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A10241-09
THERMAL GAP FILLER, SILICONE, 3W/M.K
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: LAIRD
- Product type: Thermally Conductive Materials
- SVHC: No SVHC (07-Nov-2024)
- Thickness: 3.05mm
- Product Range: Tputty 502
- External Width: 229mm
- External Length: 229mm
- Thermal Impedance: -
- Conductive Material: Boron Nitride Filled Silicone Sheet
- Dielectric Strength: -
- Thermal Conductivity: 3W/m.K
| Delivery and price | |
|---|---|
| Units per pack | 1 |
| Price | 286.5 € |
| Current stock | 10+ |
| Lead time | 30 days |
## Tputty[TM] 502 Series Thermal Gap Filler ## PRODUCT DESCRIPTION Tputty™ 502 is best suited for applications where large tolerance differences create the need for compression of the interface material beyond 50% of its original thickness. Tputty™ 502 will ensure low pressures on the components being cooled. In conjunction with outstanding compression characteristics, Tputty™ 502 has a high thermal conductivity, resulting in very low thermal resistance. Tputty™ 502 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance. ## FEATURES AND BENEFITS - 3 W/mK thermal conductivity - Soft and ultra high compressibility for low stress applications - Fiberglass layer for reinforcement and better handling capabilities - Low Dielectric Constant - Environmentally friendly solution that meets regulatory requirements including RoHS and REACH ## SPECIFICATIONS |TYPICAL PROPERTIES|VALUE|TEST METHOD| |---|---|---| |Construction & Composition|Reinforced boron nitride filled|N/A| ||silicone sheet|| |Color|White|Visual| |Thickness Range|0.50mm (0.020”) 5.0mm (0.20”)|0.50mm (0.020”) 5.0mm (0.20”)<br>N/A| |Thickness Tolerance|+/- 10%|N/A| |Thermal Conductivity (W/mK)|3.0|ASTM D5470| |Density (g/cc)|1.37|Helium Pycnometer| |Hardness (Shore 00)|14|ASTM D2240| |Outgassing TML (weight %)|0.11|ASTM E595| |Outgassing CVCM (weight %)|0.06|ASTM E595| |Temperature Range|-45°C to 200°C|Laird Test Method| |Rth@ 40 mils, 10 psi|0.49°C–in2/W|ASTM D5470 (Modified)| |Dielectric Constant @ 10 GHz|3.6|ASTM D150| |UL Flammability Rating|V-0|UL 94| |Volume Resistivity|5 x 1013ohm-cm|ASTM D257| Americas: +1.866.928.8181 Europe: +49.(0).8031.2460.0 Asia: +86.755.2714.1166 www.lairdtech.com ## Tputty[TM] 502 Series Thermal Gap Filler ## AVAILABILITY ## STANDARD SHEET SIZES - 0.5mm (0.020”) to 5.0mm (0.200”) thick material available in 0.25mm (0.010”) increments - Available in standard sheet sizes of 18” x 18” and 9” x 9” or custom die cut parts ## REINFORCEMENT - Tputty 502 sheets are reinforced on both sides with fiberglass ## BULK - Tputty™ 502 is available in bulk form in the following sizes: 100 cc Jar 500 cc Jar 1000 cc Jar ## PART NUMBER SYSTEM - Tputty™ indicates Laird elastomeric thermal gap filler product line. Tputty 502FG2,xxx indicates Tputty 502 product line with Fiberglass on both sides, thickness in mils (0.001”) - EXAMPLES: Tflex™ Tputty 502FG2,040= 0.040” thick Tputty™ 502 material ## Tputty 502 DS 12-6-17 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
Updated at April 15, 2026
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