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274-3AB
HEAT SINK
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- Manufacturer: WAKEFIELD THERMAL
- Product type: Natural Convection Heat Sinks
- Thermal Resistance:62°C/W; Packages Cooled:TO-220; External Width - Metric:13.2mm; External Height - Metric:6.35mm; External Length - Metric:19mm; External Diameter - Metric:-; Heat Sink Ma 52F6214
- SVHC: No SVHC (21-Jan-2025)
- Product Range: -
- Packages Cooled: TO-220
- Heat Sink Material: Aluminum
- Thermal Resistance: 62°C/W
- External Width - Metric: 13.2mm
- External Height - Metric: 6.35mm
- External Length - Metric: 19mm
- External Width - Imperial: 0.52"
- External Diameter - Metric: -
- External Height - Imperial: 0.25"
- External Length - Imperial: 0.75"
- External Diameter - Imperial: -
| Delivery and price | |
|---|---|
| Units per pack | 1 |
| Price | 0.341 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
**Board Level Heat Sinks**
## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**
## **217 SERIES**
## **Surface Mount Heat Sinks**
_D[2] PAK, TO-220, SOT-223, SOL-20_
~~}—~~ - ety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increas-Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a vari- ~~J~~ a ing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers' component thermal specifications.
## **FEATURES AND BENEFITS:**
- No interface material is needed
- Copper with matte tin plating for improved solderability and assembly
- Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
- EIA standards and ESD protection are specified
- Can be used with water soluble or no clean SMT solder creams or other pastes
**Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Package Package Natural Forced P/N in. (mm) in. (mm) Format Quantity Convection Convection)** 217-36CTE6 .360 (9.1) .600 (15.2) x .740 (18.8) Bulk 1 55°C @ 1W 16.0°C/W @ 200 LFM 217-36CTTE6 .360 (9.1) .600 (15.2) x .740 (18.8) Tube 20 55°C @ 1W 16.0°C/W @ 200 LFM 217-36CTRE6 .360 (9.1) .600 (15.2) x .740 (18.8) Tape & Reel 250 55°C @ 1W 16.0°C/W @ 200 LFM Material: Copper, Matte Tin Plated
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MECHANICAL DIMENSIONS 217 HEAT SINK WITH<br>THERMAL PERFORMANCE<br>DDPAK DEVICE 6 LAYER BOARD, D' PAK<br>125°C LEAD, 40°C AMBIENT<br>r“ al | rT 7] |<br>| en<br>217-36CT6 4 1 8 , 4<br>Device Power Dissipation. W<br>KEY: a Device only, NC Device + HS, NC A Device + HS, 100 lfm o Device + HS, 200 lfm © Device + HS, 300 lfm<br>S26 ears<br>4<br>7<br>76 « Losi<br>re<br>SECTION A-A<br>A Boas _ L ans<br>r4 in.<br>NOTES<br>1. Material to be “ESD” TAPE DETAILS<br>_piee<br>2. Approximately 6 Meters per Reel<br>——_L_t___. 3. 250 Pieces per Reel.<br>217-36CTR6<br>|<br>(or<br>REEL DETAILS<br>4 —, Dimensions: in.<br>Device Tab dT, C<br>**----- End of picture text -----**<br>
**22**
## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**
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**----- Start of picture text -----**<br>
Surface Mount Heat Sinks<br>**----- End of picture text -----**<br>
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217 SERIES<br>**----- End of picture text -----**<br>
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D [2] PAK, TO-220, SOL-20<br>MECHANICAL DIMENSIONS BOARD LAYOUT RECOMMENDATIONS<br>217 SERIES<br>TUBE DETAILS at USE HaxX COPPER TO 7<br>ALLOW WAX CONDUCTION<br>G4 nes asa — FORoie wreSOLDER TO HEAT SINK cra<br>—| f pate Trap 66 a5<br>135 765 j | || |<br>+ AT 64 | |<br>| ooo a 64<br>a > ie a<br>8 nes REF: JEDEC To-F7045 poe i f<br>SOLDER MASK OF EXING<br>COPPER san |<br>G4 FOR HEATSINKFOOTPRINT |<br>. 06 . __f<br>OF FOR10 HIMSOLDER KIN COPPER<br>BALL TRAP FOR HEATS TAK<br>TUBE: 16.25 Inches Long,<br>Min. ESD Material with Nail<br>Stops<br>20 Pieces per Tube<br>64 | _ | : :<br>217-36CTT6<br>45 tt ; SOL 20<br>REF: JEDEC TO-263 (DD PAK)<br>REF: JEDEC MO-169 (DD PAK) 217-36CT6<br>Dimensions: in.<br>**----- End of picture text -----**<br>
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218 SERIES<br>**----- End of picture text -----**<br>
## **Surface Mount Heat Sink**
_SMT Devices_
**Height Above Maximum Standard PC Board Footprint Thermal Performance at Typical Load P/N in. (mm) in. (mm) Natural Convection Forced Convection** 218-40CTE3 .40 (10.2) .90 (22.9) x .315 (8.0) 62°C rise @ 2W 21°C/W @ 200LFM 218-40CTE5 .40 (10.2) 1.03 (26.2) x .50 (12.7) 62°C rise @ 2W 21°C/W @ 200LFM Material: Copper, Matte Tin Plated
## **MECHANICAL DIMENSIONS**
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218-40CT3 218-40CT5<br>**----- End of picture text -----**<br>
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NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>AIR VELOCITY (LFM)<br>0 200 400 600 800 1000<br>1008060 Fa+fatet 4 ff 44 252015<br>40 rf2[|Sur[| [| [oe] is ————1Fd — [i— 10<br>20 SECSee 5<br>Lfa ee A |<br>0 a 0<br>0 0.5200 1.4000 1.5600 2.0800 1000 2.5<br>HEAT DISSIPATED (WATTS)<br>Solid line = 218-40CT5 Dashed Line = 218-40CT3<br>)AMBIENT (C<br>ABOVE AMBIENT AIR (C)<br>HEAT SINK TEMPERATURE RISE THERMAL RESISTANCE SINK TO<br>**----- End of picture text -----**<br>
**23**
**Board Level Heat Sinks**
## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**
## **Vertical Mount Heat Sink**
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206 SERIES<br>**----- End of picture text -----**<br>
|**Standard**<br>**P/N**<br>206-1PABEH<br>**206 SERIES**|**Vertical Mount Heat Sink**<br>**Height Above**<br>**PC Board**<br>**in.(mm)**<br>1.18(30.0)|**Maximum**<br>**Footprint**<br>**in.(mm)**<br>1.00(25.4)x .50(12.7)|_TO-220_<br>**Thermal Performance at Typical Load**<br>**Natural Convection**<br>**Forced Convection**<br>56°C rise @ 4W<br>7.3°C/W @ 200LFM|
|---|---|---|---|
Material: Aluminum, Black Anodized
## **MECHANICAL DIMENSIONS**
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NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>AIR VELOCITY (LFM)<br>0 200 400 600 800 1000<br>100 pf | J [ ft ft tf Eq 10<br>80 pf [| ft ft tt pet 8<br>a a a a ee<br>60 | | | hee ttt tt 6<br>40 4<br>20 a 2<br>pot tT ft ft tT ft ft ft<br>0 | fT f tT ft tT tt ty 0<br>0 2200 4400 6600 8800 110 0 0<br>HEAT DISSIPATED (WATTS)<br>)AMBIENT (C<br>ABOVE AMBIENT AIR (C)<br>HEAT SINK TEMPERATURE RISE THERMAL RESISTANCE SINK TO<br>**----- End of picture text -----**<br>
## **230 & 234 SERIES**
## **Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks**
_TO-220_
|||**Height Above**||**Footprint**||**Solderable**||**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**|
|---|---|---|---|---|---|---|---|---|---|
||**Standard**|**PC Board**||**Dimensions**|**Mounting**|**Tab**|**Mounting**|**Natural**|**Forced**|
||**P/N**|**in.(mm)**||**in.(mm)**|**Configuation**|**Option**|**Style**|**Convection**|**Convection)**|
||230-75AB|.750 (19.1)|.570 (14.5) x .500 (12.7)|.570 (14.5) x .500 (12.7)|Vert./Horiz.|No Tab|Clip/Mtg Hole|57°C @ 2W|7.5°C/W @ 400 LFM|
||230-75ABE-01|.750 (19.1)|.570 (14.5) x .500 (12.7)|.570 (14.5) x .500 (12.7)|Vertical|01|Clip/Mtg Hole|57°C @ 2W|7.5°C/W @ 400 LFM|
|PATENT PENDING|230-75ABE-05|.500 (12.7)|.750 (19.1) x .570 (14.5)|.750 (19.1) x .570 (14.5)|Horizontal|05|Clip/Mtg Hole|57°C @ 2W|7.5°C/W @ 400 LFM|
||230-75ABE-10|.875 (22.2)|.570 (14.5) x .500 (12.7)|.570 (14.5) x .500 (12.7)|Vertical|10|Clip/Mtg Hole|57°C @ 2W|7.5°C/W @ 400 LFM|
||234-75AB|.790 (20.0)|.570 (14.5) x .500 (12.7)|.570 (14.5) x .500 (12.7)|Vert./Horiz|No Tab|Clip/Mtg Hole|57°C @ 2W|7.5°C/W @ 400 LFM|
||234-75ABE-01|.790 (20.0)|.570 (14.5) x .500 (12.7)|.570 (14.5) x .500 (12.7)|Vertical|01|Clip/Mtg Hole|57°C @ 2W|7.5°C/W @ 400 LFM|
||234-75ABE-05|.500(12.7)|.790|.790(20.0)x .570(14.5)|Horizontal|05|Clip/MtgHole|57°C @ 2W|7.5°C/W @ 400 LFM|
||Material: Aluminum, Black Anodized|||||||||
