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ACT108W-600D
Triac, 600 V, 800 mA, SOT-223, 900 mV, 8.8 A, 20 mA
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- Manufacturer: WEEN SEMICONDUCTORS
- Product type:
- Peak Repetitive Off-State Voltage, Vdrm:600V; On State RMS Current IT(rms):800mA; Triac Case Style:SOT-223; Gate Trigger Current Max (QI), Igt:5mA; Gate Trigger Voltage Max Vgt:900mV; Peak
- SVHC: No SVHC (27-Jun-2018)
- No. of Pins: 4Pins
- Product Range: -
- Triac Case Style: SOT-223
- Thyristor Mounting: Surface Mount
- Holding Current Max: 20mA
- On State RMS Current: 800mA
- Peak On State Voltage: 1.3V
- Gate Trigger Voltage Max: 900mV
- Operating Temperature Max: 125°C
- Peak Non Repetitive Surge Current: 8.8A
- Peak Repetitive Off State Voltage: 600V
| Delivery and price | |
|---|---|
| Units per pack | 9000 |
| Price | 0.124 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
## **ACT108W-600D** ## Rr ~~OS~~ **AC Thyristor power switch Rev. 02 — 27 December 2010 Product data sheet** ## **1. Product profile** ## **1.1 General description** AC Thyristor power switch in a SOT223 surface-mountable plastic package with self-protective capabilities against low and high energy transients ## **1.2 Features and benefits** - Common terminal on mounting base allows multiple ACTs on shared cooling pad - Exclusive negative gate triggering - Full cycle AC conduction - High noise immunity - Remote gate separates the gate driver from the effects of the load current - Safe clamping of low energy over-voltage transients - Self-protective turn-on during high energy voltage transients - Surface-mountable package - Very sensitive gate for lowest gate trigger current ## **1.3 Applications** - Fan motor circuits - Pump motor circuits - Lower-power highly inductive, resistive and safety loads ## **1.4 Quick reference data** |**Table 1.**|**Quick reference data**|||||| |---|---|---|---|---|---|---| |**Symbol**|**Parameter**<br>**Conditions**||**Min**|**Typ**|**Max**|**Unit**| |VDRM|repetitive peak||-|-|600|V| ||off-state voltage|||||| |IGT|gate trigger<br>VD= 12 V; IT= 100 mA; LD-||0.5|-|5|mA| ||current<br>G-; Tj= 25 °C|||||| ||VD= 12 V; IT= 100 mA; LD+||0.5|-|5|mA| ||G-; Tj= 25 °C; seeFigure 10|||||| |IT(RMS)|RMS on-state<br>full sine wave; Tsp≤112 °C;||-|-|0.8|A| ||current<br>seeFigure 4<br>;see Figure 1<br>;|||||| ||seeFigure 2|||||| |||||||| |dVD/dt|rate of rise of<br>VDM= 402 V; Tj= 125 °C; gate||300|-|-|V/µs| ||off-state voltage<br>open circuit; exponential|||||| ||waveform; seeFigure 14|||||| **ACT108W-600D** **NXP Semiconductors** **AC Thyristor power switch** **Table 1. Quick reference data** _…continued_ |**Symbol**|**Parameter**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |VCL|clamping voltage|ICL= 100 µA; tp= 1 ms;|650|-|-|V| |||Tj≤125 °C; see Figure 17||||| |VPP|peak pulse|Tj= 25 °C; non-repetitive,|-|-|2|kV| ||voltage|off-state; seeFigure 3||||| |VT|on-state voltage|IT= 1.1 A; seeFigure 13|-|-|1.3|V| ## **2. Pinning information** ## **Table 2. Pinning information** |**Pin**|**Symbol**|**Description**|**Simplified**|**Simplified**|**Simplified**|**outline**|**outline**|**outline**|**outline**|**outline**|**outline**||||**Graphic symbol**||||| |---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---| |1|LD|load|||||||||||||||||| |2|CM|common||||||||4||||||||LD|| ||||||||||||||||||||| |3|G|gate|||||||||||||G||||| |4|CM|common||||1|||2|||3||||||CM|| ||||||||||||||||_001aaj924_||||| ||||**SOT223 (SC-73)**||||||||||||||||| ## **3. Ordering information** ## **Table 3. Ordering information** |**Type