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Illustrative purposes only
451-00003
Bluetooth 5.0, 1.7V to 3.6V Supply, BL654 Series Range, 2Mbps, -92dBm Sensitivity
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: EZURIO
- Product type: Bluetooth Modules & Adaptors
- Bluetooth Version:Bluetooth 5.0; Supply Voltage Min:1.7V; Supply Voltage Max:3.6V; Signal Range Max:-; Data Rate:2Mbps; Bluetooth Class:-; Receive Sensitivity:-92dBm; Operating Temperature Mi
- SVHC: To Be Advised
- Interfaces: USB
- Product Range: BL654 Series
- Certifications: CE, FCC, IC, MIC, RCM
- Bluetooth Class: -
- Bluetooth Version: Bluetooth 5.0
- Supply Voltage Range: 1.7 V to 3.6 V
- Receiver Sensitivity Rx: -92 dBm
- Operating Temperature Range: -40 °C to 85 °C
| Delivery and price | |
|---|---|
| Units per pack | 50 |
| Price | 29.41 € |
| Current stock | 50+ |
| Lead time | 30 days |
Datasheet
_Version 0.5_
_This is a_ _**PRELIMINARY** version of the BL654 datasheet._
_Information contained in this document is subject to change._
|REVISION HISTORY|REVISION HISTORY|REVISION HISTORY|REVISION HISTORY|REVISION HISTORY|REVISION HISTORY|
|---|---|---|---|---|---|
|**Version**<br>**Date**<br>**Notes**<br>**Contributor(s)**<br>**Approver**<br>0.1<br>09 Feb 2018<br>Initial Release<br>Raj Khatri<br>Jonathan Kaye<br>~~a~~<br>~~ee~~<br>~~es~~||||||
||0.2|21 Feb 2018|Updated antenna information|Connie Lin|Jonathan Kaye|
||0.3|12 Mar 2018|Updated mechanical drawing (rear)<br>Updated template to new style|Raj Khatri/Sean Querry|Jonathan Kaye|
||0.4|02 Apr 2018|Fixed part # error (455-0002 changed to<br>455-00002)|Karla Moreno|Jonathan Kaye|
||0.5|12 Apr 2018|Updated Power Supply block diagram<br>(figure 4)|Raj Khatri|Jonathan Kaye|
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
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© Copyright 2018 Laird. All Rights Reserved
|1|Overview and Key Features ................................................................................................................................................... 4|Overview and Key Features ................................................................................................................................................... 4|
|---|---|---|
|2|Specification .......................................................................................................................................................................... 5||
|3|Hardware Specifications ........................................................................................................................................................ 9||
||3.1|Block Diagram and Pin-out ...................................................................................................................................... 9|
||3.2|Pin Definitions ........................................................................................................................................................ 10|
||3.3|Electrical Specifications ......................................................................................................................................... 16|
||3.4|Programmability .................................................................................................................................................... 20|
|4|Power Consumption ............................................................................................................................................................ 21||
|5|Functional Description ......................................................................................................................................................... 24||
||5.1|Power Management .............................................................................................................................................. 24|
||5.2|BL654 Power Supply Options ................................................................................................................................. 24|
||5.3|Clocks and Timers .................................................................................................................................................. 27|
||5.4|Radio Frequency (RF) ............................................................................................................................................. 27|
||5.5|NFC......................................................................................................................................................................... 27|
||5.6|UART Interface ....................................................................................................................................................... 29|
||5.7|USB interface ......................................................................................................................................................... 30|
||5.8|SPI Bus ................................................................................................................................................................... 30|
||5.9|I2C Interface .......................................................................................................................................................... 31|
||5.10|General Purpose I/O, ADC, PWM and FREQ .......................................................................................................... 31|
||5.11|nRESET pin ............................................................................................................................................................. 32|
||5.12|Two-wire Interface JTAG........................................................................................................................................ 32|
||5.13|BL654 Wakeup ....................................................................................................................................................... 33|
||5.14|Low Power Modes ................................................................................................................................................. 33|
||5.15|Temperature Sensor .............................................................................................................................................. 34|
||5.16|Security/Privacy ..................................................................................................................................................... 34|
||5.17|Optional External 32.768 kHz crystal ..................................................................................................................... 34|
||5.18|451-00001 On-board PCB Antenna Characteristics ............................................................................................... 36|
|6|Hardware Integration Suggestions ...................................................................................................................................... 36||
||6.1|Circuit ..................................................................................................................................................................... 36|
||6.2|PCB Layout on Host PCB - General ......................................................................................................................... 38|
||6.3|PCB Layout on Host PCB for the 451-00001 .......................................................................................................... 38|
||6.4|External Antenna Integration with the 451-00002 ................................................................................................ 40|
|7|Mechanical Details .............................................................................................................................................................. 41||
|8|Application Note for Surface Mount Modules .................................................................................................................... 43||
||8.1|Introduction ........................................................................................................................................................... 43|
||8.2|Shipping ................................................................................................................................................................. 43|
||8.3|Reflow Parameters ................................................................................................................................................ 46|
|9|FCC and IC Regulatory Statements ...................................................................................................................................... 48||
|10||Japan (MIC) Regulatory .......................................................................................................................................... 51|
|11||CE Regulatory ......................................................................................................................................................... 52|
|12||Ordering Information ............................................................................................................................................. 54|
|13||Bluetooth SIG Qualification ................................................................................................................................... 54|
|14||Additional Assistance ............................................................................................................................................. 56|
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
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© Copyright 2018 Laird. All Rights Reserved
Every BL654 Series module is designed to simplify OEMs enablement of Bluetooth Low Energy (BLE) v5.0 and Thread (802.15.4) to small, portable, power-conscious devices. The BL654 provides engineers with considerable design flexibility in both hardware and software programming capabilities. Based on the world-leading Nordic Semiconductor nRF52840 chipset, the BL654 modules provide ultra-low power consumption with outstanding wireless range via +8 dBm of transmit power and the Long Range (CODED PHY) Bluetooth 5 feature. The BL654 is programmable via Laird’s _smart_ BASIC language or Nordic’s software development kit (SDK).
_smart_ BASIC is an event-driven programming language that is highly optimized for memory-constrained systems such as embedded modules. It was designed to make BLE development quicker and simpler, vastly cutting down time to market.
The Nordic SDK, on the other hand, offers developers source code (in C) and precompiled libraries containing BLE and ANT+ device profiles, wireless communication, as well as application examples.
**Note:** BL654 hardware provides all functionality of the nRF52840 chipset used in the module design. This is a hardware datasheet only – it does not cover the software aspects of the BL654.
For customers using _smart_ BASIC, refer to the _smart_ BASIC extensions guide (available from the BL654 product page of the Laird website.
For customers using the Nordic SDK, refer to www.nordicsemi.com.
- Bluetooth v5.0 – Single mode
- NFC
- 802.15.4 (Thread) radio support
- External or internal antennas
- Multiple programming options
-
-
- Compact footprint
- Programmable Tx power +8 dBm to -20 dBm, -40dBm
- Rx sensitivity – -95 dBm
- Ultra-low power consumption
- Tx – 4.9 mA peak (at 0 dBm, DCDC on) (See Note 1 in the _Power Consumption_ section)
- Standby Doze – TBD uA typical
- ▪ Deep Sleep – TBD uA – (See Note 4 in the _Power Consumption_ section)
- ▪ UART, GPIO, ADC, PWM, FREQ output, timers, I2C, SPI, I2S, PDM, and USB interfaces
- Fast time-to-market
- ▪ FCC, CE, IC, RCM and Japan certified
- Full Bluetooth Declaration ID
- Other regulatory certifications on request (all certifications pending)
- No external components required
- Industrial temperature range (-40° C to +85° C)
- Rx: 4.8 mA peak (DCDC on) (See Note 1 in the _Power Consumption_ section)
- Medical devices
- IoT Sensors
- Appcessories
- Fitness sensors
- Location awareness
- Home automation
**Note** : Figures on this page are gathered from the nRF52840 datasheet provided by Nordic.
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
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© Copyright 2018 Laird. All Rights Reserved
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**----- Start of picture text -----**<br>
||||
|---|---|---|
|Categories/Feature|Implementation|
|eeGe|
|Wireless Specification|
|▪|BT 5.0 – Single mode|
|▪|4x Range (CODED PHY support) – BT 5.0|
|▪|2x Speed (2M PHY support) – BT 5.0|
|▪|LE Advertising Extensions – BT 5.0|
|▪|Concurrent master, slave|
|Bluetooth®|▪|BLE Mesh capabilities|
|▪|Diffie-Hellman based pairing (LE Secure Connections) – BT 4.2|
|▪|Data Packet Length Extension – BT 4.2|
|▪|Link Layer Privacy (LE Privacy 1.2) – BT 4.2|
|▪|LE Dual Mode Topology – BT 4.1|
|▪|LE Ping – BT 4.1|
|Frequency|2.402 - 2.480 GHz|
|1 Mbps BLE (over-the-air)|
|2 Mbps BLE (over-the-air)|
|Raw Data Rates|
|125 kbps BLE (over-the-air)|
|500 kbps BLE (over-the-air) – TBD|
|+8 dBm|Conducted 451-00001 (Integrated antenna)|
|Maximum Transmit Power Setting|
|+8 dBm|Conducted 451-00002 (External antenna)|
|-40 dBm, -20 dBm (in 4 dB steps)|
|Minimum Transmit Power Setting|
|-16 dBm, -12 dBm, - 8 dBm, - 4 dBm, 0 dBm|
|BLE 1 Mbps (0.1% BER)|-95 dBm typical|
|BLE 2 Mbps|-92 dBm typical|
|Receive Sensitivity|
|BLE 125 kbps|-103 dBm typical|
|BLE 500 kbps|-99 dBm typical (TBD)|
|103 dB|@ BLE 1 Mbps|
|Link Budget|
|111 dB|@ BLE 125 kbps|
|1 Mbps BLE|TBD|
|Range|
|125 kHz BLE|TBD|
**----- End of picture text -----**<br>
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
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© Copyright 2018 Laird. All Rights Reserved
**==> picture [477 x 637] intentionally omitted <==**
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||||
|---|---|---|
|es|Categories/Feature|Implementation|
|NFC|
|Based on NFC forum specification|
|▪|13.56 MHz|
|▪|Date rate 106 kbps|
|▪|NFC Type2 and Type 4 emulation|
|Modes of Operation:|
|NFC-A Listen mode compliant|▪|Disable|
|▪|Sense|
|▪|Activated|
|Use Cases:|
|▪|Touch-to-Pair with NFC|
|▪|NFC enabled Out-of-Band Pairing|
|System Wake-On-Field function|Proximity Detection|
|Host Interfaces and Peripherals|
|Total|48 x multifunction I/O lines|
|2 UARTs|
|Tx, Rx, CTS, RTS|
|UART|DCD, RI, DTR, DSR (See Note 1)|
|Default 115200, n, 8, 1|
|From 1,200 bps to 1 Mbps|
|USB2.0 FS (Full Speed, 12Mbps).|
|USB|CDC driver / Virtual UART (baud rate TBD)|
|Other USB drivers available via Nordic SDK|
|Up to 48, with configurable:|
|I/O direction,|
|GPIO|O/P drive strength (standard 0.5 mA or high 3mA/5 mA),|
|Pull-up /pull-down|
|Input buffer disconnect|
|Eight 8/10/12-bit channels|
|0.6 V internal reference|
|ADC|Configurable 4, 2, 1, 1/2, 1/3, 1/4, 1/5 1/6(default) pre-scaling|
|Configurable acquisition time 3uS, 5uS, 10uS(default), 15uS, 20uS, 40uS.|
|One-shot mode|
|PWM outputs on 16 GPIO output pins.|
|▪|PWM output duty cycle: 0%-100%|
|PWM Output|▪|PWM output frequency: Up to 500kHz|
|(See Note 7)|
|FREQ outputs on 16 GPIO output pins.|
|FREQ Output|▪|FREQ output frequency: 0 MHz-4MHz (50% duty cycle)|
|I2C|Two I2C interface (up to 400 kbps) – See Note 2|
|SPI|Four SPI Master Slave interface (up to 4 Mbps)|
|One 32-MHz QSPI interface. Gives XIP (Execution in Place) capability.|
|QSPI|
|External serial flash IC must be fitted as per Nordic specifications.|
**----- End of picture text -----**<br>
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
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© Copyright 2018 Laird. All Rights Reserved
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**----- Start of picture text -----**<br>
||||||
|---|---|---|---|---|
|es|Categories/Feature|Implementation|
|One temperature sensor.|
|Temperature Sensor|Temperature range equal to the operating temperature range.|
|Resolution 0.25 degrees.|
|One RF received signal strength indicator|
|RSSI Detector|Two dB accuracy (valid over -90 to -20 dBm)|
|One dB resolution|
|I2S|One inter-IC sound interface|
|PDM|One pulse density modulation interface|
|Optional (External to the BL654 module)|
|For customer use, connect +/-20ppm accuracy crystal for more accurate|
|External 32.768 kHz crystal|
|protocol timing.|
|Profiles|
|▪|Central Mode|
|▪|Peripheral Mode|
|Services supported|▪|Mesh (with custom models)|
|▪|Custom and adopted profiles|
|Programmability|
|smart|BASIC|FW upgrade via JTAG or UART|
|Application download via UART or Via Over-the-Air (if SIO_02 pin is pulled high|
|externally)|
|Nordic SDK|Via JTAG|
|Operating Modes|
|smart|BASIC|Self-contained Run mode|
|Selected by nAutoRun pin status: LOW (0V).|
|Then runs $autorun$ (|smart|BASIC application script) if it exists.|
|Interactive/Development mode|
|HIGH (VDD).|
|Then runs via at+run (and|file name|of|smart|BASIC application script).|
|Nordic SDK|As per Nordic SDK|
|Supply Voltage|
|Supply (VDD or VDD_HV) options|▪|Normal voltage mode VDD 1.7- 3.6 V – Internal DCDC converter or LDO|
|(See Note 3)|
|OR|
|▪|High voltage mode VDD_HV 2.5V-5.5V Internal DCDC converter or LDO|
|(See Note 5)|
|Power Consumption|
|Active Modes Peak Current (for|14.1 mA peak Tx (with DCDC)|
|maximum Tx power +8 dBm)|
|– Radio only|
|Active Modes Peak Current (for Tx|4.0 mA peak Tx (with DCDC)|
|power -40 dBm) – Radio only|
|Active Modes Average Current|Depends on many factors, see|Power Consumption|
**----- End of picture text -----**<br>
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
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© Copyright 2018 Laird. All Rights Reserved
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**----- Start of picture text -----**<br>
||||
|---|---|---|
|es|Categories/Feature|Implementation|
|Standby Doze|TBD uA typical (Note 4)|
|Ultra-low Power Modes|
|Deep Sleep|TBD nA (Note 4)|
|Antenna Options|
|Internal|Printed PCB monopole antenna – on-board|
|451-00001 variant|
|External|▪|Dipole antenna (with IPEX connector)|
|▪|Dipole PCB antenna (with IPEX connector)|
|▪|Connection via IPEX MH4 –|451-00002 variant|
|See the Antenna Information sections for FCC and IC, MIC, RCM and CE.|
|Physical|
|Dimensions|15.0 mm x 10 mm x 2.2 mm|
|Pad Pitch – 0.8 mm|
|Pad Type – Two rows of pads.|
|Weight|<1 gram|
|Environmental|
|Operating|-40 ˚C to +85 ˚C|
|Storage|-40 ˚C to +85 ˚C|
|Miscellaneous|
|Lead Free|Lead-free and RoHS compliant|
|Warranty|One-Year Warranty|
|Development Tools|
|Development kit per module SKU (455-00001 and 455-00002) and free|
|Development Kit|
|software tools|
|Approvals|
|Bluetooth®|Full Bluetooth SIG Declaration ID (all pending)|
|FCC / IC / CE / MIC / RCM|All BL654 Series (all pending)|
**----- End of picture text -----**<br>
## **Module Specification Notes:**
**Note 1** DSR, DTR, RI, and DCD can be implemented in the _smart_ BASIC application or through the Nordic SDK.
- **Note 2** With I2C interface selected, pull-up resistors on I2C SDA and I2C SCL _**must**_ be connected externally as per I2C standard.
