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ANT8010LL04R2400A
Chip Antenna, WLAN, 2.45 GHz, 50 Ohm, Omnidirectional, 8mm x 1mm x 1mm
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: YAGEO
- Product type: Antennas - Single Band Chip
- Centre Frequency: 2.45GHz
- Antenna Case Size: 8mm x 1mm x 1mm
| Delivery and price | |
|---|---|
| Units per pack | 30000 |
| Price | 0.208 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
## _**ANTENNA PRODUCTS**_ ## DATA Sirlleisi ## **8010 Ceramic Chip Antenna for Bluetooth/Wimax Application** ## – Sept., 2008 V8 |R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>| |---|---|---|---|---|---|---|---|---| ||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6|| ||||||||Aug, 2008<br>v7|| ||||||||Sept, 2008<br>v8|| |||||||||| |Justin Liu<br>Oscar Lu|Tommy Chen|||Page1|sheet 190-1|||A4| ||Yageo Taiwan / High Frequency BU|||||||| ## **8010 Ceramic Chip Antenna for Bluetooth/Wimax Application** ## **Quick Reference Data** Centre Frequency 2.38 GHz Bandwidth 2.3 ~ 2.49 GHz VSWR 2.5 (Max.) Polarization Linear Azimuth Beamwidth Omni-directional Peak Gain 3.0 dBi Impedance 50 Ω Operating Temperature -25~85[ o] C Termination Ni / Sn (Environmentally-Friendly Leadless) Resistance to soldering heats 260 ℃ , 10sec. Maximum Power 1W |R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>| |---|---|---|---|---|---|---|---|---| ||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6|| ||||||||Aug, 2008<br>v7|| ||||||||Sept, 2008<br>v8|| |||||||||| |Justin Liu<br>Oscar Lu|Tommy Chen|||Page2|sheet 190-2|||A4| ||Yageo Taiwan / High Frequency BU|||||||| ## **1. Mechanical Data (8 x 1x 1 mm ³ )** **==> picture [323 x 129] intentionally omitted <==** **----- Start of picture text -----**<br> Top-Side View<br>1.0 mm<br>1.0 mm q 8.0 mm F|<br>Bottom-Side View<br>**----- End of picture text -----**<br> ## **CAN4311881XX2453K** |R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>| |---|---|---|---|---|---|---|---|---| ||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**<br>~~nO~~|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6|| ||||||||Aug, 2008<br>v7|| ||||||||Sept, 2008<br>v8|| |||||||||| |Justin Liu<br>Oscar Lu|Tommy Chen<br>~~es~~|~~es~~<br>~~nO~~|~~es~~<br>~~nO~~|Page3<br>~~es~~|sheet 190-3<br>~~es~~|~~es~~|~~es~~|A4| ||Yageo Taiwan / High Frequency BU<br>~~nO~~|||||||| ## **2 . Dimension of Footprint** **==> picture [388 x 296] intentionally omitted <==** **----- Start of picture text -----**<br> 9.0 mm<br>1.4 mm<br>1.4 mm<br>8.0+- 0.1mm<br>1.05+- 0.1 mm<br>0.90+- 0.15mm<br>Bottom Side<br>**----- End of picture text -----**<br> **-** |R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>| |---|---|---|---|---|---|---|---|---| ||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6|| ||||||||Aug, 2008<br>v7|| ||||||||Sept, 2008<br>v8|| |||||||||| |Justin Liu<br>Oscar Lu|Tommy Chen|||Page4|sheet 190-4|||A4| ||Yageo Taiwan / High Frequency BU|||||||| - **3 . Evaluation Board Dimension and Outlook** **==> picture [195 x 166] intentionally omitted <==** **----- Start of picture text -----**<br> 50 ohm Line<br>Gound plane in<br>backside<br>Unit: mm<br>**----- End of picture text -----**<br> |R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>| |---|---|---|---|---|---|---|---|---| ||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6|| ||||||||Aug, 