5525DSO-SB005GS

## WVRoHS 

## MS5525DSO 

## (Digital Small Outline) 

## SPECIFICATIONS 

- **Integrated Digital Pressure Sensor** 

   - **∆Σ ADC)** 

- **Fast Conversion Down to 1 ms** 

- **Low Power, 1 µA (standby < 0.15 µA)** 

- **Supply Voltage: 1.8 to 3.6V** 

- **Pressure Range: 1 to 30 PSI** 

- **I[2] C and SPI Interface** 

## FEATURES 

- Small Outline IC Package 

- Barbed Pressure Ports 

- Low Power, High Resolution ADC 

- Digital Pressure and Temperature Outputs 

## APPLICATIONS 

- Factory Automation 

- Altitude and Airspeed Measurements 

- Medical Instruments 

The MS5525DSO is a new generation of Digital Small Outline pressure sensors from MEAS with SPI and I[2] C bus interface designed for high volume OEM users. The sensor module includes a pressure sensor and an ultra-low power 24-bit ∆Σ ADC with internal factory calibrated coefficients. It provides a 24-bit digital pressure and temperature value and different operation modes that allow the user to optimize for conversion speed and current consumption. The MS5525DSO can be interfaced to virtually any microcontroller. The communication protocol is simple, without the need of programming internal registers in the device. 

- Leak Detection 

This new sensor module generation is based on leading MEMS technology and latest benefits from TE proven experience and know-how in high volume manufacturing of pressure modules, which have been widely used for over a decade. 

The rugged engineered thermoplastic transducer is available in single and dual port configurations, and can measure absolute, gauge, compound, and differential pressure from 1 to 30psi. 

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MS5525DSO (Digital Small Outline) 

## STANDARD RANGES (PSI) 

|**FS Pressure**|**Absolute**|**Gauge**|**Differential**|
|---|---|---|---|
|001|||DB, SB,ST, DH|
|002||DB, SB, ST, DH,FT|DB, SB,ST, DH|
|005||DB, SB, ST, DH,FT|DB, SB,ST ,DH|
|015|DB, FB, DH, FT|DB, SB, ST, DH,FT|DB, DH|
|030|DB, FB, DH, FT|DB, SB, ST, DH,FT|DB, DH|



See Package Configurations:  DB= Dual Barb, DH= Dual Hole, SB=Single Barb, ST=Single Tube, FT=Front Side Tube, FB=Front Single Barb 

## ABSOLUTE MAXIMUM RATING 

|**Parameter**|**Conditions**|**Min**|**Max**|**Unit**|**Symbol/Notes**|
|---|---|---|---|---|---|
|**Supply Voltage**|TA= 25°C|-0.3|3.6|V|**VDD**|
|**Storage Temperature**||-40|125|°C||
|**Overpressure**|TA= 25 °C, both Ports||60|psi||
|**Burst Pressure**|TA= 25 °C, Port 1|||psi|See Table 1|
|**ESD**|HBM|-4|+4|kV|EN 61000-4-2|
|**Solder Temperature**||250°C, 5 sec max.||||



## **Table 1- BURST PRESSURE BY RANGE AND PORT DESIGNATION.** 

|**Range**|**Port 1**|**Port 1**|**Port 2**|**Port 2**|**Unit**|
|---|---|---|---|---|---|
|**001**|10||10||psi|
|**002**|20||20||psi|
|**005**|50||15||psi|
|**015**|120|120|60||psi|
|**030**|120|120|120|120|psi|



## ENVIRONMENTAL SPECIFICATIONS 

|**Parameter**|**Conditions**|
|---|---|
|**Mechanical Shock**|Mil Spec 202F, Method 213B, Condition C, 3 Drops|
|**Mechanical Vibration**|Mil Spec 202F, Method 214A, Condition 1E, 1Hr Each Axis|
|**Thermal Shock**|100 Cycles over Storage Temperature, 30 minute dwell|
|**Life**|1 Million FS Cycles|
|**MTTF**|>10Yrs, 70 ºC, 10 Million Pressure Cycles,  120%FS|
||Pressure|
|**MSL**|Moisture Sensitivity Level is 3|



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MS5525DSO (Digital Small Outline) 

