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A14691-36
Thermal Phase Change Sheet, 228.6 mm x 228.6 mm x 0.125 mm, 0.9 W/m.K
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: LAIRD
- Product type: Thermal Insulators
- Thickness: 0.125mm
- Volume Resistivity: 79000000000000ohm-cm
- Thermal Conductivity: 0.9W/m.K
- Insulator Body Material: Wax
| Delivery and price | |
|---|---|
| Units per pack | 50 |
| Price | 9.68 € |
| Current stock | 10+ |
| Lead time | 30 days |
TpcmTM FSF-52 ## Innovative **Technology** for a **Connected** World ## Tpcm™ FSF-52 Tpcm™ FSF-52 is a free standing film. It contains no substrate. At temperatures greater than 52°C, Tpcm™ FSF-52 changes into a molten state and, under low closure force, wets the heat sink and component surfaces to create a very thin, low thermal resistance interface. Tpcm™ FSF-52 is thixotropic and won’t flow from the interface. Tpcm™ FSF-52 has superior thermal performance comparable to the highest performing grease and phase change products available. Since it is a free standing film, it is easy to handle and is a great replacement for messy grease. Tpcm™ FSF-52 is available as individual die cut parts, kiss cut parts on rolls or sheets, and uncut rolls. Tpcm™ FSF-52 is 0.005” (0.125mm) thick. ## FEATURES AND BENEFITS - Superior thermal resistance after phase change at 52°C - Thixotropic - won’t bleed or flow out of the interface - Easy to handle and is a great messy grease replacement ## APPLICATIONS - Microprocessors - Chipsets - Graphic processing chips - Custom ASICS • Free standing film |**PROPERTIES**<br>**TPCM FSF-52**<br>**TEST METHOD**<br>Construction & Composition<br>Ceramic filled wax based free standing film<br>~~e~~~~**e**~~<br>~~e~~<br>~~ee~~|**PROPERTIES**<br>**TPCM FSF-52**<br>**TEST METHOD**<br>Construction & Composition<br>Ceramic filled wax based free standing film<br>~~e~~~~**e**~~<br>~~e~~<br>~~ee~~|**PROPERTIES**<br>**TPCM FSF-52**<br>**TEST METHOD**<br>Construction & Composition<br>Ceramic filled wax based free standing film<br>~~e~~~~**e**~~<br>~~e~~<br>~~ee~~| |---|---|---| |Color|White|Visual| |Thickness|0.005” (0.125mm)|| |Thickness Tolerance|+/-0.001” (0.025mm)|| |Density|2.0 g/cc|Helium Pycnometer| |UL Flammability Rating|94 V0|| |Phase Change Temperature|52°C|| |Thermal Conductivity|0.9W/mK|ASTM D5470| |Thermal Resistance||| |@ 10 psi<br>@ 50 psi|0.042 C-in2/W (0.27 C-cm2/W)<br>0.030 C-in2/W (0.19 C-cm2/W)|ASTM D5470 (modified)| |Dielectric constant:@ 1KHz / 1MH|3.8 / 3.4|ASTM D150| |Volume resistivity|7.9 x 1013|ASTM D257| **Standard sheet sizes:** 18”x18” & 9”x9”. Sheets are supplied with white release paper as top and bottom liner. Individual die cut shapes can also be supplied. **Rolls:** 18” x 250 ft on 3” core, 18” x 250 ft on 10” core. Rolled on one white liner for 3” cores. Rolled between two white liners for 10”cores and optional red liner can replace on white liner on 10” cores. ## **global solutions: local support TM** Americas: +1.800.843.4556 Europe: +49.8031.2460.0 Asia: +86.755.2714.1166 CLV-customerservice@lairdtech.com **www.lairdtech.com/thermal** ## THR-DS-Tpcm-FSF-52-0210 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2010 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
Updated at February 9, 2023
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