>0.02 1 1 2 2 3 3 4 4 0.49731 0.001301<br>0.01 Ci= iRi<br>0.01 ei Ci= iRi 0.26766 0.008693<br>Notes:<br>SINGLE PULSE<br>1. Duty Factor D = t1/t2<br>( THERMAL RESPONSE )<br>2. Peak Tj = P dm x Zthjc + Tc<br>ae<br>0.00<br>1E-006 1E-005 0.0001 0.001 0.01 0.1<br>t1 , Rectangular Pulse Duration (sec)<br>Fig 13. Maximum Effective Transient Thermal Impedance, Junction-to-Case<br>1000<br>Duty Cycle = Single Pulse<br>Allowed avalanche Current vs avalanche<br>100 pulsewidth, tav, assuming Tj = 150°C and<br>Tstart =25°C (Single Pulse)<br>coe CC<br>0.01<br>ETS ll<br>10 0.05<br>0.10<br>1 pSeBegSsAU iivavie ees lifTo<br>Allowed avalanche Current vs avalanche<br>pulsewidth, tav, assuming j = 25°C and<br>Tstart = 150°C.<br>Ss<br>0.1<br>ee<br>1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01<br>tav (sec)<br> thJC ) °C/W<br>Thermal Response ( Z<br>Avalanche Current (A)<br>**----- End of picture text -----**<br> **Fig 14.** Avalanche Current vs. Pulse width **==> picture [204 x 195] intentionally omitted <==** **----- Start of picture text -----**<br> 150<br>TOP Single Pulse<br>BOTTOM 1.0% Duty Cycle<br>125 I D = 46A<br>100<br>75<br>INN<br>50<br>NNO<br>25<br>LINN IEE<br>OUTTA<br>0<br>25 50 75 100 125 150 175<br>Starting TJ , Junction Temperature (°C)<br>EAR , Avalanche Energy (mJ)<br>**----- End of picture text -----**<br> ## **Notes on Repetitive Avalanche Curves , Figures 14, 15:** **(For further info, see AN-1005 at www.infineon.com)** 1. Avalanche failures assumption: - Purely a thermal phenomenon and failure occurs at a temperature far in - excess of Tjmax. This is validated for every part type. 2. Safe operation in Avalanche is allowed as long as Tjmax is not exceeded. 3. Equation below based on circuit and waveforms shown in Figures 18a, 18b. 4. PD (ave) = Average power dissipation per single avalanche pulse. 5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase during avalanche). 6. Iav = Allowable avalanche current. 7. T = Allowable rise in junction temperature, not to exceed Tjmax (assumed as 25°C in Figure 13, 14). - tav = Average time in avalanche. - D = Duty cycle in avalanche = tav ·f - ZthJC(D, tav) = Transient thermal resistance, see Figures 13) **PD (ave) = 1/2 ( 1.3·BV·Iav) =** **T/ ZthJC Iav = 2** **T/ [1.3·BV·Zth]** **EAS (AR) = PD (ave)·tav** **Fig 15.** Maximum Avalanche Energy vs. Temperature 2016-2-12 5 **==> picture [558 x 242] intentionally omitted <==** **----- Start of picture text -----**<br> AUIRFS/SL3607<br>G —oeeo nn<br>4.5 20<br>IF = 31A<br>4.0 VR = 64V<br>TOT 15 T J = 25°C Py<br>3.5 Pf PP EN TT TT TJ = 125°C de<br>3.0<br>SSSR dh<br>10<br>2.5 ID = 100µA<br>ID = 250µA BNNGEEE a<br>2.0 ID = 1.0mA PRACT 5 EEaae<br>ID = 1.0A<br>1.5<br>1.0 SEEPC A NEN 0 cannn<br>-75 -50 -25 0 25 50 75 100 125 150 175 200 0 200 400 600 800 1000<br>TJ , Temperature ( °C ) diF /dt (A/µs)<br>VGS(th), Gate Threshold Voltage (V)<br>IRR (A)<br>**----- End of picture text -----**<br> **Fig 16.** Threshold Voltage vs. Temperature **Fig. 17** - Typical Recovery Current vs. dif/dt **==> picture [205 x 196] intentionally omitted <==** **----- Start of picture text -----**<br> 20<br>IF = 46A<br>VR = 64V<br>15 T J = 25°C Te:<br>TJ = 125°C<br>ee<br>10<br>oO<br>TPT<br>5<br>Eanan<br>0<br>0 200 400 600 800 1000<br>diF /dt (A/µs)<br>IRR (A)<br>**----- End of picture text -----**<br> **==> picture [207 x 196] intentionally omitted <==** **----- Start of picture text -----**<br> 560<br>IF = 31A<br>480 V R = 64V<br>TJ = 25°C