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453-00013C
U.FL MODULE, IOT, 2.4GHZ-2.5GHZ
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: EZURIO
- Product type:
- Available until stocks are exhausted
- SVHC: To Be Advised
- Frequency RF: 2.5GHz
- Product Range: Sterling-EWB Series
- Module Interface: I2C, I2S, SPI, UART, USART
- Module Applications: Internet of Things (IoT)
| Delivery and price | |
|---|---|
| Units per pack | 1 |
| Price | 14.49 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
A
_Version 1.3_
|**Version**||**Date**|**Notes**|**Contributor(s)**|**Approver**|
|---|---|---|---|---|---|
|1.0|26 June 2019|26 June 2019|Initial version|Dave Neperud,<br>Aaron Arbiture|Jay White|
||||Updated Regulatory section with|||
|1.1|24 July 2019|24 July 2019|new certifications; ™ added to|Maggie Teng|Jay White|
||||required module names.|||
|1.2|05 Aug 2019|05 Aug 2019|Updated Bluetooth SIG section|Jonathan Kaye|Jay White|
|1.3|28 Aug 2019|28 Aug 2019|Corrected the Pin 80 VBAT<br>description|Dave Neperud|Jay White|
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|1|Scope .................................................................................................................................................................................. 4|Scope .................................................................................................................................................................................. 4|
|---|---|---|
|2|Introduction .......................................................................................................................................................................... 4||
||2.1|General Description.................................................................................................................................................... 4|
||2.2|Features Summary ..................................................................................................................................................... 4|
||2.3|Applications ................................................................................................................................................................ 5|
|3|Module Variants ................................................................................................................................................................... 5||
|4|Ordering Information ............................................................................................................................................................ 6||
||4.1|Module Accessories ................................................................................................................................................... 7|
|5|Block Diagram ..................................................................................................................................................................... 8|Block Diagram ..................................................................................................................................................................... 8|
|6|Base SiP Module Footprint and Pin Definitions ................................................................................................................... 9|Base SiP Module Footprint and Pin Definitions ................................................................................................................... 9|
|7|U.FL/Chip Antenna Module Footprint and Pin Definitions ................................................................................................. 15||
|8|Specifications .................................................................................................................................................................... 19||
||8.1|General Characteristics ............................................................................................................................................ 19|
||8.2|Power Supply Requirements .................................................................................................................................... 19|
||8.2.1|RF Characteristics .............................................................................................................................................. 19|
||8.3|Maximum Ratings..................................................................................................................................................... 20|
||8.4|WLAN Power Consumption ...................................................................................................................................... 20|
||8.5|Bluetooth Power Consumption ................................................................................................................................. 20|
||8.6|WLAN RF Characteristics ........................................................................................................................................ 21|
||8.7|Bluetooth RF Characteristics .................................................................................................................................... 23|
|9|MCU Interface Characteristics ........................................................................................................................................... 24|MCU Interface Characteristics ........................................................................................................................................... 24|
||9.1|DC Characteristics – General Input and Output ....................................................................................................... 24|
||9.2|I2C Interface ............................................................................................................................................................. 25|
||9.3|SPI Interface ............................................................................................................................................................ 26|
|10|MCU UART Interfaces ....................................................................................................................................................... 27|MCU UART Interfaces ....................................................................................................................................................... 27|
||10.1|Overview .................................................................................................................................................................. 27|
||10.2|Soldering Recommendations ................................................................................................................................... 27|
||10.3|Recommended Reflow Profile for Lead Free Solder ................................................................................................ 27|
|11|Wi-Fi MAC IDs/Bluetooth MAC IDs ................................................................................................................................... 28|Wi-Fi MAC IDs/Bluetooth MAC IDs ................................................................................................................................... 28|
|12|Mechanical Details ............................................................................................................................................................ 28||
||12.1|Base SiP Module Mechanical Data .......................................................................................................................... 28|
||12.2|Base SiP Module PCB Footprint .............................................................................................................................. 29|
||12.3|Base SiP Module Recommended Solder Stencil ..................................................................................................... 30|
||12.4|Base SiP Module Tape and Reel Packaging ............................................................................................................ 31|
||12.5|U.FL and Chip Antenna PCB Footprint .................................................................................................................... 32|
||12.6|U.FL and Chip Antenna Tape and Reel Packaging .................................................................................................. 33|
||12.7|Device Markings ....................................................................................................................................................... 33|
||12.7.1<br>SiP Module ......................................................................................................................................................... 33||
||12.7.2<br>Antenna Option Modules .................................................................................................................................... 33||
|13|Cleaning ............................................................................................................................................................................ 34||
|14|Optical Inspection .............................................................................................................................................................. 34||
|15|Rework .............................................................................................................................................................................. 34||
|16|Shipping, Handling, and Storage ....................................................................................................................................... 34||
|17|Regulatory ......................................................................................................................................................................... 35||
||17.1|FCC and IC Regulatory – Pending ........................................................................................................................... 35|
||17.2|Europe – EU Declaration of Conformity ................................................................................................................... 38|
||17.3|Japan (MIC) Regulatory ........................................................................................................................................... 38|
||17.4|Australia and New Zealand ...................................................................................................................................... 38|
|18|Bluetooth SIG Qualification ............................................................................................................................................... 39||
||18.3|Additional Assistance ............................................................................................................................................... 40|
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This document describes key hardware aspects of the Laird Connectivity Sterling™-EWB.
The Laird Connectivity Sterling™-EWB is a high performance 2.4 GHz WLAN and Bluetooth combo module based on latest-generation silicon (Cypress’s CYW4343W) with an integrated ST Micro STM32F412 Cortex M4 MCU. With an industrial temperature rating, broad country certifications, and the availability of three different package styles, the Sterling-EWB provides significant flexibility to meet various end user application needs.
The on-module chip antenna package style for the Sterling-EWB eliminates complexity for design integration, simplifies manufacturing assembly with larger pin outs, and features an advanced chip antenna that offers greater resistance to de-tuning than typical trace or chip antennas.
- IEEE 802.11 b/g/n (single stream n)
- Bluetooth v4.2 BR/DR/LE
- Cortex M4 microprocessor
- Typical WLAN transmit power:
- +17.5 dBm, 11 Mbps, CCK (b)
- +14.0 dBm, 54 Mbps, OFDM (g)
- +12.5 dBm, HT20 MCS7 (n)
- Typical WLAN sensitivity:
- -88 dBm, 8% PER,11 Mbps (b)
- -75 dBm, 10% PER, 54 Mbps (g)
- -72 dBm, 10% PER, MCS7 (n)
- Available with integrated chip antenna or U.FL connector for external antenna
- Operating voltage: 3.0V to 3.6V
- Operating temperature: -40° to +85° C
- Storage temperature: -40° to +125°C
- Compact design based on Cypress CYW4343W SoC and STM32F412 MCU
- Worldwide acceptance pending: FCC (USA), IC (Canada), ETSI (Europe), Giteki (Japan), and RCM (AU/NZ)
- BT SIG QDID: TBD
- REACH and RoHS-compliant
- WLAN and Bluetooth coexistence
- Available in two footprint styles:
- Easy to Integrate: 16 mm x 21 mm
- Miniature footprint: 10 mm x 10 mm
## **WLAN**
- IEEE 802.11b/g/n 1x1 2.4 GHz radio
- Internal power amplifier (PA)
- Internal low noise amplifier (LNA)
- Internal T/R switch
- Physical Layer (PHY)
- Baseband processor
- Standards
- IEEE 802.11b, 802.11g, 802.11n (single stream)
- Simultaneous BT/WLAN reception with a single antenna.
- Media Access Controller (MAC)
## **Bluetooth**
- Class 2 power amplifier with Class 2 capability
- HCI interface using high speed UART
- PCM for audio data
- Bluetooth v4.2 BR /DR/LE
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## **Microcontroller**
- STM32 Arm 32-bit Cortex™-M4 with a frequency up to 100 MHz
- 1 MB internal flash
- 256 kB of SRAM
- SPI, QSPI, USART, PCM
- ADC, I2C, I2S, GPIO, Timers
- JTAG
- WICED Fully compatible
- 2 MB SPI flash
## **Wireless Security System Features – Supported Modes**
- Open (no security)
- WEP
- WPA Personal
- WPA2 Personal
- WMM
- WMM-SA
- WAPI
- AES (Hardware accelerator)
- TKIP (host-computed)
- CKIP (SW support)
- WMM-PS (U-APSD)
- Security and building automation
- Internet of Things/M2M connectivity
- Smart gateways
The Laird Connectivity Sterling-EWB module is available in three different versions. Depending on your antenna and footprint needs, there is a variant to suit most application requirements. We recommend, for simplicity of both the host PCB design and the manufacturing process, that you use either the chip antenna or RF connector version of the modules.
## ▪ **453-00012 - Base SiP Module**
This module variant is supplied in a compact, 151 pin, 0.5 mm pitch LGA footprint. Unlike the other module variants, it requires the addition of either an off-module antenna or RF connector, as well as the associated matching components. To benefit from the EMC certifications on the module, you must strictly follow the layout in the module application guide. This requires adherence to the PCB stack-up and layout around the antenna. The footprint of this module may require additional care during reflow and PCB assembly.