## PERFORMANCE SPECIFICATIONS 

|PERFORMANCE SPECIFICATIONS|PERFORMANCE SPECIFICATIONS|PERFORMANCE SPECIFICATIONS||||
|---|---|---|---|---|---|
|**Unless otherwise specified: Supply Voltage1 3.0 VDC, Reference Temperature: 25°C**||||||
|**PARAMETERS**|**MIN**|**TYP**|**MAX**|**UNITS**|**NOTES**|
|Operating Voltage|1.8||3.6|||
|ADC|||24|bits||
|Pressure Accuracy||See Table 2 Below||%FS|2,5|
|Total Error Band (TEB)|-2.5||2.5|%FS|3|
|Temperature Accuracy (Reference Temperature)||±1.5||ºC|4,5|
|Temperature Accuracy||±2.5||ºC|4,5|
|Supply Current|See OSR Table Below|||mA||
|Compensated Temperature|0||85|ºC||
|Operating Temperature|-40||+125|ºC||
|Conversion Time|See OSR Table Below|||ms||
|Weight||3||grams||
|Media|Non-Corrosive Dry Gases Compatible with Silicon, Glass, LCP, RTV,|||||
||Gold, Thermo-Epoxy, Silicone Gel, Aluminum and Epoxy.  See|||||



“Wetted Material by Port Designation” chart. 

## **Notes** 

1. Proper operation requires an external capacitor placed as shown in Application Circuit. Output is not ratiometric to supply voltage. 

2. The maximum deviation from a best fit straight line(BFSL) fitted to the output measured over the pressure range at 25°C. Includes all errors due to pressure non-linearity, hysteresis, and non-repeatability. 

3. The maximum deviation from ideal output with respect to input pressure and temperature over the compensated temperature range. Total error band (TEB) includes all accuracy errors, thermal errors over the compensated temperature range, span and offset calibration tolerances. TEB values are valid only at the calibrated supply voltage. 

4. The deviation from a best fit straight line (BFSL) from 25°C. to 85°C. 

5. Six coefficients must be read by microcontroller software and are used in a mathematical calculation for converting D1 and D2 into compensated pressure and temperature values. 

## **Table 2- TYPICAL ACCURACY SPECIFICATION BY PRESSURE RANGE** 

|**Range**|**Port 1**|**Port 2**|**Unit**|
|---|---|---|---|
|**001**|±0.25|±1.0|%FSS|
|**002**|±0.25|±0.5|%FSS|
|**005**|±0.50|±1.0|%FSS|
|**015**|±0.25|±0.25|%FSS|
|**030**|±0.25|±0.25|%FSS|



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MS5525DSO (Digital Small Outline) 

## OVERSAMPLNG RATIO (OSR) PERFORMANCE CHARACTERISTICS 

## **SUPPLY CURRENT CHARACTERISTICS** 

|**Parameter**|**Symbol**|**Conditions**||**Min.**|**Typ.**|**Max**|**Unit**|
|---|---|---|---|---|---|---|---|
|||OSR|4096||12.5|||
|Supply current<br>(1 sample per sec.)|IDD||2048<br>1024<br>512||6.3<br>3.2<br>1.7||µA|
||||256||0.9|||
|Peak supply current||during conversion|||1.4||mA|
|Standby supply current||at 25°C|||0.02|0.14|µA|



## **ANALOG DIGITAL CONVERTER (ADC)** 

|**Parameter**|**Symbol**|**Conditions**||**Min.**|**Typ.**|**Max**|**Unit**|
|---|---|---|---|---|---|---|---|
|||OSR|4096|7.40|8.22|9.04||
||||2048|3.72|4.13|4.54||
|Conversion time|tc||1024|1.88|2.08|2.28|ms|
||||512|0.95|1.06|1.17||
||||256|0.48|0.54|0.60||



## INPUT/OUTPUT SPECIFICATIONS 

## **DIGITAL INPUTS (CSB, I[2] C, DIN, SCLK)** 

|**Parameter**|**Symbol**|**Conditions**|**Min.**|**Typ.**|**Ma**|**Unit**|
|---|---|---|---|---|---|---|
|Serial data clock|SCLK|SPI protocol|||2|MHz|
|Serial data clock|SCL|I2C protocol|||400|kHz|
|Input high voltage|VIH|Pins CSB|80%||100% VDD|V|
|Input low voltage|VIL||V<br>0%||20% VDD|V|
|Input leakage current|Ileak25°C<br>Ileak85°C|at 25°C|||0.1<br>5|µA|
|Input capacitance|CIN||||6|pF|