**Note 3** Use of the internal DCDC convertor or LDO is decided by the underlying BLE stack.
- **Note 4** These figures are measured on the BL654 modules
- Deep Sleep current for BL654 modules TBD uA (typical)
- Standby Doze current for BL654 modules – TBD uA (typical)
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
8
© Copyright 2018 Laird. All Rights Reserved
_**Figure 1: BL654 Block diagram**_
_**Figure 2: Functional HW and SW block diagram for BL654 series BLE module**_
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
9
© Copyright 2018 Laird. All Rights Reserved
_**Figure 3: BL654 module pin-out (top view). Outer row pads (long red line) and inner row pads (short red line) shown.**_
_**Table 1: Pin definitions**_
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||||||||||
|---|---|---|---|---|---|---|---|---|
|Pull|
|Default|Alternate|nRF52840|nRF52840|
|Pin #|Pin Name|In/ Out|Up/|Comment|
|Function|Function|QFN Pin|QFN Name|
|Down|
|0|GND|-|-|-|-|-|-|-|
|PULL-|
|1|SWDIO|SWDIO|-|IN|AC24|SWDIO|-|
|UP|
|PULL-|
|2|SIO_36|SIO_36|IN|U24|P1.04|-|
|UP|
|PULL-|
|3|SWDCLK|SWDCLK|-|IN|AA24|SWDCLK|
|DOWN|
|PULL-|
|4|SIO_34|SIO_34|-|-|W24|P1.02|-|
|UP|
|Laird Devkit:|FTDI|
|SIO_35/|PULL-|
|5|nAutoRUN|SIO_35|IN|V23|P1.03|USB_DTR via jumper|
|nAutoRUN|DOWN|
|on J12pin1-2.|
|PULL-|
|6|SIO_33|SIO_33|IN|Y23|P1.01|-|
|UP|
**----- End of picture text -----**<br>
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
10
© Copyright 2018 Laird. All Rights Reserved
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**----- Start of picture text -----**<br>
||||||||||
|---|---|---|---|---|---|---|---|---|
|Pull|
|Default|Alternate|nRF52840|nRF52840|
|Pin #|Pin Name|In/ Out|Up/|Comment|
|Function|Function|QFN Pin|QFN Name|
|Down|
|PULL-|
|7|SIO_32|SIO_32|-|IN|AD22|P1.00|-|
|UP|
|PULL-|Laird Devkit:|
|8|SIO_25|SIO_25|-|IN|AC21|PO.25|
|UP|BUTTON1|
|PULL-|
|9|SIO_23|SIO_23|QSPI_DIO3|IN|AC19|PO.23|-|
|UP|
|PULL-|Laird Devkit:|
|10|SIO_24|SIO_24|IN|AD20|PO.24|
|UP|BUTTON3|
|PULL-|
|11|SIO_22|SIO_22|QSPI_DIO2|IN|AD18|PO.22|-|
|UP|
|PULL-|
|12|SIO_21|SIO_21|QSPI_DIO1|IN|AC17|PO.21|-|
|UP|
|PULL-|
|13|SIO_20|SIO_20|QSPI_DIO0|IN|AD16|PO.20|-|
|UP|
|PULL-|PO.19|
|14|SIO_19|SIO_19|QSPI_CLK|IN|AC15|-|
|UP|
|15|D+|D+|-|IN|AD6|D+|-|
|PULL-|
|16|SIO_17|SIO_17|QSPI_CS|IN|AD12|PO.17|-|
|UP|
|17|D-|D-|-|IN|AD4|D-|-|
|PULL-|
|18|SIO_15|SIO_15|-|IN|AD10|PO.15|Laird Devkit:|LED3|
|UP|
|PULL-|System Reset (Active|
|19|nRESET|nRESET|SIO_18|IN|AC13|PO.18|
|UP|Low)|
|PULL-|
|20|SIO_13|SIO_13|-|IN|AD8|PO.13|Laird Devkit:|LED1|
|UP|
|PULL-|
|21|SIO_16|SIO_16|-|IN|AC11|PO.16|Laird Devkit:|LED4|
|UP|
|PULL-|
|22|SIO_14|SIO_14|-|IN|AC9|PO.14|Laird Devkit:|LED2|
|UP|
|23|GND|-|-|-|-|-|-|-|
|24|VBUS|4.35V – 5.5V|
|25|VDD_HV|-|-|-|-|-|-|2.5V to 5.5V|
|26|GND|-|-|-|-|-|-|-|
|PULL-|Laird Devkit:|
|27|SIO_11|SIO_11|-|IN|T2|PO.11|
|UP|BUTTON1|
|PULL-|
|28|SIO_12|SIO_12|-|IN|U1|PO.12|-|
|UP|
**----- End of picture text -----**<br>
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
11
© Copyright 2018 Laird. All Rights Reserved
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**----- Start of picture text -----**<br>
||||||||||
|---|---|---|---|---|---|---|---|---|
|Pull|
|Default|Alternate|nRF52840|nRF52840|
|Pin #|Pin Name|In/ Out|Up/|Comment|
|Function|Function|QFN Pin|QFN Name|
|Down|
|UARTCLOSE() selects|
|DIO functionality.|
|SIO_08/|PULL-|
|29|SIO_08|UART_RX|IN|N1|PO.08|UARTOPEN() selects|
|UART_RX|UP|
|UART COMMS|
|behaviour|
|PULL-|
|30|SIO_41|SIO_41|-|IN|R1|P1.09|-|
|UP|
|31|VDD|-|-|-|-|1.7V to 3.6V|
|PULL-|
|32|SIO_40|SIO_40|-|IN|P2|P1.08|-|
|UP|
|33|GND|-|-|-|-|-|-|-|
|SIO_04/|PULL-|
|34|SIO_04|AIN2|IN|J1|PO.04/AIN2|-|
|AIN2|UP|
|UARTCLOSE() selects|
|Set|DIO functionality.|
|SIO_06/|
|35|SIO_06|UART_TX|OUT|High|L1|PO.06|UARTOPEN() selects|
|UART_TX|
|in FW|UART COMMS|
|behaviour|
|SIO_26/|PULL-|Laird Devkit:|I2C RTC|
|36|SIO_26|I2C_SDA|IN|G1|PO.26|
|I2C_SDA|UP|chip. I2C data line.|
|UARTCLOSE() selects|
|DIO functionality.|
|SIO_07/|PULL-|
|37|SIO_07|UART_CTS|IN|M2|PO.07|UARTOPEN() selects|
|UART_CTS|DOWN|
|UART COMMS|
|behaviour|
|SIO_27/|PULL-|Laird Devkit:|I2C RTC|
|38|SIO_27|I2C_SCL|IN|H2|PO.27|
|I2C_SCL|UP|chip. I2C clock line.|
|UARTCLOSE() selects|
|SIO_05/|Set|DIO functionality.|
|UART_RTS/|
|39|UART_RTS/|SIO_05|OUT|Low in|K2|PO.05/AIN3|UARTOPEN() selects|
|AIN3|
|AIN3|FW|UART COMMS|
|behaviour|
|40|GND|-|-|-|-|-|-|-|
|Laird Devkit: Optional|
|SIO_01/|PULL-|32.768kHz crystal pad|
|41|SIO_01|XL2|IN|F2|PO.01/XL2|
|XL2|UP|XL2 and associated|
|load capacitor.|
|Laird Devkit: Optional|
|SIO_00/|PULL-|32.768kHz crystal pad|
|42|SIO_00|XL1|IN|D2|PO.00/XL1|
|XL1|UP|XL1 and associated|
|load capacitor.|
|43|GND|-|-|-|-|-|-|-|
|SIO_31/|PULL-|
|44|SIO_31|AIN7|IN|A8|PO.31/AIN7|-|
|AIN7|UP|
**----- End of picture text -----**<br>
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
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© Copyright 2018 Laird. All Rights Reserved
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**----- Start of picture text -----**<br>
||||||||||
|---|---|---|---|---|---|---|---|---|
|Pull|
|Default|Alternate|nRF52840|nRF52840|
|Pin #|Pin Name|In/ Out|Up/|Comment|
|Function|Function|QFN Pin|QFN Name|
|Down|
|SIO_30/|PULL-|
|45|SIO_30|AIN6|IN|B9|PO.30/AIN6|-|
|AIN6|UP|
|SIO_28/|PULL-|
|46|SIO_28|AIN4|IN|B11|PO.28/AIN4|-|
|AIN4|UP|
|47|GND|-|-|-|-|-|-|-|
|SIO_29/|PULL-|
|48|SIO_29|AIN5|IN|A1-|PO.29/AIN5|-|
|AIN5|UP|
|SIO_03/|PULL-|Laird Devkit:|Temp|
|49|SIO_03|AIN1|IN|B13|PO.03/AIN1|
|AIN1|UP|Sens Analog|
|Internal pull-down. Pull|
|SIO_02/|PULL-|High externally to|
|50|SIO_02|AIN0|IN|A12|PO.02/AIN0|
|AIN0|DOWN|enter VSP (Virtual|
|Serial Port) Service.|
|Laird Devkit:|SPI|
|EEPROM.|
|SPI_Eeprom_MISO,|
|Input.|
|SIO_46/|PULL-|
|51|SIO_46|SPI_MISO|IN|B15|P1.14|
|SPI_MISO|UP|SPIOPEN() in|
|smart|BASIC selects SPI|
|function; MOSI and|
|CLK are outputs when|
|in SPI master mode.|
|52|GND|-|-|-|-|-|-|-|
|Laird Devkit:|SPI|
|EEPROM.|
|SPI_Eeprom_CLK,|
|Output:|
|SIO_47/|PULL-|
|53|SIO_47|SPI_CLK|IN|A14|P1.15|
|SPI_CLK|UP|SPIOPEN() in|
|smart|BASIC selects SPI|
|function, MOSI and CLK|
|are outputs when in|
|SPI master mode.|
|Laird Devkit:|SPI|
|PULL-|
|54|SIO_44|SIO_44|-|IN|B17|P1.12|EEPROM.|
|UP|
|SPI_Eeprom_CS, Input|
|55|GND|-|-|-|-|-|-|-|
**----- End of picture text -----**<br>
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**==> picture [495 x 499] intentionally omitted <==**
**----- Start of picture text -----**<br>
||||||||||
|---|---|---|---|---|---|---|---|---|
|Pull|
|Default|Alternate|nRF52840|nRF52840|
|Pin #|Pin Name|In/ Out|Up/|Comment|
|Function|Function|QFN Pin|QFN Name|
|Down|
|Laird Devkit:|SPI|
|EEPROM.|
|SPI_Eeprom_MOSI,|
|Output|
|SIO_45/|PULL-|
|56|SIO_45|SPI_MOSI|IN|A16|P1.13|
|SPI_MOSI|UP|SPIOPEN() in|
|smart|BASIC selects SPI|
|function, MOSI and CLK|
|are outputs in SPI|
|master.|
|NFC2/|
|57|NFC2|SIO_10|IN|-|J24|PO.10/NFC2|-|
|SIO_10|
|58|GND|-|-|-|-|-|-|-|
|NFC1/|
|59|NFC1|SIO_09|IN|-|L24|PO.09/NFC1|-|
|SIO_09|
|PULL-|
|60|SIO_43|SIO_43|-|IN|B19|P1.11|-|
|UP|
|PULL-|
|61|SIO_37|SIO_37|-|IN|T23|P1.05|-|
|UP|
|PULL-|
|62|SIO_42|SIO_42|-|IN|A20|P1.10|-|
|UP|
|PULL-|Reserved for future|
|63|SIO_38|N/C|-|IN|R24|P1.06|
|UP|use. Do not connect.|
|PULL-|
|64|SIO_39|SIO_39|-|IN|P23|P1.07|-|
|UP|
|65|GND|-|-|-|-|-|-|-|
|66|GND|-|-|-|-|-|-|-|
|67|GND|-|-|-|-|-|-|-|
|68|GND|-|-|-|-|-|-|-|
|69|GND|-|-|-|-|-|-|-|
|70|GND|-|-|-|-|-|-|-|
|71|GND|-|-|-|-|-|-|-|
**----- End of picture text -----**<br>
**Pin Definition Notes:**
**Note 1** SIO = Signal Input or Output. Secondary function is selectable in _smart_ BASIC application or via Nordic SDK. I/O voltage level tracks VDD. AIN = Analog Input.
**Note 2** At reset, all SIO lines are configured as the defaults shown above.
SIO lines can be configured through the _smart_ BASIC application script to be either inputs or outputs with pullups or pull-downs. When an alternative SIO function is selected (such as I2C or SPI), the firmware does not allow the setup of internal pull-up/pull-down. Therefore, when I2C interface is selected, pull-up resistors on I2C
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## **Pin Definition Notes:**
SDA and I2C SCL _**must**_ be connected externally as per I2C standard.
- **Note 3** JTAG (two-wire SWD interface), pin 1 (SWDIO) and pin 3 (SWDCLK).
JTAG is required because Nordic SDK applications can only be loaded using JTAG ( _smart_ BASIC firmware can be loaded using the JTAG as well as UART). We recommend that you use JTAG (2-wire interface) to handle future BL654 module _smart_ BASIC firmware upgrades. You MUST wire out the JTAG (2-wire interface) on your host design (see Figure 7, where four lines (SWDIO, SWDCLK, GND and VDD) should be wired out. _smart_ BASIC firmware upgrades can still be performed over the BL654 UART interface, but this is slower (60 seconds using UART vs. 10 seconds when using JTAG) than using the BL654 JTAG (2-wire interface).
