AMHP000606304R7MM1

**Automotive Grade AMHP Series** 

## **Power Inductor** 

## **Overview** 

Bidirectional DC-DC converters enable energy transfer between two voltage systems, 

such as a 48V and a 12V bus. These systems are critical in modern automotive and industrial applications, such as electric vehicles (EVs) and renewable energy storage systems. 

Inductors in these converters must exhibit robust insulation properties, high energy storage capacity, and efficient operation under high-current, high-frequency conditions. 

## **Benefits** 

1. Automotive grade available 

2. 48V/12V bidirectional DC-DC 

3. High withstand voltage, up to 80V 

4. Up to 155°C operating temperature, AEC-Q200 grade 0 

## **Applications** 

1. Automotive for Lighting 

2. Automotive for DC to DC 

3. Battery Charger 

4. 48V Mild Hybrid System 

## **Product Information** 

|**Series**|**L (mm)**|**W(mm)**|**T (mm)**|**Inductance (**µ**H)**|
|---|---|---|---|---|
|AMHP|6.4|6.0|3.0|0.68 ~ 4.7|



## **AMHP00060630 Series Specification** 

## AEC-Q200 

1 Scope This specification applies to large current and low loss SMD power inductor ~~:~~ 2 Part numbering 

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A MHP □□ □□□□□□ □□□ □ □□<br>Internal code<br>Tolerance<br>| [LE] LL [=] ,<br>Inductance<br>Dimension<br>Control code<br>;LLES Prouduct series<br>Grade<br>**----- End of picture text -----**<br>


## 3 Temperature rating 

Operating Temperature: -55°C~155°C 

Storage Temperature: (on tape & reel): -20°C to +40°C; 75% RH max. 

## ~~;~~ 4 Marking 

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Marking : R68<br>**----- End of picture text -----**<br>


## ~~__|~~ 5 Standard testing condition 

||Unless otherwise specified|Incase ofdoubt|
|---|---|---|
|Temperature|OrdinaryTemperature(15 to 35°C)|20 to 30°C|
|Humidity|OrdinaryHumidity(25 to 85%RH)|50 to 80 %RH|



## **AMHP00060630 Series Specification** AEC-Q200 ~~Fe~~ 

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__| 6 Configuration and dimensions<br>A E Dimensions in mm<br>Type 060630<br>A 6.4 ± 0.4<br>B 6.0 ± 0.4<br>B D C 3.0 Max<br>D 3.18 ± 0.3<br>E 1.04 ± 0.4<br>oe =<br>Size Code Net weight(grms)<br>c C<br>060630 0.75 (typ.)<br>fd) , — _ [Ex]<br>**----- End of picture text -----**<br>


## ~~__|~~ 7 Electrical characteristics 

|**Part number**|**Inductance**<br>**(uH)**|**Tolerance**<br>**(±%)**|**Test Freq.**|**Irms (A)**<br>**Typ.**|**Isat (A)**<br>**Typ.**|**RDC (mΩ)**<br>**Max.(Typ.)**|**Marking**|
|---|---|---|---|---|---|---|---|
|AMHP00060630R68MM1|0.68|20|100kHz,0.5V|13.2|20.2|5.72(5.2)|R68|
|AMHP000606301R0MM1|1|20|100kHz,0.5V|12.1|16|6.82(6.2)|1R0|
|AMHP000606301R5MM1|1.5|20|100kHz,0.5V|9.1|14.2|12.1(11)|1R5|
|AMHP000606302R2MM1|2.2|20|100kHz,0.5V|7.9|12.8|15.95(14.5)|2R2|
|AMHP000606303R3MM1|3.3|20|100kHz,0.5V|6.1|11.5|26.51(24.1)|3R3|
|AMHP000606304R7MM1|4.7|20|100kHz,0.5V|5.6|9.8|31.9(29)|4R7|



## **Note:** 

1. Operating temperature range -55°C to 155°C. 

2. Isat for Inductance drop 30% from its value without current. 

3. Irms for a 40°C temperature rise from 25°C ambient. 

4. The part temperature (ambient + temp rise) should not exceed 155°C under worst case operating conditions. Circuit design 155°C under worst case operating conditions. Component placement, PCB trace size and thickness, airflow  and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 

5.[Absolute maximum voltage 30V DC. (Based on test method, it may not the sameunder different application,] it is recommended to verify first.) 