## **PRESSURE OUTPUTS (I[2] C, DOUT)** 

|**Parameter**|**Symbo**|**Conditions**|**Min.**|**Ty**|**M**|**Unit**|
|---|---|---|---|---|---|---|
|Output high voltage|VOH|Isource= 0.6 mA|80% VDD||100%|V|
|Output low voltage|VOL|Isink= 0.6 mA|0% VDD||20% VDD|V|
|Load capacitance|CLOAD||||1|pF|



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MS5525DSO (Digital Small Outline) 

## FUNCTIONAL DESCRIPTION 

## **GENERAL** 

The MS5525DSO consists of a piezo-resistive sensor and a sensor interface IC. The main function of the MS5525DSO is to convert the uncompensated analog output voltage from the piezo-resistive pressure sensor to a 24-bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor. 

## **FACTORY CALIBRATION** 

Every module is individually factory calibrated at two temperatures and three pressures. As a result, six coefficients necessary to compensate for process variations and temperature variations are calculated and stored in the 128-bit PROM of each module. These bits, partitioned into six coefficients, C1 through C6, must be read by the microcontroller software and used in the program converting D1 and D2 into compensated pressure and temperature values. 

The coefficients C0 and C7 are for factory calibration and CRC. 

## **SERIAL INTERFACE** 

The MS5525DSO has built in two types of serial interfaces: SPI and I[2] C. Pulling the Protocol Select pin PS to low selects the SPI protocol, pulling PS to high activates the I[2] C bus protocol. 

|**Pin PS**|**Mode**|**Pins used**|
|---|---|---|
|High|I<br>2C|SDA,SCL CSB|
|Low|SPI|SDI, SDO, SCLK, CSB|



## **SPI MODE** 

The external microcontroller clocks in the data through the input SCLK (Serial CLocK) and SDI (Serial Data In). In the SPI mode module can accept both mode 0 and mode 3 for the clock polarity and phase. The sensor responds on the output SDO (Serial Data Out). The pin CSB (Chip Select) is used to enable/disable the interface, so that other devices can talk on the same SPI bus. The CSB pin can be pulled high after the command is sent or after the end of the command execution (for example end of conversion). The best noise performance from the module is obtained when the SPI bus is idle and without communication to other devices during the ADC conversion. 

## **I[2] C MODE & ADDRESSING** 

The external microcontroller clocks in the data through the input SCL (Serial CLock) and SDA (Serial DAta). The sensor responds on the same pin SDA which is bidirectional for the I[2] C bus interface. So this interface type uses only 2 signal lines and does not require a chip select, which can be favorable to reduce board space.  In I[2] C -Mode the complement of the pin CSB (Chip Select) represents the LSB of the I[2] C address. It is possible to use two sensors with two different addresses on the I[2] C bus. The pin CSB must be connected to VDD or GND do not leave these pins unconnected. 

|**Pin CSB**|**Address(7 bits)**|
|---|---|
|High|0x76|
|Low|0x77|



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MS5525DSO (Digital Small Outline) 

## **COMMANDS** 

The MS5525DSO has only five basic commands: 

1.   Reset 

2.   Read PROM (128 bit of calibration words) 

3.   D1 conversion 

4.   D2 conversion 

5.   Read ADC result (24 bit pressure / temperature) 

Size of each command is 1 byte (8 bits) as described in the table below. After ADC read commands the device will return 24 bit result and after the PROM read 16bit result. The address of the PROM is embedded inside of the PROM read command using the Ad2, Ad1 and Ad0 bits. 

||**Command byte**|**Command byte**|**Command byte**|**Command byte**|**Command byte**|**Command byte**|**Command byte**|**Command byte**|**hex value**|
|---|---|---|---|---|---|---|---|---|---|
|Bit number|0|1|2|3|4|5|6|7||
|Bit name|PRM|COV|-|Typ|Ad2/<br>Os2|Ad1/<br>Os1|Ad0/<br>Os0|Stop||
|Command||||||||||
|Reset|0|0|0|1|1|1|1|0|0x1E|
|Convert D1(OSR=256)|0|1|0|0|0|0|0|0|0x40|
|Convert D1(OSR=512)|0|1|0|0|0|0|1|0|0x42|
|Convert D1(OSR=1024)|0|1|0|0|0|1|0|0|0x44|
|Convert D1(OSR=2048)|0|1|0|0|0|1|1|0|0x46|
|Convert D1(OSR=4096)|0|1|0|0|1|0|0|0|0x48|
|Convert D2(OSR=256)|0|1|0|1|0|0|0|0|0x50|
|Convert D2(OSR=512)|0|1|0|1|0|0|1|0|0x52|
|Convert D2(OSR=1024)|0|1|0|1|0|1|0|0|0x54|
|Convert D2(OSR=2048)|0|1|0|1|0|1|1|0|0x56|
|Convert D2(OSR=4096)|0|1|0|1|1|0|0|0|0x58|
|ADC Read|0|0|0|0|0|0|0|0|0x00|
|PROM Read|1|0|1|0|Ad2|Ad1|Ad0|0|0xA0 to<br>0xAE|



