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534202B02853G
HEAT SINK
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: BOYD
- Product type: Natural Convection Heat Sinks
- Thermal Resistance:13.4°C/W; Packages Cooled:TO-220; External Width - Metric:25.4mm; External Height - Metric:29.97mm; External Length - Metric:12.7mm; External Diameter - Metric:-; Heat Si 99R8246
- Thermal Resistance: 13.4°C/W
| Delivery and price | |
|---|---|
| Units per pack | 1458 |
| Price | 5.87 € |
| Current stock | 500+ |
| Lead time | 30 days |
Datasheet
## TO ~~-2~~ 20, TO ~~-2~~ 20- ~~s~~ ingle gauge (0.020")
Channel style heat sink with Shur ~~-~~ Lock tabs and device clip
This non ~~-e~~ lectronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits ~~.~~ The heat resistance time or heat resistance temperature is not applicable for the component ~~.~~ Height: 50 ~~.~~ 80
Mount Orientation: Vertical
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Finish: Black Anodize RoHS: compliant
Thermal Resistance: 13.40
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25.40 13.84<br>|1 {~](0.545) 1208<br>C 3.96 (0.475)<br>412 (0.156) -el be 3.17<br>(0,556) 3,05 x 0.64 HIGH DITTIN (0.125)<br>; & (0.120) (0.025) ! : i 29.97"<br>80 | € | :| (1.180)<br>(0.700) 9.78 set<br>(0.385) ji} at<br>i 3063)" 92<br>(0.123)3.12 j +—e860)93.35 —+| (0.030)762 (0.063)—\"" 0385)(0.365Pre<br>12,70<br>(0.500)<br>. 00 (0 . 315) | Z Dim: 2 . 39 (0 . 094)<br>Lae Device Centerline<br>| ' | 4 Mounting surace<br>- -. of Heat Sink<br>1 \aypical Device<br>Lead Locations<br>H<br>'<br>| a? 21 (2 Places)<br>x1 ole x1 _,|<br>FIGURE 1<br>MUR VELOCITY-FEET PER MINLITE<br>0 0 200 400 600 a0 = 1000<br>=7 w Jfer”ft| et=<br>So2 wo aa_ _aLZ tween]a a ee TT Tl, se2<br>z5 SLE, 88<br>=ews yae, [fel || || 7 yt yy ye ze2<br>pf#tt ttt ty tt yy, =<br>0 2 f] 6 i] 10<br>HEAT DISSIPATED-WHITS<br>**----- End of picture text -----**<br>
X Dim: 11 ~~.~~ 18 (0 ~~.~~ 440) | Y Dim: 8 ~~.~~ 00 (0 ~~.~~ 315) | Z Dim: 2 ~~.~~ 39 (0 ~~.~~ 094)
Shurlock Tabs
Updated at April 29, 2026
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