450-0169C

Wireless LAN Module, Sterling-LWB5 Series, 2.4 GHz, SDIO, UART, Security & Building Automation

⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
Manufacturer: EZURIO
Product type:
Frequency RF:2.4GHz; Module Interface:SDIO, UART; Module Applications:Security & Building Automation, Internet of Things / M2M Connectivity, Smart Gateways; Product Range:Sterling-LWB5 Series
SVHC: To Be Advised
Frequency RF: 2.4GHz
Product Range: Sterling-LWB5 Series
Module Interface: SDIO, UART
Module Applications: Security & Building Automation, Internet of Things / M2M Connectivity, Smart Gateways
Delivery and price
Units per pack	50
Price	33.59 €
Current stock	10+
Lead time	30 days
Datasheet
**Sterling-LWB5 Module Datasheet** 

## **Integrated 802.11 a/b/g/n/ac WLAN, Bluetooth & BLE Module** 

## **FEATURES** 

## **DESCRIPTION** 

- IEEE 802.11 a/b/g/n/ac (single stream n) 

- Typical WLAN Transmit Power: `o` +16 dBm, 11 Mbps, CCK (b) `o` +13 dBm, 54 Mbps, OFDM (g) `o` +11 dBm, HT20 MCS7 (n) 

- Typical WLAN Sensitivity: `o` -87 dBm, 8% PER,11 Mbps (b) 

   - -73 dBm, 10% PER, 54 Mbps (g) 

   - `o` -71 dBm, 10% PER, MCS7 (n) 

- Bluetooth 2.1+EDR, Bluetooth 3.0, Bluetooth 4.2 (Bluetooth Low Energy) 

- WLAN and Bluetooth coexistence 

- Available in two footprint styles: `o` Easy to Integrate: 15.5 mm x 21 mm `o` Miniature footprint: 10 mm x 10 mm 

The Sterling-LWB5 is a high performance 2.4 GHz and 5 GHz WLAN and Bluetooth Smart Ready combo module based on latest-generation silicon (Cypress’s BCM43353).  With an industrial temperature rating, broad country certifications, and the availability of two different package styles, the Sterling-LWB5 provides significant flexibility to meet various end user application needs. 

The on-module chip antenna package style for the Sterling-LWB5 eliminates complexity for design integration, simplifies manufacturing assembly with larger pin outs, and features an advanced chip antenna that offers greater resistance to de-tuning than typical trace or chip antennas. 

- Available with integrated chip antenna or U.FL connector for external antenna 

- Operating voltage: VBAT = 3.20V to 3.60V VDDIO = 1.71V to 1.89V 

- Operating temperature: -40 to +85[o] C 

- Compact design based on Cypress BCM43353 SoC 

- Worldwide acceptance: FCC (USA), IC (Canada), ETSI (Europe), Giteki (Japan), and RCM (AU/NZ) 

**Note: All certifications are currently pending.  When completed this statement will be removed.** 

BT SIG QDID: coming soon 

- REACH and RoHS compliant 

## **APPLICATIONS** 

- Security & Building Automation 

- Internet of Things / M2M Connectivity 

- Smart Gateways 

The module includes the MAC, Baseband and Radio to support WLAN applications and an independent, high-speed UART is provided for the Bluetooth host interface.  In addition, the latest Linux and Android drivers are supported directly by LSR and Cypress. Need to get to market quickly?  Not an expert in 802.11. Need a custom antenna?  Would you like to own the design?  Would you like a custom design? Not quite sure what you need?  Do you need help with your host board?  LSR Design Services will be happy to develop custom hardware or software, or assist with integrating the design.  Contact us at sales@lsr.com or call us at 262-375-4400. 

The information in this document is subject to change without notice. 

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**Sterling-LWB5 Module Datasheet** 

**TABLE OF CONTENTS FEATURES ................................................................................................................................... 1 APPLICATIONS ............................................................................................................................ 1 DESCRIPTION .............................................................................................................................. 1 MODULE VARIANTS .................................................................................................................... 5 FUNCTIONAL FEATURES .............................................................................................................. 8 WLAN Features ...................................................................................................................................................... 8 Bluetooth Features ................................................................................................................................................ 8 Wireless Security System Features ........................................................................................................................ 8 ORDERING INFORMATION .......................................................................................................... 9 MODULE ACCESSORIES .............................................................................................................. 10 APPLICABLE DOCUMENTS ......................................................................................................... 10 BLOCK DIAGRAMS ..................................................................................................................... 11 SIP MODULE FOOTPRINT AND PIN DEFINITIONS ........................................................................ 14 SIP MODULE PIN DESCRIPTIONS ................................................................................................ 15 U.FL AND CHIP ANTENNA MODULE FOOTPRINT AND PIN DEFINITIONS ...................................... 18 U.FL AND CHIP ANTENNA MODULE PIN DESCRIPTIONS .............................................................. 19 MODULE POWER STATES .......................................................................................................... 21 MODULE PIN I/O STATES ........................................................................................................... 22 ELECTRICAL SPECIFICATIONS ..................................................................................................... 25 Absolute Maximum Ratings ................................................................................................................................. 25 Recommended Operating Conditions .................................................................................................................. 25 General Characteristics ........................................................................................................................................ 26 WLAN Power Consumption.................................................................................................................................. 27 Bluetooth Power Consumption ............................................................................................................................ 28 Power Supply Requirements ................................................................................................................................ 28 Power Supply Sequencing .................................................................................................................................... 29** 

The information in this document is subject to change without notice. 

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**Sterling-LWB5 Module Datasheet** 

**CRYSTAL OSCILLATOR REQUIREMENTS ...................................................................................... 33 WLAN RF Characteristics ...................................................................................................................................... 38 Bluetooth RF Characteristics ................................................................................................................................ 45 WLAN HOST INTERFACE ............................................................................................................ 46 SDIO Interface ..................................................................................................................................................... 46 BLUETOOTH UART HOST INTERFACE .......................................................................................... 49 Overview ............................................................................................................................................................. 49 Soldering Recommendations ............................................................................................................................... 51 Recommended Reflow Profile for Lead Free Solder ............................................................................................. 51 CLEANING ................................................................................................................................. 52 OPTICAL INSPECTION ................................................................................................................ 52 REWORK ................................................................................................................................... 52 SHIPPING, HANDLING, AND STORAGE ....................................................................................... 52 Shipping ............................................................................................................................................................... 52 Handling .............................................................................................................................................................. 52 Moisture Sensitivity Level (MSL) .......................................................................................................................... 52 Storage ................................................................................................................................................................ 52 Repeated Reflow Soldering .................................................................................................................................. 53 AGENCY CERTIFICATIONS .......................................................................................................... 54 AGENCY STATEMENTS ............................................................................................................... 54 Federal Communication Commission Interference Statement ............................................................................. 54 Industry Canada Statements ................................................................................................................................ 55 OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS ............. 56 OEM LABELING REQUIREMENTS FOR END-PRODUCT ................................................................. 57 OEM END PRODUCT USER MANUAL STATEMENTS ..................................................................... 58 EUROPE .................................................................................................................................... 59 CE Notice ............................................................................................................................................................. 59 Declaration of Conformity (DOC) ......................................................................................................................... 59** 

The information in this document is subject to change without notice. 

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**BLUETOOTH SIG QUALIFICATION ............................................................................................... 59 Overview ............................................................................................................................................................. 59 Qualification Steps When Referencing a Laird Controller Subsystem Design ....................................................... 60 Additional Assistance........................................................................................................................................... 60 CHIP ANTENNA PERFORMANCE ................................................................................................. 61 Summary of Antenna Performance ...................................................................................................................... 61 2.4 GHz Radiated Performance ............................................................................................................................ 62 5 GHz Radiated Performance ............................................................................................................................... 68 BASE SIP MODULE MECHANICAL DATA ...................................................................................... 74 BASE SIP MODULE PCB FOOTPRINT ........................................................................................... 75 BASE SIP MODULE TAPE AND REEL PACKAGING ......................................................................... 76 U.FL AND CHIP ANTENNA MECHANICAL DATA ........................................................................... 77 U.FL AND CHIP ANTENNA PCB FOOTPRINT ................................................................................ 78 U.FL AND CHIP ANTENNA TAPE AND REEL PACKAGING .............................................................. 79 DEVICE MARKINGS .................................................................................................................... 80 Rev 1 Devices ....................................................................................................................................................... 80 CONTACTING LSR ...................................................................................................................... 81** 

The information in this document is subject to change without notice. 

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**Sterling-LWB5 Module Datasheet** 

## **MODULE VARIANTS** 

The LSR Sterling-LWB5 Module is available in three different versions.  Depending on the user’s antenna and footprint needs, there is a variant to suite most application requirements.  LSR recommends that for simplicity of both the host PCB design, as well as the manufacturing process, that either the Chip Antenna or RF Connector version of the modules be used in your design. 

- **450-0162 - Base SIP Module** 

   - This module variant is supplied in a compact, 84 pin, LGA footprint.  Unlike the other module variants, it requires the addition of either an off module antenna or RF connector, as well as the associated matching components.  In order to benefit from the EMC certifications on the module, strictly following the layout in the module application guide is required.  This requires adherence to the PCB stack-up and layout around the antenna.  The footprint of this module may require additional care during reflow and PCB assembly. 

**Figure 1 Sterling-LWB5 Base SIP Module (450-0162)** 

The information in this document is subject to change without notice. 

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**Sterling-LWB5 Module Datasheet** 

- **450-0168 – U.FL Module** 

   - This module variant integrates the 450-0162 Base SIP Module, a U.FL RF connector, and all associated RF matching components on a PCB.  This integrated approach not only provides a U.FL connector for connections to external antennas, but also simplifies and reduces the cost of the end users host board by simplifying the module PCB footprint. 

**Figure 2 Sterling-LWB5 U.FL Module (450-0168)** 

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**Sterling-LWB5 Module Datasheet** 

- **450-0169 - Chip Antenna Module** 

This module variant integrates the 450-0162 Base SIP Module, a chip antenna, and all associated RF matching components on a PCB.  This integrated approach not only provides an external antenna solution, but also simplifies and reduces the cost of the end users host board by simplifying the module PCB footprint 

**Figure 3 Sterling-LWB5 Chip Antenna Module (450-0169)** 

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**Sterling-LWB5 Module Datasheet** 

## **FUNCTIONAL FEATURES** 

## **WLAN Features** 

- IEEE802.11 a/b/g/n/ac 1x1 2.4 GHz Radio 

   - Internal Power Amplifier (PA) 

   - Internal Low Noise Amplifier(LNA) 

   - Internal T/R Switch 

   - Simultaneous BT/WLAN reception with a single antenna. 

- Media Access Controller (MAC) 

- Physical Layer (PHY) 

- Baseband Processor 

- **Standards** 

   - IEEE 802.11a, 802.11b, 802.11g, 802.11n (single stream), 802.11ac 

## **Bluetooth Features** 

- Class 2 power amplifier with Class 2 capability 

- HCI Interface using High Speed UART 

- PCM for Audio Data 

- **Standards** 

- Bluetooth 2.1+EDR, Bluetooth 3.0, Bluetooth 4.2 (Bluetooth Low Energy) 

## **Wireless Security System Features** 

- **Supported modes:** 

   - Open (no security) 

   - WEP 

   - WPA Personal 

   - WPA2 Personal 

   - WMM 

   - WMM-PS (U-APSD) 

   - WMM-SA 

   - WAPI 

   - AES (Hardware Accelerator) 

   - TKIP (host-computed) 

   - CKIP (SW Support) 

The information in this document is subject to change without notice. 

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**Sterling-LWB5 Module Datasheet** 

## **ORDERING INFORMATION** 

|**Order Number**|**Description**|
|---|---|
|450-0168C|Sterling-LWB5 U.FL Module (Cut Tape)|
|450-0168R|Sterling-LWB5 U.FL Module (Tape and Reel, SPQ = 1000)|
|450-0169C|Sterling-LWB5 Chip Antenna Module (Cut Tape)|
|450-0169R|Sterling-LWB5 Chip Antenna Module (Tape and Reel, SPQ = 1000)|
|450-0162C|Sterling-LWB5 Base SIP Module (Cut Tape)|
|450-0162R|Sterling-LWB5 Base SIP Module (Tape and Reel, SPQ = 1000)|
|450-0171|Sterling-LWB5 SD Development Board, U.FL|
|450-0172|Sterling-LWB5 SD Development Board, Chip Antenna|



**Table 1 Orderable Sterling-LWB5 Part Numbers** 

The information in this document is subject to change without notice. 

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## **MODULE ACCESSORIES** 

||**Order Number**|**Description**|
|---|---|---|
|~~DO]~~|**001-0009**<br>~~DO]~~<br>~~|~~|2.4 GHz and 5.5 GHz Dipole Antenna with<br>Reverse Polarity SMA Connector|
|~~DO]~~|**080-0001**<br>~~DO]~~<br>~~|~~|U.FL to Reverse Polarity SMA Bulkhead<br>Cable 105mm|
|~~DO]~~|**001-0016**<br>~~DO]~~<br>~~|~~|2.4 GHz and 5.5GHz FlexPIFA Antenna|
||Johanson<br>2450AD14A5500T|2.4/5.5 GHz Chip Antenna|



**Table 2 Module Accessories** 

## **APPLICABLE DOCUMENTS** 

- Sterling-LWB5 Module Application Guide (330-0209) 

- Sterling-LWB5 SD Card User Guide (330-0201) 

The information in this document is subject to change without notice. 

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**Sterling-LWB5 Module Datasheet** 

## **BLOCK DIAGRAMS** 

**Figure 4 Sterling-LWB5 Base SIP Module Block Diagram** 

The information in this document is subject to change without notice. 

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**Figure 5 Sterling-LWB5 U.FL Module Block Diagram** 

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**Figure 6 Sterling-LWB5 Chip Antenna Module Block Diagram** 

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**Sterling-LWB5 Module Datasheet** 

## **SIP MODULE FOOTPRINT AND PIN DEFINITIONS** 

Note that the following footprint and pin definition applies to the Sterling-LWB5 Base SIP Module (450-0162). There are two module footprints depending on which variant of the module is being used, so it is important to make certain you are using the correct version on your design. 

**Figure 7 Sterling-LWB5 SIP Module Pinout (Top View)** 

The information in this document is subject to change without notice. 