Figure 1: Command structure 

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MS5525DSO (Digital Small Outline) **Start 5525DSO-pp005GS Example Tmin=-40°C, Tmax=125°C Read Calibration Data from PROM Size[[1]      ] Value Recommended Example/ Variable Coefficient Description Variable Type [Bit] Min Max Typical C1 Pressure Sensitivity | SENST1 unsigned int 16 16 0 65535 36402 16 C2 Pressure Offset | OFFT1 unsigned int 16 0 65535 39473 16 C3 Temperature Coefficient of Pressure Sensitivity | TCS unsigned int 16 0 65535 40393 16 C4 Temperature Coefficient of Pressure Offset | TCO unsigned int 16 0 65535 29523 16 C5 Reference Temperature | TREF unsigned int 16 0 65535 29854 16 C6 Temperature Coefficient of Temperature | TEMPSENS unsigned int 16 0 65535 21917 Read Digital Pressure and Temperature Data D1 Digital Pressure Value unsigned int 32 24 0 16777216 5240585 D2 Digital Temperature Value unsigned int 32 24 0 16777216 3869265** ~~am~~ **Calculate Temperature dT Difference between actual and reference temperature signed int 32 25 -16776960 16777216 47953 dT = D2 - TRE F = D2 - C5 * 2[Q5] TEMP Measured temperature 2501 TEMP=20°C+dT*TEMPSENS=2000+dT*C6/2[Q6] signed int 32 41 -4000 12500 ° =25.01 C Calculate Temperature Compensated Pressure OFF Offset at actual temperature OFF=OFFT1+TCO * dT=C2*2[Q2] +(C4*dT)/2[Q4] signed int 64 41 5218046194 SENS Sensitivity at actual temperature signed int 64 41 2415906558 SENS=SENST1+TCS*dT=C1*2[Q1] +(C3*dT)/2[Q3] P Temperature Compensated Pressure signed int 32 61 24996 P=D1*SENS-OFF=(D1*SENS/2[21] -OFF)/2[15] =2.4996psi Display Pressure and Temperature Value** ~~==~~ Figure 2:  Flow chart for pressure and temperature reading and software compensation. SENSOR SOLUTIONS ///MS5525DSO 11/2018 

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MS5525DSO (Digital Small Outline) 