E<br>mary<br>400 T J = 125°C<br>320<br>mez<br>240<br>ns<br>eee<br>160<br>ae<br>80<br>0 anee<br>0 200 400 600 800 1000<br>diF /dt (A/µs)<br>QRR (nC)<br>**----- End of picture text -----**<br> **Fig. 18** - Typical Recovery Current vs. dif/dt **Fig. 19** - Typical Stored Charge vs. dif/dt **==> picture [207 x 196] intentionally omitted <==** **----- Start of picture text -----**<br> 560<br>IF = 46A<br>“TT:<br>480 V R = 64V<br>TJ = 25°C<br>TT<br>400 T J = 125°C 7<br>320<br>ee<br>240<br>TT<br>160<br>80<br>eT<br>Eamae<br>0<br>0 200 400 600 800 1000<br>diF /dt (A/µs)<br>QRR (nC)<br>**----- End of picture text -----**<br> **Fig. 20** - Typical Stored Charge vs. dif/dt 6 2016-2-12 ~~Cinfir~~ AUIRFS/SL3607 ~~a~~ **Fig 21.** Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET® Power MOSFETs **==> picture [175 x 108] intentionally omitted <==** **----- Start of picture text -----**<br> 15V<br>L DRIVER<br>VDS<br>R G D.U.T +<br>- [V][DD]<br>20V JL IAS<br>ae tp Y 0.01<br>**----- End of picture text -----**<br> **Fig 22a.** Unclamped Inductive Test Circuit **==> picture [112 x 26] intentionally omitted <==** **----- Start of picture text -----**<br> V(BR)DSS<br>tp ><br>**----- End of picture text -----**<br> **==> picture [18 x 9] intentionally omitted <==** **----- Start of picture text -----**<br> IAS<br>**----- End of picture text -----**<br> **Fig 22b.** Unclamped Inductive Waveforms **Fig 23a.** Switching Time Test Circuit **Fig 23b.** Switching Time Waveforms **==> picture [188 x 128] intentionally omitted <==** **----- Start of picture text -----**<br> Id<br>Vds :<br>Vgs<br>'i<br>!<br>'|<br>Vgs(th) !t<br>!t<br>Qgs1 Qgs2 Qgd Qgodr<br>**----- End of picture text -----**<br> **Fig 24a.** Gate Charge Test Circuit **Fig 24b.** Gate Charge Waveform 2016-2-12 7 AUIRFS/SL3607 ~~LLL~~ ## ~~Cinfin eon~~ **D[2] Pak (TO-263AB) Package Outline** (Dimensions are shown in millimeters (inches)) ## **D[2] Pak (TO-263AB) Part Marking Information** **==> picture [331 x 148] intentionally omitted <==** **----- Start of picture text -----**<br> Part Number AUFS3607<br>Date Code<br>IR Logo T é4R YWWA Y= Year<br>WW= Work Week<br><br>XX XX<br>[|<br>Lot Code<br>**----- End of picture text -----**<br> Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 8 2016-2-12 AUIRFS/SL3607 ~~LLL~~ ## ~~Cinfineon~~ **TO-262 Package Outline** (Dimensions are shown in millimeters (inches) ## **TO-262 Part Marking Information** **==> picture [331 x 148] intentionally omitted <==** **----- Start of picture text -----**<br> Part Number AUFSL3607<br>Date Code<br>IR Logo T é4R YWWA Y= Year<br>WW= Work Week<br><br>XX XX<br>[|<br>Lot Code<br>**----- End of picture text -----**<br> Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 9 2016-2-12 ~~Cinfineon~~ AUIRFS/SL3607 ~~LLL~~ ## **D[2] Pak (TO-263AB) Tape & Reel Information** (Dimensions are shown in millimeters (inches)) **==> picture [386 x 164] intentionally omitted <==** **----- Start of picture text -----**<br> TRR<br>1.60 (.063)<br>1.50 (.059)<br>1.60 (.063)<br>4.10 (.161)<br>3.90 (.153) 1.50 (.059) 0.368 (.0145)<br>0.342 (.0135)<br>FEED DIRECTION 1.85 (.073) 11.60 (.457)<br>1.65 (.065) 11.40 (.449) 24.30 (.957)<br>15.42 (.609)<br>23.90 (.941)<br>15.22 (.601)<br>TRL<br>1.75 (.069)<br>10.90 (.429) 1.25 (.049)<br>10.70 (.421) 4.72 (.136)<br>16.10 (.634) 4.52 (.178)<br>15.90 (.626)<br>**----- End of picture text -----**<br> **==> picture [71 x 7] intentionally omitted <==** **----- Start of picture text -----**<br> FEED DIRECTION<br>**----- End of picture text -----**<br> **==> picture [376 x 188] intentionally omitted <==** **----- Start of picture text -----**<br> 13.50 (.532) 27.40 (1.079)<br>12.80 (.504) 23.90 (.941)<br>4<br>330.00 60.00 (2.362)<br>(14.173) MIN.