Upgrading _smart_ BASIC firmware or loading the _smart_ BASIC applications is done using the UART interface.
- **Note 4** Pull the nRESET pin (pin 19) low for minimum 100 milliseconds to reset the BL654.
- **Note 5** The SIO_02 pin (pin 50) must be pulled high externally to enable VSP (Virtual Serial Port) which would allow OTA (over-the-air) _smart_ BASIC application download. Refer to the latest firmware release documentation for details.
- **Note 6** Ensure that SIO_02 (pin 50) and AutoRUN (pin 5) are _**not both high**_ (externally), in that state, the UART is bridged to Virtual Serial Port service; the BL654 module does not respond to AT commands and cannot load _smart_ BASIC application scripts.
- **Note 7** Pin 5 (nAutoRUN) is an input, with active low logic. In the development kit it is connected so that the state is driven by the host’s DTR output line. The nAutoRUN pin must be externally held high or low to select between the following two BL654 operating modes:
- Self-contained Run mode (nAutoRUN pin held at 0V –this is the default (internal pull-down enabled))
- ▪ Interactive/Development mode (nAutoRUN pin held at VDD)
The _smart_ BASIC firmware checks for the status of nAutoRUN during power-up or reset. If it is low and if there is a _smart_ BASIC application script named **$autorun$** , then the _smart_ BASIC firmware executes the application script automatically; hence the name S _elf-contained Run Mode_ .
**Note 8** The _smartBASIC_ firmware has SIO pins as Digital (Default Function) INPUT pins, which are set PULL-UP by default. This avoids floating inputs (which can cause current consumption to drive with time in low power modes (such as Standby Doze). You can disable the PULL-UP through your _smart_ BASIC application.
- All of the SIO pins (with a default function of DIO) are inputs (apart from SIO_05 and SIO_06, which are outputs):
- SIO_06 (alternative function UART_TX) is an output, set High (in the firmware).
- SIO_05 (alternative function UART_RTS) is an output, set Low (in the firmware).
- SIO_08 (alternative function UART_RX) is an input, set with internal pull-up (in the firmware).
- SIO_07 (alternative function UART_CTS) is an input, set with internal pull-down (in the firmware).
- SIO_02 is an input set with internal pull-down (in the firmware). It is used for OTA downloading of _smart_ BASIC applications. Refer to the latest firmware extension documentation for details.
- UART_RX, UART_TX, and UART_CTS are 3.3 V level logic (if VDD is 3.3 V; such as SIO pin I/O levels track VDD). For example, when Rx and Tx are idle, they sit at 3.3 V (if VDD is 3.3 V). Conversely, handshaking pins CTS and RTS at 0V are treated as assertions.
**Note 9** Not required for BL654 module normal operation. The on-chip 32.768kHz RC oscillator provides the standard
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## **Pin Definition Notes:**
accuracy of ±250 ppm, with calibration required every 8seconds (default) to stay within ±250 ppm.
BL654 also allows as an option to connect an external higher accuracy (±20 ppm) 32.768 kHz crystal to the BL654 pins SIO_01/XL2 (pin 41) and SIO_00/XL1 (pin 42). This provides higher accuracy protocol timing and helps with radio power consumption in the system standby doze/deep sleep modes by reducing the time that the Rx window must be open.
BL654 power supply options: **Note 10**
- **Option 1** – Normal voltage power supply mode entered when the external supply voltage is connected to both the VDD and VDD_HV pins (so that VDD equals VDD_HV). Connect external supply within range 1.7V to 3.6V range to BL654 VDD and VDD_HV pins.
## _OR_
- **Option 2** – High voltage mode power supply mode (using BL654 VDD_HV pin) entered when the external supply voltage in ONLY connected to the VDDH pin and the VDD pin is not connected to any external voltage supply. Connect external supply within range 2.5V to 5.5V range to BL654 VDD_HV pin. BL654 VDD pin left unconnected.
For either option, if you use USB interface then the BL654 VBUS pin must be connected to external supply within the range 4.35V to 5.5V. When using the BL654 VBUS pin, you MUST externally fit a 4.7uF to ground.
Absolute maximum ratings for supply voltage and voltages on digital and analogue pins of the module are listed below; exceeding these values causes permanent damage.
|**_Table 2: Maximum current ratings_**<br>**Parameter**<br>**Min**<br>**Max**<br>**Unit**<br>~~es~~|**_Table 2: Maximum current ratings_**<br>**Parameter**<br>**Min**<br>**Max**<br>**Unit**<br>~~es~~|**_Table 2: Maximum current ratings_**<br>**Parameter**<br>**Min**<br>**Max**<br>**Unit**<br>~~es~~|**_Table 2: Maximum current ratings_**<br>**Parameter**<br>**Min**<br>**Max**<br>**Unit**<br>~~es~~|
|---|---|---|---|
|Voltage at VDDpin|-0.3|+3.9(Note 1)|V|
|Voltage at VDD_HVpin|-0.3|+5.8|V|
|VBUS|-0.3|+5.8|V|
|Voltage at GNDpin||0|V|
|Voltage at SIOpin(at VDD≤3.6V)|-0.3|VDD +0.3|V|
|Voltage at SIOpin(at VDD≥3.6V)|-0.3|3.9|V|
|NFC antennapin current(NFC1/2)|-|80|mA|
|Radio RF input level|-|10|dBm|
|**Environmental**||||
|Storage temperature|-40|+85|ºC|
|MSL(Moisture SensitivityLevel)|-|4|-|
|ESD (as per EN301-489)||||
|Conductive||4|KV|
|Air Coupling||8|KV|
|Flash Memory (Endurance) (Note 2)|-|10000|Write/erase cycles|
|Flash Memory (Retention)|-|10years at 40°C|-|
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## **Maximum Ratings Notes:**
**Note 1** The absolute maximum rating for VDD_nRFin (max) is 3.9V for the BL654.
**Note 2** Wear levelling is used in file system.
## 3.5.2 Recommended Operating Parameters
**==> picture [509 x 176] intentionally omitted <==**
**----- Start of picture text -----**<br>
||||||||
|---|---|---|---|---|---|---|
|Table 3: Power supply operating parameters|
|es|Parameter|ns|Min|Typ|Max|Unit|
|VDD (independent of DCDC)|[1]|supply range|1.7|3.3|3.6|V|
|VDD_HV (independent of DCDC) supply range|2.5|3.7|5.5|V|
|VBUS USB supply range|4.35|5|5.5|V|
|VDD Maximum ripple or noise|[2]|-|-|10|mV|
|VDD supply rise time (0V to 1.7V)|[3]|-|-|60|mS|
|Time in Power|mS|
|mS|
|mS|
|VDD_HV supply rise time (0V to 3.7V)|[ 3]|100|mS|
|Operating Temperature Range|-40|-|+85|ºC|
**----- End of picture text -----**<br>
## **Recommended Operating Parameters Notes:**
**Note 1** 4.7 uF internal to module on VDD. The internal DCDC convertor or LDO is decided by the underlying BLE stack.
- **Note 2** This is the maximum VDD or VDD_HV ripple or noise (at any frequency) that does not disturb the radio.
**Note 3** The on-board power-on reset circuitry may not function properly for rise times longer than the specified maximum.
**Note 4** BL654 power supply options:
- **Option 1** – Normal voltage power supply mode entered when the external supply voltage is connected to both the VDD and VDD_HV pins (so that VDD equals VDD_HV). Connect external supply within range 1.7V to 3.6V range to BL654 VDD and VDD_HV pins.
## _OR_
- **Option 2** – High voltage mode power supply mode (using BL654 VDD_HV pin) entered when the external supply voltage in ONLY connected to the VDD_HV pin and the VDD pin is not connected to any external voltage supply. Connect external supply within range 2.5V to 5.5V range to BL654 VDD_HV pin. BL654 VDD pin left unconnected.
For either option, if you use USB interface then the BL654 VBUS pin must be connected to external supply within the range 4.35V to 5.5V. When using the BL654 VBUS pin, you MUST externally fit a 4.7uF to ground.
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_**Table 4: Signal levels for interface, SIO**_
**==> picture [514 x 344] intentionally omitted <==**
**----- Start of picture text -----**<br>
|||||||||
|---|---|---|---|---|---|---|---|
|a|Parameter|ee|Min|Ge|Typ|Max|Unit|
|VIH Input high voltage|0.7 VDD|VDD|V|
|VIL Input low voltage|VSS|0.3 x VDD|V|
|VOH Output high voltage|
|(std. drive, 0.5mA) (Note 1)|VDD -0.4|VDD|V|
|(high-drive, 3mA) (Note 1)|VDD -0.4|VDD|V|
|(high-drive, 5mA) (Note 2)|VDD -0.4|VDD|
|VOL Output low voltage|
|(std. drive, 0.5mA) (Note 1)|VSS|VSS+0.4|V|
|(high-drive, 3mA) (Note 1)|VSS|VSS+0.4|V|
|(high-drive, 5mA) (Note 2)|VSS|VSS+0.4|
|VOL Current at VSS+0.4V, Output set low|
|(std. drive, 0.5mA) (Note 1)|1|2|4|mA|
|(high-drive, 3mA) (Note 1)|3|-|-|mA|
|(high-drive, 5mA) (Note 2)|6|10|15|mA|
|VOL Current at VDD -0.4, Output set low|
|(std. drive, 0.5mA) (Note 1)|1|2|4|mA|
|(high-drive, 3mA) (Note 1)|3|-|-|mA|
|(high-drive, 5mA) (Note 2)|6|9|14|mA|
|Pull up resistance|11|13|16|k|Ω|
|Pull down resistance|11|13|16|k|Ω|
|Pad capacitance|3|pF|
|Pad capacitance at NFC pads|4|pF|
**----- End of picture text -----**<br>
## **Signal Levels Notes:**
**Note 1** For VDD≥1.7V. The firmware supports high drive (3 mA, as well as standard drive).
**Note 2** For VDD≥2.7V. The firmware supports high drive (5 mA (since VDD≥2.7V), as well as standard drive).
The GPIO (SIO) high reference voltage always equals the level on the **VDD** pin.
▪ Normal voltage mode – The GPIO high level equals the voltage supplied to the VDD pin ▪ High voltage mode – The GPIO high level equals the level specified (configurable TBD).
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_**Table 5: SIO pin alternative function AIN (ADC) specification**_
|**Parameter**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|
|**Maximum sample rate**|||**200**|**kHz**|
|ADC Internal reference voltage|-1.5%|0.6 V|+1.5%|%|
|ADC pin input||4, 2, 1, 1/2,||scaling|
|internal selectable scaling||1/3, 1/4, 1/5|||
|||1/6|||
|ADC input pin (AIN) voltage maximum without|||||
|damaging ADC w.r.t1|||||
|VCC Prescaling|||||
|0V-VDD 4, 2, 1, ½, 1/3, ¼, 1/5, 1/6||VDD+0.3||V|
|Configurable|8-bit mode|10-bit mode|12-bit mode||
|Resolution||||bits|
|Configurable2|||||
|Acquisition Time, source resistance ≤10kΩ||3||uS|
|Acquisition Time, source resistance ≤40kΩ||5||uS|
|Acquisition Time, source resistance ≤100kΩ||10||uS|
|Acquisition Time, source resistance ≤200kΩ||15||uS|
|Acquisition Time, source resistance ≤400kΩ||20||uS|
|Acquisition Time, source resistance ≤800kΩ||40||uS|
|Conversion Time3||<2||uS|
|ADC input impedance (during operation)3|||||
|Input Resistance||>1||MOhm|
|Sample and hold capacitance at maximum gain||2.5||pF|
## **Recommended Operating Parameters Notes:**
- **Note 1** Stay within internal 0.6 V reference voltage with given pre-scaling on AIN pin and do not violate ADC maximum input voltage (for damage) for a given VCC, e.g. If VD is 3.6V, you can only expose AIN pin to VDD+0.3 V. Default pre-scaling is 1/6 which configurable via smartBASIC.
**Note 2** Firmware allows configurable resolution (8-bit, 10-bit or 12-bit mode) and acquisition time. The sampling frequency is limited by the sum of sampling time and acquisition time. The maximum sampling time is 2us. For acquisition time of 3us the total conversion time is therefore 5us, which makes maximum sampling frequency of 1/5us = 200kHz. Similarly, if acquisition time of 40us chosen, then the conversion time is 42us and the maximum sampling frequency is 1/42us = 23.8kHz
**Note 3** ADC input impedance is estimated mean impedance of the ADC (AIN) pins.
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## **3.4.1 BL654 Default Firmware**
The BL654 module comes loaded with _smart_ BASIC firmware but does not come loaded with any _smart_ BASIC application script (as that is dependent on customer-end application or use). Laird provides many sample _smart_ BASIC application scripts via a sample application folder on GitHub – https://github.com/LairdCP/BL654-Applications
Therefore, it boots into AT command mode by default.
Refer to the _smart_ BASIC extension manual for details of functionality connected to this:
- nAutoRUN pin (SIO_35), see Table 6 for default
- VSP pin (SIO_02), see Table 7 for default
- SIO_38 – Reserved for future use. Do not connect. See Table 8
## _**Table 6: nAutoRUN pin**_
~~**e**~~ **Signal Name** ~~e es~~ **Pin #** ~~es~~ **I/O** ~~e~~ **Comments** nAutoRUN /(SIO_35) 5 I Input with active low logic. Internal pull down (default).
I Input with active low logic. Internal pull down (default). Operating mode selected by nAutoRun pin status:
- Self-contained Run mode (nAutoRUN pin held at 0V). If Low (0V), runs $autorun$ if it exists
- Interactive/Development mode (nAutoRUN pin held at VCC).
- If High (VCC), runs via at+run (and file name of application)
In the development board nAutoRUN pin is connected so that the state is driven by the host’s DTR output line.
_**Table 7: VSP mode**_ **Signal Name Pin # I/O Comments** ~~a ee ee~~ SIO_02 50 I Internal pull down (default). VSP mode selected by externally pulling-up SIO_02 pin: **High (VCC),** then OTA _smart_ BASIC application download is possible. _**Table 8: SIO_38**_ ~~**e**~~ **Signal Name** ~~e~~ **Pin #** ~~ee~~ **I** ~~es~~ **/O** ~~e~~ **Comments** SIO_38 63 I Internal pull up (default). Reserved for future use. Do not connect.
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Data taken at VDD of 3.0 V with internal (to chipset) LDO ON or with internal (to chipset) DCDC ON (see Power Consumption Note 1) and 25 º C.