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MECHANICAL DIMENSIONS 230-75AB-01 230-75AB-10 230 AND 234 SERIES 230-75AB-05 230 SERIES<br>eeSoa | Totea de CTT |if | cm) PEMrue Le on Td' PreePere reobeet:ga|<br>Fal BE raat | me LEA | = er | pel ea atm i Pd<br>| | Fe ae i al Lz ae |) £e NATURAL AND FORCED<br>‘ldon LER a, edBEI 2 | = fnsth | es CONVECTION CHARACTERISTICS<br>+ ome ae = =o iH = . =) i r |e} Fl i<br>234 SERIES mo fF Lilllows i ea meosan 1 + How j=is " | ekca ie ee<br>Hy -E 1 it —t : Ee --<br>a] 1M pe elite a a le 234 SERIES c2 wl ve Ea“<br>uM 234-75AB 4 "a 234-75AB-01 ea 234-75AB-05 LT he | | egg eet<br>r Th a Ral a Ps ; 425A PATIO ge |<br>—=— ehh eSfae od =eE E t ta\ my 1 a F Tite e.= a * ee i<br>— ‘iE F a = r I Las ae ki fi ag A A<br>J — — P71 Fy i k : it F Ht |-—+ A. =e at<br>Dimensions: in. (mm) —7 P=aa i anEe= fae |= cgi ‘ tti * tgz aTALTtTast ir iaa eTa<br>**----- End of picture text -----**<br>
**24**
## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**
## **Horizontal Mount Heat Sink**
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241 SERIES<br>**----- End of picture text -----**<br>
|**241 SERIES**|**Horizontal Mount Heat Sink**|||||
|---|---|---|---|---|---|
|**241 SERIES**|**Horizontal Mount Heat Sink**||||_TO-220_|
||**Height Above**|**Maximum**||||
|**Standard**|**PC Board**|**Footprint**|**Thermal Performance at Typical Load**|||
|**P/N**|**in.(mm)**|**in.(mm)**|**Natural Convection**|**Forced Convection**||
|241-69ABE-03|.39(9.9)|.86(21.8)x .69(17.5)|77°C rise @ 4W|12°C/W @ 200LFM||
Material: Aluminum, Black Anodized
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NATURAL AND FORCED<br>LHi g! CONVECTION CHARACTERISTICS<br>MECHANICAL DIMENSIONS |]<br>Ui AIR VELOCITY (LFM)<br>L} LI 0 200 400 600 800 1000<br>100 20<br>fT [| | | TT | T [ 7 | 18<br>80 Pf | tT ty ty tat Ty 16<br>86 [21.8] [ff yt er 14<br>032 [ 81] 60 | | [| | | [| Pet tT | 12<br>eeee ee 10<br>40 ee eee 8<br>TAB HOLES | | joa feet ft 6<br>20 4<br>} 6 1 310 2 ) 2746S 2<br>0 0<br>| _ | 0 fF | 200 1 [ | 2400 | — 3600 | — 4800 [ TT 5 | 1000<br>83 [21.1] TF<br>HEAT DISSIPATED (WATTS)<br>020 [.51] |. . 83 [21 . 1] |<br>262 SERIES Horizontal and Vertical Mount Heat Sink TO-220<br>Height Above Maximum<br>Standard PC Board Footprint Thermal Performance at Typical Load<br>P/N in. (mm) in. (mm) Natural Convection Forced Convection<br>262-75ABE-05 .53 (13.4) .75 (19.1) x .50 (12.78) 80°C rise @ 2W 10°C/W @ 200LFM<br>262-75ABE-01 .75 (19.1) .53 (13.4) x .50 (12.7) 80°C rise @ 2W 10°C/W @ 200LFM<br>AMBIENT (C)<br>ABOVE AMBIENT AIR (C)<br>HEAT SINK TEMPERATURE RISE THERMAL RESISTANCE SINK TO<br>**----- End of picture text -----**<br>
Material: Aluminum, Black Anodized
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MECHANICAL DIMENSIONS<br>**----- End of picture text -----**<br>
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NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>AIR VELOCITY (LFM)<br>0 200 400 600 800 1000<br>100 10<br>80 fF | [KX tT fT Pt tT Tt 8<br>60 |P|| [|[| |IN[ohttTTTTTfT Tt 6<br>40 | | | ett ft ft [| [eI] 4<br>| | ett fT tT tT tT Tt<br>20 2<br>|| rt[Tq tT| tT| tf[| tT| ft[ ft[ 7[|<br>0 0<br>0 | | 1200 [| | 2400 | [— 3600 | {— 4800 [ JT 51000 |<br>HEAT DISSIPATED (WATTS)<br>)AMBIENT (C<br>ABOVE AMBIENT AIR (C)<br>HEAT SINK TEMPERATURE RISE THERMAL RESISTANCE SINK TO<br>**----- End of picture text -----**<br>
**25**
**Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**
## **233 & 236 SERIES**
## **Self-Locking Wavesolderable Heat Sinks**
_TO-220_
PATENT PENDING
||**Height Above**|**Footprint**||||**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**|
|---|---|---|---|---|---|---|---|
|**Standard**|**PC Board**|**Dimensions**|**Mounting**|**Solderable**|**Mounting**|**Natural**|**Forced**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Configuration**|**Tab Options**|**Style**|**Convection**|**Convection**|
|233-60AB|.600 (15.2)|.570 (14.5) x .500 (12.7)|Vert./Horiz.|No Tab|Clip/Mtg Hole|58°C @ 2W|11.0°C/W @ 400 LFM|
|233-60ABE-01|.600 (15.2)|.570 (14.5) x .500 (12.7)|Vertical|01|Clip/Mtg Hole|58°C @ 2W|11.0°C/W @ 400 LFM|
|233-60ABE-05|.500 (12.7)|.600 (15.2) x .570 (14.5)|Horizontal|05|Clip/Mtg Hole|58°C @ 2W|11.0°C/W @ 400 LFM|
|233-60ABE-10|.725 (18.4)|.570 (14.5) x .500 (12.7)|Vertical|10|Clip/Mtg Hole|58°C @ 2W|11.0°C/W @ 400 LFM|
|236-150AB|1.500 (38.1)|.570 (14.5) x .500 (12.7)|Vert./Horiz|No Tab|Clip/Mtg Hole|40°C @ 2W|4.80°C/W @ 400 LFM|
|236-150ABE-01|1.500 (38.1)|.570 (14.5) x .500 (12.7)|Vertical|01|Clip/Mtg Hole|40°C @ 2W|4.80°C/W @ 400 LFM|
|236-150ABE-05|.500 (12.7)|1.500 (38.1) x .570 (14.5)|Horizontal|05|Clip/Mtg Hole|40°C @ 2W|4.80°C/W @ 400 LFM|
|236-150ABE-10|1.625 (41.3)|.570(14.5)x .570(12.7)|Vetrical|10|Clip/MtgHole|40°C @ 2W|4.80°C/W @ 400 LFM|
|Material: Aluminum, Black Anodized||||||||
## **MECHANICAL DIMENSIONS 233 AND 236 SERIES**
**NATURAL AND FORCED CONVECTION CHARACTERISTICS**
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u 233-60AB-01 | | (08) 233-60AB-10 | (0.5) i] —»| |<(13)050 (08)032<br>236-150AB-01 236-150AB-10<br>— (38.1)1.500 ARRAS Ana (42)15»)<br> MAX |g ,<br>(14.5) i 250 125 SOOMIN. ; 233-60AB-05<br>236-150AB-05<br>— 500 TYP (64) {3.2) (12.7)<br>a t (127) | | |<br>(_] 52) 236-150AB v4 Fr 38 SERIES NUMBER LENGTH “AY<br>{|x | a ¥ as: 233-6048 600 (15.2)<br>233-60AB — Dimensions: in. (mm) (1.3)050__,||| 4 — t (1.5)063. |= 4 236-1508 (1 50D 80BB<br>**----- End of picture text -----**<br>
## **275 & 231 SERIES**
## **Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks**
_TO-220_
|||||**Height Above**||**Footprint**||**Thermal Performance at Typical Load**|
|---|---|---|---|---|---|---|---|---|
|||**Standard**||**PC Board**||**Dimensions**|**Mounting**<br>**Solderable**|**Mounting**<br>**Natural**<br>**Forced**|
|||**P/N**||**in.(mm)**||**in.(mm)**<br>**Configuration**<br>**Tab Options**||**Style**<br>**Convection**<br>**Convection**|
|||275-75AB||.750 (19.1)|.835 (21.2) x .400 (12.7)|.835 (21.2) x .400 (12.7)|Vert./Horiz.<br>No Tab|Clip/Mtg Hole<br>44 C @ 2W<br>7.9°C/W @ 400 LFM|
|||275-75ABE-01||.750 (19.1)|.835 (21.2) x .400 (12.7)|.835 (21.2) x .400 (12.7)|Vertical<br>01|Clip/Mtg Hole<br>44°C @ 2W<br>7.9°C/W @ 400 LFM|
|||275-75ABE-10||.875 (12.7)|.835 (21.2) x .400 (14.5)|.835 (21.2) x .400 (14.5)|Vertical<br>10|Clip/Mtg Hole<br>44°C @ 2W<br>7.9°C/W @ 400 LFM|
|PATENT 5381041||231-69PAB||.690 (18.4)|.835 (21.2) x .400 (12.7)|.835 (21.2) x .400 (12.7)|Vert./Horiz.<br>No Tab|Clip/Mtg Hole<br>45°C @ 2W<br>8°C/W @ 400 LFM|
|||231-69PABE||.400 (10.1)|.690 (17.5) x .835 (12.7)|.690 (17.5) x .835 (12.7)|Horizontal<br>13H|Clip/Mtg Hole<br>45°C @ 2W<br>8°C/W @ 400 LFM|
|||231-69PABE-XXX||.690 (17.5)|.835 (21.2) x .400 (12.7)|.835 (21.2) x .400 (12.7)|Vertical<br>13V, 14V, 15V|Clip/Mtg Hole<br>45°C @ 2W<br>8°C/W @ 400 LFM|
|||231-75PAB||.750 (19.1)|.835 (21.2) x .400 (14.5)|.835 (21.2) x .400 (14.5)|Vert./Horiz.<br>No Tab|Clip/Mtg Hole<br>43°C @ 2W<br>7.9°C/W @ 400 LFM|
|||231-75PABE||.400 (10.1)|.750 (19.1) x .835 (12.7)|.750 (19.1) x .835 (12.7)|Horizontal<br>13H|Clip/Mtg Hole<br>43°C @ 2W<br>7.9°C/W @ 400 LFM|
|||231-75PABE-XXX||.750 (19.1)|.835 (21.2) x .400 (12.7)|.835 (21.2) x .400 (12.7)|Vertical<br>13V, 14V, 15V|Clip/Mtg Hole<br>43°C @ 2W<br>7.9°C/W @ 400 LFM|
|||231-137PAB||1.375 (35)|.835 (21.2 x .400 (12.7)||Vert./Horiz.<br>No Tab|Clip/Mtg Hole<br>32°C @ 2W<br>5.9°C/W @ 400 LFM|
|||231-137PABE||.400 (10.2)|1.375 (34.9) x .835 (12.7)||Horizontal<br>13H|Clip/Mtg Hole<br>32°C @ 2W<br>5.9°C/W @ 400 LFM|
|||231-137PABE-XXX||1.375(35)|.835|.835(21.2)x .400(12.7)|Vertical<br>13V,14V,15V|Clip/MtgHole<br>32°C @ 2W<br>5.9°C/W @ 400 LFM|
|||Material: Aluminum, Pre-anodized Black (PAB), Anodized Black (AB)|||||||
