A16367-08

## Tflex SF600 Series Thermal Gap Filler 

## PRODUCT DESCRIPTION 

Tflex™ SF600 is a high performance, silicone-free thermal gap filler with a conductivity of 3 W/mK.  Tflex SF600 is designed for applications which are silicone sensitive. 

Tflex SF600 is naturally tacky on both sides, requiring no adhesive coating and allowing for the pad to be held in place during assembly.   For applications that may require rework, a differential tack option is available to remove the natural tack from one side of the material. 

## FEATURES AND BENEFITS 

*Ready for 5G 

- Silicone free 

- Differential tack option available for easy assembly and rework 

- Minimal compression set 

- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH 

SPECIFICATIONS 

|TYPICAL PROPERTIES<br>TYPICAL VALUE<br>TEST METHOD<br>~~|~~|TYPICAL PROPERTIES<br>TYPICAL VALUE<br>TEST METHOD<br>~~|~~|TYPICAL PROPERTIES<br>TYPICAL VALUE<br>TEST METHOD<br>~~|~~|
|---|---|---|
|Construction & Composition|Boron nitride filled sheet|N/A|
|Color|Rose|Visual|
|Thickness Range|0.25mm(0.010”)– 3.56mm(0.140”)|N/A|
|Thermal Conductivity (W/mK)|3.0|ASTM D5470|
|Density (g/cc)|1.27|Helium Pyncometer|
|Hardness(Shore 00)|80|ASTM D2240|
|OutgassingTML(weight %)|1.30|ASTM E595|
|OutgassingCVCM(weight %)|0.63|ASTM E595|
|Temperature Range|-20°C to 125°C|N/A|
|Rth@ 40 mils, 10 psi, 500C|0.81°C–in2/W|ASTM D5470|
|||(modified)|
|*Dielectric Constant@10GHz|3.5*|ASTM D150|
|UL FlammabilityRating|V-0|UL 94|
|Volume Resistivity|10^14 ohm-cm|ASTM D257|



Americas: +1.866.928.8181 Europe: +49.(0).8031.2460.0 Asia: +86.755.2714.1166 

www.lairdtech.com 

## Tflex SF600 Series Thermal Gap Filler 

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**----- Start of picture text -----**<br>
Tflex SF600 Thermal Resistance vs Pressure<br>2.50 C-in2/W<br>2.00 C-in2/W<br>1.50 C-in2/W<br>1.00 C-in2/W SQ<br>0.50 C-in2/W —<br>s<br>0.00 C-in2/W<br>0 psi 10 psi 20 psi 30 psi 40 psi 50 psi 60 psi 70 psi 80 psi<br>— SF620 a SF660 —_— SF680 — _ — SF6100 = SF6130<br>Tflex SF600 Deflection vs Pressure<br>100%<br>90%<br>80%<br>70%<br>60%<br>50% A ge S e — — — #><br>40%<br>30% JA pEE oe<br>20%<br>—<E ———<br>10%<br>0%<br>10 psi 20 psi 30 psi 40 psi 50 psi 60 psi 70 psi 80 psi 90 psi 100 psi<br>—— SF620 = SF640 o— SF660 — SF680<br>SF6100 SF6120 SF6140<br>**----- End of picture text -----**<br>


## AVAILABILITY 

## STANDARD THICKNESSES 

- 0.25mm (0.010”) to 3.56mm (0.140”) thick material available in 0.25mm (0.010”) increments 

- Available in standard sheet sizes of 18” x 18” and 9” x 9” or custom die cut parts 

## OPTIONS 

- DF – differential tack option available in thicknesses of 0.25 mm(0.010”) to 1.50mm(0.060”) 

## PART NUMBER SYSTEM 

Tflex indicates Laird elastomeric thermal gap filler product line.  SF6xx indicates Tflex SF600 product line with thickness in mils (0.001”) EXAMPLES: 

- Tflex SF640 = 0.040 inch thick Tflex SF600 material 

- Tflex SF660DF = 0.060 inch thick Tflex SF600 material with DF option 

## Tflex SF600 DS 071718 

Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end 

user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2015 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.