_**Figure 1 Sterling-EWB Base SiP module (453-00012)**_
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## ▪ **453-00013 – U.FL Module**
This module variant integrates the 450-00012 base SiP module, a U.FL RF connector, and all associated RF matching components on a PCB. This integrated approach not only provides a U.FL connector for connections to external antennas, but also simplifies and reduces the cost of the end users host board by simplifying the module PCB footprint.
## _**Figure 2: Sterling-EWB U.FL module (453-00013)**_
## ▪ **453-00014 - Chip Antenna Module**
This module variant integrates the 453-00012 base SiP module, a chip antenna, and all associated RF matching components on a PCB. This integrated approach not only provides an external antenna solution, but also simplifies and reduces the cost of the end users host board by simplifying the module PCB footprint.
## _**Figure 3 Sterling-EWB chip antenna module (453-00014)**_
|**Part Number**<br>453-00013C<br>~~ne~~|**Part Number**<br>453-00013C<br>~~ne~~|**Description**<br>Sterling-EWB U.FL module (Cut Tape)|
|---|---|---|
||453-00013R|Sterling-EWB U.FL module (Tape and Reel, SPQ = 1000)|
||453-00014C|Sterling-EWB chip antenna module (Cut Tape)|
||453-00014R|Sterling-EWB chip antenna module (Tape and Reel, SPQ = 1000)|
||453-00012C|Sterling-EWB base SiP module (Cut Tape)|
||453-00012R|Sterling-EWB base SiP module (Tape and Reel, SPQ = 2000)|
||455-00030|Sterling-EWB development kit, Chip Antenna|
||455-00031|Sterling-EWB development kit, FlexPIFA Antenna|
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~~es~~ **Part Number** ~~es~~ **Description Image** 2.4 GHz dipole antenna 001-0001 with reverse polarity SMA connector U.FL to reverse polarity 080-0001 SMA bulkhead cable 105 mm 001-0014 2.4 GHz FlexPIFA antenna 001-0015 2.4 GHz FlexNotch antenna 2.4 GHz Metal FlexPIFA 001-0030 antenna w/U.FL cable, 100 mm MAF94045 2.4 GHz NanoBlue Antenna
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**==> picture [496 x 280] intentionally omitted <==**
**----- Start of picture text -----**<br>
VDD_MCU VBAT VDD_WIFI_IO VDD_WIFI VDD_WIFI_PA<br>I2C CLK_REQ BT_PCM<br>SPI || BT_REG_ON COCO<br>BT_GPIO<br>QSPI + an BT_DEV_WAKE n Bluetooth =<br>BT_HOST_WAKE<br>UART BT_UART<br>2.4GHz Chip<br>USB<br>Antenna<br>CAN STM32F412<br>WLAN_REG_ON<br>I2S WL_IRQ WLAN LPF Match<br>ADC/DAC WLAN_SDIO<br>TIMER Coaxial<br>Connector<br>GPIO 32.768kHz<br>JTAG Match<br>CYW4343W<br>RF interface option<br>32.768kHz 2MB 26MHz 37.4MHz<br>RTC Flash REF CLK REF CLK<br>Base SiP Module<br>Laird Sterling-EWB<br>**----- End of picture text -----**<br>
_**Figure 4: Sterling-EWB U.FL/chip antenna module block diagram**_
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**Note** : The following footprint and pin definitions apply to the Sterling-EWB base SiP module (453-00012). There are two module footprints, depending on which variant of the module is used. _It is important to ensure you are using the correct version on your design_ .
_**Figure 5: Sterling-EWB base SiP module pinout (top view)**_
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_**- Table 1: Sterling EWB base SiP module pin descriptions**_
|**Module**<br>**Pin**|**Name**|**I/O Type**|**Description**|**STM32F412**<br>**Port**|
|---|---|---|---|---|
|1|ANT|RF|RF TRANSMITTER OUTPUT AND RECEIVE INPUT||
|2|GND|GND|GROUND||
|3|VDD_3V3_WIFI_PA|PI|WIFI PA POWER SUPPLY||
|4|VDD_3V3_WIFI_PA|PI|WIFI PA POWER SUPPLY||
|5|GND|GND|GROUND||
|6|VDD_3V3_5|PI|DC SUPPLY FOR MCU AND I/O||
|7|GND|GND|GROUND||
|8|MICRO_SPI1_MOSI|DIO|SPI1_MOSI|PA7|
|9|QUADSPI_CLK|DIO|QUADSPI_CLK|PB1|
|10|GND|GND|GROUND||
|11|MICRO_SPI4_NSS|DIO|SPI4_NSS|PE11|
|12|MICRO_SPI4_SCK|DIO|SPI4_SCK|PE12|
|13|MICRO_SPI4_MISO|DIO|SPI4_MISO|PE13|
|14|MICRO_SPI4_MOSI|DIO|SPI4_MOSI|PE14|
|15|GND|GND|GROUND||
|16|NC|-|NO CONNECT (DO NOT CONNECT)||
|17|NC|-|NO CONNECT (DO NOT CONNECT)||
|18|GND|GND|GROUND||
|19|NC|-|NO CONNECT (DO NOT CONNECT)||
|20|BT_GPIO_3|DIO|WPT_INTb TO WIRELESS CHARGING PMU||
|21|MICRO_SPI2_MISO|DIO|SPI4_MOSI|PB14|
|22|MICRO_SPI2_MOSI|DIO|SPI2_MOSI|PB15|
|23|GND|GND|GROUND||
|24|VDD_3V3_3|PI|DC SUPPLY FOR MCU AND I/O||
|25|GND|GND|GROUND||
|26|NC|-|NO CONNECT (DO NOT CONNECT)||
|27|GND|GND|GROUND||
|28|VDD3V3_WiFi_IO|PI|DC SUPPY FOR WIFI AND I/O||
|29|GND|GND|GROUND||
|30|MICRO_USART1_TX|DO|USART1_TX|PA9|
|31|MICRO_USART1_RX|DI|USART1_RX|PA10|
|32|MICRO_USART1_CTS|DI|USART1_CTS|PA11|
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|**Module**<br>**Pin**|**Name**|**I/O Type**|**Description**|**STM32F412**<br>**Port**|
|---|---|---|---|---|
|33|MICRO_USART1_RTS|DO|USART1_RTS|PA12|
|34|GND|GND|GROUND||
|35|MICRO_JTAG_TMS|DI|JTAG_TMS|PA13|
|36|GND|GND|GROUND||
|37|MICRO_JTAG_TCK|DI|JTAG_TCK|PA14|
|38|MICRO_JTAG_TDI|DI|JTAG_TDI|PA15|
|39|GND|GND|GROUND||
|40|NC|-|NO CONNECT (DO NOT CONNECT)||
|41|GND|GND|GROUND||
|42|VDD3V3_WIFI|PI|WIFI POWER SUPPLY||
|43|VDD3V3_WIFI|PI|WIFI POWER SUPPLY||
|44|GND|GND|GROUND||
|45|MICRO_JTAG_TDO|DO|JTAG_TDO|PB3|
|46|MICRO_JTAG_TRSTN|DI|JTAG_TRSTN|PB4|
|47|GND|GND|GROUND||