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**Sterling-LWB5 Module Datasheet** 

## **SIP MODULE PIN DESCRIPTIONS** 

|**Module**<br>**Pin**|**Name**|**I/O Type**|**Description**|
|---|---|---|---|
|1|GND|-|GROUND|
|2|GND|-|GROUND|
|3|GND|-|GROUND|
|4|GND|-|GROUND|
|5|GND|-|GROUND|
|6|RF_SW_CTRL_9|O|External RF SW control|
|7|RF_SW_CTRL_8|O|External RF SW control|
|8|GND|-|GROUND|
|9|GND|-|GROUND|
|10|GND|-|GROUND|
|11|GND|-|GROUND|
|12|GND|-|GROUND|
|13|GPIO_3|I/O|LTE Coexistence GPIO for 3-wire|
|14|GPIO_5|I/O|LTE Coexistence GPIO|
|15|GPIO_4|I/O|LTE Coexistence GPIO|
|16|GND|-|GROUND|
|17|WLAN_HOST_WAKE/GPIO_0|O|Output from WLAN to wake module|
|18|GND|GND|GROUND|
|19|SDIO_CLK|I|WLAN SDIO clock|
|20|GND|-|GROUND|
|21|SDIO_CMD|I|WLAN SDIO command line|
|22|SDIO_DATA_0|I/O|WLAN SDIO data line 0|
|23|SDIO_DATA_1|I/O|WLAN SDIO data line 1|
|24|SDIO_DATA_2|I/O|WLAN SDIO data line 2|
|25|SDIO_DATA_3|I/O|WLAN SDIO data line 3|
|26|GND|-|GROUND|
|27|LPO IN|I|32.768KHz Input|
|28|WL_REG_ON|I|PMU power up to the WLAN section|



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|**Module**<br>**Pin**|**Name**|**I/O Type**|**Description**|
|---|---|---|---|
|29|BT_REG_ON|I|PMU power up to the Bluetooth section|
|30|GND|-|GROUND|
|31|GND|-|GROUND|
|32|SR_VLX|O|CBUCK switching regulator output|
|33|GND|-|GROUND|
|34|VIN_LDO|I|CBUCK switching regulator input|
|35|GND|-|GROUND|
|36|VBAT|I|Power VBAT|
|37|VBAT|I|Power VBAT|
|38|GND|-|GROUND|
|39|VDDIO|I|I/O Power Supply|
|40|GND|-|GROUND|
|41|BT_PCM_IN|I|Bluetooth PCM data input|
|42|BT_PCM_CLK|I/O|Bluetooth PCM clock|
|43|BT PCM SYNC|I/O|Bluetooth PCM Sync signal|
|44|BT_PCM_OUT|O|Bluetooth PCM data output|
|45|GND|-|GROUND|
|46|BT_HOST_WAKE|O|Output from Bluetooth to wake Host|
|47|BT_DEV_WAKE|I|Input from Host to wake Bluetooth|
|48|GND|-|GROUND|
|49|BT_UART_CTS|I|Bluetooth UART clear to send|
|50|BT_UART_RTS|O|Bluetooth UART request to send|
|51|BT_UART_RXD|I|Bluetooth UART serial Input|
|52|BT_UART_TXD|O|Bluetooth UART serial output|
|53|GND|-|GROUND|
|54|GND|-|GROUND|
|55|GND|-|GROUND|
|56|GND|-|GROUND|
|57|GND|-|GROUND|
|58|GND|-|GROUND|



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**Sterling-LWB5 Module Datasheet** 

|**Module**<br>**Pin**|**Name**|**I/O Type**|**Description**|
|---|---|---|---|
|59|5G/2G_ANT|I/O|2.4G/5GHz RF signal input/output|
|60|GND|-|GROUND|
|61|GND|-|GROUND|
|62|GND|-|GROUND|
|63|GND|-|GROUND|
|64|GND|-|GROUND|
|65|GND|-|GROUND|
|66|GND|-|GROUND|
|67|GND|-|GROUND|
|68|GND|-|GROUND|
|69|GND|-|GROUND|
|70|GND|-|GROUND|
|71|GND|-|GROUND|
|72|GND|-|GROUND|
|73|GND|-|GROUND|
|74|GND|-|GROUND|
|75|GND|-|GROUND|
|76|GND|-|GROUND|
|77|GND|-|GROUND|
|78|GND|-|GROUND|
|79|GND|-|GROUND|
|80|GND|-|GROUND|
|81|GND|-|GROUND|
|82|GND|-|GROUND|
|83|GND|-|GROUND|
|84|GND|-|GROUND|



PI = Power Input, DI = Digital Input, DO = Digital Output, DIO = Bi-directional Digital Port, RF = Bi-directional RF Port, GND = Ground 

**Table 3 Sterling-LWB5 SIP Module Pin Descriptions** 

The information in this document is subject to change without notice. 

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**Sterling-LWB5 Module Datasheet** 

## **U.FL AND CHIP ANTENNA MODULE FOOTPRINT AND PIN DEFINITIONS** 

Note that the following footprint and pin definitions apply to the Sterling-LWB5 U.FL and Chip Antenna variants of the module (450-0168 and 450-0169).  There are two module footprints depending on which variant of the module is being used, so it is important to make certain you are using the correct version on your design. 

**Figure 8 Sterling-LWB5 U.FL and Chip Antenna Module Pinout (Top View)** 

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**Sterling-LWB5 Module Datasheet** 

## **U.FL AND CHIP ANTENNA MODULE PIN DESCRIPTIONS** 

|**Module**<br>**Pin**|**Name**|**I/O Type**|**Description**|
|---|---|---|---|
|1|GND|GND|GROUND|
|2|BT_PCM_SYNC|DIO|PCM SYNC; CAN BE MASTER (OUTPUT) OR SLAVE (INPUT)|
|3|BT_PCM_IN|DI|PCM DATA INPUT SENSING|
|4|BT_PCM_OUT|DO|PCM DATA OUTPUT|
|5|VBAT|PI|WIFI AND BLUETOOTH POWER SUPPLY|
|6|GND|GND|GROUND|
|7|RF_SW_CTRL_9|DO|External RF SW control|
|8|RF_SW_CTRL_8|DO|External RF SW control|
|9|GPIO_3|DIO|PROGRAMMABLE GPIO PIN|
|10|GPIO_5|DIO|PROGRAMMABLE GPIO PIN|
|11|GPIO_4|DIO|PROGRAMMABLE GPIO PIN.|
|12|WLREG_ON|DI|USED BY PMU TO POWER UP OR POWER DOWN THE<br>INTERNAL REGULATORS USED BY THE WLAN SECTION.|
|13|GPIO_0/<br>WLAN_HOST_WAKE|DO|PROGRAMMABLE GPIO PIN.|
|14|GND|GND|GROUND|
|15|NC|NC|NO CONNECT|
|16|NC|NC|NO CONNECT|
|17|NC|NC|NO CONNECT|
|18|GND|GND|GROUND|
|19|LPO_IN|DI|EXTERNAL SLEEP CLOCK INPUT|
|20|VDDIO|PI|DC SUPPLY FOR I/O|
|21|BT_REG_ON|DI|USED BY PMU TO POWER UP OR POWER DOWN THE<br>INTERNAL REGULATORS USED BY THE BLUETOOTH<br>SECTION.|
|22|SDIO_DATA_0|DIO|SDIO DATA LINE 0|
|23|SDIO_DATA_1|DIO|SDIO DATA LINE 1|
|24|GND|GND|GROUND|
|25|SDIO_DATA_2|DIO|SDIO DATA LINE 2|



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|**Module**<br>**Pin**|**Name**|**I/O Type**|**Description**|
|---|---|---|---|
|26|SDIO_CMD|DIO|SDIO COMMAND LINE|
|27|SDIO_DATA_3|DIO|SDIO DATA LINE 3|
|28|GND|GND|GROUND|
|29|SDIO_CLK|DIO|SDIO CLOCK LINE|
|30|GND|GND|GROUND|
|31|BT_UART_RTS|DO|Bluetooth UART request-to-send|
|32|BT_UART_CTS|DI|Bluetooth UART clear-to-send|
|33|BT_UART_TXD|DO|Bluetooth UART transmit output|
|34|BT_UART_RXD|DI|Bluetooth UART Receive input|
|35|NC|NC|NO CONNECT|
|36|NC|NC|NO CONNECT|
|37|NC|NC|NO CONNECT|
|38|BT_PCM_CLK|DIO|PCM CLOCK; CAN BE MASTER (OUTPUT) OR SLAVE<br>(INPUT)|
|39|BT_DEV_WAKE|DI|Input from Host to wake Bluetooth|
|40|BT_HOST_WAKE|DO|Output from Bluetooth to wake Host|
|41|GND|GND|GROUND|
|42|GND|GND|GROUND|
|43|GND|GND|GROUND|
|44|GND|GND|GROUND|
|45|GND|GND|GROUND|
|46|GND|GND|GROUND|
|47|GND|GND|GROUND|



PI = Power Input, DI = Digital Input, DO = Digital Output, DIO = Bi-directional Digital Port, GND = Ground 

**Table 4 Sterling-LWB5 U.FL and Chip Antenna Module Pin Descriptions** 

The information in this document is subject to change without notice. 

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**Sterling-LWB5 Module Datasheet** 

## **MODULE POWER STATES** 

The Sterling-LWB5 WLAN power states are described as follows: 

**• Active mode** - All WLAN blocks in the Sterling-LWB5 are powered up and fully functional with active carrier sensing and frame transmission and receiving.  All required regulators are enabled and put in the most efficient mode based on the load current.  Clock speeds are dynamically adjusted by the PMU sequencer. 

**• Doze mode** - The radio, analog domains, and most of the linear regulators are powered down.  The rest of the BCM43353 remains powered up in an IDLE state.  All main clocks (PLL, crystal oscillator) are shut down to reduce active power to the minimum.  The 32.768 kHz LPO clock is available only for the PMU sequencer.  This condition is necessary to allow the PMU sequencer to wake up the chip and transition to Active mode.  In Doze mode, the primary power consumed is due to leakage current. 

**• Deep-sleep mode** - Most of the chip, including both analog and digital domains, and most of the regulators are powered off.  Logic states in the digital core are saved and preserved into a retention memory in the always-ON domain before the digital core is powered off.  Upon a wake-up event triggered by the PMU timers, an external interrupt, or a host resume through the SDIO bus, logic states in the digital core are restored to their pre-deep-sleep settings to avoid lengthy HW reinitialization. 

**• Power-down mode** - The BCM43353 is effectively powered off by shutting down all internal regulators.  The chip is brought out of this mode by external logic re-enabling the internal regulators. 

The information in this document is subject to change without notice. 

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**Sterling-LWB5 Module Datasheet** 

## **MODULE PIN I/O STATES** 

|**Pin #**|**Pin #**|**Name**|**Keeper**<br>**(b)**|**Active Mode**|**Low Power**<br>**State/Sleep****_(All_**<br>**_Power Present)_**|**Power Down(c)**<br>**_WL_REG_ON =0_**<br>**_BT_REG_ON = 0_**|**Out of Reset:** **_(VDD_VIO is present)_**|**Out of Reset:** **_(VDD_VIO is present)_**|**Out of Reset:** **_(VDD_VIO is present)_**|
|---|---|---|---|---|---|---|---|---|---|
|**450-0162**<br>**(SiP)**|**450-0168 &**<br>**450-0169**<br>**(Antenna**<br>**Modules)**||||||**_WL_REG_ON =1_**<br>**_BT_REG_ON = 1_**<br>_(before SW download)_|**_WL_REG_ON =1_**<br>**_BT_REG_ON = 0_**|**_WL_REG_ON =0_**<br>**_BT_REG_ON = 1_**|
|43<br>~~a~~|2<br>~~a~~|BT_PCM_SYNC<br>~~a~~|Y<br>~~ee~~|Input No Pull(d)<br>~~ee~~|Input No Pull(d)<br>~~ee~~|High –Z No Pull(d)<br>~~ee~~|Output<br>~~ee~~|Input; PD<br>~~ee~~|TBD<br>~~ee~~|
|41<br>~~a~~<br>~~a~~|3<br>~~a~~<br>~~ee~~|BT_PCM_IN<br>~~a~~<br>~~ee~~|Y<br>~~ee~~<br>~~es~~|Input No Pull(d)<br>~~ee~~|Input No Pull(d)<br>~~ee~~|High –Z No Pull(d)<br>~~ee~~|Input, No Pull,<br>High-Z<br>~~ee~~|Input; PD<br>~~ee~~|TBD<br>~~ee~~|
|44<br>~~a ~~<br>~~a~~|4<br> ~~a ~~<br>~~ee~~|BT_PCM_OUT<br> ~~a ~~<br>~~ee~~|Y<br> ~~ee~~<br>~~es~~|Input No Pull(d)<br>~~ee~~|Input No Pull(d)<br>~~ee~~|High –Z No Pull(d)<br>~~ee~~|Output<br>~~ee~~|Input; PD<br>~~ee~~|TBD<br>~~ee~~|
|13<br>~~a ~~|9<br> ~~ee~~|WIFI_GPIO_3<br>~~ee~~|Y<br>~~es~~|Input/Output:<br>PU, PD, NoPull<br>(Programmable)<br>Default PD|Input/Output:<br>PU, PD, NoPull<br>(Programmable)<br>Default PD|High –Z No Pull(f)|Input; PD|Input; PD|TBD|
|14|10|WIFI_GPIO_5|Y|Input/Output:<br>PU, PD, NoPull<br>(Programmable)<br>Default PD|Input/Output:<br>PU, PD, NoPull<br>(Programmable)<br>Default PD|High –Z No Pull(f)|Input; PD|Input; PD|TBD|
|15|11|WIFI_GPIO_4|Y|Input/Output:<br>PU, PD, NoPull<br>(Programmable)<br>Default NoPull|Input/Output:<br>PU, PD, NoPull<br>(Programmable)<br>Default NoPull|High –Z No Pull(f)|Input, NoPull|Input, NoPull|TBD|
|28|12|WLREG_ON|N|Input; PD (pull-<br>down can be<br>disabled)|Input; PD (pull-<br>down can be<br>disabled)|Input; PD (of<br>200K)|Input; PD (of<br>200K)|Input; PD (of<br>200K)|TBD|
|17|13|WIFI_GPIO_0/<br>WLAN_HOST_WAKE|Y|Input/Output:<br>PU, PD, NoPull<br>(Programmable)<br>Default PD|Input/Output:<br>PU, PD, NoPull<br>(Programmable)<br>Default PD|High –Z No Pull(f)|Input; PD|Input; PD|TBD|



The information in this document is subject to change without notice. 

