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453-00044C
Bluetooth Module, MHF4 Connector, 2.48 GHz, AADC, GPIO, I2C, I2S, PDM, PWM, SPI, UART
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: EZURIO
- Product type: Bluetooth Modules & Adaptors
| Delivery and price | |
|---|---|
| Units per pack | 250 |
| Price | 3.19 € |
| Current stock | 200+ |
| Lead time | 30 days |
Datasheet
## **Datasheet**
## BL54L15, BL54L10 Series
Version 1.9
**BL54L15 / BL54L10 Series** Datasheet
## Revision History
|**Version**<br>0.1<br>~~a~~|**Version**<br>0.1<br>~~a~~|**Date**<br>10 June 2024<br>~~a~~|**Notes**<br>Initial PRELIMINARY release.|**Contributor(s)**<br>Raj Khatri|**Approver**<br>Jonathan Kaye|
|---|---|---|---|---|---|
||0.2|2 Oct 2024|Updated pin list names and notes below table1.|Raj Khatri|Jonathan Kaye|
||||Added sectionExternal Antenna Integration with|||
||||BL54L15/BL54L10 MHF4 variant (453-00044/453-00226)|||
||||Added section on Programmability.|||
||0.3|24 Oct 2024|Removed Medium voltage mode (VDDM_nRF) from|Raj Khatri|Jonathan Kaye|
||||Specification Summarytable and updated Normal|||
||||voltage mode (VDD_nRF) operating range from 1.7V-2.6V|||
||||to 1.7V-3.6V. UpdatedBlock Diagram and Pin-outfor 39|||
||||connection pins.|||
||||Updated SCH symbol to remove pin40.|||
||||Updated pin list inTable 1(removed pin 40 VDDM_nRF).|||
||||UpdatedBL54L15/ BL54L10Power Supply|||
||||UpdatedTable 4external antenna Mag Layers EDA-|||
||||8709-2G4C1-B27-CY antenna gain from 2dBi to 2.32dBi.|||
||0.4|6 Dec 2024|Updated maximum Tx power to +7 dBm.|Dave Drogowski|Jonathan Kaye|
||0.5|11 Dec 2024|Updatedsensitivity value|Louis Chang|Jonathan Kaye|
||||Added trace antenna performance|||
||0.6|16 Dec 2024|Updated maximum Tx power to +6 dBm.|Louis Chang|Jonathan Kaye|
||1.0|16 Dec 2024|Initial release|Dave Drogowski|Jonathan Kaye|
||1.1|19 Dec 2024|Updated maximum Tx power to +7 dBm.|Louis Chang|Jonathan Kaye|
||1.2|13 Jan 2025|Updated title of7.4|Louis Chang|Jonathan Kaye|
||||Updated some typo|||
||1.3|21 Feb. 2025|Change (VDD_nRF) operating range from 1.7V-3.6V to|Louis Chang|Jonathan Kaye|
||||1.7V-3.5V.|||
||||Add VDD_nRF supply voltage (1.7V-3.3V) under extended|||
||||operating Temperature (85 to 105C)|||
||||Update Absolute maximum ratings of VDD_nRF (-0.3V-|||
||||3.6V)|||
||1.4|25 Feb. 2025|Update Minimum Transmit Power Setting to -40dBm|Louis Chang|Jonathan Kaye|
||||Update Active Modes Peak Current|||
||1.5|27 Feb. 2025|Update 32MHz crystal oscillator internal capacitor|Louis Chang|Jonathan Kaye|
||||setting value|||
||||Update 32.768KHz crystal oscillator internal capacitor|||
||||setting value|||
||||Update NFC antenna pin current value|||
||1.6|3 Mar. 2025|Update Idle mode and off mode current|Louis Chang|Jonathan Kaye|
||||BL54L10 Antenna performance shares with BL54L15|||
||1.7|10 Mar. 2025|Update2.4GHz Radiated Performance|Louis Chang|Jonathan Kaye|
||||Update flash specs inAbsolute Maximum Ratings|||
||1.8|18 Mar 2025|Update power consumption in2.1|Louis Chang|Jonathan Kaye|
||1.9|09 Jun 2025|Update Thermal shock Max. Temperature from 85℃to|Olivia Chang|Jonathan Kaye|
||||105℃of Reliability Test|||
2
© Copyright 2025 Ezurio All Rights Reserved
https://www.ezurio.com/
**BL54L15 / BL54L10 Series** Datasheet
## Contents
|1|Overview and Key Features ......................................................................................................................................................................................................... 5|Overview and Key Features ......................................................................................................................................................................................................... 5|
|---|---|---|
||1.1|Features and Benefits ....................................................................................................................................................................................................... 5|
||1.2|Application Areas ............................................................................................................................................................................................................... 5|
|2|Specification .................................................................................................................................................................................................................................. 6||
||2.1|Specification Summary ..................................................................................................................................................................................................... 6|
|3|Hardware Specifications .............................................................................................................................................................................................................. 9||
||3.1|Block Diagram and Pin-out ............................................................................................................................................................................................... 9|
||3.2|Pin Definitions .................................................................................................................................................................................................................... 10|
||3.3|Electrical Specifications .................................................................................................................................................................................................. 14|
||3.3.1|Absolute Maximum Ratings ..................................................................................................................................................................................... 14|
||3.3.2|Recommended Operating Parameters .................................................................................................................................................................. 14|
||3.4|Clocks ................................................................................................................................................................................................................................. 15|
||3.4.1|HFXO - 32MHz crystal oscillator and nRF54L15/nRF54L10 internal load capacitor mandatory setting ...................................................... 15|
||3.4.2|LFCLK – Low Frequency clock source ..................................................................................................................................................................... 15|
||3.4.3|Other Internal Clocks ................................................................................................................................................................................................ 15|
||3.5|BL54L15/ BL54L10 Power Supply .................................................................................................................................................................................... 16|
|4|Programmability............................................................................................................................................................................................................................ 17||
||4.1|BL54L15/ BL54L10 Default Firmware .............................................................................................................................................................................. 17|
||4.2|BL54L15/ BL54L10 Firmware Options ............................................................................................................................................................................. 18|
|5|Peripherals ..................................................................................................................................................................................................................................... 19||
|6|SW requirements related to hardware .................................................................................................................................................................................... 20||
||6.1|32MHz crystal internal load capacitor setting ............................................................................................................................................................ 20|
|7|Hardware Integration Suggestions .......................................................................................................................................................................................... 20||
||7.1|Circuit ................................................................................................................................................................................................................................ 20|
||7.2|PCB Layout on Host PCB - General ................................................................................................................................................................................ 21|
||7.3|PCB Layout on Host PCB for the 453-00001 and 453-00225 .................................................................................................................................... 21|
||7.3.1|Antenna Keep-out on Host PCB ................................................................................................................................................................................... 21|
||7.3.2|Antenna Keep-out and Proximity to Metal or Plastic ......................................................................................................................................... 22|
||7.4|External Antenna Integration with BL54L15/BL54L10 MHF4 variant (453-00044/453-00226) ......................................................................... 22|
|8|Mechanical Details ...................................................................................................................................................................................................................... 23||
||8.1|BL54L15/BL54L10 Mechanical Details .......................................................................................................................................................................... 23|
||8.2|Host PCB Land Pattern and Antenna Keep-out for the 453-00001 and 453-00225 ............................................................................................ 25|
|9|On -Board PCB Trace Antenna Characteristics ..................................................................................................................................................................... 26||
||9.1|Summary of Antenna Performance .............................................................................................................................................................................. 26|
||9.2|2.4GHz Radiated Performance ...................................................................................................................................................................................... 26|
||9.3|Antenna S11 measuring data .......................................................................................................................................................................................... 27|
|10|Application Note for Surface Mount Modules ........................................................................................................................................................................ 28||
||10.1|Introduction ...................................................................................................................................................................................................................... 28|
© Copyright 2025 Ezurio All Rights Reserved
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3
**BL54L15 / BL54L10 Series** Datasheet
||10.2|Module Packaging Configuration .................................................................................................................................................................................. 28|
|---|---|---|
||10.3|Module Shipping .............................................................................................................................................................................................................. 30|
||10.4|Labeling .............................................................................................................................................................................................................................. 31|
||10.5|Required Storage Conditions ........................................................................................................................................................................................ 33|
||10.5.1|Prior to Opening the Dry Packing ........................................................................................................................................................................... 33|
||10.5.2|After Opening the Dry Packing ............................................................................................................................................................................... 33|
||10.5.3|Temporary Storage Requirements after Opening .............................................................................................................................................. 33|
||10.6|Baking Conditions ............................................................................................................................................................................................................ 34|
||10.7|Surface Mount Conditions ............................................................................................................................................................................................. 34|
||10.7.1|Soldering .................................................................................................................................................................................................................... 34|
||10.7.2|Cautions When Removing the BL54L15/BL54L10 from the Platform for RMA ................................................................................................ 35|
||10.7.3|Precautions for Use .................................................................................................................................................................................................. 35|
|11|Reliability Test .............................................................................................................................................................................................................................. 36||
||11.1|Climatic And Dynamic Reliability Test .......................................................................................................................................................................... 36|
||11.2|Reliability MTBF Prediction ............................................................................................................................................................................................. 37|
|12|Regulatory .................................................................................................................................................................................................................................... 38||
||12.1|Certified Antennas for the BL54L15/BL54L10 ............................................................................................................................................................. 38|
|13|Bluetooth Qualification Process ............................................................................................................................................................................................... 39||
||13.1|Overview ............................................................................................................................................................................................................................ 39|
||13.2|Scope ................................................................................................................................................................................................................................. 39|
||13.3|Qualification Steps When Referencing a single existing design, (unmodified) – Option 1 in the QPRDv3 ....................................................... 39|
||13.4|Example Designs for reference ..................................................................................................................................................................................... 40|
||13.5|Qualify More Products ..................................................................................................................................................................................................... 40|
|14|Ordering Information ................................................................................................................................................................................................................... 41||
|15|Additional Information ................................................................................................................................................................................................................ 42||
© Copyright 2025 Ezurio All Rights Reserved
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4
**BL54L15 / BL54L10 Series** Datasheet
## 1 Overview and Key Features
Experience a new pinnacle of performance, efficiency, and security with our new BL54L15 and BL54L10 series, built on Nordic Semiconductor's powerful **nRF54L QFN** silicon. Elevating what you know and love from the nRF52 series, this next generation redefines Bluetooth LE and 802.15.4 solutions. Unleashing enhanced processing power, expanded memory, and innovative peripherals, the BL54L15 is the ultimate choice for low power connectivity.
