ATSAMW25H18-MR210PB1961

**ATSAMW25-MR210PB** 

## **IEEE 802.11 b/g/n SmartConnect Wi-Fi Module** 

## **DATASHEET** 

## **Description** 

The Atmel[® ] | SMART SAMW25 module is based on the industry-leading lowpower 2.4GHz IEEE[® ] 802.11 b/g/n Wi-Fi[® ] ATWINC1500 SoC (System on Chip) combined with the ARM[® ] Cortex[®] -M0+ based microcontroller technology from Atmel. 

This turnkey system provides an integrated software solution with application and security protocols such as TLS and integrated network services (TCP/IP stack) which are all available through Atmel Studio 6 integrated development environment (IDE). The Atmel SmartConnect modules offer the ideal solutions for designers seeking to add Wi-Fi connectivity with minimal previous experience in 802.11, IP Stack, or RF. Atmel SmartConnect Wi-Fi opens the door of the Internet of Things (IoT) to the vast array of battery-powered devices and applications requiring the integration of WLAN connectivity without compromising on cost or power consumption. While we compete with other Wi-Fi modules on size, RF performance, cost, and other characteristics, the Atmel SmartConnect product family has a distinctive advantage when it comes to power consumption and power saving modes. The ATSAMW25 device is a standalone end point, where a complete small application can be executed on the module by itself. 

## **Features** 

Key features with SAMW25 Wireless connectivity solution: 

- Certified Wi-Fi ATWINC1500B-MU-T with SAMD21 MCU 

- IEEE 802.11 b/g/n 20MHz (1x1) solution 

- Single spatial stream in 2.4GHz ISM band 

- Compact footprint: 33.863 x 14.882mm 

- Radio: 

   - Output power - 802.11b /11Mbps: 17dBm ±1dB 

   - 802.11g /54Mbps: 16dBm ±1dB @ EVM -28dB 

   - 802.11n /72Mbps: 14dBm ±1dB @ EVM -30dB 

- Application processor: 

   - Atmel SAM D21 ARM Cortex M0+ based microcontroller 

   - 256KB embedded Flash and 32KB SRAM 

   - Full-Speed USB Device and embedded Host 

Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 

- CryptoAuthentication™ ATECC508 (optional) I/O operating voltage: 2.7 to 3.6V 

- Power Amplifier and On-board Switching Regulator operating voltage: 2.7 to 4.3V 

- Power states supported: – Provision (AP/Sniffer) IDLE LISTEN 

   - IDLE 

   - SUSPEND 

- Extreme low-power, on-chip low-power sleep oscillator 

- Serial Host Interface SPI or UART 

- Software Upgrade Over-the-Air (OTA) 

- FCC, CE, IC, and TELEC Certified; RoHS compliant 

- Security protocols; WPA/WPA2 Personal, TLS, and SSL 

- Network services; DHCP, DNS, TCP/IP (IPv4), UDP, HTTP, and HTTPS 

## **Target Applications** 

- IoT applications 

- Smart appliances 

- Multimedia streaming 

- Safety and security 

- Home automation 

- Consumer electronics 

- Industrial automation 

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 

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## **Table of Contents** 

|**1**|**Block Diagram ............................................................................................................... 4**|**Block Diagram ............................................................................................................... 4**|
|---|---|---|
|**2**|**Ordering Information and IC Marking ........................................................................... 4**||
|**3**|**Pinout and Package Information .................................................................................. 5**||
||3.1|Pin Description ........................................................................................................................................ 5|
||3.2|Package Description ............................................................................................................................... 8|
|**4**|**Electrical Specifications ................................................................................................ 9**||
||4.1|Absolute Ratings ..................................................................................................................................... 9|
||4.2|Recommended Operating Conditions ................................................................................................... 10|
||4.3|DC Electrical Characteristics ................................................................................................................. 10|
|**5**|**Application and Core Subsystems ............................................................................. 11**||
||5.1|Host Processor ...................................................................................................................................... 11|
|||5.1.1<br>Host MCU Description .............................................................................................................. 11|
|||5.1.2<br>Host MCU Key Features ........................................................................................................... 11|
||5.2|Wi-Fi Core Processor ............................................................................................................................ 11|
|||5.2.1<br>Memory Subsystem .................................................................................................................. 12|
|||5.2.2<br>Non-volatile Memory (eFuse).................................................................................................... 12|
|**6**|**WLAN Subsystem ........................................................................................................ 13**||
||6.1|MAC<br>................................................................................................................................................. 13|
|||6.1.1<br>Features ................................................................................................................................... 13|
|||6.1.2<br>Description ................................................................................................................................ 13|
||6.2|PHY<br>................................................................................................................................................. 14|
|||6.2.1<br>Features ................................................................................................................................... 14|
|||6.2.2<br>Description ................................................................................................................................ 14|
||6.3|Radio  ................................................................................................................................................. 14|
|||6.3.1<br>Receiver Performance .............................................................................................................. 14|
|||6.3.2<br>Transmitter Performance .......................................................................................................... 16|
|**7**|**Recommended Reflow Profile .................................................................................... 17**||
|**8**|**Module Schematic ....................................................................................................... 18**||
|**9**|**Bill of Materials (BOM)................................................................................................. 20**|**Bill of Materials (BOM)................................................................................................. 20**|
|**10**|**Application Schematic ................................................................................................ 21**||
|**11**|**Design Guidelines ....................................................................................................... 22**||
|**12**|**Reference Documentation and Support ..................................................................... 23**||
||12.1|Reference Documents ........................................................................................................................... 23|
||12.2|Related Documents ............................................................................................................................... 23|
|**13**|**Revision History .......................................................................................................... 24**||



