2SK1317-E
Power MOSFET, N Channel, 1.5 kV, 2.5 A, 9 ohm, TO-3P, Through Hole
- Manufacturer: RENESAS
- Product type:
- Available until stocks are exhausted
- MSL: -
- SVHC: No SVHC (21-Jan-2025)
- No. of Pins: 3Pins
- Channel Type: N Channel
- Product Range: -
- Qualification: -
- Power Dissipation: 100W
- Transistor Mounting: Through Hole
- Rds(on) Test Voltage: 15V
- Transistor Case Style: TO-3P
- Drain Source Voltage Vds: 1.5kV
- Operating Temperature Max: 150°C
- Continuous Drain Current Id: 2.5A
- Drain Source On State Resistance: 9ohm
- Gate Source Threshold Voltage Max: 4V
| Delivery and price | |
|---|---|
| Units per pack | 5 |
| Price | 10.11 € |
| Current stock | 50+ |
| Lead time | 30 days |
## **2SK1317** ## Silicon N Channel MOS FET REJ03G0929-0200 (Previous: ADE-208-1268) Rev.2.00 Sep 07, 2005 ## **Application** High speed power switching ## **Features** - High breakdown voltage VDSS = 1500 V - High speed switching - Low drive current - No secondary breakdown - Suitable for switching regulator, DC-DC converter and motor driver ## **Outline** **==> picture [350 x 134] intentionally omitted <==** **----- Start of picture text -----**<br> RENESAS Package code: PRSS0004ZE-A<br>(Package name: TO-3P)<br>D<br>1. Gate<br>G 2. Drain<br> (Flange)<br>3. Source<br>1 S<br>2<br>3<br>**----- End of picture text -----**<br> Rev.2.00 Sep 07, 2005 page 1 of 6 **2SK1317** ## **Absolute Maximum Ratings** (Ta = 25°C) ||||(Ta = 25°C)| |---|---|---|---| |**Item**|**Symbol**|**Ratings **|**Unit**| |Drain to source voltage|VDSS|1500|V| |Gate to source voltage|VGSS|±20|V| |Drain current|ID|2.5|A| |Drainpeak current|ID(pulse)<br>*1|7|A| |Bodyto drain diode reverse drain current|IDR|2.5|A| |Channel dissipation|Pch*2|100|W| |Channel temperature|Tch|150|°C| |Storage temperature|Tstg|–55 to +150|°C| Notes: 1. PW ≤ 10 µs, duty cycle ≤ 1% 2. Value at TC = 25°C ## **Electrical Characteristics** (Ta = 25°C) |||||||(Ta = 25°C)| |---|---|---|---|---|---|---| |**Item**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|**Test conditions**| |Drain to source breakdown voltage|V(BR)DSS|1500|—|—|V|ID= 10 mA, VGS= 0| |Gate to source leak current|IGSS|—|—|±1|µA|VGS=±20 V, VDS= 0| |Zerogate voltage drain current|IDSS|—|—|500|µA|VDS= 1200 V, VGS= 0| |Gate to source cutoff voltage|VGS(off)|2.0|—|4.0|V|ID= 1 mA, VDS= 10 V| |Static drain to source on state<br>resistance|RDS(on)|—|9|12|Ω|ID= 2 A, VGS= 15 V *3| |Forward transfer admittance||yfs||0.45|0.75|—|S|ID= 1 A, VDS= 20 V *3| |Input capacitance|Ciss|—|990|—|pF|VDS= 10 V, VGS= 0,<br>f = 1 MHz| |Output capacitance|Coss|—|125|—|pF|| |Reverse transfer capacitance|Crss|—|60|—|pF|| |Turn-on delaytime|td(on)|—|17|—|ns|ID= 2 A, VGS= 10 V,<br>RL= 15Ω| |Rise time|tr|—|70|—|ns|| |Turn-off delaytime|td(off)|—|110|—|ns|| |Fall time|tf|—|60|—|ns|| |Bodyto drain diode forward voltage|VDF|—|0.9|—|V|IF= 2 A, VGS= 0| |Body to drain diode reverse