## **AMHP00060630 Series Specification** AEC-Q200 ~~Fe~~ 

8 AMHP00060630 Series **8.1 Construction** 1 2 

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## **8.2 Material List** 

|**Item**|**Part**|**Description**|
|---|---|---|
|1|Magnetic core|Magnetic metal powder|
|2|Coil|Enameled copper wire|
|3|Terminals|Copper based terminal|



AEC-Q200 

## **AMHP00060630 Series Specification** 

|Reliability test items<br>9<br>**1-1.Mechanical Performance**<br>**No**<br>**Item**<br>**Specification**<br>1-1-1 Board Flex<br>The forces applied on the rightRefer to AEC-Q200-005<br>conditions must not damage Test device shall be soldered on the substrate<br>the terminal electrode and the Substrate Dimension: 100x40x1.6mm<br>ferrite<br>Deflection: 2.0mm<br>KeepingTime: 60sec<br>1-1-2 Resistance to Soldering Heat Appearance: No damage<br>Refer to MIL-STD-202 Method 210<br>Inductance change shall be<br>Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)<br>within ±10%.<br>Solder Temperature: 260±5°C<br>Immersion Time: 10±1sec<br>1-1-3 Solder ability<br>The electrodes shall be at<br>Refer to J-STD-002<br>least 95% covered with new<br>Pre-heating: 150°C, 1min<br>solder coating<br>Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)<br>Solder Temperature: 245±5°C(Pb-Free)<br>Immersion Time: 4±1sec<br>1-1-4 Terminal Strength Test<br>Appearance: No damage<br>Refer AEC-Q200-006<br>Soldered on PCB for testing as fig.<br>Force : 1.8kg<br>KeepingTime: 60 seconds.<br>1-1-5 Resistance to Solvent<br>There must be no change in<br>Refer to MIL-STD-202 Method 215<br>appearance or obliteration of<br>Inductors must withstand 6 mimutes of alcohol or water.<br>marking<br>Sample Size : 15pcs<br>1-1-6 Vibration<br>Appearance: No damage<br>Refer MIL-STD-202 Method 204<br>Inductance change shall be<br>Vibration waveform: Sine waveform<br>within ±10%.<br>Vibration frequency: 10Hz~2000Hz<br>Vibration acceleration: 5g<br>Sweep rate: 0.764386otcave/minute<br>Duration of test: 12 cycles each of 3 orientations,<br>20 minutes for each cycle<br>Vibration axes: X,Y & Z<br>**1-2.Environmental Performance**<br>**No**<br>**Item**<br>**Specification**<br>1-2-1 Temperature Cycle<br>Appearance: No damage<br>Refer to JESD Method JA-104<br>Inductance change shall be<br>Total cycles: 1000 cycles<br>within±20%<br>Temperature Cycling Test Conditions : -55 to 155°C<br>-55°C  Soak Mode Condition :  30 minutes<br>155°C  Soak Mode Condition :  30 minutes<br>Measured after exposure in the room condition for 24hrs<br>**Test Method**<br>**Test Method**<br>~~a~~<br>~~Pee~~<br>~~i~~<br>~~Poof~~<br>~~a~~<br>~~LCT_~~|Reliability test items<br>9<br>**1-1.Mechanical Performance**<br>**No**<br>**Item**<br>**Specification**<br>1-1-1 Board Flex<br>The forces applied on the rightRefer to AEC-Q200-005<br>conditions must not damage Test device shall be soldered on the substrate<br>the terminal electrode and the Substrate Dimension: 100x40x1.6mm<br>ferrite<br>Deflection: 2.0mm<br>KeepingTime: 60sec<br>1-1-2 Resistance to Soldering Heat Appearance: No damage<br>Refer to MIL-STD-202 Method 210<br>Inductance change shall be<br>Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)<br>within ±10%.<br>Solder Temperature: 260±5°C<br>Immersion Time: 10±1sec<br>1-1-3 Solder ability<br>The electrodes shall be at<br>Refer to J-STD-002<br>least 95% covered with new<br>Pre-heating: 150°C, 1min<br>solder coating<br>Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)<br>Solder Temperature: 245±5°C(Pb-Free)<br>Immersion Time: 4±1sec<br>1-1-4 Terminal Strength Test<br>Appearance: No damage<br>Refer AEC-Q200-006<br>Soldered on PCB for testing as fig.<br>Force : 1.8kg<br>KeepingTime: 60 seconds.<br>1-1-5 Resistance to Solvent<br>There must be no change in<br>Refer to MIL-STD-202 Method 215<br>appearance or obliteration of<br>Inductors must withstand 6 mimutes of alcohol or water.