AFSI001211093R3M05
Power Inductor (SMD), 3.3 µH, 26 A, Shielded, 26 A, AFSI Series
- Manufacturer: PULSE ELECTRONICS
- Product type: SMD Power Inductors
- SVHC: No SVHC (04-Feb-2026)
- Inductance: 3.3µH
- Product Range: AFSI Series
- Product Width: 11mm
- Product Height: 8.8mm
- Product Length: 12mm
- DC Resistance Max: 3800µohm
- RMS Current (Irms): 26A
- Inductance Tolerance: ± 20%
- Inductor Construction: Shielded
- Inductor Case / Package: -
- Saturation Current (Isat): 26A
| Delivery and price | |
|---|---|
| Units per pack | 240 |
| Price | 0.632 € |
| Current stock | 200+ |
| Lead time | 30 days |
## **Power Inductor**
## **Automotive Grade AFSI Series**
## **Overview**
Power inductors are passive electronic components used in various circuits to store energy in a magnetic field when electrical current flows through them. They are critical in filtering, energy storage, and noise suppression in power electronic systems.
They are designed to handle higher currents and are optimized for minimal power loss and thermal efficiency.
## **Benefits**
1. Automotive grade available
2. Large size bottom termination
3. Low DCR
4. Large current
## **Applications**
1. Automotive Systems
2. VRM/VRD
3. Industrial Control
## **Product Information**
|**Series**|**L (mm)**|**W(mm)**|**T (mm)**|**Inductance (**µ**H)**|
|---|---|---|---|---|
|AFSI|9.3|9.0|8.1|0.45 ~ 33|
||9.3|9.0|8.1||
||12.0|11.0|8.8||
||11.8|10.5|10.0||
||16.3|15.3|8.0||
||16.3|15.3|10.0||
AEC-Q200
## **AFSI00121109XXXM05 Series Specification**
~~_|~~ **1 Scope:** This specification applies to large current and low RDC SMD power inductor.
~~_|~~ **2[Part Numbering: ]**
AFSI 00 12 11 09 XXX M 0 5 Internal Code Tolerance Inductance Value ~~JP~~ fee Dimensions Control Code Product Series
## **3 Rating:** ~~_|~~
Operating temperature range: `－` 50℃ `～` 150℃ (Including self - temperature rise) Storage condition:-20 `℃` ~40 `℃；` 75%RH Max
~~_|~~ **4 Marking:**
CΧΧΧ _
**Marking color** ： **Black Marking** ： C Chilisin ΧΧΧ = Inductance
## **5 Material List:** ~~_|~~
|**Material List:**<br>~~_|~~|||
|---|---|---|
|**NO**|**Part**|**Material**|
|1|Flat copper wire|AIW（220℃）|
|2|Core|Iron powder|
|3|coating|Paint Gray（127# matte）|
|4|Solder|Sn96.5-Ag3.0-Cu0.5|
|5|Ink|jet ink black (9210)|
|6|EPOXY|M02-039-AU(6461HF)|
|**Standard Testing Condition**<br>~~_|—<_———~~|**Standard Testing Condition**<br>~~—<_———~~|~~—<_———~~|
|---|---|---|
|~~—<_———~~|Unless otherwise specified<br>~~—<_———~~|In case of doubt<br>~~—<_———~~|