|48|VDD_3V3_2|PI|DC SUPPLY FOR MCU AND I/O||
|49|GND|GND|GROUND||
|50|QUADSPI_BK1_IO3|DIO|QUADSPI_BK1_IO3|PF6|
|51|GND|GND|GROUND||
|52|NC|-|NO CONNECT (DO NOT CONNECT)||
|53|NC|-|NO CONNECT (DO NOT CONNECT)||
|54|GND|GND|GROUND||
|55|BT_PCM_CLK|DIO|PCM CLOCK; CAN BE MASTER (OUTPUT) OR SLAVE<br>(INPUT)||
|56|NC|-|NO CONNECT (DO NOT CONNECT)||
|57|BT_HOST_WAKE|DO|HOST_WAKE||
|58|GND|GND|GROUND||
|59|VBAT|PI|POWER SUPPLY FOR BACKUP CIRCUIT||
|60|GND|GND|GROUND||
|61|GND|GND|GROUND||
|62|NC|-|NO CONNECT (DO NOT CONNECT)||
|63|NC|-|NO CONNECT (DO NOT CONNECT)||
|64|GND|GND|GROUND||
|65|VDD_3V3|PI|DC SUPPLY FOR MCU AND I/O||
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|**Module**<br>**Pin**|**Name**|**I/O Type**|**Description**|**STM32F412**<br>**Port**|
|---|---|---|---|---|
|66|GND|GND|GROUND||
|67|QUADSPI_BK1_IO1|DIO|QUADSPI_BK1_IO1|PF9|
|68|QUADSPI_BK1_IO2|DIO|QUADSPI_BK1_IO2|PF7|
|69|MICRO_I2S2_SD|DIO|I2S2_SD|PC3|
|70|GND|GND|GROUND||
|71|GND|GND|GROUND||
|72|GND|GND|GROUND||
|73|GND|GND|GROUND||
|74|MICRO_SPI1_NSS|DIO|SPI1_NSS|PA4|
|75|MICRO_SPI1_SCK|DIO|SPI1_SCK|PA5|
|76|MICRO_SPI1_MISO|DIO|SPI1_MISO|PA6|
|77|GND|GND|GROUND||
|78|QUADSPI_BK2_IO3|DIO|QUADSPI_BK2_IO3|PC5|
|79|BOOT1/QUADSPI_CLK|DO|BOOT1/QUADSPI_CLK|PB2|
|80|QUADSPI_BK2_IO0|DIO|QUADSPI_BK2_IO0|PE7|
|81|QUADSPI_BK2_IO1|DIO|QUADSPI_BK2_IO1|PE8|
|82|MICRO_I2C2_SCL|DIO|I2C2_SCL|PB10|
|83|MICRO_ I2C2_SDA|DIO|I2C2_SDA|PB11|
|84|MICRO_SPI2_NSS|DIO|SPI2_NSS|PB12|
|85|MICRO_SPI2_SCK|DIO|SPI2_SCK|PB13|
|86|MICRO_GPIO27|DIO|MICRO_GPIO|PD8|
|87|MICRO_GPIO25|DIO|MICRO_GPIO|PD10|
|88|NC|-|NO CONNECT (DO NOT CONNECT)||
|89|NC|-|NO CONNECT (DO NOT CONNECT)||
|90|VDD_USB|PI|DC SUPPLY FOR USB||
|91|GND|GND|GROUND||
|92|MICRO_I2S2_MCK/MICRO_USART6_TX|DIO|I2S2_MCK/USART6_TX|PC6|
|93|MICRO_I2S2_CK/MICRO_USART6_RX|DIO|I2S2_CK/USART6_RX|PC7|
|94|GND|GND|GROUND||
|95|NC|-|NO CONNECT (DO NOT CONNECT)||
|96|NC|-|NO CONNECT (DO NOT CONNECT)||
|97|NC|-|NO CONNECT (DO NOT CONNECT)||
|98|NC|-|NO CONNECT (DO NOT CONNECT)||
|99|GND|GND|GROUND||
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|**Module**<br>**Pin**|**Name**|**I/O Type**|**Description**|**STM32F412**<br>**Port**|
|---|---|---|---|---|
|100|NC|-|NO CONNECT (DO NOT CONNECT)||
|101|GND|GND|GROUND||
|102|MICRO_I2C1_SCL|DIO|I2C1_SCL|PB6|
|103|MICRO_I2C1_SDA|DIO|I2C1_SDA|PB7|
|104|BOOT0|DO|BOOT0|BOOT0|
|105|NC|-|NO CONNECT (DO NOT CONNECT)||
|106|MICRO_GPIO0|DIO|MICRO_GPIO|PE3|
|107|QUADSPI_BK2_NCS|DIO|QUADSPI_BK2_NCS|PC11|
|108|MICRO_GPIO30|DIO|MICRO_GPIO|PE0|
|109|NC|-|NO CONNECT (DO NOT CONNECT)||
|110|NC|-|NO CONNECT (DO NOT CONNECT)||
|111|MICRO_I2S2_DI|DIO|I2S2_DI|PE5|
|112|GND|GND|GROUND||
|113|GND|GND|GROUND||
|114|GND|GND|GROUND||
|115|GND|GND|GROUND||
|116|GND|GND|GROUND||
|117|MICRO_RST_N|DI|MICRO_RST_N|NRST|
|118|QUADSPI_BK1_IO0|DIO|QUADSPI_BK1_IO0|PF8|
|119|MICRO_WKUP|DI|MICRO_WKUP|PA0|
|120|GND|GND|GROUND||
|121|MICRO_ADC_IN2|DI|ADC_IN2|PA2|
|122|MICRO_ADC_IN3|DI|ADC_IN3|PA3|
|123|GND|GND|GROUND||
|124|QUADSPI_BK2_IO2|DIO|QUADSPI_BK2_IO2|PC4|
|125|MICRO_GPIO5|DIO|MICRO_GPIO|PB0|
|126|RF_SW_CTRL|DIO|ANTENNA DIVERSITY CONTROL||
|127|NC|-|NO CONNECT (DO NOT CONNECT)||
|128|MICRO_GPIO16|DIO|MICRO_GPIO|PE15|
|129|BT_GPIO_4|DIO|BSC_SDA TO/FROM WIRELESS CHARGING PMU||
|130|BT_GPIO_5|DIO|BSC_SCL FROM WIRELESS CHARGING PMU.||
|131|NC|-|NO CONNECT (DO NOT CONNECT)||
|132|GND|GND|GROUND||
|133|QUADSPI_BK1_NCS|DIO|QUADSPI_BK1_NCS|PG6|
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|**Module**<br>**Pin**|**Name**||**I/O Type**||**Description**|**STM32F412**<br>**Port**|
|---|---|---|---|---|---|---|
|134|GND||GND||GROUND||
|135|GND||GND||GROUND||
|136|NC||-|NO CONNECT (DO NOT CONNECT)|NO CONNECT (DO NOT CONNECT)||
|137|MICRO_GPIO26||DIO||MICRO_GPIO|PD1|
|138|NC||-|NO CONNECT (DO NOT CONNECT)|NO CONNECT (DO NOT CONNECT)||
|139|NC||-|NO CONNECT (DO NOT CONNECT)|NO CONNECT (DO NOT CONNECT)||
|140|NC||-|NO CONNECT (DO NOT CONNECT)|NO CONNECT (DO NOT CONNECT)||
|141|NC||-|NO CONNECT (DO NOT CONNECT)|NO CONNECT (DO NOT CONNECT)||
|142|MICRO_GPIO28||DIO||MICRO_GPIO|PB8|
|143|MICRO_I2S2_WS||DIO||I2S2_WS|PB9|
|144|BT_PCM_SYNC||DIO|PCM SYNC; CAN BE MASTER (OUTPUT) OR SLAVE|PCM SYNC; CAN BE MASTER (OUTPUT) OR SLAVE<br>(INPUT)||
|145|BT_PCM_OUT||DO||PCM DATA OUTPUT||
|146|BT_PCM_IN||DI||PCM DATA INPUT SENSING||
|147|PC13||DIO||MICRO_GPIO|PC13|
|148|GND||GND||GROUND||
|149|GND||GND||GROUND||
|150|MICRO_ADC_IN1||DI||ADC_IN1|PA1|
|151|GND||GND||GROUND||
||||||||
|PI = Power Input||DI = Digital Input|||DO = Digital Output||
|DIO = Bi-directional Digital Port||RF = Bi-directional RF Port|RF = Bi-directional RF Port||GND = Ground||
* If you want to use the USB interface, pins 30-33 (PA9-PA12) can be configured over USART1
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**Note:** The following footprint and pin definitions apply to the Sterling-EWB U.FL and Chip Antenna variants of the module (453-00013 and 453-00014). There are two module footprints depending on which variant of the module is being used, so it is important to ensure you are using the correct version on your design.