2008<br>v7|| ||||||||Sept, 2008<br>v8|| |||||||||| |Justin Liu<br>Oscar Lu|Tommy Chen|||Page5|sheet 190-5|||A4| ||Yageo Taiwan / High Frequency BU|||||||| ## **4. Measured S-parameter** |R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>| |---|---|---|---|---|---|---|---|---| ||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6|| ||||||||Aug, 2008<br>v7|| ||||||||Sept, 2008<br>v8|| |||||||||| |Justin Liu<br>Oscar Lu|Tommy Chen|||Page6|sheet 190-6|||A4| ||Yageo Taiwan / High Frequency BU|||||||| ## **5.The Definition of X-Y-Z Plane** **==> picture [93 x 59] intentionally omitted <==** **----- Start of picture text -----**<br> X Z<br>Y<br>**----- End of picture text -----**<br> |R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>| |---|---|---|---|---|---|---|---|---| ||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6|| ||||||||Aug, 2008<br>v7|| ||||||||Sept, 2008<br>v8|| |||||||||| |Justin Liu<br>Oscar Lu|Tommy Chen|||Page7|sheet 190-7|||A4| ||Yageo Taiwan / High Frequency BU|||||||| ## **6. The Environment of Antenna Radiation Pattern** - **Anechoic Chamber Dimension=10(m)** **`×` 6(m)** **`×` 6(m)** |R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>| |---|---|---|---|---|---|---|---|---| ||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6|| ||||||||Aug, 2008<br>v7|| ||||||||Sept, 2008<br>v8|| |||||||||| |Justin Liu<br>Oscar Lu|Tommy Chen|||Page8|sheet 190-8|||A4| ||Yageo Taiwan / High Frequency BU|||||||| ## **7. Radiation Pattern** |R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>| |---|---|---|---|---|---|---|---|---| ||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6|| ||||||||Aug, 2008<br>v7|| ||||||||Sept, 2008<br>v8|| |||||||||| |Justin Liu<br>Oscar Lu|Tommy Chen|||Page9|sheet 190-9|||A4| ||Yageo Taiwan / High Frequency BU|||||||| ## **8. Reliability Test** |**IEC**<br>**384-10/**<br>**CECC 32**<br>**100**<br>**CLAUSE**|**IEC**<br>**60068-2**<br>**TEST**<br>**METHOD**|**TEST**|**PROCEDURE**|**REQUIREMENTS**| |---|---|---|---|---| |4.4||Mounting|The antenna can be<br>mounted on printed-circuit<br>boards or ceramic<br>substrates by applying<br>wave soldering, reflow<br>soldering (including vapour<br>phase soldering) or<br>conductive adhesive|No visible damage| |4.5||Visual inspection<br>and dimension<br>check|Any applicable method<br>using**× **10 magnification|In accordance with<br>specification (chip off<br>4mm)| |4.6.1||Antenna|Central Frequency<br>at20 oC|Standard test board in<br>page 4| |4.8||Adhesion|A force of 3 N applied for<br>10 s to the line joining the<br>terminations and in a<br>plane parallel to the<br>substrate|No visible damage| |4.9||Bond strength of<br>plating on end face|Mounted in accordance<br>with CECC 32 100,<br>paragraph 4.4|No visible damage| ||||Conditions: bending 0.5<br>mm at a rate of 1mm/s,<br>radius jig. 340 mm, 2mm<br>warp on FR4 board of 90<br>mm length|No visible damage| |4.10|20(Tb)|Resistance to<br>soldering heat|260±5°C for 10 ± 0.5 s in<br>a static solder bath|Satisfy the original<br>electrical specification<br>aftersoldering.