## **Qx Coefficients Matrix by Pressure Range** 

|**Part Number**<br>~~es~~|**Pmin**<br>~~es~~|**Pmax**<br>~~es~~|**Q1**<br>~~ee~~|**Q2**<br>~~ee~~|**Q3**<br>~~GG~~|**Q4**<br>~~GG~~|**Q5**<br>~~GG~~|**Q6**|**TRES**<br>**(°C)**|**PRES**<br>**(PSI)**|
|---|---|---|---|---|---|---|---|---|---|---|
|**5525DSO-pp001DS**<br>~~es~~|**-1**<br>~~es~~|**1**<br>~~es~~|**15**<br>~~ee~~|**17**<br>~~ee~~|**7**<br>~~GG~~|**5**<br>~~GG~~|**7**<br>~~GG~~|**21**|**0.01**|**0.0001**|
|**5525DSO-pp002GS**<br>~~es ~~<br>~~ee~~|**0**<br> ~~es ~~<br>~~ee~~|**2**<br> ~~es ~~<br>~~es~~|**14**<br> ~~ee ~~<br>~~ee Ge~~|**16**<br> ~~ee ~~<br>~~Ge~~|**8**<br> ~~GG~~<br>~~ee~~|**6**<br>~~GG~~|**7**<br>~~GG~~|**22**|**0.01**|**0.0001**|
|**5525DSO-pp002DS**<br>~~ee ~~<br>~~es~~<br>~~es~~|**-2**<br> ~~ee~~<br>~~ee~~<br>~~es~~|**2**<br>~~es ~~<br>~~es~~<br>~~es~~|**16**<br> ~~ee Ge~~<br>~~ee~~<br>~~ee~~|**18**<br>~~Ge ~~<br>~~ee~~|**6**<br> ~~ee~~<br>~~OO~~|**4**<br>~~OO~~|**7**<br>~~OO~~|**22**|**0.01**|**0.0001**|
|**5525DSO-pp005GS**<br>~~es ~~<br>~~es~~<br>~~es~~|**0**<br> ~~ee~~<br>~~es~~<br>~~es~~|**5**<br>~~es ~~<br>~~es~~<br>~~es~~|**16**<br> ~~ee ~~<br>~~ee~~<br>~~ee~~|**17**<br> ~~ee~~<br>~~ee~~|**6**<br>~~OO~~<br>~~GG~~|**5**<br>~~OO~~<br>~~GG~~|**7**<br>~~OO~~<br>~~GG~~|**21**|**0.01**|**0.0001**|
|**5525DSO-pp005DS**<br>~~es ~~<br>~~es~~|**-5**<br> ~~es ~~<br>~~es~~|**5**<br> ~~es ~~<br>~~es~~|**17**<br> ~~ee~~<br>~~ee~~|**19**<br>~~ee~~|**5**<br>~~OO~~<br>~~GG~~|**3**<br>~~OO~~<br>~~GG~~|**7**<br>~~OO~~<br>~~GG~~|**22**|**0.01**|**0.0001**|
|**5525DSO-pp015GS**<br>~~es ~~<br>~~ee~~|**0**<br> ~~es ~~<br>~~ee~~|**15**<br> ~~es ~~<br>~~es~~|**16**<br> ~~ee ~~<br>~~ee Ge~~|**17**<br> ~~ee ~~<br>~~Ge~~|**6**<br> ~~GG~~<br>~~ee~~|**5**<br>~~GG~~|**7**<br>~~GG~~|**22**|**0.01**|**0.0001**|
|**5525DSO-pp015AS**<br>~~ee ~~<br>~~es~~<br>~~es~~|**0**<br> ~~ee~~<br>~~es~~<br>~~es~~|**15**<br>~~es ~~<br>~~es~~<br>~~ee~~|**16**<br> ~~ee Ge~~<br>~~ee~~<br>~~ee~~|**17**<br>~~Ge ~~<br>~~ee~~|**6**<br> ~~ee~~|**5**|**7**|**22**|**0.01**|**0.0001**|
|**5525DSO-pp015DS**<br>~~es ~~<br>~~es~~<br>~~ee~~|**-15**<br> ~~es ~~<br>~~es~~<br>~~ee~~|**15**<br> ~~es ~~<br>~~ee~~<br>~~ee~~|**17**<br> ~~ee ~~<br>~~ee~~<br>~~ee~~|**19**<br> ~~ee~~<br>~~ee~~|**5**|**3**|**7**|**22**|**0.01**|**0.0001**|
|**5525DSO-pp030AS**<br>~~es ~~<br>~~ee~~|**0**<br> ~~es ~~<br>~~ee~~|**30**<br> ~~ee ~~<br>~~ee~~|**17**<br> ~~ee~~<br>~~ee~~|**18**<br>~~ee~~|**5**|**4**|**7**|**22**|**0.01**|**0.0001**|
|**5525DSO-pp030GS**<br>~~ee ~~<br>~~es~~|**0**<br> ~~ee ~~<br>~~ee~~|**30**<br> ~~ee ~~<br>~~es~~|**17**<br> ~~ee~~<br>~~ee~~|**18**<br>~~ee~~|**5**|**4**|**7**|**22**|**0.01**|**0.0001**|
|**5525DSO-pp030DS**<br>~~es ~~<br>~~es~~|**-30**<br> ~~ee~~<br>~~ee~~|**30**<br>~~es ~~<br>~~es~~|**18**<br> ~~ee~~<br>~~ee~~|**21**|**4**|**1**|**7**|**22**|**0.01**|**0.0001**|



## **MEMORY MAPPING** 

## **Memory Mapping** 

|**Address**|**15**|**14**|**13**|**12**|**11**|**10**|**9**|**8**|**7**|**6**|**5**|**4**|**3**|**2**|**1**|**0**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**0**|**Reserved for Manufacturer**||||||||||||||||
|**1**|**Coefficient 1 (C1)**||||||||||||||||
|**2**|**Coefficient 2 (C2)**||||||||||||||||
|**3**|**Coefficient 3 (C3)**||||||||||||||||
|**4**|**Coefficient 4 (C4)**||||||||||||||||
|**5**|**Coefficient 5 (C5)**||||||||||||||||
|**6**|**Coefficient 6 (C6)**||||||||||||||||
|**7**|||||||||||||**CRC**||||



Figure 3: Memory PROM Mapping 

## Notes 

[1] Maximal size of intermediate result during evaluation of variable. 