recovery<br>time|trr|—|1750|—|ns|IF= 2 A, VGS= 0,<br>diF/dt = 100 A/µs| Note: 3. Pulse test Rev.2.00 Sep 07, 2005 page 2 of 6 **2SK1317** ## **Main Characteristics** **==> picture [187 x 646] intentionally omitted <==** **----- Start of picture text -----**<br> Power vs. Temperature Derating<br>120<br>80<br>40<br>0 50 100 150<br>Case Temperature TC (°C)<br>Typical Output Characteristics<br>5<br>15 V 10 V<br>Pulse Test 8 V<br>4<br>7 V<br>3<br>6 V<br>2<br>5 V<br>1<br>VGS = 4 V<br>0 20 40 60 80 100<br>Drain to Source Voltage VDS (V)<br>Drain to Source Saturation Voltage<br>vs. Gate to Source Voltage<br>50<br>Pulse Test<br>40<br>ID = 3 A<br>30<br>2 A<br>20<br>1 A<br>10<br>0.5 A<br>0 4 8 12 16 20<br>Gate to Source Voltage VGS (V)<br>Channel Dissipation Pch (W)<br> (A)<br>D<br>Drain Current I<br> (V)<br>DS (on)<br>Drain to Source Saturation Voltage V<br>**----- End of picture text -----**<br> Maximum Safe Operation Area **==> picture [202 x 628] intentionally omitted <==** **----- Start of picture text -----**<br> 10<br>3<br>1.0<br>0.3<br>0.1<br>0.03<br>Ta = 25°C<br>0.01<br>10 30 100 300 1,000 3,000 10,000<br>Drain to Source Voltage VDS (V)<br>Typical Transfer Characteristics<br>2.0<br>1.6 VDS = 20 V<br>Pulse Test<br>1.2<br>0.8 75°C<br>TC = 25°C<br>0.4 –25°C<br>0 2 4 6 8 10<br>Gate to Source Voltage VGS (V)<br>Static Drain to Source on State<br>Resistance vs. Drain Current<br>50<br>20<br>VGS = 10 V<br>15 V<br>10<br>5<br>2<br>Pulse Test<br>1.0<br>0.5<br>0.1 0.2 0.5 1.0 2 5 10<br>Drain Current ID (A)<br>Operation in this area<br>is limited by RDS (on)<br>10<br>µs<br>DC Operation (T<br>C<br>= 25°<br>C)<br>PW = 10 ms (1 Shot)<br>100<br> (A) 1 ms µs<br>D<br>Drain Current I<br> (A)<br>D<br>Drain Current I<br>)Ω<br> (<br>DS (on)<br>Static Drain to Source on State Resistance R<br>**----- End of picture text -----**<br> Rev.2.00 Sep 07, 2005 page 3 of 6 **2SK1317** **==> picture [220 x 659] intentionally omitted <==** **----- Start of picture text -----**<br> Static Drain to Source on State<br>Resistance vs. Temperature<br>20<br>ID = 2 A<br>VGS = 15 V<br>16 Pulse Test<br>0.5 A, 1 A<br>12<br>8<br>4<br>0<br>–40 0 40 80 120 160<br>Case Temperature TC (°C)<br>Body to Drain Diode Reverse<br>Recovery Time<br>5,000<br>2,000<br>1,000<br>500<br>200 di/dt = 100 A/µs, Ta = 25°C<br>VGS = 0<br>Pulse Test<br>100<br>50<br>0.05 0.1 0.2 0.5 1.0 2 5<br>Reverse Drain Current IDR (A)<br>Dynamic Input Characteristics<br>1,000 20<br>VDD = 250 V<br>800 400 V 16<br>600 V<br>600 VGS 12<br>VDS<br>400 8<br>VDD = 600 V<br>200 400 V 4<br>250 V ID = 2.5 A<br>0<br>0 20 40 60 80 100<br>Gate Charge Qg (nc)<br>)Ω<br> (<br>DS (on)<br>Static Drain to Source on State Resistance R<br>Reverse Recovery Time trr (ns)<br> (A) (V)<br>DS GS<br>Drain to Source Voltage V Gate to Source Voltage V<br>**----- End of picture text -----**<br> **==> picture [184 x 657] intentionally omitted <==** **----- Start of picture text -----**<br> Forward Transfer Admittance<br>vs. Drain Current<br>10<br>VDS = 20 V<br>5 Pulse Test<br>2 –25°C<br>Ta = 25°C<br>1.0 75°C<br>0.5<br>0.2<br>0.1<br>0.05 0.1 0.2 0.5 1.0 2 5<br>Drain Current ID (A)<br>Typical Capacitance vs.