<br> MAX.<br>30.40 (1.197)<br>NOTES : MAX.<br>1. COMFORMS TO EIA-418.<br>26.40 (1.039) 4<br>2. CONTROLLING DIMENSION: MILLIMETER. 24.40 (.961)<br>3. DIMENSION MEASURED @ HUB. 3<br>**----- End of picture text -----**<br> 4. INCLUDES FLANGE DISTORTION @ OUTER EDGE. Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 10 2016-2-12 ~~ie~~ AUIRFS/SL3607 ~~&»«=«=»™§F5F eed~~ ## **Qualification Information** |**Qualification Information**|**Qualification Information**||| |---|---|---|---| |**Qualification Level**||Automotive<br>(per AEC-Q101)|| |||Comments: This part number(s) passed Automotive qualification. Infineon’s<br>Industrial and Consumer qualification level is granted by extension of the higher<br>Automotive level.|| |**Moisture Sensitivity Level**||D2-Pak|MSL1| |||TO-262|| |**ESD**|Machine Model|Class M4 (+/- 600V)† <br>AEC-Q101-002|| ||Human Body Model|Class H1C (+/- 2000V)† <br>AEC-Q101-001|| ||Charged Device Model|Class C5 (+/- 2000V)† <br>AEC-Q101-005|| |**RoHS Compliant**||Yes|| - Highest passing voltage. ## **Revision History** |**Date**|**Comments**| |---|---| |10/27/2015|<br>Updated datasheet with corporate template<br><br>Corrected orderingtable onpage 1.| |02/12/2016|<br>Corrected Fig.6 label from VDS=24V & 15V to VDS= 60V,38V,15V-on page 3.| **Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2015 All Rights Reserved.** ## **IMPORTANT NOTICE** The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office (www.infineon.com). ## **WARNINGS** Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 11 2016-2-12
Updated at February 9, 2023
Infineon Technologies is a globally recognized leader in semiconductor solutions, renowned for driving innovation in power management, energy efficiency, and modern mobility. With a strong legacy of engineering excellence, the company provides highly reliable components designed to meet the rigorous demands of industrial, automotive, and advanced commercial applications. The core of our Infineon portfolio is centered on their industry-leading discrete semiconductors. We offer an extensive selection of single and dual MOSFETs, alongside a robust range of single IGBTs and advanced IGBT modules. These flagship power transistors are essential for high-efficiency power conversion and motor control, providing engineers with superior thermal performance and minimized switching losses. Beyond advanced field-effect transistors, the selection includes a comprehensive array of diodes and rectifiers, heavily featuring Schottky diodes, as well as fast-recovery and RF/PIN diodes. This power foundation is further supported by bipolar transistors, intelligent power modules, and thyristor SCR modules, delivering the critical building blocks required for complex power system designs. To support broader system integration, the portfolio also encompasses specialized solutions such as solid-state relays, AC/DC LED driver ICs, and Bluetooth communications modules. From high-power industrial rectifiers to wireless connectivity adapters, Infineon equips designers with the precision components needed to build efficient, scalable, and fully connected electronic systems.
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