Powered by **Nordic's nRF54L15 and nRF54L10** SoC, our compact BL54L15 and BL54L10 modules deliver secure and robust Bluetooth LE and 802.15.4 with flexible programming via Nordic’s nRF Connect SDK or Ezurio Canvas Software Suite.
Featuring a **128MHz ARM Cortex M33** and **128MHz RISC-V coprocessor** , supported by 1.5 MB non-volatile memory and 256 KB RAM for BL54L15, 1.0 MB non-volatile memory and 192 KB RAM for BL54L10, the BL54L15 and BL54L10 modules offer double the processing power (vs prior BL654 – nRF52840). The BL54L15 / L10 series brings out all nRF54L15/ L10 hardware features and capabilities including up to **+7 dBm** transmit power, **1.7V – 3.5V** supply considerations, and **NFC A-Tag** implementation.
It’s further enhanced with state-of-the-art security and is designed for PSA Certified level 3 and supports services such as Secure Boot, Secure Firmware Update, Secure Storage plus protection from physical attacks.
**Note:** BL54L15/ BL54L10 hardware provides all functionality of the nRF54L15/ nRF54L10 chipset used in the module design. This is a hardware datasheet only – it does not cover the software aspects of the BL54L15 and BL54L10. This is to acknowledge that information in this datasheet is referenced from the nRF54L15/ nRF54L10 datasheet.
## **1.1 Features and Benefits**
- **Nordic nRF54L15/ nRF54L10** – 6x6 mm QFN48 with 31 GPIOs utilized.
- **Multi-protocol support:** Bluetooth LE, 802.15.4 (Thread & Matter)
- **Cortex M33** processor core: 128 MHz ARM Cortex M33
- **RISC-V** co-processor core: 128 MHz VPR
- **Memory:** 1.5MB non-volatile memory, 256 KB RAM for BL54L15
- 1.0MB non-volatile memory, 192 KB RAM for BL54L10
- **High Speed Peripherals** : - HS-SPI/UART, software defined peripherals on 128 MHz VPR, GPIO - 1x 64 MHz Port, 1.7 – 3.5V, 11 GPIOs
- **Bluetooth LE** : Channel Sounding, LE 2M, LE Coded, LE Secure Connections & more
- **Qualified against Bluetooth Core 6.0**
- Firmware Over the Air **(FOTA)** via MCUboot and nRF Connect SDK
- **Hostless operation** – Multi Core MCU reduces BOM
- • **Fully featured development kits** to jump start Bluetooth LE development
- **BL54L15 and Bl54L10 are 100% drop in options, pin for pin**
- **Low Leakage Peripherals:** 2x QDEC, 7x Timer, Global RTC, 2x WDT, NFC A-Tag, TEMP, I2S, COMP, 3x PWM, LPCOMP, 14-bit 8CH ADC, 5x TWI/SPI/UART, GPIO (2x 16 MHz Port (P0, P1), 20 GPIO’s, 1.7-3.5V, 31 GPIO)
- **Antenna choice** – integrated pre-certified **PCB Trace antenna** or external antenna support via **MHF4 connector**
- **Ultra-small footprint** (14 mm x 10 mm x 1.6 mm)
- **Extended** Industrial **Temperature Rating** (-40° to +105 °C)
## **1.2 Application Areas**
- Building Automation
- • Security
- Medical Peripherals
- • Industrial Sensors
© Copyright 2025 Ezurio All Rights Reserved
https://www.ezurio.com/
5
**BL54L15 / BL54L10 Series** Datasheet
## 2 Specification
## **2.1 Specification Summary**
|**Categories/Feature**<br>**Implementation**<br>**Specification**<br>~~EE~~|**Categories/Feature**<br>**Implementation**<br>**Specification**<br>~~EE~~|**Categories/Feature**<br>**Implementation**<br>**Specification**<br>~~EE~~|**Categories/Feature**<br>**Implementation**<br>**Specification**<br>~~EE~~|
|---|---|---|---|
|Bluetooth®|Bluetooth Core 6.0|||
||•<br>Channel Sounding|||
||•<br>GATT client & GATT server – Any adopted/custom services|||
||•<br>Central/Peripheral roles|||
||•<br>Mesh networking|||
||•<br>LE CODED|||
||•<br>LE 2M|||
||•<br>LE Secure Connections|||
||•<br>Extended Advertising|||
||•<br>LE Power Control|||
||•<br>DTM Firmware (Test Modes)|||
|IEEE 802.15.4-2020|2405–2480 MHzIEEE 802.15.4-2006 radio transceiver, implementing IEEE 802.15.4-2006 compliant|||
|PHY|•<br>250kbps, 2450MHz, O-QPSK PHY|||
||•<br>Channels 11-26. Channel 11 2405MHz and CH26 2480MHz.|||
||•<br>Clear channel assessment (CCA)|||
||•<br>Energy detection (ED) scan|||
||•<br>CRC generation|||
|Nordic proprietary|2402–2480 MHz Nordic proprietary 1Mbps and 2Mbps modes radio transceiver|||
|1Mbps, 2Mbps,|•<br>1Mbps nRF proprietary mode (ideal transmitter)|||
|4Mbps modes<br>radio|•<br>2Mbps nRF proprietary mode (ideal transmitter)<br>•<br>4Mbps nRF proprietary mode (ideal transmitter)|||
|Frequency|2.402 - 2.480 GHz for BLE (CH0 to CH39)|||
||2.405 - 2.480 GHz forIEEE 802.15.4-2006PHY (CH11 to CH26)|||
|Raw Data Rates|1 Mbps BLE (over-the-air)|||
||2 Mbps BLE (over-the-air)|||
||125 kbps BLE (over-the-air)|||
||500 kbps BLE (over-the-air)|||
||250 kbpsIEEE 802.15.4-2020 (over-the-air)|||
||Nordicproprietary1Mbps,2Mbps and 4Mbps modes(over-the-air)|||
|Maximum Transmit|+7 dBm<br>Conducted 453-00001, 453-00225 (Integrated antenna) (Exclude antenna gain)|Conducted 453-00001, 453-00225 (Integrated antenna) (Exclude antenna gain)||
|Power Setting|+7 dBm<br>Conducted 453-00044, 453-00226 (External antenna) (Test at MHF4 connector)|||
|Minimum Transmit|-40 dBm|||
|Power Setting||||
|Receive|BLE 1 Mbps(BER=1E-3)|-94 dBm typical||
|Sensitivity1|BLE 2 Mbps|-92 dBm typical||
|(≤37byte packet<br>for BLE)|BLE 125 kbps<br>BLE 500 kbps<br>IEEE 802.15.4-2020 250kbps|-102 dBm typical<br>-98 dBm typical<br>TBD dBm typical||
|Link Budget|101 dB<br>@BLE 1 Mbps(TXpower used is 7dBm)|||
|(conducted)<br>109 dB<br> @BLE 125 kbps(TXpower used is 7dBm)<br>**NFC**<br>~~I~~||||
|NFC-Type A Listen|**Based on NFC forum specification:**|**ecification:**13.56 MHz,Date rate 106 kbps,NFC Type2 and Type 4 emulation||
_Note1 Known Noise on channels 2432MHz and 2464MHz degrades receiver sensitivity, in which sensitivity are not within the typical value_
© Copyright 2025 Ezurio All Rights Reserved
6
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**BL54L15 / BL54L10 Series** Datasheet
|mode compliant|**Modes of Operation:**Disable, Sense, Activated|**Modes of Operation:**Disable, Sense, Activated|
|---|---|---|
||**Use Cases:**Touch-to-Pair with NFC,NFC enabled Out-of-Band Pairing||
|Security|Designed for PSA Certified Level 3 with Secure Boot, Secure Firmware Update, and Secure Storage. Integrated tamper||
||sensors detect attacks and take action,and cryptographic accelerators are hardened against side-channel attacks.||
||||
|**Host**<br>**Interfaces and**<br>**Peripherals**<br>**Application Core**<br>**(High Performance)**<br>**Software defined peripheral Core**<br>**(ultra-low power)**<br>~~ee~~|||
|Total||31 x multifunction I/O lines|
|Two co-|Arm Cortex-M33 with DSP, FPU, TrustZone|RISC-V CPU (VPR) fast lightweight peripheral processor (FLPR) dedicated|
|processors|support.|for software defined peripherals|
||1524KB non-volatile RRAM (BL54L15)|16MHz clock|
||1022KB non-volatile RRAM (BL54L10)||
||256KB RAM (BL54L15)||
||192KB RAM (BL54L10)||
||L1 cache||
||128MHz clock||
||Uses voltage and clock frequency scaling||
|GPIO||Up to 31 multifunction GPIO’s|
||64MHz 1.7-3.5V GPIO port|16MHz 1.7-3.5V GPIO port|
||P2.00-P2.10|P1.00-P1.14;|
|||P0.00-P0.04|
|ADC (14-bit)|14-bit 31.25KS/s with oversampling||
||12-bit 250KS/s||
||10-bit 2MS/s||
||AIN0-AIN7 pins upto 8 programmable gain||
||channels||
|Global RTC||Implements full real time clock and calendar as shared system time. Can run|
|(GRTC)||in System OFF mode.|
|||Ultra low power, 1us resolution, 52bits wide, uses 16MHz clock, 32.76kHz|
|||when other power modes.|
|RTC||2x low power runs off LFCLK|
|High Speed|1 x||
|SPI/UART|||
|SPI/UART/TWI||4x|
|PWM||3x 4channel PWM|
|I2S||1x I2S (Inter-IC sound interface)|
|PDM||1x PDM (Pulse code modulation interface) for digital microphones|
|TIMER||7x Timer (32bit)|
|QDEC||2x QDEC (Quadrature decoder)|
|COMP||1x COMP (comparator)|
|LPCOMP||1x LPCOMP (low power comparator)|
|TEMP||1x Temperature sensor|
|||Temperature range equal to operating temperature range|
|WDT||2x WDT (Watchdog timer)|
|NFC A-Tag||1x|
|Wakeup pins||20x|
© Copyright 2025 Ezurio All Rights Reserved
https://www.ezurio.com/
7
**BL54L15 / BL54L10 Series** Ezurio Datasheet **Host Application Core Software defined peripheral Core Interfaces and (High Performance) (ultra-low power)** ~~ee~~ **Peripherals** External Not needed for normal radio operation. optional Optionally, connect +/-20ppm accuracy crystal for more accurate protocol 32.768 kHz timing. Fit associated load capacitor for crystal or use nRF54L15/nRF54L10 crystal internal load capacitor, which is configurable as 4 pF to 18 pF in 0.5 pF steps on pins XL1, XL2. Security Designed for PSA Certified Level 3 with Secure Boot, Secure Firmware Update, and Secure Storage. Integrated tamper sensors detect attacks and take action, and cryptographic accelerators are hardened against side-channel attacks.