||||||||||||||||||||87<br>7|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|1<br>2<br>oo|||||||||||||||||||79<br>80<br>oo|
|3<br>4<br>oo|||||||||||||||||||77<br>78<br>Ao|
|5<br>6<br>oo|||||||||||||||||||75<br>76<br>AA|
|7<br>8<br>oo|||||||||||||||||||73<br>74<br>=a.|
|9<br>10<br>11<br>12<br>13<br>14<br>AG<br>oo|||||||81<br>82<br>LIU||83<br> U||||||||||67<br>68<br>69<br>70<br>71<br>72<br>54<br>Ao|
|15<br>16<br>17<br>18<br>19<br>20<br>A a<br>AO|||||||84<br>85<br>UU|||86|||||||||61<br>62<br>63<br>64<br>65<br>66<br>54<br>oo|
|21<br>22<br>oo|||||||||||||||||||59<br>60<br>AA|
|23<br>24<br>oo|||||||||||||||||||57<br>58<br>AA|
|25<br>26<br>27<br>28<br>29<br>30<br>31<br>33<br>35<br>37<br>39<br>41<br>43<br>45<br>47<br>49<br>50<br>51<br>32<br>34<br>36<br>38<br>40<br>42<br>44<br>46<br>48<br>53<br>52<br>54<br>55<br>56<br>oo<br>AA<br>OO ooooooooo<br>oo<br>COanggoo0o0oooo0o004||||||||||||||||||||
_**Figure 6: Sterling-EWB U.FL and Chip Antenna module pinout (top view)**_
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_**- Table 2: Sterling EWB U.FL and Chip Antenna module pin descriptions**_
|**Module**<br>**Pin**|**Name**|**I/O Type**|**Description**|
|---|---|---|---|
|1|GND1|GND|GROUND|
|2|MICRO_ADC_IN2/PA2|DIO|ADC INPUT OR GENERAL-PURPOSE I/O|
|3|MICRO_SPI1_SCK/PA5|DIO|SPI SCK OR GENERAL-PURPOSE I/O|
|4|MICRO_SPI1_NSS/PA4|DIO|SPI NSS OR GENERAL-PURPOSE I/O|
|5|MICRO_SPI1_MISO/PA6|DIO|SPI MISO OR GENERAL-PURPOSE I/O|
|6|MICRO_ADC_IN3/PA3|DIO|ADC INPUT OR GENERAL-PURPOSE I/O|
|7|MICRO_GPIO_5/PB0|DIO|GENERAL-PURPOSE I/O|
|8|QUADSPI_BK2_IO2/PC4|DIO|QSPI IO2 OR GENERAL-PURPOSE I/O|
|9|VDD_WIFI_PA|PI|WIFI AND BLUETOOTH POWER SUPPLY|
|10|GND11|GND|GROUND|
|11|RF_SW_CNTL|DO|ANTENNA DIVERSITY CONTROL OUTPUT|
|12|QUADSPI_BK2_IO3/PC5|DIO|QSPI IO3 OR GENERAL-PURPOSE I/O|
|13|MICRO_SPI1_MOSI/PA7|DIO|SPI MOSI OR GENERAL-PURPOSE I/O|
|14|BOOT1/QUADSPI_CLK/PB2|DI|BOOT OPTION 1 INPUT|
|15|QUADSPI_CLK/PB1|DIO|QSPI CLK OR GENERAL-PURPOSE I/O|
|16|QUADSPI_BK2_IO0/PE7|DIO|QSPI IO0 OR GENERAL-PURPOSE I/O|
|17|MICRO_SPI4_NSS/PE11|DIO|SPI NSS OR GENERAL-PURPOSE I/O|
|18|QUADSPI_BK2_IO1/PE8|DIO|QSPI IO1 OR GENERAL-PURPOSE I/O|
|19|MICRO_SPI4_SCK/PE12|DIO|SPI SCK OR GENERAL-PURPOSE I/O|
|20|MICRO_I2C2_SCL/PB10|DIO|I2C SCL OR GENERAL-PURPOSE I/O|
|21|MICRO_SPI4_MISO/PE13|DIO|SPI MISO OR GENERAL-PURPOSE I/O|
|22|MICRO_I2C2_SDA/PB11|DIO|I2C SDAOR GENERAL-PURPOSE I/O|
|23|MICRO_SPI4_MOSI/PE14|DIO|SPI MOSI OR GENERAL-PURPOSE I/O|
|24|MICRO_GPIO_16/PE15|DIO|GENERAL-PURPOSE I/O|
|25|BT_GPIO_3|DIO|BT GENERAL-PURPOSE I/O|
|26|MICRO_SPI2_NSS/PB12|DIO|SPI NSS OR GENERAL-PURPOSE I/O|
|27|MICRO_SPI2_SCK/PB13|DIO|SPI SCK OR GENERAL-PURPOSE I/O|
|28|MICRO_SPI2_MISO/PB14|DIO|SPI MISO OR GENERAL-PURPOSE I/O|
|29|GND2|GND|GROUND|
|30|MICRO_SPI2_MOSI/PB15|DIO|SPI MOSI OR GENERAL-PURPOSE I/O|
|31|MICRO_GPIO_27/PD8|DIO|GENERAL-PURPOSE I/O|
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|**Module**<br>**Pin**|**Name**|**I/O Type**|**Description**|
|---|---|---|---|
|32|MICRO_GPIO_25/PD10|DIO|GENERAL-PURPOSE I/O|
|33|BT_GPIO_4|DIO|BT GENERAL-PURPOSE I/O|
|34|BT_GPIO_5|DIO|BT GENERAL-PURPOSE I/O|
|35|VDD_USB|PI|VUSB POWER SUPPLY|
|36|QUADSPI_BK1_NCS/PG6|DIO|QSPI NCS OR GENERAL-PURPOSE I/O|
|37|VDD_MCU|PI|MCU AND IO POWER SUPPLY|
|38|MICRO_I2S2_CK/MICRO_USART6_RX/PC7|DIO|I2S CK OR USART RX INPUT OR GENERAL-<br>PURPOSE I/O|
|39|MICRO_I2S2_MCK/MICRO_USART6_TX/PC6|DIO|I2S MCK OR USART TX OUTPUT OR<br>GENERAL-PURPOSE I/O|
|40|GND12|GND|GROUND|
|41|VDD_WIFI_IO|PI|WIFI AND BLUETOOTH IO POWER SUPPLY|
|42|MICRO_USART1_RX/PA10|DI|MCU USART1 RECEIVE INPUT|
|43|MICRO_USART1_TX/PA9|DO|MCU USART1 TRANSMIT OUTPUT|
|44|MICRO_GPIO_26/PD1|DIO|GENERAL-PURPOSE I/O|
|45|MICRO_GPIO_28/PB8|DIO|GENERAL-PURPOSE I/O|
|46|MICRO_I2C1_SDA/PB7|DIO|I2C SDA OR GENERAL-PURPOSE I/O|
|47|MICRO_USART1_CTS/PA11|DI|MCU USART1 CLEAR-TO-SEND|
|48|MICRO_I2C1_SCL/PB6|DIO|I2C SCL OR GENERAL-PURPOSE I/O|
|49|MICRO_USART1_RTS/PA12|DO|MCU USART1 REQUEST-TO-SEND|
|50|MICRO_JTAG_TDI|DI|JTAG_TDI|
|51|MICRO_JTAG_TMS/SWDIO|DI|JTAG_TMS/SWDIO|
|52|GND3|GND|GROUND|
|53|BOOT0|DI|BOOT OPTION 0 INPUT|
|54|MICRO_JTAG_TDO|DI|JTAG_TDO|
|55|PC13|DIO|GENERAL-PURPOSE I/O|
|56|MICRO_ADC_IN1/PA1|DIO|ADC INPUT OR GPIO|
|57|MICRO_JTAG_TCK/SWCLK|DI|JTAG_TCK/SWCLK|
|58|BT_PCM_IN|DI|PCM DATA INPUT SENSING|
|59|BT_PCM_OUT|DO|PCM DATA OUTPUT|
|60|MICRO_RSTN|DI|MCU RESET INPUT|
|61|BT_PCM_SYNC|DIO|PCM SYNC; CAN BE MASTER (OUTPUT) OR<br>SLAVE (INPUT)|
|62|VDD_WIFI|PI|WIFI AND BLUETOOTH POWER SUPPLY|
|63|GND4|GND|GROUND|
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|**Module**<br>**Pin**|**Name**|**I/O Type**|**Description**|
|---|---|---|---|
|64|MICRO_JTAG_TRSTN|DI|JTAG_TRSTN|
|65|MICRO_GPIO_0/PE3|DIO|GENERAL-PURPOSE I/O|
|66|QUADSPI_BK1_IO0/PF8|DIO|QSPI IO0 OR GENERAL-PURPOSE I/O|
|67|QUADSPI_BK2_NCS/PC11|DIO|QSPI NCS OR GENERAL-PURPOSE I/O|
|68|QUADSPI_BK1_IO1/PF9|DIO|QSPI IO1 OR GENERAL-PURPOSE I/O|
|69|MICRO_I2S2_WS/PB9|DIO|I2S WS OR GENERAL-PURPOSE I/O|
|70|QUADSPI_BK1_IO3/PF6|DIO|QSPI IO3 OR GENERAL-PURPOSE I/O|
|71|MICRO_GPIO_30/PE0|DIO|GENERAL-PURPOSE I/O|
|72|OSC_32K_IN|DI|EXTERNAL SLEEP CLOCK INPUT (not used)|
|73|MICRO_I2S_DI/PE5|DIO|I2S DATA INPUT OR GENERAL-PURPOSE I/O|
|74|OSC_32K_OUT|DO|EXTERNAL SLEEP CLOCK INPUT (not used)|
|75|BT_PCM_CLK|DIO|PCM CLOCK; CAN BE MASTER (OUTPUT) OR<br>SLAVE (INPUT)|
|76|MICRO_WKUP/PA0|DI|MCU WAKE INPUT|
|77|BT_HOST_WAKE|DO|HOST_WAKE OR GENERAL-PURPOSE I/O|
|78|QUADSPI_BK1_IO2/PF7|DIO|QSPI IO2 OR GENERAL-PURPOSE I/O|
|79|MICRO_I2S2_SD/PC3|DIO|I2S DATA OUTPUT OR GENERAL-PURPOSE I/O|
|80|VBAT|PI|MCU Battery Backup Power Supply|
|81|GND5|GND|GROUND|
|82|GND6|GND|GROUND|
|83|GND7|GND|GROUND|
|84|GND8|GND|GROUND|
|85|GND9|GND|GROUND|
|86|GND10|GND|GROUND|
|87|GND13|GND|GROUND|
|||||
|PI = Power Input|PI = Power Input<br>DI = Digital Input||DO = Digital Output|
|DIO = Bi-directional Digital Port<br>GND = Ground||||
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|**Characteristic**|**Description**|
|---|---|
|Model Name|Sterling-EWB|
|Product Description|Wi-Fi and Bluetooth wireless module with Cortex™-M4 MCU|
|SiP Module Dimensions (W x L x T) – mm (in.)|10 x 10 x 1.2 (0.39 x 0.39 x 0.05)|
|Antenna Option Module Dimensions (W x L x T) – mm (in.)|16 x 21 x 2.8 (0.63 x 0.83 x 0.11)|
