A18841-02

## **Silicone Free** 

## **Thermal Gap Filler Preliminary Data Sheet** 

## **Silicone Free Thermal Gap Fillers** 

## **Tflex SF4 – Tflex SF7 – Tflex SF10** 

## **PRODUCT DESCRIPTION** 

Tflex SF4, Tflex SF7, and Tflex SF10 are innovative, high performing thermal materials in Laird’s silicone free gap filler portfolio. The silicone free technology provides products with excellent deflection properties, providing minimal pressure on components during deflection. Very little pressure is required to reach the lowest possible thermal resistance.  Thicknesses from 0.5mm (.020”) up to 4mm (.160”) in 0.5mm (.020”) increments available as standard. 

## **FEATURES AND BENEFITS** 

## **MARKETS AND APPLICATIONS** 

- Silicone free formulation 

- Low peak and residual pressure 

- Excellent surface wetting for low contact resistance 

- Exceptionally low thermal resistance 

- UL V-0 Flammability Rating 

- Datacom Systems 

- Automotive Electronics 

- Telecom Systems 

- Optical Modules 

- Cameras 

## **STORAGE CONDITIONS** 

- Storage Temperature: 0-35 Deg C 

- Shelf Life: 

   - 2 years from date of Shipment 

   - No change for materials with DF, 1 year for all products with Adhesive 

## **TYPICAL PROPERTIES** 

|**Property**<br>~~PR~~|**Tflex SF4**<br>|**Tflex SF7**<br>|**Tflex SF10**<br>|**Test Method**<br>|
|---|---|---|---|---|
|Color<br>~~PR~~|Light Grey<br>|Dark Grey<br>|Grey<br>|N/A<br>|
|Thickness Range*<br>~~PRGO~~|0.5mm-4mm<br>~~GO~~|0.5mm-4mm<br>~~GO~~|0.5mm-5mm<br>~~GO~~|N/A<br>~~GO~~|
|Thermal Conductivity (W/mK)<br>~~GO~~<br>~~GG~~|4.0<br>~~GO~~<br>~~GG~~|7.8<br>~~GO~~<br>~~GG~~|10.0<br>~~GO~~<br>~~GG~~|Hot Disk<br>~~GO~~<br>~~GG~~|
|OperatingTemperature<br>~~GO~~|-65 to 125 DegC<br>~~GO~~|-65 to 125 DegC<br>~~GO~~|-40 to 125 DegC<br>~~GO~~|Laird Test Method<br>~~GO~~|
|Density (g/cc)<br>~~GO~~<br>~~Ce~~|3.1<br>~~GO~~<br>~~Ce~~<br>~~es~~|3.4<br>~~GO~~<br>~~Ce~~<br>~~es~~|3.7<br>~~GO~~<br>~~Ce~~|Helium Pycnometer<br>~~GO~~<br>~~Ce~~|
|Hardness (shore 00)<br>3 second/30 second<br>~~ee~~|1-4mm: 40/TBD<br>0.5-0.75mm: 70/TBD<br>~~ee~~<br>~~es~~|1-4mm: 40/TBD<br>0.5-0.75mm: 70/TBD<br>~~ee~~<br>~~es~~|1-5mm: 40/8<br>0.5-0.75mm: 70/50<br>~~ee~~|ASTM D2240<br>~~ee~~|
|OutgassingTML(weight %)|TBD<br>~~es~~|TBD<br>~~es~~|0.33|ASTM E595|
|OutgassingCVCM(weight %)<br>~~GG~~|TBD<br>~~GG~~|TBD<br>~~GG~~|0.15<br>~~GG~~|ASTM E595<br>~~GG~~|
|Thermal Resistance (℃in2/w)<br><br>1.5mm,30 PSI<br>~~CR~~|0.070|0.057|0.047|ASTM D5470|
|Dielectric Breakdown Voltage(kV/mm)<br>~~CR~~<br>~~Ce~~|7.5|7.9|7.5|ASTM D149|
|Dielectric Constant<br>~~CR~~<br>~~Ce~~<br>~~PC~~|TBD|TBD|9|ASTM D150|
|Volume Resistivity<br>~~Ce~~<br>~~PC~~|6 × 10^13|5 x 10^13|10^14|ASTM D257|



*Thickness Tolerance is +/- 10% 

**Silicone Free** 

## **Thermal Gap Filler Preliminary Data Sheet** 

## **AVAILIABILITY** 

## **STANDARD THICKNESSES** 

- 0.5mm (0.020”) to 4.0mm (0.160”) thick material available in 0.25mm (0.010”) increments.  Other custom thicknesses may be available upon request. 

## **OPTIONS** 

- DF – eliminate tack from one side 

- A1 – adhesive added to one side 

## **PART NUMBER SYSTEM** 

Tflex™ indicates Laird elastomeric thermal gap filler product line. SF10 is a silicone free 10 W/mk material. Thickness of the sheet in mm is listed after the material name. 

## **EXAMPLES** : 

- Tflex™ SF4,1.00 = 1.00mm thick Tflex SF4 material 

- Tflex™ SF7DF,1.00 = 1.00mm thick Tflex SF7 material with only one side tacky 

## THR-DS-Silicone Free Gap Filler 10-02-2024 

Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2015 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.