Copyright © 2016-2017 LSR 

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|**Pin #**|**Pin #**|**Name**|**Keeper**<br>**(b)**|**Active Mode**|**Low Power**<br>**State/Sleep****_(All_**<br>**_Power Present)_**|**Power Down(c)**<br>**_WL_REG_ON =0_**<br>**_BT_REG_ON = 0_**|**Out of Reset:** **_(VDD_VIO is present)_**|**Out of Reset:** **_(VDD_VIO is present)_**|**Out of Reset:** **_(VDD_VIO is present)_**|
|---|---|---|---|---|---|---|---|---|---|
|**450-0162**<br>**(SiP)**|**450-0168 &**<br>**450-0169**<br>**(Antenna**<br>**Modules)**||||||**_WL_REG_ON =1_**<br>**_BT_REG_ON = 1_**<br>_(before SW download)_|**_WL_REG_ON =1_**<br>**_BT_REG_ON = 0_**|**_WL_REG_ON =0_**<br>**_BT_REG_ON = 1_**|
|29|21|BT_REG_ON|N|Input; PD (pull-<br>down can be<br>disabled)|Input; PD (pull-<br>down can be<br>disabled)|Input; PD (of<br>200K)|Input; PD (of<br>200K)|Input; PD (of<br>200K)|TBD|
|22|22|SDIO_D0|N|SDIO MODE -><br>PullUp|SDIO MODE -><br>Input PullUp|High-Z, NoPull|SDIO MODE -<br>>Input PullUP|SDIO MODE -><br>Input PullUP|TBD|
|23|23|SDIO_D1|N|SDIO MODE -><br>PullUp|SDIO MODE -><br>Input PullUp|High-Z, NoPull|SDIO MODE -<br>>Input PullUP|SDIO MODE -><br>Input PullUP|TBD|
|24|25|SDIO_D2|N|SDIO MODE -><br>PullUp|SDIO MODE -><br>Input PullUp|High-Z, NoPull|SDIO MODE -<br>>Input PullUP|SDIO MODE -><br>Input PullUP|TBD|
|21|26|SDIO_CMD|N|SDIO MODE -><br>PullUp|SDIO MODE -><br>Input PullUp|High-Z, NoPull|SDIO MODE -<br>>Input PullUP|SDIO MODE -><br>Input PullUP|TBD|
|25<br>~~a~~|27<br>~~ee~~|SDIO_D3<br>~~ee~~|N<br>~~ee~~|SDIO MODE -><br>PullUp<br>~~ee~~|SDIO MODE -><br>Input PullUp|High-Z, NoPull<br>~~GO~~|SDIO MODE -<br>>Input PullUP<br>~~GO~~|SDIO MODE -><br>Input PullUP|TBD|
|19<br>~~a~~<br>~~a~~|29<br>~~ee~~<br>~~a~~|SDIO_CK<br>~~ee~~<br>~~es~~|N<br>~~ee~~<br>~~GO~~|Input: NoPull<br>~~ee~~<br>~~GO~~|Input: NoPull<br>~~GO~~|High-Z, NoPull<br>~~GO~~<br>~~GO~~|Input, NoPull<br>~~GO~~<br>~~GO~~|Input, NoPull<br>~~GO~~|TBD<br>~~GO~~|
|50<br>~~a ~~<br>~~a~~<br>~~a~~|31<br> ~~ee~~<br>~~a~~<br>~~a~~|BT_UART_RTS<br>~~ee ~~<br>~~es~~<br>~~es~~|Y<br> ~~ee~~<br>~~GO~~<br>~~es~~|Output:NoPull<br>~~ee~~<br>~~GO~~<br>~~ns~~|Output:NoPull<br>~~GO~~<br>~~Os~~|High-Z,NoPull<br>~~GO~~<br>~~GO~~<br>~~Os~~|Input; PU<br>~~GO~~<br>~~GO~~<br>~~nS~~|Input; PU<br>~~GO~~|TBD<br>~~GO~~|
|49<br>~~a ~~<br>~~a~~|32<br> ~~a~~<br>~~a~~|BT_UART_CTS<br>~~es~~<br>~~es~~|Y<br>~~GO~~<br>~~es~~|Input:NoPull<br>~~GO~~<br>~~ns~~|Input:NoPull<br>~~GO~~<br>~~Os~~|High-Z,NoPull<br>~~GO~~<br>~~Os~~|Input; PU<br>~~GO~~<br>~~nS~~|Input; PU<br>~~GO~~|TBD<br>~~GO~~|
|52<br>~~a ~~|33<br> ~~a~~|BT_UART_TXD<br>~~es ~~|Y<br> ~~es~~|Output:NoPull<br>~~ns~~|Output:NoPull<br>~~Os~~|High-Z,NoPull<br>~~Os~~|Input; PU<br>~~nS~~|Input; PU|TBD|
|51<br>~~a~~|34<br>~~a~~|BT_UART_RXD<br>~~es~~|Y<br>~~es~~|Input:PU|Input:NoPull|High-Z,NoPull|Input; PU|Input; PU|TBD|
|42<br>~~a~~|38<br>~~a~~|BT_PCM_CLK<br>~~es~~|Y<br>~~es~~|Input No Pull(d)|Input No Pull(d)|High –Z NoPull|Output|Input; PD|TBD|



The information in this document is subject to change without notice. 

Copyright © 2016-2017 LSR 

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|**Pin #**|**Pin #**|**Name**|**Keeper**<br>**(b)**|**Active Mode**|**Low Power**<br>**State/Sleep****_(All_**<br>**_Power Present)_**|**Power Down(c)**<br>**_WL_REG_ON =0_**<br>**_BT_REG_ON = 0_**|**Out of Reset:** **_(VDD_VIO is present)_**|**Out of Reset:** **_(VDD_VIO is present)_**|**Out of Reset:** **_(VDD_VIO is present)_**|
|---|---|---|---|---|---|---|---|---|---|
|**450-0162**<br>**(SiP)**|**450-0168 &**<br>**450-0169**<br>**(Antenna**<br>**Modules)**||||||**_WL_REG_ON =1_**<br>**_BT_REG_ON = 1_**<br>_(before SW download)_|**_WL_REG_ON =1_**<br>**_BT_REG_ON = 0_**|**_WL_REG_ON =0_**<br>**_BT_REG_ON = 1_**|
|47|39|BT_DEV_WAKE|Y|I/O:<br>PU,PD,NoPull<br>(Programmable)|Input:<br>PU,PD,NoPull<br>(Programmable)|High-Z,NoPull|Input; PD|Input; PD|TBD|
|46|40|BT_HOST_WAKE|Y|I/O:<br>PU,PD,NoPull<br>(Programmable)|I/O:<br>PU,PD,NoPull<br>(Programmable)|High-Z, NoPull|Input; PU|Input; PD|TBD|



**Table 5 I/O States** 

The following notations are used: 

- I = Input signal 

- O = Output signal 

- I/O = Input/Output signal 

- PU = Pulled Up 

- PD = Pulled Down 

- NoPull = Neither pulled up nor pulled down 

## Notes: 

## a. PU = Pulled Up, PD = Pulled Down. 

b. N = pad has no keeper.  Y = pad has a keeper.  Keeper is always active except in the power-down state.  If there is no keeper, and it is an input and there is NoPull, then the pad should be driven to prevent leakage due to floating pad, for example, SDIO_CLK. 

c. In the Power-down state (xx_REG_ON = 0): High-Z; NoPull => The pad is disabled because power is not supplied. 

- d. Depending on whether the PCM interface is enabled and the configuration is master or slave mode, it can be either an output or input. 

- e. Depending on whether the I2S interface is enabled and configuration is master or slave mode, it can be either an input or output. 

- f. The GPIO pull states for the active and low-power states are hardware defaults.  They can all be subsequently programmed as a pull-up or pull-down. 

The information in this document is subject to change without notice. 

Copyright © 2016-2017 LSR 

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## **ELECTRICAL SPECIFICATIONS** 

## **Absolute Maximum Ratings** 

|**Parameter**|**Min**|**Max**|**Unit**|
|---|---|---|---|
|Wi-Fi power supply (VBAT)|3.2|3.6|V|
|DIO Power Supply (VDDIO)|1.71|1.89|V|
|Voltage on digital pins|-0.5|1.89|V|
|Operating temperature|-40|+85|ºC|
|Storage temperature|-40|+85|ºC|



**Table 6 Absolute Maximum Ratings** 

## **Recommended Operating Conditions** 

|**Parameter**|**Typical**|**Unit**|
|---|---|---|
|VBAT|3.3|V|
|VDDIO|1.8|V|
|Voltage on digital pins|1.8|V|
|Ambient temperature range|25|ºC|



**Table 7 Recommended Operating Conditions** 

The information in this document is subject to change without notice. 

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## **General Characteristics** 

**DC Characteristics – General Purpose I/O** 

|**Parameter**|**Test Conditions**|**Min**|**Typical**|**Max**|**Unit**|
|---|---|---|---|---|---|
|Logic input low, VIL|VDDIO = 1.8V|-|-|0.35x VDD_VIO|V|
|Logic input high, VIH|VDDIO = 1.8V|0.65x VDD_VIO|-|-|V|
|Logic output low, VOL|VDDIO = 1.8V, 2mA|-|-|0.45|V|
|Logic output high, VOH|VDDIO = 1.8V, 2mA|VDDIO-0.45|-|-|V|



**Table 8 DC Characteristics General Purpose I/O** 

## **RF Characteristics** 

|**Parameter**|**Min**|**Typical**|**Max**|**Unit**|
|---|---|---|---|---|
|2.4 GHz RF frequency range|2400||2472|MHz|
|5 GHz RF frequency range|5180||5835|MHz|
|WLAN RF data rate|1|802.11ac and 802.11a/b/g/n|433.3|Mbps|
|BT RF frequency Range|2402||2480|MHz|
|BT data rate||Bluetooth 4.2 + EDR|||



**Table 9 2.4 GHz RF Characteristics** 

The information in this document is subject to change without notice. 

Copyright © 2016-2017 LSR 

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## **WLAN Power Consumption 2.4 GHZ** 

(TA = +25°C, VBAT = 3.3V, VDDIO = 1.8V) 

|**Parameter**<br>~~a ee~~<br>~~es~~|**Test Conditions**<br>~~ee~~<br>|**Min**<br>~~ee~~<br>~~ee~~<br>|**Typical**<br>~~ee~~<br>~~ee~~|**Max**<br>~~ee~~<br>~~eee~~|**Unit**<br>~~ee~~<br>~~eee~~|
|---|---|---|---|---|---|
|Sleep (idle, unassociated)<br>~~es~~|~~es~~|-<br>~~ee~~<br>~~es~~|5<br>~~ee~~|-<br>~~eee~~|uA<br>~~eee~~|
|11b TX Current<br>~~es~~<br>~~PD~~|11 Mbps, 20 MHz<br><br>~~PD~~|-<br>~~ee ~~<br><br>~~PD~~|320<br> ~~ee ~~<br>~~PD~~|-<br> ~~eee~~<br>~~PD~~|mA<br>~~eee~~<br>~~PD~~|
|11g TX Current|6 Mbps, 20 MHz|-|260|-|mA|
|11g TX Current<br>~~es~~|54 Mbps, 20 MHz<br>~~ee~~|-|230|-|mA|
|11n TX Current<br>~~es~~|MCS0, 20 MHz<br>~~ee~~|-|235|-|mA|
|11n TX Current<br>~~es ~~<br>~~Ge~~|MCS7, 20 MHz<br> ~~ee~~<br>~~Ge~~|-<br>~~Ge~~|205<br>~~Ge~~|-<br>~~Ge~~|mA<br>~~Ge~~|
|11n TX Current<br>~~CG~~|MCS7, 40 MHz<br>~~CG~~|-<br>~~CG~~|185<br>~~CG~~|-<br>~~CG~~|mA<br>~~CG~~|
|11b RX Current<br>~~CG~~<br>~~es~~|11 Mbps, 20 MHz<br>~~CG~~<br>~~es~~|-<br>~~CG~~<br>~~es~~|55<br>~~CG~~<br>~~es~~|-<br>~~CG~~<br>~~es~~|mA<br>~~CG~~<br>~~es~~|
|11g RX Current<br>~~es~~<br>~~es~~|54 Mbps, 20 MHz<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~|55<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~|mA<br>~~es~~<br>~~es~~|
|11n RX Current<br>~~es~~<br>~~a ~~|MCS7, 20 MHz<br>~~es~~<br> ~~ee~~|-<br>~~es~~<br>~~ee~~|55<br>~~es~~<br>~~ee~~|-<br>~~es~~<br>~~ee~~|mA<br>~~es~~<br>~~ee~~|
|11n RX Current<br>~~eG~~|MCS7, 40 MHz<br>~~eG~~|-<br>~~eG~~|70<br>~~eG~~|-<br>~~eG~~|mA<br>~~eG~~|
|Power Down (OFF) Mode<br>~~eC~~|~~eC~~|-<br>~~eC~~|5<br>~~eC~~|-<br>~~eC~~|uA<br>~~eC~~|



**5 GHZ** (TA = +25°C, VBAT = 3.3V, VDDIO = 1.8V) 

|**Parameter**<br>~~a eee~~<br>~~es~~|**Test Conditions**<br>~~eee~~<br>~~ee~~|**Min**<br>~~eee~~<br>~~ee~~|**Typical**<br>~~eee~~|**Max**<br>~~eee~~|**Unit**<br>~~eee~~|
|---|---|---|---|---|---|
|Sleep (idle, unassociated)<br>~~a eee~~<br>~~es~~|~~eee~~<br>~~ee~~|-<br>~~eee~~<br>~~ee~~|5<br>~~eee~~|-<br>~~eee~~|uA<br>~~eee~~|
|11a TX Current<br>~~es ~~<br>~~Rs~~|54 Mbps, 20 MHz<br> ~~ee~~<br>~~Rs~~|-<br>~~ee~~<br>~~Rs~~|275<br>~~Rs~~|-<br>~~Rs~~|mA<br>~~Rs~~|
|11n TX Current<br>~~eG~~|MCS7, 20 MHz<br>~~eG~~<br>~~ee~~|-<br>~~eG~~|250<br>~~eG~~|-<br>~~eG~~|mA<br>~~eG~~|
|11n TX Current<br>~~eG~~<br>~~es~~|MCS7, 40 MHz<br>~~eG~~<br>~~es~~<br>~~ee~~<br>~~ee~~|-<br>~~eG~~<br>~~es~~|215<br>~~eG~~<br>~~es~~|-<br>~~eG~~<br>~~es~~|mA<br>~~eG~~<br>~~es~~|
|11ac TX Current<br>~~es~~<br>~~es~~|MCS9, 40 MHz<br>~~es~~<br>~~ee~~<br>~~es~~<br>~~ee~~|-<br>~~es~~<br>~~es~~|210<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~|mA<br>~~es~~<br>~~es~~|
|11ac TX Current<br>~~es~~<br>~~es~~|MCS9, 80 MHz<br>~~es~~<br>~~ee~~<br>~~es~~|-<br>~~es~~<br>~~es~~|215<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~|mA<br>~~es~~<br>~~es~~|
|11a RX Current<br>~~Rs~~|54 Mbps, 20 MHz<br>~~Rs~~|-<br>~~Rs~~|70<br>~~Rs~~|-<br>~~Rs~~|mA<br>~~Rs~~|
|11n RX Current<br>~~sO~~|MCS7, 20 MHz<br>~~sO~~|-<br>~~sO~~|70<br>~~sO~~|-<br>~~sO~~|mA<br>~~sO~~|
|11n RX Current<br>~~sO~~<br>~~ee~~|MCS7, 40 MHz<br>~~sO~~<br>~~ee~~|-<br>~~sO~~<br>~~ee~~|85<br>~~sO~~<br>~~ee~~|-<br>~~sO~~<br>~~ee~~|mA<br>~~sO~~<br>~~ee~~|
|11ac RX Current<br>~~ee~~<br>~~ee~~|MCS9, 40 MHz<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|85<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|mA<br>~~ee~~<br>~~ee~~|
|11ac RX Current<br>~~ee~~<br>~~ee~~|MCS9, 80 MHz<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|110<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|mA<br>~~ee~~<br>~~ee~~|
|Power Down Mode||-|5|-|uA|



The information in this document is subject to change without notice. 

