8000072515

**Data sheet** 

## **MHS 5/12 W T3 B T** 

**Weidmüller Interface GmbH & Co. KG** Klingenbergstraße 26 D-32758 Detmold Germany 

www.weidmueller.com 

## **Product image** 

## **OMNIMATE[®] 4.0 - the next evolution step** 

OMNIMATE[®] 4.0 follows the trend of One Cable Technology (OCT). The modular concept enables the fast configuration of hybrid interfaces, which transmit data, signals and energy in a single connector. As a result, you can reduce the cabling effort in a wide variety of applications, simplify maintenance and accelerate automation processes. The unique SNAP IN connection is the backbone and speeds up the wiring process. 

- Flexible combination options for power, signal and data transmission 

- Future-proof Single-Pair Ethernet technology 

## **The fastest connection yet** 

- Fast, safe, and tool-free wiring due to unique SNAP IN connection 

- Ready for Robot through "wire ready" delivery with open clamping point 

- Optical and acoustic feedback indicates proper wiring 

## **Create your own configuration** 

## **General ordering data** 

- Flexible configuration and ordering via the Weidmüller Configurator (WMC) 

- Dispatch within three days – even for individually configured products 

- Automatic offer preparation for the configurated product 

## **Simply configuration of modular hybrid connectors** 

|Version|PCB plug-in connector, male header, THT/THR|
|---|---|
||solder connection, Pitch in mm (P): 5.00 mm,|
|Order No.<br>Type|Number ofpoles: 12, 270°, Tube<br>8000072515<br>MHS 5/12 W T3 B T|
|GTIN(EAN)|4064675330943|
|Qty.|8pc(s).|
|Product data|IEC: 400 V / 26.8 A<br>UL: 300 V/18.5 A|
|Packaging|Tube|



Creation date October 27, 2022 8:44:40 AM CEST 

Catalogue status 25.10.2022 / We reserve the right to make technical changes. 

1 

**Data sheet** — **MHS 5/12 W T3 B T** 

## **Weidmüller Interface GmbH & Co. KG** 

Klingenbergstraße 26 D-32758 Detmold Germany 

## **Technical data** ~~Ld~~ 

~~a~~ www.weidmueller.com 

## **Dimensions and weights** 

|Depth|14 mm|Depth(inches)|0.551 inch|
|---|---|---|---|
|Height|14.1 mm|Height(inches)|0.555 inch|
|Height of lowest version|10.9 mm|Width|61.38 mm|
|Width (inches)|2.417 inch|Net weight|17.435 g|
|**System specifications**||||
|Type of connection||Mounting onto the PCB|THT/THR solder|
||Board connection||connection|
|Pitch in mm(P)|5 mm|Pitch in inches(P)|0.197 inch|
|Outgoingelbow|270°|Number ofpoles|12|
|Number of solderpinsperpole|1|Solderpin length(l)|3.2 mm|
|Solderpin dimensions|1.0 x 1.0 mm|Solder eyelet hole diameter(D)|1.4 mm|
|Solder eyelet hole diameter tolerance(D)<br>+ 0,1 mm||Outside diameter of solderpad|2.3 mm|
|Template aperture diameter|2.1 mm|L1 in mm|55 mm|
|L1 in inches|2.165 inch|Number of rows|1|
|Pin series quantity||Touch-safe protection acc. to DIN VDE|Touch-safe above the|
||1|57 106|printed circuit board|
|Touch-safe protection acc. to DIN VDE||Protection degree||
|0470|IP 20||IP20|
|Volume resistance|≤5 mΩ|Pluggingcycles|≥ 25|
|Plugging force/pole, max.|8.5 N|Pulling force/pole, max.|8.5 N|
|**Material data**||||
|Insulatingmaterial|PA 9T|Colour|black|
|Colour chart(similar)|RAL 9011|Insulatingmaterialgroup|I|
|Comparative TrackingIndex(CTI)|≥ 600|Moisture Level(MSL)|1|
|UL 94 flammabilityrating|V-0|Contact base material|CuMg|
|Contact material|CuMg|Contact surface|tinned|
|Tinningtype|matt|Storage temperature,min.|-25 °C|
|Storage temperature,max.|55 °C|Operatingtemperature,min.|-50 °C|
|Operating temperature, max.|100 °C|||
|**Rated data acc. to IEC**||||
|tested acc. to standard||Rated current, min. number of poles||
||IEC 60664-1,IEC 61984|(Tu=20°C)|26.8 A|
|Rated current, max. number of poles||Rated current, min. number of poles||
|(Tu=20°C)|19.7 A|(Tu=40°C)|23.1 A|
|Rated current, max. number of poles||Rated voltage for surge voltage class /||
|(Tu=40°C)|16.9 A|pollution degree II/2|400 V|
|Rated voltage for surge voltage class /||Rated voltage for surge voltage class /||
|pollution degree III/2|320 V|pollution degree III/3|250 V|
|Rated impulse voltage for surge voltage||Rated impulse voltage for surge voltage||
|class/ pollution degree II/2|4 kV|class/ pollution degree III/2|4 kV|
|Rated impulse voltage for surge voltage||Clearance, min.||
|class/contamination degree III/3|4 kV||4 mm|
|Creepage distance, min.|5.4 mm|||
|**Rated data acc. to UL 1059**||||
|Rated voltage(UsegroupB/UL 1059)|300 V|Rated voltage(UsegroupD/UL 1059)|300 V|
|Rated voltage(UsegroupF/UL 1059)|420 V|Rated current(UsegroupB/UL 1059)|18.5 A|
|Rated current(UsegroupD/UL 1059)|10 A|Clearance distance,min.|4 mm|
|Creepage distance, min.|5.6 mm|||