|**MECHANICAL**<br>**DIMENSIONS**<br>**All versions No Tab**<br>Dimpte on 231-69, 275-75 Series only<br>bares<br>‘<br>Lance<br>not<br>|<br>Ry<br>ass<br>availed<br>C)<br>and275.<br>‘”TT<br>I) Sr<br>' re ext<br>| t=}<br>en<br>‘i<br>t<br>0.150<br>~~.<br>_e<br>|<br>BO BEF<br>i<br>G8)||||**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>**275 AND 231 SERIES**<br>**TAB 13H**<br>Dimple not<br>available<br>on<br>275-75Series<br>~—<br>855<br>AIRVELOCITY (LFM)<br>an<br>sen Fw<br>—l<br>;<br>QD<br>020<br>(0<br>ww jog___200_<br>400500001000)<br>t=<br>sees ©<br>@® § (tS<br>88<br>[iO]<br>025(0.6)<br>TABS13V, 14V,15V<br>ge °= ae aeNe<br>231<br>14V,<br>,<br>xo<br>4]<br>835<br>>|)<br>SERIES<br>SUGGESTED<br>TABHOLES<br>HE 5<br>\<br>geo Nyy BE<br>a)<br>(<br>(21.2)<br>|<br>FORALLPARTNUMBERS<br>ae<br>ON<br>sree |<br>I<br>020__,||<br>(VERTICALANDHORIZONTAL MOUNTING)- 2=<br>SS<br>yy<br>5<br>|<br>ass<br>(0.5)<br>©.075(1.9)(PLATED)WITH©.100(2.5)PAD<br>xewy 40Pe,am<br>a=<br>mos<br>BS<br>23<br>craps194, Navgy)<br>(21.7)<br>G2 2<br>A<br>4 Fo|||||
||**TAB**<br>**14V**<br>**TAB**<br>**13V**<br>**TAB 13H**<br>00 BEF<br>1<br>(10.2)<br>1g<br>ry<br>(a5) G2)<br>rit<br>i<br>i+<br>0.8)<br>_, —_ 185<br>(47)<br>125<br>(32)||**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>**TAB 01**<br>**TAB 10**<br>**TAB 15V**<br>=<br>0<br>C<br>ES<br>Hoe<br>.<br>ze<br>oo<br>Tf<br>2<br>@<br>@<br>5<br>&<br>~“<br>as<br>eS<br>POWER OISSIPATION (WATTS)<br>YI<br>Pi © =<br>Lf Ot<br>as<br>‘<br>FAPorF?§, Forad<br>aa<br>|<br>6a<br>E88<br>032(TABI)<br>AIR VELOCITY (LEM)<br>375<br>-<br>5)<br>—>{-4—(08)<br>wO jp<br>200400<br>6008001000)<br>5) f<br>062REF<br>let<br>063,<br>|<br>Se<br>|<br>ws<br>r<br>l— (05)<br>zt<br>8b<br>tS<br>6 25<br>| |be}<br>—.125 (3.2)<br>ae<br>geo<br>2<br>aa<br>%<br>—<br>185(4.7)<br>DIM*A®<br>DiM“B"<br>TABS01 AND10<br>eo ©<br>B<br>|? ge<br>SUGGESTED TAB HOLE=<br>a<br>=<br>_ 2<br>690(17.5)<br>345(88)<br>0.075 {1.9} (PLATED)<br>ee<br>40<br>: > creel 2s<br>5}<br>a00REF<br>231-75PAB<br>750(19.1)<br>375(9.5)<br>WITH 0.100 (2.5) (PAD)<br>2a<br>i<br>3a||||||
|**Dimensions: in. (mm)**<br>= t+<br>ee062REF<br>231-137PAB<br>4 gy<br>(1.6)||||||“688(17.5)||gy lA<br>!<br>ity) “2<br>x<br>0<br>1<br>2<br>3<br>4<br>5<br>a|
**26**
## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**
|||||||**Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks**<br>**235 SERIES**|**Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks**<br>**235 SERIES**|**Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks**<br>**235 SERIES**|**Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks**<br>**235 SERIES**|**Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks**<br>**235 SERIES**|**Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks**<br>**235 SERIES**|**Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks**<br>**235 SERIES**|**Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks**<br>**235 SERIES**||_TO-220_|_TO-220_|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||||||**Height Above**|**Footprint**||||||**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|||||||**Standard**|**PC Board**|**Dimensions**|**Mounting**||**Solderable**||**Mounting**|**Natural**<br>**Forced**|||
|||||||**P/N**|**in.(mm)**|**in.(mm)**|**Configuration**||**Tab Options**||**Style**|**Convection**<br>**Convection**|||
|PATENT 5381041||||||235-85AB<br>235-85ABE-01<br>235-85ABE-05<br>235-85ABE-10|.850 (21.6)<br>.850 (21.6)<br>.500 (12.7)<br>.975(24.8)|1.000 (25.4) x<br>.500 (12.7)<br>1.000 (25.4) x<br>.500 (12.7)<br>.850 (21.6) x 1.000 (25.4)<br>1.000(25.4)x<br>.500(12.7)|Vert./Horiz.<br>Vertical<br>Horizontal<br>Vertical|||No Tab<br>01<br>05<br>10|Clip/Mtg Hole<br>Clip/Mtg Hole<br>Clip/Mtg Hole<br>Clip/MtgHole|40°C @ 2W<br>6.8°C/W @ 400 LFM<br>40°C @ 2W<br>6.8°C/W @ 400 LFM<br>40°C @ 2W<br>6.8°C/W @ 400 LFM<br>40°C @ 2W<br>6.8°C/W @ 400 LFM|6.8°C/W @ 400 LFM<br>6.8°C/W @ 400 LFM<br>6.8°C/W @ 400 LFM<br>6.8°C/W @ 400 LFM|6.8°C/W @ 400 LFM<br>6.8°C/W @ 400 LFM<br>6.8°C/W @ 400 LFM<br>6.8°C/W @ 400 LFM|
|||||||Material: Aluminum, Black Anodized|||||||||||
||.|a|_|||za<br>c|**235-85AB**<br>FA|**MECHANICAL DIMENSIONS**|||**235 SERIES**|**235 SERIES**||**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**|||
||||||||<br>| _a|| i|ley ais<br>|<br>wt|f1]|||||<br>i|feeevsa|a||
|||<br>ae|||||ae<br>= —*<br>i<br>aeee<br>ee<br>j||1<br>| c _|<br>im tlC1 ti<br>i|= <br>4|J LE =<br> re—||,<br> at<br>|<br>'|——-<br>ts<br>of <br>co<br>a|+t od foto<br> CccpTE|f<br>||5°<br> a|
|||||||**235-85AB-05**|||||||||||
|t+|-¢|ha||eM|y|I|wd<br>||**235-85AB-01**||**235-85AB-10**|||.|i<br>niet|||
||Ye<br>1||t|le||a|Le<br>=<br>‘|**Dimensions: in. (mm)**|||Te|es|||||
## **243 SERIES**
## **Labor-Saving Clip-On Heat Sinks**
_TO-220_
||**Height Above**|**Footprint**||||**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**|
|---|---|---|---|---|---|---|---|
|**Standard**|**PC Board**|**Dimensions**|**Mounting**|**Solderable**|**Mounting**|**Natural**|**Forced**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Configuration**|**Tab Options**|**Style**|**Convection**|**Convection**|
|243-1PAB|1.000 (25.4)|.800 (20.3) x .270 (6.9)|Vert./Horiz.|No Tab|Clip|50°C@ 2W|4.5°C/W @ 400 LFM|
|243-3PAB|.800(20.3)|.800(20.3)x .270(6.9)|Verl./Horiz.|No Tab|Clip|78°C@ 2W|8.2°C/W @ 400 LFM|
|Material: Aluminum, Pre-anodized Black||Material: Aluminum, Pre-anodized Black||||||
**MECHANICAL DIMENSIONS**
**==> picture [29 x 6] intentionally omitted <==**
**----- Start of picture text -----**<br>
243 SERIES<br>**----- End of picture text -----**<br>
**==> picture [233 x 59] intentionally omitted <==**
**----- Start of picture text -----**<br>
NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br> *a4 | cr a 1 a| oe a<br>SECTION A-A VIEW B-B ta @ a a<br>**----- End of picture text -----**<br>
**Dimensions: in. (mm)**
## **239 SERIES**
## **Snap-Down Self-Locking Heat Sinks**
_TO-220_
|||**Height Above**||**Footprint**||||**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**|
|---|---|---|---|---|---|---|---|---|---|
||**Standard**|**PC Board**||**Dimensions**|**Mounting**|**Solderable**|**Mounting**|**Natural**|**Forced**|
||**P/N**|**in.(mm)**||**in.(mm)**|**Configuration**|**Tab Options**|**Style**|**Convection**|**Convection**|
||239-75AB|.750 (19.1)|1.120 (28.4) x .435 (11.0)|1.120 (28.4) x .435 (11.0)|Vert./Horiz|No Tab|Clip/Mtg Hole|38°C @ 2W|6°C/W @ 400 LFM|
||239-75ABE-03|.750 (19.1)|1.120 (28.4) x .435 (11.0)|1.120 (28.4) x .435 (11.0)|Vertical|03|Clip/Mtg Hole|38°C @ 2W|6°C/W @ 400 LFM|
||239-75ABE-04|.750(19.1)|1.120|1.120(28.4)x .435(11.0)|Vertical|04|Clip/MtgHole|38°C @ 2W|6°C/W @ 400 LFM|
|PATENT PENDING|Material: Aluminum, Black Anodized|||||||||
**==> picture [488 x 75] intentionally omitted <==**
**----- Start of picture text -----**<br>
239 SERIES NATURAL AND FORCED<br>MECHANICAL DIMENSIONS SECTION A-A on a CONVECTION CHARACTERISTICS<br>A. 239-75AB ee io = feo eli al Lie i<br>4 L . m= |i a = eee<br>Pts i — a Se a a<br>239-75AB-03 k= rc Cc pe<br>239-75AB-04<br>**----- End of picture text -----**<br>
**Dimensions: in. (mm)**
**27**
**Board Level Heat Sinks**
## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**
## **Vertical Mount Heat Sink**
**==> picture [48 x 9] intentionally omitted <==**
**----- Start of picture text -----**<br>
265 SERIES<br>**----- End of picture text -----**<br>