<br>marking<br>Sample Size : 15pcs<br>1-1-6 Vibration<br>Appearance: No damage<br>Refer MIL-STD-202 Method 204<br>Inductance change shall be<br>Vibration waveform: Sine waveform<br>within ±10%.<br>Vibration frequency: 10Hz~2000Hz<br>Vibration acceleration: 5g<br>Sweep rate: 0.764386otcave/minute<br>Duration of test: 12 cycles each of 3 orientations,<br>20 minutes for each cycle<br>Vibration axes: X,Y & Z<br>**1-2.Environmental Performance**<br>**No**<br>**Item**<br>**Specification**<br>1-2-1 Temperature Cycle<br>Appearance: No damage<br>Refer to JESD Method JA-104<br>Inductance change shall be<br>Total cycles: 1000 cycles<br>within±20%<br>Temperature Cycling Test Conditions : -55 to 155°C<br>-55°C  Soak Mode Condition :  30 minutes<br>155°C  Soak Mode Condition :  30 minutes<br>Measured after exposure in the room condition for 24hrs<br>**Test Method**<br>**Test Method**<br>~~a~~<br>~~Pee~~<br>~~i~~<br>~~Poof~~<br>~~a~~<br>~~LCT_~~|Reliability test items<br>9<br>**1-1.Mechanical Performance**<br>**No**<br>**Item**<br>**Specification**<br>1-1-1 Board Flex<br>The forces applied on the rightRefer to AEC-Q200-005<br>conditions must not damage Test device shall be soldered on the substrate<br>the terminal electrode and the Substrate Dimension: 100x40x1.6mm<br>ferrite<br>Deflection: 2.0mm<br>KeepingTime: 60sec<br>1-1-2 Resistance to Soldering Heat Appearance: No damage<br>Refer to MIL-STD-202 Method 210<br>Inductance change shall be<br>Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)<br>within ±10%.<br>Solder Temperature: 260±5°C<br>Immersion Time: 10±1sec<br>1-1-3 Solder ability<br>The electrodes shall be at<br>Refer to J-STD-002<br>least 95% covered with new<br>Pre-heating: 150°C, 1min<br>solder coating<br>Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)<br>Solder Temperature: 245±5°C(Pb-Free)<br>Immersion Time: 4±1sec<br>1-1-4 Terminal Strength Test<br>Appearance: No damage<br>Refer AEC-Q200-006<br>Soldered on PCB for testing as fig.<br>Force : 1.8kg<br>KeepingTime: 60 seconds.<br>1-1-5 Resistance to Solvent<br>There must be no change in<br>Refer to MIL-STD-202 Method 215<br>appearance or obliteration of<br>Inductors must withstand 6 mimutes of alcohol or water.<br>marking<br>Sample Size : 15pcs<br>1-1-6 Vibration<br>Appearance: No damage<br>Refer MIL-STD-202 Method 204<br>Inductance change shall be<br>Vibration waveform: Sine waveform<br>within ±10%.<br>Vibration frequency: 10Hz~2000Hz<br>Vibration acceleration: 5g<br>Sweep rate: 0.764386otcave/minute<br>Duration of test: 12 cycles each of 3 orientations,<br>20 minutes for each cycle<br>Vibration axes: X,Y & Z<br>**1-2.Environmental Performance**<br>**No**<br>**Item**<br>**Specification**<br>1-2-1 Temperature Cycle<br>Appearance: No damage<br>Refer to JESD Method JA-104<br>Inductance change shall be<br>Total cycles: 1000 cycles<br>within±20%<br>Temperature Cycling Test Conditions : -55 to 155°C<br>-55°C  Soak Mode Condition :  30 minutes<br>155°C  Soak Mode Condition :  30 minutes<br>Measured after exposure in the room condition for 24hrs<br>**Test Method**<br>**Test Method**<br>~~a~~<br>~~Pee~~<br>~~i~~<br>~~Poof~~<br>~~a~~<br>~~LCT_~~|
|---|---|---|
|||1-2-2 Biased Humidity Resistance<br>Refer to MIL-STD-202 Method 103<br>Temperature: 85±2°C<br>Relative Humidity:85% / Time: 1000hrs<br>Measured after exposure in the room condition for 24hrs|
|||1-2-3 High<br>Refer to MIL-STD-202 Method 108<br>Temperature Exposure<br>Temperature: 155±3°C / Relative Humidity: 0%<br>(Storage)<br>Applied Current: Rated Current /Time: 1000hrs<br>Measured after exposure in the room condition for 24hrs|
|||1-2-4 Operational Life<br>Refer to MIL-PRF-27<br>Temperature: 85±3°C<br>Applied Current : Rated Current<br>Time: 1000hrs<br>Measured after exposure in the room condition for 24hrs|