Atmel 

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] 

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Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 

## **1 Block Diagram** 

**Figure 1-1. ATSAMW25 Block Diagram** 

## **2 Ordering Information and IC Marking** 

**Table 2-1. Ordering Details** 

|**Atmel ordering code**|**Package**|
|---|---|
|ATSAMW25-MR210PB|ATWINC1500 + SAM D21 module. Tray Packing.|
|ATSAMW25-MR510PA|ATWINC1500 + SAM D21 + ATECC508 module. Tray Packing.|
|ATSAMW25-XPRO|Xplained board evaluation kit|



ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] 

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Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 

## **3 Pinout and Package Information** 

## **3.1 Pin Description** 

**Figure 3-1. Pin Assignment** 

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 

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**Table 3-1. Pin Description** 

|**Pin #**|**Pin description**|**I/O type**|**Function (default)**|**Programmable**<br>**pull-up/-down**<br>**resistor**|
|---|---|---|---|---|
|1|GND|N/A|Common ground||
|2<br>~~———a~~|UART_TxD<br>~~———a~~|ATWINC1500 output<br>~~———a~~|Currently used only for Atmel de-<br>bug. Not for customer use. Leave<br>unconnected.<br>~~———a~~|Yes – pull-up<br>~~———a~~|
|3<br>~~———a~~|UART_RxD<br>~~———a~~|ATWINC1500 input<br>~~———a~~|Currently used only for Atmel de-<br>bug. Not for customer use. Leave<br>unconnected.<br>~~———a~~|Yes – pull-up<br>~~———a~~|
|4|Wi-Fi Chip_En|ATWINC1500 input|Currently used only for Atmel de-<br>bug. Not for customer use. Leave<br>unconnected.|No|
|5|Wi-Fi GPIO_1/RTC|ATWINC1500 I/O|ATWINC1500 General purpose I/O.<br>Can also be used to input a<br>32.768KHz Real Time Clock for ac-<br>curate timing of Wi-Fi sleep intervals|Yes – pull-up|
|6|Wi-Fi GPIO_3|-|ATWINC1500 General purpose I/O|Yes – pull-up|
|7<br>~~————~~|VBAT<br>~~————~~|Power<br>~~————~~|Supply for Wi-Fi RF Power Amplifier<br>and Internal 1.3V Switching Regula-<br>tor<br>~~————~~||
|8<br>~~————~~|PA16<br>~~————~~|SeeSAM D21G datasheet<br>~~————~~|SeeSAM D21G datasheet<br>~~————~~|Yes|
|9<br>~~————~~|PA17<br>~~————~~|SeeSAM D21G datasheet<br>~~————~~|SeeSAM D21G datasheet<br>~~————~~|Yes|
|10<br>~~————~~|GND<br>~~————~~|Power<br>~~————~~|Ground<br>~~————~~||
|11<br>~~————~~|PA18<br>~~————~~|SeeSAM D21G datasheet<br>~~————~~|SeeSAM D21G datasheet<br>~~————~~|Yes|
|12|PA19|SeeSAM D21G datasheet|SeeSAM D21G datasheet|Yes|
|13|PA20|SeeSAM D21G datasheet|SeeSAM D21G datasheet|Yes|
|14|PA21|SeeSAM D21G datasheet|SeeSAM D21G datasheet|Yes|
|15|PA22|SeeSAM D21G datasheet|SeeSAM D21G datasheet|Yes|
|16|PA23|SeeSAM D21G datasheet|SeeSAM D21G datasheet|Yes|
|17|GND|Power|Ground||
|18|PA24/USB_DM|SeeSAM D21G datasheet|Host Interface USB Data minus pin|Yes|
|19|PA25/USB_DP|SeeSAM D21G datasheet|Host Interface USB Data Plus pin|Yes|
|20|GND|Power|Ground||
|21|VCC|Power|Power supply for I/O||
|22|PB22|SeeSAM D21G datasheet|SeeSAM D21G datasheet|Yes|
|23|PB23|SeeSAM D21G datasheet|SeeSAM D21G datasheet|Yes|
|24|RESET_N|Input seeSAM D21G<br>datasheet|System Reset. Low level on this pin<br>resets the entire module.|Yes|
|25|PA30/SWCLK|SeeSAM D21G datasheet|Cortex Serial Wire Debug Interface<br>CLK|Yes|



ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 

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|**Pin #**<br>~~i~~|**Pin description**<br>~~i~~|**I/O type**<br>~~ee~~|**Function (default)**|**Programmable**<br>**pull-up/-down**<br>**resistor**|
|---|---|---|---|---|
|26<br>~~i~~<br>~~2~~|PA31/SWDIO<br>~~i~~<br>~~2~~|SeeSAM D21G datasheet<br>~~ee~~<br>~~2~~|Cortex Serial Wire Debug Interface<br>Data I/O<br>~~2~~|Yes<br>~~2~~|
|27<br>~~2~~|PB02<br>~~2~~|SeeSAM D21G datasheet<br>~~2~~|SeeSAM D21G datasheet<br>~~2~~|Yes<br>~~2~~|
|28|PB03|SeeSAM D21G datasheet|SeeSAM D21G datasheet|Yes|
|29|PA00/GPIO/XIN32|SeeSAM D21G datasheet|SeeSAM D21G datasheet|Yes|
|30|PA01/GPIO/XOUT32|SeeSAM D21G datasheet|SeeSAM D21G datasheet|Yes|
|31<br>~~——————————~~|PA02<br>~~——————————~~|I/O<br>~~——————————~~|SeeSAM D21G datasheet<br>~~——————————~~|Yes<br>~~——————————~~|
|32<br>~~——————————~~|GND<br>~~——————————~~|Power<br>~~——————————~~|Ground<br>~~——————————~~|Yes<br>~~——————————~~|
|33|PA03|SeeSAM D21G datasheet|SeeSAM D21G datasheet|Yes|
|34<br>~~—~~|PA04<br>~~—~~|SeeSAM D21G datasheet<br>~~—~~|SeeSAM D21G datasheet<br>~~—~~|Yes<br>~~—~~|
|35<br>~~—~~|PA05<br>~~—~~|SeeSAM D21G datasheet<br>~~—~~|SeeSAM D21G datasheet<br>~~—~~|Yes<br>~~—~~|
|36<br>~~So~~|PA06<br>~~So~~|SeeSAM D21G datasheet<br>~~So~~|SeeSAM D21G datasheet<br>~~So~~|Yes<br>~~So~~|
|37<br>~~So~~<br>~~a~~|PA07<br>~~So~~<br>~~a~~|SeeSAM D21G datasheet<br>~~So~~<br>~~a~~|SeeSAM D21G datasheet<br>~~So~~<br>~~ee~~|Yes<br>~~So~~<br>~~ee~~|
|38<br>~~a~~|PA08<br>~~a~~|SeeSAM D21G datasheet<br>~~a~~|SeeSAM D21G datasheet<br>~~ee~~|Yes<br>~~ee~~|
|39<br>~~a~~<br>~~—————~~|PA09<br>~~a~~<br>~~—————~~|SeeSAM D21G datasheet<br>~~a~~<br>~~—————~~|SeeSAM D21G datasheet<br>~~ee~~<br>~~—————~~|Yes<br>~~ee~~<br>~~—————~~|
|40<br>~~a~~<br>~~—————~~|PA10<br>~~a~~<br>~~—————~~|SeeSAM D21G datasheet<br>~~a~~<br>~~—————~~|SeeSAM D21G datasheet<br>~~ee ~~<br>~~—————~~|Yes<br> ~~ee~~<br>~~—————~~|
|41<br>~~—————~~<br>~~a~~|PA11<br>~~—————~~<br>~~es~~|SeeSAM D21G datasheet<br>~~—————~~|SeeSAM D21G datasheet<br>~~—————~~|Yes<br>~~—————~~|
|42<br>~~—————~~<br>~~a~~|GND<br>~~—————~~<br>~~es~~|Power<br>~~—————~~|Ground<br>~~—————~~|~~—————~~|
|43<br>~~a~~<br>~~a~~|PB10<br>~~es~~<br>~~a~~|SeeSAM D21G datasheet<br>|SeeSAM D21G datasheet<br>|Yes<br>|
|44<br>~~a~~|PB11<br>~~a~~|SeeSAM D21G datasheet<br>|SeeSAM D21G datasheet<br>|Yes<br>|
|45<br>~~ee~~|Wi-Fi GPIO_4<br>~~ee~~|ATWINC1500 I/O<br>~~ee~~|ATWINC1500 General purpose I/O<br>~~ee~~|Yes – pull-up<br>~~ee~~|
|46<br>~~ee~~|Wi-Fi GPIO_5<br>~~ee~~|ATWINC1500 I/O<br>~~ee~~|ATWINC1500 General purpose I/O<br>~~ee~~|Yes – pull-up<br>~~ee~~|
|47<br>~~ee~~<br>~~ee~~|Wi-Fi GPIO_6<br>~~ee~~<br>~~ee~~|ATWINC1500 I/O<br>~~ee~~<br>~~**eee**~~|ATWINC1500 General purpose I/O<br>~~ee~~<br>~~ee~~|Yes – pull-up<br>~~ee~~<br>~~ee~~|
|48<br>~~ee~~<br>~~ee~~|Wi-Fi I2C_SCL<br>~~ee~~<br>~~ee~~|ATWINC1500 I/O<br>~~ee~~<br>~~**eee**~~|Currently used only for Atmel de-<br>bug. Not for customer use. Leave<br>unconnected.<br>~~ee~~<br>~~ee~~<br>~~eee~~|Yes – pull-up<br>~~ee~~<br>~~ee~~<br>~~eee~~|
|49<br>~~ee~~|Wi-Fi I2C_SDA<br>~~ee~~|ATWINC1500 I/O<br>~~**eee**~~|Currently used only for Atmel de-<br>bug. Not for customer use. Leave<br>unconnected.<br>~~ee~~<br>~~eee~~|Yes – pull-up<br>~~ee~~<br>~~eee~~|
|50<br>~~ee~~<br>~~psf}~~|Wi-Fi Reset_n<br>~~ee~~<br>~~psf}~~|ATWINC1500 Input<br>~~**eee** ~~<br>~~psf}~~|Currently used only for Atmel de-<br>bug. Not for customer use. Leave<br>unconnected.<br> ~~ee~~<br>~~eee~~<br>~~psf}~~|No<br>~~ee~~<br>~~eee~~<br>~~psf}~~|
|51<br>~~psf}~~|GND<br>~~psf}~~|Power<br>~~psf}~~|Ground<br>~~psf}~~|~~psf}~~|



ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 

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## **3.2 Package Description** 

The ATSAMW25-MR210PB package information. 

