A17653-05

## Tflex[TM] HD700 Series Thermal Gap Filler 

## PRODUCT DESCRIPTION 

Laird Tflex™ HD700 Is our latest product in our High Deflection series.  Tflex™ HD700 combines 5 W/mK thermal conductivity with superior pressure versus deflection characteristics.  The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device. 

Tflex™ HD700 is available in thickness from 0.5mm (0.020”) to 5mm (0.200”).  Laird can provide material to meet your production needs in any region through our local production facilities. Please contact your local Laird sales or field engineering contact for samples or questions. 

## FEATURES AND BENEFITS 

- 5.0 W/mK thermal conductivity 

- Low pressure versus deflection 

- Excellent surface wetting for low contact resistance 

- Minimizes board and component stress 

- Large tolerance applications 

- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH 

## SPECIFICATIONS 

|TYPICAL PROPERTIES|VALUE|TEST METHOD|
|---|---|---|
|Construction & Composition|Ceramic filled silicone sheet|N/A|
|Color|Pink|Visual|
|Thickness Range|0.50mm (0.020”) 5.0mm (0.20”)|0.50mm (0.020”) 5.0mm (0.20”)<br>N/A|
|Thickness Tolerance|+/- 10%|N/A|
|Thermal Conductivity (W/mK)|5.0|ASTM D5470|
|Density (g/cc)|3.3|Helium Pycnometer|
|Hardness (Shore 00)|54|ASTM D2240|
|Outgassing TML (weight %)|0.23|ASTM E595|
|Outgassing CVCM (weight %)|0.07|ASTM E595|
|Temperature Range|-50°C to 200°C|Laird Test Method|
|Rth@ 40 mils, 10 psi|0.287°C–in2/W|ASTM D5470 (Modified)|
|Dielectric Constant @ 1 MHz|5.01|ASTM D150|
|UL Flammability Rating|V-0|UL 94|
|Volume Resistivity|1.4x 1014ohm-cm|ASTM D257|



Americas: +1.866.928.8181 Europe: +49.(0).8031.2460.0 Asia: +86.755.2714.1166 

www.lairdtech.com 

## Tflex[TM] HD700 Series 

## Thermal Gap Filler 

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**----- Start of picture text -----**<br>
Tflex HD700 Thermal Resistance vs Pressure<br>1.400 C-in2/W<br>1.200 C-in2/W<br>1.000 C-in2/W<br>0.800 C-in2/W<br>0.600 C-in2/W _—_<br>0.400 C-in2/W<br>0.200 C-in2/W<br>a ee a<br>0.000 C-in2/W<br>10 psi 20 psi 30 psi 40 psi 50 psi 60 psi 70 psi 80 psi 90 psi 100 psi<br>Tflex HD720 Tflex HD740 Tflex HD780<br>—o— Tflex HD7100 —~— Tflex HD7140 ——— Tflex HD7200<br>Tflex HD700 Deflection vs Pressure<br>80%<br>70%<br>60%<br>50%<br>40% = ia<br>30%<br>20%<br>10%<br>0%<br>0 psi 20 psi 40 psi 60 psi 80 psi 100 psi<br>Tflex HD720 Tflex HD740 Tflex HD780<br>Tflex HD7100 Tflex HD7140 Tflex HD7200<br>**----- End of picture text -----**<br>


## AVAILABILITY 

## STANDARD THICKNESSES 

- 0.5mm (0.020”) to 5.0mm (0.200”) thick material available in 0.25mm (0.010”) increments 

- Available in standard sheet sizes of 18” x 18” and 9” x 9” or custom die cut parts 

## OPTIONS 

- DC1 – eliminate tack from one side 

## PART NUMBER SYSTEM 

Tflex™ indicates Laird elastomeric thermal gap filler product line.  HD7xxx indicates Tflex HD700 product line with thickness in mils (0.001”) 

## EXAMPLES: 

- Tflex™ HD740 = 0.040” thick Tflex™ HD700 material 

- Tflex™ HD7100,DC1 = 0.10” thick Tflex™ HD700 material with DC1 option 

## A17758-00 Tflex HD700 DS 070518 

Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.