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AMMA00050530100MV1
Power Inductor (SMD), 10 µH, 2.5 A, Shielded, 4 A, AMMA Series
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: PULSE ELECTRONICS
- Product type: SMD Power Inductors
- SVHC: No SVHC (04-Feb-2026)
- Inductance: 10µH
- Product Range: AMMA Series
- Product Width: 5.18mm
- Product Height: 3mm
- Product Length: 5.49mm
- DC Resistance Max: 0.158ohm
- RMS Current (Irms): 2.5A
- Inductance Tolerance: ± 20%
- Inductor Construction: Shielded
- Inductor Case / Package: -
- Saturation Current (Isat): 4A
| Delivery and price | |
|---|---|
| Units per pack | 1000 |
| Price | 0.282 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
## **Power Inductor** ## **Automotive Grade AMMA Series** ## **Overview** Power inductors are passive electronic components used in various circuits to store energy in a magnetic field when electrical current flows through them. They are critical in filtering, energy storage, and noise suppression in power electronic systems. They are designed to handle higher currents and are optimized for minimal power loss and thermal efficiency. This series is the most common standard specification. ## **Benefits** 1. Automotive grade available 2. Energy Storage, Efficiently stores and transfers energy in DC-DC converters and power supplies. 3. High Current Handling, Supports high current capacity with minimal losses, ensuring thermal stability. 4. Compact and Efficient Design, Advanced materials and construction enable miniaturization without sacrificing performance, ideal for space-constrained designs. ## **Applications** 1. Automotive Systems for ADAS, infotainment. 2. Industrial Equipment: Robotics, power tools, industrial automation, and IoT devices. 3. DC-DC converters, inverters, and battery management systems. 4. Base stations, 5G infrastructure, and signal processing systems. 5. Consumer Electronics: Smartphones, laptops, tablets, wearable devices, and gaming consoles. ## **Product Information** |**Series**|**L (mm)**|**W(mm)**|**T (mm)**|**Inductance (**µ**H)**| |---|---|---|---|---| |AMMA|4.45|4.06|2.0|0.1 ~ 15| ||5.49|5.18|3.0|| ||6.86|6.47|3.0|| ||11.5|10.0|4.0|| ||13.2|12.9|6.4|| ## **AMMA00050530 Series Specification** ## AEC-Q200 1 Scope This specification applies to large current and low loss SMD power inductor ~~:~~ 2 Part numbering **==> picture [390 x 124] intentionally omitted <==** **----- Start of picture text -----**<br> A MMA □□ □□□□□□ □□□ □ □□<br>Internal code<br>Tolerance<br>| [LE] LL [=] ,<br>Inductance<br>Dimension<br>Control code<br>;LLES Prouduct series<br>Grade<br>**----- End of picture text -----**<br> ## 3 Temperature rating Operating Temperature: -55°C~125°C Storage Temperature: (on tape & reel): -20°C to +40°C; 75% RH max. ## ~~;~~ 4 Marking **==> picture [90 x 13] intentionally omitted <==** **----- Start of picture text -----**<br> Marking : R33<br>**----- End of picture text -----**<br> ## ~~__|~~ 5 Standard testing condition ||Unless otherwise specified|Incase ofdoubt| |---|---|---| |Temperature|OrdinaryTemperature(15 to 35°C)|20 to 30°C| |Humidity|OrdinaryHumidity(25 to 85%RH)|50 to 80 %RH| ## **AMMA00050530 Series Specification** AEC-Q200 ~~Fe~~ **==> picture [460 x 258] intentionally omitted <==** **----- Start of picture text -----**<br> __| 6 Configuration and dimensions<br>A E Dimensions in mm<br>Type 050530<br>A 5.49 ± 0.25<br>B 5.18 ± 0.22<br>B D C 3.0 Max<br>D 2.0 ± 0.3<br>E 1.0 ± 0.3<br>oe =<br>Size Code Net weight(grms)<br>c C<br>050530 0.46 (typ.)