## **AMHP00060630 Series Specification** 

## AEC-Q200 

## ~~__|~~ 10 Recommended IR reflow profile 

|oC|Ramp-up|Ramp-up||||Pre-heating|Pre-heating|Pre-heating|Pre-heating|||Reflow|Reflow|Reflow|||Cooling|Cooling|||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|300||||||||||||Peak : 260°C|||||||||
||||||||||||||||||||||
|217°C|||||||||||||||||||||
||||||||||||||||||||||
|150°C||||||||||||||||||6°C / sec max|||
||||||||||||||||||||||
|100|||||||||||||||||||||
|°|||3°C / sec max||C / sec max||||||||||||||||
|0|50||100||||150||200|||250|||||300|350||sec|
|||||||||Reflow||profile|||||||||||
|Lead-Free(LF)||||||||||||||||||Refer to J-STD-020F|Refer to J-STD-020F||
|Item|Ramp-up|||||Pre-heating||||Reflow|||||Peak Temp.|||||Cooling|
|Temp. scope|R.T. ~150||R.T. ~150°C||150°C~200°C|||||217°C||||||260±5°C|||Peak Temp.<br>150°C||
|Time spec|-|||||60~120 sec||60~120 sec|60~150 sec||||||20~40 sec|||20~40 sec||-|



Note: 

1. IR reflow times: within 3 times 

2. Nitrogen adopted is recommended while in IR reflow 

## **AMHP00060630 Series Specification** 

## AEC-Q200 

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__| 11 Packaging<br>11.1 Packaging-cover tape<br>The force for tearing off cover tape is 10 to 130 grams.<br>165° to 180°<br>Top cover tape<br>AN<br>\<br>Base tape<br>11.2 Packaging quantity<br>Type pcs/reel<br>060630 1000<br>a<br>11.3 Reel dimensions<br>A C B<br>I c:<br>D<br>Dimensions in mm<br>Type A B C D<br>060630 330 100 13 16.4<br>So<br>**----- End of picture text -----**<br>


## **AMHP00060630 Series Specification** 

## AEC-Q200 

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__| 11 Packaging<br>11.4 Tape dimensions in mm<br>P0 P2<br>D<br>E<br>W<br>B0<br>K0 P<br>ab =)<br>Pulling direction<br>A0<br>Type A0 B0 K0 D E W P P0 P2<br>060630 6.6 7.0 3.4 1.5 1.75 16 12 4 2<br>————E<br>R68<br>**----- End of picture text -----**<br>


## ~~__|~~ 12 Recommended pattern 

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C<br>Dimensions in mm<br>Type A B C<br>A<br>060630 3.429 3.429 8.255<br>U U 0 EE<br>B<br>__| 13 Note<br>1. Please make sure that your product has been evaluated and confirmed against your specifications<br>when our product is mounted to your product.<br>**----- End of picture text -----**<br>


2. Don’t design/mount any components in contact with this product. 

3. The moisture sensitivity level (MSL) of products is classified as level 1. 

4. Shelf life: 1 years from the date of shipment. 

## **AMHP00060630 Series Specification** 

## AEC-Q200 

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__| 14 Graph<br>AMHP00060630R68MM1 AMHP000606301R0MM1<br>1.00 100 1.5 100<br>Inductance(μH) Inductance(μH)<br>Temp Rise (°C) Temp Rise (°C)<br>0.80 e e 80 ee 1.2 80<br>0.60 60 0.9 60<br>a Ae ee e e<br>0.40 40 0.6 40<br>0.20 I S 20 0.3 ae 20<br>0.00 ee ee 0 ee 0.0 er 0<br>0 5 10 15 20 25 0 5 10 15 20<br>DC Current(A) DC Current(A)<br>AMHP000606301R5MM1 AMHP000606302R2MM1<br>2.5 100 3.5 100<br>Inductance(μH) Inductance(μH)<br>Temp Rise (°C) Temp Rise (°C)<br>2.0 4 80 ee 2.8 e y 80<br>1.5 60 2.1 60<br>e y<br>eee e e<br>1.0 40 1.4 40<br>0.5 I s 20 0.7 a ee 20<br>0.0 ee ee 0 ee 0.0 0<br>0 3 6 9 12 15 0 3 6 9 12 15<br>DC Current(A) DC Current(A)<br>AMHP000606303R3MM1 AMHP000606304R7MM1<br>5.0 100 7.0 100<br>Inductance(μH) Inductance(μH)<br>Temp Rise (°C) Temp Rise (°C)<br>4.0 = . SY) 80 5.6 fF . 80<br>3.0 60 4.2 60<br>e yee ee e eYY<br>2.0 40 2.8 40<br>1.0 --anee 20 1.4 ee 20<br>0.0 ae 0 ee 0.0 len 0<br>0 3 6 9 12 0 2 4 6 8 10<br>DC Current(A) DC Current(A)<br>) )<br>℃ ℃<br>Rise( Rise(<br>Inductance(μH) Temp Inductance(μH) Temp<br>) )<br>℃ ℃<br>Rise( Rise(<br>Inductance(μH) Temp Inductance(μH) Temp<br>) )<br>℃ ℃<br>Rise( Rise(<br>Inductance(μH) Temp Inductance(μH) Temp<br>**----- End of picture text -----**<br>