Copyright © 2016-2017 LSR 

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## **Bluetooth Power Consumption** 

|**Parameter**<br>~~eee~~<br>~~a~~|**Test Conditions**<br>~~eee~~|**Min**<br>~~eee~~<br>~~eee~~|**Typical**<br>~~eee~~<br>~~eee~~|**Max**<br>~~eee~~|**Unit**<br>~~eee~~|
|---|---|---|---|---|---|
|Sleep<br>~~a~~||-<br>~~eee~~|5<br>~~eee~~|-|uA|
|DM5/DH5 TX<br>~~a~~|1 Mbps<br>|-<br>|46<br>|-<br>|mA<br>|
|3DM5/3DH5 TX<br>~~sO~~|3 Mbps<br>~~sO~~|-<br>~~sO~~|44<br>~~sO~~|-<br>~~sO~~|mA<br>~~sO~~|
|DM5/DH5 RX<br>~~sO~~|1 Mbps<br>~~sO~~|-<br>~~sO~~|23<br>~~sO~~|-<br>~~sO~~|mA<br>~~sO~~|
|3DM5/3DH5 RX<br>~~a~~|3 Mbps<br>~~a~~|-<br>~~a~~|23<br>~~a~~|-<br>~~a~~|mA<br>~~a~~|
|Power Down Mode<br>~~a~~|~~a~~|-<br>~~a~~|5<br>~~a~~|-<br>~~a~~|uA<br>~~a~~|
|~~a~~|~~a~~|~~a~~|~~a~~|~~a~~|~~a~~|
|BLE TX<br>~~a~~<br>~~a~~|~~a~~<br>~~a~~|-<br>~~a~~<br>~~a~~|34<br>~~a~~<br>~~a~~|-<br>~~a~~<br>~~a~~|mA<br>~~a~~<br>~~a~~|
|BLE RX<br>~~a~~<br>~~a~~|~~a~~<br>~~a~~|-<br>~~a~~<br>~~a~~|22<br>~~a~~<br>~~a~~|-<br>~~a~~<br>~~a~~|mA<br>~~a~~<br>~~a~~|



**Table 12 Bluetooth Power Consumption** 

## **Power Supply Requirements** 

|**Power Supply Requirements**|**Min**|**Typical**|**Max**|**Unit**|
|---|---|---|---|---|
|VDDIO|1.71|1.8|1.89|V|
|VDDIO Current|-|<1|-|mA|
|VBAT|3.2|3.3|3.6|V|
|VBAT Current|-|-|350|mA|



**Table 13 Power Supply Requirements** 

The information in this document is subject to change without notice. 

Copyright © 2016-2017 LSR 

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**Sterling-LWB5 Module Datasheet** 

## **Power Supply Sequencing** 

WLAN Boot-Up Sequence 

**Figure 9 WLAN Boot-Up Sequence** 

The information in this document is subject to change without notice. 

Copyright © 2016-2017 LSR 

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**Sterling-LWB5 Module Datasheet** 

**Figure 10 Bluetooth Boot-UP Sequence** 

The information in this document is subject to change without notice. 

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## Control Signal Sequencing 

The Sterling-LWB5 has two signals that allow host to control power consumption by enabling or disabling the WLAN, Bluetooth and internal regulator blocs.  The timing values indicated are minimum required values; longer delays are also acceptable. 

• WL_REG_ON: Used by the Power Management Unit (PMU) to power up the WLAN section.  It is also OR-gated with the BT_REG_ON input to control the internal DWM-W097 regulators.  When this pin is high, the regulators are enabled and the WLAN section is out of reset.  When this pin is low the WLAN section is in reset.  If both WL_REG_ON and BT_REG_ON pins are low, the regulators are disabled. 

• BT_REG_ON: Used by the Power Management Unit (PMU) (OR-gated with WL_REG_ON) to power up the internal DWM-W097 regulators.  If both the BT_REG_ON and WL_REG_ON pins are low, the regulators are disabled. When this pin is low the Bluetooth section is in reset. 

## Note: 

For both pins, there should be at least a 10ms time delay between consecutive toggles (when both signals have been driven low).  This is to allow timer for the CBUCK regulator to discharge.  If this delay is not followed, then there may be a VDDIO in-rush current on the order of 36mA during next PMU cold start.  The Sterling-LWB5 has an internal power on reset (POR) circuit.  The device will be held in reset for a maximum of 110ms after VBAT and VDDIO have both passed the POR threshold.  Wait at least 150ms after VBAT and VDDIO are available before initiating SDIO access. 

The information in this document is subject to change without notice. 

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## **Calibration Current Profile** 

Although the Max continuous supply current to the module is <320 mA, when providing power to the module, a power source capable of supplying 750 mA peak current for a duration of ~20 msec is required by the module transmitter during calibration. 

**Figure 11** shows the current profile of the Sterling-LWB5 module during calibration.  If current is limited to <750mA during this process, the module will fail to calibrate. 

**Figure 11 Module RF Calibration Current Profile** 

The information in this document is subject to change without notice. 

Copyright © 2016-2017 LSR 

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## **CRYSTAL OSCILLATOR REQUIREMENTS** 

|**32.768 KHz Oscillator**|**32.768 KHz Oscillator**|
|---|---|
|**Frequency Accuracy**|± 200 ppm|
|**Duty Cycle**|30% - 70%|
|**Input Signal Amplitude**|200 – 3300 mV, p-p|
|**Signal Type**|Square or Sine Wave|
|**Clock Jitter**|<10,000 ppm|



**Table 14 Oscillator Requirements** 

**Note** : A 32.768 KHz crystal is required in order for the module to be fully functional.  The module will not boot without it. 

The information in this document is subject to change without notice. 

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**Figure 12 WLAN = ON, Bluetooth = ON** 

The information in this document is subject to change without notice. 

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**Figure 13 WLAN = OFF, Bluetooth = OFF** 

The information in this document is subject to change without notice. 

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**Figure 14 WLAN = ON, Bluetooth = OFF** 

The information in this document is subject to change without notice. 

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**Sterling-LWB5 Module Datasheet** 

**Figure 15 WLAN = OFF, Bluetooth = ON** 

The information in this document is subject to change without notice. 

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## **WLAN RF Characteristics** 

## 2.4 GHz WLAN Transmitter Characteristics (TA = +25°C, VBAT = 3.3V, VDDIO = 1.8V) 

|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|
|1 Mbps DSSS (b) TX Output Power|1 Mbps BPSK 802.11(b) Mask Compliance<br>35% EVM RMS power over TX packet, 20 MHz|-|16|-|dBm|
|2 Mbps DSSS (b) TX Output Power|2 Mbps QPSK 802.11(b) Mask Compliance<br>35% EVM RMS power over TX packet, 20 MHz|-|16|-|dBm|
|5.5 Mbps DSSS (b) TX Output Power|5.5 Mbps QPSK 802.11(b) Mask Compliance<br>35% EVM RMS power over TX packet, 20 MHz|-|16|-|dBm|
|11 Mbps DSSS (b) TX Output Power|11 Mbps CCK 802.11(b) Mask Compliance<br>35% EVM RMS power over TX packet, 20 MHz|-|16|-|dBm|
|6 Mbps OFDM (g) TX Output Power|6 Mbps BPSK 802.11(g) Mask Compliance<br>-5 dB EVM RMS power over TX packet, 20 MHz|-|13|-|dBm|
|9 Mbps OFDM (g) TX Output Power|9 Mbps BPSK 802.11(g) Mask Compliance<br>-8 dB EVM RMS power over TX packet, 20 MHz|-|13|-|dBm|
|12 Mbps OFDM (g) TX Output Power|12 Mbps QPSK 802.11(g) Mask Compliance<br>-10 dB EVM RMS power over TX packet, 20 MHz|-|13|-|dBm|
|18 Mbps OFDM (g) TX Output Power|18 Mbps QPSK 802.11(g) Mask Compliance<br>-13 dB EVM RMS power over TX packet, 20 MHz|-|13|-|dBm|
|24 Mbps OFDM (g) TX Output Power|24 Mbps 16-QAM 802.11(g) Mask Compliance<br>-16 dB EVM RMS power over TX packet, 20 MHz|-|13|-|dBm|
|36 Mbps OFDM (g) TX Output Power|36 Mbps 16-QAM 802.11(g) Mask Compliance<br>-19 dB EVM RMS power over TX packet, 20 MHz|-|13|-|dBm|
|48 Mbps OFDM (g) TX Output Power|48 Mbps 64-QAM 802.11(g) Mask Compliance<br>-22 dB EVM RMS power over TX packet, 20 MHz|-|13|-|dBm|
|54 Mbps OFDM (g) TX Output Power|54 Mbps 64-QAM 802.11(g) Mask Compliance<br>-25 dB EVM RMS power over TX packet, 20 MHz|-|13|-|dBm|
|MCS0 OFDM (n) TX Output Power, 20 MHz|6.5 Mbps BPSK 802.11(n) Mask Compliance<br>-5 dB EVM RMS power over TX packet, 20 MHz|-|11|-|dBm|
|MCS1 OFDM (n) TX Output Power, 20 MHz|13 Mbps QPSK 802.11(n) Mask Compliance<br>-10 dB EVM RMS power over TX packet, 20 MHz|-|11|-|dBm|
|MCS2 OFDM (n) TX Output Power, 20 MHz|19.5 Mbps QPSK 802.11(n) Mask Compliance<br>-13 dB EVM RMS power over TX packet, 20 MHz|-|11|-|dBm|
|MCS3 OFDM (n) TX Output Power, 20 MHz|26 Mbps 16-QAM 802.11(n) Mask Compliance<br>-16 dB EVM RMS power over TX packet, 20 MHz|-|11|-|dBm|
|MCS4 OFDM (n) TX Output Power, 20 MHz|39 Mbps 16-QAM 802.11(n) Mask Compliance<br>-19 dB EVM RMS power over TX packet, 20 MHz|-|11|-|dBm|
|MCS5 OFDM (n) TX Output Power, 20 MHz|52 Mbps 64-QAM 802.11(n) Mask Compliance<br>-22 dB EVM RMS power over TX packet, 20 MHz|-|11|-|dBm|
|MCS6 OFDM (n) TX Output Power, 20 MHz|58.5 Mbps 64-QAM 802.11(n) Mask Compliance<br>-25 dB EVM RMS power over TX packet, 20 MHz|-|11|-|dBm|
|MCS7 OFDM (n) TX Output Power, 20 MHz|65 Mbps 64-QAM 802.11(n) Mask Compliance<br>-27 dB EVM RMS power over TX packet, 20 MHz|-|11|-|dBm|



**Table 15 2.4 GHz WLAN Transmitter RF Characteristics** 

The information in this document is subject to change without notice. 

Copyright © 2016-2017 LSR 

Page 38 of 81 

330-0208-R1.8 

**Sterling-LWB5 Module Datasheet** 

## **5 GHz WLAN Transmitter Characteristics** 

(TA = +25°C, VBAT = 3.3V, VDDIO = 1.8V) 

|**Parameter**<br>~~eee~~|**Test Conditions**<br>~~eee~~|**Min**<br>~~eee~~|**Typ**<br>~~eee~~|**Max**<br>~~eee~~|**Unit**<br>~~eee~~|
|---|---|---|---|---|---|
|6 Mbps OFDM (a) TX Output Power<br>~~eee~~|6 Mbps BPSK 802.11(a) Mask Compliance<br>-5 dB EVM RMS power over TX packet, 20 MHz<br>~~eee~~|-<br>~~eee~~|15<br>~~eee~~|-<br>~~eee~~|dBm<br>~~eee~~|
|9 Mbps OFDM (a) TX Output Power|9 Mbps BPSK 802.11(a) Mask Compliance<br>-8 dB EVM RMS power over TX packet, 20 MHz|-|15|-|dBm|
|12 Mbps OFDM (a) TX Output Power|12 Mbps QPSK 802.11(a) Mask Compliance<br>-10 dB EVM RMS power over TX packet, 20 MHz|-|15|-|dBm|
|18 Mbps OFDM (a) TX Output Power|18 Mbps QPSK 802.11(a) Mask Compliance<br>-13 dB EVM RMS power over TX packet, 20 MHz|-|15|-|dBm|
|24 Mbps OFDM (a) TX Output Power|24 Mbps 16-QAM 802.11(a) Mask Compliance<br>-16 dB EVM RMS power over TX packet, 20 MHz|-|15|-|dBm|
|36 Mbps OFDM (a) TX Output Power|36 Mbps 16-QAM 802.11(a) Mask Compliance<br>-19 dB EVM RMS power over TX packet, 20 MHz|-|15|-|dBm|
|48 Mbps OFDM (a) TX Output Power|48 Mbps 64-QAM 802.11(a) Mask Compliance<br>-22 dB EVM RMS power over TX packet, 20 MHz|-|15|-|dBm|
|54 Mbps OFDM (a) TX Output Power|54 Mbps 64-QAM 802.11(a) Mask Compliance<br>-25 dB EVM RMS power over TX packet, 20 MHz|-|15|-|dBm|
|~~ee~~|~~ee~~|~~ee~~|~~ee~~|~~ee~~|~~ee~~|
|MCS0 OFDM (n/ac) TX Output Power<br>~~ee~~|6.5 Mbps BPSK 802.11(n/ac) Mask Compliance<br>-5 dB EVM RMS power over TX packet, 20 MHz<br>~~ee~~|-<br>~~ee~~|13<br>~~ee~~|-<br>~~ee~~|dBm<br>~~ee~~|
|MCS1 OFDM (n/ac) TX Output Power|13 Mbps QPSK 802.11(n/ac) Mask Compliance<br>-10 dB EVM RMS power over TX packet, 20 MHz|-|13|-|dBm|
|MCS2 OFDM (n/ac) TX Output Power|19.5 Mbps QPSK 802.11(n/ac) Mask Compliance<br>-13 dB EVM RMS power over TX packet, 20 MHz|-|13|-|dBm|
|MCS3 OFDM (n/ac) TX Output Power|26 Mbps 16-QAM 802.11(n/ac) Mask Compliance<br>-16 dB EVM RMS power over TX packet, 20 MHz|-|13|-|dBm|
|MCS4 OFDM (n/ac) TX Output Power|39 Mbps 16-QAM 802.11(n/ac) Mask Compliance<br>-19 dB EVM RMS power over TX packet, 20 MHz|-|13|-|dBm|
|MCS5 OFDM (n/ac) TX Output Power|52 Mbps 64-QAM 802.11(n/ac) Mask Compliance<br>-22 dB EVM RMS power over TX packet, 20 MHz|-|13|-|dBm|
|MCS6 OFDM (n/ac) TX Output Power|58.5 Mbps 64-QAM 802.11(n/ac) Mask Compliance<br>-25 dB EVM RMS power over TX packet, 20 MHz|-|13|-|dBm|
|MCS7 OFDM (n/ac) TX Output Power|65 Mbps 64-QAM 802.11(n/ac) Mask Compliance<br>-27 dB EVM RMS power over TX packet, 20 MHz|-|13|-|dBm|
|MCS8 OFDM (ac) TX Output Power|78 Mbps 64-QAM 802.11(n/ac) Mask Compliance<br>-30 dB EVM RMS power over TX packet, 20 MHz|-|13|-|dBm|
|~~eS~~|~~eS~~|~~eS~~|~~eS~~|~~eS~~|~~eS~~|
|MCS0 OFDM (ac) TX Output Power<br>~~eS~~|13.5/29.3 Mbps BPSK 802.11(ac) Mask Compliance<br>-5 dB EVM RMS power over TX packet, 40/80 MHz<br>~~eS~~|-<br>~~eS~~|9.5<br>~~eS~~|-<br>~~eS~~|dBm<br>~~eS~~|
|MCS1 OFDM (ac) TX Output Power|27/58.5 Mbps QPSK 802.11(ac) Mask Compliance<br>-10 dB EVM RMS power over TX packet, 40/80 MHz|-|9.5|-|dBm|



The information in this document is subject to change without notice. 

