ATS-50425G-C2-R0

## Ultra High Performance BGA Cooling Solutions w/ maxiGRIP™ Attachment 

## **ATS PART # ATS-50425G-C2-R0** 

## Features & Benefits 

- » maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling 

- » maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB 

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- » Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and Unpackaged Drop Testing standards 

- » Comes preassembled with high performance thermal interface material 

» Designed for standard height components from 3 to 4.5mm thermal Performance _*Image above is for illustration purposes only._ ~~—— daa NIM~~ **AIR VELOCITy THERMAL RESISTANCE** ~~|~~ FT/MIN M/S °C/W (UNDUCTED FLOW) °C/W (DUCTED FLOW) ~~ee ee|~~ 200 1.0 2.4 2 300 1.5 1.9 ~~Bf ee es~~ 400 2.0 1.7 500 2.5 1.5 ~~ee~~ ~~**es** eees~~ 600 3.0 1.4 700 3.5 1.3 ~~ee~~ ~~**e** es eees~~ 800 4.0 1.2 ~~es~~ Product Details ~~—[ee]~~ **DIMENSION A DIMENSION B DIMENSION C DIMENSION D INTERFACE MATERIAL FINISH** ~~| | ee~~ 42.5 mm 42.5 mm 12.5 mm 72.8 mm SAINT-GOBAIN C675 BLUE-ANODIZED ~~— a ee ee~~ 

## Notes: 

- 1) Dimension C = heat sink height from bottom of the base to the top of the fin field. 

- 2) Thermal performance data are provided for reference only. Actual performance may vary by application. 

- 3) ATS reserves the right to update or change its products without notice to improve the design or performance. 

- 4) Optional maxiGRIP™ Installation/Removal Tool Set P/N: MGT425 

- 5) Contact ATS to learn about custom options available. 

For more information, to find a distributor or to place an order, visit www.qats.com or call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe). 

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