<br>fd) , — _ [Ex]<br>__| 7 Electrical characteristics<br>**----- End of picture text -----**<br> |**Part number**|**(uH)**<br>**Inductance**|**(±%)**<br>**Tolerance**|**Test Freq.**|**Irms (A)**<br>**Typ.**|**Isat (A)**<br>**Typ.**|**RDC (mΩ)**<br>**Max.(Typ.)**|**Marking**| |---|---|---|---|---|---|---|---| |AMMA00050530R33MV1|0.33|20|100kHz,0.5V|13.7|19|5.56(5.3)|R33| |AMMA00050530R47MV1|0.47|20|100kHz,0.5V|12.2|16|7.04(6.7)|R47| |AMMA00050530R68MV1|0.68|20|100kHz,0.5V|10.2|13.5|8.96(8.53)|R68| |AMMA000505301R0MV1|1|20|100kHz,0.5V|9.2|12|13.7(13.1)|1R0| |AMMA000505301R5MV1|1.5|20|100kHz,0.5V|7.2|11|20.7(19.7)|1R5| |AMMA000505302R2MV1|2.2|20|100kHz,0.5V|5.8|10|29.2(27.8)|2R2| |AMMA000505303R3MV1|3.3|20|100kHz,0.5V|5|8.5|54.7(52.1)|3R3| |AMMA000505304R7MV1|4.7|20|100kHz,0.5V|3.5|8.2|77.5(73.8)|4R7| |AMMA00050530100MV1|10|20|100kHz,0.5V|2.5|4|158(152)|100| |AMMA00050530150MV1|15|20|100kHz,0.5V|1.9|2.5|265(252)|150| ## **Note:** 1. Operating temperature range -55°C to 125°C. 2. Isat for Inductance drop 20% from its value without current. 3. Irms for a 40°C temperature rise from 25°C ambient. 4. The part temperature (ambient + temp rise) should not exceed 125°C under worst case operating conditions. Circuit design 125°C under worst case operating conditions. Component placement, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 5.[Absolute maximum voltage 25V DC. (Based on test method, it may not the sameunder different application,] it is recommended to verify first.) ## **AMMA00050530 Series Specification** AEC-Q200 ~~Fe~~ **==> picture [418 x 150] intentionally omitted <==** **----- Start of picture text -----**<br> 8 AMMA00050530 Series<br>8.1 Construction<br>1<br>3<br>2 c<br>**----- End of picture text -----**<br> ## **8.2 Material List** |**Item**|**Part**|**Description**| |---|---|---| |1|Magnetic core|Magnetic metal powder| |2|Coil|Enameled copper wire| |3|Terminals|Copper based terminal| AEC-Q200 ## **AMMA00050530 Series Specification** |Reliability test items<br>9<br>**1-1.Mechanical Performance**<br>**No**<br>**Item**<br>**Specification**<br>1-1-1 Board Flex<br>The forces applied on the rightRefer to AEC-Q200-005<br>conditions must not damage Test device shall be soldered on the substrate<br>the terminal electrode and the Substrate Dimension: 100x40x1.6mm<br>ferrite<br>Deflection: 2.0mm<br>KeepingTime: 60sec<br>1-1-2 Resistance to Soldering Heat Appearance: No damage<br>Refer to MIL-STD-202 Method 210<br>Inductance change shall be<br>Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)<br>within ±10%.<br>Solder Temperature: 260±5°C<br>Immersion Time: 10±1sec<br>1-1-3 Solder ability<br>The electrodes shall be at<br>Refer to J-STD-002<br>least 95% covered with new<br>Pre-heating: 150°C, 1min<br>solder coating<br>Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)<br>Solder Temperature: 245±5°C(Pb-Free)<br>Immersion Time: 4±1sec<br>1-1-4 Terminal Strength Test<br>Appearance: No damage<br>Refer AEC-Q200-006<br>Soldered on PCB for testing as fig.