Copyright © 2016-2017 LSR 

Page 39 of 81 

330-0208-R1.8 

**Sterling-LWB5 Module Datasheet** 

|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|
|MCS2 OFDM (ac) TX Output Power|40.5/87.8 Mbps QPSK 802.11(ac) Mask Compliance<br>-13 dB EVM RMS power over TX packet, 40/80 MHz|-|9.5|-|dBm|
|MCS3 OFDM (ac) TX Output Power|54/117 Mbps 16-QAM 802.11(ac) Mask Compliance<br>-16 dB EVM RMS power over TX packet, 40/80 MHz|-|8.5|-|dBm|
|MCS4 OFDM (ac) TX Output Power|81/175.5 Mbps 16-QAM 802.11(ac) Mask Compliance<br>-19 dB EVM RMS power over TX packet, 40/80 MHz|-|9.5|-|dBm|
|MCS5 OFDM (n) TX Output Power|108/234 Mbps 64-QAM 802.11(ac) Mask Compliance<br>-22 dB EVM RMS power over TX packet, 40/80 MHz|-|9.5|-|dBm|
|MCS6 OFDM (n) TX Output Power|121.5/263.3 Mbps 64-QAM 802.11(ac) Mask Compliance<br>-25 dB EVM RMS power over TX packet, 40/80 MHz|-|9.5|-|dBm|
|MCS7 OFDM (n) TX Output Power|135/292.5 Mbps 64-QAM 802.11(ac) Mask Compliance<br>-27 dB EVM RMS power over TX packet, 40/80 MHz|-|9.5|-|dBm|
|MCS8 OFDM (n) TX Output Power|162/351Mbps 256-QAM 802.11(ac) Mask Compliance<br>-30 dB EVM RMS power over TX packet, 40/80 MHz|-|9.5|-|dBm|
|MCS9 OFDM (n) TX Output Power|180/390 Mbps 256-QAM 802.11(ac) Mask Compliance<br>-32 dB EVM RMS power over TX packet, 40/80 MHz|-|9.5|-|dBm|



**Table 16 5 GHz WLAN Transmitter RF Characteristics** 

The information in this document is subject to change without notice. 

Copyright © 2016-2017 LSR 

Page 40 of 81 

330-0208-R1.8 

**Sterling-LWB5 Module Datasheet** 

## **2.4 GHz WLAN Receiver Characteristics** 

(TA = +25°C, VBAT = 3.3V, VDDIO = 1.8V) 

|**Parameter**<br>~~ee~~|**Test Conditions**<br>~~ee~~<br>~~ee~~|**Min**<br>~~ee~~<br>~~ee~~|**Typ**<br>~~ee~~<br>~~ee~~|**Max**<br>~~ee~~<br>~~ee~~|**Unit**<br>~~ee~~<br>~~ee~~|
|---|---|---|---|---|---|
|1 Mbps DSSS (b) RX Sensitivity<br>~~es~~<br>~~PR~~|8% PER, 20 MHz<br>~~ee ~~<br>~~es~~|-<br> ~~ee~~<br>~~es~~|-93<br>~~ee~~<br>~~es~~|-<br>~~ee~~<br>~~es~~|dBm<br>~~ee~~<br>~~es~~|
|2 Mbps DSSS (b) RX Sensitivity<br>~~PR~~<br>~~DR~~|8% PER, 20 MHz<br>|-<br>|-91<br>|-<br>|dBm<br>|
|5.5 Mbps DSSS (b) RX Sensitivity<br>~~PR~~<br>~~DR~~|8% PER, 20 MHz<br>|-<br>|-90<br>|-<br>|dBm<br>|
|11 Mbps DSSS (b) RX Sensitivity<br>~~DRee~~|8% PER, 20 MHz<br>~~ee~~|-<br>~~ee~~|-87<br>~~ee~~|-<br>~~ee~~|dBm<br>~~ee~~|
|~~a~~<br>~~PR~~||||||
|6 Mbps OFDM (g) RX Sensitivity<br>~~PR~~<br>~~DR~~|10% PER, 20 MHz<br>|-<br>|-90<br>|-<br>|dBm<br>|
|9 Mbps OFDM (g) RX Sensitivity<br>~~PR~~<br>~~DR~~|10% PER, 20 MHz<br>|-<br>|-89<br>|-<br>|dBm<br>|
|12 Mbps OFDM (g) RX Sensitivity<br>~~DRGe~~|10% PER, 20 MHz<br>~~Ge~~|-<br>~~Ge~~|-87<br>~~Ge~~|-<br>~~Ge~~|dBm<br>~~Ge~~|
|18 Mbps OFDM (g) RX Sensitivity<br>~~Ge~~<br>~~ee~~|10% PER, 20 MHz<br>~~Ge~~<br>~~ee~~|-<br>~~Ge~~<br>~~ee~~|-85<br>~~Ge~~<br>~~ee~~|-<br>~~Ge~~<br>~~ee~~|dBm<br>~~Ge~~<br>~~ee~~|
|24 Mbps OFDM (g) RX Sensitivity<br>~~ee~~<br>~~es~~|10% PER, 20 MHz<br>~~ee~~<br>~~es~~|-<br>~~ee~~<br>~~es~~|-82<br>~~ee~~<br>~~es~~|-<br>~~ee~~<br>~~es~~|dBm<br>~~ee~~<br>~~es~~|
|36 Mbps OFDM (g) RX Sensitivity<br>~~a~~|10% PER, 20 MHz<br>~~a~~|-<br>~~a~~|-78<br>~~a~~|-<br>~~a~~|dBm<br>~~a~~|
|48 Mbps OFDM (g) RX Sensitivity<br>~~a~~|10% PER, 20 MHz<br>~~a~~|-<br>~~a~~|-74<br>~~a~~|-<br>~~a~~|dBm<br>~~a~~|
|54 Mbps OFDM (g) RX Sensitivity<br>~~Ge~~|10% PER, 20 MHz<br>~~Ge~~|-<br>~~Ge~~|-73<br>~~Ge~~|-<br>~~Ge~~|dBm<br>~~Ge~~|
|~~Ge~~<br>~~ee~~|~~Ge~~<br>~~ee~~|~~Ge~~<br>~~ee~~|~~Ge~~<br>~~ee~~|~~Ge~~<br>~~ee~~|~~Ge~~<br>~~ee~~|
|MCS0 (6.5 Mbps) OFDM (n) RX Sensitivity<br>~~ee~~<br>~~es~~|10% PER, 20 MHz<br>~~ee~~<br>~~es~~|-<br>~~ee~~<br>~~es~~|-90<br>~~ee~~<br>~~es~~|-<br>~~ee~~<br>~~es~~|dBm<br>~~ee~~<br>~~es~~|
|MCS1 (13 Mbps) OFDM (n) RX Sensitivity<br>~~DR~~|10% PER, 20 MHz<br>~~DR~~|-<br>~~DR~~|-88<br>~~DR~~|-<br>~~DR~~|dBm<br>~~DR~~|
|MCS2 (19.5 Mbps) OFDM (n) RX Sensitivity<br>~~ee~~|10% PER, 20 MHz<br>~~ee~~|-<br>~~ee~~|-85<br>~~ee~~|-<br>~~ee~~|dBm<br>~~ee~~|
|MCS3 26 Mbps OFDM (n) RX Sensitivity<br>~~Ge~~|10% PER, 20 MHz<br>~~Ge~~|-<br>~~Ge~~|-82<br>~~Ge~~|-<br>~~Ge~~|dBm<br>~~Ge~~|
|MCS4 39 Mbps OFDM (n) RX Sensitivity<br>~~Ge~~<br>~~a~~|10% PER, 20 MHz<br>~~Ge~~|-<br>~~Ge~~|-78<br>~~Ge~~|-<br>~~Ge~~|dBm<br>~~Ge~~|
|MCS5 52 Mbps OFDM (n) RX Sensitivity<br>~~a~~<br>~~a~~|10% PER, 20 MHz|-|-74|-|dBm|
|MCS6 58.5 Mbps OFDM (n) RX Sensitivity<br>~~ee~~|10% PER, 20 MHz<br>~~ee~~|-<br>~~ee~~|-72<br>~~ee~~|-<br>~~ee~~|dBm<br>~~ee~~|
|MCS7 65 Mbps OFDM (n) RX Sensitivity<br>~~ee~~|10% PER, 20 MHz<br>~~ee~~|-<br>~~ee~~|-71<br>~~ee~~|-<br>~~ee~~|dBm<br>~~ee~~|
|~~Ge~~|~~Ge~~|~~Ge~~|~~Ge~~|~~Ge~~|~~Ge~~|
|802.11b RX Overload Level – 20 MHz<br>~~Ge~~|8% PER, 11 Mbps<br>~~Ge~~<br>~~ee~~|-10<br>~~Ge~~|-<br>~~Ge~~|-<br>~~Ge~~|dBm<br>~~Ge~~|
|802.11g RX Overload Leve l – 20 MHz<br>~~ee~~|10% PER, 54 Mbps<br>~~ee~~<br>~~ee~~|-20<br>~~ee~~|-<br>~~ee~~|-|dBm|
|802.11n RX Overload Level – 20 MHz<br>~~ee~~<br>~~es~~|10% PER, MCS7<br>~~ee~~<br>~~ee~~<br>~~es~~|-20<br>~~ee~~<br>~~es~~|-<br>~~ee~~<br>~~es~~|-<br>~~es~~|dBm<br>~~es~~|



**Table 17 2.4 GHz WLAN Receiver RF Characteristics** 

The information in this document is subject to change without notice. 