## **Figure 3-2. SAMW25 MR210PB Package** 

**==> picture [42 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
TOP VIEW<br>**----- End of picture text -----**<br>


**==> picture [434 x 200] intentionally omitted <==**

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## ATSAMW25-MR210 

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 

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## **4 Electrical Specifications** 

## **4.1 Absolute Ratings** 

All typical values are measured at T = 25°C unless otherwise specified. All minimum and maximum values are valid across operating temperature and voltage unless otherwise specified. 

|**Parameters**<br>~~EE EE~~|**Minimum**<br>~~EE EE~~|**Maximum**<br>~~EE~~|**Unit**|
|---|---|---|---|
|VBAT power supply voltage<br>~~EE EE~~|0<br>~~EE EE~~|5.0<br>~~EE~~|V|
|VCC power supply voltage<br>~~EE EE~~|0<br>~~EE EE~~|3.63<br>~~EE~~||
|Pin voltage with respect to GND and VCC|GND-0.3|VCC+0.3||
|Storage temperature range|-40|+125|°C|



|**Table 4-2.**<br>**General Operating Ratings**<br>**Parameters**<br>**Minimum**<br>**Typical**<br>**Maximum**<br>**Unit**<br>VBATT<br>3.0<br>3.6<br>4.3<br>°C<br>VCC<br>2.7<br>3.30<br>3.6<br>Operating temperature range<br>-40<br>25<br>85<br>~~OP~~|**Table 4-2.**<br>**General Operating Ratings**<br>**Parameters**<br>**Minimum**<br>**Typical**<br>**Maximum**<br>**Unit**<br>VBATT<br>3.0<br>3.6<br>4.3<br>°C<br>VCC<br>2.7<br>3.30<br>3.6<br>Operating temperature range<br>-40<br>25<br>85<br>~~OP~~|**Table 4-2.**<br>**General Operating Ratings**<br>**Parameters**<br>**Minimum**<br>**Typical**<br>**Maximum**<br>**Unit**<br>VBATT<br>3.0<br>3.6<br>4.3<br>°C<br>VCC<br>2.7<br>3.30<br>3.6<br>Operating temperature range<br>-40<br>25<br>85<br>~~OP~~|**Table 4-2.**<br>**General Operating Ratings**<br>**Parameters**<br>**Minimum**<br>**Typical**<br>**Maximum**<br>**Unit**<br>VBATT<br>3.0<br>3.6<br>4.3<br>°C<br>VCC<br>2.7<br>3.30<br>3.6<br>Operating temperature range<br>-40<br>25<br>85<br>~~OP~~|**Table 4-2.**<br>**General Operating Ratings**<br>**Parameters**<br>**Minimum**<br>**Typical**<br>**Maximum**<br>**Unit**<br>VBATT<br>3.0<br>3.6<br>4.3<br>°C<br>VCC<br>2.7<br>3.30<br>3.6<br>Operating temperature range<br>-40<br>25<br>85<br>~~OP~~|**Table 4-2.**<br>**General Operating Ratings**<br>**Parameters**<br>**Minimum**<br>**Typical**<br>**Maximum**<br>**Unit**<br>VBATT<br>3.0<br>3.6<br>4.3<br>°C<br>VCC<br>2.7<br>3.30<br>3.6<br>Operating temperature range<br>-40<br>25<br>85<br>~~OP~~|
|---|---|---|---|---|---|
|**Table 4-3.**<br>**Physical Characteristics**||||||
|**Parameters**<br>Size<br>Connector pins pitch<br>~~—~~||**Value**<br>33.863 x 14.882mm<br>See module footprint||**Comments**<br>-<br>-||



**Table 4-4. I/O Pins Characteristics** 

|**Characteristic**<br>~~——===5~~|**Minimum**<br>~~——===5~~|**Typical**<br>~~——===5~~|**Maximum**<br>~~——===5~~|**Unit**<br>~~——===5~~|
|---|---|---|---|---|
|Input Low Voltage VIL<br>~~——===5~~|-0.30<br>~~——===5~~|~~——===5~~|0.65<br>~~——===5~~|V<br>~~——===5~~|
|Input High Voltage VIH<br>~~——===5~~|VCC-0.60<br>~~——===5~~|~~——===5~~|VCC+0.30<br>~~——===5~~||
|Output Low Voltage VOL<br>~~——===5~~|~~——===5~~|~~——===5~~|0.45<br>~~——===5~~||
|Output High Voltage VOH<br>~~——===5~~|VCC-0.50<br>~~——===5~~|~~——===5~~|~~——===5~~||
|Output Loading<br>~~———<—_—~~|~~———<—_—~~|~~———<—_—~~|20<br>~~———<—_—~~|pF<br>~~———<—_—~~|
|Digital Input Load<br>~~———<—_—~~|~~———<—_—~~|~~———<—_—~~|6<br>~~———<—_—~~||
|Pull-up Resistor<br>~~———<—_—~~|76K<br>~~———<—_—~~|90K<br>~~———<—_—~~|104K<br>~~———<—_—~~|Ω<br>~~———<—_—~~|



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Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 

**4.2 Recommended Operating Conditions Table 4-5. Recommended Operating Conditions Characteristic Symbol Minimum Typical Maximum Unit** I/O supply voltage VCC 2.7 3.3 3.6 V Battery supply voltage VBATT 3.0 3.6 4.3 Operating temperature -40 85 ºC ~~——~~ Notes:   1. I/O supply voltage is applied to the following pins: VDDIO_A and VDDIO. 2. Battery supply voltage is applied to following pins: VDD_BATT_PPA, VDD_BATT_PA, and VBATT_BUCK. 

## **4.3 DC Electrical Characteristics** 

Table 4-6 provides the DC characteristics for the ATSAMW25 digital pads. 