**==> picture [445 x 575] intentionally omitted <==**
**----- Start of picture text -----**<br>
TO-220<br>Height Above Maximum<br>Standard PC Board Footprint Thermal Performance at Typical Load<br>P/N in. (mm) in. (mm) Natural Convection Forced Convection<br>265-118ABHE-22 1.18 (30.0) 1.00 (25.4) x .50 (12.7) 56°C rise @ 4W 7.0°C/W @ 200LFM<br>Material: Aluminum, Black Anodized<br>NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>50 [12.7]<br>AIR VELOCITY (LFM)<br>05 [1.3] 0 200 400 600 800 1000<br>9.125 [83.18] LF 100 10<br>_ a De<br>= 80 p | tT [| tf ft f[ fT Tf 8<br>= 1-18 [30.0] || | | | [oe] | tT<br>| pr 60 | | | be TTT tT tT Tf 6<br>40 | | wi ft |) [| -F+t 4<br>7a) 4 20 |po][| fttopft ftTHeyt tt | Tt Tf 2<br>| —s0. 10. 2 ) 0 | | [ fT Jf tT f ft fT Tf 0<br>0 2002 4004 6006 8008 101 0 0<br>© DETAIL [A]<br>|) HEAT DISSIPATED (WATTS)<br>286DB SERIES Vertical Mount Heat Sink TO-220<br>Height Above Maximum<br>Standard PC Board Footprint Thermal Performance at Typical Load<br>P/N 286DBE NN .95 in. ( ( 24.1 mm) ) 1.00 (25.4 in. ) ( x .50 mm) (12.7) Natural Convection 65°C rise @ 4W 9.0°C/W @ 200LFM Forced Convection<br>Material: Aluminum, Black Anodized<br>NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>1.00 [25 . 4]<br>AIR VELOCITY (LFM)<br>0 200 400 600 800 1000<br>150 [3.8] rT $00 (12-71<br>a 100 P | [| fT ft fT pq 10<br>80 8<br>t T Pf ft ft ft tort ty<br>081 [2.1] 3x | [ ke | [ [ert ft ff<br>70 [17.8] 60 Pf tT NA ar fe 6<br>— 40 a | 4<br>-200 [6.1] re2 eeeae eeeeeeee<br>—a { -- 0 50 [1 . 3] 20 PottyfT tT tT 2<br>cow s ‘oo p s a<br>100251 an 0 ee ee ee eee 0<br>5 00 [12 . 7] 0 2002 4004 6006 8008 100010<br>0 50 [1 . 3] HEAT DISSIPATED (WATTS)<br>)AMBIENT (C<br>ABOVE AMBIENT AIR (C)<br>HEAT SINK TEMPERATURE RISE THERMAL RESISTANCE SINK TO<br>)AMBIENT (C<br>ABOVE AMBIENT AIR (C)<br>HEAT SINK TEMPERATURE RISE THERMAL RESISTANCE SINK TO<br>**----- End of picture text -----**<br>
Material: Aluminum, Black Anodized
**==> picture [90 x 8] intentionally omitted <==**
**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS<br>**----- End of picture text -----**<br>
|**286DB SERIES**|**Vertical Mount Heat Sink**|||_TO-220_|
|---|---|---|---|---|
||**Height Above**|**Maximum**|||
|**Standard**|**PC Board**|**Footprint**|**Thermal Performance at Typical Load**||
|**P/N**<br>~~NN~~|**in.(mm))**<br>~~NN~~|**in.(mm))**<br>~~NN~~|**Natural Convection**<br>**Forced Convection**<br>~~NN~~||
|286DBE|.95(24.1)<br>1.00 (25.4|1.00 (25.4(25.425.4)x .50(12.7)12.7))|65°C rise @ 4W<br>9.0°C/W @ 200LFM||
Material: Aluminum, Black Anodized
## **MECHANICAL DIMENSIONS**
**28**
## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**
## **Low-Cost, Low-Height Wavesolderable Heat Sinks**
**==> picture [49 x 9] intentionally omitted <==**
**----- Start of picture text -----**<br>
273 SERIES<br>**----- End of picture text -----**<br>
|**273 SERIES**||**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**273 SERIES**||**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|||||_TO-218, TO-220_|
|**Height Above**||**Height Above**|||**Footprint**||||||||||||**Thermal Performance at Typical Load**|
|**Standard**|**PC Board**||||**Dimensions**|||**Mounting**|||**Solderable**|||**Mounting**|||**Natural**<br>**Forced**|
|**P/N**|**in.(mm)**||||**in.(mm)**|||**Configuration**|||**Tab Options**|||**Style**|||**Convection**<br>**Convection**|
|273-AB|.375 (9.5)|.375 (9.5)|.750 (19.1) x .750 (19.1)||.750 (19.1) x .750 (19.1)||.750 (19.1) x .750 (19.1)|Vert./Horiz.||||No Tab||Mtg Hole|||49°C @ 2W<br>7.2°C/W @ 400 LFM|
|273-ABE-01|.375 (9.5)|.375 (9.5)|.750 (19.1) x .750 (19.1)||.750 (19.1) x .750 (19.1)||.750 (19.1) x .750 (19.1)|Vertical||||01||Mtg Hole|||49°C @ 2W<br>7.2°C/W @ 400 LFM|
|273-ABE-02|.375|.375(9.5)|.750||.750(19.1)x .750||x .750(19.1)|Vertical||||02||MtgHole|||49°C @ 2W<br>7.2°C/W @ 400 LFM|
|Material: Aluminum, Black Anodized||||||||||||||||||
|**MECHANICAL DIMENSIONS**<br>Ee||||||**273 SERIES**|||||||||||**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**|
|i<br>ia<br>3<br>.<br>abe||]<br>;=<br>7<br>4<br>t|=|r<br> a<br>I<br>mi<br>l<br>|||:<br>CY<br>'<br>i||il|=|:.<br>“t|fai|=<br>7<br>x||-,<br>Fr<br>a|aay Looe wre<br>&aoa<br>et EeLy i<br>oT<br>|<br>ee<br>ee<br>ees<br>eedeeoe<br>|<br>{—.--}--f<br>by a<br>|<br>Pet-<br>Sia<br>J|||
|-<br>4<br>ire<br>a=|=|a<br>rT<br>eee||||=||uu<br>|<br>“1<br>oh|a|ae||Ht<br>i|r<br>=_|7<br>TTBS|4,<br>rch<br>-<br>de|=<br>ed<br>«#<br>pl||fy,<br>foo<br>ers<br>1+<br>EE<br>eea<br>ee<br>ee<br>te<br>2<br>oe<br>ee<br>oe<br>oe ee<br>ee<br>i<br>ye<br>eto<br>CO<br>I<br>ee|
|.||||**273-AB-01**|||||**273-AB-02**|||||||||
|;<br>ee|ie]|||||**Dimensions: in. (mm)**||||||||_|||Ty<br>EaLe<br>& 7<br>F<br>Pe<br>ceefayAt|
**==> picture [90 x 65] intentionally omitted <==**
**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS<br>jt1 Ee<br>a |eriFA |<br>imi) q in7"<br>a a<br>273-AB<br>**----- End of picture text -----**<br>
## **274 & 281 SERIES**
## **Low-Cost, Low-Height Wavesolderable Heat Sinks**
_TO-220_
||**274 & 281 SERIES**|**274 & 281 SERIES**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|_TO-220_|_TO-220_|
|---|---|---|---|---|---|---|---|---|
|||**Height Above**|**Footprint**||||**Thermal Performance at Typical Load**||
||**Standard**|**PC Board**|**Dimensions**|**Mounting**|**Solderable**|**Mounting**|**Natural**|**Forced**|
||**P/N**|**in.(mm)**|**in.(mm)**|**Configuration**|**Tab Options**|**Style**|**Convection**|**Convection**|
||274-1AB|.375 (9.5)|.520 (13.2) x .750 (19.1)|Vert./Horiz.|No Tab|Mtg Hole|56°C @ 2W|8.0°C/W @ 400 LFM|
||274-1ABE-01|.375 (9.5)|.520 (13.2) x .750 (19.1)|Vertical|01|Mtg Hole|56°C @ 2W|8.0°C/W @ 400 LFM|
||274-1ABE-02|.375 (9.5)|.520 (13.2) x .750 (19.1)|Vertical|02|Mtg Hole|56°C @ 2W|8.0°C/W @ 400 LFM|
||274-2AB|.500 (12.7)|.520 (13.2) x .750 (19.1)|Vert./Horiz.|No Tab|Mtg Hole|50°C @ 2W|7.0°C/W @ 400 LFM|
|Material: Aluminum,<br>Black Anodized|274-2ABE-01<br>274-2ABE-02<br>274-3AB|.500 (12.7)<br>.500 (12.7)<br>.250 (6.4)|.520 (13.2) x .750 (19.1)<br>.520 (13.2) x .750 (19.1)<br>.520 (13.2) x .750 (19.1)|Vertical<br>Vertical<br>Vert./Horiz.|01<br>02<br>No Tab|Mtg Hole<br>Mtg Hole<br>Mtg Hole|50°C @ 2W<br>50°C @ 2W<br>62°C @ 2W|7.0°C/W @ 400 LFM<br>7.0°C/W @ 400 LFM<br>9.0°C/W @ 400 LFM|
||274-3ABE-01|.250 (6.4)|.520 (13.2) x .750 (19.1)|Vertical|01|Mtg Hole|62°C @ 2W|9.0°C/W @ 400 LFM|
||274-3ABE-02|.250 (6.4)|.520 (13.2) x .750 (19.1)|Vertical|02|Mtg Hole|62°C @ 2W|9.0°C/W @ 400 LFM|
||281-1AB|.375 (9.5)|.520 (13.2) x .750 (19.1)|Vertical|No Tab|Mtg Hole|56°C @ 2W|8.0°C/W @ 400 LFM|
||281-2AB|.500(12.7)|.520(13.2)x .750(19.1)|Vertical|No Tab|MtgHole|50°C @ 2W|7.0°C/W @ 400 LFM|
**MECHANICAL DIMENSIONS**
## **274 SERIES**
**NATURAL AND FORCED CONVECTION CHARACTERISTICS**
**==> picture [317 x 84] intentionally omitted <==**
**----- Start of picture text -----**<br>
ey STU 274-XAB-01 274-XAB-02<br>274 SERIES -; Ig ;<br>a} 750 i Wig: ;<br>| en fo, tT oss ae +,<br>gan 050 (64) (95)<br>281 SERIES : aa (ia Tera “”{ 13) laI (08)032 || t 1.3)050; —* ||! (08)032, || l=__‘<br>de Z~— 0.075 (1.9) (plated) 0.100 (2.5) pad<br>Dimensions: in. (mm)<br>**----- End of picture text -----**<br>
**240 SERIES**
## **Labor-Saving Twisted Fin Heat Sinks**
_TO-220_
||**Height Above**|**Footprint**||||**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**|
|---|---|---|---|---|---|---|---|
|**Standard**|**PC Board**|**Dimensions**|**Mounting**|**Solderable**|**Mounting**|**Natural**|**Forced**|
|**P/N**<br>~~a~~|**in.(mm)**<br>~~a~~|**in.(mm)**<br>~~a~~|**Configuration**<br>~~a~~|**Tab Options**<br>~~a~~|**Style**<br>~~a~~|**Convection**<br>~~a~~|**Convection**<br>~~a~~|
|240-118ABEH-22|1.180 (30.0)|1.000 (25.4) x .500 (12.7)|Vertical|22|Clip/Mtg Hole|55°C @ 4W|5.3°C/W @ 400 LFM|
|240-118ABES-22|1.180(30.0)|1.000(25.4)x .500(12.7)|Vertical|22|Clip/MtgSlot|55°C @ 4W|5.3°C/W @ 400 LFM|
|Material: Aluminum, Black Anodized||||||||
**MECHANICAL DIMENSIONS** — | 806/25.41 \— 58M — |- , {| 375 (9.54 __) 1m maq pall | i | i 1 \ ar c [en 18 Ls aig, enna' r T ! **240-118ABS-22** | ~~ ess ise 4.7) — maeE 259oy ve ri _ soe e411 **240-118ABH-22 Dimensions: in. (mm)**
**240 SERIES**
**NATURAL AND FORCED CONVECTION CHARACTERISTICS**
**29**
**Board Level Heat Sinks**
## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**