<br>Drain to Source Voltage<br>10,000<br>VGS = 0<br>f = 1 MHz<br>Ciss<br>1,000<br>100 Coss<br>Crss<br>10<br>0 10 20 30 40 50<br>Drain to Source Voltage VDS (V)<br>Switching Characteristics<br>1,000<br>VGS = 10 V VDD = 30 V• •<br>500 PW = 2 µs, duty < 1%<br>t<br>d (off)<br>200<br>100<br>tf<br>50<br>tr<br>20 td (on)<br>10<br>0.05 0.1 0.2 0.5 1.0 2 5<br>Drain Current ID (A)<br> (S)<br><br>yfs<br><br>Forward Transfer Admittance<br>Capacitance C (pF)<br>Switching Time t (ns)<br>**----- End of picture text -----**<br> Rev.2.00 Sep 07, 2005 page 4 of 6 **2SK1317** Reverse Drain Current vs. Source to Drain Voltage **==> picture [182 x 177] intentionally omitted <==** **----- Start of picture text -----**<br> 5<br>Pulse Test<br>4<br>3<br>2<br>1<br>10 V, 15 V<br>VGS = 0, –5 V<br>0<br>0 0.4 0.8 1.2 1.6 2.0<br>Source to Drain Voltage VSD (V)<br> (A)<br>DR<br>Reverse Drain Current I<br>**----- End of picture text -----**<br> **==> picture [421 x 361] intentionally omitted <==** **----- Start of picture text -----**<br> Normalized Transient Thermal Impedance vs. Pulse Width<br>3<br>TC = 25°C<br>D = 1<br>1.0<br>0.5<br>0.3 0.2<br>θch–c (t) = γS (t) • θch–c<br>0.1 θch–c = 1.25°C/W, TC = 25°C<br>PDM<br>PW<br>0.03 D =<br>T<br>PW<br>T<br>0.01<br>10 µ 100 µ 1 m 10 m 100 m 1 10<br>Pulse Width PW (S)<br>Switching Time Test Circuit Waveforms<br>Vin Monitor 90%<br>Vout Monitor<br>Vin<br>10%<br>D.U.T<br>RL Vout 10% 10%<br>50 Ω<br>Vin VDD 90% 90%<br>10 V = 30 V td (on) t r td (off) t f<br>0.1<br>0.05<br>0.02<br>1 Shot Pulse0.01<br> (t)<br>S<br>γ<br> Normalized Transient Thermal Impedance<br>**----- End of picture text -----**<br> Rev.2.00 Sep 07, 2005 page 5 of 6 **2SK1317** ## **Package Dimensions** **==> picture [482 x 322] intentionally omitted <==** **----- Start of picture text -----**<br> JEITA Package Code RENESAS Code Package Name MASS[Typ.]<br>SC-65 PRSS0004ZE-A TO-3P / TO-3PV 5.0g<br>Unit: mm<br>15.6 ± 0.3 4.8 ± 0.2<br>φ3.2 ± 0.2 1.5<br>1.6<br>1.4 Max 2.0<br>2.8<br>1.0 ± 0.2 0.6 ± 0.2<br>3.6 0.9<br>1.0<br>5.45 ± 0.5 5.45 ± 0.5<br>1.0 5.0 ± 0.3<br>0.5<br>19.9 ± 0.2<br>14.9 ± 0.2<br>2.0 0.3<br>18.0 ± 0.5<br>**----- End of picture text -----**<br> ## **Ordering Information** |**Part Name**|**Quantity**|**Shipping Container**| |---|---|---| |2SK1317-E|360pcs|Box(Tube)| Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product. Rev.2.00 Sep 07, 2005 page 6 of 6 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan - Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. - Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. 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Updated at March 31, 2026
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