Copyright © 2016-2017 LSR 

Page 41 of 81 

330-0208-R1.8 

**Sterling-LWB5 Module Datasheet** 

**5 GHz WLAN Receiver Characteristics** (TA = +25°C, VBAT = 3.3V, VDDIO = 1.8V) 

|**Parameter**<br>~~ee~~|**Test Conditions**<br>~~ee~~<br>~~eee~~|**Min**<br>~~ee~~<br>~~ee~~|**Typ**<br>~~ee~~<br>~~eee~~|**Max**<br>~~ee~~<br>~~eee~~|**Unit**<br>~~ee~~<br>~~eee~~|
|---|---|---|---|---|---|
|6 Mbps OFDM (a) RX Sensitivity<br>~~Pe~~|10% PER, 20 MHz<br>~~eee ~~<br>~~Pe~~|-<br> ~~ee ~~<br>~~Pe~~|-90<br> ~~eee~~<br>~~Pe~~|-<br>~~eee~~<br>~~Pe~~|dBm<br>~~eee~~<br>~~Pe~~|
|9 Mbps OFDM (a) RX Sensitivity<br>~~a~~|10% PER, 20 MHz|-|-89|-|dBm|
|12 Mbps OFDM (a) RX Sensitivity<br>~~a~~|10% PER, 20 MHz|-|-87|-|dBm|
|18 Mbps OFDM (a) RX Sensitivity<br>~~es~~<br>~~a~~|10% PER, 20 MHz<br>~~es~~<br>~~ee~~|-<br>~~es~~|-85<br>~~es~~|-<br>~~es~~|dBm<br>~~es~~|
|24 Mbps OFDM (a) RX Sensitivity<br>~~ee~~<br>~~a~~|10% PER, 20 MHz<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|-82<br>~~ee~~|-<br>~~ee~~|dBm<br>~~ee~~|
|36 Mbps OFDM (a) RX Sensitivity<br>~~a~~|10% PER, 20 MHz<br>~~ee~~|-|-78|-|dBm|
|48 Mbps OFDM (a) RX Sensitivity<br>~~a~~|10% PER, 20 MHz|-|-74|-|dBm|
|54 Mbps OFDM (a) RX Sensitivity<br>~~GG~~|10% PER, 20 MHz<br>~~GG~~|-<br>~~GG~~|-73<br>~~GG~~|-<br>~~GG~~|dBm<br>~~GG~~|
|~~GG~~<br>~~es~~|~~GG~~<br>~~es~~|~~GG~~<br>~~es~~|~~GG~~<br>~~es~~|~~GG~~<br>~~es~~|~~GG~~<br>~~es~~|
|MCS0 (6.5 Mbps) OFDM (n) RX Sensitivity<br>~~es~~<br>~~es~~<br>~~a~~|10% PER, 20 MHz<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~|-90<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~|dBm<br>~~es~~<br>~~es~~|
|MCS1 (13 Mbps) OFDM (n) RX Sensitivity<br>~~a~~<br>~~a~~|10% PER, 20 MHz<br>|-<br>|-87<br>|-<br>|dBm<br>|
|MCS2 (19.5 Mbps) OFDM (n) RX Sensitivity<br>~~a~~<br>~~a~~|10% PER, 20 MHz<br>|-<br>|-85<br>|-<br>|dBm<br>|
|MCS3 26 Mbps OFDM (n) RX Sensitivity<br>~~aGG~~|10% PER, 20 MHz<br>~~GG~~|-<br>~~GG~~|-82<br>~~GG~~|-<br>~~GG~~|dBm<br>~~GG~~|
|MCS4 39 Mbps OFDM (n) RX Sensitivity<br>~~GG~~<br>~~es~~|10% PER, 20 MHz<br>~~GG~~<br>~~es~~|-<br>~~GG~~<br>~~es~~|-78<br>~~GG~~<br>~~es~~|-<br>~~GG~~<br>~~es~~|dBm<br>~~GG~~<br>~~es~~|
|MCS5 52 Mbps OFDM (n) RX Sensitivity<br>~~es~~<br>~~es~~<br>~~Pa~~|10% PER, 20 MHz<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~|-74<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~|dBm<br>~~es~~<br>~~es~~|
|MCS6 58.5 Mbps OFDM (n) RX Sensitivity<br>~~Pa~~|10% PER, 20 MHz|-|-73|-|dBm|
|MCS7 65 Mbps OFDM (n) RX Sensitivity<br>~~Pa~~<br>~~ee~~|10% PER, 20 MHz<br>~~ee~~|-<br>~~ee~~|-71<br>~~ee~~|-<br>~~ee~~|dBm<br>~~ee~~|
|~~po~~|~~po~~|~~po~~|~~po~~|~~po~~|~~po~~|
|MCS0 (6.5 Mbps) OFDM (n) RX Sensitivity<br>~~po~~<br>~~ee~~|10% PER, 40 MHz<br>~~po~~<br>~~ee~~|-<br>~~po~~<br>~~ee~~|-88<br>~~po~~<br>~~ee~~|-<br>~~po~~<br>~~ee~~|dBm<br>~~po~~<br>~~ee~~|
|MCS1 (13 Mbps) OFDM (n) RX Sensitivity<br>~~ee~~<br>~~es~~|10% PER, 40 MHz<br>~~ee~~<br>~~es~~|-<br>~~ee~~<br>~~es~~|-85<br>~~ee~~<br>~~es~~|-<br>~~ee~~<br>~~es~~|dBm<br>~~ee~~<br>~~es~~|
|MCS2 (19.5 Mbps) OFDM (n) RX Sensitivity<br>~~ee~~|10% PER, 40 MHz<br>~~ee~~|-<br>~~ee~~|-82<br>~~ee~~|-<br>~~ee~~|dBm<br>~~ee~~|
|MCS3 26 Mbps OFDM (n) RX Sensitivity<br>~~ee~~|10% PER, 40 MHz<br>~~ee~~|-<br>~~ee~~|-79<br>~~ee~~|-<br>~~ee~~|dBm<br>~~ee~~|
|MCS4 39 Mbps OFDM (n) RX Sensitivity<br>~~po~~|10% PER, 40 MHz<br>~~po~~|-<br>~~po~~|-76<br>~~po~~|-<br>~~po~~|dBm<br>~~po~~|
|MCS5 52 Mbps OFDM (n) RX Sensitivity<br>~~po~~<br>~~ee~~|10% PER, 40 MHz<br>~~po~~<br>~~ee~~|-<br>~~po~~<br>~~ee~~|-71<br>~~po~~<br>~~ee~~|-<br>~~po~~<br>~~ee~~|dBm<br>~~po~~<br>~~ee~~|
|MCS6 58.5 Mbps OFDM (n) RX Sensitivity<br>~~ee~~<br>~~es~~|10% PER, 40 MHz<br>~~ee~~<br>~~es~~|-<br>~~ee~~<br>~~es~~|-70<br>~~ee~~<br>~~es~~|-<br>~~ee~~<br>~~es~~|dBm<br>~~ee~~<br>~~es~~|
|MCS7 65 Mbps OFDM (n) RX Sensitivity<br>~~ee~~|10% PER, 40 MHz<br>~~ee~~|-<br>~~ee~~|-68<br>~~ee~~|-<br>~~ee~~|dBm<br>~~ee~~|



The information in this document is subject to change without notice. 

Copyright © 2016-2017 LSR 

Page 42 of 81 

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**Sterling-LWB5 Module Datasheet** 

**Parameter Test Conditions Min Typ Max Unit** ~~eeee ee~~ 802.11(ac) MCS0 (6.5 Mbps) OFDM (n) RX Sensitivity 10% PER, 20 MHz - -89 - dBm ~~ss~~ 802.11(ac) MCS1 (13 Mbps) OFDM (n) RX Sensitivity 10% PER, 20 MHz - -87 - dBm ~~PO~~ 802.11(ac) MCS2 (19.5 Mbps) OFDM (n) RX Sensitivity 10% PER, 20 MHz - -85 - dBm ~~ee~~ 802.11(ac) MCS3 (26 Mbps) OFDM (n) RX Sensitivity 10% PER, 20 MHz - -82 - dBm ~~ee~~ 802.11(ac) MCS4 (39 Mbps) OFDM (n) RX Sensitivity 10% PER, 20 MHz - -78 - dBm ~~esee~~ 802.11(ac) MCS5 (52 Mbps) OFDM (n) RX Sensitivity 10% PER, 20 MHz - -74 - dBm 802.11(ac) MCS6 (58.5 Mbps) OFDM (n) RX Sensitivity 10% PER, 20 MHz - -72 - dBm ~~PO~~ 802.11(ac) MCS7 (65 Mbps) OFDM (n) RX Sensitivity 10% PER, 20 MHz - -71 - dBm ~~en~~ 802.11(ac) MCS8 (78 Mbps) OFDM (n) RX Sensitivity 10% PER, 20 MHz - -65 - dBm ~~eeee es~~ 802.11(ac) MCS0 (13.5 Mbps) OFDM (n) RX Sensitivity 10% PER, 40 MHz - -88 - dBm ~~a~~ 802.11(ac) MCS1 (27 Mbps) OFDM (n) RX Sensitivity 10% PER, 40 MHz - -85 - dBm ~~eG~~ 802.11(ac) MCS2 (40.5 Mbps) OFDM (n) RX Sensitivity 10% PER, 40 MHz - -82 - dBm ~~ee~~ 802.11(ac) MCS3 (54 Mbps) OFDM (n) RX Sensitivity 10% PER, 40 MHz - -79 - dBm ~~ee~~ 802.11(ac) MCS4 (81 Mbps) OFDM (n) RX Sensitivity 10% PER, 40 MHz - -76 - dBm ~~es~~ 802.11(ac) MCS5 (108 Mbps OFDM (n) RX Sensitivity 10% PER, 40 MHz - -71 - dBm ~~ee~~ 802.11(ac) MCS6 (121.5 Mbps) OFDM (n) RX Sensitivity 10% PER, 40 MHz - -70 - dBm ~~GG~~ 802.11(ac) MCS7 (135 Mbps) OFDM (n) RX Sensitivity 10% PER, 40 MHz - -67 - dBm ~~es~~ 802.11(ac) MCS8 (162 Mbps) OFDM (n) RX Sensitivity 10% PER, 40 MHz - -64 - dBm ~~es~~ 802.11(ac) MCS9 (180 Mbps) OFDM (n) RX Sensitivity 10% PER, 40 MHz - -61 - dBm ~~es ee~~ MCS0 (29.3 Mbps) OFDM (n) RX Sensitivity 10% PER, 80 MHz - -84 - dBm ~~eG~~ MCS1 (58.5 Mbps) OFDM (n) RX Sensitivity 10% PER, 80 MHz - -81 - dBm ~~es~~ MCS2 (87.8 Mbps) OFDM (n) RX Sensitivity 10% PER, 80 MHz - -78 - dBm ~~es~~ MCS3 (117 Mbps) OFDM (n) RX Sensitivity 10% PER, 80 MHz - -75 - dBm ~~es~~ MCS4 (175.5 Mbps) OFDM (n) RX Sensitivity 10% PER, 80 MHz - -72 - dBm ~~ee~~ MCS5 (234 Mbps) OFDM (n) RX Sensitivity 10% PER, 80 MHz - -68 - dBm ~~ee~~ MCS6 (263.3 Mbps) OFDM (n) RX Sensitivity 10% PER, 80 MHz - -65 - dBm ~~es~~ MCS7 (292.5 Mbps) OFDM (n) RX Sensitivity 10% PER, 80 MHz - -64 - dBm ~~es~~ MCS8 (351 Mbps) OFDM (n) RX Sensitivity 10% PER, 80 MHz - -59 - dBm ~~DG~~ MCS9 (390 Mbps) OFDM (n) RX Sensitivity 10% PER, 80 MHz - -56 - dBm ~~a~~ 

The information in this document is subject to change without notice. 

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|**Parameter**|**Test Conditions**|**Min**|**Typical**|**Max**|**Unit**|
|---|---|---|---|---|---|
|802.11a RX Overload Level – 20 MHz|10% PER, All Rates|-30|-|-|dBm|
|802.11n RX Overload Level– 20 MHz|10% PER, All Rates|-30|-|-|dBm|
|802.11n RX Overload Level– 40 MHz|10% PER, All Rates|-30|-|-|dBm|
|802.11ac RX Overload Level – 20 MHz|10% PER, All Rates|-30|-|-|dBm|
|802.11ac RX Overload Level– 40 MHz|10% PER, All Rates|-30|-|-|dBm|
|802.11ac RX Overload Level– 80 MHz|10% PER, All Rates|-30|-|-|dBm|



**Table 18 5 GHz WLAN Receiver RF Characteristics** 

The information in this document is subject to change without notice. 

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## **Bluetooth RF Characteristics** 

## **Bluetooth Transmitter Characteristics** 

(TA = +25°C, VBAT = 3.3V, VDDIO = 1.8V) 

|**Parameter**|**Test Conditions**|**Min**|**Typical**|**Max**|**Unit**|
|---|---|---|---|---|---|
|Transmit Frequency|Tamb= +25°C, 3.3V|2402|-|2480|MHz|
|Bluetooth 1 Mbps GFSK Transmit Power|Tamb= +25°C, 3.3V|-|8|-|dBm|
|Bluetooth EDR Transmit Power|Tamb= +25°C, 3.3V|-|7|-|dBm|
|Bluetooth EDR Relative Transmit Power|Tamb= +25°C, 3.3V|-4||1|dB|
|Bluetooth Low Energy (BLE) Transmit Power|Tamb= +25°C, 3.3V|-|6|-|dBm|



**Table 19 Bluetooth Transmitter RF Characteristics** 

## **Bluetooth Receiver Characteristics** 

(TA = +25°C, VBAT = 3.3V, VDDIO = 1.8V) 

|**Parameter**|**Test Conditions**|**Min**|**Typical**|**Max**|**Unit**|
|---|---|---|---|---|---|
|Receive Frequency|Tamb= +25°C, 3.3V|2402|-|2480|MHz|
|Bluetooth 1 Mbps GFSK Sensitivity|BER=0.1%|-|-88|-|dBm|
|Bluetooth 2 Mbps EDR Sensitivity|BER=0.01%|-|-90|-|dBm|
|Bluetooth 3 Mbps EDR Sensitivity|BER=0.01%|-|-84.5|-|dBm|
|Bluetooth Low Energy (BLE) Sensitivity|Tamb= +25°C, 3.3V|-|-92|-|dBm|



**Table 20 Bluetooth Receiver RF Characteristics** 

The information in this document is subject to change without notice. 

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## **WLAN HOST INTERFACE** 

## **SDIO Interface** 

The Sterling-LWB5 module SDIO interface supports SDIO Version 3.0, including the UHS-1 modes. 

|**PIN**|**4 Bit Mode**|**1 Bit Mode**|
|---|---|---|
|18|DATA0|DATA|
|19|DATA1|IRQ|
|20|DATA2|RW|
|21|DATA3|N/C|
|15|CLK|CLK|
|17|CMD|CMD|



**Table 21 SDIO Pins** 

## **DC Characteristics – SDIO Interface Pins** 

|**Parameter**|**Test Conditions**|**Min**|**Typical**|**Max**|**Unit**|
|---|---|---|---|---|---|
|Logic input low, VIL|VDDIO = 1.8V|-|-|0.58|V|
|Logic input high, VIH|VDDIO = 1.8V|1.27|-|-|V|
|Logic output low, VOL|VDDIO = 1.8V, 2mA|-|-|0.45|V|
|Logic output high, VOH|VDDIO = 1.8V, 2mA|1.4|-|-|V|



**Figure 16 DC Characteristics SDIO I/O** 

The information in this document is subject to change without notice. 

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## **Figure 17 Signal Connections to SDIO Host (SD 4-Bit Mode)** 

The information in this document is subject to change without notice. 

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**Figure 18 Signal Connections to SDIO Host (SD 1-Bit Mode)** 

The information in this document is subject to change without notice. 

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## **BLUETOOTH UART HOST INTERFACE** 

## **Overview** 

The Sterling-LWB5 uses a single UART for Bluetooth. The UART is a standard 4-wire interface (RX, TX, RTS, and CTS) with adjustable baud rates from 9600 bps to 4.0 Mbps. The interface features an automatic baud rate detection capability that returns a baud rate selection. Alternatively, the baud rate may be selected through a vendor-specific UART HCI command. The UART also supports the 3-wire _UART Transport Layer_ which reduces the number of signal lines required by eliminating the CTS and RTS signals. 

**Figure 19 UART Connection from Sterling-LWB5 to Host** 

**DC Characteristics – SDO Interface Pins** 

|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|
|Input high voltage|VDDIO = 1.8V|1.7|-||V|
|Input low voltage|VDDIO = 1.8V|-|-|0.63|V|
|Output high voltage @2mA|VDDIO = 1.8V|1.4|-||V|
|Output low voltage @2mA|VDDIO = 1.8V|-|-|0.45|V|



**Table 22 Bluetooth (UART) DC Characteristics** 

The information in this document is subject to change without notice. 

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**Figure 20 UART Timing** 

The information in this document is subject to change without notice. 

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## **Soldering Recommendations** 

## **Reflow for Lead Free Solder Paste** 

- Optimal solder reflow profile depends on solder paste properties and should be optimized as part of an overall process development. 

- It is important to provide a solder reflow profile that matches the solder paste supplier's recommendations. 

- Temperature ranges beyond that of the solder paste supplier's recommendation could result in poor solderability. 

- All solder paste suppliers recommend an ideal reflow profile to give the best solderability. 

## **Recommended Reflow Profile for Lead Free Solder** 

**Figure 21 Recommended Soldering Profile** 

**Note: The quality of solder joints on the surface mount pads where they contact the host board should meet the appropriate IPC Specification.  See IPC-A-610-D Acceptability of Electronic Assemblies, section 8.2.1 “Bottom Only Terminations.”** 

The information in this document is subject to change without notice. 

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## **CLEANING** 

## **SHIPPING, HANDLING, AND STORAGE** 

In general, cleaning the populated modules is strongly discouraged.  Residuals under the module cannot be easily removed with any cleaning process. 

- Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module.  The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads.  Water could also damage any stickers or labels. 

- Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the RF shield, which is not accessible for post-washing inspection.  The solvent could also damage any stickers or labels. 

- Ultrasonic cleaning could damage the module permanently. 

## **OPTICAL INSPECTION** 

After soldering the Module to the host board, consider optical inspection to check the following: 

- Proper alignment and centering of the module over the pads. 

- Proper solder joints on all pads. 

- Excessive solder or contacts to neighboring pads, or vias. 

## **Shipping** 

Bulk orders of the Sterling-LWB5 SIP module are delivered in reels of 1000.  Bulk orders for the U.FL and chip antenna modules are delivered in reels of 1000. 

## **Handling** 

The Sterling-LWB5 modules contain a highly sensitive electronic circuitry.  Handling without proper ESD protection may damage the module permanently. 

## **Moisture Sensitivity Level (MSL)** 

Per J-STD-020, devices rated as MSL 4 and not stored in a sealed bag with desiccant pack should be baked prior to use. 

Devices are packaged in a Moisture Barrier Bag with a desiccant pack and Humidity Indicator Card (HIC). Devices that will be subjected to reflow should reference the HIC and J-STD-033 to determine if baking is required. 

If baking is required, refer to J-STD-033 for bake procedure. 

## **Storage** 

## **REWORK** 

The Sterling-LWB5 module can be unsoldered from the host board if the Moisture Sensitivity Level (MSL) requirements are met as described in this datasheet. 

**Never attempt a rework on the module itself, e.g. replacing individual components.  Such actions will terminate warranty coverage.** 

Per J-STD-033, the shelf life of devices in a Moisture Barrier Bag is 12 months at <40ºC and <90% room humidity (RH). 

Do not store in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX. 

Do not store in direct sunlight. 

The product should not be subject to excessive mechanical shock. 

The information in this document is subject to change without notice. 

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## **Repeated Reflow Soldering** 

**Only a single reflow soldering process is encouraged for host boards.** 

The information in this document is subject to change without notice. 

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## **AGENCY CERTIFICATIONS** 

TODO: All certifications are currently pending.  When completed this statement will be removed. 

FCC ID: TFB-1004, 15.247 

IC ID: 5969A-1004, RSS 247 

CE: Compliant to standards EN 60950-1, EN 300 328, and EN 301 489 

Giteki:  TODO: Add Giteki number 

RCM 

## **AGENCY STATEMENTS** 

## **Federal Communication Commission Interference Statement** 

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.  These limits are designed to provide reasonable protection against harmful interference in a residential installation.  This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.  However, there is no guarantee that interference will not occur in a particular installation.  If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: 

- Reorient or relocate the receiving antenna. 

- Increase the separation between the equipment and receiver. 

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. 

- Consult the dealer or an experienced radio/TV technician for help. 

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. 

**FCC CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.** 

The information in this document is subject to change without notice. 

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## **Industry Canada Statements** 

This Device complies with Industry Canada License-exempt RSS standard(s).  Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. 

To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication. 

This device has been designed to operate with the antenna(s) listed below, and having a maximum gain of 2.0/2.0 dBi (LSR Dipole), 2.5/3.0 dBi (LSR FlexPIFA), and 1.0/4.0 dBi (Johanson Chip).  Antennas not included in this list or having a gain greater than 2.0/2.0 dBi, 2.5/3.0 dBi, and 1.0/4.0 dBi are strictly prohibited for use with this device.  The required antenna impedance is 50 ohms. 

List of all Antennas Acceptable for use with the Transmitter 

- 1) LSR 001-0009 center-fed 2.4 GHz and 5.5 GHz dipole antenna and LSR 080-0001 U.FL to Reverse Polarity SMA connector cable. 

- 2) LSR 001-0016 2.4 GHz and 5.5 GHz FlexPIFA antenna. 

- 3) Johanson Technology 2450AD14A5500 chip antenna. 

Cet appareil est conforme avec Industrie Canada , exempts de licence standard RSS (s).  L'opération est soumise aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences et (2) cet appareil doit accepter toute interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement de l'appareil. 

Pour réduire le risque d'interférence aux autres utilisateurs, le type d'antenne et son gain doiventêtre choisis de manière que la puissance isotrope rayonnée équivalente (PIRE) ne dépasse pascelle permise pour une communication réussie. 

Cet appareil a été conçu pour fonctionner avec l'antenne (s) ci-dessous, et ayant un gain maximum de 2,0/2,0 dBi (LSR Dipole), 2,5/3,0 dBi (LSR FlexPIFA), et 1,0/4,0 dBi (Johanson Chip).  Antennes pas inclus dans cette liste ou présentant un gain supérieure à 2,0/2,0 dBi, 2,5/3,0 dBi, et 1,0/4,0 dBi sont strictement interdits pour une utilisation avec cet appareil. L'impédance d'antenne requise est de 50 ohms. 

Liste de toutes les antennes acceptables pour une utilisation avec l'émetteur 

- 1) Antenne LSR 001-0009 centre-alimenté 2,4 GHz et 5,5 GHz dipôle et LSR 080-0001 U.FL à Inverse câble connecteur SMA à polarité. 

- 2) LSR 001-0016 2,4 GHZ et 5,5 GHz antenne FlexPIFA. 

- 3) Antenne de puce Johanson Technology 2450AD14A5500. 

The information in this document is subject to change without notice. 

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## **OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS** 

The Sterling-LWB5 Module has been certified for integration into products only by OEM integrators under the following conditions: 

To comply with FCC and Industry Canada RF exposure limits for general population / uncontrolled exposure, the antenna must be installed to provide a separation distance of at least 70 mm from all persons and operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi-transmitter product procedures. 

As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). 

**IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or colocation with another transmitter), then the FCC and Industry Canada authorizations are no longer considered valid and the FCC ID and IC Certification Number cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC and Industry Canada authorization.** 

Le module de Sterling-LWB5 a été certifié pour l'intégration dans des produits uniquement par des intégrateurs OEM dans les conditions suivantes: 

Pour se conformer aux limites d'exposition aux RF de la FCC et d'Industrie Canada pour la population générale / exposition non contrôlée, l'antenne doit être installé pour fournir une distance de séparation d'au moins 70 mm de toutes les personnes et fonctionnant conjointement avec une autre antenne ou émetteur, sauf en conformité avec la FCC procédures de produits multi- émetteurs. 

Tant que les deux conditions précitées sont réunies, les tests de transmetteurs supplémentaires ne seront pas tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leur produit final pour toutes les exigences de conformité supplémentaires requis avec ce module installé (par exemple, les émissions appareil numérique, les exigences de périphériques PC, etc.) 

**NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou de co-implantation avec un autre émetteur), puis la FCC et Industrie autorisations Canada ne sont plus considérés comme valides et l'ID de la FCC et IC numéro de certification ne peut pas être utilisé sur la produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'un distincte de la FCC et Industrie Canada l'autorisation.** 

The information in this document is subject to change without notice. 

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## **OEM LABELING REQUIREMENTS FOR END-PRODUCT** 

The Sterling-LWB5 module is labeled with its own FCC ID and IC Certification Number.  The FCC ID and IC certification numbers are not visible when the module is installed inside another device, as such the end device into which the module is installed must display a label referring to the enclosed module.  The final end product must be labeled in a visible area with the following: 

## “ **Contains Transmitter Module FCC ID: TFB-1004”** 

## “ **Contains Transmitter Module IC: 5969A-1004”** 

or 

## “ **Contains FCC ID: TFB-1004”** 

## “ **Contains IC: 5969A-1004”** 

The OEM of the Sterling-LWB5 Module must only use the approved antenna(s) listed above, which have been certified with this module. 

Le module de Sterling-LWB5 est étiqueté avec son propre ID de la FCC et IC numéro de certification. L'ID de la FCC et IC numéros de certification ne sont pas visibles lorsque le module est installé à l'intérieur d'un autre appareil, comme par exemple le terminal dans lequel le module est installé doit afficher une etiquette faisant référence au module ci-joint. Le produit final doit être étiqueté dans un endroit visible par le suivant: 

**“Contient Module émetteur FCC ID: TFB-1004" “Contient Module émetteur IC: 5969A-1004"** 

## ou 

## **“Contient FCC ID: TFB-1004" “Contient IC: 5969A-1004"** 

Les OEM du module Sterling-LWB5 ne doit utiliser l'antenne approuvée (s) ci-dessus, qui ont été certifiés avec ce module. 

The information in this document is subject to change without notice. 

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## **OEM END PRODUCT USER MANUAL STATEMENTS** 

The OEM integrator should not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. 

## **The user manual for the end product must include the following information in a prominent location:** 

To comply with FCC and Industry Canada RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 70 mm from all persons and operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi-transmitter product procedures. 

Other user manual statements may apply. 

L'intégrateur OEM ne devraient pas fournir des informations à l'utilisateur final sur la façon d'installer ou de supprimer ce module RF ou modifier les paramètres liés RF dans le manuel utilisateur du produit final. 

## **Le manuel d'utilisation pour le produit final doit comporter les informations suivantes dans unendroit bien en vue:** 

Pour se conformer aux limites d'exposition aux RF de la FCC et d'Industrie Canada pour la population générale / exposition non contrôlée, l'antenne(s) utilisée pour ce transmetteur doit être installé pour fournir une distance de séparation d'au moins 70 mm de toutes les personnes et fonctionnant conjointement avec une autre antenne ou émetteur, sauf en conformité avec les procédures de produits multi- émetteur FCC. 

Autres déclarations manuel de l'utilisateur peuvent s'appliquer. 

The information in this document is subject to change without notice. 

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## **EUROPE** 

## **CE Notice** 

TODO: The European testing is not yet completed so the following information is a place holder only.  When the testing is complete this statement will be removed. 

This device has been tested and certified for use in the European Union.  See the Declaration of Conformity (DOC) for specifics. 

If this device is used in a product, the OEM has responsibility to verify compliance of the final product to the EU standards.  A Declaration of Conformity must be issued and kept on file as described in the Radio and Telecommunications Terminal Equipment (R&TTE) Directive. 

The ‘CE’ mark must be placed on the OEM product per the labeling requirements of the Directive. 

## **Declaration of Conformity (DOC)** 

TODO: The DOC is not yet available.  When the European testing is complete this statement will be removed. Lo 

This DOC can be downloaded from the LSR Website. 

## **BLUETOOTH SIG QUALIFICATION** 

## **Overview** 

The Sterling LWB5 module is listed on the Bluetooth SIG website as a qualified Controller Subsystem. 

|**Design Name**<br>450-0162<br>~~**e**e~~|**Design Name**<br>450-0162<br>~~**e**e~~|**Design Name**<br>450-0162<br>~~**e**e~~|**Design Name**<br>450-0162<br>~~**e**e~~|**Owner**<br>**Declaration ID **<br>Laird<br>D035148<br>~~esSs ~~|**Owner**<br>**Declaration ID **<br>Laird<br>D035148<br>~~esSs ~~|**Link to listing on the SIG website**<br>Sterling LWB5 450-0162 (Base Module)<br> ~~e~~|
|---|---|---|---|---|---|---|
|||450-0169||Laird<br>D035148||SterlingLWB5 450-0169 (ChipAntenna Module)|
|||450-0168||Laird<br>D035148||Sterling LWB5 450-0168 (U.FL Module)|
|||450-0171||Laird<br>D035148||SterlingLWB5 450-0171 (U.FL Dev Board)|
|||450-0172||Laird<br>D035148||Sterling LWB5 450-0171 (Chip Antenna Dev Board)|



It is a mandatory requirement of the Bluetooth Special Interest Group (SIG) that every product implementing Bluetooth technology has a Declaration ID. Every Bluetooth design is required to go through the qualification process, even when referencing a Bluetooth Design that already has its own Declaration ID. The Qualification Process requires each company to register as a member of the Bluetooth SIG – www.bluetooth.org 

The following is a link to the Bluetooth Registration page: https://www.bluetooth.org/login/register/ 

For each Bluetooth Design it is necessary to purchase a Declaration ID. This can be done before starting the new qualification, either through invoicing or credit card payment. The fees for the Declaration ID will depend on your membership status, please refer to the following webpage: 

## https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees 

For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to the following SIG document, (login is required to views this document): 

The information in this document is subject to change without notice. 

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https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698&vId=317486 

## **Qualification Steps When Referencing a Laird Controller Subsystem Design** 

To qualify your product when referencing a Laird Controller Subsystem design, follow these steps: 

1. To start a listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm 

**Note:** A user name and password are required to access this site. 

2. In step 1, select the option, New Listing and Reference a Qualified Design. 

3. Enter _97564_ in the Controller Subsystem table entry. 

4. Enter your complimentary Host Subsystem and optional Profile Subsystem in the table entry. 

5. Select your pre-paid Declaration ID from the drop down menu or go to the Purchase Declaration ID page. 

   - **Note:** Unless the Declaration ID is pre-paid or purchased with a credit card, you cannot proceed until the SIG invoice is paid. 

6. Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help document accessible from the site. 

Your new design will be listed on the SIG website and you can print your Certificate and SDoC. 

For further information please refer to the following training material: 

https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates 

If you require assistance with the qualification process please contact our recommended Bluetooth Qualification Expert (BQE), Steve Flooks, steve.flook@eurexuk.com. 

## **Additional Assistance** 

Please contact your local sales representative or our support team for further assistance: 

Laird Technologies Connectivity Products Business Unit 

Support Centre: http://ews-support.lairdtech.com 

Email: wireless.support@lairdtech.com 

Phone: Americas: +1-800-492-2320 

Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 

Web: http://www.lairdtech.com/bluetooth 

The information in this document is subject to change without notice. 