|Operating Temperature – °C (°F)|-40 to +85 (-40 to +185)|
|Storage Temperature – °C (°F)|-40 to +125 (-40 to +257)|
|Weight|0.0015167KGS|
|**Power Supply Input**|**Min**|**Typical**|**Max**|**Unit**|
|---|---|---|---|---|
|VDD_MCU|2.4|3.3|3.6|V|
|VDD_WIFI|3.0|3.3|3.6|V|
|VDD_WIFI_IO|3.0|3.3|3.6|V|
|VDD_WIFI_PA|3.0|3.3|3.6|V|
|VDD_USB(1)|3.0|3.3|3.6|V|
|VBAT(2)|2.4|3.3|3.6|V|
(1) If USB not used, connect VDD_USB input to VDD_MCU
(2) If VBAT not used, connect to VDD_MCU
|**Parameter**|**Min**|**Typical**|**Max**|**Unit**|
|---|---|---|---|---|
|RF frequency range|2400||2500|MHz|
|RF data rate|1|802.11 b/g/n rates supported|65|Mbps|
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|**Rating**|**Value**|**Unit**|
|---|---|---|
|VDD_MCU|0 to 4|V|
|VDD_WIFI|0 to 6|V|
|VDD_WIFI_IO|0 to 4|V|
|VDD_WIFI_PA|0 to 6|V|
|VDD_USB|0 to 4|V|
|VBAT|0 to 4|V|
|Voltage ripple any supply input (not to exceed operating voltage)|±2%|Not to exceed operating voltage|
|Output current sunk by any I/O or control pin|25|mA|
|Output current sourced by any I/O or control pin|-25|mA|
|Total output current sunk by sum of all I/O or control pin|120|mA|
|Total output current sourced by sum of all I/O or control pin|-120|mA|
|**Parameter**|**Test Conditions**|**Min**|**Typical**|**Max**|**Unit**|
|---|---|---|---|---|---|
|11b TX Current|11 Mbps, Tamb= +25°C, 3.3V|-|390|-|mA|
|11g TX Current|54 Mbps, Tamb= +25°C, 3.3V|-|310|-|mA|
|11n TX Current|MCS7, Tamb= +25°C, 3.3V|-|290|-|mA|
|11b RX Current|11 Mbps, Tamb= +25°C, 3.3V|-|55|-|mA|
|11g RX Current|54 Mbps, Tamb= +25°C, 3.3V|-|55|-|mA|
|11n RX Current|MCS7, Tamb= +25°C, 3.3V|-|55|-|mA|
|**Parameter**|**Test Conditions**|**Min**|**Typical**|**Max**|**Unit**|
|---|---|---|---|---|---|
|EDR TX Current|Constant Transmit, 3DH5, PRBS9 Tamb= +25°C, 3.3V|-|50|-|mA|
|EDR RX Current|Constant Receive, 3DH5 Tamb= +25°C, 3.3V|-|30|-|mA|
|BLE TX Current|Tamb= +25°C, 3.3V|-|50|-|mA|
|BLE RX Current|Tamb= +25°C, 3.3V|-|30|-|mA|
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|8.6.1 WLAN Transmitter|Characteristics (TA = +25°C, VCC|= 3.3|= 3.3|V)|||
|---|---|---|---|---|---|---|
|**Parameter**|**Test Conditions**|**Min**||**Typ**|**Max**|**Unit**|
|1 Mbps DSSS (b) TX Output Power|1 Mbps BPSK 802.11(b) Mask Compliance<br>35% EVM RMS power over TX packet|-||17.5|-|dBm|
|2 Mbps DSSS (b) TX Output Power|2 Mbps QPSK 802.11(b) Mask Compliance<br>35% EVM RMS power over TX packet|-||17.5|-|dBm|
|5.5 Mbps DSSS (b) TX Output Power|5.5 Mbps QPSK 802.11(b) Mask Compliance<br>35% EVM RMS power over TX packet|-||17.5|-|dBm|
|11 Mbps DSSS (b) TX Output Power|11 Mbps CCK 802.11(b) Mask Compliance<br>35% EVM RMS power over TX packet|-||17.5|-|dBm|
|6 Mbps OFDM (g) TX Output Power|6 Mbps BPSK 802.11(g) Mask Compliance<br>-5 dB EVM RMS power over TX packet|-||14.0|-|dBm|
|9 Mbps OFDM (g) TX Output Power|9 Mbps BPSK 802.11(g) Mask Compliance<br>-8 dB EVM RMS power over TX packet|-||14.0|-|dBm|
|12 Mbps OFDM (g) TX Output Power|12 Mbps QPSK 802.11(g) Mask Compliance<br>-10 dB EVM RMS power over TX packet|-||14.0|-|dBm|
|18 Mbps OFDM (g) TX Output Power|18 Mbps QPSK 802.11(g) Mask Compliance<br>-13 dB EVM RMS power over TX packet|-||14.0|-|dBm|
|24 Mbps OFDM (g) TX Output Power|24 Mbps 16-QAM 802.11(g) Mask Compliance<br>-16 dB EVM RMS power over TX packet|-||14.0|-|dBm|
|36 Mbps OFDM (g) TX Output Power|36 Mbps 16-QAM 802.11(g) Mask Compliance<br>-19 dB EVM RMS power over TX packet|-||14.0|-|dBm|
|48 Mbps OFDM (g) TX Output Power|48 Mbps 64-QAM 802.11(g) Mask Compliance<br>-22 dB EVM RMS power over TX packet|-||14.0|-|dBm|
|54 Mbps OFDM (g) TX Output Power|54 Mbps 64-QAM 802.11(g) Mask Compliance<br>-25 dB EVM RMS power over TX packet|-||14.0|-|dBm|
|MCS0 OFDM (n) TX Output Power|6.5 Mbps BPSK 802.11(n) Mask Compliance<br>-5 dB EVM RMS power over TX packet|-||12.5|-|dBm|
|MCS1 OFDM (n) TX Output Power|13 Mbps QPSK 802.11(n) Mask Compliance<br>-10 dB EVM RMS power over TX packet|-||12.5|-|dBm|
|MCS2 OFDM (n) TX Output Power|19.5 Mbps QPSK 802.11(n) Mask Compliance<br>-13 dB EVM RMS power over TX packet|-||12.5|-|dBm|
|MCS3 OFDM (n) TX Output Power|26 Mbps 16-QAM 802.11(n) Mask Compliance<br>-16 dB EVM RMS power over TX packet|-||12.5|-|dBm|
|MCS4 OFDM (n) TX Output Power|39 Mbps 16-QAM 802.11(n) Mask Compliance<br>-19 dB EVM RMS power over TX packet|-||12.5|-|dBm|
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|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|
|MCS5 OFDM (n) TX Output Power|52 Mbps 64-QAM 802.11(n) Mask Compliance<br>-22 dB EVM RMS power over TX packet|-|12.5|-|dBm|
|MCS6 OFDM (n) TX Output Power|58.5 Mbps 64-QAM 802.11(n) Mask Compliance<br>-25 dB EVM RMS power over TX packet|-|12.5|-|dBm|
|MCS7 OFDM (n) TX Output Power|65 Mbps 64-QAM 802.11(n) Mask Compliance<br>-27 dB EVM RMS power over TX packet|-|12.5|-|dBm|
## 8.6.2 WLAN Receiver Characteristics (TA = +25°C, VCC = 3.3 V)
|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|
|1 Mbps DSSS (b) RX Sensitivity|8% PER|-|-93|-|dBm|
|2 Mbps DSSS (b) RX Sensitivity|8% PER|-|-91|-|dBm|
|5.5 Mbps DSSS (b) RX Sensitivity|8% PER|-|-89|-|dBm|
|11 Mbps DSSS (b) RX Sensitivity|8% PER|-|-86|-|dBm|
|||||||
|6 Mbps OFDM (g) RX Sensitivity|10% PER|-|-88|-|dBm|
|9 Mbps OFDM (g) RX Sensitivity|10% PER|-|-87|-|dBm|
|12 Mbps OFDM (g) RX Sensitivity|10% PER|-|-85|-|dBm|
|18 Mbps OFDM (g) RX Sensitivity|10% PER|-|-83|-|dBm|
|24 Mbps OFDM (g) RX Sensitivity|10% PER|-|-80|-|dBm|
|36 Mbps OFDM (g) RX Sensitivity|10% PER|-|-78|-|dBm|
|48 Mbps OFDM (g) RX Sensitivity|10% PER|-|-74|-|dBm|
|54 Mbps OFDM (g) RX Sensitivity|10% PER|-|-72|-|dBm|
|||||||
|MCS0 (6.5 Mbps) OFDM (n) RX Sensitivity|10% PER|-|-87|-|dBm|
|MCS1 (13 Mbps) OFDM (n) RX Sensitivity|10% PER|-|-84|-|dBm|
|MCS2 (19.5 Mbps) OFDM (n) RX Sensitivity|10% PER|-|-82|-|dBm|
|MCS3 26 Mbps OFDM (n) RX Sensitivity|10% PER|-|-80|-|dBm|
|MCS4 39 Mbps OFDM (n) RX Sensitivity|10% PER|-|-77|-|dBm|
|MCS5 52 Mbps OFDM (n) RX Sensitivity|10% PER|-|-72|-|dBm|
|MCS6 58.5 Mbps OFDM (n) RX Sensitivity|10% PER|-|-71|-|dBm|
|MCS7 65 Mbps OFDM (n) RX Sensitivity|10% PER|-|-70|-|dBm|
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|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|
|11b RX Overload Level|8% PER, 11 Mbps|-10|-|-|dBm|