**==> picture [246 x 10] intentionally omitted <==**
**----- Start of picture text -----**<br>
242 SERIES Low-Height, Low-Profile Twisted Fin Heat Sinks<br>**----- End of picture text -----**<br>
||**242 SERIES**|**Low-Height, Low-Profile Twisted Fin Heat Sinks**|**Low-Height, Low-Profile Twisted Fin Heat Sinks**|**Low-Height, Low-Profile Twisted Fin Heat Sinks**|**Low-Height, Low-Profile Twisted Fin Heat Sinks**|**Low-Height, Low-Profile Twisted Fin Heat Sinks**|**Low-Height, Low-Profile Twisted Fin Heat Sinks**||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
||**242 SERIES**|**Low-Height, Low-Profile Twisted Fin Heat Sinks**|**Low-Height, Low-Profile Twisted Fin Heat Sinks**|**Low-Height, Low-Profile Twisted Fin Heat Sinks**|**Low-Height, Low-Profile Twisted Fin Heat Sinks**|**Low-Height, Low-Profile Twisted Fin Heat Sinks**|**Low-Height, Low-Profile Twisted Fin Heat Sinks**|||||_TO-220_|
|||**Height Above**|**Footprint**|||||||**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|**Standard**||**PC Board**|**Dimensions**||**Mounting**||**Solderable**|**Mounting**||**Natural**||**Forced**|
|**P/N**||**in.(mm)**|**in.(mm)**||**Configuration **||**Tab Options**|**Style**||**Convection**||**Convection**|
|242-125ABE-22||1.285(32.6)|.875(22.2)x .250(6.4)||Vertical||22|MtgHole||48°C @ 2W|6.2°C/W @ 400 LFM||
|Material: Aluminum, Black Anodized|||||||||||||
||**242-125AB-22**<br>al<br>Ty<br>is<br>fj<br>4<br>=|**MECHANICAL DIMENSIONS**<br>PC ARTErr]<br>———<br>aT<br>md||||**242 SERIES**<br>Law<br>aoe ATID||**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>2 CEE<br>ie<br>Tal<br>=<br>ae ee<br>fi eT<br>7<br>A<br>ee eS<br>A<br>4"|||||
|Cc<br>Ca|1|L<br>|:<br>ff<br>on<br>tt<br>: |a<br>iey<br>ii<br>be<br>H||:|ra|F<br>oF<br> er<br>prams<br>L._<br>mu<br>_,!||+<br>AS<br>A<br>A<br>SP<br>a2 c|———+<br>angett<br>oa<br>Sa jt He<br>a3<br>=<br>alae<br>i<br>es ==|||ae<br>1|=<br>LI<br>a=<br>25|
|ia<br>Ga|Ae ee<br> Ae<br>Fn<br>ee||**Dimensions: in. (mm)**|||||||A<br>TE<br>AT|||
||||||||||||||
||||||||||||||
||**232 & 238 SERIES**||**Staggered Fin Heat Sinks for Vertical Mounting**||**Staggered Fin Heat Sinks for Vertical Mounting**|||||||_TO-202, TO-220_|
|||**Height Above**|**Footprint**||||**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**|
|---|---|---|---|---|---|---|---|---|
|i|**Standard**|**PC Board**|**Dimensions**|**Mounting**|**Solderable**|**Mounting**|**Natural**|**Forced**|
||**P/N**|**in.(mm)**|**in.(mm)**|**Configuration**|**Tab Options**|**Style**|**Convection**|**Convection**|
||232-200AB|2.000 (50.8)|1.380 (35.1) x .500 (12.7)|Vertical|2, Twisted|Clip/Mtg Hole|48°C @ 4W|3.3°C/W @ 400 LFM|
||232-200ABE-23|2.000 (50.8)|1.380 (35.1) x .500 (12.7)|Vertical|2, Solderable|Clip/Mtg Hole|48°C @ 4W|3.3°C/W @ 400 LFM|
|Material: Aluminum,<br>Black Anodized|238-200AB<br>238-200ABE-23|2.000 (50.8)<br> 2.000(50.8)|1.380 (35.1) x .500 (12.7)<br>1.380(35.1)x .500(12.7)|Verlical<br>Verlical|2, Twisted<br>2,Solderable|Mtg Slot<br>MtgSlot|48°C @ 4W<br>48°C @ 4W|3.3°C/W @ 400 LFM<br>3.3°C/W @ 400 LFM|
**==> picture [473 x 140] intentionally omitted <==**
**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS 238-200AB 238-200AB-23 NATURAL AND FORCED<br>= 232-200AB 232-200AB-23 2)"125 238 SERIES 232 AND 238 SERIES sao CONVECTION CHARACTERISTICS AIR VELOCITY (LFM)<br>Cc CT sas pt f O CI [ [usjase J t LJ mi can [— wS yy9__200__<br>CI Tae Jol oO Cc | D om LL 2802 ! ge VE"<br>meteor fel 608) (_] LJ \ LJ TJ (08) L_] — a 80<br>SpeedCtip™ O SES = [] atonal i ) CI #6 yg Aeery<br>ea — ; SpeedClip™ ay 60 4<br>a LY Mounting | §o2 fa G I sar ae PRC ae<br>Tee i : ; 2<br>lw | ESeaff, & eel See, PL O Teis aeG3 yfSet| PE,<br>097 ty a fs r 4 Y i iN ee Ue<br>ey cr toa ——, $00 REE | oo Zw,<br>—+! 00 ies -- i a ia! es) wl | ! 050 —— “ze 0 : : 5 §<br>(25.4) (4.8) — oe (11.2) — (25.4)4.000 Gay ina) Sof aT POWERTAB HOLESDISSIPATION9.139 PLATED(WATTS)<br>390SC 4# 285SC 10# 08) Lay<br>Dimensions: in. (mm)<br>**----- End of picture text -----**<br>
## **251 SERIES**
## **Slim-Profile Heat Sinks With Integral Clips**
**==> picture [51 x 6] intentionally omitted <==**
**----- Start of picture text -----**<br>
15 Lead Multiwatt<br>**----- End of picture text -----**<br>
||**Height Above**||**Footprint**||||**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**|
|---|---|---|---|---|---|---|---|---|
|**Standard**|**PC Board**||**Dimensions**|**Mounting**|**Solderable**|**Mounting**|**Natural**|**Forced**|
|**P/N**|**in.(mm)**||**in.(mm)**|**Configuration**|**Tab Options**|**Style**|**Convection**|**Convection**|
|251-62AB|.620 (15.7)|.910 (23.1) x .380 (9.7)|.910 (23.1) x .380 (9.7)|Vert./Horiz.|No Tab|Clip|66°C @ 3W|66°C/W @ 400 LFM|
|251-80AB|.845 (21.5)|.910 (23.1) x .380 (9.7)|.910 (23.1) x .380 (9.7)|Vert./Horiz.|No Tab|Clip|64°C @ 3W|66°C/W @ 400 LFM|
|251-80ABE-19|.875(22.2)|.910|.910(23.1)x .380(9.7)|Vertical|19|Clip|64°C @ 3W|66°C/W @ 400 LFM|
|Material: Aluminum, Black Anodized|||||||||
**==> picture [433 x 109] intentionally omitted <==**
**----- Start of picture text -----**<br>
251 SERIES NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>cr| * dl ; ¥ AE ay Le<br>ae |e t : i i —4 ak mm! a et ae =<br>, o= “ae<br>r ee t ; OS as ‘OEE rire<br>| Mo —i r_t + Leos ap * tt<br>251-80AB 251-80AB-19<br>251-62AB ~I at Lina!rae!] bot 7 ] = | Ba « a l_lesI<br>rrae| os = .ta aTa ee= Po=na i a*gefe, 4=F<br>= 7 4 a an * F4 7 a 1 F] i ry<br>ay 7, Hu “ Dimensions: in. (mm) POSER OSSIPATION [WATTS<br>**----- End of picture text -----**<br>
## **MECHANICAL DIMENSIONS**
**30**
## **BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATT™COMPONENTS**
|**244 SERIES**|**Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks**|**Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks**|**Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks**|**Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks**|**Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks**||_MULTIWATT_|
|---|---|---|---|---|---|---|---|
||**Height Above**|**Footprint**|||**Thermal Performance at Typical Load**|||
|**Standard**|**PC Board**|**Dimensions**|**Mounting**|**Solderable**|**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Configuration**|**Tab Options**|**Convection**|**Convection**|**lbs.(grams)**|
|244-145AB|1.450 (36.8)|1.300 (33.0) x 480 (12.1)|Vert/Horiz,|No Tab|44°C @ 4W|4.4°C/W @ 400 LFM|.0160 (7.25)|
|244-145ABE-50|1.650(41.9)|1.300(33.0)x 480(12.1)|Vertical|50|44°C @ 4W|4.4°C/W @ 400 LFM|.0170(7.20)|
|Material: Aluminum, Black Anodized||||||||
## **MECHANICAL DIMENSIONS**
**Dimensions: in. (mm)**
## **245 SERIES Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks**
_MULTIWATT_
||**Height Above**||**Footprint**|||**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|---|---|---|---|---|---|---|---|---|
|**Standard**|**PC Board**||**Dimensions**|**Mounting**|**Solderable**|**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**||**in.(mm)**|**Configuration**|**Tab Options**|**Convection**|**Convection**|**lbs.(grams)**|
|245-145AB|1.450 (36.8)|1.750 (44.5) x .380 (9.7)|1.750 (44.5) x .380 (9.7)|Ver.t/Horiz.|No Tab|38°C @ 4W|3.2°C/W @ 400 LFM|.0160 (7.25)|
|245-145ABE-50|1.650(41.9)|1.750|1.750(44.5)x .380(9.7)|Vertical|50|38°C @ 4W|3.2°C/W @ 400 LFM|.0170(7.20)|
|Material: Aluminum, Black Anodized|||||||||
## **MECHANICAL DIMENSIONS**
**Dimensions: in. (mm)**
## **246 SERIES Medium Height, Slim Profile Wavesolderable Folded Fin Heat Sinks**
_MULTIWATT_
||**Height Above**|**Footprint**|||**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|---|---|---|---|---|---|---|---|
|**Standard**|**PC Board**|**Dimensions**|**Mounting**|**Solderable**|**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Configuration**|**Tab Options**|**Convection**|**Convection**|**lbs.(grams)**|