Creation date October 27, 2022 8:44:40 AM CEST 

Catalogue status 25.10.2022 / We reserve the right to make technical changes. 

2 

**Data sheet** — **MHS 5/12 W T3 B T** 

## **Weidmüller Interface GmbH & Co. KG** 

Klingenbergstraße 26 D-32758 Detmold Germany 

## **Technical data** ~~Ld~~ 

~~a~~ www.weidmueller.com 

## **Classifications** 

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|||||
|---|---|---|---|
|ETIM 6.0|EC002637|ETIM 7.0|EC002637|
|ETIM 8.0|EC002637|ECLASS 9.0|27-44-04-02|
|ECLASS 9.1|27-44-04-02|ECLASS 10.0|27-44-04-02|
|ECLASS 11.0|27-46-02-01|ECLASS 12.0|27-46-02-01|

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## **Important note** 

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||||
|---|---|---|
|IPC conformity|Conformity: The products are developed, manufactured and delivered according international recognized|
|standards and norms and comply with the assured properties in the data sheet resp. fulfill decorative properties|
|in accordance with IPC-A-610 "Class 2". Further claims on the products can be evaluated on request.|
|Notes|•|Rated current related to rated cross-section & min. No. of poles.|
|•|P on drawing = pitch|
|•|Rated data refer only to the component itself. Clearance and creepage distances to other components are to|
|be designed in accordance with the relevant application standards.|
|•|Diameter of solder eyelet D = 1.4+0.1mm|

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• Long term storage of the product with average temperature of 50 °C and average humidity 70%, 36 months 

## **Downloads** 

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|---|---|
|Engineering Data|CAD data -- STEP|
|Catalogues|Catalogues in PDF-format|

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Creation date October 27, 2022 8:44:40 AM CEST 

Catalogue status 25.10.2022 / We reserve the right to make technical changes. 

3 

**Data sheet** 

## **MHS 5/12 W T3 B T** 

**Weidmüller Interface GmbH & Co. KG** Klingenbergstraße 26 D-32758 Detmold Germany 

www.weidmueller.com 

## **Drawings** 

## **Product image** 

## **Dimensional drawing** 

Creation date October 27, 2022 8:44:40 AM CEST 

Catalogue status 25.10.2022 / We reserve the right to make technical changes. 