|11g RX Overload Level|10% PER, 54 Mbps|-20|-|-|dBm|
|11n RX Overload Level|10% PER, MCS7|-20|-|-|dBm|
|**Parameter**|**Test Conditions**|**Min**|**Typical**|**Max**|**Bluetooth Spec**|**Unit**|
|---|---|---|---|---|---|---|
|GFSK RF Output Power||-|8.5|-||dBm|
|EDR RF Output Power||-|4.0|-||dBm|
|Power Control Step Size||2|4|8|2-8|dB|
|EDR Relative Power||-4||1|-4/+1|dB|
## 8.7.2 Bluetooth Receiver GFSK & EDR Characteristics (TA=25°C, VDD=3.3 V)
_**Table 3: Bluetooth receiver RF characteristics**_
|**Parameter**|**Test Conditions**|**Min**|**Typical**|**Max**|**Bluetooth Spec**|**Unit**|
|---|---|---|---|---|---|---|
|GFSK Sensitivity|BER=0.1%|-|-90|-|-70|dBm|
|EDR 2 Mbps Sensitivity|BER=0.01%|-|-92|-|-70|dBm|
|EDR 3 Mbps Sensitivity|BER=0.01%|-|-87|-|-70|dBm|
|GFSK Maximum Input Level|BER=0.1%|-|-20|-|-20|dBm|
|EDR 2 Maximum Input Level|BER=0.01%|-|-20|-|-|dBm|
|EDR 3 Maximum Input Level|BER=0.01%|-|-20|-|-|dBm|
## 8.7.5 BLE Transmitter Characteristics (TA=25°C, VDD=3.3 V)
## _**Table 4: BLE transmitter RF characteristics**_
|**Parameter**|**Test Conditions**|**Min**|**Typical**|**Max**|**Bluetooth Spec**|**Unit**|
|---|---|---|---|---|---|---|
|GFSK RF Output Power||-|7.5|-||dBm|
|Power Control Step Size||2|4|8|2-8|dB|
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## 8.7.4 BLE Receiver Characteristics (TA=25°C, VDD=3.3 V)
_**Table 5: BLE receiver RF characteristics**_
|**Parameter**|**Test Conditions**|**Min**|**Typical**|**Max**|**Bluetooth Spec**|**Unit**|
|---|---|---|---|---|---|---|
|GFSK Sensitivity|PER = 30.8%|-|-94|-|-70|dBm|
|GMSK Maximum Input Level|PER = 30.8%|-|-20|-|-20|dBm|
_**Table 6: DC characteristics MCU I/O**_
|**Parameter**|**Test Conditions**|**Min**|**Max**|**Unit**|
|---|---|---|---|---|
|Logic input low, VIL|2.4V≤VDD_MCU≤3.6V|-|0.3VDD|V|
|Logic input high, VIH|2.4V≤VDD_MCU≤3.6V|0.7VDD|-|V|
|BOOT0 Logic input low, VIL|2.4V≤VDD_MCU≤3.6V|-|0.1VDD+ 0.1|V|
|BOOT0 Logic input high, VIH|2.4V≤VDD_MCU≤3.6V|0.17VDD+ 0.7|-|V|
|Logic output low, VOL|2.7V≤VDD_MCU≤3.6V CMOS|-|0.4|V|
||port, IIO= +8mA||||
||2.7V≤VDD_MCU≤3.6V TTL|-|0.4||
||port, IIO= +8mA||||
||2.7V≤VDD_MCU≤3.6V|3.6V<br>-|1.3||
||IIO= +20mA||||
||2.4V≤VDD_MCU≤3.6V|3.6V<br>-|0.4||
||IIO= +6mA||||
||2.4V≤VDD_MCU≤3.6V|3.6V<br>-|0.4||
||IIO= +4mA||||
|Logic output high, VOH|2.7V≤VDD_MCU≤3.6V CMOS|VDD– 0.4|-|V|
||port, IIO= +8mA||||
||2.7V≤VDD_MCU≤3.6V TTL|2.4|-||
||port, IIO= +8mA||||
||2.7V≤VDD_MCU≤3.6V|3.6V<br>VDD– 1.3|-||
||IIO= +20mA||||
||2.4V≤VDD_MCU≤3.6V|3.6V<br>VDD– 0.4|-||
||IIO= +6mA||||
||2.4V≤VDD_MCU≤3.6V|3.6V<br>VDD– 0.4|-||
||IIO= +4mA||||
TTL and CMOS outputs are compatible with JEDEC standards JESD36 and JESD52
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The Sterling-EWB Module MCU section supports Standard and Fast mode I2C communication.
**==> picture [269 x 94] intentionally omitted <==**
**----- Start of picture text -----**<br>
VDD_MCU<br>Sterling-EWB<br>4.7 kΩ 4.7 kΩ<br>100 Ω<br>SDA<br>I [2] C bus<br>{ SCL<br>100 Ω<br>**----- End of picture text -----**<br>
_**Table 7: Signal connections to I2C bus**_
|||**Standard**|**Standard**|**Fast**|**Fast**|**Fast**|**Fast**||
|---|---|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Mode(1)**||**Mode(1)(2)**||||**Unit**|
|||**Min**|**Max**|**Min**|**Min**||**Max**||
|tw(SCLL)|SCL clock low time|4.7|-|1.3|||-|µs|
|tw(SCLH)|SCL clock high time|4.0|-|0.6|||-|µs|
|tsu(SDA)|SDA setup time|250|-|100|||-|ns|
|th(SDA)|SDA data hold time|0|3450(3)|0|||900(4)|ns|
|tr(SDA)|SDA and SCL rise time|-|1000|-|||300|ns|
|tr(SCL)|||||||||
|tf(SDA)|SDA and SCL fall time|-|300|-|||300|ns|
|tf(SCL)|||||||||
|th(SDA)|Start condition hold time|4.0|-|0.6|||-|µs|
|tsu(STA)|Repeated Start condition setup time|4.7|-|0.6|||-|µs|
|tsu(STO)|Stop condition setup time|4.0|-|0.6|||-|µs|
|tsw(STO:STA)|Stop to Start condition time (bus free)|4.7|-|1.3|||-|µs|
|tSP|Pulse width of the spikes that are suppressed by the analog filter|0|50|0|||50|µs|
||for standard fast mode||||||||
|Cb|Capacitive load for each bus line|-|400|-|||400|pF|
1. Guaranteed by design, not tested in production.
2. fPCLK1 must be at least 2 MHz to achieve standard mode I2C frequencies. It must be at least 4MHz to achieve fast mode I2C frequencies, and a multiple of 10MHz to reach the 400 kHz maximum I2C fast mode clock.
3. The device must internally provide a hold time of at least 300ns for the SDA signal in order to bridge the undefined region of the falling edge of SCL.
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4. The maximum data hold time has only to be met if the interface does not stretch the low period of SCL signal.
Measurement points are done at 0.3VDD and 0.7VDD
_**Table 8: SPI interface characteristics**_
|**Parameter**|**Test Conditions**|**Min**|**Typical**|**Max**|**Unit**|
|---|---|---|---|---|---|
|SPI Clock Frequency|Master full duplex/receiver mode<br>2.7V < VDD_MCU <3.6V SPI1/4/5|-|-|42|MHz|
||Master full duplex/receiver mode<br>3.0V < VDD_MCU <3.6V SPI1/4/5|-|-|50||
||Master transmitter mode<br>2.4V < VDD_MCU <3.6V SPI1/4/5|-|-|50||
||Master mode|Master mode||||
||2.4V < VDD_MCU <3.6V|-|-|25||
||SPI1/2/3/4/5|||||
||Slave transmitter/full duplex mode<br>2.7V < VDD_MCU <3.6V SPI1/4/5|-|-|38(1)||
||Slave receiver mode<br>2.4V < VDD_MCU <3.6V SPI1/4/5|Slave receiver mode<br>-|-|50||
||Slave mode|Slave mode||||
||2.4V < VDD_MCU <3.6V|-|-|25||
||SPI1/2/3/4/5|||||
|Dutycycle of SPI Clock|Slave mode|30|50|70|%|
|SCK high and low time|Master mode, SPI presc = 2|TPCLK- 1.5|TPCLK|TPCLK- 1.5|ns|
|NSS setuptime|Slave mode, SPIpresc = 2|3TPCLK|-|-|ns|
|NSS hold time|Slave mode, SPI presc = 2|2TPCLK|-|-|ns|
|Data input setuptime|Master mode|4|-|-|ns|
||Slave mode|2.5|-|-|ns|
|Data input hold time|Master mode|7.5|-|-|ns|
||Slave mode|3.5|-|-|ns|
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The Sterling-EWB is configurable for up to three UART interfaces for serial communications. The UART is a standard 4-wire interface (RX, TX, RTS, and CTS) with adjustable baud rates from 9600 bps to 4.0 Mbps. The interface features an automatic baud rate detection capability that returns a baud rate selection. The baud rate may also be selected through a vendor-specific UART HCI command.