|246-197AB|1.968 (50.0)|1.986 (50.4) x 3.75 (9.5)|Vert./Horiz.|No Tab|35°C @ 4W|2.8°C/W @ 400 LFM|.0240 (10.90)|
|246-197ABE-50|2.168(55.1)|1.986(50.4)x 3.75(9.5)|Vertical|50|35°C @ 4W|2.8°C/W @ 400 LFM|.0250(11.40)|
**Order SpeedClip™285SC or 330SC separately.** (See 248 Series section). Material: Aluminum, Black Anodized
## **MECHANICAL DIMENSIONS**
**Dimensions: in. (mm)**
**31**
**Board Level Heat Sinks**
## **BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATT™COMPONENTS**
|**Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks**<br>**247 SERIES**|**Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks**|**Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks**|**Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks**||_MULTIWATT_|
|---|---|---|---|---|---|
|**Height Above**<br>**Footprint**<br>**Standard**<br>**PC Board**<br>**Dimensions**<br>**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>~~a~~|**Mounting**<br>**Configuration**<br>~~a~~|**Solderable**<br>**Tab Options**<br>~~a~~|**Thermal Performance at Typical Load**<br>**Natural**<br>**Forced**<br>**Weight**<br>**Convection**<br>**Convection**<br>**lbs.(grams)**<br>~~a~~|||
|247-195AB<br>1.950 (49.5)<br>1.900 (48.3) x .950 (24.1)|Vert./Horiz.|No Tab|25°C@ 4W|2.4°C/W @ 400 LFM|.0330 (15.10)|
|247-195ABE-50<br>1.950(49.5)<br>1.900(48.3)x .950(24.1)|Vertical|50|25°C@ 4W|2.4°C/W @ 400 LFM|.0340(15.60)|
|**Order SpeedClip™285SC or 330SC separately.**(See 248 Series section).||||||
|Material: Aluminum, Black Anodized||||||
## **MECHANICAL DIMENSIONS**
## **Dimensions: in. (mm)**
|**248 SERIES**|**Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks**|**Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks**|**Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks**|**Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks**|**Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks**||_MULTIWATT_|
|---|---|---|---|---|---|---|---|
|**Height Above**||**Footprint**|||**Thermal Performance at Typical Load**|||
|**Standard**|**PC Board**|**Dimensions**|**Mounting**|**Solderable**|**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Configuration**|**Tab Options**|**Convection**|**Convection**|**lbs.(grams)**|
|248-162AB|1.620 (41.1)|2.000 (50.8) x .750 (19.1)|Vert/Horiz.|No Tab|35°C @ 4W|2.5°C/W @ 400 LFM|.026 (11.60)|
|248-162ABE-50|1.620(41.1)|2.000(50.8)x .750(19.1)|Vertical|50|35°C @ 4W|2.5°C/W @ 400 LFM|.027(12.20)|
**Order SpeedClip™285SC or 330SC separately.** Material: Aluminum, Black Anodized
## **MECHANICAL DIMENSIONS**
**Order SpeedClips™separately for use with Series 246, 247, 248 or 249**
## **Dimensions: in. (mm)**
## **249 SERIES Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks**
_MULTIWATT_
||**Height Above**|**Footprint**|||**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|---|---|---|---|---|---|---|---|
|**Standard**|**PC Board**|**Dimensions**|**Mounting**|**Solderable**|**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Configuration**|**Tab Options**|**Convection**|**Convection**|**lbs.(grams)**|
|249-113AB|1.130 (28.7)|1.900 (48.3) x .950 (24.1)|Vert./Horiz,|No Tab|35°C@ 4W|3.29°C/W @ 400 LFM|.020 (8.90)|
|249-113ABE-50|1.130(28.7)|1.900(48.3)x .950(24.1)|Vertical|50|35°C@ 4W|3.29°C/W @ 400 LFM|.021(9.40)|
**Order SpeedClip™285SC or 330SC separately.** (See 248 Series section). Material: Aluminum, Black Anodized
## **MECHANICAL DIMENSIONS**
**Dimensions: in. (mm)**
**32**
## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**
**==> picture [246 x 10] intentionally omitted <==**
**----- Start of picture text -----**<br>
288 SERIES Compact Wave-Solderable Low-Cost Heat Sinks<br>**----- End of picture text -----**<br>
|**Compact Wave-Solderable Low-Cost Heat Sinks**<br>**288 SERIES**|**Compact Wave-Solderable Low-Cost Heat Sinks**||
|---|---|---|
|**Compact Wave-Solderable Low-Cost Heat Sinks**<br>**288 SERIES**|**Compact Wave-Solderable Low-Cost Heat Sinks**|TO-220, TO-202|
|**Height Above**<br>**Maximum**|**Thermal Performance at Typical Load**||
|**Standard**<br>**PC Board**<br>**Footprint**|**Natural**<br>**Forced**|**Weight**|
|**P/N**<br>**in.(mm)**<br>**in.(mm)**|**Convection**<br>**Convection**|**lbs.(grams)**|
|288-1ABE<br>1.250(31.8)<br>0.875(22.2)x 0.215(5.5)|85°C @ 4W<br>12°C/W @ 200 LFM|0.0057(2.59)|
|Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good|space is available. The 288-1AB is a stamped aluminum heat sink, black an-|space is available. The 288-1AB is a stamped aluminum heat sink, black an-|
|electrical connections for vertical mounting of TO-220 and TO-202 semiconduc-|odized, designed for applications requiring good heat dissipation from a heat||
|tor packages. These heat sinks are designed for use where minimum PC board|sink occupying minimum space, available at minimum cost.||
## **MECHANICAL DIMENSIONS**
**==> picture [249 x 23] intentionally omitted <==**
**----- Start of picture text -----**<br>
288 SERIES<br>NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>**----- End of picture text -----**<br>
**Dimensions: in. (mm)**
**==> picture [48 x 9] intentionally omitted <==**
**----- Start of picture text -----**<br>
271 SERIES<br>**----- End of picture text -----**<br>
## **Top-Mount Booster Heat Sinks for Use with 270/272/280 Series**
TO-220
||||**Horizontal**|||||
|---|---|---|---|---|---|---|---|
||**Height Above**||**Mounting Footprint**||**Thermal Performance at Typical Load**|||
|**Standard**|**Semiconductor Case**||**Dimensions**||**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**||**in.(mm)**||**Convection**|**Convection**|**lbs.(grams)**|
|271-AB|0.500 (12.7)|1.750 (44.5) x 0.700 (17.8)||62°C @ 4W (NOTE A)||5.1°C/W @ 400 LFM|0.0052 (2.36)|
|||||31 °C @ 4W|31 °C @ 4W(NOTE B)|1.8°C/W 400 LFM(NOTE B)||
Material: Aluminum, Black Anodized
This top-hat style booster heat sink can be added to any of the 270, 272, or 280 Series for improved performance.
NOTE A: Thermal resistance with one 271-AB. NOTE B: Thermal resistance (total) as shown with (2) 271-AB types added to (1) 272-AB type.
## **MECHANICAL DIMENSIONS**
## **271 SERIES**
**NATURAL AND FORCED CONVECTION CHARACTERISTICS**
**Dimensions: in. (mm)**
**33**
**Board Level Heat Sinks**
## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**
## **Small Footprint Low-Cost Heat Sinks**
## **270/272/280 SERIES**
|**270/272/280 SERIES**|**Small Footprint Low-Cost Heat Sinks**|**Small Footprint Low-Cost Heat Sinks**||||
|---|---|---|---|---|---|
|**270/272/280 SERIES**|**Small Footprint Low-Cost Heat Sinks**|**Small Footprint Low-Cost Heat Sinks**|||_TO-220, TO-202_|
|**Height Above**<br>**Standard**<br>**PC Board**<br>**P/N**<br>**in.(mm)**<br>270-AB<br>0.375 (9.4)<br>272-AB<br>0.375 (9.4)|**Horizontal Mounting**<br>**Maximum Footing**<br>**in.(mm)**<br>1.750 (44.5) x 0.700 (17.8)<br>1.750 (44.5) x 1.450 (36.8)|**Solderable**<br>**Tab Options**<br>—<br>01,02|**Thermal Performance at Typical Load**<br>**Natural**<br>**Convection**<br>70°C @ 4W<br>42°C @ 4W|**Thermal Performance at Typical Load**<br>**Forced**<br>**Convection**<br>6.0°C/W @ 400 LFM<br>3.6°C/W @ 400 LFM|**Weight**<br>**lbs.(grams)**<br>0.0052 (2.36)<br>0.0105 (5.72)|
|280-AB<br>0.375(9.4)|1.750(44.5)x 0.700(17.8)|—|70°C @ 4W|6.0°C/W @ 400 LFM|0.0048(2.18)|
|Material: Aluminum, Black Anodized||||||
These exceptionally low-cost heat sinks can be mounted horizontally under a TO-220 or TO-202 case style with a maximum height of only 0.375 in. (9.4). For added performance, a 271 Series heat sink can also be used for double-sided heat dissipation.
The 270-AB and 280-AB accept one power semiconductor; the 272-AB is designed for two power semiconductors. Specify solderable tab options for the 272 Series by the addition of suffix “O1” or “02” to the standard part number (i.e. 272-AB01 or 272-AB02).
