A17883-06

## **Tflex HD80000 Series Thermal Gap Filler** 

## **PRODUCT DESCRIPTION** 

Laird Tflex™ HD80000 is the latest product in the High Deflection gap filler series. Tflex™ HD80000 combines 6 W/mK thermal conductivity with superior pressure versus deflection characteristics.  The combination will allow minimal stress on components while also yielding low thermal resistance.  As a result, less mechanical and thermal stresses will be experienced within your device. 

The Tflex HD80000 material is extremely soft, but also can be handled and applied manually without the need to add a fiberglass or other reinforcement layer, maintaining the superior thermal performance of the product. 

## **FEATURES AND BENEFITS** 

- 6 W/mK thermal conductivity 

- Low pressure versus deflection 

- Excellent surface wetting for low contact resistance 

- No fiberglass reinforcement 

- Minimizes board and component stress 

- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH 

## **SPECIFICATIONS** 

|TYPICAL PROPERTIES|VALUE|TEST METHOD|
|---|---|---|
|**Construction & Composition**|Ceramic filled silicone sheet|N/A|
|**Color**|Teal|Visual|
|**Thickness Range**|1 mm (0.040”) - 5.0mm (0.20”)|N/A|
|**Thickness Tolerance**|+/- 10%|N/A|
|**Thermal Conductivity (W/mK)**|6.0|Hot Disk|
|**Density (g/cc)**|3.3|Helium Pycnometer|
|**Hardness (Shore 00, 3 sec)**|40|ASTM D2240|
|**Hardness (Shore 00, 30 sec)**|32|ASTM D2240|
|**Outgassing TML (weight %)**|0.3|ASTM E595|
|**Outgassing CVCM (weight %)**|0.04|ASTM E595|
|**Temperature Range**|-400C to 1500C|Laird Test Method|
|**Rth@ 50 mils, 10 psi**|0.330|ASTM D5470 (Modified)|
|**Dielectric Constant @ 1 MHz**|9|ASTM D150|
|**UL Flammability Rating**|V-0|UL 94|
|**Volume Resistivity**|1.06 x 1016|ASTM D257|



Americas: +1.866.928.8181 Europe: +49.(0).8031.2460.0 Asia: +86.755.2714.1166 

**www.lairdtech.com** 

## **Tflex[TM] HD80000 Series** 

## **Thermal Gap Filler** 

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Tflex HD80000 Thermal Resistance vs. Pressure<br>1.400 C-in2/W<br>1.200 C-in2/W<br>1.000 C-in2/W<br>\\<br>0.800 C-in2/W<br>0.600 C-in2/W<br>AW<br>0.400 C-in2/W0.200 C-in2/W mm B™SASX<br>0.000 C-in2/W<br>0 psi 5 psi 10 psi 15 psi 20 psi 25 psi 30 psi 35 psi 40 psi 45 psi 50 psi<br>40 mil 80 mil 120 mil 140 mil 160 mil 200 mil<br>**----- End of picture text -----**<br>


## **Tflex HD80000 Deflection vs. Pressure** 

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100%<br>90%<br>80% ee ea ——<br>70%<br>60% Zo.<br>50% ae<br>40% TD. EE<br>30% ELBE<br>20%<br>10%<br>0%<br>0 psi 10 psi 20 psi 30 psi 40 psi 50 psi 60 psi 70 psi 80 psi 90 psi 100 psi<br>40 mil 60 mil 80 mil 100 mil 140 mil 160 mil<br>**----- End of picture text -----**<br>


## **AVAILABILITY** 

## STANDARD THICKNESSES 

- 1.0 mm (0.040”) to 5.0 mm (0.200”) thick material available in 0.25mm (0.010”) increments 

- Available in standard sheet sizes of 9” x 9” or custom die cut parts 

## **PART NUMBER SYSTEM** 

Tflex™ indicates Laird elastomeric thermal gap filler product line.  HD8xxxxx indicates Tflex HD80000 product line with thickness in microns 

## EXAMPLES: 

- Tflex™ HD81000 = 1000 microns / 0.040” thick Tflex™ HD80000 material 

Tflex HD80000 A18003-00 Rev. D 

Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.