**==> picture [501 x 420] intentionally omitted <==**
**----- Start of picture text -----**<br>
||||||||
|---|---|---|---|---|---|---|
|Table 9: Power consumption|
|es|Parameter|es|Min|Typ|Max|Unit|
|Active mode ‘peak’ current|(Note 1)|With DCDC [with LDO]|
|(Advertising or Connection)|
|Tx only run peak current @ Txpwr = +8 dBm|14.1 [30.4]|mA|
|Tx only run peak current @ Txpwr = +4 dBm|9.3 [18.9]|mA|
|Tx only run peak current @ Txpwr = 0 dBm|4.9 [10.2]|mA|
|Tx only run peak current @ Txpwr = -4 dBm|3.4 [7.3]|mA|
|mA|
|Tx only run peak current @ Txpwr = -8 dBm|3.0 [6.4]|
|mA|
|Tx only run peak current @ Txpwr = -12 dBm|2.7 [5.7]|
|mA|
|Tx only run peak current @ Txpwr = -16 dBm|2.5 [5.3]|mA|
|Tx only run peak current @ Txpwr = -20 dBm|2.3 [5.0]|mA|
|Tx only run peak current @ Txpwr = -40 dBm|2.0 [4.0]|
|Active Mode|
|Rx only ‘peak’ current, BLE 1Mbps (Note 1)|4.8 [10.3]|mA|
|Rx only ‘peak’ current, BLE 2Mbps (Note 2)|5.4 [11.6]|
|Ultra-Low Power Mode 1|(Note 2)|
|TBD|uA|
|Standby Doze, 64k RAM retention|
|Ultra-Low Power Mode 2|(Note 3)|
|TBD|nA|
|Deep Sleep (no RAM retention)|
|Active Mode Average current|(Note 4)|
|Advertising Average|Current draw|
|Max|, with advertising interval (min) 20 mS|~TBD|uA|
|Min|, with advertising interval (max) 10240 mS|~TBD|uA|
|Connection|Average|Current draw|
|Max,|with connection interval (min) 7.5 mS|~TBD|uA|
|Min|, with connection interval (max) 4000 mS|~TBD|uA|
|Power Consumption Notes:|
**----- End of picture text -----**<br>
**Note 1** This is for Peak Radio Current only, but there is additional current due to the MCU. The internal DCDC convertor or LDO is decided by the underlying BLE stack.
**Note 2** BL654 modules Standby Doze is TBD uA typical. When using _smart_ BASIC firmware, Standby Doze is entered automatically (when a waitevent statement is encountered within a _smart_ BASIC application script). In Standby Doze, all peripherals
that are enabled stay on and may re-awaken the chip. Depending on active peripherals, current consumption ranges from TBD μA to TBD uA (when UART is ON). See individual peripherals current consumption data in the Peripheral Block Current Consumption section. smartBASIC
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## **Power Consumption Notes:**
firmware has added new functionality to detect GPIO change with no current consumption cost, it is possible to close the UART and get to the TBD uA current consumption regime and still be able to detect for incoming data and be woken up so that the UART can be re-opened at expense of losing that first character.
The BL654 Standby Doze current consists of the below nRF52840 blocks:
- nRF52 System ON IDLE current (no RAM retention) (0.7 uA) – This is the base current of the CPU
- LFRC (TBD uA) and RTC (TBDuA) running as well as 64k RAM retention (0.48 uA) – This adds to the total of TBD uA typical.
- **Note 3** In Deep Sleep, everything is disabled and the only wake-up sources (including NFC to wakeup) are reset and changes on SIO or NFC pins on which sense is enabled. The current consumption seen is ~TBD nA typical in BL654 modules.
- Coming out from Deep Sleep to Standby Doze through the reset vector.
- **Note 4** Data taken with a transmit power of 8 dBm and all peripherals off (UART OFF after radio event), slave latency of 0 (in a connection). Average current consumption depends on several factors (including Tx power, VCC, accuracy of 32MHz and 32.768 kHz). With these factors fixed, the largest variable is the advertising or connection interval set.
Advertising Interval range:
- 20 milliseconds to 10240 milliseconds in multiples of 0.625 milliseconds for the following Advert type: ADV_IND and ADV_DIRECT_IND
- For advertising timeout, if the advert type is ADV_DIRECT_IND, then the timeout is limited to 1.28 seconds (1280 milliseconds).
For an advertising event:
- The minimum average current consumption is when the advertising interval is large 10240 mS (although this may cause long discover times (for the advertising event) by scanners
- The maximum average current consumption is when the advertising interval is small 20 mS
Other factors that are also related to average current consumption include the advertising payload bytes in each advertising packet and whether it’s continuously advertising or periodically advertising.
## Connection Interval range:
- 7.5 milliseconds to 4000 milliseconds in multiples of 1.25 milliseconds.
## For a connection event:
- The minimum average current consumption is when the connection interval is large 4000 milliseconds
- The maximum average current consumption is with the shortest connection interval of 7.5 ms; no slave latency.
Other factors that are also related to average current consumption include:
- Whether transmitting six packets per connection interval with each packet containing 20 bytes (which is the maximum for each packet)
- An inaccurate 32.768 kHz master clock accuracy would increase the average current consumption.
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The values below are calculated for a typical operating voltage of 3V.
**==> picture [525 x 324] intentionally omitted <==**
**----- Start of picture text -----**<br>
||||||||
|---|---|---|---|---|---|---|
|Table 10: UART power consumption|
|es|Parameter|es|Min|Typ|Max|Unit|
|UART Run current @ 115200 bps|-|55|-|uA|
|UART Run current @ 1200 bps|-|55|-|uA|
|Idle current for UART (no activity)|-|1|-|uA|
|UART Baud rate|1.2|-|1000|kbps|
|Table 11: power consumption|
|a|Parameter|Min|Typ|Max|Unit|
|SPI Master Run current @ 2 Mbps|-|50|uA|
|SPI Master Run current @ 8 Mbps|-|50|uA|
|Idle current for SPI (no activity)|<1|uA|
|SPI bit rate|-|8|Mbps|
|Table 12: I2C power consumption|
|a|Parameter|Min|Typ|Max|Unit|
|I2C Run current @ 100 kbps|-|50|-|uA|
|I2C Run current @ 400 kbps|-|50|-|uA|
|I2C Bit rate|100|-|400|kbps|
|Table 13: ADC power consumption|
|a|Parameter|Min|Typ|Max|Unit|
|ADC current during conversion|-|700|-|uA|
**----- End of picture text -----**<br>
The above current consumption is for the given peripheral only and to operate that peripheral requires some other internal blocks which consume base current. This base current is consumed when the UART, SPI, I2C, or ADC is opened (operated).
For asynchronous interface like the UART (asynchronous as the other end can communicate at any time), the UART on the BL654 must be kept open (by a command in _smart_ BASIC application script), resulting in the base current consumption penalty.
For a synchronous interface like the I2C or SPI (since BL654 side is the master), the interface can be closed and opened (by a command in _smart_ BASIC application script) only when needed, resulting in current saving (no base current consumption penalty). There’s a similar argument for ADC (open ADC when needed).
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To provide the widest scope for integration, a variety of physical host interfaces/sensors are provided. The major BL654 series module functional blocks described below.
Power management features:
- System Standby Doze and Deep Sleep modes
- Open/Close peripherals (UART, SPI, I2C, SIO’s, ADC, NFC). Peripherals consume current when open; each peripheral can be individually closed to save power consumption
- Use of the internal DCDC convertor or LDO is decided by the underlying BLE stack
- _smart_ BASIC command allows the supply voltage to be read (through the internal ADC)
- Pin wake-up system from deep sleep (including from NFC pins)
Power supply features:
- Supervisor hardware to manage power during reset, brownout, or power fail.
- 1.7V to 3.6V supply range for normal power supply (VDD pin) using internal DCDC convertor or LDO decided by the underlying BLE stack.
- 2.5V to 5.5 supply range for High voltage power supply (VDD_HV pin) using internal DCDC convertor or LDO decided by the underlying BLE stack.
- 4.35V to 5.5V supply range for powering USB (VBUS pin) portion of BL654 only.
**Note:** The remainder of the BL654 module circuitry must still be powered through the VDD (or VDD_HV) pin.
The BL654 module power supply internally contains the following two main supply regulator stages (Figure 4):
- REG0 – Connected to the VDD_HV pin
- REG1 – Connected to the VDD pin
The USB power supply is separate (connected to the VBUS pin).
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_**Figure 4: BL654 power supply block diagram (adapted from the following resource: http://infocenter.nordicsemi.com/pdf/nRF52840_OPS_v0.5.1.pdf**_
The BL654 power supply system enters one of two supply voltage modes, normal or high voltage mode, depending on how the external supply voltage is connected to these pins.
BL654 power supply options:
- **Option 1 –** Normal voltage power supply mode entered when the external supply voltage is connected to both the VDD and VDD_HV pins (so that VDD equals VDD_HV). Connect external supply within range 1.7V to 3.6V range to BL654 VDD and VDD_HV pins.
## _OR_
- **Option 2 –** High voltage mode power supply mode (using BL654 VDD_HV pin) entered when the external supply voltage in ONLY connected to the VDD_HV pin and the VDD pin is not connected to any external voltage supply. Connect external supply within range 2.5V to 5.5V range to BL654 VDD_HV pin. BL654 VDD pin left unconnected.
For either option, if you use USB interface then the BL654 VBUS pin must be connected to external supply within the range 4.35V to 5.5V. When using the BL654 VBUS pin, you **MUST** externally fit a 4.7uF to ground.
Table 14 summarizes these power supply options.
_**Table 14: BL654 powering options**_
|**Power Supply Pins**<br>**and Operating**<br>**Voltage Range**|**OPTION1**<br>**Normal voltage**<br>**mode operation**<br>**connect?**||**OPTION2**<br>**High voltage mode**<br>**operation connect?**|**OPTION2**<br>**OPTION1 with USB**<br>**peripheral,**<br>**operation, and normal**<br>**voltage connect?**|**OPTION2 with USB**<br>**peripheral,**<br>**operation, and high**<br>**voltage connect?**|
|---|---|---|---|---|---|
|VDD (pin31)<br>1.7V to 3.6V|Yes<br>(Note 1)||No<br>(Note 2)|Yes|No<br>(Note 2)|
|VDD_HV (pin25)<br>2.5V to 5.5V|No||Yes|No|Yes<br>(Note 5)|
|VBUS (pin24)<br>4.35V to 5.5V|No||Note 3|Yes<br>(Note 4)|Yes<br>(Note 4)|
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## **Power Supply Option Notes:**
- **Note 1 Option 1 –** External supply voltage is connected to BOTH the VDD and VDD_HV pins (so that VDD equals VDD_HV). Connect external supply within range 1.7V to 3.6V range to BOTH BL654 VDD and VDD_HV pins.
- **Note 2 Option 2 –** External supply within range 2.5V to 5.5V range to the BL654 VDD_HV pin ONLY. BL654 VDD pin left unconnected.
In High voltage mode, the VDD pin becomes an output voltage pin. It can be used to supply external circuitry from the VDD pin. Before any current can be taken from the BL654 VDD pin, this feature must be enabled in the BL654. Additionally, the VDD output voltage is configurable from 1.8V to 3.3V with possible settings of 1.8V, 2.1V, 2.4V, 2.7V, 3.0V, and 3.3V. The default voltage is 1.8V.
The supported BL654 VDD pin output voltage range depends on the supply voltage provided on the BL654 VDD_HV pin. The minimum difference between voltage supplied on the VDD_HV pin and the voltage output on the VDD pin is 0.3 V. The maximum output voltage of the VDD pin is VDDH – 0.3V. Table4 shows the current that can be drawn by external circuitry from VDD pin in high voltage mode (supply on VDD_HV).
_**Table 15: Current that can be drawn by external circuitry from VDD pin in High voltage mode (supply on VDDH)**_
**==> picture [404 x 145] intentionally omitted <==**
**----- Start of picture text -----**<br>
||||||
|---|---|---|---|---|
|Parameter|Min|Typ|Max|Unit|
|Current that can be drawn by external circuitry from VDD pin in|1|mA|
|High voltage mode (supply on VDD_HV) with EXTSUPPLY enabled|
|in UICR during System OFF|
|Current that can be drawn by external circuitry from VDD pin in|25|mA|
|High voltage mode (supply on VDD_HV) with EXTSUPPLY enabled|
|in UICR during System ON|
|Current drawn from VDD pin in High voltage mode (supply on|50|mA|
|VDD_HV) of both external circuits and BL654|
|Minimum difference between voltage supplied on VDD_HV pin|0.3|V|
|and voltage on VDD pin|
**----- End of picture text -----**<br>
**Note 3** Depends on whether USB operation is required.
- **Note 4** When using the BL654 **VBUS** pin, you **must** externally fit a 4.7uF capacitor to ground.
**Note 5** To use the BL654 USB peripheral:
1. Connect the BL654 VBUS pin to the external supply within the range 4.35V to 5.5V. When using the BL654 VBUS pin, you **MUST** externally fit a 4.7uF to ground.
2. Connect the external supply to either the VDD (Option 1) or VDD_HV (Option 2) pin to operate the rest of BL654 module.
When using the BL654 USB peripheral, the VBUS pin can be supplied from same source as VDD_HV (within the operating voltage range of the VBUS pin and VDD_HV pin).
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The integrated high accuracy 32 MHz (±10 ppm) crystal oscillator helps with radio operation and reducing power consumption in the active modes.
The integrated on-chip 32.768 kHz RC oscillator (±250 ppm) provides protocol timing and helps with radio power consumption in the system StandByDoze and Deep Sleep modes by reducing the time that the RX window needs to be open.
To keep the on-chip 32.768 kHz RC oscillator within ±250 ppm (which is needed to run the BLE stack) accuracy, RC oscillator needs to be calibrated (which takes 16-17 mS) regularly. The default calibration interval is eight seconds which is enough to keep within ±250 ppm. The calibration interval ranges from 0.25 seconds to 31.75 seconds (in multiples of 0.25 seconds) and configurable via firmware
## 5.3.2 Timers
When using _smart_ BASIC, the timer subsystem enables applications to be written which allow future events to be generated based on timeouts.
- **Regular Timer** – There are eight built-in timers (regular timers) derived from a single RTC clock which are controlled solely by _smart_ BASIC functions. The resolution of the regular timer is 976 microseconds.
- **Tick Timer –** A 31-bit free running counter that increments every (1) millisecond. The resolution of this counter is 488 microseconds.
Refer to the _**smart**_ **BASIC User Guide** available from the Laird BL654 product page. For timer utilization when using the Nordic SDK, refer to http://infocenter.nordicsemi.com/index.jsp.