**==> picture [472 x 245] intentionally omitted <==**
**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>Gilda 7} Ot ] AP ELOCITY (LFA<br>DA THR eit | oo 28 at me<br>: | L auT gj j | z T<br>i aeee' De | Bye 4oe<br>Ono 7) Dia TH eu a] F as<br>270 SERIES 280 SERIES =eee a oi = 1<br>12 ‘1 ¢ fa o fF a 8<br>: _— fatal POWER FHSS0P A108 (MATT)<br>, ia "Tray<br>— ral 33 PEF 4<br>oem |] T a<br>AEE] ega ee<br>nm 7 ie —+ — i a E: cc] * =<br>1 ot L _] a0 | SS rt se<br>+ — eM Jom | | + =| ao<br>na } —— | ] | | (7 | O90 REF 0 (er<br>Cc | |__| t CE) t pe jog els<br>FT | ] H 4 ane Com HEF<br>1 oh arr aE<br>272 SERIES 272AB01 272AB02<br>Dimensions: in. (mm) 1 tgpended Ta Hirde TE 4 paed<br>**----- End of picture text -----**<br>
## **289 & 290 SERIES**
## **Low-Cost Single or Dual Package Heat Sinks**
_TO-218, TO-202, TO-220_
||**Height Above**|**Horizontal Mounting**|**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|---|---|---|---|---|---|
|**Standard**|**PC Board**|**Maximum Footing**|**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|**lbs.(grams)**|
|289-AB|0.500 (12.7)|1.000 (25.4) x 0.710 (18.1)|50°C @ 2W|9.0 C/W @ 400 LFM|0.0055 (2.49)|
|289-AP|0.500 (12.7)|1.000 (25.4) x 0.710 (18.1)|50°C @ 2W|9.0 C/W @ 400 LFM|0.0055 (2.49)|
|290-1AB|0.500 (12.7)|1.000 (25.4) x 1.180 (30.0)|44°C @ 2W|7.0 C/W @ 400 LFM|0.0082 (3.72)|
|290-2AB|0.500(12.7)|1.000(25.4)x 1.180(30.0)|44°C @ 2W|7.0 C/W @ 400 LFM|0.0081(3.67)|
|Material: Aluminum, Black Anodized|Material: Aluminum, Black Anodized|||||
Low in cost and compact in overall dimensions, one 289 Series heat sink can accommodate one semiconductor; the 289 Series is available with a black an-
odized finish (289-AB) or with no finish (289-AP). Two semiconductors can be mounted to the 290-2AB style.
**==> picture [406 x 138] intentionally omitted <==**
**----- Start of picture text -----**<br>
NATURAL AND FORCED<br>289 SERIES MECHANICAL DIMENSIONS 290 SERIES CONVECTION CHARACTERISTICS<br>1m] a} bat AIA VELCHTY [LF by<br>" weg a a a a a<br>= ee ee wt<br>| arue‘ 1|| Th1000 35‘ * -<br>r<br>4. am ~ 28 ep ay<br>eet * |' Ole<br>to ee $3<br> DA THR \CHa ee i ie i 7UF oa tw a)*) a fed<br>| nent7 seemo rm 0 OMYI i IF a dmn8 awa Powe7 j F<br>mn oration pvatT Si<br>fin P— | tie LF Dimensions: in. (mm)<br>**----- End of picture text -----**<br>
**34**
## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**
## **High-Performance Slim Profile Heat Sinks With Integral Clips**
## **250 SERIES**
**==> picture [454 x 285] intentionally omitted <==**
**----- Start of picture text -----**<br>
|||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|MULTIWATT|
|Height Above|Footprint|Thermal Performance at Typical Load|
|Standard|PC Board|Dimensions|Mounting|Solderable|Mounting|Natural|Forced|
|P/N|in. (mm)|in. (mm)|Configuration|Tab Options|Style|Convection|Convection|
|Ne|
|250-122AB|1.220 (31.0)|1.000 (25.4) x .500 (12.7)|Vert./Horiz.|No Tab|Clip|50°C @ 4W|3.7°C/W @ 400 LFM|
|250-122ABE-09|1.220 (31.0)|1.000 (25.4) x .500 (12.7)|Vertical|09|Clip|50°C @ 4W|3.7°C/W @ 400 LFM|
|250-122ABE-25|1.380 (35.1)|1.000 (25.4) x .500 (12.7)|Vertical|25|Clip|50°C @ 4W|3.7°C/W @ 400 LFM|
|Material: Aluminum, Black Anodized|
|fe|pal|ig|250 SERIES|250-122AB-09|t|250-122AB-25|CONVECTION CHARACTERISTICSNATURAL AND FORCED|
|ee|a|||Peto|ow|+|nl|=n|Ea|tal|Ea|-|
|—-;|—a|ODETTED SF|Wes|||fe|a|=|woe|
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|237 & 252 SERIES|High-Performance, High-Power Vertical Mount Heat Sinks|TO-220|
|Height Above|Footprint|Thermal Performance at Typical Load|
|Standard|PC Board|Dimensions|Mounting|Solderable|Mounting|Natural|Forced|
|P/N|in. (mm)|in. (mm)|Configuration|Tab Options|Style|Convection|Convection|
|237-167AB2|1.675 (42.5)|1.000 (25-4) x 1.000 (25.4)|Vertical|2, Twisted|Clip/Mtg Slot|46°C @ 4W|4.5°C/W @ 200 LFM|
|237-167AB3|1.675 (42.5)|1.000 (25.4) x 1.000 (25.4)|Vertical|3, Twisted|Clip/Mtg Slot|46°C @ 4W|4.5°C/W @ 200 LFM|
|237-167ABE2-24|1.675 (42.5)|1.000 (25.4) x 1.000 (25.4)|Vertical|2, Solderable|Clip/Mtg Slot|46°C @ 4W|4.5°C/W @ 200 LFM|
|252-167AB2|1.675 (42.5)|1.000 (25.4) x 1.000 (25.4)|Vertical|2, Twisted|Clip/Mtg Slot|40°C @ 4W|4.5°C/W @ 200 LFM|
|252-167AB3|1.675 (42.5)|1.000 (25.4) x 1.000 (25.4)|Vertical|3, Twisted|Clip/Mtg Slot|40°C @ 4W|4.5°C/W @ 200 LFM|
|252-167ABE2-24|1.675 (42.5)|1.000 (25.4) x 1.000 (25.4)|Vertical|2, Solderable|Clip/Mtg Slot|40°C @ 4W|4.5°C/W @ 200 LFM|
**----- End of picture text -----**<br>
**==> picture [90 x 96] intentionally omitted <==**
**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS<br>a a ee<br>—_}<br>|<br>e. I 7<br>hiere ] pHL_ |=<br>=<br>4 ll<br>250-122AB<br>Dimensions: in. (mm)<br>**----- End of picture text -----**<br>
**Order SpeedClips™285SC or 330SC separately for rapid component installation, lowering manufacturing costs.** Material: Aluminum, Black Anodized
**==> picture [522 x 217] intentionally omitted <==**
**----- Start of picture text -----**<br>
|||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|MECHANICAL DIMENSIONS|227-167|252-167|237-167AB2|237-167AB2-24|CONVECTION CHARACTERISTICSNATURAL AND FORCED|
|1.000|252-167AB2|252-167AB2-24|200|Order SpeedClips™|
|||1.000|54|
|237 AND 252 SERIES|——e54)||||—_—54)|4|—_mae—é|||Separately|wSeesoc|jop9eeOO200|AIR VELOCITY4006008001000, (LFM)|=|
|@s)a75x.156_(oy|||ff|ff|—|———|(TWISTED)amas|[=|8)corel|f|esez|gl[|],|||||rrr]>)|Tl||,|ZO28|
|oodI|Hi|||Pi|TAB|237-167AB3|AVAILABLE|[ON]|[|][——][|]|[AB]|252-167AB3|[ AVAILABLE]|ONLY|[ON]|(24.0|25oO|gyEEE,||ae|
|\|oe|onsets||||pment|RT|memes|OPP|
|moner|Hae|aH|0|“|=|oY|(SOLDERABLE)|su|8See|'|22|
|(10.2)}|||H|7.8)|I|450|450|1|||weros|©S|||||||baeree,|zo|
|re100|ee]|||«oo|<—(11.4)|cone(11.4\—o||on;|gt$y|okaee|[DTTP]|eerrr|rd,|*s|
|es)|TYP|(25.4)4,000||||"1|3|237-167AB3|TABS (TWISTED)ly|237 AND 252 SERIES|"25)|__a5)t|i|Spring|Steel|285SC|10#|e|0|POWER1|DISSIPATION (WATTS)2|3|4|§|w|
|252-167AB3|ONLY|Dimensions: in. (mm)|475|(12.1)950 (24.1)| _4|3.130(33)|
|291 SERIES|Labor-Saving Clip-on Heat Sinks|TO-220|
|Vertical|
|Height Above|Mounting Footprint|Thermal Performance at Typical Load|
|Standard|PC Board|Dimensions|Mounting|Natural|Forced|Weight|
|P/N|in. (mm)|in. (mm)|Style|Convection|Convection|lbs. (grams)|
|291-C236AB|0.860 (21.)9|1.100 (27.0) x 0.360 (9.1)|TO-220 (Clip)|80°C @ 2W|24°C/W @ 600 LFM|0.0026 (1.18)|
|291-H36AB|0.860 (21.9)|1.100 (27.0) x 0.360 (9.1)|TO-220 (Mtg. Hole)|68°C @ 2W|16°C/W @ 600 LFM|0.0026 (1.18))|
|Material: Aluminum, Black Anodized|
**----- End of picture text -----**<br>
Designed for mounting horizontally or vertically on a circuit board, 291 Series heat sinks employ a unique clip for attachment of TO-220 case styles.
**==> picture [129 x 111] intentionally omitted <==**
**----- Start of picture text -----**<br>
291 SERIES<br>‘eu<br>sa<br>7 = Fh ——F<br>“|<br>‘a.ae | f *, ua Fia5, | aeT<br>‘ po Ta<br>—| : nen,i_ ns<br>ail jen<br>LOCH, [Te]<br>291-C2 291-H<br>**----- End of picture text -----**<br>
## **MECHANICAL DIMENSIONS**
**Dimensions: in. (mm)**
One type is available with a locking clip and one with a 0.140 in. (3.6) diameter mounting hole only.