number**|**Package**| |---|---| ||**Name**<br>**Description**<br>**Version**| |ACT108W-600D|SC-73<br>plastic surface-mounted package with increased heatsink; 4<br>leads<br>SOT223| © NXP B.V. 2010. All rights reserved. ACT108W-600D All information provided in this document is subject to legal disclaimers. **Product data sheet** **Rev. 02 — 27 December 2010** **2 of 15** **ACT108W-600D** **NXP Semiconductors** **AC Thyristor power switch** ## **4. Limiting values** ## **Table 4. Limiting values** _In accordance with the Absolute Maximum Rating System (IEC 60134)._ |**Symbol**<br>**Parameter**|**Conditions**<br>**Min**<br>**Max**<br>**Unit**| |---|---| |VDRM<br>repetitive peak off-state voltage|-<br>600<br>V| |IT(RMS)<br>RMS on-state current|full sine wave; Tsp≤112 °C;<br>see Figure 4<br>;see Figure 1<br>;see Figure 2<br>-<br>0.8<br>A| |ITSM<br>non-repetitive peak on-state<br>current|full sine wave; Tj(init)= 25 °C;<br>tp= 16.7 ms<br>-<br>8.8<br>A| ||full sine wave; Tj(init)= 25 °C;<br>tp= 20 ms; seeFigure 5<br>;see Figure 6<br>-<br>8<br>A| |I2t<br>I2t for fusing|tp= 10 ms; sine-wave pulse<br>-<br>0.32<br>A2s| |dIT/dt<br>rate of rise of on-state current|IT= 1 A; IG= 10 mA; dIG/dt = 0.2 A/µs<br>-<br>50<br>A/µs| |IGM<br>peak gate current|t = 20 μs<br>-<br>1<br>A| |VGM<br>peak gate voltage|positive applied gate voltage<br>-<br>15<br>V| |PG(AV)<br>average gate power|over any 20 ms period<br>-<br>0.1<br>W| |Tstg<br>storage temperature|-40<br>150<br>°C| |Tj<br>junction temperature|-<br>125<br>°C| |VPP<br>peak pulse voltage|Tj= 25 °C; non-repetitive, off-state;<br>seeFigure 3<br>-<br>2<br>kV| **==> picture [497 x 261] intentionally omitted <==** **----- Start of picture text -----**<br> 003aac822 003aac807<br>8 1<br>IT(RMS) IT(RMS)<br>(A)<br>(A)<br>0.8<br>6<br>0.6<br>4<br>0.4<br>2<br>0.2<br>0 0<br>10 [−] [2] 10 [−] [1] 1 10 − 50 0 50 100 150<br>surge duration (s) Tsp ( ° C)<br>f = 50 Hz<br>Tsp = 112 °C<br>Fig 1. RMS on-state current as a function of surge Fig 2. RMS on-state current as a function of solder<br>duration; maximum values point temperature; maximum values<br>**----- End of picture text -----**<br> © NXP B.V. 2010. All rights reserved. ACT108W-600D All information provided in this document is subject to legal disclaimers. **Rev. 02 — 27 December 2010** **Product data sheet** **3 of 15** **ACT108W-600D** **NXP Semiconductors** **AC Thyristor power switch** **==> picture [217 x 101] intentionally omitted <==** **----- Start of picture text -----**<br> IEC 61000-4-5 Standards<br>Surge Generator<br>Open Circuit Voltage<br>1.2 μ s/50 μ s waveform<br>RGen R L<br>2 Ω 150 Ω 5 μ H RG<br>Load Model DUT<br>Surge pulse 220 Ω<br>003aad077<br>**----- End of picture text -----**<br> **Fig 3. Test circuit for inductive and resistive loads with conditions equivalent to IEC 61000-4-5** **==> picture [438 x 184] intentionally omitted <==** **----- Start of picture text -----**<br> 003aac803<br>1.0<br>Ptot α = 180 °<br>(W) α<br>0.8<br>α<br>0.6<br>0.4<br>0.2<br>0<br>0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8<br>IT(RMS) (A)<br>**----- End of picture text -----**<br> α = conduction angle **Fig 4. Total power dissipation as a function of RMS on-state current; maximum values** **==> picture [481 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> 003aac804<br>10<br>ITSM<br>(A)<br>8<br>6<br>4<br>IT ITSM<br>t<br>2<br>1 /f<br>Tj(init) = 25 ° C max<br>0<br>1 10 10 [2] 10 [3]<br>number of cycles<br>**----- End of picture text -----**<br> f = 50 Hz **Fig 5. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values** © NXP B.V. 2010. All rights reserved. ACT108W-600D **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 02 — 27 December 2010** **4 of 15** **ACT108W-600D** **NXP Semiconductors** **AC Thyristor power switch** **==> picture [481 x 205] intentionally omitted <==** **----- Start of picture text -----**<br> 003aac805<br> 10 [3]<br>ITSM IT ITSM<br>(A)<br>t<br> 10 [2] Tj(init) = 25 tp ° C max<br> 10<br> 1<br>10 [−] [5] 10 [−] [4] 10 [−] [3] 10 [−] [2]<br>tp (s)<br>tp ≤ 20 ms<br>**----- End of picture text -----**<br> **Fig 6. Non-repetitive peak on-state current as a function of pulse width; maximum values** ## **5. Thermal characteristics** ## **Table 5. Thermal characteristics** |**Symbol**<br>**Parameter**|**Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**| |---|---| |Rth(j-sp)<br>thermal resistance from<br>junction to solder point|full cycle with heatsink compound;<br>seeFigure 9<br>-<br>-<br>15<br>K/W| |Rth(j-a)<br>thermal resistance from<br>junction to ambient|full cycle; printed-circuit board mounted<br>for pad area; seeFigure 7<br>-<br>70<br>-<br>K/W| ||full cycle; printed-circuit board mounted<br>for minimum footprint; seeFigure 8<br>-<br>156<br>-<br>K/W| © NXP B.V. 2010. All rights reserved. ACT108W-600D **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 02 — 27 December 2010** **5 of 15** **ACT108W-600D** **NXP Semiconductors** **AC Thyristor power switch** **==> picture [400 x 222] intentionally omitted <==** **----- Start of picture text -----**<br> 3.8 min<br>36<br>1.5<br>min<br>18<br>60 4.6 4.5 6.3<br>9<br>1.5<br>2.3<br>min<br>10 (3 × )<br>1.5<br>min<br>4.6<br>001aab508<br>7<br>All dimensions are in mm<br>15<br>50<br>001aab509<br>**----- End of picture text -----**<br> All dimensions are in mm Printed-circuit board: FR4 epoxy glass (1.6 mm thick), copper laminate (35 um thick). **Fig 7. Printed-circuit board pad area SOT223 Fig 8. Minimum footprint SOT223** **==> picture [481 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> 003aac808<br>10 [2]<br>Zth(j-sp)<br>(K/W)<br>10<br>1<br>P<br>10 [−] [1]<br>t p t<br>10 [−] [2]<br>10 [−] [5] 10 [−] [4] 10 [−] [3] 10 [−] [2] 10 [−] [1] 1 10<br>tp (s)<br>**----- End of picture text -----**<br> **Fig 9. Transient thermal impedance from junction to solder point as a function of pulse width** © NXP B.V. 2010. All rights reserved. ACT108W-600D All information provided in this document is subject to legal disclaimers. **Product data sheet** **Rev. 02 — 27 December 2010** **6 of 15** **ACT108W-600D** **NXP Semiconductors** **AC Thyristor power switch** ## **6. Characteristics** |**Table 6.**<br>**Characteristics**|| |---|---| |**Symbol**<br>**Parameter**|**Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**| |IGT<br>gate trigger current|VD= 12 V; IT= 100 mA; LD- G-;<br>Tj= 25 °C<br>0.5<br>-<br>5<br>mA| ||VD= 12 V; IT= 100 mA; LD+ G-;<br>Tj= 25 °C; seeFigure 10<br>0.5<br>-<br>5<br>mA| |IL<br>latching current|VD= 12 V; IG= 12 mA; Tj= 25 °C;<br>seeFigure 11<br>-<br>-<br>25<br>mA| |IH<br>holding current|VD= 12 V; Tj= 25 °C; see Figure 12<br>-<br>-<br>20<br>mA| |VT<br>on-state voltage|IT= 1.1 A; seeFigure 13<br>-<br>-<br>1.3<br>V| |VGT<br>gate trigger voltage|VD= 12 V; IT= 100 mA; Tj= 25 °C<br>-<br>-<br>0.9<br>V| ||VD= 12 V; IT= 100 mA; Tj≤125 °C<br>0.15<br>-<br>-<br>V| |ID<br>off-state current|VD= 600 V; Tj≤25 °C<br>-<br>-<br>2<br>µA| ||VD= 600 V; Tj≤125 °C<br>-<br>-<br>0.2<br>mA| |dVD/dt<br>rate of rise of off-state<br>voltage|VDM= 402 V; Tj= 125 °C; gate open<br>circuit; exponential waveform;<br>seeFigure 14<br>300<br>-<br>-<br>V/µs| |dIcom/dt<br>rate of change of<br>commutating current|VD= 400 V; Tj= 125 °C; IT(RMS)= 1 A;<br>dVcom/dt = 15 V/µs; gate open circuit;<br>seeFigure 