## **Table 4-6. DC Electrical Characteristics** 

|**Characteristic**|**Minimum**|**Maximum**|**Unit**|
|---|---|---|---|
|Input Low Voltage VIL|-0.30|0.65|V|
|Input High Voltage VIH|VCC-0.60|VCC+0.30||
|Output Low Voltage VOL||0.45||
|Output High Voltage VOH|VCC-0.50|||
|Output Loading||20|pF|
|Digital Input Load||6||
|Pad Drive Strength (regular pads1)|8|13.5|mA|
|Pad Drive Strength (high-drive pads1)|16|27||



Note: 1. The following are high-drive pads: I2C_SCL, I2C_SDA; all other pads are regular. 

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 

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## **5 Application and Core Subsystems** 

## **5.1 Host Processor** 

The Atmel | SMART SAM D ARM Cortex-M0+ based microcontroller (MCU) series builds on decades of innovation and experience in embedded Flash microcontroller technology. It not only sets a new benchmark for flexibility and ease-of-use but also combines the performance and energy efficiency of an ARM Cortex-M0+ based MCU with an optimized architecture and peripheral set. The Atmel | SMART SAM D gives you a truly differentiated general-purpose microcontroller that is ideal for many low-power, cost-sensitive industrial, and consumer applications. 

## **5.1.1 Host MCU Description** 

A rich set of peripherals, flexibility, and ease-of-use combined with low power consumption make the Atmel SAM D21 ideal for a wide range of home automation, consumer, metering, and industrial applications. 

- ARM Cortex-M0+ based MCU running up to 48MHz 

- 256KB embedded Flash and 32KB SRAM 

- DMA and Event system 

- Six flexible serial communication modules (SERCOM) 

- Full-speed USB device and embedded Host 

- 12-bit ADC (SAM D21G: 14 channels); 10-bit DAC 

- Hardware touch support 

## **5.1.2 Host MCU Key Features** 

- Low power consumption, down to 70µA/MHz 

- Enhanced Analog Performance 

   - ADC with offset and gain correction 

   - Averaging, oversampling, and decimation 

   - Flexible DAC 

   - New low-power internal oscillators 

   - ±2% accuracy over operating range 

- Digital Innovations 

   - Programmable Event System 

   - Enhanced TC for Control Applications 

   - Programmable SERCOM module 

   - I[2] C / SPI / USART / LIN2 / IrDA 

   - Full Speed USB Device and Host 

   - No external components needed 

   - 6-12 channel DMA with CRC module 

   - PTC Hardware touch module 

   - I[2] S module with PDM support 

## **5.2 Wi-Fi Core Processor** 

ATWINC1500B has a Cortus APS3 32-bit processor. This processor performs many of the MAC functions, including but not limited to association, authentication, power management, security key management, and MSDU aggregation/de-aggregation. In addition, the processor provides flexibility for various modes of operation, such as STA and AP modes. 

Atmel 

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 

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## **5.2.1 Memory Subsystem** 

The APS3 core uses a 128KB instruction/boot ROM along with a 128KB instruction RAM and a 64KB data RAM. ATWINC1500B also has 8Mb of flash memory, which can be used for system software. In addition, the device uses a 128KB shared RAM, accessible by the processor and MAC, which allows the APS3 core to perform various data management tasks on the TX and RX data packets. 

## **5.2.2 Non-volatile Memory (eFuse)** 

ATWINC1500B has 768 bits of non-volatile eFuse memory that can be read by the CPU after device reset. This non-volatile one-time-programmable (OTP) memory can be used to store customer-specific parameters, such as MAC address; various calibration information, such as TX power, crystal frequency offset, etc.; and other software-specific configuration parameters. The eFuse is partitioned into six 128-bit banks. Each bank has the same bit map, which is shown in Figure 5-1. The purpose of the first 80 bits in each bank is fixed, and the remaining 48 bits are general-purpose software dependent bits, or reserved for future use. Since each bank can be programmed independently, this allows for several updates of the device parameters following the initial programming, e.g. updating MAC address. Refer to ATWINC1500B Programming Guide for the eFuse programming instructions. 

**Figure 5-1. eFuse Bit Map** 

**==> picture [356 x 248] intentionally omitted <==**

**----- Start of picture text -----**<br>
1 1 3 4 1<br>1 7 1 15<br>Flags<br>8 48 8 16<br>Bank 0 F MAC Addr G FO<br>Bank 1<br>Bank 2<br>Bank 3<br>Bank 4<br>Bank 5<br>128 Bits<br>Used<br>Version Reserved Offset<br>Used Invalid Used Correcti on Used Freq.<br>MAC ADDR TX Gain<br>**----- End of picture text -----**<br>


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## **6 WLAN Subsystem** 

The WLAN subsystem is composed of the Media Access Controller (MAC) and the Physical Layer (PHY). The following two subsections describe the MAC and PHY in detail. 