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MS5525DSO (Digital Small Outline) 

## SPI INTERFACE 

## **RESET SEQUENCE** 

The Reset sequence shall be sent once after power-on to make sure that the calibration PROM gets loaded into the internal register. It can be also used to reset the device ROM from an unknown condition 

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MS5525DSO (Digital Small Outline) 

## **CONVERSION SEQUENCE** 

The conversion command is used to initiate uncompensated pressure (D1) or uncompensated temperature (D2) conversion. The chip select can be disabled during this time to communicate with other devices. 

After the conversion, using ADC read command the result is clocked out with the MSB first. If the conversion is not executed before the ADC read command, or the ADC read command is repeated, it will give 0 as the output result. If the ADC read command is sent during conversion the result will be 0, the conversion will not stop and the final result will be wrong. Conversion sequence sent during the already started conversion process will yield incorrect result as well. 

## **PROM READ SEQUENCE** 

The read command for PROM shall be executed once after reset by the user to read the content of the calibration PROM and to calculate the calibration coefficients. There are in total 8 addresses resulting in a total memory of 128 bit. Address 0 contains factory data and the setup, addresses 1-6 calibration coefficients and address 7 contains the serial code and CRC. The command sequence is 8 bits long with a 16 bit result which is clocked with the MSB first. 

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MS5525DSO (Digital Small Outline) 

## I[2] C INTERFACE 

## **COMMANDS** 

Each I[2] C communication message starts with the start condition and it is ended with the stop condition. The MS5525DSO address is 111011Cx, where C is the complementary value of the pin CSB. Since the IC does not have a microcontroller inside, the commands for I[2] C and SPI are quite similar. 

## **RESET SEQUENCE** 

The reset can be sent at any time. In the event that there is not a successful power on reset this may be caused by the SDA being blocked by the module in the acknowledge state. The only way to get the MS5525DSO to function is to send several SCLKs followed by a reset sequence or to repeat power on reset. 

**==> picture [286 x 53] intentionally omitted <==**

**----- Start of picture text -----**<br>
1 1 1 0 1 1 CSB 0 0 1 0 1 0 0 1 1 0 0<br>Device Address command<br>a S Device Address W a 0 A cmd byte A | P<br>From Master S = Start Condition W = Write A = Acknowledge<br>H From Slave P = Stop Condition R = Read N = Not Acknowledge<br>**----- End of picture text -----**<br>


Figure 10: I2C Reset Command 

## **PROM READ SEQUENCE** 

The PROM Read command consists of two parts. First command sets up the system into PROM read mode. The second part gets the data from the system. 

**==> picture [286 x 53] intentionally omitted <==**

**----- Start of picture text -----**<br>
1 1 1 0 1 1 CSB 0 0 1 0 1 0 0 1 1 0 0<br>Device Address command<br>a S Device Address W a A cmd b 0 yte A P<br>From Master S = Start Condition W = Write A = Acknowledge<br>H From Slave P = Stop Condition R = Read N = Not Acknowledge<br>**----- End of picture text -----**<br>


Figure 11: I2C Command to read memory address= 011 (Coefficient 3) 

|||1<br>1<br>1<br>0<br>1<br>1|CSB 1<br>0<br>1<br>1<br>0|0<br>X|X<br>X<br>X<br>0||X|X|X<br>X<br>X<br>X<br>X<br>X|0||
|---|---|---|---|---|---|---|---|---|---|---|---|
|||Device Address||data|||||data|||
|S<br>Device Address<br>~~a~~|||R A<br>A<br>Memorybit 15 - 8<br>~~a~~<br>~~Oa~~|||||Memorybit 7 - 0||N|P|
|~~LU~~|~~LU~~|From Master<br>From Slave<br>~~LU~~|S = Start Condition<br>P = Stop Condition||W = Write<br>R = Read||||A = Acknowledge<br>N = Not Acknowledge|||



Figure 12: I2C response from MS5525DSO 

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MS5525DSO (Digital Small Outline) 

## **CONVERSION SEQUENCE** 

A conversion can be started by sending the command to MS5525DSO. When command is sent to the system it stays busy until conversion is done. When conversion is finished the data can be accessed by sending a Read command, when an acknowledge appears from the MS5525DSO, 24 SCLK cycles may be sent to receive all result bits. Every 8-bit the system waits for an acknowledge signal. 