- 2402–2480 MHz Bluetooth Low Energy radio BT5.0 – 1 Mbps, 2 Mbps, and Long-range (125 kbps and 500 kbps TBD) over-the-air data rate.
- Tx output power of +8 dBm programmable to -20 dBm in steps of 4 dB and further TX power level of -40 dBm.
- Receiver (with integrated channel filters) to achieve maximum sensitivity -95 dBm @ 1 Mbps BLE, -92 dBm @2 Mbps, - 103 dBm @ 125 kbps long-range and TBD @500kbps long-range).
- RF conducted interface available in the following two ways:
-
-
- Antenna options:
-
-
- Received Signal Strength Indicator (RSSI)
- RSSI accuracy (valid range -90 to -20dBm) is -2dB typical
- RSSI resolution 1dB typical
NFC support:
- Based on the NFC forum specification
-
-
-
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- Modes of operation:
- – –
- Touch-to Pair with NFC
- Launch a smartphone app (on Android)
- NFC enabled Out-of-Band Pairing
- System Wake-On-Field function
-
_**Table 16: NFC interface**_
|**Signal Name**|**Pin No**|**I/O **|**Comments**|
|---|---|---|---|
|NFC1/SIO_09|59|I/O|The NFC pins are by default NFC pins and an alternate function on each pin|
|NFC2/SIO_10|57|I/O|is GPIO. Refer to the_smart_BASIC. User manual.|
## 5.5.2 NFC Antenna Coil Tuning Capacitors
From Nordic’s nRF52840 Objective Product Specification v0.5.1
The NFC antenna coil must be the connected differential between the NFC1 and NFC2 pins of the BL654. Two external capacitors should be used to tune the resonance of the antenna circuit to 13.56 MHz (Figure 5).
_**Figure 5: NFC antenna coil tuning capacitors**_
The required external tuning capacitor value is given by the following equations:
An antenna inductance of Lant = 0.72 uH provides tuning capacitors in the range of 300 pF on each pin. The total capacitance on NFC1 and NFC2 must be matched. Cint and Cp are small usually (Cint is 4pF), so can omit from calculation.
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## 5.5.3 Battery Protection
From Nordic’s nRF52840 Objective Product Specification v0.5.1
If the NFC coil antenna is exposed to a strong NFC field, the supply current may flow in the opposite direction due to parasitic diodes and ESD structures.
If the used battery does not tolerate a return current, a series diode must be placed between the battery and the BL654 to protect the battery.
**Note:** The BL654 has two UARTs.
The Universal Asynchronous Receiver/Transmitter (UART) offers fast, full-duplex, asynchronous serial communication with built-in flow control support (UART_CTS, UART_RTS) in HW up to one Mbps baud. Parity checking and generation for the ninth data bit are supported.
UART_TX, UART_RX, UART_RTS, and UART_CTS form a conventional asynchronous serial data port with handshaking. The interface is designed to operate correctly when connected to other UART devices such as the 16550A. The signaling levels are nominal 0 V and 3.3 V (tracks VDD) and are inverted with respect to the signaling on an RS232 cable.
Two-way hardware flow control is implemented by UART_RTS and UART_CTS. UART_RTS is an output and UART_CTS is an input. Both are active low.
These signals operate according to normal industry convention. UART_RX, UART_TX, UART_CTS, UART_RTS are all 3.3 V level logic (tracks VDD). For example, when RX and TX are idle they sit at 3.3 V. Conversely for handshaking pins CTS, RTS at 0 V is treated as an assertion.
The module communicates with the customer application using the following signals:
- Port/TxD of the application sends data to the module’s UART_RX signal line
- Port/RxD of the application receives data from the module’s UART_TX signal line
**==> picture [26 x 7] intentionally omitted <==**
**----- Start of picture text -----**<br>
BL654<br>**----- End of picture text -----**<br>
_**Figure 6: UART signals**_
**Note:** The BL654 serial module output is at 3.3V CMOS logic levels (tracks VDD). Level conversion must be added to interface with an RS-232 level compliant interface.
Some serial implementations link CTS and RTS to remove the need for handshaking. We do not recommend linking CTS and RTS other than for testing and prototyping. If these pins are linked and the host sends data at the point that the BL654 deasserts its RTS signal, there is significant risk that internal receive buffers will overflow, which could lead to an internal processor crash. This will drop the connection and may require a power cycle to reset the module. We recommend that the correct CTS/RTS handshaking protocol be adhered to for proper operation.
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|**_Table 17: UART interface_**|**_Table 17: UART interface_**|||||
|---|---|---|---|---|---|
|**Signal Name**<br>**Pin No**<br>**I/O **<br>**Comments**<br>SIO_06 / UART_Tx<br>35<br>O<br>SIO_06 (alternative function UART_Tx) is an output, set high<br>(in firmware).<br>~~es Ree Re~~<br>~~Re~~||||||
||SIO_08 / UART_Rx|29|I|SIO_08 (alternative function UART_Rx) is an input, set with internal<br>pull-up (in firmware).|SIO_08 (alternative function UART_Rx) is an input, set with internal|
||SIO_05 / UART_RTS|39|O|SIO_05 (alternative function UART_RTS) is an output, set low<br>(in firmware).|SIO_05 (alternative function UART_RTS) is an output, set low|
||SIO_07 / UART_CTS|37|I|SIO_07 (alternative function UART_CTS) is an input, set with internal<br>pull-down (in firmware).|SIO_07 (alternative function UART_CTS) is an input, set with internal|
The UART interface is also used to load customer developed _smart_ BASIC application script.
The BL654 has two UARTs.
BL654 has USB2.0 FS (Full Speed, 12Mbps) hardware capability. There is a CDC driver/Virtual UART (baud rate TBD) as well as other USB drivers available via Nordic SDK – such as: usb_audio, usb_hid, usb_generic, usb_msc (mass storage device).
|**_Table 18: USB interface_**<br>**Signal Name**<br>**Pin No**<br>D-<br>17<br>~~ee~~|**_Table 18: USB interface_**<br>**Signal Name**<br>**Pin No**<br>D-<br>17<br>~~ee~~|**_Table 18: USB interface_**<br>**Signal Name**<br>**Pin No**<br>D-<br>17<br>~~ee~~|**I/O **<br>I/O|**Comments**|
|---|---|---|---|---|
||D+|15|I/O||
||VBUS|24||When using the BL654 VBUS pin (which is mandatory when USB interface is used),<br>Customer MUST connect externally a 4.7uF capacitor to ground.<br>**_Note:_**_You MUST power the rest of BL654 module circuitry through the VDD pin_<br>_(OPTION1) or VDD_HV pin (OPTION2)._|
The SPI interface is an alternate function on SIO pins.
The module is a master device that uses terminals SPI_MOSI, SPI_MISO, and SPI_CLK. SPI_CS is implemented using any spare SIO digital output pins to allow for multi-dropping.
The SPI interface enables full duplex synchronous communication between devices. It supports a 3-wire (SPI_MOSI, SPI_MISO, SPI_SCK,) bidirectional bus with fast data transfers to and from multiple slaves. Individual chip select signals are necessary for each of the slave devices attached to a bus, but control of these is left to the application through use of SIO signals. I/O data is double-buffered.
The SPI peripheral supports SPI mode 0, 1, 2, and 3.
|The SPI peripheral supports SPI mode 0, 1, 2, and 3.|The SPI peripheral supports SPI mode 0, 1, 2, and 3.|The SPI peripheral supports SPI mode 0, 1, 2, and 3.|The SPI peripheral supports SPI mode 0, 1, 2, and 3.|The SPI peripheral supports SPI mode 0, 1, 2, and 3.|The SPI peripheral supports SPI mode 0, 1, 2, and 3.|
|---|---|---|---|---|---|
|**_Table 19: SPI interfaces_**<br>**Signal Name**<br>**Pin No**<br>**I/O **<br>**Comments**<br>~~a~~<br>~~Rs Gs~~<br>~~ee~~||||||
|||SIO_45/SPI_MOSI|56|O|This interface is an alternate function configurable by|
|||SIO_46/SPI_MISO|51|I|_smart_BASIC. Default in the FW pin 56 and 53 are SIO inputs. SPIOPEN() in<br>_smart_BASIC selects SPI function and changes pin 56 and 53 to outputs (when in|
|||SIO_47/SPI_CLK|53|O|SPI master mode).|
|||Any_SIO/SPI_CS|54|I|SPI_CS is implemented using any spare SIO digital output pins to allow for multi-<br>dropping. On Laird devboard SIO_44 (pin54) used as SPI_CS.|
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The I2C interface is an alternate function on SIO pins.
The two-wire interface can interface a bi-directional wired-OR bus with two lines (SCL, SDA) and has master /slave topology. The interface is capable of clock stretching. Data rates of 100 kbps and 400 kbps are supported.
An I2C interface allows multiple masters and slaves to communicate over a shared wired-OR type bus consisting of two lines which normally sit at VDD. The SCL is the clock line which is always sourced by the master and SDA is a bi-directional data line which can be driven by any device on the bus.
**IMPORTANT:** It is essential to remember that pull-up resistors on both SCL and SDA lines are not provided in the module and MUST be provided external to the module. _**Table 20: I2C interface**_ **Signal Name Pin No I/O Comments** ~~ee Re ee~~ SIO_26/I2C_SDA 36 I/O This interface is an alternate function on each pin, configurable by SIO_27/I2C_SCL 38 I/O _smart_ BASIC. I2COPEN() in _smart_ BASIC selects I2C function.
## 5.10 General Purpose I/O, ADC, PWM. and FREQ
## 5.10.1 GPIO
The 19 SIO pins are configurable by _smart_ BASIC application script or Nordic SDK. They can be accessed individually. Each has the following user configured features:
- Input/output direction
- Output drive strength (standard drive 0.5 mA or high drive 5mA)
- Internal pull-up and pull-down resistors (13 K typical) or no pull-up/down or input buffer disconnect
- Wake-up from high or low-level triggers on all pins including NFC pins
## 5.10.2ADC
The ADC is an alternate function on SIO pins, configurable by _smart_ BASIC or Nordic SDK.
The BL654 provides access to 8-channel 8/10/12-bit successive approximation ADC in one-shot mode. This enables sampling up to 8 external signals through a front-end MUX. The ADC has configurable input and reference pre-scaling and sample resolution (8, 10, and 12 bit).
## 5.10.2.1 Analog Interface (ADC)
_**Table 21: Analog interface**_
|**_Table 21: Analog interface_**<br>**Signal Name**<br>**Pin No**<br>**I/O **<br>**Comments**<br>~~es~~<br>~~Gs~~<br>~~ee~~|**_Table 21: Analog interface_**<br>**Signal Name**<br>**Pin No**<br>**I/O **<br>**Comments**<br>~~es~~<br>~~Gs~~<br>~~ee~~|**_Table 21: Analog interface_**<br>**Signal Name**<br>**Pin No**<br>**I/O **<br>**Comments**<br>~~es~~<br>~~Gs~~<br>~~ee~~|**_Table 21: Analog interface_**<br>**Signal Name**<br>**Pin No**<br>**I/O **<br>**Comments**<br>~~es~~<br>~~Gs~~<br>~~ee~~|**_Table 21: Analog interface_**<br>**Signal Name**<br>**Pin No**<br>**I/O **<br>**Comments**<br>~~es~~<br>~~Gs~~<br>~~ee~~|
|---|---|---|---|---|
||SIO_05/UART_RTS/AIN3 – Analog Input|39|I|This interface is an alternate function on each pin,|
||SIO_04/AIN2 – Analog Input|34|I|configurable by_smart_BASIC. AIN configuration|
||SIO_03/AIN1 – Analog Input<br>SIO_02/AIN0 – Analog Input<br>SIO_31/AIN7 – Analog Input|49<br>50<br>44|I<br>I<br>I|selected using GpioSetFunc() function. <br>Configurable 8, 10, 12-bit resolution.<br>Configurable voltage scaling 4, 2, 1/1, 1/3, 1/3, 1/4,<br>1/5, 1/6(default).|
||SIO_30/AIN6 – Analog Input|45|I|Configurable acquisition time 3uS, 5uS, 10uS(default),|
||SIO_29/AIN5 – Analog Input|48|I|15uS, 20uS, 40uS.|
||SIO_28/AIN4 – Analog Input|46|I|Full scale input range (VDD)|
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## 5.10.5PWM Signal Output on up to 16 SIO Pins
The PWM output is an alternate function on ALL (GPIO) SIO pins, configurable by _smart_ BASIC or the Nordic SDK.
The **PWM output** signal has a frequency and duty cycle property. Frequency is adjustable (up to 1 MHz) and the duty cycle can be set over a range from 0% to 100%.
PWM output signal has a frequency and duty cycle property. PWM output is generated using dedicated hardware in the chipset. There is a trade-off between PWM output frequency and resolution.
For example:
- PWM output frequency of 500 kHz (2 uS) results in resolution of 1:2.
- PWM output frequency of 100 kHz (10 uS) results in resolution of 1:10.
- PWM output frequency of 10 kHz (100 uS) results in resolution of 1:100.
- PWM output frequency of 1 kHz (1000 uS) results in resolution of 1:1000.
The FREQ output is an alternate function on 16 (GPIO) SIO pins, configurable by _smart_ BASIC or Nordic SDK.
**Note:** The frequency driving each of the 16 SIO pins is the same but the duty cycle can be independently set for each pin.
**FREQ output** signal frequency can be set over a range of 0Hz to 4 MHz (with 50% mark-space ratio).
_**Table 22: nRESET pin**_ ~~**e**~~ **Signal Name** ~~s Rs~~ **Pin No** ~~es~~ **I/O** ~~e~~ **Comments**
BL654 HW reset (active low). Pull the nRESET pin low for minimum 100mS nRESET 19 I for the BL654 to reset.
The BL654 Firmware hex file consists of four elements:
- _smart_ BASIC runtime engine
- Nordic Softdevice
- Master Bootloader
Laird BL654 _smart_ BASIC firmware (FW) image part numbers are referenced as w.x.y.z (ex. v29.x.y.z). The BL654 _smart_ BASIC runtime engine and Softdevice combined image can be upgraded by the customer over the UART interface.
You also have the option to use the two-wire (JTAG) interface, during production, to clone the file system of a Golden preconfigured BL654 to others using the Flash Cloning process. This is described in the following application note _Flash Cloning for the BL654_ . In this case the file system is also part of the .hex file.
|**Signal Name**|**Pin No**|**I/O **||**Comments**|
|---|---|---|---|---|
|SWDIO|1|I/O|Internalpull-upresistor||
|SWDCLK|3|I|Internalpull-down resistor||
The Laird development board incorporates an on-board JTAG J-link programmer for this purpose. There is also the following JTAG connector which allows on-board JTAG J-link programmer signals to be routed off the development board. The only requirement is that you should use the following JTAG connector on the host PCB.
