374424B00035G

Heat Sink, Square, PCB, For Ball Grid Arrays, 20.3 °C/W, BGA, 27 mm, 18 mm, 27 mm

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Manufacturer: BOYD
Product type: Natural Convection Heat Sinks
Thermal Resistance:20.3°C/W; Packages Cooled:BGA; External Width - Metric:27mm; External Height - Metric:18mm; External Length - Metric:27mm; External Diameter - Metric:-; Heat Sink M
SVHC: No SVHC (15-Jan-2018)
Product Range: -
Packages Cooled: BGA
Heat Sink Material: Aluminium
Thermal Resistance: 20.3°C/W
External Width - Metric: 27mm
External Height - Metric: 18mm
External Length - Metric: 27mm
External Width - Imperial: 1.06"
External Diameter - Metric: -
External Height - Imperial: 0.71"
External Length - Imperial: 1.06"
External Diameter - Imperial: -

Delivery and price
Units per pack	50
Price	3.16 €
Current stock	1000+
Lead time	30 days

Datasheet

Updated at April 3, 2026