**==> picture [287 x 52] intentionally omitted <==**

**----- Start of picture text -----**<br>
1 1 1 0 1 1 CSB 0 0 0 1 0 0 1 0 0 0 0<br>Device Address command<br>a S Device Address W 0 A cmd byte | A P<br>From Master S = Start Condition W = Write A = Acknowledge<br>LU From Slave P = Stop Condition R = Read N = Not Acknowledge<br>**----- End of picture text -----**<br>


Figure 13: I[2] C Command to initiate a pressure conversion (OSR=4096, typ=D1) 

**==> picture [286 x 53] intentionally omitted <==**

**----- Start of picture text -----**<br>
1 1 1 0 1 1 CSB 0 0 0 0 0 0 0 0 0 0 0<br>Device Address command<br>a S Device Address Oe W A cmd by | te A P<br>From Master S = Start Condition W = Write A = Acknowledge<br>LH From Slave P = Stop Condition R = Read N = Not Acknowledge<br>**----- End of picture text -----**<br>


Figure 14: I[2] C ADC read sequence 

|||1<br>1<br>1<br>0<br>1<br>1|CSB 1<br>0<br>X<br>X<br>X<br>X<br>X<br>X|X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0|X|X|X<br>X<br>X<br>X<br>X<br>X<br>0||
|---|---|---|---|---|---|---|---|---|
|S<br>R<br>A<br>A<br>A<br>N P<br>data<br>data<br>data<br>Device Address<br>Device Address<br>Data 23-16<br>Data 7 - 0<br>Data 8 - 15<br>~~Pp~~<br>~~YT~~<br>~~TT~~|||||||||
|~~LI~~|~~LI~~|From Master<br>From Slave|S = Start Condition<br>P = Stop Condition|W = Write<br>A = Acknowledge<br>R = Read<br>N = Not Acknowledge|||||



Figure 15: I[2] C response from MS5525DSO 

## **CYCLIC REDUNDANCY CHECK (CRC)** 

MS5525DSO contains a PROM memory with 128-Bit. A 4-bit CRC has been implemented to check the data validity in memory. The application note AN520 describes in detail CRC-4 code used. 

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MS5525DSO (Digital Small Outline) 

## MARKING, AND PRESSURE TYPE CONFIGURATION 

|**Pressure Type**|**Pressure Type**<br>**Pmin**|**Pmax**|**Description**|
|---|---|---|---|
|Absolute|0psiA|+Prange|Output is proportional to the difference between 0psiA (Pmin) and pressure|
||||applied to Port 1.|
|Differential/|-Prange|+Prange|Output is proportional to the difference between Port 1 and Port 2.  Output|
|Bidirectional|||swings positive when Port 2> Port 1.  Output is 50% of total counts when|
||||Port 1=Port 2.|
|Gauge|0psiG|+Prange|Output is proportional to the difference between 0psiG (Pmin) and Port 1.|
||||Output swings positive when Port 2> Port 1.|



## WETTED MATERIAL BY PORT DESIGNATION 

|**Material**|||||||||
|---|---|---|---|---|---|---|---|---|
|**Style**|**Port**|**LCP**|**Thermo-Epoxy**|**Thermo-Epoxy**<br>**Epoxy**|**Epoxy**<br>**RTV**|**Glass**|**Glass**<br>**Silicon**|**Silicone Gel**|
||||**Resin**||||||
|All|Port 1<br>Port 2|Port 1<br>X<br>Port 2<br>X|X<br>X|X<br>X|X|X|X|X|