<br>Force : 1.8kg<br>KeepingTime: 60 seconds.<br>1-1-5 Resistance to Solvent<br>There must be no change in<br>Refer to MIL-STD-202 Method 215<br>appearance or obliteration of<br>Inductors must withstand 6 mimutes of alcohol or water.<br>marking<br>Sample Size : 15pcs<br>1-1-6 Vibration<br>Appearance: No damage<br>Refer MIL-STD-202 Method 204<br>Inductance change shall be<br>Vibration waveform: Sine waveform<br>within ±10%.<br>Vibration frequency: 10Hz~2000Hz<br>Vibration acceleration: 5g<br>Sweep rate: 0.764386otcave/minute<br>Duration of test: 12 cycles each of 3 orientations,<br>20 minutes for each cycle<br>Vibration axes: X,Y & Z<br>**1-2.Environmental Performance**<br>**No**<br>**Item**<br>**Specification**<br>1-2-1 Temperature Cycle<br>Appearance: No damage<br>Refer to JESD Method JA-104<br>Inductance change shall be<br>Total cycles: 1000 cycles<br>within±20%<br>Temperature Cycling Test Conditions : -55 to 125°C<br>-55°C Soak Mode Condition : 30 minutes<br>125°C Soak Mode Condition : 30 minutes<br>Measured after exposure in the room condition for 24hrs<br>**Test Method**<br>**Test Method**<br>~~a~~<br>~~Pee~~<br>~~i~~<br>~~Poof~~<br>~~a~~<br>~~LCT_~~|Reliability test items<br>9<br>**1-1.Mechanical Performance**<br>**No**<br>**Item**<br>**Specification**<br>1-1-1 Board Flex<br>The forces applied on the rightRefer to AEC-Q200-005<br>conditions must not damage Test device shall be soldered on the substrate<br>the terminal electrode and the Substrate Dimension: 100x40x1.6mm<br>ferrite<br>Deflection: 2.0mm<br>KeepingTime: 60sec<br>1-1-2 Resistance to Soldering Heat Appearance: No damage<br>Refer to MIL-STD-202 Method 210<br>Inductance change shall be<br>Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)<br>within ±10%.<br>Solder Temperature: 260±5°C<br>Immersion Time: 10±1sec<br>1-1-3 Solder ability<br>The electrodes shall be at<br>Refer to J-STD-002<br>least 95% covered with new<br>Pre-heating: 150°C, 1min<br>solder coating<br>Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)<br>Solder Temperature: 245±5°C(Pb-Free)<br>Immersion Time: 4±1sec<br>1-1-4 Terminal Strength Test<br>Appearance: No damage<br>Refer AEC-Q200-006<br>Soldered on PCB for testing as fig.<br>Force : 1.8kg<br>KeepingTime: 60 seconds.<br>1-1-5 Resistance to Solvent<br>There must be no change in<br>Refer to MIL-STD-202 Method 215<br>appearance or obliteration of<br>Inductors must withstand 6 mimutes of alcohol or water.<br>marking<br>Sample Size : 15pcs<br>1-1-6 Vibration<br>Appearance: No damage<br>Refer MIL-STD-202 Method 204<br>Inductance change shall be<br>Vibration waveform: Sine waveform<br>within ±10%.<br>Vibration frequency: 10Hz~2000Hz<br>Vibration acceleration: 5g<br>Sweep rate: 0.764386otcave/minute<br>Duration of test: 12 cycles each of 3 orientations,<br>20 minutes for each cycle<br>Vibration axes: X,Y & Z<br>**1-2.Environmental Performance**<br>**No**<br>**Item**<br>**Specification**<br>1-2-1 Temperature Cycle<br>Appearance: No damage<br>Refer to JESD Method JA-104<br>Inductance change shall be<br>Total cycles: 1000 cycles<br>within±20%<br>Temperature Cycling Test Conditions : -55 to 