~~Ce~~ **Programmability Via SWD (JTAG) 2 wire interface** Options **Nordic nRFConnect SDK:** Software/Support available from Nordic directly https://devzone.nordicsemi.com/ **Canvas SW Suite** : Software/ Support available from https://www.ezurio.com/canvas/software-suite FW upgrade Via SWD (JTAG) 2 wire interface or UART Supply Voltage Normal Voltage Mode (VDD_nRF): 1.7V-3.5V (Internal DCDC convertor or LDO) ~~Cd~~ **Power Consumption** Active Modes Peak Current (for 30 mA peak Tx@ 1.8V, LE1M max Tx power +7dBm)– Radio only 25 mA peak Tx@ 1.8V, CW 17 mA peak Tx@ 3.3V, LE1M 14 mA peak Tx@ 3.3V, CW Active Modes Peak Current (for Tx 8 mA peak Tx @ 1.8V, LE1M power -40dBm) – Radio only 7 mA peak Tx @ 1.8V, CW 6.5 mA peak Tx @ 3.3V, LE1M 5 mA peak Tx @ 3.3V, CW Active Modes Average Current Depends on many factors. Ultra-low Power Modes System ON Idle 3 uA (System ON IDLE with GRTC (XOSC) and 256 KB RAM) 2.6uA(System ON IDLE with GRTC (XOSC) and 192 KB RAM) System OFF 0.6 uA **Antenna Options** Internal PCB Trace antenna – on-board ( **453-00001 variant for BL54L15, 453-00225 variant for BL54L10)** External Connection via on module IPEX MHF4 ( **453-00044 variant for BL54L15, 453-00226 variant for BL54L10)** ~~Cd~~ **Physical** Dimensions 14mm x 10mm x 1.6mm Pad Pitch – 0.75 mm Pad Type – Three rows of pads (LGA - Land Grid Array). Weight <1 gram **Environmental** ~~|~~ Operating -40 ˚C to +105 ˚C Storage -40 ˚C to +105 ˚C **Miscellaneous** ~~|~~ Lead Free Lead-free and RoHS compliant Warranty One-Year Warranty ~~Cd~~ **Development Tools** Development Kit Development kit per module SKU (453-00001-K1 and 453-00044-K1 respectively, BL54L15 only)
8
© Copyright 2025 Ezurio All Rights Reserved
https://www.ezurio.com/
**BL54L15 / BL54L10 Series** Datasheet
||Utilise the above development kits forprojectsplanned with BL54L10.|
|---|---|
|Development Tools|Nordic nRFConnect - Android and iOS applications|
||UART firmware upgrade|
||Xbit Tools and utilities|
|Bluetooth®|Full Bluetooth SIG Declaration ID|
|FCC/ISED/CE/MIC/RCM/UKCA/KC|All BL54L15/ BL54L10 Series|
## 3 Hardware Specifications
## **3.1 Block Diagram and Pin-out**
**Figure 1: BL54L15/ BL54L10 HW block diagram**
© Copyright 2025 Ezurio All Rights Reserved
9
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**BL54L15 / BL54L10 Series** Datasheet
**==> picture [260 x 247] intentionally omitted <==**
**----- Start of picture text -----**<br>
27<br>GND<br>26<br>VDD_nRF<br>25<br>P1.00/XL1<br>24<br>P1.01/XL2<br>23<br>P1.04/AIN0/CLK<br>22<br>P1.05/AIN1<br>21<br>P1.06/AIN2<br>20<br>P1.07/AIN3<br>19<br>P0.02<br>18<br>P0.01<br>17<br>P0.00<br>28 29 30 31 32 33 34 35 36 37 38 39<br>P1.10 P1.09 P1.08/EXTREF/CLK16M/CLK P0.04/CLK P1.14/AIN7 P1.13/AIN6 P1.12/AIN5/CLK P1.11/AIN4/CLK P0.03/CLK P2.10 P2.06/CLK GND<br>GND P1.02/NFC1 P1.03/NFC2/CLK P2.03 P2.05 P2.04 P2.01/CLK P2.00 P2.02 NRESET SWDCLK SWDIO P2.07 P2.08 P2.09 GND<br>61 15 14 31 21 11 01 9 8 7 6 5 4 3 2 1<br>**----- End of picture text -----**<br>
**Figure 2: Top view - Schematic symbol for 453-00001/453-00225 BL54L15/L10 Module (Nordic nRF54L15/L10) - Integrated PCB Trace Antenna variant or 453-00044/453-00226 MHF4 RF connector variant**
## **3.2 Pin Definitions**
**Table 1: Pin definitions**
|**Pin**|**Pin Name (red**|**nRF54L15**|**nRF54L15/ nRF54L10 QFN48**|**Description**|**Example usage**|
|---|---|---|---|---|---|
|**#**|**coloured pins for clock**|**nRF54L10**|**Name**|||
||**for interfaces, trace)**|**QFN48**||||
|||**Pin**||||
|1|GND|-|VSS|||
|2|P2.09|20|P2.09/TRACEDATA[2]/SPI.SDI|General purpose I/O||
||||/SDO|Trace data|Trace|
|||||SPIM SDI|SPIM00/SPIM21|
|||||SPIS SDI|SPIS00/SPIS21|
|||||UARTE CTS|UARTE00/UARTE21|
|3|P2.08|19|P2.08/TRACEDATA[1]/SPI.SDI|General purpose I/O||
||||/SDO|Trace data|Trace|
|||||SPIM SDO|SPIM00/SPIM21|
|||||SPIS SDO|SPIS00/SPIS21|
|||||UARTE TXD|UARTE00/UARTE21|
|4|P2.07|18|P2.07/TRACEDATA[0]/SWO/S|General purpose I/O||
||||PI.DCX|Trace data|Trace|
|||||Serial wire output (SWO)|Serial wire output (SWO)<br>Trace|
|||||SPIM DCX|SPIM00/SPIM21|
|||||UARTE RXD|UARTE00/UARTE21|
|5|SWDIO|25|SWDIO|Serial Wire Debug IO for||
|||||debugandprogramming||
|6|SWDCLK|26|SWDCLK|Serial Wire Debug clock||
|||||input for debug and||
|||||programming||
|7|NRESET|30|nRESET|Pin RESET with internal||
|||||pull-up resistor (13k||
|||||Ohms). System Reset||
|||||(Active Low).||
10
© Copyright 2025 Ezurio All Rights Reserved
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**BL54L15 / BL54L10 Series** Datasheet
|**Pin**|**Pin Name (red**|**nRF54L15**|**nRF54L15/ nRF54L10 QFN48**|**Description**|**Example usage**|
|---|---|---|---|---|---|
|**#**|**coloured pins for clock**|**nRF54L10**|**Name**|||
||**for interfaces, trace)**|**QFN48**||||
|||**Pin**||||
|8|P2.02|13|P2.02/SPI.SDI/SDO|General purpose I/O||
|||||SPIM SDO|SPIM00/SPIM20<br>SPIS00/SPIS20|
|||||SPIS SDO||
||||||UARTE00/UARTE20|
|||||UARTE TXD|FLPR|
|||||QSPI D0|Trace|
|||||Serial wire output(SWO)||
|9|P2.00|11|P2.00/SPI.DCX|General purpose I/O||
|||||SPIM DCX|SPIM00/SPIM20|
|||||UARTE RXD|UARTE00/UARTE20|
|||||QSPI D3|FLPR(QSPI)|
|10|P2.01/CLK|12|P2.01/SPI.SCK|General purpose I/O|Clock pin|
|||||SPIM SCK|SPIM00/SPIM20|
|||||SPIS SCK|SPIS00/SPIS20|
|||||QSPI SCK|FLPR|
|11|P2.04|15|P2.04/SPI.SDI/SDO|General purpose I/O||
|||||SPIM SDI|SPIM00/SPIM20|
|||||SPIS SDI|SPIS00/SPIS20|
|||||UARTE CTS|UARTE00/UARTE20|
|||||QSPI D1|FLPR|
|12|P2.05|16|P2.05/SPI.CS|General purpose I/O||
|||||SPIM CS|SPIM00/SPIM20|
|||||UARTE RTS|UARTE00/UARTE20|
|||||QSPI CS|FLPR|
|13|P2.03|14|P2.03|General purpose I/O||
|||||QSPI D2|FLPR|
|14|P1.03/NFC2/CLK|4|P1.03/NFC2|General purpose I/O|Clock pin|
|||||Dedicated pin for NFC||
|||||input||
|15|P1.02/NFC1|3|P1.02/NFC1|General purpose I/O||
|||||Dedicated pin for NFC||
|||||input||
|16|GND|||||
|17|P0.00|23|P0.00|Generalpurpose I/O||
|18|P0.01|24|P0.01|Generalpurpose I/O||
|19|P0.02|27|P0.02|Generalpurpose I/O||
|20|P1.07/AIN3|8|P1.07/AIN3/TAMPC|General purpose I/O||
|||||TAMPC active shield 1|TAMPC|
|||||input||
|||||Analoginput||
|21|P1.06/AIN2|7|P1.06/AIN2/TAMPC|General purpose I/O||
|||||TAMPC active shield 1|TAMPC|
|||||output||
|||||Analoginput||
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11
**BL54L15 / BL54L10 Series** Datasheet
|**Pin**|**Pin Name (red**|**nRF54L15**|**nRF54L15/ nRF54L10 QFN48**|**Description**|**Example usage**|
|---|---|---|---|---|---|
|**#**|**coloured pins for clock**|**nRF54L10**|**Name**|||
||**for interfaces, trace)**|**QFN48**||||
|||**Pin**||||
|22|P1.05/AIN1|6|P1.05/AIN1/TAMPC|General purpose I/O||
|||||TAMPC active shield 0|TAMPC|
|||||input|RADIO|
|||||RADIO DFEGPIO||
|||||Analoginput||
|23|P1.04/AIN0/CLK|5|P1.04/AIN0/TAMPC|General purpose I/O|Clock pin|
|||||TAMPC active shield 0|TAMPC|
|||||output||
|||||Analoginput||
|24|P1.01/XL2|2|P1.01/XL2|General purpose I/O|Ezurio Devkit: Optional|
||||||32.768kHz crystal pad XL2, XL1|
|||||General purpose I/O|and associated 9pF load|
|||||Connection for 32.768kHz|capacitor inside nRF54L15|
|||||crystal|chipset.|
|25|P1.00/XL1|1|P1.00/XL1|General purpose I/O|Ezurio Devkit: Optional|
|||||Connection for 32.768kHz|32.768kHz crystal pad XL2, XL1|
|||||crystal|and associated 9pF load|
||||||capacitor inside nRF54L15|
||||||chipset.|
|26|VDD_nRF|48|VDD|1.7V-3.5V input for Normal||
|||||Voltage Mode where||
|||||connect external supply to|connect external supply to|
|||||VDD_nRF(pin26).||
|||||See 3.5 BL54L15/ BL54L10||
|||||Power Supply||
|27|GND|||||
|28|P1.10|38|P1.10/TAMPC|General purpose I/O||
|||||TAMPC active shield 2|TAMPC|
|||||input|RADIO|
|||||RADIO DFEGPIO||
|29|P1.09|37|P1.09/TAMPC|General purpose I/O||
|||||TAMPC active shield 2|TAMPC|
|||||output|RADIO|
|||||RADIO DFEGPIOO||
|30|P1.08/EXTREF/CLK16M/|9|P1.08/CLK16M/TAMPC|General purpose I/O|Clock pin|
||CLK|||GRTC HF clock output||
|||||External reference for||
|||||SAADC||
|31|P0.04/CLK|29|P0.04/GRTC_CLKOUT32K|General purpose I/O|Clock pin|
|||||GRTC LF clock output|GRTC|
|32|P1.14/AIN7|42|P1.14/AIN7|General purpose I/O||
