453-00048

A 

## _M.2 2230 E-Key Module_ 

Laird Connectivity’s customers across multiple industries have a diverse set of requirements and specific needs. They asked for a truly robust industrial IoT module: one that’s rugged, small, simplifies their BOM, is globally certified, has reliable connectivity, and easy to integrate. 

Laird Connectivity’s new Sterling-LWB5+ answers that call for next-gen wireless IoT. Powered by Infineon’s CYW4373E silicon, the Sterling-LWB5+ is purpose-built for industrial IoT connectivity through a secure, reliable, and robust feature set. It’s IoT from the start: fully certified, easy to integrate, and is the fastest route to the market for IoT. 

**Compatible:** Our **Linux Backports** package supports many Linux kernels. 

**Reliable:** Integrated PA (Power Amplifier) and LNA (Low Noise Amplifier) with **antenna diversity** for reliable connectivity in harsh RF environments. 

**Robust:** Rich feature-set including 802.11ac Wi-Fi and Dual-Mode Bluetooth. Reliable in **industrial temperature range,** and solder-down module is suitable for industrial vibration and impact demands. 

**Secure:** Supports the latest WPA3 security standards. 

_On-board Chip Antenna Module_ 

   - 1x1 **Wi-Fi 5** (802.11ac) 

   - Optional **Wi-Fi antenna diversity** for reliable connectivity 

   - **Bluetooth 5** Bluetooth Low Energy (BLE) 

   - Integrated **Wi-Fi + Bluetooth coexistence** for seamless connectivity 

   - High Speed host interface: SDIO(WLAN)/UART(BT) 

   - Industrial Temperature Rating (-40° to +85 °C) 

   - **Ultra-small footprint** (12 mm x 17 mm) including onboard antenna 

   - Module options: 

      - External antenna module 

      - On-board antenna module 

      - M.2 module w/antenna diversity 

   - List options of external antennas available 

   - **Rugged Design** – solder down form factor 

   - **Global Certifications** – FCC, IC, CE, Giteki, RCM (pending) 

   - **Linux Backports** for broad kernel support 

- RELIABLE CONNECTIVITY 802.11ac Wi-Fi with integrated PA and LNA combined with Antenna AT A GLANCE 

- Diversity add up to a reliable module for harsh RF conditions 

Open Sourced software and Linux Backports ensures compatibility with a wide variety of Linux kernels. 

Designed to the industrial temperature range of -40 ºC to +85 ºC for every component utilized. 

Carries several modular FCC, IC, CE, RCM, Giteki and Bluetooth SIG approvals. (all pending) 

MANUFACTURE PERSONAL SUPPORT FROM DESIGN TO Our industry-renowned support is passionate about helping you speed your design to market. 

Rugged Handheld Devices 

Industrial IoT Connectivity 

Battery Powered Medical Devices 

Industrial IoT Sensors 

For documentation, software, sample apps and more visit: **http://www.lairdconnect.com/sterling-lwb5-plus** 

Contact Sales -   Americas:  +1 262 375 4400 Korea: +82 10 2622 3935 Europe: +44 1628 940 ext. 958 Hong Kong: +852 2923 0610 

|Wireless Specification|Wi-Fi|Wi-Fi 5(802.11ac)|||
|---|---|---|---|---|
||Bluetooth®|v5.0|||
||Frequency|Dual-Band 2.4GHz & 5GHz|||
||Transmit Power|+ 18 dBm(maximum)|||
||Receive Sensitivity|TBD|||
||Antenna Options|Base Module: On-board ceramic chip, MHF4 connector(s), trace pin for external antennas|||
|||M.2 Board: Antenna diversityw/MHF4 connectors|||
||Raw Data Rates(Air)|433.3Mbps - MCS9,80MHz,256QAM,SGI|||
|Host Interface and|WLAN Interfaces|SDIO 3.0|||
|Peripherals|Bluetooth Interface|UART|||
|Key Wi-Fi Features|Wi-Fi 5 (802.11ac)|•<br>20, 40, and 80MHz wide channels|||
|||•<br>Single-stream spatial multiplexing up to 433.3 Mbps data rate.||Single-stream spatial multiplexing up to 433.3 Mbps data rate.|
|||•<br>Integrated PA/LNA|||
|||•<br>Antenna Diversity (optional on base module,mandatoryon M.2 board)|||
|Key Bluetooth Features|Bluetooth Low Energy|•<br>Central/Peripheral roles|•|Secure simple pairing (SSP)|
|||•<br>Up to 7 BLE connections|•|LE Secure Connections|
|||•<br>UART baud rates up to 4 Mbps|•|LE Privacy 1.2|
|||•<br>Adaptive frequency hopping<br>(AFH)|•<br>•|LE Data Length Extension<br>Fast connect (interlaced page|
|||•<br>Qualityof service(QoS)||and inquiry scans)|
|SupplyVoltage||3.3V|||
|Power Consumption|Estimated Current|Continuous TX: TBD|||
|||Sleep: TBD|||
|||IEEE Power Save: TBD|||
|Physical|Dimensions|12 mm x 17 mm x 2.2 mm (Modules)|||
|||22 mm x 30 mm x 3.1 mm(M.2 E-KeyModule)|||
|Environmental|TempRange|-40°C to +85°C|||
|Miscellaneous|Lead Free|Lead-free and RoHS-compliant|||
||Development Kit|Development board,accessories,and evaluation software|||
|Qualifications|Bluetooth® SIG|Bluetooth 5.0(pending)|||
|Regulatory|Approvals|FCC/IC/CE/MIC/RCM(allpending)|||



_**For full specifications on the Sterling-LWB5+ modules, please see the appropriate datasheet.**_ 

|**453-00045C**|Module, Sterling LWB5+, Chip Antenna, Cut Tape|
|---|---|
|**453-00045R**|Module, Sterling LWB5+, Chip Antenna, Tape/Reel|
|**453-00046C**|Module, Sterling LWB5+, MHF4, Cut Tape|
|**453-00046R**|Module, Sterling LWB5+, MHF4, Tape/Reel|
|**453-00047C**|Module, Sterling LWB5+, Trace Pin, Cut Tape|
|**453-00047R**|Module, Sterling LWB5+, Trace Pin, Tape/Reel|
|**453-00048**|Module, Sterling LWB5+, M.2, Key E, SDIO, UART|
|**453-00049**|Module, Sterling LWB5+, M.2, Key E, USB, USB|
|**453-00045-K1**|Development Kit, Sterling LWB5+, Chip Antenna|
|**453-00046-K1**|Development Kit, Sterling LWB5+, MHF4|
|**453-00048-K1**|Development Kit , Sterling LWB5+, M.2, Key E, SDIO, UART|
|**453-00049-K1**|Development Kit , Sterling LWB5+, M.2, Key E, USB, USB|



For documentation, software, sample apps and more visit: 

Contact Sales -   Americas:  +1 262 375 4400 Korea: +82 10 2622 3935 Europe: +44 1628 940 ext. 958 Hong Kong: +852 2923 0610 

**http://www.lairdconnect.com/sterling-lwb5-plus**