15<br>;seeFigure 16<br>0.15<br>-<br>-<br>A/ms| ||<br>| |VCL<br>clamping voltage|ICL= 100 µA; tp= 1 ms; Tj≤125 °C;<br>seeFigure 17<br>650<br>-<br>-<br>V| **==> picture [497 x 261] intentionally omitted <==** **----- Start of picture text -----**<br> 3 003aac809 3 003aac811<br>IGT (1) IL<br>IGT(25 ° C) IL(25 ° C)<br>2 2<br>(2)<br>1 1<br>(2)<br>(1)<br>0 0<br>− 50 0 50 100 Tj ( ° C) 150 − 50 0 50 100 Tj ( ° C) 150<br>(1) LD+ G-<br>(2) LD- G-<br>Fig 10. Normalized gate trigger current as a function of Fig 11. Normalized latching current as a function of<br>junction temperature junction temperature<br>**----- End of picture text -----**<br> © NXP B.V. 2010. All rights reserved. ACT108W-600D All information provided in this document is subject to legal disclaimers. **Rev. 02 — 27 December 2010** **Product data sheet** **7 of 15** **ACT108W-600D** **NXP Semiconductors** **AC Thyristor power switch** **==> picture [446 x 545] intentionally omitted <==** **----- Start of picture text -----**<br> 003aac810 003aaf722<br>3 2.0<br>IT<br>IH TTT (A) coors<br>IH(25 ° C)<br>1.5<br>P 2 PT Tree Saari<br>1.0<br>NIP tty<br>1 CMT) Sassen (1) (2) (3)<br>0.5<br>TTT Mo fpA fe<br>_— eo) a<br>0 EERE 0.0 Ly<br>− 50 0 50 100 150 0.0 0.5 1.0 1.5 2.0<br>Tj ( ° C) VT (V)<br>V, =0.758V<br>R; = 0.2630<br>(1) T; =125 °C; typical values<br>(2) T; =125 °C ; maximum values<br>(3)T; = 25 °C; maximum values<br>Normalized holding current as a function of Fig 13. On-state current as a function of on-state<br>junction temperature voltage<br>003aac813 003aac814<br>12 12<br>A<br>B<br>A<br>10<br>B<br>8 8<br>6<br>SEREEREE NESE<br>4 4<br>BNEREEEE BNESEEEE<br>2<br>Ben SSeee BER SSaae<br>0 et) Err 0 BERR<br>25 50 75 100 125 25 50 75 100 125<br>Tj ( ° C) Tj ( ° C)<br>A is dVD/dt at condition Tj °C A is dIcom/dt at condition Tj °C<br>B is dVD/dt at condition Tj 125 °C B is dIcom/dt at condition Tj 125 °C<br>VD = 400 V<br>**----- End of picture text -----**<br> **Fig 13. On-state current as a function of on-state voltage** **Fig 12. Normalized holding current as a function of junction temperature** **Fig 14. Normalized rate of rise of off-state voltage as a Fig 15. Normalized critical rate of rise of commutating function of junction temperature current as a function of junction temperature** © NXP B.V. 2010. All rights reserved. ACT108W-600D **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 02 — 27 December 2010** **8 of 15** **ACT108W-600D** **NXP Semiconductors** **AC Thyristor power switch** **==> picture [233 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> 003aac815<br>2.0<br>A [B]<br>A [spec]<br>1.5<br>1.0<br>0.5<br>0<br>10 [−] [1] 1 10 10 [2]<br>B (V/ μ s)<br>**----- End of picture text -----**<br> **==> picture [233 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> 003aac817<br>1.2<br>VCL<br>VCL(25 ° C)<br>0.8<br>0.4<br>0<br>− 50 0 50 100 150<br>Tj ( ° C)<br>**----- End of picture text -----**<br> A[B] is dIcom/dt at condition B, dVcom/dt A[spec] is the specified data sheet value of dIcom/dt turn-off time < 20 ms - **Fig 16. Normalized critical rate of change of commutating current as a function of critical rate of change of commutating voltage; minimum values** - **Fig 17. Normalized clamping voltage (upper limit) as a function of junction temperature; minimum values** © NXP B.V. 2010. All rights reserved. ACT108W-600D All information provided in this document is subject to legal disclaimers. **Product data sheet** **Rev. 02 — 27 December 2010** **9 of 15** **ACT108W-600D** **NXP Semiconductors** **AC Thyristor power switch** ## **7. Package outline** **Plastic surface-mounted