|||||RADIO DFEGPIO|RADIO|
|||||Analoginput||
|33|P1.13/AIN6|41|P1.13/AIN6|General purpose I/O||
|||||RADIO DFEGPIO|RADIO|
|||||Analoginput||
12
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**BL54L15 / BL54L10 Series** Datasheet
|**Pin**|**Pin**<br>**Pin Name (red**|**Pin**<br>**Pin Name (red**|**nRF54L15**<br>**nRF54L15/ nRF54L10 QFN48**<br>**Description**|**Example usage**|
|---|---|---|---|---|
|**#**|**coloured pins for clock**||**nRF54L10**<br>**Name**||
||**for interfaces, trace)**||**QFN48**||
||||**Pin**||
|34|P1.12/AIN5/CLK||40<br>P1.12/AIN5<br>General purpose I/O|Clock pin|
||||TAMPC active shield 3|TAMPC|
||||input|RADIO|
||||RADIO DFEGPIO||
||||Analoginput||
|35|P1.11/AIN4/CLK||39<br>P1.11/AIN4<br>General purpose I/O|Clock pin|
||||TAMPC active shield 3|TAMPC|
||||output|RADIO|
||||RADIO DFEGPIO||
||||Analoginput||
|36|P0.03/CLK||28<br>P0.03/GRTC_PWMOUT<br>General purpose I/O|Clock pin|
||||GRTC PWM output|GRTC|
|37|P2.10||21<br>P2.10/TRACEDATA[3]/SPIM.C<br>General purpose I/O||
||||S<br>Trace|Trace|
||||SPIM CS|SPIM00/SPIM21|
||||UARTE RTS|UARTE00/UARTE21|
|38|P2.06/CLK||17<br>P2.06/TRACECLK/SPI.SCK<br>General purpose I/O|Clock pin|
||||SPIM SCK|SPIM00/SPIM21|
||||SPIS SCK|SPIS00/SPIS21|
||||Trace clock|Trace|
|39|GND||||
|Pin Definition Notes:|Pin Definition Notes:||||
||**Note 1**|**GPIO = General Input or Output (GPIO level voltage tracks VDD pin). AIN =Analog input.**|||
||**GPIO**|If GPIO is selected as an input, ensure the input is not floating (which can cause current consumption to drive with time in|||
|||low power modes (such as System ON Idle), by selecting the internal pull up or pull down.|||
|||**Must connect all GNDpads to host board PCB GNDplane.**|||
||**Note2**|Some peripherals (SPI, TWI, PDM, I2S, TRACE, GRTC) have clock signals. Dedicated clock pins have been optimized to|||
||**Clock for serial**|ensure correct timing relationship between clock and data signal for these peripherals. Pins that can be used as clock||ensure correct timing relationship between clock and data signal for these peripherals. Pins that can be used as clock|
|**interfaces or trace**||signals are shown with pin name in red colour.|||
|||The peripheral data signal must be configured to use pins close to the clock pin. This ensures that the|||
|||internal paths from the peripheral to the pin have the same delay, so that the data and clock signals reach|||
|||the pins at the same time.|||
|||For high-speed signals, the printed circuit board (PCB) layout must use short PCB traces of identical length. This makes|||
|||sure anydelays are kept to a minimum and it assures close to identical delayand clockpath.|||
||**Note 3**|**UARTE20/21:**Can use any pin son GPIO port P1. Can be connected across power domains to dedicated pin on P2.|||
||**Dedicated pins**|**SPIM00:**Has dedicated pins on GPIO port P2. For 32MHz operation, the pins must be configured using extra high|Has dedicated pins on GPIO port P2. For 32MHz operation, the pins must be configured using extra high||
||||drive E0/E1 configuration.||
|||**SPIM20/21:**Can use any pin son GPIO port P1. Can be connected across power domains to dedicated pin on P2.|Can use any pin son GPIO port P1. Can be connected across power domains to dedicated pin on P2.||
|||**SPIS20/21:**Can use any pin son GPIO port P1. Can be connected across power domains to dedicated pin on P2.|Can use any pin son GPIO port P1. Can be connected across power domains to dedicated pin on P2.||
|||**TRACE:**Has dedicated pins on GPIO port P2. For 32MHz operation, the pins must be configured using extra high|Has dedicated pins on GPIO port P2. For 32MHz operation, the pins must be configured using extra high|Has dedicated pins on GPIO port P2. For 32MHz operation, the pins must be configured using extra high|
||||drive E0/E1 configuration.||
|||**GRTC:**Has dedicated pins for clock and PWM output.|Has dedicated pins for clock and PWM output.||
|||**TAMPC:**Has dedicated pins for active shield inputs and outputs.|Has dedicated pins for active shield inputs and outputs.||
|||**FLPR:**|Uses dedicated pins on GPIO port P2 for emulated peripherals such as QSPI.||
|||**RADIO:**Uses dedicated pins on GPIO port P1 for antenna switch control (DFEGPIO for direction finding).|Uses dedicated pins on GPIO port P1 for antenna switch control (DFEGPIO for direction finding).||
|||**NFC:**|Uses dedicatedpins listed inpin definitions table1.||
||**Note 4**|Customer MUST bring out SWDIO, SWCLK, nRESET, VDD, GND for programming purposes.|||
**SWDIO / SWCLK / nRESET / VDD / GND**
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13
**BL54L15 / BL54L10 Series** Datasheet
## **3.3 Electrical Specifications**
## **3.3.1 Absolute Maximum Ratings**
Absolute maximum ratings are the extreme limits for supply voltage and voltages on digital and analogue pins of the module are listed below; exceeding these values causes permanent damage.
|exceeding these values causes permanent damage.||||
|---|---|---|---|
|**Table 2: Absolute maximum ratings **||||
|**Parameter**<br>**Min**<br>**Max**<br>**Unit**<br>**Supply Voltages**<br>~~a~~||||
|VDD_nRF|-0.3|3.6|V|
|**I/Opin voltage**||||
|Voltage at GPIOpin(at VDD≤3.5V)|-0.3|VDD_nRF + 0.3|V|
|Voltage at GPIOpin(at VDD>3.5V)||3.6|V|
|NFC antennapin current(NFC1/2)|-|130|mA|
|**Environmental**||||
|Storage temperature|-40|+105|ºC|
|MSL(Moisture SensitivityLevel)|-|4|-|
|ESD (as per EN301-489)||||
|Conductive||4|kV|
|Air Coupling||8|kV|
|Flash Memory (Endurance) (Note 2)|10,000||Write/erase cycles|
|Flash Memory (Retention)|10 years at 85ºC||years at TBD ºC|
||2years at 105ºC|||
~~ee~~ **Absolute maximum Ratings Notes:**
The absolute maximum rating for VDD pin (max) is 3.6 V for the BL54L15.
**Note 1 Note 2** Wear levelling can be implemented by customer.
## **3.3.2 Recommended Operating Parameters**
|**3.3.2**<br>**Recommended Operating Parameters**|||||
|---|---|---|---|---|
|**Table 3: Power supply operating parameters**|||||
|**Parameter**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>VDD_nRF (independent of DCDC) supplyrange<br>1.7<br>3.5<br>V<br>~~ee~~|||||
|VDD_nRFext(**VDD_nRF**supply voltage under extended|1.7||3.3|V|
|operating|||||
|temperature)|||||
|VDD_nRF Maximum ripple or noise (SeeNote 1)|-|-|10|mV|
|OperatingTemperature Range|-40|+25|+85|ºC|
|Extended operatingtemperature|85||105|ºC|
~~Pe~~ **Recommended Operating Parameters Notes:**
**Note 1** This is the maximum VDD_nRF ripple or noise (at any frequency) that does not disturb the radio. **Note 2** The on-board power-on reset circuitry may not function properly for rise times longer than the specified maximum. **Note 3** Some electrical parameters are valid only for the operating temperature range conditions. When this is the case, an additional parameter for the extended operating temperature condition is provided.
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14
**BL54L15 / BL54L10 Series** Datasheet
## **3.4 Clocks**
## **3.4.1 HFXO - 32MHz crystal oscillator and nRF54L15/nRF54L10 internal load capacitor mandatory setting**
The BL54L15/BL54L10 module contains the 32 MHz crystal, but the load capacitors to create 32MHz crystal oscillator circuit are inside the nRF54L15/nRF54L10 chipset. Customer can set the internal nRF54L15/nRF54L10 capacitors from 4 pF to 17 pF in 0.25pF if needed or use default value without changing.
The 32 MHz crystal inside the BL54L15/BL54L10 module is a high accuracy crystal (±15 ppm at room temperature) that helps with radio operation and reducing power consumption in the active modes.
## **3.4.2 LFCLK – Low Frequency clock source**
There are four possibilities (see figure 3) for the low frequency clock (LFCLK) and options are:
**LFRC (32.768kHz RC oscillator):** The Internal 32.768 kHz RC oscillator (LFRC) is fully embedded in nRF54L15/nRF54L10 (and does not require additional external components) with an accuracy ±250 ppm (after calibration of LFRC at least every eight seconds using the HFXO as a reference oscillator).