## **6.1 MAC** 

## **6.1.1 Features** 

The ATWINC1500B IEEE802.11 MAC supports the following functions: 

- IEEE 802.11b/g/n 

- IEEE 802.11e WMM[® ] QoS EDCA/PCF multiple access categories traffic scheduling 

- Advanced IEEE 802.11n features: 

   - Transmission and reception of aggregated MPDUs (A-MPDU) 

   - Transmission and reception of aggregated MSDUs (A-MSDU) 

   - Immediate Block Acknowledgement 

   - Reduced Interframe Spacing (RIFS) 

- Support for IEEE802.11i and WFA security with key management 

   - WEP 64/128 

   - WPA-TKIP 

   - 128-bit WPA2 CCMP (AES) 

- Support for WAPI security 

- Advanced power management 

   - Standard 802.11 Power Save Mode 

   - Wi-Fi Alliance WMM-PS (U-APSD) 

- RTS-CTS and CTS-self support 

- Supports either STA or AP mode in the infrastructure basic service set mode 

- Supports independent basic service set (IBSS) 

## **6.1.2 Description** 

The ATWINC1500B MAC is designed to operate at low power while providing high data throughput. The IEEE 802.11 MAC functions are implemented with a combination of dedicated data path engines, hardwired control logic, and a low-power, high-efficiency microprocessor. The combination of dedicated logic with a programmable processor provides optimal power efficiency and real-time response while providing the flexibility to accommodate evolving standards and future feature enhancements. Dedicated data path engines are used to implement data path functions with heavy computational. For example, an FCS engine checks the CRC of the transmitting and receiving packets, and a cipher engine performs all the required encryption and decryption operations for the WEP, WPA-TKIP, WPA2 CCMP-AES, and WAPI security requirements. Control functions, which have real-time requirements, are implemented using hardwired control logic modules. These logic modules offer real-time response while maintaining configurability via the processor. Examples of hardwired control logic modules are the channel access control module (implements EDCA/HCCA, Beacon TX control, inter-frame spacing, etc.), protocol timer module (responsible for the Network Access Vector, back-off timing, timing synchronization function, and slot management), MPDU handling module, aggregation/deaggregation module, block ACK controller (implements the protocol requirements for burst block communication), and TX/RX control FSMs (coordinate data movement between PHY-MAC interface, cipher engine, and the DMA interface to the TX/RX FIFOs).ø 

The MAC functions implemented solely in software on the microprocessor have the following characteristics: 

- Functions with high memory requirements or complex data structures. Examples are association table management and power save queuing. 

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- Functions with low computational load or without critical real-time requirements. Examples are authentication and association. 

- Functions which need flexibility and upgradeability. Examples are beacon frame processing and QoS scheduling. 

## **6.2 PHY** 

## **6.2.1 Features** 

The ATWINC1500B IEEE802.11 PHY supports the following functions: 

- Single antenna 1x1 stream in 20MHz channels 

- Supports IEEE 802.11b DSSS-CCK modulation: 1, 2, 5.5, and 11Mbps 

- Supports IEEE 802.11g OFDM modulation: 6, 9, 12,18, 24, 36, 48, and 54Mbps 

- Supports IEEE 802.11n HT modulations MCS0-7, 20MHz, 800 and 400ns guard interval: 6.5, 7.2, 13.0, 14.4, 19.5, 21.7, 26.0, 28.9, 39.0, 43.3, 52.0, 57.8, 58.5, 65.0, and 72.2Mbps 

- IEEE 802.11n mixed mode operation 

- Per packet TX power control 

- Advanced channel estimation/equalization, automatic gain control, CCA, carrier/symbol recovery, and frame detection 

## **6.2.2 Description** 

The ATWINC1500B WLAN PHY is designed to achieve reliable and power-efficient physical layer communication specified by IEEE 802.11 b/g/n in single stream mode with 20MHz bandwidth. Advanced algorithms have been employed to achieve maximum throughput in a real world communication environment with impairments and interference. The PHY implements all the required functions such as FFT, filtering, FEC (Viterbi decoder), frequency and timing acquisition and tracking, channel estimation and equalization, carrier sensing, and clear channel assessment, as well as the automatic gain control. 

## **6.3 Radio** 

## **6.3.1 Receiver Performance** 

|**6.3.1**|**6.3.1**<br>**Receiver Performance**|**6.3.1**<br>**Receiver Performance**|**6.3.1**<br>**Receiver Performance**||
|---|---|---|---|---|
||Radio performance under typical conditions: VBAT = 3.3V; VDDIO = 3.3V; Temp.: 25°C @ RF pins||||
||**Table 6-1.**<br>**Receiver Performance**<br>**Parameter**<br>**Description**<br>**Minimum**<br>**Typical**<br>**Maximum**<br>**Unit**<br>Frequency<br>2,412<br>2,484<br>MHz<br>Sensitivity<br>802.11b<br>1Mbps DSS<br>-98<br>dBm<br>2Mbps DSS<br>-94<br>dBm<br>5.5Mbps DSS<br>-92<br>dBm<br>11Mbps DSS<br>-88<br>dBm<br>~~SSSeee~~||||
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|**Parameter**|**Description**|**Minimum**|**Typical**|**Maximum**|**Unit**|
|---|---|---|---|---|---|
|Sensitivity<br>802.11g<br>~~eee~~|6Mbps OFDM<br>~~eee~~|~~eee~~|-90<br>~~eee~~|~~eee~~|dBm<br>~~eee~~|
||9Mbps OFDM<br>~~eee~~|~~eee~~|-89<br>~~eee~~|~~eee~~|dBm<br>~~eee~~|
||12Mbps OFDM<br>~~eee~~|~~eee~~|-88<br>~~eee~~|~~eee~~|dBm<br>~~eee~~|
||18Mbps OFDM<br>~~eee~~|~~eee~~|-85<br>~~eee~~|~~eee~~|dBm<br>~~eee~~|
||24Mbps OFDM<br>~~eee~~|~~eee~~|-83<br>~~eee~~|~~eee~~|dBm<br>~~eee~~|
||36Mbps OFDM<br>~~eee~~|~~eee~~|-80<br>~~eee~~|~~eee~~|dBm<br>~~eee~~|
||48Mbps OFDM<br>~~eee~~|~~eee~~|-76<br>~~eee~~|~~eee~~|dBm<br>~~eee~~|
||54Mbps OFDM<br>~~eee~~|~~eee~~<br>~~es~~|-74<br>~~eee~~<br>~~ee~~|~~eee~~<br>~~es~~|dBm<br>~~eee~~|
|Sensitivity<br>802.11n<br>(BW=20MHz)<br>~~eee~~|MCS 0<br>~~eee~~<br>~~ee~~|~~eee~~<br>~~ee~~<br>~~es~~|-89<br>~~eee~~<br>~~ee~~<br>~~ee~~|~~eee~~<br>~~ee~~<br>~~es~~|dBm<br>~~eee~~<br>~~ee~~|
||MCS 1|~~es ~~|-87<br> ~~ee~~|~~es~~|dBm|
||MCS 2||-85||dBm|
||MCS 3<br>|||<br>||-82<br>|<br>|||<br>||dBm<br>||
||MCS 4||-77||dBm|
||MCS 5||-74||dBm|
||MCS 6||-72||dBm|
||MCS 7||-70.5||dBm|
|Maximum Receive<br>Signal Level|1-11Mbps DSS||0||dBm|
||6-54Mbps OFDM||0||dBm|
||MCS 0 – 7||0||dBm|
|Adjacent Channel<br>Rejection|1Mbps DSS (30MHz offset)||50||dB|
||11Mbps DSS (25MHz offset)||43||dB|
||6Mbps OFDM (25MHz offset)||40||dB|
||54Mbps OFDM (25MHz offset)||25||dB|
||MCS 0 – 20MHz BW (25MHz offset)||40||dB|
||MCS 7 – 20MHz BW (25MHz offset)||20||dB|
|Cellular Blocker<br>Immunity|776-794MHz CDMA||-14||dBm|
||824-849MHz GSM||-10||dBm|
||880-915MHz GSM||-10||dBm|
||1710-1785MHz GSM||-15||dBm|
||1850-1910MHz GSM||-15||dBm|
||1850-1910MHz WCDMA||-24||dBm|
||1920-1980MHz WCDMA||-24||dBm|