External UART Sterling-EWB MCU UART
_**Figure 7: UART connection between Sterling-EWB and external device**_
## 10.2 Soldering Recommendations
## 10.2.1 Reflow for Lead Free Solder Paste
- Optimal solder reflow profile depends on solder paste properties and should be optimized as part of an overall process development.
- It is important to provide a solder reflow profile that matches the solder paste supplier's recommendations.
- Temperature ranges beyond that of the solder paste supplier's recommendation could result in poor solderability.
- All solder paste suppliers recommend an ideal reflow profile to give the best solderability.
## 10.35 Recommended Reflow Profile for Lead Free Solder
_**Figure 8: Recommended soldering profile**_
**Note:** The quality of solder joints on the surface mount pads where they contact the host board should meet the appropriate IPC Specification. See _IPC-A-610-D Acceptability of Electronic Assemblies_ , section 8.2.1 _Bottom Only Terminations_ .
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_**Table 9: Example of MAC ID assignments**_
|||**Wi-Fi MAC ID**|**Bluetooth MAC ID**|
|---|---|---|---|
|**Module 1**|**Module 1**|C0:EE:40:07:00:01|C0:EE:40:07:00:02|
|**Module 2**|**Module 2**|C0:EE:40:07:00:03|C0:EE:40:07:00:04|
|**Module 3**|**Module 3**|C0:EE:40:07:00:05|C0:EE:40:07:00:06|
|**Module 4**|**Module 4**|C0:EE:40:07:00:07|C0:EE:40:07:00:08|
_**Figure 9: Base SiP module mechanical dimensions**_
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## 12.2 Base SiP Module PCB Footprint
_**Figure 10: Base SiP module footprint (top view)**_
## **Note:**
||||**Pad Sizes**|**Solder Mask**|
|---|---|---|---|---|
|Type A – mm (in.)|0.424 x 0.424 (0.017 x 0.017)|0.424 x 0.424 (0.017 x 0.017)|0.424 x 0.424 (0.017 x 0.017)|0.524 x 0.524 mm (0.021 x 0.021)|
|Type B – mm (in.)|0.275 x 0.325 (0.011 x 0.013)|0.275 x 0.325 (0.011 x 0.013)|0.275 x 0.325 (0.011 x 0.013)|0.35 x 0.40 (0.014 x 0.016)|
|Type C – mm (in.)|2.7 x 2.7 (0.106 x 0.106)|2.7 x 2.7 (0.106 x 0.106)|2.7 x 2.7 (0.106 x 0.106)|2.8 x 2.8 (0.110 x 0.110)|
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_**Figure 11: Base SiP module recommended solder stencil (top view)**_
**Note** : Solder mask and paste mask to be adjusted according to end-user’s assembly process.
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## 12.4 Base SiP Module Tape and Reel Packaging
_**Figure 12: Base SiP module tape and reel specification**_
**Notes:**
- 1) DIM in mm
- 2) 10 sprocket hole pitch cumulative tolerance ± 0.10 mm
- 3) Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole
- 4) Full reel contains 2000 modules
The module must be in this orientation when feeding the tape.
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## 12.5 U.FL and Chip Antenna PCB Footprint
_**Figure 13: U.FL and chip antenna host PCB footprint**_
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## 12.6 U.FL and Chip Antenna Tape and Reel Packaging
_**Figure 14: U.FL and chip antenna modules tape and reel specification (full reel contains 1000 modules)**_
## 12.7.1 SiP Module
The shield on the 453-00012 base module contains the following information:
**==> picture [105 x 53] intentionally omitted <==**
**----- Start of picture text -----**<br>
Laird<br>MODEL: STERLING™-EWB<br>P/N: 453-00012 R1<br>FCC ID: SQG-EWB1<br>IC: 3147A-EWB1<br>05YYWWD XXXXX<br>**----- End of picture text -----**<br>
## 12.7.2 Antenna Option Modules
The shield on the 453-00013 and 453-00014 modules contains the following information:
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In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process.
- Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels.
- Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the RF shield, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
- Ultrasonic cleaning could damage the module permanently.
After soldering the module to the host board, consider optical inspection to check the following:
- Proper alignment and centering of the module over the pads.
- Proper solder joints on all pads.
- Excessive solder or contacts to neighboring pads, or vias.
The Sterling-EWB module can be unsoldered from the host board if the Moisture Sensitivity Level (MSL) requirements are met as described in this datasheet.
**Note:** Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate warranty coverage.
Bulk orders of the Sterling-EWB base module are delivered in reels of 2000. Bulk orders for the antenna option PCBAs are delivered in reels of 1000.
## 16.2 Handling
The Sterling-EWB modules contain a highly sensitive electronic circuitry. Handling without proper ESD protection may damage the module permanently.
## 16.3 Moisture Sensitivity Level (MSL)
Per J-STD-020, devices rated as MSL 4 and not stored in a sealed bag with desiccant pack should be baked prior to use. Devices are packaged in a Moisture Barrier Bag with a desiccant pack and Humidity Indicator Card (HIC). Devices that will be subjected to reflow should reference the HIC and J-STD-033 to determine if baking is required. If baking is required, refer to J-STD-033 for bake procedure.
## 16.4 Storage
Per J-STD-033, the shelf life of devices in a Moisture Barrier Bag is 12 months at <40C and <90% room humidity (RH). Do not store in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX. Do not store in direct sunlight.
The product should not be subject to excessive mechanical shock.
## 16.5 Repeated Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
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This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
**FCC Caution:** Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
## **IMPORTANT NOTE:**
## **FCC Radiation Exposure Statement:**
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
## **Integration instructions for Host Product Manufacturers**
Applicable FCC Rules to Module
FCC Part 15.247
Summarize the specific operational use conditions
The module must be installed in mobile devices.
This device is intended for OEM integrators under the following conditions:
- The antenna must be installed such that 20 centimeters is maintained between the antenna and users, and
- The transmitter module may not be co-located with any other transmitter or antenna
As long as the two conditions above are met, further transmitter testing is not required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements with this module installed.
**IMPORTANT NOTE:** In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warnings as shown in this manual.
## **Limited Module Procedures**
Not applicable
## **Trace Antenna Designs**
Not applicable
## **RF Exposure Considerations**
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20-centimeter separation distance and co-located issue shall be met at mentioned in _Summarize the specific operational use conditions_ .
The product manufacturer shall provide the text below in the end-product manual:
_This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body._
## **Antennas**
|**Brand Name**|**Model Name**|**Antenna Type**|**Antenna Gain**|**Antenna Connector**|
|---|---|---|---|---|
|ACX|AT3216-A2R4PAA|Chip|1.5|N/A|
|Laird|001-0001|Dipole|2.0|R-SMA|
|Laird|001-0014|FlexPIFA|2.0|U.FL|
|Laird|001-0015|FlexNotch|2.0|U.FL|
|Laird|001-0030|mFlexPIFA|2.0|U.FL|
|Laird|NanoBlue|PCB Dipole|2.0|U.FL|
## **Label and Compliance Information**
Product manufacturers must provide with the finished product a physical or electronic label stating the following:
_Contains FCC ID: SQG-EWB1_
## **Information on Test Modes and Additional Testing Requirements**
Test tool: The Cypress WICED SDK shall be used to set the module to transmit continuously.