**LFXO (32.768kHz crystal oscillator):** For higher LFCLK accuracy (greater than ±250ppm accuracy is required), the low frequency crystal oscillator (LFXO) must be used. To use LFXO, a 32.768kHz crystal must be connected between the XL1 and XL2 pins and the load capacitance between each crustal terminal and ground. Optionally internal (to nRF54L15/nRF54L10) capacitor of maximum 18 pF in 0.5 pF steps are provided on pins XL1 and XL2.
**Low frequency (32.768 kHz) external source** : The 32.768 kHz oscillator (LFXO) is designed to work with external sources
**LFSYNTH (32.768kHz Synthesised clock) from HFCLK (LFSYNTH):** The LFCLK can be synthesised from the HFCLK source. LFSYNTH depends on the HFCLK to run. The accuracy of the LFCLK clock with LFSYNTH as a source assumes the accuracy of the HFCLK. If high accuracy is required, the HFCLK must generated from the HFXO. Using the LFSYNT clock removes the requirement for an external 32.768kHz crystal but the increases the average power consumption as the HFCLK will turned on in the system.
## **3.4.3 Other Internal Clocks**
**Figure 3: nRF54L15/nRF54L10 Clock System Overview (adapted from Nordic)**
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15
**BL54L15 / BL54L10 Series** Datasheet
## **3.5 BL54L15/ BL54L10 Power Supply**
Normal voltage mode power supply mode is entered when the external supply voltage (1.7V-3.5V) is connected to both VDD_nRF pin (pin26). See Figure 4.
**Figure 4: Normal Voltage Mode**
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**BL54L15 / BL54L10 Series** Datasheet
## 4 Programmability
## **4.1 BL54L15/ BL54L10 Default Firmware**
The BL54L15/BL54L10 module is shipped from Ezurio manufacturing facilities with no firmware programmed.
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17
**BL54L15 / BL54L10 Series** Datasheet
## **4.2 BL54L15/ BL54L10 Firmware Options**
Firmware for use with the BL54L15/BL54L10 can be divided into the following types.
- **Bootloader** – This is the application that resides on the Application Core used to perform firmware updates of the Application and FLPR cores.
The MCU Boot or Trusted Firmware M Bootloaders are recommended to be used as the basis for the BL54L15 Bootloader functionality.
- **Application** – This is the main application running on the Application core. In interfaces with the integrated radio stack(s) and provides supplementary functionality in addition to the time critical activities performed for radio activity.
- **Software Defined Peripheral** – This is the application running on the RISC-V FLPR core.
**Figure 5 :Functional SW block diagram for BL54L15/BL54L10 series module**
18
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**BL54L15 / BL54L10 Series** Datasheet
5 Peripherals
|~~I~~|**Feature**<br>~~I~~|**Module**<br>**BL54L15**<br>**BL54L10**<br>**nRF54L15-QFAA**<br>**nRF54L10-QFAA**<br>~~I~~|**Module**<br>**BL54L15**<br>**BL54L10**<br>**nRF54L15-QFAA**<br>**nRF54L10-QFAA**<br>~~I~~|
|---|---|---|---|
|~~I~~|~~I~~|~~I~~|~~I~~|
|Memory|Non-volatile memory (RRAM)|1524 KB 1022 KB|1524 KB 1022 KB|
||Random access memory (RAM)|256 KB 192 KB|256 KB 192 KB|
|Radio|Bluetooth Low Energy||Yes|
||Bluetooth Low Energy Coded PHY (Long range)||Yes|
||Bluetooth Constant Tone Extension (Direction-finding)||Yes|
||IEEE 802.15.4||Yes|
|GPIO pins|GPIO pins|31|31|
||Wakeup-pins|20|20|
||Analog input pins||8|
||GPIO voltage||VDD (1.7V-3.5V)|
|Peripherals|Timers (TIMER)||7|
||Real-time counter (RTC)||2|
||Global real-time counter (GRTC)||Yes|
||Serial interfaces (UART, SPI, TWI)||5|
||Temperature sensor||Yes|
||Comparator (COMP)||Yes|
||Analog-to-digital converter (ADC)||Yes|
||Quadrature decoder (QDEC)||2|
||Inter-IC sound interface (I2S)||2|
||Near-field communication (NFC)||Yes|
||Pulse density modulation interface (PDM)||2|
||Pulse-width modulator (PWM)||3|
||Watchdog timer (WDT)||2|
|Security|Active tamper shield pin pairs (in/out)||4|
||Glitch detectors||Yes|
||Key management unit||Yes|
||Encryption accelerator||Yes|
|Debug|ITM parallel trace|Yes|Yes|
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**BL54L15 / BL54L10 Series** Datasheet
## 6 SW requirements related to hardware
## **6.1 32MHz crystal internal load capacitor setting**
BL54L15/ BL54L10 module contains the 32 MHz crystal but the load capacitors to create 32 MHz crystal oscillator circuit are inside the nRF54L15/ nRF54L10 chipset. Customer can set the internal nRF54L15/nRF54L10 capacitors from 4 pF to 17 pF in 0.25pF if needed, or use default value without changing.
## 7 Hardware Integration Suggestions
## **7.1 Circuit**
The BL54L15/ BL54L10 is easy to integrate, requiring one mandatory external 10uF capacitor on customers board and apart from that those components which customer require for development and in your end application.
The following are suggestions for your design for the best performance and functionality.
## **Checklist (for Schematic):**
- **BL54L15/ BL54L10 power supply:**
Normal voltage mode power supply mode is entered when the external supply voltage (1.7V-3.5V) is connected to both VDD_nRF pin (pin26).
External power source should be within the operating range, rise time and noise/ripple specification of the BL54L15/ BL54L10. Add decoupling capacitors for filtering the external source. Power-on reset circuitry within BL54L15/ BL54L10 series module incorporates brown-out detector, thus simplifying your power supply design. Upon application of power, the internal power-on reset ensures that the module starts correctly.
- **AIN (ADC) and GPIO pin IO voltage levels**
BL54L15/BL54L10 GPIO voltage levels are at VDD_nRF. Ensure input voltage levels into GPIO pins are at VDD_nRF also. Ensure ADC pin maximum input voltage for damage is not violated.
- **AIN (ADC) impedance and external voltage divider setup**
If you need to measure with ADC a voltage higher than 3.5V, you can connect a high impedance voltage divider to lower the voltage to the ADC input pin.
- **SWD**
This is REQUIRED for loading firmware. MUST wire out the SWD two wire interface on host design. Five lines should be wired out, namely SWDIO, SWDCLK, nRESET, GND and VDD.
- **UART and flow control (CTS, RTS)**
Required if customer requires UART.
- **TWI (I2C)**
It is essential to remember that pull-up resistors on both SCL and SDA lines are required, the value as per I2C standard. nRF54L15/ nRF54L10 can provide 13K Ohms typical pull up values internally. For other values, fit external pull-up resistor on both SCL and SDA as per I2C specification to set speed. The I2C specification allows a line capacitance of 400pF.
- **QSPI, High Speed SPI, High speed TWI (I2C, 1Mbps) and Trace**
- High-Speed SPI, TWI and Trace come on dedicated GPIO pins only. Other lower speed SPI and TWI can come out on any GPIO pins. For all high-speed signal, the printed circuit board (PCB) layout must ensure that connections are made using short PCB traces.
- **GPIO pins**
If GPIO is selected as an input, ensure the input is not floating (which can cause current consumption to drive with time in low power modes (such as System ON Idle), by selecting the internal pull up or pull down.
-
-
## **NFC antenna connector**
- To make use of the Ezurio flexi-PCB NFC antenna (part # 0600-00061), fit connector:
- Description – FFC/FPC Connector, Right Angle, SMD/90d, Dual Contact,1.2 mm Mated Height
- Manufacturer – Molex
- Manufacturers Part number – 512810594
Add tuning capacitors of 300 pF on NFC1 pin to GND and 300 pF on NFC2 pins to GND if the PCB track length is similar as development board.
-
## **nRESET pin (active low)**
Hardware reset. Wire out to push button or drive by host.
20
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**BL54L15 / BL54L10 Series** Datasheet
By default module is out of reset when power applied to VDD_nRF pins (13K pull-up inside BL54L15/ BL54L10 (nRF54L15-QFAA/nRF54L10QFAA)).
- **Optional External 32.768kHz crystal**
If the optional external 32.768kHz crystal is needed, then use a crystal that meets specification and add load capacitors (either inside nRF54L15-QFAA/nRF54L10-QFAA or discrete capacitors outside BL54L15/BL54L10 (nRF54L15-QFAA/nRF54L10-QFAA) whose values should be tuned to meet all specification for frequency and oscillation margin.
## **7.2 PCB Layout on Host PCB - General**
## **Checklist (for PCB):**
- MUST locate BL54L15/ BL54L10 module close to the edge of PCB (mandatory for the 453-00001/453-00225 for on-board PCB trace antenna to radiate properly).
- Use solid GND plane on inner layer (for best EMC and RF performance).
- All module GND pins MUST be connected to host PCB GND.
- Place GND vias close to module GND pads as possible.
- Unused PCB area on surface layer can flooded with copper but place GND vias regularly to connect the copper flood to the inner GND plane. If GND flood copper is on the bottom of the module, then connect it with GND vias to the inner GND plane.
- Route traces to avoid noise being picked up on VDD_nRF supply and AIN (analogue), GPIO (digital) traces and high-speed traces.
- Ensure no exposed copper is on the underside of the module (refer to land pattern of BL54L15/BL54L10 development board).
## **7.3 PCB Layout on Host PCB for the 453-00001 and 453-00225**
## **7.3.1 Antenna Keep-out on Host PCB**
The 453-00001/453-00225 has an integrated PCB trace antenna and its performance is sensitive to host PCB. It is critical to locate the 45300001/453-00225 on the edge of the host PCB (or corner) to allow the antenna to radiate properly. Refer to guidelines in section **PCB land pattern and antenna keep-out area for the 453-00001/453-00225** . Some of those guidelines repeated below.
- Ensure there is no copper in the antenna keep-out area on any layers of the host PCB. Keep all mounting hardware and metal clear of the area to allow proper antenna radiation.
- For best antenna performance, place the 453-00001/453-00225 module on the edge of the host PCB, preferably in the edge center.