**==> picture [95 x 13] intentionally omitted <==**
**----- Start of picture text -----**<br>
NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>**----- End of picture text -----**<br>
**35**
**Board Level Heat Sinks**
## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**
## **286 SERIES**
**Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks** See also 286DB Series on Page 7.
_TO-220_
||**Height Above**|||**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|---|---|---|---|---|---|---|
|**Standard**|**PC Board**|**Maximum Footprint**||**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Material**|**Convection**|**Convection**|**lbs.(grams)**|
|286-AB|1.190 (30.2)|1.000 (25.4) x 0.500 (12.7)|Aluminum, Anodized|58°C @ 4W|7.4°CW @ 200 LFM|0.0085 (3.86)|
|286-CBTE|1.190 (30.2)|1.000 (25.4) x 0.500 (12.7)|Copper, Black|58°C @ 4W|7.4°CW @ 200 LFM|0.0250 (11.34)|
|286-CTE|1.190(30.2)|1.000(25.4)x 0.500(12.7)|Copper,Tinned|58°C @ 4W|7.4°CW @ 200 LFM|0.0250(11.34)|
Efficient heat removal at low cost can be achieved by inserting the 286 Series dithe board. Material: 286-AB style (aluminum, black anodized), 286-CBT style rectly into pre-drilled circuit boards; scored mounting tabs may be bent after in(copper, black paint tin tabs), and 286-CT style (copper, tinned). sertion to provide added stability. The 286 Series can be wavesoldered directly to
## **MECHANICAL DIMENSIONS**
**==> picture [238 x 15] intentionally omitted <==**
**----- Start of picture text -----**<br>
NATURAL AND FORCED<br>286 SERIES CONVECTION CHARACTERISTICS<br>**----- End of picture text -----**<br>
**==> picture [68 x 8] intentionally omitted <==**
**----- Start of picture text -----**<br>
Dimensions: in. (mm)<br>**----- End of picture text -----**<br>
## **287 SERIES**
## **Wave-Solderable Low-Cost Heat Sinks**
_TO-220_
|||**Height Above**|**Maximum**|**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|---|---|---|---|---|---|---|
|**Standard P/N**||**PC Board**|**Footprint “A”**|**Natural**|**Forced**|**Weight**|
|**Mounting Slot**|**Mounting Hole**|**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|**lbs.(grams)**|
|287-1ABE|287-1ABH|1.180 (30.0)|1.000 (25.4) x 0.500 (12.7)|65°C @ 4W|7.8°CW @ 200 LFM|0.0090 (4.08)|
|287-2ABE|287-2ABH|1.180(30.0)|1.000(25.4)x 1.000(25.4)|55°C @ 4W|6.4°CW @ 200 LFM|0.0140(6.35)|
|Material: Aluminum, Black Anodized|||||||
Mount these cost-effective TO-220 heat sinks vertically into pre-drilled printed circuit boards. Soldered, pre-tinned tabs can be wavesoldered directly to the
board. A 0.375 in. (9.5 mm) mounting slot allows for correct positioning of TO220 and similar semiconductor packages.
## **MECHANICAL DIMENSIONS**
**287 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS Standard P/N Dim. “A”** 287-1AB 0.500 (12.7) 7) - ea= = | om 287-2AB 1.000 (25.4) 287-1ABH 0.500 (12.7) yee = [TT a 287-2ABH 1.000 (25.4) eScr ~ Herthay
**Dimensions: in. (mm)**
## **285 & 330 SERIES**
## **285 SC and 330 SC SpeedClips™**
**Standard Nominal Installed For Use Weight** ~~r~~ **P/N** ~~a~~ **Loading Force With Series Material lbs. (grams)** 285 SC 10 lbs 232, 237, 240, 252, 667 Carbon Steel 0.00053 (0.24) “ns ~~[#]~~ ‘a 330 SC 4 lbs 232, 237, 240, 252, 667 Stainless Steel 0.00074 (0.34) SpeedClips™employ a locking safety tab for mounting. Must be ordered sepaone SpeedClip™for each heat sink purchased. Must be purchased with heat rately for these heat sink series. Use these SpeedClips™with our 237, 240, and sinks. 252 Series heat sinks for the lowest production assembly time and cost. Order **MECHANICAL DIMENSIONS** =e - TT| T
‘ 1 rie=e - _ | **SpeedClip** TT| ilT **SpeedClip 330 SC 285 SC** oot‘ae aceF ——'La **4 lb (17.8N) 10 lb (44.5N) Nominal Force Nominal Force** i ioe ne rin! 1 an i **Dimensions: in. (mm)** a | ad | **Installed** Se , {ee **Installed**
**36**
## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**
|**695 SERIES**<br>_|**Space-Saving Heat Sinks for Small Stud-Mounted Diodes**<br>**Maximum**|**Space-Saving Heat Sinks for Small Stud-Mounted Diodes**<br>**Maximum**|**Space-Saving Heat Sinks for Small Stud-Mounted Diodes**<br>**Thermal Performance at Typical Load**|**Space-Saving Heat Sinks for Small Stud-Mounted Diodes**<br>**Thermal Performance at Typical Load**|STUD-MOUNT<br>[||STUD-MOUNT<br>[||
|---|---|---|---|---|---|---|
|**Standard**|**Width**|**Height**|**Natural**|**Forced**||**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Convection**|**Convection**||**lbs.(grams)**|
|695-1B|1.330(33.8)|0.530(13.7)|72°C @ 4.0W|5.2°C/W @ 400 LFM||0.008(4.0)|
Mount and effectively heat sink small stud-mounted diodes with the 695 Series provides good heat dissipation for use where height is limited above the printed space-saving heat sink type. Each unit is black anodized aluminum with an circuit board or base plate. 0.200 in. (5.1) dia. mounting hole centered in the base. The folded fin design
**==> picture [465 x 101] intentionally omitted <==**
**----- Start of picture text -----**<br>
MECHANICAL 695 SERIES NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>DIMENSIONS fo eit!1154 : iam 4 : roemery bedsi<br>a age ie 1 oe es ee | |<br>ew | — z ott! A Ol A<br>Dimensions: in. (mm)<br>**----- End of picture text -----**<br>
## a **260 SERIES Cup Clips for TO-5 Case Style Semiconductors**
|**260 SERIES**<br>a|**Cup Clips for TO-5 Case Style Semiconductors**<br>a|**Cup Clips for TO-5 Case Style Semiconductors**|**Cup Clips for TO-5 Case Style Semiconductors**|**Cup Clips for TO-5 Case Style Semiconductors**|||_TO-5_<br>[||_TO-5_<br>[||
|---|---|---|---|---|---|---|---|---|
||||||**Depth of**||||
|**Characteristics**||**TO-5**||**Model**|**Tapped Base**||||
|Thermal Resistance – EpoxyInsulated||14° C/W||260-4T5E|0.093 (2.36)||||
|Breakdown Voltage – EpoxyType(VAC),60 Hz||500||260-4TH5E|0.125 (3.18)||||
|Recommended Operating Voltage, AC or DC|||||||||
|Clean Conditions: % Hipot Rating<br>Dusty Conditions: % Hipot Rating<br>DirtyConditions: % Hipot Rating||50<br>30<br>10 to 20||**Thread**<br>**Size:**|4 = #4-40 UNC<br>6 = #6-32 UNC|**Base Style:** H = hex<br>**Semiconductor**|||
|Temperature Range — Continuous (C°)||-73/+149||**Mounting**<br>**Style:**|T = tapped<br>S = stud|**Case Style:** 5 = TO-5<br>**Insulation** E = epoxy|||
||||||P = plain||||
## **TO-5 CASE STYLE CUP CLIPS — ORDERING GUIDE**
|**Standard**<br>**P/N**<br>260-4T5E<br>260-4TH5E<br>260-6SH5E|**Insulation**<br>**Type**<br>Epoxy Insulated<br>Epoxy Insulated<br>Epoxy Insulated|**Outline Dimension**<br>**L x W x I.D.**<br>**in.(mm)**<br>0.370 (9.4) x 0.380 (9.7) dia. x 0.290 (7.4)<br>0.400 (10.2) x 0.370 (9.4) hex. x 0.290 (7.4)<br>0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4)|**Weight**<br>**lbs.(grams)**<br>0.0024 (1.09)<br>0.0031 (1.41)<br>0.0037 (1.68)|**Case**<br>**Style**<br>TO-5<br>TO-5<br>TO-5|
|---|---|---|---|---|
Materials and Finish: Cups – beryllium copper, black ebonol “C”; Bases – brass, black ebonol “C”
**Base Mounting Configurations** — TO-5 **Plain Type** — Epoxy bonded, or used with #4 pan head screws. **Tapped Base** — #4-40 UNC screw (not supplied) fits tapped hole. Care should be taken not to use too long a screw, which could short against the semiconductor case. For correct screw lengths:
Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness **Stud Mounting Base** . #6-32 UNC. Nuts and washers not supplied. Stud hole must be slightly countersunk to ensure flat mounting.
To determine the correct mounting screw lengths, add dimensions as follows:
Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness
**37**
**Board Level Heat Sinks**
## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**
**==> picture [49 x 9] intentionally omitted <==**
**----- Start of picture text -----**<br>
260 SERIES<br>**----- End of picture text -----**<br>
## **Epoxy Insulated For TO-5**
**==> picture [336 x 9] intentionally omitted <==**
**----- Start of picture text -----**<br>
260-4T5E 260-4TH5E 260-6SH5E<br>**----- End of picture text -----**<br>
## **Thermal Links for Fused Glass Diodes**
## **258 SERIES**
|**258 SERIES**|**258 SERIES**|**Thermal Links for Fused Glass Diodes**|**Thermal Links for Fused Glass Diodes**||_DIODES_|
|---|---|---|---|---|---|
|**Standard**||**Dimensions**|||**Weight**|
|**P/N**||**in.(mm)**|**Material**|**Finish**|**lbs.(grams)**|
|258|0.500 (12.7) x 0.250 (6.4) x 0.340 (8.6)|0.500 (12.7) x 0.250 (6.4) x 0.340 (8.6)|Aluminum|DeltaCoate™151 on all surfaces|0.0018 (0.82)|
|||||except solderpads and base||
The thermal resistance from diode leads to chassis or heat sink is 12°C/watt, sink to ambient impedance is available, the thermal resistance from the diode when unit is mounted with TYPE 120 Joint Compound. If a 10°C/watt chassis or leads to ambient is reduced from about 150°C/watt to 22°C/watt.
## **MECHANICAL DIMENSIONS**
**258 SERIES**
**Dimensions: in. (mm)**
## **292 SERIES**
## **Heat Sink for Single TO-92**
_TO-92_
||**Height Above**|**Overall**||||
|---|---|---|---|---|---|
|**Standard**|**PC Board**|**Fin Width**|**Thermal Performance**||**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Natural Convection**|**Finish**|**lbs.(grams)**|
|292-AB|0.750(19.1)|0. 600(15.3)|0.225°C/W @ 0.250 W|Black Anodized|0.00049(0.22)|
|Power semiconductors packaged in a TO-92 style plastic case can be cooled ef-||Power semiconductors packaged in a TO-92 style plastic case can be cooled ef-|292-AB is effective over the typical power range of such devices.|292-AB is effective over the typical power range of such devices.||
|fectively at little additional cost with the addition of the 292-AB heat sink. The|||Material: Aluminum, Black Anodized|||
Power semiconductors packaged in a TO-92 style plastic case can be cooled effectively at little additional cost with the addition of the 292-AB heat sink. The
**MECHANICAL DIMENSIONS** Tr adiin = **292 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS**
**Dimensions: in. (mm)**
**38**
Updated at April 29, 2026
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