## **Additional Testing – Part 15 Subpart B Disclaimer**
The module is only FCC authorized for the specific rule parts listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
## **Industry Canada Statement**
_This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions:_
## _(1) This device may not cause interference_
_(2) This device must accept any interference, including interference that may cause undesired operation of the device_
_Cet appareil contient des émetteurs / récepteurs exempts de licence qui sont conformes au (x) RSS (s) exemptés de licence d'Innovation, Sciences et Développement économique Canada. L'opération est soumise aux deux conditions suivantes:_
## _(1) Cet appareil ne doit pas causer d'interférences_
_(2) Cet appareil doit accepter toute interférence, y compris les interférences pouvant provoquer un fonctionnement indésirable de l'appareil_
_This radio transmitter_ (IC: 3147A-EWB1) _has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device._
_Le présent émetteur radio_ (IC: 3147A-EWB1) _a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur._
|**Brand Name**|**Model Name**|**Antenna Type**|**Antenna Gain**|**Antenna Connector**|
|---|---|---|---|---|
|ACX|AT3216-A2R4PAA|Chip|1.5|N/A|
|Laird|001-0001|Dipole|2.0|R-SMA|
|Laird|001-0014|FlexPIFA|2.0|U.FL|
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|**Brand Name**|**Model Name**|**Antenna Type**|**Antenna Gain**|**Antenna Connector**|
|---|---|---|---|---|
|Laird|001-0015|FlexNotch|2.0|U.FL|
|Laird|001-0030|PIFA|2.0|U.FL|
|Laird|NanoBlue/<br>EBL2400A1-10MH4L|PCB Dipole|2.0|U.FL|
## **Caution:**
(i) the device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;
(ii) for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the e.i.r.p. limit;
(iii) for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band 5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits specified for point-to-point and non-point-to-point operation as appropriate; and
Operations in the 5.25-5.35GHz band are restricted to indoor usage only.
## **Avertissement:**
(i) les dispositifs fonctionnant dans la bande de 5150 à 5250MHz sont réservés uniquement pour une utilisation à l'intérieur afin de réduire les risques de brouillage préjudiciable aux systèmes de satellites mobiles utilisant les mêmes canaux;
(ii) pour les dispositifs munis d'antennes amovibles, le gain maximal d'antenne permis pour les dispositifs utilisant les bandes de 5250 à 5350MHz et de 5470 à 5725 MHz doit être conforme à la limite de la p.i.r.e;
(iii) pour les dispositifs munis d'antennes amovibles, le gain maximal d'antenne permis (pour les dispositifs utilisant la bande de 5725 à 5850 MHz) doit être conforme à la limite de la p.i.r.e. spécifiée pour l'exploitation point à point et l'exploitation non point à point, selon le cas;
Les opérations dans la bande de 5.25-5.35GHz sont limités à un usage intérieur seulement.
## **Radiation Exposure Statement:**
This equipment complies with Canada radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
## **Déclaration d'exposition aux radiations:**
Cet équipement est conforme Canada limites d'exposition aux radiations dans un environnement non contrôlé. Cet équipement doit être installé et utilisé à distance minimum de 20cm entre le radiateur et votre corps.
This device is intended only for OEM integrators under the following condition:
1) The transmitter module may not be co-located with any other transmitter or antenna.
As long as the condition above is met, further transmitter testing is not required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes:
- 1) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
Tant que les 1 condition ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformité supplémentaires requis pour ce module installé.
## **IMPORTANT NOTE:**
In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization.
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## **NOTE IMPORTANTE:**
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada.
## **End Product Labeling**
The final end product must be labeled in a visible area with the following: _Contains IC: 3147A-SU60SOMC_ .
## **Plaque signalétique du produit final**
Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: _Contient des IC: 3147A-SU60SOMC_ .
## **Manual Information to the End User**
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
## **Manuel d'information à l'utilisateur final**
L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module.
Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme indiqué dans ce manuel.
This device complies with the essential requirements of the Radio Equipment directive: 2014/53/EU. The following test methods have been applied in order to prove presumption of conformity with the essential requirements of the Radio Equipment directive: **2014/53/EU** :
- EN 300 328 V2.1.1
- Draft EN 301 489-1 V2.2.0
- Draft EN 301 489-17 V3.2.0
- EN 50385:2017
- EN 62311:2008
- EN 60950-1: 2006+A11:2009+A1:2010+A12:2011+A2:2013
2400~2480 MHz: 18.51 dBm SW version: R1.0
The minimum distance between the user and/or any bystander and the radiating structure of the transmitter is 20 cm.
## 17.5 Japan (MIC) Regulatory
Pending Giteki: CAB ID-Certification Number
## 17.4 Australia and New Zealand
RCM: Pending Compliant to standards EN 300 328 V1.9.1, AS/NZS 4268: 2012-A1:2013, and EN 55022:2010/AC:2011 If this device is used in a product, the OEM has responsibility to verify compliance of the final end product to the Australia/New Zealand (RCM) Standards. All end-products require their own certification (SDoc). You will not be able to leverage the module certification and ship product into the country.
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The Sterling-EWB module is listed on the Bluetooth SIG website as a qualified Controller Subsystem.
_**Table 10: Sterling-EWB declaration ID**_
|**Design Name**|**Owner**|**Declaration ID**|**Design Description**|
|---|---|---|---|
|453-00013C|Laird|D043845|Sterling-EWB U.FL module (Cut Tape)|
|453-00013R|Laird|D043845|Sterling-EWB U.FL module (Tape and Reel)|
|453-00014C|Laird|D043845|Sterling-EWB chip antenna module (Cut Tape)|
|453-00014R|Laird|D043845|Sterling-EWB chip antenna module (Tape and Reel)|
|453-00012C|Laird|D043845|Sterling-EWB base SiP module (Cut Tape)|
|453-00012R|Laird|D043845|Sterling-EWB base SiP module (Tape and Reel)|
It is a mandatory requirement of the Bluetooth Special Interest Group (SIG) that every product implementing Bluetooth technology has a Declaration ID. Every Bluetooth design is required to go through the qualification process, even when referencing a Bluetooth Design that already has its own Declaration ID. The Qualification Process requires each company to register as a member of the Bluetooth SIG – www.bluetooth.com
The following is a link to the Bluetooth Registration page: https://www.bluetooth.com/develop-with-bluetooth/join/
For each Bluetooth Design it is necessary to purchase a Declaration ID. This can be done before starting the new qualification, either through invoicing or credit card payment. The fees for the Declaration ID will depend on your membership status, please refer to the following webpage:
https://www.bluetooth.com/develop-with-bluetooth/qualification-listing/qualification-listing-fees/
A Declaration ID can be purchased via the following link:
https://launchstudio.bluetooth.com/MyProjects/ManageDeclarationIds
## 18.2 Qualification Steps When Referencing a Laird Controller
To qualify your product when referencing a Laird Controller Subsystem design, follow these steps:
1. To start a listing, go to: https://launchstudio.bluetooth.com/MyProjects/GettingStarted
**Note:** A user name and password are required to access this site.
2. Select the option, ‘Start the Bluetooth Qualification Process with **No Required Testing** ’.
3. Enter your Project Name and then enter _**136198**_ in Referenced Qualified Design.
4. Repeat this step for all Subsystems used in your design, (this may be just a Host Subsystem or in addition a Profile Subsystem). You will need to add the QDID for each Subsystem referenced in your design.
_Note: If there is no associated Host Subsystem then it will be necessary to list your own Host Subsystem, this would be possible by following option, ‘Start the Bluetooth Qualification Process with Required Testing’. In this case you will add a Host Component Design in the ‘Referenced Qualified Design’ drop down. An example of this is the Cypress CY-WICED 4.0 Bluetooth Host Software Stack, QDID_ _**115853** . It will be necessary to follow the more complex route for this listing. Once your Host Subsystem listing is complete, you would simply reference the_
https://www.lairdconnect.com/
**Americas** : +1-800-492-2320 **Europe** : +44-1628-858-940 **Hong Kong** : +852 2923 0610
39 © Copyright 2019 Laird. All Rights Reserved
_Sterling LWB Design in the final listing steps, using QDID_ _**136198** . Contact your Laird representative for assistance, contact details are at the bottom of this document._
5. When all referenced Subsystems have been entered, hit ‘Save and continue to Product Declaration’.
6. Enter your preferred listing date, (note it’s possible to delay the public listing date up to 90 days).
7. The next step is to add all Products that contain the Subsystem combination as declared in step 3 and 4. Additional products can be added at a later date if required, as long as they use the same subsystem combination. Each product should have its own entry, to add a similar product use the ‘Duplicate’ button and edit as required.
8. Once all products are added, hit ‘Save and continue to Declaration ID’, if you have already purchased an ID select the correct one from the listed IDs or hit ‘Purchase Declaration ID page’.
**Note:** Unless the Declaration ID is pre-paid or purchased with a credit card, you cannot proceed until the SIG invoice is paid.
9. Once the Declaration ID is selected, tap **Save and continue to Review** . The Project Status items should all be ticked in green, then check all details are correct, go back an amend if required. You should now read and select all statements, add your name to the Signature box, and tap **Signature Confirmed – Complete Project & Submit Product(s) for Qualification.**
Your new design will be listed on the SIG website and you can download a copy of your SDoC. You can also check your listing by hitting ‘View Listing Details’.
For further information please refer to the following training material:
https://www.bluetooth.com/wp-content/uploads/2019/04/Launch-Studio-Checklist.pdf
Please contact your local sales representative or our support team for further assistance:
Email support@lairdconnect.com
Phone Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Web https://www.lairdconnect.com/wireless-modules
https://www.lairdconnect.com/
**Americas** : +1-800-492-2320 **Europe** : +44-1628-858-940 **Hong Kong** : +852 2923 0610
40 © Copyright 2019 Laird. All Rights Reserved
Updated at April 25, 2026
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