- The BL54L15 development board (453-00001-K1) has the 453-00001 module on the edge of the board (not in the corner). The antenna keepout area is defined by the BL54L15 development board which was used for module development and antenna performance evaluation is shown in Figure 6, where the antenna keep-out area is ~5mm wide, ~28.6mm long; with PCB dielectric (no copper) height ~1.57mm sitting under the 453-00001 PCB trace antenna module. Bl54L10 module (453-00225) please follow the same design of BL54L15.
- The 453-00001 PCB trace antenna is tuned when the 453-00001 is sitting on development board (host PCB) with size of 113 mm x 63.5 mm x 1.6mm.
- A different host PCB thickness dielectric will have small effect on antenna.
- The antenna-keep-out defined in the 8.2 Host PCB Land Pattern and Antenna Keep-out for the 453-00001 and 453-00225 section.
- Host PCB land pattern and antenna keep-out for the BL54L15/BL54L10 applies when the 453-00001/453-00225 is placed in the edge of the host PCB preferably in the edge center. **Error! Reference source not found.** shows an example.
**==> picture [390 x 23] intentionally omitted <==**
**----- Start of picture text -----**<br>
A<br>Antenna Keep-out 2<br>**----- End of picture text -----**<br>
Figure 6 : PCB trace Antenna keep-out area (shown in red), corner of the BL54L15 development board for the 453-00001 module.
## **Antenna Keep-out Notes:**
**Note 1** The BL54L15/BL54L10 module is placed on the edge, preferably edge centre of the host PCB.
**Note 2** Copper cut-away on all layers in the Antenna Keep-out area under the 453-00001/453-00225 on host PCB.
21
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**BL54L15 / BL54L10 Series** Datasheet
## **7.3.2 Antenna Keep-out and Proximity to Metal or Plastic**
## **Checklist (for metal /plastic enclosure):**
- Minimum safe distance for metals without seriously compromising the antenna (tuning) is 40 mm top/bottom and 30 mm left or right.
- Metal close to the 453-00001/453-00225 PCB trace monopole antenna (bottom, top, left, right, any direction) will have degradation on the antenna performance. The amount of that degradation is entirely system dependent, meaning you will need to perform some testing with your host application.
- Any metal closer than 20 mm will begin to significantly degrade performance (S11, gain, radiation efficiency).
- It is best that you test the range with a mock-up (or actual prototype) of the product to assess effects of enclosure height (and materials, whether metal or plastic) and host PCB ground (GND plane size).
## **7.4 External Antenna Integration with BL54L15/BL54L10 MHF4 variant (453-00044/453-**
## **00226)**
Please refer to the regulatory sections for FCC, ISED, CE, MIC, UKCA and RCM details of use of BL54L15 with external antennas in each regulatory region.
The BL54L15/BL54L10 family has been designed to operate with the below external antennas (with a maximum gain of 2.32 dBi). The required antenna impedance is 50 ohms. See Table 4. External antennas improve radiation efficiency.
**Table 4: External antennas for the BL54L15/BL54L10** _**RF trace pin variant module (453-00044/453-00226)**_
|**Manufacturer**<br>**Model**<br>**Ezurio**<br>**Part Number**<br>**Type**<br>**Connector**<br>**Peak Gain**<br>**2400-2500 MHz**<br>**2400-2480 MHz**<br>~~te~~|**Manufacturer**<br>**Model**<br>**Ezurio**<br>**Part Number**<br>**Type**<br>**Connector**<br>**Peak Gain**<br>**2400-2500 MHz**<br>**2400-2480 MHz**<br>~~te~~|**Manufacturer**<br>**Model**<br>**Ezurio**<br>**Part Number**<br>**Type**<br>**Connector**<br>**Peak Gain**<br>**2400-2500 MHz**<br>**2400-2480 MHz**<br>~~te~~|**Manufacturer**<br>**Model**<br>**Ezurio**<br>**Part Number**<br>**Type**<br>**Connector**<br>**Peak Gain**<br>**2400-2500 MHz**<br>**2400-2480 MHz**<br>~~te~~|**Manufacturer**<br>**Model**<br>**Ezurio**<br>**Part Number**<br>**Type**<br>**Connector**<br>**Peak Gain**<br>**2400-2500 MHz**<br>**2400-2480 MHz**<br>~~te~~|**Manufacturer**<br>**Model**<br>**Ezurio**<br>**Part Number**<br>**Type**<br>**Connector**<br>**Peak Gain**<br>**2400-2500 MHz**<br>**2400-2480 MHz**<br>~~te~~|**Manufacturer**<br>**Model**<br>**Ezurio**<br>**Part Number**<br>**Type**<br>**Connector**<br>**Peak Gain**<br>**2400-2500 MHz**<br>**2400-2480 MHz**<br>~~te~~|
|---|---|---|---|---|---|---|
|Ezurio (Laird|NanoBlue|EBL2400A1-|PCB Dipole|PCB Dipole<br>IPEX MHF4|2 dBi|-|
|Connectivity)|Connectivity)|10MH4L|||||
|Ezurio (Laird|FlexPIFA|001-0022|PIFA|IPEX MHF4|-|2 dBi|
|Connectivity)|Connectivity)||||||
|Mag.Layers|EDA-8709-2G4C1-B27-CY|EDA-8709-2G4C1-B27-CY<br>0600-00057|Dipole|IPEX MHF4|2.32 dBi|-|
|Ezurio (Laird|mFlexPIFA|EFA2400A3S-|PIFA|IPEX MHF4|-|2 dBi|
|Connectivity)|Connectivity)|10MH4L|||||
|Ezurio (Laird|iFlexPIFA Mini|EFG2401A3S-|PIFA|IPEX MHF4|-|2 dBi|
|Connectivity)|Connectivity)|10MH4L|||||
|Ezurio (Laird|Ezurio NFC|0600-00061|NFC|N/A|-|-|
|Connectivity)|Connectivity)||||||
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**BL54L15 / BL54L10 Series** Datasheet
## 8 Mechanical Details
## **8.1 BL54L15/BL54L10 Mechanical Details**
Figure 7 : Mechanical Details – Internal Antenna variant module (453-00001)
Figure 8 : Mechanical Details – Internal Antenna variant module (453-00225)
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**BL54L15 / BL54L10 Series** Datasheet
Figure 9 : Mechanical Details – MHF4 RF connector variant module (453-00044)
Figure 10 : Mechanical Details – MHF4 RF connector variant module (453-00226)
3D models for BL54L15 Module, MHF4 (453-00044) and BL54L15 Module, Trace Antenna (453-00001) on the BL54L15 product page – https://www.ezurio.com/product/bl54l15-series-bluetooth-le-80215-4-nfc
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**BL54L15 / BL54L10 Series** Datasheet
## **8.2 Host PCB Land Pattern and Antenna Keep-out for the 453-00001 and 453-00225**
PCB footprint - BL54L15 (DXF and Altium format) and SCH Symbol - BL54L15 (Altium format) can be found on the BL54L15 product page – https://www.ezurio.com/product/bl54l15-series-bluetooth-le-80215-4-nfc
BL54L10 use the same footprint of BL54L15
Figure 11 : Land pattern and Keep-out for the 453-00001 and 453-00225
**All dimensions are in mm.**
## **Host PCB Land Pattern and Antenna Keep-out for the 453-000xx Notes:**
|**Note 1**|**Note 1**|Ensure there is no copper in the antenna ‘keep out area’ on any layers of the host PCB. Also keep all mounting hardware or|
|---|---|---|
|||any metal clear of the area (Refer to7.3.2) to reduce effects of proximity detuning the antenna and to help antenna radiate|
|||properly.|
|**Note 2**|**Note 2**|For the best on-board antenna performance, the module 453-00001/453-00225 MUST be placed on the edge of the host|
|||PCB and preferably in the edge centre and host PCB, the antenna “Keep Out Area” is extended (seeNote 4).|
|**Note 3**|**Note 3**|BL54L15 development board has the 453-00001 placed on the edge of the PCB board (and not in corner) for that the|
|||Antenna keep out area is extended down to the corner of the development board, see section8.2Host PCB Land Pattern|
|||and Antenna Keep-out for the 453-00001 and 453-00225.|
|**Note 4**|**Note 4**|Ensure that there is no exposed copper under the module on the host PCB.|
|**Note 5**|**Note 5**|You may modify the PCB land pattern dimensions based on their experience and/or process capability.|
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**BL54L15 / BL54L10 Series** Datasheet
## 9 On -Board PCB Trace Antenna Characteristics
## **9.1 Summary of Antenna Performance**
|||**2402MHz**|**2440MHz**|**2480MHz**||
|---|---|---|---|---|---|
|||**Peak**<br>**Avg**|**Peak**|**Avg**<br>**Peak**|**Avg**|
|453-00001/453-00225 PCB trace antenna|453-00001/453-00225 PCB trace antenna|+0.2dBi<br>-4.24dBi|+1.49dBi|-3.19dBi<br>+1.39dBi|-3.27dBi|
## **9.2 2.4GHz Radiated Performance**
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**BL54L15 / BL54L10 Series** Datasheet
## **9.3 Antenna S11 measuring data**
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**BL54L15 / BL54L10 Series** Datasheet
## 10 Application Note for Surface Mount Modules
## **10.1 Introduction**
Ezurio’s surface mount modules are designed to conform to all major manufacturing guidelines. This application note is intended to provide additional guidance beyond the information that is presented in the user manual. This application note is considered a living document and will be updated as new information is presented.
The modules are designed to meet the needs of several commercial and industrial applications. They are easy to manufacture and conform to current automated manufacturing processes.
Part numbers – **453-00001R/453-00225R and 453-00044R/453-00226R** are shipped as Tape / Reel, with a reel containing 1,000 pcs.
## **10.2 Module Packaging Configuration**
**Figure 12: Reel specifications – 1,000 pieces per reel**
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**BL54L15 / BL54L10 Series** Datasheet
**Figure 13: Carrier Tape specifications**
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**BL54L15 / BL54L10 Series** Datasheet
**Figure 14: BL54L15/BL54L10 Packaging Process**
## **10.3 Module Shipping**
All modules are shipped in tape and reel package and sealed in ESD Bags.
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**BL54L15 / BL54L10 Series** Datasheet
## **10.4 Labeling**
The following labels are placed on the anti-static bag. The BL54L15/BL54L10 modules are classified as MSL4 devices.
**Figure 15: Moisture Sensitivity Level Label**
**Figure 16: Product Identifier Label**
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**BL54L15 / BL54L10 Series** Datasheet
The following labels are placed on the pizza box.
**Figure 17: Product Identifier Label**
The following labels are placed on the master shipping carton.