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The JTAG connector MPN is as follows: ~~egMe~~ **Reference** ~~ee~~ **Part Description and MPN (Manufacturers Part Number)** JP1 FTSH-105 Header, 1.27mm, SMD, 10-way, FTSH-105-01-L-DV Samtech
**==> picture [502 x 129] intentionally omitted <==**
**----- Start of picture text -----**<br>
Note: Reference on the BL654 development board schematic (Figure 7) shows the DVK development schematic wiring<br>only for the JTAG connector and the BL654 module JTAG pins.<br>VDD_VSRC_nRF<br>T<br>JP1<br>1 2 SWDIO_EXT<br>3 4 SWDCLK_EXT<br>5 6 SWO_EXT<br>7 8<br>9 1 0 nRESET_EXT<br>PIN HEADER,1.27mm 2X5P<br>GND<br>**----- End of picture text -----**<br>
## _**Figure 7: BL654 development board schematic**_
**Note:** The BL654 development board allows Laird on-board JTAG J-link programmer signals to be routed off the development board by from connector JP1
JTAG is require because Nordic SDK applications can only be loaded using the JTAG ( _smart_ BASIC firmware can be loaded using JTAG as well as over the UART). We recommend that you use JTAG (2-wire interface) to handle future BL654 module firmware upgrades. You **must** wire out the JTAG (2-wire interface) on your host design (see Figure 7, where the following four lines should be wired out – SWDIO, SWDCLK, GND and VCC). _smart_ BASIC firmware upgrades can still be performed over the BL654 UART interface, but this is slower than using the BL654 JTAG (2-wire interface) – (60 seconds using UART vs. 10 seconds when using JTAG).
SWO (SIO_32) is a Trace output (called SWO, Serial Wire Output) and is not necessary for programming BL654 over the SWD interface.
nRESET_BLE is not necessary for programming BL654 over the SWD interface.
## 5.135 BL654 Wakeup
## 5.13.1 Waking. Up BL654 from Host
Wake the BL654 from the host using wake-up pins (any SIO pin). You may configure the BL654’s wakeup pins via _smart_ BASIC to do any of the following:
- Wake up when signal is low
- Wake up when signal is high
- Wake up when signal changes
Refer to the _smart_ BASIC user guide for details. You can access this guide from the Laird BL654 product page.
For BL654 wake-up using the Nordic SDK, refer to Nordic infocenter.nordicsemi.com.
## 5.14 Low Power Modes
The BL654 has three power modes: Run, Standby Doze, and Deep Sleep.
The module is placed automatically in Standby Doze if there are no pending events (when WAITEVENT statement is encountered within a customer’s _smart_ BASIC script). The module wakes from Standby Doze via any interrupt (such as a
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received character on the UART Rx line). If the module receives a UART character from either the external UART or the radio, it wakes up.
Deep sleep is the lowest power mode. Once awakened, the system goes through a system reset.
For different Nordic power modes using the Nordic SDK, refer to Nordic infocenter.nordicsemi.com.
## 5.15 Temperature Sensor
The on-silicon temperature sensor has a temperature range greater than or equal to the operating temperature of the device. Resolution is 0.25°C degrees. The on-silicon temperature sensor accuracy is ±5°C.
To read temperature from on-silicon temperature sensor (in tenth of centigrade, so 23.4°C is output as 234) using _smart_ BASIC:
- In command mode, use **ATI2024**
- or
- From running a _smart_ BASIC application script, use **SYSINFO(2024)**
## 5.16 Security/Privacy
## 5.16.1 Random Number Generator
Exposed via an API in _smart_ BASIC (see _smart_ BASIC documentation available from the BL654 product page). The **rand()** function from a running _smart_ BASIC application returns a value.
For Nordic related functionality, visit Nordic infocenter.nordicsemi.com
## 5.16.2 AES Encryption/Decryption
Exposed via an API in _smart_ BASIC (see _smart_ BASIC documentation available from the BL654 product page). Function called **aesencrypt** and **aesdecrypt** .
For Nordic related functionality, visit Nordic infocenter.nordicsemi.com
ARM Cryptocell incorporates a true random generator (TRNG) and support for a wide range of asymmetric, symmetric and hashing cryptographic services for secure applications. For more information, please check the Nordic SDK.
## 5.16.4Readback Protection
The BL654 supports readback protection capability that disallows the reading of the memory on the nrf52840 using a JTAG interface. Available via _smart_ BASIC or the Nordic SDK.
## 5.16.5 Elliptic Curve Cryptography
The BL654 offers a range of functions for generating public/private keypair, calculating a shared secret, as well as generating an authenticated hash. Available via _smart_ BASIC or the Nordic SDK.
## 5.17 Optional External 32.768 kHz crystal
This is not required for normal BL654 module operation.
The BL654 uses the on-chip 32.76 kHz RC oscillator (LFCLK) by default (which has an accuracy of ±250 ppm) which requires regulator calibration (every eight seconds) to within ±250 ppm.
You can connect an optional external high accuracy (±20 ppm) 32.768 kHz crystal (and associated load capacitors) to the BL654SIO_01/XL2 (pin 41) and SIO_00/XL1 (pin 42) to provide improved protocol timing and to help with radio power
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consumption in the system standby doze/deep sleep modes by reducing the time that the RX window needs to be open. Table 23 compares the current consumption difference between RC and crystal oscillator.
_**Table 23: Comparing current consumption difference between BL654 on-chip RC 32.76 kHz oscillator and optional external crystal (32.768kHz) based oscillator**_
**==> picture [505 x 576] intentionally omitted <==**
**----- Start of picture text -----**<br>
||||||
|---|---|---|---|---|
|BL654 On-chip 32.768 kHz RC Oscillator|Optional External Higher Accuracy (±20|
|(±250 ppm) LFRC|ppm) 32.768 kHz Crystal-based Oscillator XO|
|Current Consumption of|
|TBD uA|TBD uA|
|32.768 kHz Block|
|Standby Doze Current|TBD uA|TBD uA|
|Calibration required regularly (default eight|
|seconds interval).|
|Calibration takes 16-17 ms; with DCDC used,|
|the total charge of a calibration event is TBD|
|uC.|
|The average current consumed by the|
|calibration depends on the calibration|
|interval and can be calculated using the|
|following formula:|
|CAL_charge/CAL_interval –|The lowest|
|calibration interval (0.25 seconds) provides an|
|Calibration|Not applicable|
|average current of (DCDC enabled):|
|TBDuC/0.25s = TBDuA|
|To get the 250-ppm accuracy, the BLE stack|
|specification states that a calibration interval|
|of eight seconds is enough. This gives an|
|average current of:|
|TBDuC/8s = TBD uA|
|Added to the LFRC run current and Standby|
|Doze (IDLE) base current shown above results|
|in a total average current of:|
|LFRC + CAL = TBD + TBD = TBDuA|
|Total|TBD uA|TBD uA|
|▪|Lowest current consumption|
|▪|Low current consumption|▪|Needs external crystal|
|Summary|
|▪|Accuracy 250 ppm|▪|High accuracy (depends on the crystal,|
|usually 20 ppm)|
|Table 24: Optional external 32.768 kHz crystal specification|
|CQ|Optional external 32.768kHz crystal|Min|Typ|Max|
|Crystal Frequency|-|32.768 kHz|-|
|Frequency tolerance requirement of BLE stack|-|-|±250 ppm|
|Load Capacitance|-|-|12.5 pF|
|Shunt Capacitance|-|-|2 pF|
|Equivalent series resistance|-|-|100 kOhm|
|Drive level|-|-|1 uW|
**----- End of picture text -----**<br>
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|**Optional external 32.768kHz crystal**<br>**Min**<br>**Typ**<br>**Max**<br>~~rs~~|**Optional external 32.768kHz crystal**<br>**Min**<br>**Typ**<br>**Max**<br>~~rs~~|**Optional external 32.768kHz crystal**<br>**Min**<br>**Typ**<br>**Max**<br>~~rs~~|**Optional external 32.768kHz crystal**<br>**Min**<br>**Typ**<br>**Max**<br>~~rs~~|**Optional external 32.768kHz crystal**<br>**Min**<br>**Typ**<br>**Max**<br>~~rs~~|
|---|---|---|---|---|
||Input capacitance on XL1 and XL2 pads|-|4 pF|-|
||Run current for 32.768 kHz crystal based oscillator|-|0.25 uA|-|
||Start-up time for 32.768 kHz crystal based oscillator|-|0.25 seconds|-|
||Peak to peak amplitude for external low swing clock input signal<br>must not be outside supply rails|200 mV|-|1000 mV|
Be sure to tune the load capacitors on the board design to optimize frequency accuracy (at room temperature) so it matches that of the same crystal standalone, Drive Level (so crystal operated within safe limits) and oscillation margin (Rneg is at least 3 to 5 times ESR) over the operating temperature range.
## 5.18 451-O0001 On-board PCB Antenna Characteristics
The 451-00001 on-board PCB trace monopole antenna radiated performance depends on the host PCB layout.
The BL654 development board was used for BL654 development and the 451-00001 PCB antenna performance evaluation. To obtain similar performance, follow guidelines in section _PCB Layout on Host PCB for the 451-00001_ to allow the on-board antenna to radiate and reduce proximity effects due to nearby host PCB GND copper or metal covers.
|**Unit in dBi @2.44GHz**<br>~~Po~~|**XY-plane**|**XY-plane**|**XZ-plane**|**XZ-plane**|**YZ-plane**|**YZ-plane**|**Efficiency**|
|---|---|---|---|---|---|---|---|
||**Peak**|**Avg**|**Peak**|**Avg**|**Peak**|**Avg**||
|PCB trace antenna<br>~~Po~~|TBD|TBD|TBD|TBD|TBD|TBD||
The BL654 is easy to integrate, requiring no external components on your board apart from those which you require for development and in your end application.
The following are suggestions for your design for the best performance and functionality.
## **Checklist (for Schematic):**
- BL654 power supply options:
## _OR_
OPTION2. High voltage mode power supply mode (using BL654 VDDH pin) entered when the external supply voltage in ONLY connected to the VDDH pin and the VDD pin is not connected to any external voltage supply. Connect external supply within range 2.5V to 5.5V range to BL654 VDDH pin. BL654 VDD pin left unconnected.
External power source should be within the operating range, rise time and noise/ripple specification of the BL654. Add decoupling capacitors for filtering the external source. Power-on reset circuitry within BL654 series module incorporates
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brown-out detector, thus simplifying your power supply design. Upon application of power, the internal power-on reset ensures that the module starts correctly.
- **VDD and coin-cell operation**
- With a built-in DCDC (operating range 1.7V to 3.6V), that reduces the peak current required from a coin-cell, making it easier to use with a coin-cell.
- **AIN (ADC) and SIO pin IO voltage levels**
- BL654 SIO voltage levels are at VDD. Ensure input voltage levels into SIO pins are at VDD also (if VDD source is a battery whose voltage will drop). Ensure ADC pin maximum input voltage for damage is not violated.
## ▪ **AIN (ADC) impedance and external voltage divider setup**
If you need to measure with ADC a voltage higher than 3.6V, you can connect a high impedance voltage divider to lower the voltage to the ADC input pin.
- **JTAG**
This is REQUIRED as Nordic SDK applications can only be loaded using the JTAG ( _smart_ BASIC firmware can be loaded using the JTAG as well as the UART).
Laird recommends you use JTAG (2-wire interface) to handle future BL654 module firmware upgrades. You MUST wire out the JTAG (2-wire interface) on your host design (see Figure 7, where four lines should be wired out, namely SWDIO, SWDCLK, GND and VCC). Firmware upgrades can still be performed over the BL654 UART interface, but this is slower (60 seconds using UART vs. 10 seconds when using JTAG) than using the BL654 JTAG (2-wire interface). JTAG may be used if you intend to use Flash Cloning during production to load _smart_ BASIC scripts.
- **UART**
Required for loading your _smart_ BASIC application script during development (or for subsequent firmware upgrades (except JTAG for FW upgrades and/or Flash Cloning of the _smart_ BASIC application script). Add connector to allow interfacing with UART via PC (UART–RS232 or UART-USB).
- **UART_RX and UART_CTS**
SIO_08 (alternative function UART_RX) is an input, set with internal weak pull-up (in firmware). The pull-up prevents the module from going into deep sleep when UART_RX line is idling.
SIO_07 (alternative function UART_CTS) is an input, set with internal weak pull-down (in firmware). This pull-down ensures the default state of the UART_CTS will be asserted which means can send data out of the UART_TX line. Laird recommends that UART_CTS be connected.
- **nAutoRUN pin and operating mode selection**
nAutoRUN pin needs to be externally held high or low to select between the two BL654 operating modes at power-up:
-
-
- **I2C**
It is essential to remember that pull-up resistors on both I2C_SCL and I2C_SDA lines are not provided in the BL654 module and MUST be provided external to the module as per I2C standard.
## ▪ **SPI**
Implement SPI chip select using any unused SIO pin within your _smart_ BASIC application script or Nordic application then SPI_CS is controlled from the software application allowing multi-dropping.
- **SIO pin direction**
- BL654 modules shipped from production with _smart_ BASIC FW, all SIO pins (with default function of DIO) are mostly digital inputs (see Pin Definitions Table2). Remember to change the direction SIO pin (in your _smart_ BASIC application script) if that particular pin is wired to a device that expects to be driven by the BL654 SIO pin configured as an output. Also, these SIO pins have the internal pull-up or pull-down resistor-enabled by default in firmware (see Pin Definitions Table 2). This was done to avoid floating inputs, which can cause current consumption in low power modes (e.g. StandbyDoze) to drift with time. You can disable the PULL-UP or Pull-down through their _smart_ BASIC application.
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**Note:** Internal pull-up, pull down will take current from VDD.
- **SIO_02 pin** and OTA _smart_ BASIC application download feature
SIO_02 is an input, set with internal pull-down (in FW). Refer to latest firmware release documentation on how SIO_02 is used for Over the Air _smart_ BASIC application download feature. The SIO_02 pin must be pulled high externally to enable the feature. Decide if this feature is required in production. When SIO_02 is high, ensure nAutoRun is NOT high at same time; otherwise you cannot load the _smart_ BASIC application script.
- **NFC antenna connector**
To make use of the Laird flexi-PCB NFC antenna, fit connector:
Description: FFC/FPC Connector, Right Angle, SMD/90d, Dual Contact,1.2 mm Mated Height Manufacturer: Molex
Manufacturers Part number: 512810594
Add tuning capacitors of 300 pF on NFC1 pin to GND and 300 pF on NFC2 pins to GND if the PCB track length is similar as development board.
- **nRESET pin (active low)**
Hardware reset. Wire out to push button or drive by host.
By default module is out of reset when power applied to VCC pins.