| |||Resistance to<br>leaching|260±5°C for 30 ±1 s in a<br>static solder bath|Using visual<br>enlargement of**× **10,<br>dissolution of the<br>termination shall not<br>exceed10%| |R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>| |---|---|---|---|---|---|---|---|---| ||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6|| ||||||||Aug, 2008<br>v7|| ||||||||Sept, 2008<br>v8|| |||||||||| |Justin Liu<br>Oscar Lu|Tommy Chen|||Page10|sheet 190-<br>10|||A4| ||Yageo Taiwan / High FrequencyBU|||||||| |**IEC**<br>**384-10/**<br>**CECC 32**<br>**100**<br>**CLAUSE**|**IEC**<br>**60068-2**<br>**TEST**<br>**METHOD**|**TEST**|**PROCEDURE**|**REQUIREMENTS**| |---|---|---|---|---| |4.11|20(Ta)|Solderability|Zero hour test, and test<br>after storage (20 to 24<br>months) in original<br>atmosphere; un-mounted<br>chips completely<br>immersed for 2±0.5 s in<br>235 ± 5°C.|The termination must<br>be well tinned, at least<br>75% is well tinned at<br>termination| |4.12|4(Na)|Rapid change of<br>temperature|-25 °C (30 minutes) to +85<br>°C (30 minutes)**;**100<br>cycles|No visible damage<br>Central Freq. Change<br>±6%| |4.14|3(Ca)|Damp heat|500±12 hours at 60°C;<br>90 to 95 % RH|No visible damage<br>2 hours recovery<br>Central Freq. Change<br>± 6%| |4.15||Endurance|500±12 hours at 85°C;|No visible damage<br>2 hours recovery<br>Central Freq. Change<br>± 6%| ## **■ Notice (shipping and storage during transportation)** ## **In order to ensure some quality, it is suggested to follow the condition during shipping :** - **Temperature : -40~70 ℃** - **Humidity : 45~75%** ## **■ Notice (storage condition)** ## **In order to ensure the solderability of the termination, it is suggested to follow the condition for storage :** - **Temperature : 15~30 ℃** - **Humidity : 45~75%** - **Prevent corrosive gas (SO2, NOX, NH3, Cl2, ..etc)** - **It is better to use products within 6 months. Solderability should be confirmed again if exceed 6 months.** |R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>| |---|---|---|---|---|---|---|---|---| ||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6|| ||||||||Aug, 2008<br>v7|| ||||||||Sept, 2008<br>v8|| |||||||||| |Justin Liu<br>Oscar Lu|Tommy Chen|||Page11|sheet 190-<br>11|||A4| ||Yageo Taiwan / High FrequencyBU|||||||| ## **9. Soldering Condition (Suggestion)** * Customers should alter the profile according to realistic tin paste in use. **==> picture [114 x 21] intentionally omitted <==** **----- Start of picture text -----**<br> Typical value (solid line)<br>Process limits (dotted line)<br>**----- End of picture text -----**<br> |R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>| |---|---|---|---|---|---|---|---|---| ||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6|| ||||||||Aug, 2008<br>v7|| ||||||||Sept, 2008<br>v8|| |||||||||| |Justin Liu<br>Oscar Lu|Tommy Chen|||Page12|sheet 190-<br>12|||A4| ||Yageo Taiwan / High FrequencyBU|||||||| ## **10. Ordering Information** The antennas may be ordered by using the Yageo ordering code. These code numbers can be determined by the following rules: ## **CAN43 11 8 81 04 245 3K** Family Code **CAN 43** = Yageo Part No. for Antenna Packing Type Code **11** = 180 mm/ 7" reel , blister taping Materials Code **8** = High Frequency Material (White) Size Code **81** = 8.0 * 1.0 * 1.0 mm Antenna type **01** = type 1 **02** = type 2 **03** = type 3 **04** = type 4 **05** = type 5 **06** = type 6 **07** = type 7 **08** = type 8 Working Frequency **245 =** 2.45 GHz Packing Type Code **3K =** 3000 pcs for taping per reel |R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>| |---|---|---|---|---|---|---|---|---| ||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6|| ||||||||Aug, 