**Figure 18: Standard Shipping Carton Label**
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**BL54L15 / BL54L10 Series** Datasheet
## **10.5 Required Storage Conditions**
## **10.5.1 Prior to Opening the Dry Packing**
The following are required storage conditions **prior to opening the dry packing** :
- Normal temperature: 5~40˚C
- Normal humidity: 80% (Relative humidity) or less
- Storage period: One year or less
**Note:** Humidity means relative humidity.
## **10.5.2 After Opening the Dry Packing**
The following are required storage conditions **after opening the dry packing** (to prevent moisture absorption):
- Storage conditions for one-time soldering:
- Temperature: 5-25°C
- Humidity: 60% or less
- Period: 72 hours or less after opening
- Storage conditions for two-time soldering
- Storage conditions following opening and prior to performing the 1[st] reflow:
- Temperature: 5-25°C
- Humidity: 60% or less
- Period: A hours or less after opening
- Storage conditions following completion of the 1[st] reflow and prior to performing the 2[nd] reflow
- Temperature: 5-25°C
- Humidity: 60% or less
- Period: B hours or less after completion of the 1[st] reflow
**Note:** Should keep A+B within 72 hours.
## **10.5.3 Temporary Storage Requirements after Opening**
The following are temporary storage requirements after opening:
- Only re-store the devices once prior to soldering.
- Use a dry box or place desiccant (with a blue humidity indicator) with the devices and perform dry packing again using vacuumed heatsealing.
The following indicate the required storage period, temperature, and humidity for this temporary storage:
- Storage temperature and humidity:
**==> picture [438 x 38] intentionally omitted <==**
**----- Start of picture text -----**<br>
Temperature: +5 to +40°C Temperature: +5 to +25°C<br>Temperature: +5 to +40°C Temperature: +5 to +25°C<br>Humidity: 80% or less Humidity: 60% or less<br>Humidity: 80% or less Humidity: 60% or less<br>*** ***<br>**----- End of picture text -----**<br>
*** - External atmosphere temperature and humidity of the dry packing
- Storage period:
- X1+X2 – Refer to After Opening the Dry Packing storage requirements. Keep is X1+X2 within 72 hours.
- Y – Keep within two weeks or less.
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**BL54L15 / BL54L10 Series** Datasheet
## **10.6 Baking Conditions**
Baking conditions and processes for the module follow the J-STD-033 standard which includes the following:
- The calculated shelf life in a sealed bag is 12 months at <40℃ and <80% relative humidity.
- Once the packaging is opened, the module must be mounted (per MSL4/Moisture Sensitivity Level 4) within 72 hours at <30˚C and <60% relative humidity.
- If the module is not mounted within 72 hours or if, when the dry pack is opened, the humidity indicator card displays >10% humidity, then the product must be baked for 48 hours at 125 ˚C (±5 ˚C).
## **10.7 Surface Mount Conditions**
The following soldering conditions are recommended to ensure device quality.
## **10.7.1 Soldering**
**Note:** When soldering, the stencil thickness should be ≥ 0.1 mm.
Convection reflow or IR/Convection reflow (one-time soldering or two-time soldering in air or nitrogen environment)
- Measuring point – IC package surface
- Temperature profile:
## **Figure 19: Temperature profile**
- Ramp-up: 40-130˚C. Less than 2.5˚C/sec
- Pre heat: 130-180˚C 60-120 sec, 180˚C MAX
- Ramp-up: 180-220˚C. Less than 3˚C/sec
- Peak Temperature: MAX 250˚C
- 225˚C ~ 250˚C, 30 ~ 50 sec
- Ramp-down: Less than 3˚C/sec
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**BL54L15 / BL54L10 Series** Datasheet
- **10.7.2 Cautions When Removing the BL54L15/BL54L10 from the Platform for RMA**
- Bake the platform before removing the BL54L15/BL54L10 from the platform. Reference baking conditions.
- Remove the BL54L15/BL54L10 by using a hot air gun. This process should be carried out by a skilled technician.
Suggestion conditions:
- One-side component platform:
- Set the hot plate at 280 `°` C.
- Put the platform on the hot plate for 8~10 seconds.
- Remove the SIP from platform.
- Two-side components platform:
- Use two hot air guns
- `°`
- On the bottom side, use a pre-heated nozzle (temperature setting of 200~250 C) at a suitable distance from the platform PCB.
- `°`
- On the top side, apply a remove nozzle (temperature setting of 330 C). Heat the SIP until it can be removed from platform PCB.
**==> picture [251 x 144] intentionally omitted <==**
**----- Start of picture text -----**<br>
Remove Nozzle<br>Platform PCB BL5L15/BL54L1<br>a 0<br>| | | | |<br>Pre-heat Nozzle<br>**----- End of picture text -----**<br>
- Remove the residue solder under the bottom side of module. (Note: Alternate module pictured as an example)
(Not accepted for RMA) (Accepted for RMA analysis)
## **Example module with residue solder on the bottom Example Module, no residue solder**
- Remove and clean the residue flux as needed.
## **10.7.3 Precautions for Use**
- Opening/handing/removing must be done on an anti-ESD treated workbench. All workers must also have undergone anti-ESD treatment.
- The devices should be mounted within one year of the date of delivery.
- The BL54L15/BL54L10 modules are MSL 4 rated.
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**BL54L15 / BL54L10 Series** Datasheet
## 11 Reliability Test
## **11.1 Climatic And Dynamic Reliability Test**
|**Table 5: Climatic and Dynamic Reliability Test Results for BL54L15/BL54L10 Modules**<br>**Test Item**<br>**Specification**<br>**Standard**<br>**Test Result**<br>Thermal Shock<br>Temperature: -40 ~ 105℃<br>Ramp time: Less than 10 seconds.<br>Dwell Time: 10 minutes<br>Number of Cycles: 350 times<br>*JESD22-A106<br>*IEC 60068-2-14 for dwell<br>time and number of cycles<br>PASS<br>~~en~~<br>~~ee~~|**Table 5: Climatic and Dynamic Reliability Test Results for BL54L15/BL54L10 Modules**<br>**Test Item**<br>**Specification**<br>**Standard**<br>**Test Result**<br>Thermal Shock<br>Temperature: -40 ~ 105℃<br>Ramp time: Less than 10 seconds.<br>Dwell Time: 10 minutes<br>Number of Cycles: 350 times<br>*JESD22-A106<br>*IEC 60068-2-14 for dwell<br>time and number of cycles<br>PASS<br>~~en~~<br>~~ee~~|**Table 5: Climatic and Dynamic Reliability Test Results for BL54L15/BL54L10 Modules**<br>**Test Item**<br>**Specification**<br>**Standard**<br>**Test Result**<br>Thermal Shock<br>Temperature: -40 ~ 105℃<br>Ramp time: Less than 10 seconds.<br>Dwell Time: 10 minutes<br>Number of Cycles: 350 times<br>*JESD22-A106<br>*IEC 60068-2-14 for dwell<br>time and number of cycles<br>PASS<br>~~en~~<br>~~ee~~|**Table 5: Climatic and Dynamic Reliability Test Results for BL54L15/BL54L10 Modules**<br>**Test Item**<br>**Specification**<br>**Standard**<br>**Test Result**<br>Thermal Shock<br>Temperature: -40 ~ 105℃<br>Ramp time: Less than 10 seconds.<br>Dwell Time: 10 minutes<br>Number of Cycles: 350 times<br>*JESD22-A106<br>*IEC 60068-2-14 for dwell<br>time and number of cycles<br>PASS<br>~~en~~<br>~~ee~~|
|---|---|---|---|
||Vibration Wave Form: Sine Waveform|||
||Vibration frequency / Displacement: 20-80 Hz/1.5mm|||
|Vibration|Vibration frequency / Acceleration: 80-2000 Hz/20g|||
|Non-Operating Unpackaged|Cycle Time: 4 min/cycle|JEDEC 22-B103B (2016)|PASS|
|device|Number of Cycles: 4 cycle/axis|||
||Vibration Axes: X, Y and Z (Rotate each axis on vertical|||
||vibration table)|||
||Pulse shape: Half-sine waveform|||
|Mechanical Shock|Impact acceleration: 1500 g|||
|Non-Operating Unpackaged|Pulse duration: 0.5 ms|JEDEC 22-B110B.01 (2019)|PASS|
|device|Number of shocks: 30 shocks (5 shocks for each face)|||
||Orientation: Bottom, top, left, right, front, and rear faces|||
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**BL54L15 / BL54L10 Series** Datasheet
## **11.2 Reliability MTBF Prediction**
||**Table 6: MTBF Predictions for BL54L15/BL54L10 Modules**|**Table 6: MTBF Predictions for BL54L15/BL54L10 Modules**|||
|---|---|---|---|---|
|**Ezurio Part Number**<br>**Environment**<br>~~ee~~|||**Standard**|**Test Result 45**℃<br>**(Hours)**<br>~~eee~~|
||453-00001R||||
||453-00001C||||
|||Ground, Fixed, Uncontrolled|Telcordia Issue 4|1,559,211|
||453-00225R||||
||453-00225C||||
||453-00044R||||
||453-00044C||||
|||Ground, Fixed, Uncontrolled|Telcordia Issue 4|1,559,211|
||453-00226R||||
||453-00226C||||
||453-00001R||||
||453-00001C||||
|||Mobile, Fixed, Uncontrolled|Telcordia Issue 4|605,957|
||453-00225R||||
||453-00225C||||
||453-00044R||||
||453-00044C||||
|||Mobile, Fixed, Uncontrolled|Telcordia Issue 4|605,957|
||453-00226R||||
||453-00226C||||
|**Ezurio Part Number**<br>~~ae~~||**Environment**|**Standard**|**Test Result 105**℃<br>**(Hours)**|
||453-00001R||||
||453-00001C||||
|||Ground, Fixed, Uncontrolled|Telcordia Issue 4|980,517|
||453-00225R||||
||453-00225C||||
||453-00044R||||
||453-00044C||||
|||Ground, Fixed, Uncontrolled|Telcordia Issue 4|980,517|
||453-00226R||||
||453-00226C||||
||453-00001R||||
||453-00001C||||
|||Mobile, Fixed, Uncontrolled|Telcordia Issue 4|283,138|
||453-00225R||||
||453-00225C||||
||453-00044R||||
||453-00044C||||
|||Mobile, Fixed, Uncontrolled|Telcordia Issue 4|283,138|
||453-00226R||||
||453-00226C||||
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37
**BL54L15 / BL54L10 Series** Datasheet
## 12 Regulatory
Full regulatory information on the BL54L15/BL54L10, including the Regulatory Information Guide, grants, and test reports are available on the BL54L15 product page and BL54L10 product page.