125°C<br>-55°C Soak Mode Condition : 30 minutes<br>125°C Soak Mode Condition : 30 minutes<br>Measured after exposure in the room condition for 24hrs<br>**Test Method**<br>**Test Method**<br>~~a~~<br>~~Pee~~<br>~~i~~<br>~~Poof~~<br>~~a~~<br>~~LCT_~~|Reliability test items<br>9<br>**1-1.Mechanical Performance**<br>**No**<br>**Item**<br>**Specification**<br>1-1-1 Board Flex<br>The forces applied on the rightRefer to AEC-Q200-005<br>conditions must not damage Test device shall be soldered on the substrate<br>the terminal electrode and the Substrate Dimension: 100x40x1.6mm<br>ferrite<br>Deflection: 2.0mm<br>KeepingTime: 60sec<br>1-1-2 Resistance to Soldering Heat Appearance: No damage<br>Refer to MIL-STD-202 Method 210<br>Inductance change shall be<br>Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)<br>within ±10%.<br>Solder Temperature: 260±5°C<br>Immersion Time: 10±1sec<br>1-1-3 Solder ability<br>The electrodes shall be at<br>Refer to J-STD-002<br>least 95% covered with new<br>Pre-heating: 150°C, 1min<br>solder coating<br>Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)<br>Solder Temperature: 245±5°C(Pb-Free)<br>Immersion Time: 4±1sec<br>1-1-4 Terminal Strength Test<br>Appearance: No damage<br>Refer AEC-Q200-006<br>Soldered on PCB for testing as fig.<br>Force : 1.8kg<br>KeepingTime: 60 seconds.<br>1-1-5 Resistance to Solvent<br>There must be no change in<br>Refer to MIL-STD-202 Method 215<br>appearance or obliteration of<br>Inductors must withstand 6 mimutes of alcohol or water.<br>marking<br>Sample Size : 15pcs<br>1-1-6 Vibration<br>Appearance: No damage<br>Refer MIL-STD-202 Method 204<br>Inductance change shall be<br>Vibration waveform: Sine waveform<br>within ±10%.<br>Vibration frequency: 10Hz~2000Hz<br>Vibration acceleration: 5g<br>Sweep rate: 0.764386otcave/minute<br>Duration of test: 12 cycles each of 3 orientations,<br>20 minutes for each cycle<br>Vibration axes: X,Y & Z<br>**1-2.Environmental Performance**<br>**No**<br>**Item**<br>**Specification**<br>1-2-1 Temperature Cycle<br>Appearance: No damage<br>Refer to JESD Method JA-104<br>Inductance change shall be<br>Total cycles: 1000 cycles<br>within±20%<br>Temperature Cycling Test Conditions : -55 to 125°C<br>-55°C Soak Mode Condition : 30 minutes<br>125°C Soak Mode Condition : 30 minutes<br>Measured after exposure in the room condition for 24hrs<br>**Test Method**<br>**Test Method**<br>~~a~~<br>~~Pee~~<br>~~i~~<br>~~Poof~~<br>~~a~~<br>~~LCT_~~| |---|---|---| |||1-2-2 Biased Humidity Resistance<br>Refer to MIL-STD-202 Method 103<br>Temperature: 85±2°C<br>Relative Humidity:85% / Time: 1000hrs<br>Measured after exposure in the room condition for 24hrs| |||1-2-3 High<br>Refer to MIL-STD-202 Method 108<br>Temperature Exposure<br>Temperature: 125±3°C / Relative Humidity: 0%<br>(Storage)<br>Applied Current: Rated Current /Time: 1000hrs<br>Measured after exposure in the room condition for 24hrs| |||1-2-4 Operational Life<br>Refer to MIL-PRF-27<br>Temperature: 85±3°C<br>Applied Current : Rated Current<br>Time: 1000hrs<br>Measured after exposure in the room condition for 24hrs| ## **AMMA00050530 Series Specification** ## AEC-Q200 ## ~~__|~~ 10 Recommended IR reflow profile |oC|Ramp-up|Ramp-up||||Pre-heating|Pre-heating|Pre-heating|Pre-heating|||Reflow|Reflow|Reflow|||Cooling|Cooling||| |---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---| |300||||||||||||Peak : 260°C||||||||| |||||||||||||||||||||| |217°C||||||||||||||||||||| |||||||||||||||||||||| |150°C||||||||||||||||||6°C / sec max||| |||||||||||||||||||||| |100||||||||||||||||||||| |°|||3°C / sec max||C / sec max|||||||||||||||| |0|50||100||||150||200|||250|||||300|350||sec| |||||||||Reflow||profile||||||||||| |Lead-Free(LF)||||||||||||||||||Refer to J-STD-020F|Refer to J-STD-020F|| |Item|Ramp-up|||||Pre-heating||||Reflow|||||Peak Temp.|||||Cooling| |Temp. scope|R.T. ~150||R.T. ~150°C||150°C~200°C|||||217°C||||||260±5°C|||Peak Temp.<br>150°C|| |Time spec|-|||||60~120 sec||60~120 sec|60~150 sec||||||20~40 sec|||20~40 sec||-| Note: 1. IR reflow times: within 3 times 2. Nitrogen adopted is recommended while in IR reflow ## **AMMA00050530 Series Specification** ## AEC-Q200 **==> picture [380 x 512] intentionally omitted <==** **----- Start of picture text -----**<br> __| 11 Packaging<br>11.1 Packaging-cover tape<br>The force for tearing off cover tape is 10 to 130 grams.<br>165° to 180°<br>Top cover tape<br>AN<br>\<br>Base tape<br>11.2 Packaging quantity<br>Type pcs/reel<br>050530 1000<br>a<br>11.3 Reel dimensions<br>A C B<br>I c:<br>D<br>Dimensions in mm<br>Type A B C D<br>050530 330 100 13 12.4<br>So<br>**----- End of picture text -----**<br> ## **AMMA00050530 Series Specification** ## AEC-Q200 **==> picture [461 x 229] intentionally omitted <==** **----- Start of picture text -----**<br> __| 11 Packaging<br>11.4 Tape dimensions in mm<br>P0 P2<br>D<br>E<br>W<br>B0<br>K0 P<br>ab =)<br>Pulling direction<br>A0<br>Type A0 B0 K0 D E W P P0 P2<br>050530 5.5 6.0 3.3 1.5 1.75 12 8 4 2<br>————E<br>R33<br>**----- End of picture text -----**<br> ## ~~__|~~ 12 Recommended pattern **==> picture [430 x 150] intentionally omitted <==** **----- Start of picture text -----**<br> C<br>Dimensions in mm<br>Type A B C<br>A<br>050530 2.79 2.16 5.99<br>U U 0 EE<br>B<br>__| 13 Note<br>1. Please make sure that your product has been evaluated and confirmed against your specifications<br>when our product is mounted to your product.<br>**----- End of picture text -----**<br> 2. Don’t design/mount any components in contact with this product. 3. The moisture sensitivity level (MSL) of products is classified as level 1. 4. Shelf life: 1 years from the date of shipment. ## **AMMA00050530 Series Specification** AEC-Q200 ~~ae~~ **==> picture [518 x 575] intentionally omitted <==** **----- Start of picture text -----**<br> __| 14 Graph<br>AMMA00050530R33MV1 AMMA00050530R47MV1<br>0.50 100 0.70 100<br>Inductance(μH) Inductance(μH)<br>Temp Rise (°C) Temp Rise (°C)<br>0.40 = |.) 