A17752-16

## **Tflex[TM] HD90000 Series Thermal Gap Filler** 

## **PRODUCT DESCRIPTION** 

Laird’s Tflex™HD90000 is the latest product in our High Deflection series. Tflex™HD90000 combines 7.5 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device. 

Tflex™HD90000 is available in thickness from 0.020” (500 µm) to 0.200” (5000 µm). Laird can provide material to meet your production needs in any region through our local production facilities. Please contact your local Laird sales or field engineering contact for samples or questions. 

## **FEATURES AND BENEFITS** 

- 7.5 W/mK thermal conductivity 

- Low pressure versus deflection 

- Excellent surface wetting for low contact resistance 

- Minimizes board and component stress 

- Low Outgassing 

- Low D3-D20 (< 20ppm) 

- Large tolerance applications 

- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH 

## **SPECIFICATIONS** 

|TYPICAL PROPERTIES|VALUE|TEST METHOD|
|---|---|---|
|**Construction & Composition**|Ceramic filled silicone sheet|N/A|
|**Color**|Grey|Visual|
|**Thickness Range**|0.020” (500µm) - 0.20” (5000µm)|N/A|
|**Thermal Conductivity (W/mK)**|7.5|Hot Disk|
|**Density (g/cc)**|3.5|Helium Pycnometer|
|**Hardness (Shore 00)**|500 and 750µm: 45|ASTM D2240|
||1000 µmand up: 32||
|**Outgassing TML (weight %)**|0.17|ASTM E595|
|**Outgassing CVCM (weight %)**|0.01|ASTM E595|
|**Temperature Range**|-50°C to 125°C|Laird Test Method|
|**Rth at 40 mils, 10 psi, 500 C**|0.198°C–in2/W|ASTM D5470|
|**Dielectric Constant at 1 MHz**|8.14|ASTM D150|
|**UL Flammability Rating**|V-0|UL 94|
|**Volume Resistivity**|8.73×1013 ohm-cm|ASTM D257|



Americas: +1.866.928.8181 Europe: +49.(0).8031.2460.0 Asia: +86.755.2714.1166 

**www.lairdtech.com** 

## **Tflex[TM] HD90000 Series Thermal Gap Filler** 

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**----- Start of picture text -----**<br>
Tflex HD90000 Thermal Resistance vs Pressure<br>0.600 C-in2/W<br>0.500 C-in2/W<br>0.400 C-in2/W<br>0.300 C-in2/W<br>0.200 C-in2/W<br>0.100 C-in2/W<br>0.000 C-in2/W<br>10 PSI 20 PSI 30 PSI 40 PSI 50 PSI<br>—~— Tflex HD90500 —~— Tflex HD91000 —~— Tflex HD91500<br>=O= Tflex HD92000 =O= Tflex HD92500 =O= Tflex HD95000<br>Tflex HD90000 Deflection vs Pressure<br>100%<br>90%80% SS<br>70% Se<br>60% i<br>50% /foZa<br>40% Ulf<br>30% VLet<br>20% A.<br>10% __—_3_ oe fae ae<br>0%<br>0 psi 20 psi 40 psi 60 psi 80 psi 100 psi<br>Tflex HD90500 Tflex HD90750 Tflex HD91000<br>o Tflex HD91500 _ Tflex HD92000 - Tflex HD92500<br>**----- End of picture text -----**<br>


## **AVAILABILITY** 

## STANDARD THICKNESSES 

- 0.020” (500 µm) up to 0.200” (5000 µm) thick material available in 250 µm increments 

- Available in standard sheet sizes of 18” x 18” (1000 µm and up only) and 9” x 9” or custom die cut parts. 

## **PART NUMBER SYSTEM** 

Tflex™indicates Laird elastomeric thermal gap filler product line. HD90000 indicates Tflex™HD90000 product line with thickness in microns EXAMPLES: 

- Tflex™HD91000= 1000 µm (0.040”) thick Tflex™HD90000 material 

- Tflex™HD95000= 5000 µm (0.200”) thick Tflex™HD90000 material 

## A17807-00 Tflex™HD90000 DS 06062019 

Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. 

## **Tflex[TM] HD90000 Series Thermal Gap Filler** 

## A17807-00 Tflex™HD90000 DS 06062019 

Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.