The BL54L15/BL54L10 holds current certifications in the following countries:
**Table 7: BL54L15 Certifications**
|**Table 7: BL54L15 Certifications**|**Table 7: BL54L15 Certifications**||
|---|---|---|
|**Country/Region**<br>USA (FCC)<br>~~a~~||**Regulatory ID**<br>SQG-BL54L15|
||EU (ETSI)|N/A (No ID Number Required)|
||UKCA|N/A (No ID Number Required)|
||Canada (ISED)|3147A-BL54L15|
||Japan (MIC)|201-250023|
||Australia (RCM)|N/A|
||New Zealand (RCM)|N/A|
||Korea|R-C-EZU1-BL54L15 (for BL54L15)|
|||R-C-EZU1-BL54L10 (for BL54L10)|
## **12.1 Certified Antennas for the BL54L15/BL54L10**
||**Table 8: Certified Antennas for BL54L15/BL54L10 Modules**|**Table 8: Certified Antennas for BL54L15/BL54L10 Modules**|**Table 8: Certified Antennas for BL54L15/BL54L10 Modules**||||
|---|---|---|---|---|---|---|
|**Model**<br>**MPN**<br>~~a~~|||**Manufacturer**|**Type**|**Connector**|**Connector**<br>**Peak Gain**<br>**(2400 – 2500 MHz)**|
||NanoBlue|EBL2400A1-10MH4L|Ezurio|PCB Dipole|IPEX MHF4|2 dBi|
||FlexPIFA|001-0022|Ezurio|FlexPIFA|IPEX MHF4L|2 dBi|
||EDA-8709-|EDA-8709-2G4C1-B27-CY|MAG.LAYERS|Dipole|IPEX MHF4|2.32 dBi|
||2G4C1-B27-CY|(Ezurio Part#0600-00057)|||||
||mFlexPIFA|EFA2400A3S-10MH4L|Ezurio|PIFA|IPEX MHF4L|2 dBi|
||I-FlexPIFATM|EFG2401A3S-10MHF4L|Ezurio|I-FlexPIFA|IPEX MHF4L|IPEX MHF4L<br>2 dBi|
||Mini Series||||||
||Ezurio NFC|0600-00061|Ezurio|Coiled Inductor|FFC/FPC|-|
||||||Connector||
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**BL54L15 / BL54L10 Series** Datasheet
## 13 Bluetooth Qualification Process
## **13.1 Overview**
The Bluetooth Qualification Process promotes global product interoperability and reinforces the strength of the Bluetooth® brand and ecosystem to the benefit of all Bluetooth SIG members. The Bluetooth Qualification Process helps member companies ensure their products that incorporate Bluetooth technology comply with the Bluetooth Patent & Copyright License Agreement and the Bluetooth Trademark License Agreement (collectively, the Bluetooth License Agreement) and Bluetooth Specifications.
The Bluetooth Qualification Process is defined by the Qualification Program Reference Document (QPRD) v3.
To demonstrate that a product complies with the Bluetooth Specification(s), each member must for each of its products:
- Identify the product, the design included in the product, the Bluetooth Specifications that the design implements, and the features of each implemented specification
- Complete the Bluetooth Qualification Process by submitting the required documentation for the product under a user account belonging to your company
The Bluetooth Qualification Process consists of the phases shown below:
To complete the Qualification Process the company developing a Bluetooth End Product shall be a member of the Bluetooth SIG. To start the application please use the following link: Apply for Adopter Membership
## **13.2 Scope**
This guide is intended to provide guidance on the Bluetooth Qualification Process for End Products that reference a single existing design, that has not been modified, (refer to Section 3.2.1 of the Qualification Program Reference Document v3).
This option applies to a Member qualifying a Product that includes an existing Design that has a DN, QDID, or DID and that Design has not been modified (e.g., rebranding a Qualified Product from another Member). The Design identified by the DN, QDID, or DID may only implement Bluetooth Specifications that are active or deprecated at the time of Submission. No modifications may be made to the Design, including changes to the ICS Form.
Changes to the Product outside the Design are allowed, including:
- Enabling technologies
- Changes to the industrial design
- Changes to the communication technology other than Bluetooth
- Changes to the features that are unrelated to Bluetooth, branding, packaging, colour, shape, Product name, or Model number
Members are responsible for assessing that modifications to the Product outside of the Design do not affect compliance with Bluetooth Specifications or result in a change to the ICS Form.
For the purposes of this document, it is assumed that the member is combining a single unmodified Core-Complete Configuration.
## **13.3 Qualification Steps When Referencing a single existing design, (unmodified) – Option 1**
## **in the QPRDv3**
For this qualification, follow these steps:
1. To start a listing, go to: https://qualification.bluetooth.com/
2. Select **Start the Bluetooth Qualification Process** .
3. Product Details to be entered:
- Project Name (this can be the product name or the Bluetooth Design name).
- Product Description
- Model Number
- Product Publication Date (the product publication date may not be later than 90 days after submission)
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- Product Website (optional)
- Internal Visibility (this will define if the product will be visible to other users prior to publication)
- If you have multiple End Products to list then you can select ‘Import Multiple Products’, firstly downloading and completing the template, then by ‘Upload Product List’. This will populate Qualification Workspace with all your products.
4. Specify the Design:
- Do you include any existing Design(s) in your Product? Answer Yes, I do.
- Enter the single DN or QDID used in your, (for Option 1 only one DN or QDID can be referenced)
- Once the DN or QDID is selected it will appear on the left-hand side, indicating the layers covered by the design.
- Select ‘I’m finished entering DN’s
- What do you want to do next? Answer, ‘Use this Design without Modification’
- Save and go to Product Qualification Fee
5. Product Qualification Fee:
- It’s important to make sure a Prepaid Product Qualification fee is available as it is required at this stage to complete the Qualification Process.
- Prepaid Product Qualification Fee’s will appear in the available list so select one for the listing.
- If one is not available select ‘Pay Product Qualification Fee’, payment can be done immediately via credit card, or you can pay via Invoice. Payment via credit will release the number immediately, if paying via invoice the number will not be released until the invoice is paid.
- Once you have selected the Prepaid Qualification Fee, select ‘Save and go to Submission’
6. Submission:
- Some automatic checks occur to ensure all submission requirements are complete.
- To complete the listing any errors must be corrected
- Once you have confirmed all design information is correct, tick all of the three check boxes and add your name to the signature page.
- Now select ‘Complete the Submission’.
- You will be asked a final time to confirm you want to proceed with the submission, select ‘Complete the Submission’.
- Qualification Workspace will confirm the submission has been submitted. The Bluetooth SIG will email confirmation once the submission has been accepted, (normally this takes 1 working day).
7. Download Product and Design Details:
- a. You can now download a copy of the confirmed listing from the design listing page and save a copy in your Compliance Folder
For further information, please refer to the following webpage:
https://www.bluetooth.com/develop-with-bluetooth/qualification-listing/
## **13.4 Example Designs for reference**
The following gives an example of a design possible under option 1:
**Ezurio End Product design using Nordic Component based design**
**Design Name Owner Design ID Link to listing on the SIG website** ~~a es es~~ BL54L15/BL54L15µ Ezurio Q345095 https://qualification.bluetooth.com/ListingDetails/274104 **13.5 Qualify More Products**
If you develop further products based on the same design in the future, it is possible to add them free of charge. The new product must not modify the existing design i.e add ICS functionality, otherwise a new design listing will be required.
To add more products to your design, select ‘Manage Submitted Products’ in the Getting Started page, Actions, Qualify More Products. The tool will take you through the updating process.
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© Copyright 2025 Ezurio All Rights Reserved
https://www.ezurio.com/
**BL54L15 / BL54L10 Series** Datasheet
## 14 Ordering Information
|**Part Number**<br>453-00001R<br>~~a~~|**Part Number**<br>453-00001R<br>~~a~~|**Product Description**<br>Module,BL54L15, (Nordic nRF54L15),Trace antenna,Tape/Reel|
|---|---|---|
||453-00044R|Module,BL54L15, (Nordic nRF54L15),MHF4 Connector,Tape/Reel|
||453-00001C|Module,BL54L15, (Nordic nRF54L15),Trace antenna,Cut Tape|
||453-00044C|Module,BL54L15, (Nordic nRF54L15),MHF4 Connector,Cut Tape|
||453-00001-K1|Development kit,Module,BL54L15(Nordic nRF54L15),Trace antenna|
||453-00044-K1|Development kit,Module,BL54L15(Nordic nRF54L15),MHF4 Connector|
||453-00225R|Module,BL54L10, (Nordic nRF54L10),Trace antenna,Tape/Reel|
||453-00226R|Module,BL54L10, (Nordic nRF54L10),MHF4 Connector,Tape/Reel|
||453-00225C|Module,BL54L10, (Nordic nRF54L10),Trace antenna,Cut Tape|
||453-00226C|Module,BL54L10, (Nordic nRF54L10),MHF4 Connector,Cut Tape|
© Copyright 2025 Ezurio All Rights Reserved
https://www.ezurio.com/
41
**BL54L15 / BL54L10 Series** Datasheet
## 15 Additional Information
Please contact your local sales representative or our support team for further assistance:
|**Headquarters**|Ezurio|
|---|---|
||50 S. Main St. Suite 1100|
||Akron, OH 44308 USA|
|**Website**|http://www.ezurio.com|
|**Technical Support**|http://www.ezurio.com/resources/support|
|**Sales Contact**|http://www.ezurio.com/contact|
**Note:** Information contained in this document is subject to change.
Ezurio’s products are subject to standard Terms & Conditions.
© Copyright 2025 Ezurio All Rights Reserved. Any information furnished by Ezurio and its agents is believed to be accurate but cannot be guaranteed. All specifications are subject to change without notice. Responsibility for the use and application of Ezurio materials or products rests with the end user since Ezurio and its agents cannot be aware of all potential uses. Ezurio makes no warranties as to non-infringement nor as to the fitness, merchantability, or sustainability of any Ezurio materials or products for any specific or general uses. Ezurio or any of its affiliates or agents shall not be liable for incidental or consequential damages of any kind. All Ezurio products are sold pursuant to the Ezurio Terms and Conditions of Sale in effect from time to time, a copy of which will be furnished upon request. Nothing herein provides a license under any Ezurio or any third-party intellectual property right. Ezurio and its associated logos are trademarks owned by Ezurio and/or its affiliates.
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© Copyright 2025 Ezurio All Rights Reserved
https://www.ezurio.com/
Updated at June 5, 2026
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