- **Optional External 32.768kHz crystal**
If the optional external 32.768kHz crystal is needed then use a crystal that meets specification and add load capacitors whose values should be tuned to meet all specification for frequency and oscillation margin.
- **SIO_38 special function pin**
This is for future use by Laird. It is currently a Do Not Connect pin.
## **Checklist (for PCB):**
- MUST locate BL654 module close to the edge of PCB (mandatory for the 451-00001 for on-board PCB trace antenna to radiate properly).
- Use solid GND plane on inner layer (for best EMC and RF performance).
- All module GND pins MUST be connected to host PCB GND.
- Place GND vias close to module GND pads as possible.
- Unused PCB area on surface layer can flooded with copper but place GND vias regularly to connect the copper flood to the inner GND plane. If GND flood copper is on the bottom of the module, then connect it with GND vias to the inner GND plane.
- Route traces to avoid noise being picked up on VDD, VDDH, VBUS supply and AIN (analogue) and SIO (digital) traces.
- Ensure no exposed copper is on the underside of the module (refer to land pattern of BL654 development board).
The 451-00001 has an integrated PCB trace antenna and its performance is sensitive to host PCB. It is critical to locate the 451-00001 on the edge of the host PCB (or corner) to allow the antenna to radiate properly. Refer to guidelines in section _**PCB land pattern and antenna keep-out area for the 451-00001**_ . Some of those guidelines repeated below.
- Ensure there is no copper in the antenna keep-out area on any layers of the host PCB. Keep all mounting hardware and metal clear of the area to allow proper antenna radiation.
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- For best antenna performance, place the 451-00001 module on the edge of the host PCB, preferably in the corner with the antenna facing the corner.
- The BL654 development board has the 451-00001 module on the edge of the board (not in the corner). The antenna keep-out area is defined by the BL654 development board which was used for module development and antenna performance evaluation is shown in Figure 8, where the antenna keep-out area is ~TBD mm wide, TBD mm long; with PCB dielectric (no copper) height 0.85 mm sitting under the 451-00001 PCB trace antenna.
- The 451-00001 PCB trace antenna is tuned when the 451-00001 is sitting on development board (host PCB) with size of 125 mm x 85 mm.
- A different host PCB thickness dielectric will have small effect on antenna.
- The antenna-keep-out defined in the Host PCB Land Pattern and Antenna Keep-out for the 451-00001 section.
- Host PCB land pattern and antenna keep-out for the BL654 applies when the 451-00001 is placed in the corner of the host PCB. When the 451-00001 cannot be placed as such, it must be placed on the edge of the host PCB and the antenna keep out must be observed. Figure 8 shows an example.
**==> picture [23 x 215] intentionally omitted <==**
**----- Start of picture text -----**<br>
Antenna Keep-out<br>**----- End of picture text -----**<br>
_**Figure 8: PCB trace Antenna keep-out area (shown in red), corner of the BL654 development board for the 451-00001 module.**_
## **Antenna Keep-out Notes:**
**Note 1** The BL654 module is placed on the edge of the host PCB.
- **Note 2** Copper cut-away on all layers in the _Antenna Keep-out_ area under the 451-00001 on host PCB.
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## 6.3.2 Antenna Keep-out and Proximity to Metal or Plastic
## **Checklist (for metal /plastic enclosure):**
- Minimum safe distance for metals without seriously compromising the antenna (tuning) is 40 mm top/bottom and 30 mm left or right.
- Metal close to the 451-00001 PCB trace monopole antenna (bottom, top, left, right, any direction) will have degradation on the antenna performance. The amount of that degradation is entirely system dependent, meaning you will need to perform some testing with your host application.
- Any metal closer than 20 mm will begin to significantly degrade performance (S11, gain, radiation efficiency).
- It is best that you test the range with a mock-up (or actual prototype) of the product to assess effects of enclosure height (and materials, whether metal or plastic).
Please refer to the regulatory sections for FCC, IC, CE, and Japan for details of use of BL654-with external antennas in each regulatory region.
The BL654 family has been designed to operate with the below external antennas (with a maximum gain of 2.0 dBi). The required antenna impedance is 50 ohms. See Table 25. External antennas improve radiation efficiency.
_**Table 25: External antennas for the BL654**_
**==> picture [497 x 169] intentionally omitted <==**
**----- Start of picture text -----**<br>
||||||||
|---|---|---|---|---|---|---|
|Peak Gain|
|Laird|
|Manufacturer|Model|Type|Connector|
|Part Number|2400-2500 MHz|2400-2480 MHz|
|Laird|NanoBlue|TBD|PCB Dipole|IPEX MHF4|2 dBi|-|
|Laird|FlexPIFA|001-0022|PCB Dipole|IPEX MHF4|-|2 dBi|
|Laird|FlexNotch|001-0023|PCB Dipole|IPEX MHF4|-|2 dBi|
|Mag.Layers|EDA-8709-2G4C1-B27-CY|0600-00057|Dipole|IPEX MHF4|2 dBi|-|
|Laird|mFlexPIFA|EFA2400A3S-10MH4L|PIFA|IPEX MHF4|-|2 dBi|
|Laird|Laird NFC|0600-00061|NFC|N/A|-|-|
|Laird|BL654-SA PCB printed antenna|NA|Printed PCB|N/A|0 dBi|-|
|Walsin|RFDPA870900SBAB8G1|NA|Dipole|SMA|2dBi|
**----- End of picture text -----**<br>
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**==> picture [50 x 9] intentionally omitted <==**
**----- Start of picture text -----**<br>
Rear View<br>**----- End of picture text -----**<br>
## _**Figure 9: BL654 mechanical drawings**_
Development Kit Schematics can be found in the software downloads tab of the BL654 product page: TBC
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_**Figure 10: Land pattern and Keep-out for the 451-00001**_
All dimensions are in mm.
**Host PCB Land Pattern and Antenna Keep-out for the 451-00001 Notes:**
- **Note 1** Ensure there is no copper in the antenna ‘keep out area’ on any layers of the host PCB. Also keep all mounting hardware or any metal clear of the area (Refer to 6.3.2) to reduce effects of proximity detuning the antenna and to help antenna radiate properly.
- **Note 2** For the best on-board antenna performance, the module 451-00001 MUST be placed on the edge of the host PCB and preferably in the corner with the antenna facing the corner. Above “Keep Out Area” is the module placed in corner of PCB. If the 451-00001 is not placed in corner but on edge of host PCB, the antenna “Keep Out Area” is extended (see Note 4).
- **Note 3** BL654 development board has the 451-00001 placed on the edge of the PCB board (and not in corner) for that the Antenna keep out area is extended down to the corner of the development board, see section _PCB Layout on Host PCB for the 451-00001_ , Figure 10. This was used for module development and antenna performance evaluation.
- **Note 4** Ensure that there is no exposed copper under the module on the host PCB.
- **Note 5** You may modify the PCB land pattern dimensions based on their experience and/or process capability.
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Laird Technologies surface mount modules are designed to conform to all major manufacturing guidelines. This application note is intended to provide additional guidance beyond the information that is presented in the User Manual. This Application Note is considered a living document and will be updated as new information is presented.
The modules are designed to meet the needs of several commercial and industrial applications. They are easy to manufacture and conform to current automated manufacturing processes.
_**Figure 11: Reel specifications**_
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_**Figure 12: Tape specifications**_
There are 1,000 x BL654 modules taped in a reel (and packaged in a pizza box) and five boxes per carton (5000 modules per carton). Reel, boxes, and carton are labeled with the appropriate labels. See Carton Contents for more information.
## 8.2.2 Carton Contents
The following are the contents of the carton shipped for the BL654 modules.
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_**Figure 13: Carton contents for the BL654**_
## 8.2.5 Packaging Process
**==> picture [135 x 9] intentionally omitted <==**
**----- Start of picture text -----**<br>
Figure 14: BL654 packaging process<br>**----- End of picture text -----**<br>
**==> picture [220 x 32] intentionally omitted <==**
**----- Start of picture text -----**<br>
8.2.4 Labeling<br>The following labels are located on the antistatic bag:<br>**----- End of picture text -----**<br>
**==> picture [104 x 31] intentionally omitted <==**
**----- Start of picture text -----**<br>
M/N:451-00001<br>QTY:1000PCS<br>**----- End of picture text -----**<br>
_**Figure 15: Antistatic bag labels**_
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The following package label is located on both sides of the master carton:
_**Figure 16: Master carton package label**_
The following is the packing slip label:
_**Figure 17: Packing slip label**_
Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New packages contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained during storage and shipment. If directed to _bake units_ on the card, see Table 26 and follow instructions specified by IPC/JEDEC J-STD-033. A copy of this standard is available from the JEDEC website: http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf
Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate and a new humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 4 devices is 168 hours in ambient environment 30°C/60%RH.
_**Table 26: Recommended baking times and temperatures**_
|||**125°C**|**C**|**90°C/≤ 5%RH**|**90°C/≤ 5%RH**|**40°C/≤ 5%RH**|**40°C/≤ 5%RH**|
|---|---|---|---|---|---|---|---|
||**Baking Temp. **|||**Baking Temp. **||**Baking Temp. **||
|**MSL**|**Saturated**|**Floor Life Limit**||**Saturated**|**Floor Life Limit**|**Saturated**|**Floor Life Limit**|
||**@**|**+ 72 hours**|**+ 72 hours**|**@**|**+ 72 hours**|**@ 30°C/85%**|**C/85%**<br>**+ 72 hours @**|
||**30°C/85%**|**@ 30**|**@ 30°C/60%**|**30°C/85%**|**@ 30°C/60%**||**30°C/60%**|
|3|9 hours||7 hours|33 hours|23 hours|13 days|9 days|
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Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. Laird surface mount modules conform to J-STD-020D1 standards for reflow temperatures.
**Important:** During reflow, modules should not be above 260° and not for more than 30 seconds. In addition, we recommend that the BL654 module does not go through the reflow process more than one time, otherwise the BL654 internal component soldering may be impacted.
_**Figure 18: Recommended reflow temperature**_
Temperatures should not exceed the minimums or maximums presented in Table 27.
_**Table 27: Recommended maximum and minimum temperatures**_
|**Specification**|**Value**|**Unit**|
|---|---|---|
|Temperature Inc./Dec. Rate (max)|1~3|°C / Sec|
|Temperature Decrease rate (goal)|2-4|°C / Sec|
|Soak Temp Increase rate (goal)|.5 - 1|°C / Sec|
|Flux Soak Period (Min)|70|Sec|
|Flux Soak Period (Max)|120|Sec|
|Flux Soak Temp (Min)|150|°C|
|Flux Soak Temp (max)|190|°C|
|Time Above Liquidous (max)|70|Sec|
|Time Above Liquidous (min)|50|Sec|
|Time In Target Reflow Range (goal)|30|Sec|
|Time At Absolute Peak (max)|5|Sec|
|Liquidous Temperature (SAC305)|218|°C|
|Lower Target Reflow Temperature|240|°C|
|Upper Target Reflow Temperature|250|°C|
|Absolute Peak Temperature|260|°C|
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
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© Copyright 2018 Laird. All Rights Reserved
**==> picture [276 x 45] intentionally omitted <==**
**----- Start of picture text -----**<br>
||||||
|---|---|---|---|---|
|ee|Model|ee|US/FCC|Canada/IC|
|451-00001|Pending|Pending|
|451-00002|Pending|Pending|
**----- End of picture text -----**<br>
The 451-00001 and the 451-00002 hold full modular approvals. The OEM must follow the regulatory guidelines and warnings listed below to inherit the modular approval.
**==> picture [372 x 42] intentionally omitted <==**
**----- Start of picture text -----**<br>
|||||
|---|---|---|---|
|Part #|Form Factor|Tx Outputs|Antenna|
|ee Re Ce|
|451-00001|Surface Mount|8 dBm|PCB Trace|
|451-00002|Surface Mount|8 dBm|IPEX MHF4|
**----- End of picture text -----**<br>
The BL654 family has been designed to operate with the antennas listed below with a maximum gain of 2 dBi. The required antenna impedance is 50 ohms.
**==> picture [497 x 168] intentionally omitted <==**
**----- Start of picture text -----**<br>
||||||||
|---|---|---|---|---|---|---|
|Peak Gain|
|Laird|
|Manufacturer|Model|Type|Connector|
|Part Number|2400-2500 MHz|2400-2480 MHz|
|Laird|NanoBlue|TBD|PCB Dipole|IPEX MHF4|2 dBi|-|
|Laird|FlexPIFA|001-0022|PCB Dipole|IPEX MHF4|-|2 dBi|
|Laird|FlexNotch|001-0023|PCB Dipole|IPEX MHF4|-|2 dBI|
|Mag.Layers|EDA-8709-2G4C1-B27-CY|0600-00057|Dipole|IPEX MHF4|2 dBi|-|
|Laird|mFlexPIFA|EFA2400A3S-10MH4L|PIFA|IPEX MHF4|-|2 dBI|
|Laird|Laird NFC|0600-00061|NFC|N/A|-|-|
|Laird|BL654-SA PCB printed antenna|NA|Printed PCB|N/A|0 dBi|-|
|Walsin|RFDPA870900SBAB8G1|NA|Dipole|SMA|2dBi|
**----- End of picture text -----**<br>
**Note:** The OEM is free to choose another vendor’s antenna of like type and equal or lesser gain as an antenna appearing in the table and still maintain compliance. Reference FCC Part 15.204(c)(4) for further information on this topic.
To reduce potential radio interference to other users, the antenna type and gain should be chosen so that the equivalent isotropic radiated power (EIRP) is not more than that permitted for successful communication.
Federal Communication Commission (FCC) Radiation Exposure Statement:
This EUT is in compliance with SAR for general population/uncontrolled exposure limits in ANSI/IEEE C95.1-1999 and had been tested in accordance with the measurement methods and procedures specified in OET Bulletin 65 Supplement C.
This transceiver must not be co-located or operating in conjunction with any other antenna, transmitter, or external amplifiers. Further testing/evaluation of the end product will be required if the OEM’s device violates any of these requirements.
The BL654 is fully approved for mobile and portable applications.
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
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© Copyright 2018 Laird. All Rights Reserved
**WARNING** : The OEM must ensure that FCC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Laird Technology FCC identifier for this product.
Contains FCC ID: XXXXX (Pending)
If the size of the end product is larger than 8x10cm, then the following FCC part 15.19 statement must also be available on visible on outside of device:
The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation
Label and text information should be in a size of type large enough to be readily legible, consistent with the dimensions of the equipment and the label. However, the type size for the text is not required to be larger than eight points.
- **CAUTION** : The OEM should have their device which incorporates the BL654 tested by a qualified test house to verify compliance with FCC Part 15 Subpart B limits for unintentional radiators.