|Temperature<br>~~—<_———~~|Ordinary Temperature(15 to 35℃)<br>~~—<_———~~|20 to 30℃<br>~~—<_———~~|
|Humidity<br>~~—<_———~~|Ordinary Humidity(25 to 85% RH)<br>~~—<_———~~|50 to 80 %RH<br>~~—<_———~~|
AEC-Q200
## **AFSI00121109XXXM05 Series S ecification p**
## ~~_|~~ **7[Configuration and Dimensions:]**
TOP VIEW SIDE VIEW BOTTOM VIEW `A B F` ~~|~~ C1R0 CXAX `D C E`
|**Part No.**|**A**|**B**|**C**|**D**|**E**|**F**|
|---|---|---|---|---|---|---|
|AFSI00121109R47M05|12.0±0.5|11.0±0.5|8.4±0.3|8.8 max|8.0±0.4|1.6±0.1|
|AFSI001211091R0M05|12.0±0.5|11.0±0.5|8.4±0.3|8.8 max|8.0±0.4|1.6±0.1|
|AFSI001211091R5M05|12.0±0.5|11.0±0.5|8.4±0.3|8.8 max|8.0±0.4|1.6±0.1|
|AFSI001211092R2M05|12.0±0.5|11.0±0.5|8.4±0.3|8.8 max|8.0±0.4|1.6±0.1|
|AFSI001211093R3M05|12.0±0.5|11.0±0.5|8.4±0.3|8.8 max|8.0±0.4|1.6±0.1|
|AFSI001211094R7M05|12.0±0.5|11.0±0.5|8.4±0.3|8.8 max|8.0±0.4|1.6±0.1|
|AFSI001211095R6M05|12.0±0.5|11.0±0.5|8.4±0.3|8.8 max|8.0±0.4|1.6±0.1|
|AFSI001211096R8M05|12.0±0.5|11.0±0.5|8.4±0.3|8.8 max|8.0±0.4|1.6±0.1|
|AFSI001211098R2M05|12.0±0.5|11.0±0.5|8.4±0.3|8.8 max|8.0±0.4|1.6±0.1|
|AFSI00121109100M05|12.0±0.5|11.0±0.5|8.4±0.3|8.8 max|8.0±0.4|1.6±0.1|
|AFSI00121109150M05|12.0±0.5|11.0±0.5|8.4±0.3|8.8 max|8.0±0.4|1.6±0.1|
## ~~_|~~ **8[Product appearance]**
## **9 Electrical Characteristics:**
|**Part No.**|**Inductance**|**Test Freq.**|**Tolerance**|**Irms**|**Isat**|**RDC**|**Marking**|
|---|---|---|---|---|---|---|---|
||**(uH )**||**(±%)**|**(A)Typ.**|**(A)Typ.**|**(mΩ)Max.**||
|AFSI00121109R47M05|0.47|100kHz,1.0V|20|50.0|65.0|1.5 (1.1 typ)|CR47|
|AFSI001211091R0M05|1.0|100kHz,1.0V|20|40.0|45.0|2.0 (1.5 typ)|C1R0|
|AFSI001211091R5M05|1.5|100kHz,1.0V|20|33.0|36.0|2.5 (2.0 typ)|C1R5|
|AFSI001211092R2M05|2.2|100kHz,1.0V|20|30.0|30.0|2.8 (2.4 typ)|C2R2|
|AFSI001211093R3M05|3.3|100kHz,1.0V|20|26.0|26.0|3.8 (3.3 typ)|C3R3|
|AFSI001211094R7M05|4.7|100kHz,1.0V|20|20.0|23.0|6.2 (5.7 typ)|C4R7|
|AFSI001211095R6M05|5.6|100kHz,1.0V|20|18.0|21.0|7.0 (6.4 typ)|C5R6|
|AFSI001211096R8M05|6.8|100kHz,1.0V|20|17.0|19.0|7.8 (6.8 typ)|C6R8|
|AFSI001211098R2M05|8.2|100kHz,1.0V|20|16.0|18.0|9.0 (8.2 typ)|C8R2|
|AFSI00121109100M05|10.0|100kHz,1.0V|20|13.0|17.5|12.0 (11.3 typ)|C100|
|AFSI00121109150M05|15.0|100kHz,1.0V|20|11.0|13.5|15.0 (14.3 typ)|C150|
## **Note:**
1. Ambient + temperature rise: `－` 50℃ `～` 150℃ (Including self - temperature rise)
- 2.Isat for Inductance drop 30% from its value without current.
- 3.Irms for a 40 `℃` temprature rise from 25 `℃` ambient.