2008<br>v7|| ||||||||Sept, 2008<br>v8|| |||||||||| |Justin Liu<br>Oscar Lu|Tommy Chen|||Page13|sheet 190-<br>13|||A4| ||Yageo Taiwan / High FrequencyBU|||||||| ## **11. Taping Blister Tape** |R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>| |---|---|---|---|---|---|---|---|---| ||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6|| ||||||||Aug, 2008<br>v7|| ||||||||Sept, 2008<br>v8|| |||||||||| |Justin Liu<br>Oscar Lu|Tommy Chen|||Page14|sheet 190-<br>14|||A4| ||Yageo Taiwan / High FrequencyBU|||||||| ## **12. Taping Reel - 7 ” (180mm) Specifications** ||f<br>CL)|Wy|Wy||| |---|---|---|---|---|---| ||LMC<br>\i<br>CF @15,0+£0,5<br>we||||| |||||Wwe|| |**Product size**|**Units per**<br>**Tape Width**<br>**C**||**D**|**W1 **|**W2**| |**code**|**Reel **<br>**(mm)**<br> **(mm)**||**(mm)**|**(mm)**|**(mm)**| |**Antenna**|**1000**<br>**16**<br>**180.0±1.0**||**62±0.5**|**16.0±1.0**|**20.5±1.0**| |R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>| |---|---|---|---|---|---|---|---|---| ||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**<br>~~a~~<br>~~ee~~|||**CAN4311 881 XX 245 3K**<br>~~eeeee~~|||June, 2008<br>v6|| ||||||||Aug, 2008<br>v7|| ||||||||Sept, 2008<br>v8|| ||||||||~~eee~~|| |Justin Liu<br>Oscar Lu|Tommy Chen<br>~~a~~|~~ee~~|~~ee~~|Page15<br>~~ee~~|sheet 190-<br>15<br>~~eee~~|~~eee~~|~~eee~~|A4| ||Yageo Taiwan / High FrequencyBU<br>~~a~~<br>~~ee~~<br>~~ee eee~~|||||||| ## **11. Tape Revision Control:** |Revision|Date|Content|Remark| |---|---|---|---| |V6|June, 2008|Phase out Blue series|| |V7|Aug, 2008|Modify the dimension of soldering pad|| |V8|Sept, 2008|Modify the dimension of soldering pad|| |V9|Sept, 2008|Modify the operation temperature|| |R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>| |---|---|---|---|---|---|---|---|---| ||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6|| ||||||||Aug, 2008<br>v7|| ||||||||Sept, 2008<br>v8|| |||||||||| |Justin Liu<br>Oscar Lu|Tommy Chen|||Page16|sheet 190-<br>16|||A4| ||Yageo Taiwan / High FrequencyBU||||||||
Updated at February 9, 2023
Founded in 1977, Yageo Corporation is a premier global provider of passive component solutions. Through strategic acquisitions of industry leaders such as Pulse Electronics, BrightKing, and KEMET, the company has built a comprehensive product portfolio and established a commanding presence across the electronics industry, particularly in capacitors, resistors, and circuit protection technologies. Our extensive range of Yageo components is heavily focused on their advanced circuit protection solutions. We carry a comprehensive selection of transient voltage suppression (TVS) devices, featuring hundreds of TVS diodes and varistors engineered to safeguard sensitive electronics from destructive voltage transients. This core offering is complemented by a robust lineup of gas discharge tubes (GDTs) designed for reliable overvoltage protection in demanding environments. Beyond voltage suppression, we supply a variety of Yageo's specialized thermistor products, including resettable fuses, inrush current limiting (ICL) NTC thermistors, and precision temperature sensing components. Rounding out our selection are high-performance Yageo RF and single-band chip antennas, providing reliable, space-efficient connectivity for modern wireless applications.
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