"X"  Indicates Wetted Materials 

## PINOUT DESIGNATION 

|**Pin Name**|**Pin**|**Function**|
|---|---|---|
|||**I2C                                                                    SPI**|
|SIN-|1,3|Sensor Input, Negative                                 Sensor Input, Negative|
|SOUT-|2,4|Sensor Outputs, Negative                             Sensor Outputs, Negative|
|SDO|5|Not Applicable                                               Serial Data Output|
|SDA/SDI|6|I2C Data Input and Output                               SPI Serial Data Input|
|SCL/SCLK|7|I2C Clock                                                       SPI Clock|
|CSB|8|Defines I2C Address                                        Chip Select (Active Low)|
|Supply -|9|Return Supply Voltage                                  Return Supply Voltage|
|PS|10|Protocol Select|
|||PS  = (VDD)                                         PS = (GND)|
|||I2C Protocol Selected                                      SPI Protocol Selected|
|||CSB= (VDD) I2C  Address =1110110X (0xEC, 0xED)|
|||CSB= (GND) I2C  Address=1110111X (0xEE, 0xEF)|
|Supply +|11,13|Positive Supply Voltage                                  Positive Supply Voltage|
|SOUT+|12,14|Sensor Outputs, Positive                              Sensor Outputs, Positive|



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MS5525DSO (Digital Small Outline) 

## BLOCK DIAGRAM 

Figure 4: Block diagram of MS5525DSO 

## **NOTE** : 

DO NOT CONNECT SIN– to SUPPLY– 

This will short the internal switch within the sensor interface IC resulting in a disruption of the temperature measurements. 

**==> picture [157 x 67] intentionally omitted <==**

**----- Start of picture text -----**<br>
SIN-<br>1 3<br>Sensor<br>Interface IC<br>**----- End of picture text -----**<br>


Figure 5: SIN- Pins 1 and 3 of MS5525DSO 

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MS5525DSO (Digital Small Outline) 

## Table B 

|**Pad No.**|**Function**|**Notes**||
|---|---|---|---|
|1|SIN-|Connect to Pin 3|Connect to Pin 3|
|2|SOUT-|Connect to Pin 4|Connect to Pin 4|
|3|SIN-|Connect to Pin 1|Connect to Pin 1|
|4|SOUT-|Connect to Pin 2|Connect to Pin 2|
|5|SDO|||
|6|SDI/SDA|||
|7|SCLK/SCL|||
|8|CSB|||
|9|SUPPLY-|||
|10|PS|||
|11|SUPPLY+|Connect to Pin 13|Connect to Pin 13|
|12|SOUT+|Connect to Pin 14|Connect to Pin 14|
|13|SUPPLY+|Connect to Pin 11|Connect to Pin 11|
|14|SOUT+|Connect to Pin 12|Connect to Pin 12|



Notes: 

[1] Function pins that share the same name (SOUT+, SOUT-, SIN-, SUPPLY+) must be connected on the PCB for proper operation, as described in the ‘Notes’ column of Table B. 

[2] Must place a 0.1µf decoupling capacitor between VDD and GND on PCB and as close as possible to sensor. 

## RECOMMEND PCB LAYOUT 

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MS5525DSO (Digital Small Outline) 

## APPLICATION CIRCUIT 

The MS5525DSO is a circuit that can be used in conjunction with a microcontroller. It is designed for lowvoltage systems with a supply voltage of 3 V. 

## **Note:** 

1. Place 100nF capacitor between Supply and GND to within 2cm of sensor 

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MS5525DSO (Digital Small Outline) 

## DIMENSIONS 

## **MS5525DSO-DBxxxyS** 

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MS5525DSO (Digital Small Outline) 

## **MS5525DSO-STxxxyS** 

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MS5525DSO (Digital Small Outline) 

## **MS5525DSO-SBxxxyS** 

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MS5525DSO (Digital Small Outline) 

## **MS5525DSO-DHxxxyS** 

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MS5525DSO (Digital Small Outline) 

## **MS5525DSO-FTxxxyS** 

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MS5525DSO (Digital Small Outline) 

## **MS5525DSO-FBxxxyS** 

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MS5525DSO (Digital Small Outline) 

## ORDERING INFORMATION 

## 5525DSO – DB 005 G S 

**Package Style DB** Dual Barb **SB** Single Barb **ST** Single Tube **DH** Dual Hole **FT** Front Tube **FB** Front Single Barb 

**==> picture [59 x 20] intentionally omitted <==**

**----- Start of picture text -----**<br>
Pin Style<br>S  Gull Wing<br>**----- End of picture text -----**<br>


**Pressure Range (psi)** ~~a~~ 001(1) 002(2) ~~a~~ 005(2) 015 030 ~~——o~~ (1)Available only in Differential Pressure Type 

**Pressure Type G** Gage **A** Absolute ~~a~~ **D** Differential 

(2)Available in Differential and Gauge Pressure Types 

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## **EUROPE** 

## **ASIA** 

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