- 4.The part temperature (ambient + temp rise) should not exceed 150°C under worst case operating conditions. Circuit design150°C under worst case operating conditions. Component placement, PWB trace size
- and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
- 5.Before loading the parts, glue in the middle of the corresponding PCB Layout size to consolidate the parts to prevent Reflow from causing displacement problems
## **AFSI00121109XXXM05 Series Specification**
## AEC-Q200
## **10 Reliability verification conditions**
**AFSI00121109XXXM05 Series Specification** AEC-Q200
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11 Reflow Profile:<br>**----- End of picture text -----**<br>
**AFSI00121109XXXM05 Series Specification** AEC-Q200
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12 Packaging:<br>_| => oe<br>12.1 Small Pack:240pcs per reel<br>{<br>. > [»]<br>A f LIEN] eae : oe<br>EGETARR ERS | er ee<br>PRODUCT TOP ALIGNWENT DIRECTION =<br>Caz=<br>導帶孔面 標籤貼導帶孔的反面<br>PRODUCT BOTTOM ALIGNMENT DIRECTION Conduction band hole The position of the label<br>surface<br>**----- End of picture text -----**<br>
**12.2 Medium pack: 2 reel per casket (480pcs)**
## **12.3 Large pack: 2 small carton per carton (960pcs)**
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Inner carton number 8401-013-01<br>Carrier M30-021-454-0<br>Cover M30-010-05-1<br>Reel M34-006-12<br>Desiccant M66.002<br>pouch M32-002-09<br>Label type Self-adhesion<br>==<br>Carton number 8402-049-01<br>Top left corner on side<br>Label location<br>surface<br>Label size<br>Label type Self-adhesion<br>**----- End of picture text -----**<br>
**AFSI00121109XXXM05 Series Specificat** TT
AEC-Q200
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_| 13 Graph：<br>Inductance vs. DC Current<br>15<br>12 MF<br>150<br>9<br>PNTTT<br>100<br>6<br>8R2<br>SS<br>6R8<br>5R6<br>3 4R7<br>SS<br>3R3<br>2R2<br>1R5<br>1R0<br>R47<br>== ee<br>0<br>0 10 20 30 40 50 60 70<br>DC Current(A)<br>Temperature Change vs. DC Current<br>50<br>8R2<br>6R8<br>150 5R6<br>40 ( | 100 lf 4R7 3R3 2R2 1R5 ff 1R0 R47<br>30<br>WIL LZ<br>20<br>WYLLAZ<br>10<br>Wr<br>0<br>)ZZ@ae ee<br>0 10 20 30 40 50 60<br>DC Current(A)<br>L(uH)<br>)<br>℃<br>T(<br>△<br>**----- End of picture text -----**<br>
Updated at June 10, 2026
Pulse Electronics, a YAGEO company, is a global leader in the design and manufacturing of passive electronic components. With a legacy of innovation dating back to 1956, the company provides essential technology for the communications, computing, industrial, transportation, and IoT sectors. Pulse is recognized worldwide for delivering high-performance solutions that power advanced applications, ranging from 5G networks and electric vehicles to data centers and smart grids. The company's extensive product portfolio is heavily anchored in power and networking magnetics. This includes a comprehensive range of power inductors engineered for exceptional efficiency and reliability in demanding environments. To address complex electromagnetic compatibility challenges, Pulse also manufactures highly effective EMC and RFI suppression solutions, such as common mode chokes and filters, alongside specialized toroidal and RF inductors designed to ensure clean power delivery and optimal signal integrity. Beyond traditional magnetics, Pulse excels in the development of advanced wireless and power conversion components. Their connectivity solutions feature a wide array of high-performance RF antennas and single-band chip antennas tailored for modern connected devices. Furthermore, to support sophisticated power architectures, Pulse provides a broad spectrum of transformers—encompassing PCB-mounted designs, current sensing transformers, and precise pulse transformers—equipping engineers with robust, industry-proven components for power isolation and measurement.
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