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## **CHIP ANTENNA PERFORMANCE** 

## **Summary of Antenna Performance** 

|Item<br>Channel<br>Frequency (MHz) Ptx(dBm) TRP(dBm) Power Gain(dB) Expected Power Gain(dB)<br>1<br>1<br>2412<br>12.4<br>10.6<br>-1.8<br>-3.5<br>2<br>6<br>2437<br>12.1<br>10.4<br>-1.7<br>-3.5<br>3<br>11<br>2462<br>11.9<br>9.6<br>-2.3<br>-3.5<br>4<br>36<br>5180<br>10.6<br>7.2<br>-3.3<br>-2.5<br>5<br>100<br>5500<br>11.8<br>7.6<br>-4.2<br>-2.5<br>6<br>165<br>5825<br>11.1<br>3.1<br>-8.0<br>-2.5<br>~~Ps~~<br>~~es Rs~~<br>~~a~~<br>~~es~~<br>~~es~~<br>~~ee~~<br>~~es es Os I~~<br>~~ee es QO~~<br>~~I~~<br>~~es~~<br>~~es~~<br>~~es QO~~<br>~~I (OO~~<br>~~ee sD ODOD~~<br>~~Ps~~<br>~~es es~~|
|---|
|Item<br>Channel Frequency (MHz) Ptx(dBm) Peak EIRP(dBm)<br>Peak Gain(dB)<br>Expected Peak Gain(dB)<br>1<br>1<br>2412<br>12.4<br>13.6<br>1.2<br>1.0<br>2<br>6<br>2437<br>12.1<br>13.3<br>1.2<br>1.0<br>3<br>11<br>2462<br>11.9<br>12.2<br>0.4<br>1.0<br>4<br>36<br>5180<br>10.6<br>9.9<br>-0.7<br>4.0<br>5<br>100<br>5500<br>11.8<br>10.6<br>-1.2<br>4.0<br>6<br>165<br>5825<br>11.1<br>6.3<br>-4.8<br>4.0<br>~~RsRs ss~~<br>~~a~~<br>~~Re~~<br>~~ee~~<br>~~es~~<br>~~es~~<br>~~ss(ON~~<br>~~(OO~~<br>~~es es~~<br>~~es esQO~~<br>~~QO~~<br>~~es es es se~~<br>~~(Oe~~<br>~~ee ~~~~**es**~~<br>~~eses~~<br>~~Ps~~<br>~~esS(O~~<br>~~QO~~|



**Table 23 Typical Antenna Performance** 

The information in this document is subject to change without notice. 

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## **2.4 GHz Radiated Performance** 

## **Channel 1: 2412 MHz** 

## **EIRP Azimuth Cut** 

**==> picture [600 x 169] intentionally omitted <==**

**----- Start of picture text -----**<br>
EIRP (dBm)  - Vertical Polarization at 2412.0 (MHz) Theta (deg) EIRP (dBm) - Horizontal Polarization at 2412.0 (MHz) Theta (deg) Total EIRP (dBm) at 2412.0 (MHz) Theta (deg)<br>90  15 90  15 90  15<br>20  30 20  30 20  30<br>120 60  45 120 60  45 120 60  45<br> 60  60  60<br>10  75 10  75 10  75<br> 90  90  90<br>105 105 105<br>0 120 0 120 0 120<br>150 30 135 150 30 135 150 30 135<br>150 150 150<br>-10 165 -10 165 -10 165<br>-20 -20 -20<br>180 0 180 0 180 0<br>210 330 210 330 210 330<br>240 300 240 300 240 300<br>270 270 270<br>EIRP Summary (dBm) at 2412.0 (MHz)       min: -10.8 (dBm)      max: +13.6 (dBm)     avg: 9.8 (dBm) EIRP Summary (dBm) at 2412.0 (MHz)       min: -22.8 (dBm)      max: +9.8 (dBm)     avg: 2.8 (dBm) EIRP Summary (dBm) at 2412.0 (MHz)       min: -0.6 (dBm)      max: +13.7 (dBm)     avg: 10.6 (dBm)<br>**----- End of picture text -----**<br>


**Figure 22 Vertical, Horizontal, and Total Patterns** 

The information in this document is subject to change without notice. 

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## **3D Plots:** 

c 

**Figure 23 Vertical, Horizontal, and Total Plots** 

The information in this document is subject to change without notice. 

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## **Channel 6: 2437 MHz** 

## **EIRP Azimuth Cut** 

**==> picture [600 x 169] intentionally omitted <==**

**----- Start of picture text -----**<br>
EIRP (dBm)  - Vertical Polarization at 2437.0 (MHz) Theta (deg) EIRP (dBm) - Horizontal Polarization at 2437.0 (MHz) Theta (deg) Total EIRP (dBm) at 2437.0 (MHz) Theta (deg)<br>90  15 90  15 90  15<br>20  30 20  30 20  30<br>120 60  45 120 60  45 120 60  45<br> 60  60  60<br>10  75 10  75 10  75<br> 90  90  90<br>105 105 105<br>0 120 0 120 0 120<br>150 30 135 150 30 135 150 30 135<br>150 150 150<br>-10 165 -10 165 -10 165<br>-20 -20 -20<br>180 0 180 0 180 0<br>210 330 210 330 210 330<br>240 300 240 300 240 300<br>270 270 270<br>EIRP Summary (dBm) at 2437.0 (MHz)       min: -9.9 (dBm)      max: +13.3 (dBm)     avg: 9.6 (dBm) EIRP Summary (dBm) at 2437.0 (MHz)       min: -20.8 (dBm)      max: +10.3 (dBm)     avg: 2.7 (dBm) EIRP Summary (dBm) at 2437.0 (MHz)       min: -1.9 (dBm)      max: +13.4 (dBm)     avg: 10.4 (dBm)<br>**----- End of picture text -----**<br>


**Figure 24 Vertical, Horizontal, and Total Patterns** 

The information in this document is subject to change without notice. 

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## **3D Plots:** 

**Figure 25 Vertical, Horizontal, and Total Plots** 

The information in this document is subject to change without notice. 

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## **Channel 11: 2462 MHz** 

## **EIRP Azimuth Cut** 

**==> picture [600 x 168] intentionally omitted <==**

**----- Start of picture text -----**<br>
EIRP (dBm)  - Vertical Polarization at 2462.0 (MHz) Theta (deg) EIRP (dBm) - Horizontal Polarization at 2462.0 (MHz) Theta (deg) Total EIRP (dBm) at 2462.0 (MHz) Theta (deg)<br>90  15 90  15 90  15<br>20  30 20  30 20  30<br>120 60  45 120 60  45 120 60  45<br> 60  60  60<br>10  75 10  75 10  75<br> 90  90  90<br>105 105 105<br>0 120 0 120 0 120<br>150 30 135 150 30 135 150 30 135<br>150 150 150<br>-10 165 -10 165 -10 165<br>-20 -20 -20<br>180 0 180 0 180 0<br>210 330 210 330 210 330<br>240 300 240 300 240 300<br>270 270 270<br>EIRP Summary (dBm) at 2462.0 (MHz)       min: -8.5 (dBm)      max: +12.2 (dBm)     avg: 8.7 (dBm) EIRP Summary (dBm) at 2462.0 (MHz)       min: -23.2 (dBm)      max: +9.7 (dBm)     avg: 2.1 (dBm) EIRP Summary (dBm) at 2462.0 (MHz)       min: -3.8 (dBm)      max: +12.3 (dBm)     avg: 9.6 (dBm)<br>**----- End of picture text -----**<br>


**Figure 26 Vertical, Horizontal, and Total Patterns** 

The information in this document is subject to change without notice. 

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## **3D Plots:** 

**Figure 27 Vertical, Horizontal, and Total Plots** 

The information in this document is subject to change without notice. 

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## **5 GHz Radiated Performance** 

## **Channel 36: 5180 MHz** 

## **EIRP Azimuth Cut** 

**==> picture [600 x 169] intentionally omitted <==**

**----- Start of picture text -----**<br>
EIRP (dBm)  - Vertical Polarization at 5180.0 (MHz) Theta (deg) EIRP (dBm) - Horizontal Polarization at 5180.0 (MHz) Theta (deg) Total EIRP (dBm) at 5180.0 (MHz) Theta (deg)<br>90  15 90  15 90  15<br>20  30 20  30 20  30<br>120 60  45 120 60  45 120 60  45<br> 60  60  60<br>10  75 10  75 10  75<br> 90  90  90<br>105 105 105<br>0 120 0 120 0 120<br>150 30 135 150 30 135 150 30 135<br>150 150 150<br>-10 165 -10 165 -10 165<br>-20 -20 -20<br>180 0 180 0 180 0<br>210 330 210 330 210 330<br>240 300 240 300 240 300<br>270 270 270<br>EIRP Summary (dBm) at 5180.0 (MHz)       min: -12.8 (dBm)      max: +9.9 (dBm)     avg: 6.4 (dBm) EIRP Summary (dBm) at 5180.0 (MHz)       min: -33.7 (dBm)      max: +6.7 (dBm)     avg: -0.4 (dBm) EIRP Summary (dBm) at 5180.0 (MHz)       min: -2.2 (dBm)      max: +10.3 (dBm)     avg: 7.2 (dBm)<br>**----- End of picture text -----**<br>


**Figure 28 Vertical, Horizontal, and Total Patterns** 

The information in this document is subject to change without notice. 

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## **3D Plots:** 

**Figure 29 Vertical, Horizontal, and Total Plots** 

The information in this document is subject to change without notice. 

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## **Channel 100: 5500 MHz** 

## **EIRP Azimuth Cut** 

**==> picture [600 x 168] intentionally omitted <==**

**----- Start of picture text -----**<br>
EIRP (dBm)  - Vertical Polarization at 5500.0 (MHz) Theta (deg) EIRP (dBm) - Horizontal Polarization at 5500.0 (MHz) Theta (deg) Total EIRP (dBm) at 5500.0 (MHz) Theta (deg)<br>90  15 90  15 90  15<br>20  30 20  30 20  30<br>120 60  45 120 60  45 120 60  45<br> 60  60  60<br>10  75 10  75 10  75<br> 90  90  90<br>105 105 105<br>0 120 0 120 0 120<br>150 30 135 150 30 135 150 30 135<br>150 150 150<br>-10 165 -10 165 -10 165<br>-20 -20 -20<br>180 0 180 0 180 0<br>210 330 210 330 210 330<br>240 300 240 300 240 300<br>270 270 270<br>EIRP Summary (dBm) at 5500.0 (MHz)       min: -11.6 (dBm)      max: +10.6 (dBm)     avg: 6.5 (dBm) EIRP Summary (dBm) at 5500.0 (MHz)       min: -23.1 (dBm)      max: +9.6 (dBm)     avg: 1.2 (dBm) EIRP Summary (dBm) at 5500.0 (MHz)       min: -0.1 (dBm)      max: +11.5 (dBm)     avg: 7.6 (dBm)<br>**----- End of picture text -----**<br>


**Figure 30 Vertical, Horizontal, and Total Patterns** 

The information in this document is subject to change without notice. 

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## **3D Plots:** 

**Figure 31 Vertical, Horizontal, and Total Plots** 

The information in this document is subject to change without notice. 

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## **Channel 165: 5825 MHz** 

## **EIRP Azimuth Cut** 

**==> picture [600 x 168] intentionally omitted <==**

**----- Start of picture text -----**<br>
EIRP (dBm)  - Vertical Polarization at 5825.0 (MHz) Theta (deg) EIRP (dBm) - Horizontal Polarization at 5825.0 (MHz) Theta (deg) Total EIRP (dBm) at 5825.0 (MHz) Theta (deg)<br>90  15 90  15 90  15<br>20  30 20  30 20  30<br>120 60  45 120 60  45 120 60  45<br> 60  60  60<br>10  75 10  75 10  75<br> 90  90  90<br>105 105 105<br>0 120 0 120 0 120<br>150 30 135 150 30 135 150 30 135<br>150 150 150<br>-10 165 -10 165 -10 165<br>-20 -20 -20<br>180 0 180 0 180 0<br>210 330 210 330 210 330<br>240 300 240 300 240 300<br>270 270 270<br>EIRP Summary (dBm) at 5825.0 (MHz)       min: -7.6 (dBm)      max: +6.3 (dBm)     avg: 2.2 (dBm) EIRP Summary (dBm) at 5825.0 (MHz)       min: -26.1 (dBm)      max: +4.7 (dBm)     avg: -4.2 (dBm) EIRP Summary (dBm) at 5825.0 (MHz)       min: -3.7 (dBm)      max: +6.9 (dBm)     avg: 3.1 (dBm)<br>**----- End of picture text -----**<br>


**Figure 32 Vertical, Horizontal, and Total Patterns** 

The information in this document is subject to change without notice. 

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## **3D Plots:** 

**Figure 33 Vertical, Horizontal, and Total Plots** 

The information in this document is subject to change without notice. 

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## **BASE SIP MODULE MECHANICAL DATA** 

**Figure 34 Base SIP Module Mechanical Dimensions** 

The information in this document is subject to change without notice. 

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## **BASE SIP MODULE PCB FOOTPRINT** 

**Figure 35 Base SIP Module Footprint (Top View)** 

The information in this document is subject to change without notice. 

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**BASE SIP MODULE TAPE AND REEL PACKAGING** 

**Figure 36 Base SIP Module Tape and Reel Specification** 

**Note:** (Module must be in this Orientation when Feeding Tape) 

The information in this document is subject to change without notice. 

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## **U.FL AND CHIP ANTENNA MECHANICAL DATA** 

**Figure 37 U.FL and Chip Antenna Mechanical Dimensions** 

The information in this document is subject to change without notice. 

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## **U.FL AND CHIP ANTENNA PCB FOOTPRINT** 

**Figure 38 U.FL and Chip Antenna PCB Footprint** 

**Note:** All Pads .762mm x .762mm Square. Solder Mask and Paste Mask to be adjusted according to end user’s assembly process. 

The information in this document is subject to change without notice. 

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## **U.FL AND CHIP ANTENNA TAPE AND REEL PACKAGING** 

**Figure 39 U.FL and Chip Antenna Modules Tape and Reel Specification** 

**Note:** Module must be in this Orientation when Feeding Tape. 

The information in this document is subject to change without notice. 

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## **DEVICE MARKINGS** 

## **Rev 1 Devices** 

- Initial Release 

The shield on the 450-0162, 450-0168, and 450-0169 modules contains the following information: 

- LSR Model:  Sterling-LWB5 (All Caps and Trademark (TM) on the SiP Module) 

- Part Number and Revision: 

   - Part Number: 450-0162, 450-0168, or 450-0169 

   - R1 = Revision 1 

- FCC ID:  TFB-1004 

- IC:  5969A-1004 

- SSYYWWD = Date Code (SS=Manufacturer, YY=Year, WW=Week, D=Day) 

- XXXXX = Incremental Serial Number 

- 2D Barcode Format is Data Matrix Standard 

- Pin 1 Marking 

The information in this document is subject to change without notice. 

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## **CONTACTING LSR** 

**Headquarters** LS Research, LLC W66 N220 Commerce Court Cedarburg, WI 53012-2636 USA Tel: (262) 375-4400 Fax: (262) 375-4248 **Website** www.lsr.com **Technical Support** forum.lsr.com **Sales Contact** sales@lsr.com 

The information in this document is provided in connection with LS Research (hereafter referred to as “LSR”) products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of LSR products. EXCEPT AS SET FORTH IN LSR’S TERMS AND CONDITIONS OF SALE LOCATED ON LSR’S WEB SITE, LSR ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL LSR BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF LSR HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. LSR makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. LSR does not make any commitment to update the information contained herein. LSR’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. 

If the intent is to apply this module to products related to the control and safety of transportation units (vehicles, trains, etc.), traffic signaling units, disaster-preventive & burglar-proof units, or the like, you are requested to inform our sales team of such a use in advance. 

The information in this document is subject to change without notice. 

Copyright © 2016-2017 LSR 

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Updated at April 25, 2026
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