package with increased heatsink; 4 leads** ## **SOT223** **==> picture [478 x 570] intentionally omitted <==** **----- Start of picture text -----**<br> D B E A X<br>c<br>y<br>HE v M A<br>b1<br>4<br>Q<br>A<br>A1<br>1 2 3 Lp<br>e1 bp w M B detail X<br>e<br>0 2 4 mm<br>scale<br>DIMENSIONS (mm are the original dimensions)<br>UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y<br>1.8 0.10 0.80 3.1 0.32 6.7 3.7 7.3 1.1 0.95<br>mm 4.6 2.3 0.2 0.1 0.1<br>1.5 0.01 0.60 2.9 0.22 6.3 3.3 6.7 0.7 0.85<br>OUTLINE REFERENCES EUROPEAN<br>ISSUE DATE<br>VERSION IEC JEDEC JEITA PROJECTION<br>04-11-10<br> SOT223 SC-73<br>06-03-16<br>**----- End of picture text -----**<br> ## **Fig 18. Package outline SOT223 (SC-73)** All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. ACT108W-600D **Product data sheet** **Rev. 02 — 27 December 2010** **10 of 15** **ACT108W-600D** **NXP Semiconductors** **AC Thyristor power switch** ## **8. Soldering** **==> picture [497 x 562] intentionally omitted <==** **----- Start of picture text -----**<br> 7<br>3.85<br>3.6<br>3.5<br>0.3<br>1.3 1.2<br>(4 × ) (4 × )<br>4 solder lands<br>solder resist<br>3.9 6.1 7.65 solder paste<br>occupied area<br>1 2 3<br>Dimensions in mm<br>2.3 2.3<br>1.2<br>(3 × )<br>1.3<br>(3 × )<br>6.15 sot223_fr<br>Fig 19. Reflow soldering footprint for SOT223 (SC-73)<br>8.9<br>6.7<br>1.9<br>4 solder lands<br>solder resist<br>6.2 8.7<br>occupied area<br>Dimensions in mm<br>1 2 3<br>preferred transport<br>1.9 direction during soldering<br>(3 × )<br>2.7 2.7<br>1.9<br>1.1<br>(2 × ) sot223_fw<br>**----- End of picture text -----**<br> ## **Fig 20. Wave soldering footprint for SOT223 (SC-73)** All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. ACT108W-600D **Product data sheet** **Rev. 02 — 27 December 2010** **11 of 15** **ACT108W-600D** **NXP Semiconductors** **AC Thyristor power switch** ## **9. Revision history** |**Table 7.**<br>**Revision**|**history**|||| |---|---|---|---|---| |**Document ID**|**Release date**|**Data sheet status**|**Change notice**|**Supersedes**| |ACT108W-600D v.2|20101227|Product data sheet|-|ACT108W-600D v.1| |Modifications:|**•** Status changed from Preliminary to Product.|||| ||**•** Various changes to content.|||| |ACT108W-600D v.1|20100902|Preliminary data sheet|-|-| © NXP B.V. 2010. All rights reserved. ACT108W-600D All information provided in this document is subject to legal disclaimers. **Rev. 02 — 27 December 2010** **Product data sheet** **12 of 15** **ACT108W-600D** **NXP Semiconductors** **AC Thyristor power switch** ## **10. Legal information** ## **10.1 Data sheet status** |**Document status[1]**<br>**[2]**|**Product status[3]**|**Definition**| |---|---|---| |Objective [short] data sheet|Development|This document contains data from the objective specification for product development.| |Preliminary [short] data sheet|Qualification|This document contains data from the preliminary specification.| |Product [short] data sheet|Production|This document contains the product specification.| [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. ## **10.2 Definitions** **Draft** — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. **Short data sheet** — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. **Product specification** — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. ## **10.3 Disclaimers** **Limited warranty and liability** — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the _Terms and conditions of commercial sale_ of NXP Semiconductors. **Right to make changes** — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. **Suitability for use** — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. **Quick reference data** — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. **Applications** — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. **Limiting values** — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. **Terms and conditions of commercial sale** — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective © NXP B.V. 2010. All rights reserved. ACT108W-600D All information provided in this document is subject to legal disclaimers. **Product data sheet** **Rev. 02 — 27 December 2010** **13 of 15** **ACT108W-600D** **NXP Semiconductors** **AC Thyristor power switch** agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. **No offer to sell or license** — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. **Export control** — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. **Non-automotive qualified products** — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. ## **10.4 Trademarks** Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. **Adelante** , **Bitport** , **Bitsound** , **CoolFlux** , **CoReUse** , **DESFire** , **EZ-HV** , **FabKey** , **GreenChip** , **HiPerSmart** , **HITAG** , **I²C-bus** logo, **ICODE** , **I-CODE** , **ITEC** , **Labelution** , **MIFARE** , **MIFARE Plus** , **MIFARE Ultralight** , **MoReUse** , **QLPAK** , **Silicon Tuner** , **SiliconMAX** , **SmartXA** , **STARplug** , **TOPFET** , **TrenchMOS** , **TriMedia** and **UCODE** — are trademarks of NXP B.V. **HD Radio** and **HD Radio** logo — are trademarks of iBiquity Digital Corporation. ## **11. Contact information** For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com © NXP B.V. 2010. All rights reserved. ACT108W-600D All information provided in this document is subject to legal disclaimers. **Product data sheet** **Rev. 02 — 27 December 2010** **14 of 15** **ACT108W-600D** **NXP Semiconductors** **AC Thyristor power switch** ## **12. Contents** |**1**|**Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1**| |---|---| |1.1|General description . . . . . . . . . . . . . . . . . . . . . .1| |1.2|Features and benefits. . . . . . . . . . . . . . . . . . . . .1| |1.3|Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1| |1.4|Quick reference data . . . . . . . . . . . . . . . . . . . . .1| |**2**|**Pinning information. . . . . . . . . . . . . . . . . . . . . . .2**| |**3**|**Ordering information. . . . . . . . . . . . . . . . . . . . . .2**| |**4**|**Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3**| |**5**|**Thermal characteristics . . . . . . . . . . . . . . . . . . .5**| |**6**|**Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .7**| |**7**|**Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10**| |**8**|**Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11**| |**9**|**Revision history. . . . . . . . . . . . . . . . . . . . . . . . .12**| |**10**|**Legal information. . . . . . . . . . . . . . . . . . . . . . . .13**| |10.1|Data sheet status . . . . . . . . . . . . . . . . . . . . . . .13| |10.2|Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .13| |10.3|Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .13| |10.4|Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .14| |**11**|**Contact information. . . . . . . . . . . . . . . . . . . . . .14**| Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. **© NXP B.V. 2010.** **All rights reserved.** For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com **Date of release: 27 December 2010 Document identifier: ACT108W-600D**
Updated at April 26, 2026
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