**Measured at RF pin assuming 50Ω differential; RF performance guaranteed for temperature range -30 to 85ºC. 1dB derating in performance at -40ºC.** 

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## **6.3.2 Transmitter Performance** 

Radio performance under typical conditions: VBAT = 3.3V; VDDIO = 3.3V; Temp.: 25°C @ RF pins 

|**Parameter**<br>~~leases~~|**Description**<br>~~leases~~|**Minimum**<br>~~leases~~|**Typical**<br>~~leases~~|**Maximum**<br>~~leases~~|**Unit**<br>~~leases~~|
|---|---|---|---|---|---|
|Frequency<br>~~leases~~|~~leases~~|2,412<br>~~leases~~|~~leases~~|2,484<br>~~leases~~|MHz<br>~~leases~~|
|Output Power1,<br>ON_Transmit_High_Power Mode<br>~~leases~~|802.11b 1Mbps<br>~~leases~~|~~leases~~|18.5<br>~~leases~~|~~leases~~|dBm<br>~~leases~~|
||802.11b 11Mbps<br>~~leases~~|~~leases~~|19.5<br>~~leases~~|~~leases~~|dBm<br>~~leases~~|
||802.11g 6Mbps<br>~~leases~~|~~leases~~|18.5<br>~~leases~~|~~leases~~|dBm<br>~~leases~~|
||802.11g 54Mbps<br>~~leases~~|~~leases~~|16.5<br>~~leases~~|~~leases~~|dBm<br>~~leases~~|
||802.11n MCS 0<br>~~leases~~|~~leases~~|17.0<br>~~leases~~|~~leases~~|dBm<br>~~leases~~|
||802.11n MCS 7<br>~~leases~~|~~leases~~|14.5<br>~~leases~~|~~leases~~|dBm<br>~~leases~~|
|Output Power1,<br>ON_Transmit_Low_Power Mode<br>~~Mi==s==~~|802.11b 1Mbps<br>~~Mi==s==~~|~~Mi==s==~~|17.0<br>~~Mi==s==~~|~~Mi==s==~~|dBm<br>~~Mi==s==~~|
||802.11b 11Mbps<br>~~Mi==s==~~|~~Mi==s==~~|17.5<br>~~Mi==s==~~|~~Mi==s==~~|dBm<br>~~Mi==s==~~|
||802.11g 6-18Mbps<br>~~Mi==s==~~|~~Mi==s==~~|16.0<br>~~Mi==s==~~|~~Mi==s==~~|dBm<br>~~Mi==s==~~|
||802.11g >18Mbps<br>~~Mi==s==~~|~~Mi==s==~~|N/A<br>~~Mi==s==~~|~~Mi==s==~~|dBm<br>~~Mi==s==~~|
||802.11n MCS 0-3<br>~~Mi==s==~~|~~Mi==s==~~|14.5<br>~~Mi==s==~~|~~Mi==s==~~|dBm<br>~~Mi==s==~~|
||802.11n >MCS 3<br>~~Mi==s==~~|~~Mi==s==~~|N/A<br>~~Mi==s==~~|~~Mi==s==~~|dBm<br>~~Mi==s==~~|
|TX Power Accuracy|||±1.52||dB|
|Carrier Suppression|||30.0||dBc|
|Out of Band Transmit Power|76-108||-125||dBm/Hz|
||776-794||-125||dBm/Hz|
||869-960||-125||dBm/Hz|
||925-960||-125||dBm/Hz|
||1570-1580||-125||dBm/Hz|
||1805-1880||-125||dBm/Hz|
||1930-1990||-125||dBm/Hz|
||2110-2170||-125||dBm/Hz|
|Harmonic Output Power|2nd|||-41|dBm/MHz|
||3rd|||-41|dBm/MHz|



- Notes:   1. Measured at 802.11 spec compliant EVM/Spectral Mask. 