80 0.56 = TY 80<br>0.30 60 0.42 60<br>4 ee e e<br>0.20 40 0.28 40<br>0.10 O r 20 0.14 ae 20<br>0.00 ed 0 0.00 Oe> a 0<br>0 5 10 15 20 0 5 10 15 20<br>DC Current(A) DC Current(A)<br>AMMA00050530R68MV1 AMMA000505301R0MV1<br>1.00 100 1.5 100<br>Inductance(μH) Inductance(μH)<br>Temp Rise (°C) Temp Rise (°C)<br>0.80 = ...),) 80 1.2 ( = 7TTY 80<br>0.60 60 0.9 60<br>0.40 4 ZO 40 0.6 S eSo 40<br>0.20 en 20 0.3 20<br>0.00 a aeee 0 0.0 en ae 0<br>0 3 6 9 12 15 0 3 6 9 12 15<br>DC Current(A) DC Current(A)<br>AMMA000505301R5MV1 AMMA000505302R2MV1<br>2.5 100 3.5 100<br>Inductance(μH) Inductance(μH)<br>Temp Rise (°C) Temp Rise (°C)<br>2.0 S LY) 80 2.8 = LT 80<br>1.5 60 2.1 60<br>e eee<br>1.0 40 1.4 40<br>0.5 Ho) 20 0.7 a= 20<br>0.0 > ee 0 ee 0.0 ee 0<br>0 2 4 6 8 10 12 0 2 4 6 8 10 12<br>DC Current(A) DC Current(A)<br>) )<br>℃ ℃<br>Rise( Rise(<br>Inductance(μH) Temp Inductance(μH) Temp<br>) )<br>℃ ℃<br>Rise( Rise(<br>Inductance(μH) Temp Inductance(μH) Temp<br>) )<br>℃ ℃<br>Rise( Rise(<br>Inductance(μH) Temp Inductance(μH) Temp<br>**----- End of picture text -----**<br> ## **AMMA00050530 Series Specification** AEC-Q200 ~~Fe~~ **==> picture [518 x 384] intentionally omitted <==** **----- Start of picture text -----**<br> __| 14 Graph<br>AMMA000505303R3MV1 AMMA000505304R7MV1<br>5.0 100 7.0 100<br>Inductance(μH) Inductance(μH)<br>Temp Rise (°C) Temp Rise (°C)<br>4.0 S Y] 80 5.6 | yo 80<br>3.0 60 4.2 60<br>2.0 Sh 40 2.8 40<br>|<br>1.0 20 1.4 20<br>re a<br>0.0 Pee) 0 0.0 Le 0<br>0 1.5 3 4.5 6 7.5 9 0 1.5 3 4.5 6 7.5 9<br>DC Current(A) DC Current(A)<br>AMMA00050530100MV1 AMMA00050530150MV1<br>15.0 100 25.0 100<br>Inductance(μH) Inductance(μH)<br>Temp Rise (°C) Temp Rise (°C)<br>12.0 e T 80 20.0 F oy 80<br>9.0 60 15.0 60<br>A e ee e e<br>6.0 40 10.0 40<br>3.0 P O 20 5.0 Ae 20<br>0.0 pe 0 0.0 Le 0<br>0 1 2 3 4 5 0 0.7 1.4 2.1 2.8 3.5<br>DC Current(A) DC Current(A)<br>) )<br>℃ ℃<br>Rise( Rise(<br>Inductance(μH) Temp Inductance(μH) Temp<br>) )<br>℃ ℃<br>Rise(<br>Inductance(μH) Temp Rise( Inductance(μH) Temp<br>**----- End of picture text -----**<br>
Updated at June 10, 2026
Pulse Electronics, a YAGEO company, is a global leader in the design and manufacturing of passive electronic components. With a legacy of innovation dating back to 1956, the company provides essential technology for the communications, computing, industrial, transportation, and IoT sectors. Pulse is recognized worldwide for delivering high-performance solutions that power advanced applications, ranging from 5G networks and electric vehicles to data centers and smart grids. The company's extensive product portfolio is heavily anchored in power and networking magnetics. This includes a comprehensive range of power inductors engineered for exceptional efficiency and reliability in demanding environments. To address complex electromagnetic compatibility challenges, Pulse also manufactures highly effective EMC and RFI suppression solutions, such as common mode chokes and filters, alongside specialized toroidal and RF inductors designed to ensure clean power delivery and optimal signal integrity. Beyond traditional magnetics, Pulse excels in the development of advanced wireless and power conversion components. Their connectivity solutions feature a wide array of high-performance RF antennas and single-band chip antennas tailored for modern connected devices. Furthermore, to support sophisticated power architectures, Pulse provides a broad spectrum of transformers—encompassing PCB-mounted designs, current sensing transformers, and precise pulse transformers—equipping engineers with robust, industry-proven components for power isolation and measurement.
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