4 

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## 

**Weidmüller Interface GmbH & Co. KG** Klingenbergstraße 16 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com 

## **Single Wave:** 

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Contact time appr. 3 sec.<br>260 255 °C o s , 260 °C<br>240 250 °C I ~,.N\<br>\ [‘]<br>220 \\ [N] N [N] N<br>LON<br>200180 .\1\\ [.][N] SS\SsN.<br>160 \\\Str ‘\‘S‘S<br>wT “oy, “w<br>140 od° oNs\ "he,a> S.ss<br>12010080 Preheating :o.;7” .’Pua&&Pia4.-As-A.ue<ormeee7eeerrccCi7”Y11hae.~s- 7   appr. 150 °C \ny\\ny\\‘ wy£2.2>""y“ Cooling rate < 6 °K/s SS“>soy.‘s>“sDo~aTa“ss—m~. =~areTaaaooo-<br>;Fe ./4 -.- S.‘<br>6040 ¢Fa¢?me47soMosenooheSa--o “7“7“ ‘‘‘s.SS —=a-. Typical process        Prozess limits<br>20 Sa Heating rate < 3 °K/s “es Temperature on board<br>0<br>0  20  40  60  80  100  120  140  160  180  200  220  240<br>time [s]<br>Double Wave:<br>260 255 °C — 260 °C<br>Total contact time max. 10 sec. Q 250 °C<br>240<br>220<br>200<br>180<br>\<br>160 eee sue\\<br>140120100 Preheating a?’.a”oa a..ue °°&.SS£ 7*.“eS?ny“ocd;7 appr. 150°C [RO\‘\‘\‘‘ NS>NOS.°WSesyO~~>-°°~~ ~~~<br>8060 a?-o7747 *Aefre/&°oo&&4aea7”’ \‘‘‘‘\ Cooling rate < 6 °K/s ‘‘ >cS““Sse°“asD>,-_;-:<br>o* A. “ Typical process<br>40 Prie"7-- neeiteer<r — Process limits<br>20 Heating rate < 3 °K/s Temperature on board<br>0<br>0  20  40  60  80  100  120  140  160  180  200  220  240<br>time [s]<br>Temperature [°C]<br>Temperature  [°C]<br>**----- End of picture text -----**<br>


## 

Wired connection elements should be processed in accordance with the DIN EN 61760-1 standard. We have included two recommendations for practical wave soldering profiles, with which Weidmüller PCB terminals and connectors are qualified. 

- PCB thickness 

- Proportion of Cu in the layers 

- Single/double-sided assembly 

- Product range 

- Heating and cooling rates 

soldering temperature of 260°C. In practice, the maximum soldering temperature is quite often well below the above maximum profile. 

We reserve the right to make technical changes. 

## 

**Weidmüller Interface GmbH & Co. KG** Klingenbergstraße 16 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com 

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300<br>oe 254 °C<br>250 245 °C - aa<br>235 °C oo x<br>Melting point lead-free solder paste<br>217 o awe Ss<br>190 °C approx.  XN XN<br>200 vane yr 60 s > 217 °C XN<br>XN \<br>180 °C Pad , N \<br>----7 _-7 \ \ \ \<br>150 77 \ N\<br>preheating , o7 a Cooling rate: < 6 °K/s . ‘ \<br>100 o \<br>of \<br>o a \<br>aa Heating rate: < 3 °K/s \<br>a \<br>50 &<br>a<br>& — Continuous line: Typical process<br>a 7 -_ — Dotted line:   Process limits<br>0<br>0  50  100  150  200  250  300  350<br>Temperature [°C]<br>**----- End of picture text -----**<br>


**Time [sec]** 

## 

But there are more than one correct answer: The diagram of temperature-on-time is related to processing features of solder paste and to maximum load of components. 

We have to consider the following parameters: 

- Time for pre heating 

- Maximum temperature 

- Time above melting point 

- Time for cooling 

- Maximum heating rate 

- Maximum cooling rate 

prepared smoothly for the solder phase. Heating rate is typically  ≤ +3K/s. In parallel the solder paste is ‚activated’. The time above melting point of 217°C the paste gets liquid and components and boards begin to connect. The maximum temperature of 245°C to 254°C should stay between 10 and 40 seconds. In the cooling phase at ≥ -6K/s solder is cured. Board and components cool down while avoiding cold cracks. 

We reserve the right to make technical changes.