   2. Measured after RF matching network. See reference design. 

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**7 Recommended Reflow Profile** 

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## **8 Module Schematic** 

The ATSAMW25-MR210PB/MR510PB Module schematic is shown in Figure 8-1 

**Figure 8-1. ATSAMW25-MR210PB/MR510 Module Schematic** 

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ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] 

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Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 

## **9 Bill of Materials (BOM)** 

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## **10 Application Schematic** 

**Figure 10-1. Connections for the ATSAMW25** 

The basic power supply connections for the ATSAMW25 module are shown in Figure 10-1. The test points shown (TP1 – TP6) should be added in case Atmel is required to debug the design. 

The Wi-Fi chip can use its own internal oscillator for a Real Time Clock (RTC) or it can use an external 32.768KHz clock provided on the RTC pin. Using an external clock derived from a crystal oscillator can be used as a more accurate sleep timer for the Wi-Fi chip than its own internal oscillator. This in turn can reduce sleep current. If power consumption during sleep is a priority then a 32.768KHz crystal can be added to the SAM D21 module as shown in the reference design. The design shown above displays a connection from pin 15 (PA22) to pin 5 (GPIO_1). 

GPIO_1 is the input pin for the Wi-Fi’s Real Time Clock. PA22 can be configured to output a 32.768KHz RTC clock – derived from the 32.768KHz crystal - to be used as the source for the Wi-Fi’s RTC. If cost is a priority versus power consumption, then the 32.768KHz crystal can be left off of the design and the PA22 – GPIO_1 connection can be deleted. 

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## **11 Design Guidelines** 

It is critical to follow the recommendations listed below to achieve the best RF performance: 

- When the module is placed on the motherboard, a provision for the antenna must be made. There should be nothing under the portion of the module which contains the antenna. This means the antenna should not be placed directly on top of the motherboard PCB. This can be accomplished by, for example, placing the module at the edge of the board such that the module edge with the antenna extends beyond the main board edge by 6.5mm. Alternatively, a cutout in the motherboard can be provided under the antenna. The cutout should be at least 22 x 6.5mm. Ground vias spaced 2.5mm apart should be placed all around the perimeter of the cutout. No large components should be placed near the antenna. 

- Keep away from antenna, as far as possible, large metal objects to avoid electromagnetic field blocking 

- Do not enclose the antenna within a metal shield 

- Keep any components which may radiate noise or signals within the 2.4 – 2.5GHz frequency band far away from the antenna, or better yet, shield those components. Any noise radiated from the main board in this frequency band will degrade the sensitivity of the module. 

- The main board should have a solid ground plane. Each ground pin of the module (including each of the center ground pads) should have a via placed either in the pad or right next to the pad going down to the ground plane. 

- Place a 10µF decoupling capacitor from VBAT to ground right next to pin 7. Place another 10µF capacitor from VCC to ground right next to pin 21. 

- Contact Atmel for assistance if any other placement is required 

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## **12 Reference Documentation and Support** 

## **12.1 Reference Documents** 

Atmel offers a set of collateral documentation to ease integration and device ramp. 

The following list of documents available on Atmel web or integrated into development tools. 

**Table 12-1. Reference Documents** 

|**Title**|**Content**|
|---|---|
|Datasheet|This document|
|Design Files|User Guide, Schematic, PCB layout, Gerber, BOM, and System notes on:<br>RF/Radio Full Test Report, radiation pattern, design guidelines, temperature perfor-<br>mance, ESD.|
|Package|How to use package:<br>Out of the Box starting guide, HW limitations and notes, SW Quick start guidelines.|
|Platform Getting started<br>Guide|Best practices and recommendations to design a board with the product, including:<br>Antenna Design for Wi-Fi (layout recommendations, types of antennas, impedance<br>matching, using a power amplifier etc.), SPI/UART protocol between Wi-Fi SoC and the<br>Host MCU.|
|HW Design Guide|Integration guide with clear description of:<br>High level Arch, overview on how to write a networking application, list all API, parame-<br>ters and structures.<br>Features of the device, SPI/handshake protocol between device and host MCU, with<br>flow/sequence/state diagram, timing.|
|SW Design Guide|Explain in details the flow chart and how to use each API to implement all generic use<br>cases (e.g. start AP, start STA, provisioning, UDP, TCP, http, TLS, p2p, errors manage-<br>ment, connection/transfer recovery mechanism/state diagram) - usage and sample appli-<br>cation note.|



For a complete listing of development-support tools and documentation, visit http://www.atmel.com/ or contact the nearest Atmel field representative. 

## **12.2 Related Documents** 

## [1]  ATSAM D21 Datasheet: 

Web page: http://www.atmel.com/products/microcontrollers/arm/sam-d.aspx?tab=documents. Document: Atmel SAM D21 Datasheet (.pdf file). 

Then select the required device (ATSAMD21E18A) and get the latest datasheet (.pdf file). 

- [2]  ATWINC1500B Datasheet. 

- [3]  ATSAM W25 Network Controller Programming Guide. 

- [4]  ATSAM W25 Starter Kit User Guide. 

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**13 Revision History Doc Rev. Date Comments** 42618B 05/2016 Updated Figure 3-2 with new POD drawing which has PCB footprint and to solder GND pads. 42618A 11/2015 Initial document release. ~~[pf]~~ 

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© 2016 Atmel Corporation. / Rev.: Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016. 

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