**CAUTION** : Any changes or modifications not expressly approved by Laird Technology could void the user’s authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
**FCC Caution:** Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
## **IMPORTANT NOTE:**
## **FCC Radiation Exposure Statement:**
The product complies with the US portable RF exposure limit set forth for an uncontrolled environment and are safe for intended operation as described in this manual. The further RF exposure reduction can be achieved if the product can be kept as far as possible from the user body or set the device to lower output power if such function is available.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
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© Copyright 2018 Laird. All Rights Reserved
## **This device is intended only for OEM integrators under the following conditions:**
(1) The transmitter module may not be co-located with any other transmitter or antenna,
As long as the condition above is met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed
## **IMPORTANT NOTE**
If these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator is responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
## **End Product Labeling**
The end product must be labeled in a visible area with the following: “Contains FCC ID:XXXXX Pending”.
## **Manual Information to the End User**
The OEM integrator must be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
This device complies with Industry Canada’s license-exempt RSSs. Operation is subject to the following two conditions:
(1) This device may not cause interference; and
(2) This device must accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes:
(1) l’appareil ne doit pas produire de brouillage;
(2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.
## **Radiation Exposure Statement**
The product complies with the Canada portable RF exposure limit set forth for an uncontrolled environment and are safe for intended operation as described in this manual. The further RF exposure reduction can be achieved if the product can be kept as far as possible from the user body or set the device to lower output power if such function is available.
## **Déclaration d'exposition aux radiations:**
Le produit est conforme aux limites d'exposition pour les appareils portables RF pour les Etats-Unis et le Canada établies pour un environnement non contrôlé. Le produit est sûr pour un fonctionnement tel que décrit dans ce manuel. La réduction aux expositions RF peut être augmentée si l'appareil peut être conservé aussi loin que possible du corps de l'utilisateur ou que le dispositif est réglé sur la puissance de sortie la plus faible si une telle fonction est disponible.
This device is intended only for OEM integrators under the following conditions:
(1) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 1 condition above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
## **Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes:**
(1) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
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© Copyright 2018 Laird. All Rights Reserved
Tant que les 1 condition ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformité supplémentaires requis pour ce module installé.
## **IMPORTANT NOTE:**
In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization.
## **NOTE IMPORTANTE:**
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada.
## **End Product Labeling**
The final end product must be labeled in a visible area with the following: “Contains IC: XXXXXXX”.
## **Plaque signalétique du produit final**
Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: "Contient des IC:XXXXXXX".
## **Manual Information to the End User**
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
## **Manuel d'information à l'utilisateur final**
L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module.
Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme indiqué dans ce manuel.
## 10 JAPAN (MIC) REGULATORY
The BL654 is approved for use in the Japanese market. The part numbers listed below hold WW type certification. Refer to **ARIB-STD-T66** for further guidance on OEM’s responsibilities.
|**Model**<br>451-00001<br>~~ee ~~|**Model**<br>451-00001<br>~~ee ~~|**Model**<br>451-00001<br>~~ee ~~|**Certificate Number**<br>Pending<br> ~~ee~~|**Antenna**<br>PCB Trace<br>~~ee~~|
|---|---|---|---|---|
||451-00002||Pending|IPEX MHF4|
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
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© Copyright 2018 Laird. All Rights Reserved
The BL654 was tested with antennas listed below. The OEM can choose a different manufacturers antenna but must make sure it is of same type and that the gain is lesser than or equal to the antenna that is approved for use.
|**Manufacturer**|**Model**|**Laird**<br>**Part Number**|**Type**|**Connector**|**2400-2500 MHz**|**Peak Gain**<br>**2400-2500 MHz**|**Peak Gain**<br>**2400-2480 MHz**|**Peak Gain**<br>**2400-2480 MHz**|
|---|---|---|---|---|---|---|---|---|
||||||||||
|Laird|NanoBlue|TBD|PCB Dipole|IPEX MHF4|2 dBi|2 dBi||-|
|Laird|FlexPIFA|001-0022|PCB Dipole|IPEX MHF4|-|||2 dBi|
|Laird|FlexNotch|001-0023|PCB Dipole|IPEX MHF4|-|||2 dBI|
|Mag.Layers|EDA-8709-2G4C1-B27-CY|0600-00057|Dipole|IPEX MHF4|2 dBi|2 dBi||-|
|Laird|mFlexPIFA|EFA2400A3S-10MH4L|PIFA|IPEX MHF4|-|||2 dBI|
|Laird|Laird NFC|0600-00061|NFC|N/A|-|||-|
|Laird|BL654-SA PCB printed antenna|NA|Printed PCB|N/A|0 dBi|0 dBi||-|
|Walsin|RFDPA870900SBAB8G1|NA|Dipole|SMA|2dBi||||
## 11 CE REGULATORY
The 451-00001/451-00002 have been tested for compliance with relevant standards for the EU market. The 451-00002 module was tested with a 2.21 dBi antenna. The OEM can operate the 451-00002 module with any other type of antenna but must ensure that the gain does not exceed 2.21 dBi to maintain the Laird approval.
The OEM should consult with a qualified test house before entering their device into an EU member country to make sure all regulatory requirements have been met for their complete device.
Reference the Declaration of Conformities listed below for a full list of the standards that the modules were tested to. Test reports are available upon request.
The antennas listed below were tested for use with the BL654. For CE mark countries, the OEM is free to use any manufacturer’s antenna and type of antenna if the gain is less than or equal to the highest gain approved for use (2.21dBi ~~)~~ Contact a Laird representative for more information regarding adding antennas.
|**Manufacturer**|**Model**|**Laird**<br>**Part Number**|**Type**|**Connector**|**2400-2500 MHz**|**Peak Gain**<br>**2400-2500 MHz**|**Peak Gain**<br>**2400-2480 MHz**|
|---|---|---|---|---|---|---|---|
|||||||||
|Laird|NanoBlue|TBD|PCB Dipole|IPEX MHF4|2 dBi|2 dBi|-|
|Laird|FlexPIFA|001-0022|PCB Dipole|IPEX MHF4|-||2 dBi|
|Laird|FlexNotch|001-0023|PCB Dipole|IPEX MHF4|-||2 dBI|
|Mag.Layers|EDA-8709-2G4C1-B27-CY|0600-00057|Dipole|IPEX MHF4|2 dBi|2 dBi|-|
|Laird|mFlexPIFA|EFA2400A3S-10MH4L|PIFA|IPEX MHF4|-||2 dBI|
|Laird|Laird NFC|0600-00061|NFC|N/A|-||-|
|Laird|BL654-SA PCB printed antenna|NA|Printed PCB|N/A|0 dBi|0 dBi|-|
|Walsin|RFDPA870900SBAB8G1|NA|Dipole|SMA|2dBi|||
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
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© Copyright 2018 Laird. All Rights Reserved
**Note:** The BL654 module internal BLE chipset IC pins are rated 4 kV (ESD HBM). ESD can find its way through the external JTAG connector (if used on the customer’s design), if discharge is applied directly. Customer should ensure adequate protection against ESD on their end product design (using the BL654 module) to meet relevant ESD standard (for CE, this is EN301-489).
|**Manufacturer**|Laird|
|---|---|
|**Products**|451-00001, 451-00002|
|**Product Description**|Bluetooth v5.0 + 802.15.4 + NFC|
|**EU Directives**|2014/53/EU – Radio Equipment Directive (RED)|
**Reference standards used for presumption of conformity:**
|**Reference standards used for presumption of conformity:**|**Reference standards used for presumption of conformity:**|**Reference standards used for presumption of conformity:**|**Reference standards used for presumption of conformity:**|**Reference standards used for presumption of conformity:**|
|---|---|---|---|---|
|**Article Number**<br>**Requirement**<br>**Reference standard(s)**<br>3.1a<br>Low voltage equipment safety<br>EN 60950-1:2006 +A11:2009 +A1:2010 +A12:2011 +A2:2013<br>RF Exposure<br>EN 62311:2008<br>~~a~~<br>~~Re~~|||||
|||3.1b|Protection requirements –<br>Electromagnetic compatibility|EN 301 489-1 v2.2.0 (2017-03)<br>EN 301 489-17 v3.2.0 (2017-03)|
|||3.2|Means of the efficient use of the<br>radio frequency spectrum (ERM)|EN 300 328 v2.1.1 (2016-11)<br>Wide-band transmission systems<br>EN 300 330 v2.1.1 (2017-02)<br>Short Range Devices (SRD)|
## **Declaration:**
We, Laird, declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Radio Equipment Directive 2014/53/EU, when used for its intended purpose.
Laird Place of Issue: W66N220 Commerce Court, Cedarburg, WI 53012 USA tel: +1-262-375-4400 fax: +1-262-364-2649 Date of Issue: Name of Authorized Person: Thomas T Smith, Director of EMC Compliance Signature of Authorized Person:
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
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© Copyright 2018 Laird. All Rights Reserved
## 12 ORDERING INFORMATION
**==> picture [362 x 94] intentionally omitted <==**
**----- Start of picture text -----**<br>
|||
|---|---|
|Part Number|Product Description|
|a|
|451-00001|Bluetooth v5/802.15.4/NFC module – Integrated antenna|
|451-00002|Bluetooth v5 / 802.15.4 / NFC module – External antenna|
|451-00003|Intelligent USB Bluetooth v5 adapter|
|455-00001|Development Kit for 451-00001 module – Integrated antenna|
|455-00002|Development Kit for the 451-00002 module – External antenna|
**----- End of picture text -----**<br>
## 15 BLUETOOTH SIG QUALIFICATION
The BL654 module is listed on the Bluetooth SIG website as a qualified End Product.
**==> picture [379 x 91] intentionally omitted <==**
**----- Start of picture text -----**<br>
|||||
|---|---|---|---|
|Design|
|Owner|Declaration ID|QD ID|Link to listing on the SIG website|
|Name|
|Laird|
|BL654|
|Technologies|
|Laird|
|BL654*|
|Technologies|
**----- End of picture text -----**<br>
It is a mandatory requirement of the Bluetooth Special Interest Group (SIG) that every product implementing Bluetooth technology has a Declaration ID. Every Bluetooth design is required to go through the qualification process, even when referencing a Bluetooth Design that already has its own Declaration ID. The Qualification Process requires each company to registered as a member of the Bluetooth SIG – www.bluetooth.org
The following link provides a link to the Bluetooth Registration page: https://www.bluetooth.org/login/register/
For each Bluetooth Design, it is necessary to purchase a Declaration ID. This can be done before starting the new qualification, either through invoicing or credit card payment. The fees for the Declaration ID will depend on your membership status, please refer to the following webpage:
https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees
For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to the following SIG document:
https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698&vId=317486
To start a listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm
In step 1, select the option, **Reference a Qualified Design** and enter XXXXX in the End Product table entry. You can then select your pre-paid Declaration ID from the drop-down menu or go to the Purchase Declaration ID page, (please note that unless the Declaration ID is pre-paid or purchased with a credit card, it will not be possible to proceed until the SIG invoice is paid.
Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help document. Your new Design will be listed on the SIG website and you can print your Certificate and Declaration of Conformity.
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
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© Copyright 2018 Laird. All Rights Reserved
For further information, please refer to the following training material:
https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates
**Note** : If using the BL654 with Laird Firmware and _smart_ BASIC script, you can skip “Controller Subsystem”, “Host Subsystem”, and “Profile Subsystem”.
If you wish to deviate from the standard End Product design listed under XXXXX, the qualification process follows the Traditional Project route, creating a new design. When creating a new design, it is necessary to complete the full qualification listing process and also maintain a compliance folder for the new design.
The BL654 design under XXXXX incorporates the following components:
**==> picture [517 x 75] intentionally omitted <==**
**----- Start of picture text -----**<br>
ee Listing reference Design Name Core Spec Version<br>In the future, Nordic may list updated versions of these components and it is possible to use them in your new design. Please<br>check with Nordic to make sure these software components are compatible with the nRF52 hardware XXXXX<br>**----- End of picture text -----**<br>
If your design is based on un-modified BL654 hardware it is possible use the following process;
3. Reference the existing RF-PHY test report from the BL654 listing.
4. Combine the relevant Nordic Link Layer (LL) – check QDID with Nordic.
5. Combine in a Host Component (covering L2CAP, GAP, ATT, GATT, SM) - check QDID with Nordic.
6. Test any standard SIG profiles that are supported in the design (customs profiles are exempt).
**==> picture [106 x 223] intentionally omitted <==**
**----- Start of picture text -----**<br>
End<br>Product<br>inion<br>Laird RF-PHY<br>I<br>Nordic LL<br>I —<br>I -<br>I<br>Host<br>I Layers<br>I ||<br>!<br>I +<br>I Profiles<br>I ||<br>**----- End of picture text -----**<br>
_**Figure 19: Scope of the qualification for an End Product Design**_
The first step is to generate a project on the TPG (Test Plan Generator) system. This determines which test cases apply to demonstrate compliance with the Bluetooth Test Specifications. If you are combining pre-tested and qualified components in
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
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© Copyright 2018 Laird. All Rights Reserved
your design and they are within their three-year listing period, you are not required to re-test those layers covered by these components.
If the design incorporates any standard SIG LE profiles (such as Heart Rate Profile), it is necessary to test these profiles using PTS or other tools where permitted; the results are added to the compliance folder.
You are required to upload your test declaration and test reports (where applicable) and then complete the final listing steps on the SIG website. Remember to purchase your Declaration ID before you start the qualification process, as it’s impossible to complete the listing without it.
## 14 ADDITIONAL ASSISTANCE
Please contact your local sales representative or our support team for further assistance:
Laird Technologies Connectivity Products Business Unit Support Centre: http://ews-support.lairdtech.com Email: wireless.support@lairdtech.com Phone: Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Web: http://www.lairdtech.com/bluetooth
**Note:** This is a PRELIMINARY version of the BL654 datasheet. Information contained in this document is subject to change.
© Copyright 2018 Laird. All Rights Reserved. Patent pending. Any information furnished by Laird and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird materials or products rests with the end user since Laird and its agents cannot be aware of all potential uses. Laird makes no warranties as to non-infringement nor as to the fitness, merchantability, or sustainability of any Laird materials or products for any specific or general uses. Laird, Laird Technologies, Inc., or any of its affiliates or agents shall not be liable for incidental or consequential damages of any kind. All Laird products are sold pursuant to the Laird Terms and Conditions of Sale in effect from time to time, a copy of which will be furnished upon request. When used as a tradename herein, Laird means Laird PLC or one or more subsidiaries of Laird PLC. Laird™, Laird Technologies™, corresponding logos, and other marks are trademarks or registered trademarks of Laird. Other marks may be the property of third parties. Nothing herein provides a license under any Laird or any third party intellectual property right.
Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
56
© Copyright 2018 Laird. All Rights Reserved
Updated at June 5, 2026
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